U.S. patent number 7,965,500 [Application Number 12/204,579] was granted by the patent office on 2011-06-21 for system, method and apparatus for using overmolded dampeners to absorb shock and vibration.
This patent grant is currently assigned to Augmentix Corporation. Invention is credited to Brian Bruce, Ahmad Chamseddine.
United States Patent |
7,965,500 |
Bruce , et al. |
June 21, 2011 |
System, method and apparatus for using overmolded dampeners to
absorb shock and vibration
Abstract
A computer chassis has overmolded dampeners for absorbing shock
and vibration. Electronic components are hard mounted to points
inside the computer chassis. Overmolded dampeners are affixed to
corners, surfaces and sides of the laptop such that shock and
vibration are absorbed by the dampeners before the shock or
vibration can damage the electronic components. Affixing dampeners
to portions of the chassis may provide shock and vibration
protection with minimal weight.
Inventors: |
Bruce; Brian (Austin, