U.S. patent number 8,166,641 [Application Number 11/325,575] was granted by the patent office on 2012-05-01 for holding tray for substrate, substrate alignment system using the same and method thereof.
This patent grant is currently assigned to Samsung Mobile Display Co., Ltd.. Invention is credited to Sang-Jin Han, Seok-Heon Jeong, Hee-Cheol Kang, Kwan-Seop Song.
United States Patent |
8,166,641 |
Han , et al. |
May 1, 2012 |
Holding tray for substrate, substrate alignment system using the
same and method thereof
Abstract
Disclosed are a holding tray, a substrate alignment system using
the same and a method thereof. More specifically, the present
invention relates to a holding tray for substrate capable of
accomplishing high-precision alignment and conducting a stable
deposition. A holding means is included in at least one side of the
substrate to hold and support the substrate in a manner that the
substrate is vertically held and supported on a flat surface of the
holding tray during a vacuum process. The holding tray according to
the present invention, the substrate alignment system using the
same, and the method thereof include a substrate on which a
deposition is made, a frame formed to receive the substrate, a tray
formed to receive the frame, and at least one holding means formed
to hold the substrate on the frame. The holding tray for substrate
according to the present invention, the substrate alignment system
using the same, and the method thereof are useful to accomplish
high-precision alignment and conduct a stable deposition process
due to the stable vertical arrangement of the substrate during the
deposition process.
Inventors: |
Han; Sang-Jin (Kyunggi-do,
KR), Song; Kwan-Seop (Kyunggi-do, KR),
Kang; Hee-Cheol (Kyunggi-do, KR), Jeong;
Seok-Heon (Kyunggi-do, KR) |
Assignee: |
Samsung Mobile Display Co.,
Ltd. (Giheung-Gu, Yongin, Gyunggi-Do, KR)
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Family
ID: |
36639127 |
Appl.
No.: |
11/325,575 |
Filed: |
January 5, 2006 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20060144738 A1 |
Jul 6, 2006 |
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Foreign Application Priority Data
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Jan 5, 2005 [KR] |
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10-2005-0000956 |
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Current U.S.
Class: |
29/760; 414/936;
414/941; 206/724; 206/722 |
Current CPC
Class: |
H01L
21/68735 (20130101); H01L 21/68778 (20130101); H01L
21/68728 (20130101); Y10S 414/141 (20130101); Y10T
29/53265 (20150115); Y10S 414/136 (20130101) |
Current International
Class: |
H01L
21/68 (20060101) |
Field of
Search: |
;29/758,760 ;439/73
;414/941,936 ;206/712,722,724,725 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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04-099275 |
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Mar 1992 |
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JP |
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04-110466 |
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Apr 1992 |
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JP |
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10-302257 |
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Nov 1998 |
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JP |
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11-100669 |
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Apr 1999 |
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JP |
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11100669 |
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Apr 1999 |
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JP |
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11-163104 |
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Jun 1999 |
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JP |
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2006169625 |
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Jun 2006 |
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JP |
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2006191038 |
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Jul 2006 |
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JP |
|
Other References
Office action from the Japanese Patent Office issued in Applicant's
corresponding Japanese Patent Application No. 2005-202322 dated
Mar. 6, 2009. cited by other .
Office action from the State Intellectual Property Office of P.R.
China issued in Applicant's corresponding Chinese Application No.
200510117051.3 dated Jun. 12, 2009. cited by other .
Office action from Japanese Patent Office issued in Applicant's
corresponding Japanese Patent Application No. 2005-202322 dated
Mar. 9, 2010, and Request for Entry of the Accompanying Office
Action for Japanese Office action attached herewith. cited by other
.
Japanese Office Action issued by JPO on Sep. 13, 2011 in connection
with Japanese Patent Application No. 2005-202322, which also claims
Korean Patent Application No. 10-2005-0000956 as its priority
document, and Request for Entry of the Accompanying Office Action
attached herewith. cited by other .
Office action from the State Intellectual Property Office of P. R.
China issued in Applicant's corresponding Chinese patent
Application No. 2005101170513 dated Nov. 14, 2008. cited by
other.
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Primary Examiner: Cazan; Livius R
Attorney, Agent or Firm: Bushnell, Esq.; Robert E.
Claims
What is claimed is:
1. A holding tray comprising: a frame formed for holding a
substrate; a tray for holding the frame, the tray having a through
hole, the frame being disposed inside the through hole of the tray;
and at least one holding device formed on the frame for holding the
substrate, an edge portion of the substrate being disposed between
the frame and the at least one holding device, the at least one
holding device pressing the substrate onto the frame, the at least
one holding device comprising: an elastic member, a first end of
the elastic member of the at least one holding device being
anchored in the at least one holding device, a second end of the
elastic member of the at least one holding device being directly
fixed to the frame; and a press member for pressing an upper
surface of the substrate to the frame, the press member being in a
first position for pressing the upper surface of the substrate to
the frame, the press member being rotated about an axis
perpendicular to the upper surface of the substrate to be in a
second position for releasing the substrate from the frame.
2. The holding tray of claim 1, comprised of the at least one
holding device further comprising a projection, and the frame
further comprising a first protruded groove and a second protruded
groove, the projection being inserted into the first protruded
groove for holding the substrate to the frame, and the projection
being inserted into the second protruded groove for releasing the
substrate from the frame.
3. The holding tray of claim 1, wherein the at least one holding
device further comprises: a coupling hole; and a coupling member
anchored in the coupling hole of the at least one holding device,
the first end of the elastic member of the at least one holding
device being anchored in the coupling member of the at least one
holding device.
4. The holding tray of the claim 1, further comprising at least one
alignment tool formed on the frame for aligning the substrate to
the frame.
5. The holding tray of claim 4, the alignment tool comprising: a
reference element for providing a reference point in at least one
edge on the frame; and an adjustment element for adjusting position
of the substrate so that the substrate can be in contact with the
reference element, the adjustment element formed in at least one
edge on the frame.
6. The holding tray of claim 5, the reference element being a
reference pin.
7. The holding tray of claim 5, the reference element being a
reference hole where a reference rod passes through the reference
hole.
8. The holding tray of claim 5, the adjustment element being an
adjustment hole where an adjustment rod passes through the
adjustment hole.
9. The holding tray of claim 4, the alignment tool further
comprising a through hole formed in at least two edges of the frame
so that a substrate handler passes through the through hole.
10. The holding tray of claim 4, the at least one holding device
further comprising clamps formed on the frame for holding the
substrate.
11. The holding tray of claim 1, the press member further
comprising: a projection, the press member being coupled with the
frame by the elastic member.
12. The holding tray of claim 11, the frame further comprising a
first protruded groove and a second protruded groove, the
projection being inserted into the first protruded groove for
holding the substrate to the frame, and the projection being
inserted into the second protruded groove for releasing the
substrate from the frame.
13. The holding tray of claim 12, the press member further
comprising: a coupling hole; and a coupling member anchored in the
coupling hole, a first end of the elastic member being anchored in
the coupling member and a second end of the elastic member being
anchored in the frame.
14. The holding tray of claim 11, the operation of the press member
between the first position and the second position being
continuously conducted.
15. The holding tray of claim 14, the press member being coupled
with a clamp pusher for operating the press member between the
first position and the second position.
16. The holding tray of claim 15, the continuous operation of the
press member being conducted by moving the press member up or down
while turning the clamp pusher.
17. The holding tray of claim 14, the press member being coupled
with a guide member for the operation between the first position
and the second position.
18. The holding tray of claim 17, the guide member comprising: a
guide protrusion formed in the projection; and a guide groove
formed in the frame for matching the guide protrusion.
19. The holding tray of claim 17, the guide member comprising: a
guide groove formed in the projection; and a guide protrusion
formed in the frame to match the guide groove.
20. The holding tray of claim 1, the tray further comprising a
holding plate for mounting the frame in the tray.
21. The holding tray of claim 1, the tray further comprising a
transportation tool at an edge of the tray for moving the holding
tray.
22. The holding tray of claim 1, the tray further comprising a tray
guide tool at an edge of the tray for guiding the holding tray
while being transported.
23. The holding tray of claim 1, further comprising at least a
second holding device formed on the frame, the at least one holding
device holding a top edge portion of the substrate, the second
holding device supporting a side edge portion of the substrate.
24. The holding tray of claim 23, further comprising at least a
third holding device formed on the frame for holding a bottom edge
portion of the substrate, the third holding device comprising an
elastic member, a first end of the elastic member of the third
holding device being anchored in the third holding device, a second
end of the elastic member of the third holding device being fixed
to the frame.
25. The holding tray of claim 24, wherein the third holding device
further comprises: a coupling hole; and a coupling member anchored
in the coupling hole of the third holding device, the first end of
the elastic member of the third holding device being anchored in
the coupling member of the third holding device.
26. The holding tray of claim 24, further comprising at least a
fourth holding device formed on the frame for supporting the bottom
edge portion of the substrate.
27. The holding tray of claim 26, wherein the fourth holding device
having a protruded groove, the bottom edge portion of the substrate
being charged into the protruded groove of the fourth holding
device.
28. The holding tray of claim 1, wherein the frame has a protruded
groove on a surface of the frame, the frame having a guide groove
on a side wall of the protruded groove, the at least one holding
device further comprising: a projection disposed inside the
protruded groove of the frame; and a guide protrusion formed on the
projection, the guide protrusion disposed inside the guide
groove.
29. A substrate alignment system, comprising: a holding tray
comprising: a frame formed for holding a substrate; a tray for
holding the frame, the tray having a through hole, the frame being
disposed inside the through hole of the tray; and at least one
holding device formed on the frame for holding the substrate, an
edge portion of the substrate being disposed between the frame and
the at least one holding device, the at least one holding device
pressing the substrate onto the frame, the at least one holding
device comprising: an elastic member, a first end of the elastic
member of the at least one holding device being anchored in the at
least one holding device, a second end of the elastic member of the
at least one holding device being directly fixed to the frame; and
a press member for pressing an upper surface of the substrate to
the frame, the press member being in a first position for pressing
the upper surface of the substrate to the frame, the press member
being rotated about an axis perpendicular to the upper surface of
the substrate to be in a second position for releasing the
substrate from the frame; a mask facing one surface of the
substrate; and an alignment plate facing another surface of the
substrate, the alignment plate comprising a chuck formed to press
the substrate, the chuck moving the substrate towards the mask so
that the holding tray can be supported, held and aligned.
30. A method for aligning a substrate, comprising: coupling the
frame of the holding tray of claim 1 to the tray of the holding
tray of claim 1; providing the substrate of claim 1 to the frame;
anchoring and supporting the substrate of claim 1 to grooves of a
side supporter and a bottom supporter of the frame; and inserting a
projection of the press member of the at least one holding device
of the holding tray of claim 1 into a protruded groove of the frame
for pressing and holding the substrate.
Description
CLAIM OF PRIORITY
This application makes reference to, incorporates the same herein,
and claims all benefits accruing under 35 U.S.C. .sctn.119 from an
application for HOLDING TRAY FOR SUBSTRATE, SUBSTRATE ALIGNMENT
SYSTEM USING THE SAME AND METHOD THEREOF, earlier filed in the
Korean Intellectual Property Office on the 5.sup.th of Jan. 2005
and there duly assigned Serial No. 10-2005-0000956.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a holding tray for substrate, a
substrate alignment system using the same and a method thereof, and
more specifically to a holding tray for substrate capable of
accomplishing high-precision alignment and conducting a stable
deposition process. A holding means is included in at least one
side of the substrate to hold and support the substrate that is to
be vertically arranged. Therefore, the substrate can be vertically
held and supported on a flat surface of the holding tray for a
vacuum deposition process.
2. Related Art
Generally, a deposition process of a thin film is divided into two
groups: deposition under vacuum and deposition under atmospheric
pressure.
In the aforementioned deposition process, the method of depositing
the thin film under vacuum has been used in the fields of
semiconductors and display devices, because it may be used to form
a high-purity thin film without contamination by foreign
substances, and to deposit a thin film with relatively compact
density.
When a deposition of a thin film is carried out under vacuum
condition, the thin film was deposited using a batch process due to
limitation of the volume of the process chamber and the size of the
substrate which may be placed in the process chamber, etc.
Such a means for holding and supporting the substrate and the
method thereof will be described in detail with reference to the
accompanying drawings.
SUMMARY OF THE INVENTION
Therefore, it is an object of the present invention to provide a
holding tray for substrate capable of accomplishing high-precision
alignment and conducting a stable deposition process, and a
substrate alignment system using the same and a method thereof.
In order to accomplish the above object, the holding tray for
substrate according to the present invention includes a substrate
on which a deposition is made, a frame formed to receive the
substrate, a tray formed to receive the frame; and at least one
holding means for substrate formed to hold the substrate on the
frame.
Also, the holding means for substrate includes a press member for
pressing and closely holding the substrate to the frame with
specific elasticity in at least one side of the substrate.
Here, the press member preferably includes a projection for
insertion in its end so that it can be elastically held with the
frame by means of the elastic means. The frame further comprises a
first protruded groove and a second protruded groove, where the
projection is inserted into the first protruded groove for holding
the substrate to the frame, and the projection is inserted into the
second protruded groove for releasing the substrate from the
frame.
Also, the press member may form a coupling hole in which a coupling
member is anchored, and may suspend an elastic member in the
coupling member to be elastically connected with the frame.
Also, the holding means includes at least one side supporter for
supporting a side of the substrate.
Also, the holding means includes at least one bottom supporter for
anchoring and supporting the substrate in a lower part of the
substrate.
Here, a groove in which the substrate is preferably anchored is
formed in the bottom supporter, and the groove is preferably
slantwise formed in at least one side so that it provides a margin
for anchoring the substrate.
In addition, the protruded groove, in which the lower part of the
substrate supported and anchored, has round edges.
Also, the holding tray for substrate further includes at least one
substrate alignment means formed to align the substrate on the
frame.
Here, the substrate alignment means includes a reference element
formed to provide a reference point in at least one edge on the
frame when the substrate is anchored on the frame, and an
adjustment element for adjusting the substrate so that the
substrate can be in contact with the reference element in at least
one edge on the frame when the substrate is anchored on the
frame.
The reference element may be a reference pin formed in the
reference point of at least one edge on the frame, and may be a
reference hole where a reference rod can pass through the reference
hole, and the adjustment element is an adjustment hole formed in at
least one edge on the frame where an adjustment rod can pass
through the adjustment hole.
Also, the substrate alignment means includes a through hole formed
in at least two edges of the frame so that a substrate handler can
pass through the through hole.
Also, the holding means for substrate is composed of clamps formed
so that the substrate anchored on the frame can be held in at least
one edge on the frame, and the clamp is a press member for pressing
and closely holding the substrate to the frame with elasticity in
at least one side of the substrate.
The press member includes an elastic means, and also includes a
projection for insertion in its end so that it is elastically
coupled with the frame by means of the elastic means, where a
groove into which the projection for insertion is inserted is
formed in the frame.
Here, the press member forms a coupling hole in which a coupling
member is anchored, and suspends an elastic member in the coupling
member to be elastically connected with the frame.
Also, the press member is formed in a manner that it can be
continuously operated from a first position for press the substrate
to a second position releasing the substrate, and vice versa. The
continuous operation of the press member may be conducted by a
substrate clamp pusher.
Here, the continuous operation of the press member is preferably
conducted by a guide tool. The guide tool may include a guide
protrusion formed in the projection for insertion received into the
frame of the press member, and a guide groove formed in the frame
to match the guide protrusion. In another embodiment, the guide
tool may include a guide groove formed in the projection for
insertion received into the frame of the press member, and a guide
protrusion formed in the frame to match the guide groove.
Also, the continuous operation of the press member is conducted by
moving the press member up or down while turning the substrate
clamp pusher.
A substrate alignment system using the holding tray according to
the present invention includes the holding tray for substrate, a
mask pressed in one surface of the substrate held in the holding
tray, and an alignment plate including a flat chuck formed to press
the substrate and a driving means formed to be connected to the
flat chuck to move the flat chuck so that the holding tray can be
supported, held and aligned.
The substrate alignment system using the holding tray according to
the present invention further includes at least one coupling unit
in the holding tray and alignment plates which are coupled with
each other to hold the holding tray.
Also, a method for aligning a substrate according to the present
invention includes steps of anchoring a tray where the tray
provided in the frame is anchored onto a tray support means;
providing a substrate where the substrate is entered onto the tray;
handling the substrate where the substrate entered onto the tray is
supported by a substrate handler; anchoring the substrate where the
substrate supported by the substrate handler is anchored onto the
tray; aligning the substrate where the substrate is aligned by a
substrate alignment means; holding the aligned substrate where the
aligned substrate is held on the tray by a holding means for
substrate; standing the tray where the tray onto which the
substrate is anchored is stood from the tray support means; and
inputting the substrate anchored tray where the tray is input into
a chamber.
BRIEF DESCRIPTION OF THE DRAWINGS
A more complete appreciation of the invention and many of the
attendant advantages thereof, will be readily apparent as the same
becomes better understood by reference to the following detailed
description when considered in conjunction with the accompanying
drawings in which like reference symbols indicate the same or
similar components, wherein:
FIG. 1A is a cross sectional view showing a holding apparatus
aligned to a substrate.
FIG. 1B is a cross sectional view showing the holding apparatus of
FIG. 1A moving down to the substrate.
FIG. 2A is a front view showing a holding tray.
FIG. 2B is a rear view showing the holding tray.
FIG. 2C is a side view showing the holding tray.
FIG. 3A is a perspective view showing a first holding means 110
holding an upper left corner of a substrate, and a second holding
means 120 supporting the left side of the substrate.
FIG. 3B is a perspective view showing a third holding means 130 and
a fourth holding means 140 holding a lower left corner of a
substrate, and a second holding means 120 supporting the left side
of the substrate.
FIG. 3C is a perspective view showing the third holding means 130
in detail.
FIG. 4A is a perspective view showing the first holding means 110
before being coupled with the frame.
FIG. 4B is a perspective view showing the first holding means 110
after being coupled with the frame,
FIG. 4C is a perspective view showing that the third holding means
130 when the third holding means is coupled with the frame.
FIG. 4D is a perspective view showing a protruded groove formed in
a rear surface of the frame of FIG. 4C.
FIG. 5A is a side view showing the third holding means 130 before
being coupled with the tray.
FIG. 5B is a side view showing the third holding means 130 after
being coupled with the tray.
FIG. 5C is a cross sectional view showing the third holding means
130 and the fourth holding means 140.
FIG. 6A is a front view showing the holding tray constructed as one
embodiment of the present invention.
FIG. 6B is a front view showing the holding tray constructed as a
modified embodiment of the present invention.
FIGS. 7A and 7B are partial perspective views showing operation of
the third holding means.
FIGS. 8A and 8B are perspective views showing one example of the
third holding means of FIGS. 7A and 7B.
FIGS. 9A and 9B are perspective views showing another example of
the third holding means of FIGS. 7A and 7B.
FIG. 10A is a cross sectional view showing arrangements of the
holding tray, the mask tray, and the chuck plate of the substrate
alignment system.
FIG. 10B is a cross sectional view showing coupling of the holding
tray, the mask tray, and the chuck plate of the substrate alignment
system.
FIG. 11A is a perspective view showing a substrate, a substrate
frame and a tray in the holding tray of the substrate alignment
system.
FIG. 11B is a perspective view showing the holding tray when the
substrate is detached from the holding tray of the substrate
alignment system.
FIG. 11C is a perspective view showing the holding tray when the
substrate is attached in the holding tray of the substrate
alignment system.
FIG. 12A is a perspective view showing the substrate alignment
system when the holding tray, the mask tray, and the chuck of the
substrate alignment system are coupled together.
FIG. 12B is a perspective view showing the substrate alignment
system when the substrate is coupled with the mask.
FIG. 13A is a cross sectional view showing upper portion of the
substrate alignment system when the holding tray, the mask tray,
and the chuck of the substrate alignment system are coupled
together.
FIG. 13B is a perspective view showing part of the lower portion
when the substrate, holding means, and the chuck of the substrate
alignment system are coupled together.
FIG. 14A is a schematic view showing incomplete contact of the
substrate with a mask.
FIG. 14B is a schematic view showing complete contact of the
substrate with a mask.
FIG. 15A is a cross sectional view showing operation of the third
holding means 130.
FIG. 15B is a cross sectional view showing incomplete contact of
the substrate with a mask tray.
FIG. 15C is a cross sectional view showing complete contact of the
substrate with a mask tray.
FIG. 16 is a schematic view showing a step of anchoring the tray in
the method for aligning the substrate using the holding tray.
FIG. 17 is a schematic view showing a step of placing the substrate
in the method for aligning the substrate using the holding
tray.
FIG. 18 is a schematic view showing a step of handling the
substrate in the method for aligning the substrate using the
holding tray.
FIG. 19 is a schematic view showing a step of anchoring the
substrate in the method for aligning the substrate using the
holding tray.
FIG. 20 is a schematic view showing a step of aligning the
substrate in the method for aligning the substrate using the
holding tray.
FIG. 21 is a schematic view showing a step of holding the substrate
in the method for aligning the substrate using the holding
tray.
FIGS. 22A and 22B are schematic views showing steps of standing the
tray in the method for aligning the substrate using the holding
tray.
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1A is a cross sectional view showing a holding apparatus
aligned to a substrate, and FIG. 1B is a cross sectional view
showing the holding apparatus of FIG. 1A moving down to the
substrate.
Referring to FIGS. 1A and 1B, a substrate 10 is mounted on a frame
20, and a mask 30 is positioned between the substrate 10 and the
frame 20. The mask 30 has a desired pattern to be formed on the
substrate 10. A holding unit 50 supporting the substrate 10 is
positioned in the upper portion of the substrate 10. The holding
unit 50 includes a magnetic plate 52 and a rubber magnet 54 stuck
to a lower surface of the magnetic plate 52.
The holding unit 50 is positioned on the substrate 10 by means of
robot return so as to hold the substrate 10, and the mask 30 is
aligned to the substrate 10.
Then, the holding unit 50 moves down to the substrate 10, as shown
in FIG. 1B. As the holding unit 50 descends, the mask 30, which is
made of metal materials and positioned in the lower portion of the
substrate 10, is attracted by a magnetic force, and the shape of
the mask 30 is modified pushing a central region of the mask 30
toward the holding unit 50, and simultaneously closely pressing the
substrate 10. Meanwhile, the rubber magnet 54 of the holding unit
50 is anchored on the rear surface of the substrate 10 to support
the substrate 10. As described above, the deposition is conducted
under this condition, where the mask 30 is in close contact with
the substrate 10.
However, as the mask 30 approaches the holding unit 50 making the
gap between the mask 30 and holding unit 50 narrower, the central
region of the mask 30 moves first, and the movement causes a
mismatch between the mask 30 and the holding unit 50. Accordingly,
the central region of the mask 30 satisfactorily closely adheres to
the substrate 10, while the edge of the mask 30 does not
sufficiently closely adhere to the substrate 10. As a result, the
pattern to be formed on the substrate 10 is not as accurate as
desired, resulting in a poor product. Also, as the central region
of the mask 30 moves up prior to the other region, there exists a
problem that the substrate 10 is damaged by sliding movement when
the mask 30 closely contacts the substrate 10.
Even when the substrate 10 contacts mask 30 after alignment
process, there exists a fine gap between the substrate 10 and the
mask 30, because the substrate 10 is not perfectly parallel to the
mask 30, and therefore a fine slide is caused between the substrate
10 and the mask 30, lowering alignment precision, and therefore the
alignment process should be repeated several times.
Hereinafter, preferable embodiments of a holding tray for substrate
according to the present invention will be described with reference
to the accompanying drawings.
Here, when one element is connected to another element, one element
may be not only directly connected to another element but also
indirectly connected to another element via another element.
Further, irrelevant elements are omitted for clarity.
FIG. 2A is a front view showing a holding tray according to an
embodiment of the present invention. FIG. 2B is a rear view showing
the holding tray according to the embodiment of the present
invention, and FIG. 2C is a side view showing the holding tray
according to the embodiment of the present invention.
Referring to FIGS. 2A to 2C, the holding tray according to the
present invention includes a substrate 10 on which a deposition is
made, and a tray 60 which holds the substrate 10 and is provided
with holder members 66 and adhesion members 68.
The plate-type tray 60 is suitably constructed to hold the frame
70, and further constructed to have holding plates 72 to hold the
frame. The frame 70 equipped in the tray 60 is suitably formed to
hold the substrate 10, and first holding means 110, second holding
means 120, third holding means 130, and fourth holding means 140
are formed to hold the substrate 10. A transporting means 64 is
formed in a lower portion of the tray 60 so that the substrate 10
can be transported into a vacuum chamber, and a guide means 62 is
formed in an upper portion of the tray 60 so that transportation of
the substrate 10 is guided while being transported by the
transporting means 64. A plurality of holder members 66 and
adhesion members 68 are formed on the plate of the tray 60 along an
edge of the frame 70, and openings are formed in the holder member
66.
FIG. 3A is a perspective view showing a first and a second holding
means 110 and 120 located at an upper left corner of a substrate of
the holding tray according to the embodiment of the present
invention. FIG. 3B is a perspective view showing a second, a third,
and a fourth holding means located at a lower left corner of a
substrate of the holding tray according to an embodiment of the
present invention. FIG. 3C is a perspective view showing a third
holding means 130, a coupling member 135 and an elastic means 136
of the holding tray according to the embodiment of the present
invention.
Referring to FIGS. 3A to 3C, the first holding means 110 and the
third holding means 130, which are positioned on the upper portion
and the lower portion of the substrate 10, respectively, are formed
to elastically hold and support the substrate 10. Here, elasticity,
which is required for the holding means 110 and 130 to hold and to
support the substrate 10, is accomplished through an elastic means
136. The elastic means 136 is included in the holding means 110 and
130, and the elastic means 136 is preferably a spring member. The
elastic means 136 is formed in a manner to make a coupling member
135 being anchored and sustained in the coupling hole that is
formed in the holding means 130, as shown in FIG. 3C. Only the
third holding means 130 is described with reference to the
accompanying drawings, but such a configuration is also applicable
to the first holding means 110.
A first and a third projections 111 and 131 are formed in the first
and third holding means 110 and 130, respectively, to be inserted
into the protruded grooves 71a or 71b, and 73a or 73b,
respectively, which are formed on the frame 70. The protruded
grooves 71a and 71b formed in the upper portion of the frame 70 are
formed to receive the first projection 111 of the first holding
means 110. The first holding means 110 is inserted into the
protruded groove 71a to press the substrate 10, and the holding
means 110 is inserted into the protruded groove 71b to depress the
substrate 10. The protruded grooves 73a and 73b formed in the lower
portion of the frame 70 are formed to receive the third projection
131 of the third holding means 130. The holding means 130 is
coupled to the protruded groove 73a to press the substrate 10, and
coupled to the protruded groove 73b to depress the substrate
10.
When the substrate 10 is being mounted in the frame 70, the elastic
means of the holding means 110 and 130 are first stretched under
tension, and after the substrate 10 is completely anchored in the
frame 70, the elastic means are released having the holding means
110 and 130 press the substrate 10. By these steps, the substrate
10 is anchored to the frame 70.
Also, the second holding means 120 positioned in the side of the
substrate 10 is formed to be held through grooves (not shown)
formed in the frame 70, and a step height is formed to receive
thickness of the substrate 10 so that the substrate 10 can be
received in a direction into which the substrate 10 is charged.
That is to say, the holding means 120 of the side of the substrate
forms the protruded grooves along with the frame 70 while adhering
to the frame 70, and therefore thickness of the substrate 10 is
received into the protruded grooves. When the substrate 10 is
mounted on the frame 70, the substrate 10 is received into the step
height of the holding means 120, namely the protruded groove formed
along with the frame 70. The holding means 120 assists supporting
the substrate 10 when the substrate 10 is held and supported by the
frame 70 via the aforementioned holding means 110 and 130.
FIG. 4A is a perspective view showing the first and second holding
means 110 and 120 of the holding tray according to the embodiment
of the present invention before the holding means 110 and 120 are
coupled with the frame. FIG. 4B is a perspective view showing the
holding means 110 and 120 of the holding tray according to the
embodiment of the present invention after the holding means 110 and
120 are coupled with the frame.
Referring to FIGS. 4A and 4B, when the substrate 10 is held in the
frame 70, the substrate 10 is supported by the first holding means
110 in the upper portion of the substrate 10. The holding means 110
formed to hold the upper portion of the substrate 10 is formed to
have a first projection 111 in somewhere of the holding means 110
in a manner that the projection 111 can be received into the
protruded groove 71a or 71b formed in the frame 70. The protruded
groove 71a formed in the frame 70 receives an elastic means that is
included in the holding means 110, and are formed to hold one end
of the elastic means.
When the substrate 10 is being held, the first holding means 110 is
pulled in a direction away from the frame 70 under tension provided
by the elastic means. When a side of the substrate 10 is completely
charged into the protruded groove of the second holding means 120,
the first holding means 110 is released, relieving the tension of
the elastic means, to hold the substrate 10. The holding means 110
engaged with the elastic means is to be held and supported by
pressure of the elastic means, and closely adheres to the charged
substrate 10 due to the tension of the elastic means.
FIG. 4C is a perspective view showing the third holding means of
the holding tray according to an embodiment of the present
invention when the third holding means is coupled with the frame.
FIG. 4D is a cross sectional view showing a groove formed in a rear
surface of the cross sectional view shown in FIG. 4C.
Referring to FIGS. 4C and 4D, when the substrate 10 is held in the
frame 70, the substrate 10 is supported by the third holding means
130 in the lower portion of the substrate 10. The holding means 130
formed to hold the lower portion of the substrate 10 is formed to
have a third projection 131 in somewhere of the holding means 130
in a manner that the projection 131 can be received into the
protruded groove 73a or 73b formed in the frame 70. The protruded
groove 73a and 73b formed in the frame 70 receives the elastic
means that is included in the holding means 130, and the protruded
groove 73a is formed through the rear surface of the holding tray
where the holding means 130 is pressured to the frame 70. The
protruded groove 73a has a shape for holding one end of the elastic
means. Also, coupling holes are formed in the first and third
holding means 110 and 130, where the other end of the elastic means
anchored. And the coupling member 135 (see FIG. 3C) is formed in
the elastic means. The other end of the elastic means is sustained
to the coupling member 135 to be anchored to the coupling hole.
Here, only the protruded groove 73a is described with reference to
the accompanying drawings, but such a configuration is also
applicable to the protruded groove 71a of the specification. The
elastic means is coupled only with the protruded groove 73A (not
with 73B). When the holding means 130 holds the substrate, both of
the elastic means and the projection 131 are coupled with the
groove 73a. When the holding means releases the substrate, the
elastic means is coupled with the groove 73a, but the projection is
coupled with the groove 73b. At this time, the elastic means is
expected or compressed in the state that the coupling member 135 is
fixed to a predetermined part of a vertical opening formed in the
holding means 130. Alternatively, the coupling member may move up
and down through the vertical opening when the projection of the
holding means moves between the grooves 73a and 73b, so that the
holding means freely moves up and down even when the elastic means
is permanently coupled with the groove 73A.
FIG. 5A is a side view showing the third holding means 130 of the
holding tray according to an embodiment of the present invention
before the holding means 130 is coupled with the tray. FIG. 5B is a
side view showing the third holding means 130 of the holding tray
according to an embodiment of the present invention after the
holding means 130 is coupled with the tray. FIG. 5C is a cross
sectional view showing the third holding means 130 and fourth
holding means 140 of the holding tray according to an embodiment of
the present invention.
Referring to FIGS. 5A to 5C, when the substrate 10 is held in the
frame 70, the substrate 10 is supported by the third holding means
130 in the lower portion of the substrate 10. The holding means 130
formed to hold the lower portion of the substrate 10 is formed to
have the third projection in somewhere of the holding means 130 in
a manner that it can be received into the protruded groove 73a or
73b formed in the frame 70. The protruded grooves 73a and 73b
formed in the frame 70 receive the elastic means further included
in the holding means 130, and is formed to hold one end of the
elastic means.
When the substrate 10 is being held, the third holding means 130 is
pulled in a direction away from the frame 70 under tension provided
by the elastic means. When a side of the substrate 10 is completely
charged into the protruded groove of the second holding means 120,
the third holding means 130 is released, relieving the tension of
the elastic means, to hold the substrate 10. The holding means 130
engaged with the elastic means is to be held and supported by
pressure of the elastic means, and closely adheres to the charged
substrate 10 due to the tension of the elastic means.
Referring to FIGS. 5A to 5C again, when the substrate 10 is held in
the frame 70, the substrate 10 is supported by the fourth holding
means 140 in the lower portion of the substrate 10. The holding
means 140 formed to support the lower portion of the substrate 10
is formed to be held in grooves formed in the frame 70. The holding
means 140 has protruded grooves in the upper portion to support the
substrate 10. As shown in FIG. 5C, the protruded grooves include a
lower surface 140b having a predetermined spacing, a vertical side
140a formed perpendicular to the lower surface 140b, and an
inclined side 140c formed to be inclined to the vertical side 140c.
The protruded groove has rounded edges so that the substrate 10 is
smoothly charged into the opening portion of the protruded groove
formed to support the substrate 10. When the substrate 10 is
mounted in the frame 70, the lower portion of the substrate 10 is
anchored onto the holding means 140. Describing more accurately,
the lower portion of the substrate 10 is anchored to the lower
surface 140b of the protruded groove formed in the holding means
140.
The vertical side 140a of the protruded groove is formed to closely
adhere to the frame 70, and then the substrate 10 closely adheres
to the vertical side 140a. That is to say, the substrate 10 pressed
by the holding means 140 closely adhered to be parallel to the
vertical side 140a.
The lower surface 140b of the holding means 140, which is formed to
provide the substrate 10 with the gap, supports the substrate 10,
and the gap has a margin in a manner that the substrate 10 can be
coupled to or separated from the frame 70 while being supported by
the lower surface 140b.
The inclined side 140c, which is formed to be inclined to the
vertical side 140a of the holding means 140, is downwardly inclined
at the side of the frame 70 to allow a margin that would guide the
substrate 10 when the substrate 10 is anchored into the protruded
groove of the holding means 140
Hereinafter, another embodiment of the holding tray for substrate
according to the present invention will be described in detail with
reference to the accompanying drawings.
FIG. 6A is a front view showing a holding tray for substrate
according to an embodiment of the present invention. FIG. 6B is a
front view showing a holding tray for substrate according to a
modified embodiment of the present invention.
A plate type tray 60 is suitably formed to receive a frame 70, and
a holding plate for frame (not shown) is additionally formed to be
held in the tray 60. The frame 70 received into the tray 60 is
suitably formed to receive a substrate 10, and the holding means
for substrate 110, 120, 130, and 140 are formed to hold the
substrate 10. A transporting means 64 is formed in the lower
portion of the tray 60 so that the substrate 10 can be transported
to a vacuum chamber, and a guide means 62 is formed in the upper
portion of the tray 60 so that the transportation of the substrate
10 can be guided while being transported by the transporting means
64. A plurality of holder members 66 and adhesion members 68 are
formed on the plate of the tray 60 along edges of the frame 70, and
openings are formed in the holder member 66.
Also as shown in FIG. 6A, in order to align the substrate anchored
onto the frame 70 of the tray 60, a plurality of reference pins 76
are formed on the frame 70. A plurality of the reference pins 76
functions as a reference point that provides a suitable position of
the substrate 10 when the substrate 10 is anchored onto the frame
70. Also, four adjustment holes 77 are formed on the frame 70.
Adjustment means (not shown in the present drawings) pass through
the four adjustment holes 77 in a manner that the substrate 10 can
be moved to a desired position so that the edge of the substrate 10
is in exact contact with the reference pins 76. The adjustment
means (not shown in the present drawings) may pass through the
adjustment hole 77 from the rear surface of the tray 60, and then
the position of the substrate 10 may be adjusted, based on the
reference pins 76.
FIG. 6B shows a modified example of the configuration shown in FIG.
6A. A plurality of reference holes 78 may be formed on the frame 70
as the reference means. When such a reference hole 78 is formed,
the reference means (not shown in the present drawings) pass
through the reference hole 78 from the rear surface of the tray 60
to provide reference points, when the substrate 10 is anchored on
the frame 70. Then, the adjustment means may be used by means of
the adjustment hole 77 as described above to adjust the position of
the substrate 10.
Reference elements 76 or 78 are formed on at least one edge of the
frame 70 to provide reference points for the substrate 10. On the
other edge of the frame 70 on which the reference elements 76 or 78
are not formed, the adjustment holes 77 are formed.
Preferably in the rectangular frame 70, two reference elements 76
or 78 are formed in two nearby edges, and two adjustment holes 77
are formed in the other two edges.
Four through holes 75 are formed on the frame 70 of the tray 60 in
a manner that a substrate handler, which will be described later,
can pass through the through holes. The substrate handler passes
through the tray 60 from the rear surface of the tray 60 via the
through holes 75 to anchor the substrate 10 onto the frame 70 in
the front of the tray 60. In order to steadily anchor the substrate
10, two through holes 75 are formed on each of two edges of the
frame 70 in this embodiment.
The frame 70 received into the tray 60 is suitably formed to
receive the substrate 10, and the holding means for substrate 110,
120, 130, and 140 are formed to hold the substrate 10.
FIGS. 7A and 7B are partial perspective views showing operation of
the holding means according to an embodiment of the present
invention.
The second holding means 120 positioned in the side of the
substrate 10 is formed to be held in the grooves (not shown) formed
in the frame 70, and a step height is formed to receive thickness
of the substrate 10 so that the substrate 10 can be received in a
direction into which the substrate 10 is charged. That is to say,
the holding means for substrate 120 of the side surface forms the
protruded grooves along with the frame 70 while it adheres to the
frame 70, and therefore thickness of the substrate 10 is received
into the protruded grooves. When the substrate 10 is mounted on the
frame 70, the substrate 10 is received into the step height of the
second holding means 120, namely the protruded groove formed along
with the frame 70. The holding means for substrate 120 assists the
substrate 10 when the substrate 10 is held and supported to the
frame 70 by the aforementioned holding means for substrate 110 and
130.
The third holding means 130 positioned in the lower portion of the
substrate 10 is formed to hold and support the substrate 10 with
elasticity. Here, the elasticity, with which the holding means 130
hold and support the substrate 10, is accomplished by an elastic
means 136 that is further included in the holding means 130, and
the elastic means 136 is preferably a spring member.
When the substrate 10 is being mounted in the frame 70, the elastic
means of the third holding means 130 is first stretched under
tension, and after the substrate 10 is completely anchored in the
frame 70, the elastic means are released having the holding means
130 press the substrate 10. By these steps, the substrate 10 is
anchored to the frame 70.
A projection 131 is formed in the holding means 130 to be inserted
into the protruded grooves formed on the frame 70. The projection
131 is formed to elastically hold the holding means 130 on the
frame 70 by means of the aforementioned elastic means 136.
The holding means 130 functions as a clamp, and presses and holds
the substrate 10 closely to the frame 70 with elasticity when the
substrate 10 is anchored onto the frame 70.
The third holding means 130 is formed to be engaged in a first
position (FIG. 7A) or a second position (FIG. 7B). The first
position (FIG. 7A) presses the substrate 10 on the frame 70, and
the second position (FIG. 7B) releases the substrate 10 so that the
third holding means 130 does not interfere the input of the
substrate 10 when the substrate 10 is charged into the frame 70.
The continuous operation of such a holding means 130 is achieved by
employing a substrate clamp pusher (not shown).
One example of such a third holding means 130 is shown in FIG. 8A
and FIG. 8B. The elastic means 136 is formed to be sustained to the
coupling member 135 so that the coupling member 135 can be anchored
to the coupling hole formed in the third holding means 130.
The continuous operation to the aforementioned first position and
the aforementioned second position of the third holding means 130
may be conducted through the guide apparatus. At least one guide
protrusion 133 is formed on the projection for insertion 131 of the
third holding means 130. A guide groove 79 is formed inside the
frame 70. More specifically, the projection 131 of the third
holding means 130 is inserted into a portion of inside of the
protruded groove of the frame 70, so that it can be matched with
the guide protrusion 133 formed on the projection for insertion 131
of the third holding means 130. The guide groove 79 formed in the
frame 70 is formed so that the third holding means 130 can move to
the aforementioned first position and the aforementioned second
position, respectively, when the guide protrusion 133 of the third
holding means 130 moves along with the guide groove 79. That is to
say, the guide groove 79 is spirally formed in the inner part of
the cylindrical protruded groove formed to receive the cylindrical
projection for insertion 131, and therefore the guide groove 79
allows the third holding means 130 to move from the first position
to the second position, and vice versa, when the guide protrusion
133 moves along the guide groove 79.
In addition to the aforementioned guide apparatus, although not
shown in the drawings, it is also possible to form the guide
grooves 79 in the projection 131 of the third holding means 130.
Then the guide protrusion 133 is formed inside the protruded groove
of the frame 70. The technical object of this embodiment is the
same as described in the aforementioned guide apparatus.
In another embodiment, the continuous operation of the third
holding means 130 from the first position to the second position,
and vice versa, may be conducted by fitting the third holding means
130 to a substrate clamp pusher 530, as shown in FIG. 9A and FIG.
9B.
A convex 134 is formed in the projection 131 of the third holding
means 130. The convex 134 is formed in a section where the
projection 131 is in contact with the substrate clamp pusher 530. A
concave 534 is formed in the substrate clamp pusher 530, more
specifically in the section where the substrate clamp pusher 530 is
in complete contact with the projection 131 of the third holding
means 130 so as to correspond to the convex 134. Preferably, when
the convex 134 and the concave 534 are fitted to each other, the
section in which the convex 134 of the third holding means 130 is
formed, and the section in which the concave 534 of the substrate
clamp pusher 530 is formed, are in complete contact with each
other, because the convex 134 and the concave 534 are designed as
the same plate type.
The completely fitted third holding means 130 is engaged with a
linear motion and a rotary motion of the substrate clamp pusher 530
and therefore the continuous operation moving between the first
position and the second position is accomplished.
Only the third holding means 130 is described with reference to the
accompanying drawings, but such a configuration is also applicable
to the first holding means 110 of the specification.
Hereinafter, a substrate alignment system using the holding tray
for substrate according to an embodiment of the present invention
will be described in detail with reference to the accompanying
drawings.
FIG. 10A is a cross sectional view showing arrangement of the
holding tray for substrate, the mask tray, and the chuck plate of
the substrate alignment system according to an embodiment of the
present invention. FIG. 10B is a cross sectional view showing
coupling of the holding tray for substrate, the mask tray, and the
chuck plate of the substrate alignment system according to an
embodiment of the present invention.
Referring to FIGS. 10A and 10B, the tray 60 is arranged prior to a
position in which a chuck 92 of an alignment plate 90 is positioned
so as to carry out a vacuum deposition on the substrate 10 held in
the tray 60. Also, a mask tray 80 for forming a pattern in the
substrate 10 is arranged prior to the tray 60 upon the vacuum
deposition. That is to say, the tray 60 is arranged between the
mask tray 80 and the alignment plate 90. Then, the tray 60 is
coupled to the chuck 92 of the alignment plate 90. The mask tray 80
is coupled to the tray 60 at the opposite side where the chuck 92
of the alignment plate 90 is coupled to the tray 60. A shadow mask
30 (see FIG. 12B), in which the pattern is formed on a surface
where the deposition takes place, is coupled to the mask tray
80.
Before a deposition is carried out, alignment should be
accomplished between the substrate 10 mounted on the tray 60, and
the shadow mask mounted on the mask tray 80. For such an alignment,
the alignment plate 90 is formed to move the tray 60 in all
directions in a manner that the tray 60 on which the substrate 10
is mounted can be aligned with the shadow mask mounted on the mask
tray 80.
Reference numeral 82 represents the guide means of the mask tray,
and reference numeral 84 represents the transporting means of the
mask tray.
FIG. 11A is a perspective view showing the substrate, the substrate
frame, and the tray in the holding tray of the substrate alignment
system according to an embodiment of the present invention. FIG.
11B is a perspective view showing the holding tray when the
substrate is detached from the holding tray of the substrate
alignment system according to an embodiment of the present
invention. FIG. 11C is a cross sectional view showing the holding
tray when the substrate is attached to the holding tray of the
substrate alignment system according to an embodiment of the
present invention.
Referring to FIGS. 11A to 11C, the frame 70 is coupled to a front
of the tray 60, and the substrate 10 is coupled to the frame 70
from the rear surface of the tray 60. The frame 70 is coupled to an
opening formed in the central region of the tray 60, and then held
to the tray 60 by the support plate for frame. Then, the substrate
10 is coupled to an opening formed in the frame 70, and then held
to the frame 70 by the holding means 110, 120, 130, and 140. The
process that the substrate 10 is held to the frame 70 by means of
the holding means 110, 120, 130, and 140 is described above in
detail. The holding tray for holding the substrate 10 is completely
assembled by coupling the frame 70 and the substrate 10 to the tray
60.
FIG. 12A is a perspective view showing the substrate alignment
system when the holding tray, the mask tray, and the chuck of the
substrate alignment system are coupled together according to an
embodiment of the present. FIG. 12B is a perspective view showing
the substrate alignment system when the substrate is coupled with
the mask of FIG. 12A. FIG. 13A is a cross sectional view showing
part of the upper portion when the holding tray, the mask tray and
the chuck of the substrate alignment system are coupled together
according to an embodiment of the present invention. FIG. 13B is a
perspective view showing part of the lower portion when the
substrate, holding means, and the chuck of the substrate alignment
system are coupled together according to an embodiment of the
present invention.
Referring to FIGS. 12A to 13B, the substrate 10 mounted on the tray
60 and the shadow mask mounted on the mask tray 80 are aligned, and
then are coupled with the chuck 92 of the alignment plate 90. The
chuck 92 of the alignment plate 90 includes a driving means, and
therefore may move horizontally and reciprocally so that the
substrate 10 comes into close contact with the shadow mask. At this
time, the lower portion of the substrate 10 is held by the third
and fourth holding means 130 and 140, and the upper portion and
side surface of the substrate 10 are also held and supported by the
holding means 110 and 120, respectively.
FIG. 14A is a schematic view showing incomplete contact of the mask
30 with the substrate 10 coupled with the chuck 92 of the substrate
alignment system according to an embodiment of the present
invention. FIG. 14B is a schematic view showing complete contact of
the mask 30 with the substrate that is coupled with the chuck of
the substrate alignment system according to an embodiment of the
present invention.
Referring to FIGS. 14A and 14B, the substrate 10 and the mask 30
generate slip when the chuck 92 is pressed. That is to say, the
substrate 10 and the mask 30 slid together, or are not parallel to
each other. The slip is avoided if the chuck 92 is more pressed,
but the alignment of the substrate 10 and the mask 30 is mismatched
in the process, because pressure of the chuck 92 applied to the
substrate 10 and pressure applied to the mask 30 are slightly
different, and pressure distribution of the entire area of the
substrate 10 is slightly not even.
FIG. 15A is a cross sectional view showing operation of the third
holding means 130 of the substrate alignment system according to an
embodiment of the present invention. FIG. 15B is a cross sectional
view showing incomplete contact of the substrate with the mask tray
in the substrate alignment system according to an embodiment of the
present invention. FIG. 15C is a cross sectional view showing
complete contact of the substrate with the mask tray in the
substrate alignment system according to an embodiment of the
present invention.
Referring to FIGS. 15A to 15C, the substrate 10 is pushed to the
mask tray (not shown) by the force F.sub.1 generated by the
pressure of the chuck 92, and therefore the substrate 10 closely
adheres to the mask tray but incompletely. The substrate 10, being
pushed by the force (F.sub.1) generated by the pressure, moves
along the lower surface of the protruded groove 140b formed in the
holding means 140. Accordingly, there is no slide between the
substrate 10 and the shadow mask 30 that contacts the substrate 10,
and free movement is accomplished while the substrate 10 and the
shadow mask 30 is being combined even when the chuck plate 90 (FIG.
10B) is pressed. The substrate 10 should not be detached from the
frame 70 since the holding means 140 provides only a slightly
larger gap than the thickness of the substrate 10.
Also, the force (F.sub.1) generated by the pressure is compensated
with a force (F.sub.2) generated by the pressures of the holding
means 110 and 130, which hold and support the substrate 10 by the
pressures of the elastic means engaged with the holding means 110
and 130. That is to say, although the aforementioned substrate 10
and the mask coalesced with the substrate 10 are pushed away by the
force (F.sub.1) generated by the pressure, the substrate 10 is
pressed to closely adhere to the frame 70 that is mounted on the
substrate tray 60, and then the substrate 10 closely and completely
adheres to the frame 70. As described above, the coalescence with
the substrate 10 and the mask is accomplished by means of the
holding means 110, 120, 130, and 140 without altering the
alignment.
Hereinafter, a preferred embodiment of a method for aligning the
substrate using the holding tray according to an embodiment of the
present invention will be described in detail with reference to the
accompanying drawings.
The method for aligning the substrate using the holding tray for
substrate according to the present invention includes steps of
providing a substrate for a holding tray, anchoring and supporting
the substrates to protruded grooves of a second and a fourth
holding means of the holding tray, and inserting projections for
insertion of a first and a third holding means of the holding tray
into the protruded groove formed in the frame to press and make
closely contact of a front surface of the substrate with the
frame.
Referring to FIGS. 11A to 11C, the frame 70 is coupled to a front
of the tray 60, and the substrate 10 is coupled to the frame 70
from the rear surface of the tray 60. The frame 70 is coupled to an
opening formed in the central region of the tray 60, and then held
to the tray 60 by the support plate for frame. Then, the substrate
10 is coupled to an opening formed in the frame 70, and then held
to the frame 70 by the holding means 110, 120, 130, and 140. The
process where the substrate 10 is held to the frame 70 by means of
the holding means 110, 120, 130, and 140 was described above in
detail. The holding process for holding the substrate 10 is
completed by coupling the frame 70 and the substrate 10 to the tray
60, and a step of providing the holding tray 60 with the substrate
10 is accomplished.
Referring to FIGS. 3A to 3C, the first and the third holding means
110 and 130, which are positioned on the upper portion and the
lower portion of the substrate 10, respectively, are formed to
elastically hold and support the substrate 10. Here, elasticity,
with which the holding means 110 and 130 hold and support the
substrate 10, is accomplished by an elastic means 136 that is
further included in the holding means 110 and 130, and the elastic
means 136 is preferably a spring member. The elastic means 136 is
formed to anchor a coupling member 135 to the coupling hole formed
in the holding means 130 so that it can be sustained into the
coupling member 135, as shown in FIG. 3C.
The projections for insertion 111 and 131 are formed in the holding
means 110 and 130, respectively, to be inserted into the protruded
grooves 71a or 71b, and 73a or 73b, respectively, formed on the
frame 70. The protruded grooves 71a and 71b formed in the upper
portion of the frame 70 are formed to receive the projection for
insertion 111 of the holding means 110. The holding means 110 is
inserted into the first protruded groove 71a when it presses the
substrate 10, and the holding means 110 is inserted into the second
protruded groove 71b when it depresses the substrate 10. The
protruded grooves 73a and 73b formed in the lower portion of the
frame 70 are formed to receive the projection for insertion 131 of
the third holding means 130. The third holding means 130 is
inserted into the third protruded groove 73a when it presses the
substrate 10, and the third holding means 130 is inserted into the
fourth protruded groove 73b when it depresses the substrate 10.
When the substrate 10 is being mounted in the frame 70, the elastic
means of the holding means 110 and 130 are first stretched under
tension, and after the substrate 10 is completely anchored in the
frame 70, the elastic means are released having the holding means
110 and 130 press the substrate 10. By these steps, the substrate
10 is anchored to the frame 70.
Also, the second holding means 120 positioned in the side surface
is formed to be held in the grooves (not shown) formed in the frame
70, and a step height is formed to receive thickness of the
substrate 10 so that the substrate 10 can be received in a
direction into which the substrate 10 is charged. That is to say,
the side surface of the holding means 120 forms the protruded
grooves along with the frame 70 while it adheres to the frame 70,
and therefore thickness of the substrate 10 is received into the
protruded grooves. When the substrate 10 is mounted on the frame
70, the substrate 10 is received into the step height of the
holding means 120, namely the protruded groove formed along with
the frame 70. The holding means 120 assists the substrate 10 when
the substrate 10 is held and supported by the frame 70 by the
aforementioned holding means 110 and 130.
Referring to FIGS. 4A to 4D, FIGS. 5A to 5C, FIGS. 10A to 10B, and
FIGS. 15A to 15C, the substrate 10 is pushed to the mask tray 80 by
the force (F.sub.1) generated by the pressure of the chuck 92, and
therefore the substrate 10 closely adheres to the mask tray but
incompletely. The substrate 10, being pushed by the force (F.sub.1)
generated by the pressure, moves along the lower surface of the
protruded groove 140b formed in the holding means 140. Accordingly,
there is no slide between the substrate 10 and the shadow mask 30
coalesced with the substrate 10, and free movement is accomplished
in the coalesced state even when the chuck plate 90 is pressed. The
substrate 10 should not be detached from the frame 70, because the
holding means 140 provides only a slightly larger gap than the
thickness of the substrate 10.
Also, the force (F.sub.1) generated by the pressure is compensated
with a force (F.sub.2) generated by the pressures of the holding
means 110 and 130 that hold and support the substrate 10 by the
pressures of the elastic means engaged with the holding means 110
and 130. That is to say, although the aforementioned substrate 10
and the mask coalesced with the substrate 10 are pushed away by the
force (F.sub.1) generated by the pressure, the substrate 10 is
pressed to closely adhere to the frame 70 that is mounted on the
substrate tray 60, and then the substrate 10 closely and completely
adheres to the frame 70. As described above, the coalescence with
the substrate 10 and the mask is accomplished by means of the
holding means 110, 120, 130, and 140 without altering the
alignment.
As described above, the method for aligning the substrate using the
holding tray according to the present invention conducts a step of
anchoring and supporting the substrate 10 to the protruded grooves
of the second holding means 120 and the fourth holding means 140 of
the holding tray 60, and then a step of inserting the projections
for insertion 111 of the first holding means 110 and the
projections for insertion 131 of the third holding means 130 of the
holding tray 60 into the protruded grooves for pressure 71a and
73a, respectively, formed in the frame 70 to press and make close
contact of the substrate 10 with the frame 70.
Hereinafter, a more preferred embodiment of a method for aligning
the substrate using the holding tray according to an embodiment of
the present invention will be described in detail with reference to
the accompanying drawings.
FIG. 16 is a schematic view showing a step of anchoring the tray in
the method for aligning the substrate using the holding tray
according to an embodiment of the present invention. FIG. 17 is a
schematic view showing a step of entering the substrate in the
method for aligning the substrate using the holding tray according
to an embodiment of the present invention. FIG. 18 is a schematic
view showing a step of handling the substrate in the method for
aligning the substrate using the holding tray according to an
embodiment of the present invention. FIG. 19 is a schematic view
showing a step of anchoring the substrate in the method for
aligning the substrate using the holding tray according to an
embodiment of the present invention. FIG. 20 is a schematic view
showing a step of aligning the substrate in the method for aligning
the substrate using the holding tray according to an embodiment of
the present invention. FIG. 21 is a schematic view showing a step
of holding the substrate in the method for aligning the substrate
using the holding tray for substrate according to an embodiment of
the present invention. FIGS. 22A and 22B are schematic views
showing steps of lifting and standing the tray in the method for
aligning the substrate using the holding tray for substrate
according to an embodiment of the present invention.
The method for aligning a substrate using the holding tray
according to the present invention includes steps of anchoring a
tray where the tray provided in the frame is anchored onto a tray
support means, providing a substrate where the substrate is placed
onto the tray, handling the substrate where the substrate placed
onto the tray is supported by a substrate handler, anchoring the
substrate where the substrate supported by the substrate handler is
anchored onto the tray, aligning the substrate where the substrate
is aligned by a substrate alignment means, holding the aligned
substrate where the aligned substrate is held on the tray by
holding means, standing the tray where the tray onto which the
substrate is anchored is stood by the tray support means, and
inputting the tray where the tray is delivered into a chamber.
First, the tray 60 provided with the frame 70 is anchored onto a
tray supporting means 410. The tray supporting means 410 is formed
to support the tray 60 in parallel, and the tray 60 is horizontally
anchored onto the tray supporting means 410. Then, a substrate 10
spaced apart by a robot arm 450 enters into the upper portion of
the tray 60 placed on the tray supporting means 410. When the
substrate 10 enters by the robot arm 450, the substrate handler 475
supports the substrate 10 by means of the through hole 75 formed on
the frame 70 of the tray 60. When the substrate 10 is supported by
the substrate handler 475, the robot arm 450 is completely
retracted from the position 11 on which the tray 60 is placed.
Therefore, the robot arm 450 is preferably formed and operated in a
manner that it does not interfere with the substrate handler 475 in
its operation.
When the substrate 10 is supported by the substrate handler 475,
being spaced apart from the robot arm 450, the substrate handler
475 is retracted through the through hole 475 formed on the frame
70. Accordingly, the substrate 10 is spaced apart by the substrate
handler 475, and is anchored onto the frame 70 of the tray 60.
Then, the substrate 10 anchored onto the frame 70 of the tray 60
undergoes the alignment step. The alignment step is carried out by
adjusting the substrate 10 in a manner that push pins 477 pass
through the tray 60 from the rear surface of the tray 60 via the
adjustment holes 77 formed on the frame 70, and then two edges of
the substrate 10 can be in contact with the reference pins 76. The
reference pins 76 are positioned in the nearest two edges of the
rectangular frame 70. Two adjustment holes 77 are formed in the
other two edges in which the reference pins 76 are not formed, and
the push pins 477 may adjust the position of the substrate 10 to
the reference pins 76 by means of the adjustment holes 77.
Instead of the reference pin 76 formed on the frame 70, the
reference hole 78 (FIG. 6B) may be also formed to conduct the
alignment step. At this time, a reference arm (not shown) is formed
through the rear surface of the tray 60 to provide a reference
position. Also, both of the reference pin 76 and the reference hole
78 may be formed at the same embodiment.
According to the aforementioned alignment step, the substrate 10 is
aligned on the frame 70 of the tray 60, and then the substrate 10
is held on the aligned position by means of the first and the third
holding means 110 and 130. When the holding means 110 and 130 are
input into the substrate 10 by means of the substrate clamp pusher
(not shown), the holding means 110 and 130 moves from the second
position, where the holding means does not interfere with the
substrate 10, to the first position, where the holding means are
set to elastically hold the substrate 10 (see FIG. 7). The holding
means 110 and 130 moved to the first position are aligned to hold
the substrate 10.
After the substrate 10 is aligned and held, the tray 60, where the
substrate 10 is horizontally mounted by the tray supporting means
410, is lifted from the tray supporting means 410, and is turned to
a vertical standing position, and then proceeds into the process
chamber (not shown).
As described above, high-precision alignment may be accomplished
and stable deposition process may be also conducted, because the
perpendicularly arranged substrate may be held and supported
according to the holding tray constructed according to the present
invention, the substrate alignment system using the same, and the
method thereof.
Although a few embodiments of the present invention have been shown
and described, it would be appreciated by those skilled in the art
that changes might be made in this embodiment without departing
from the principles and spirit of the invention, the scope of which
is defined in the claims and their equivalents.
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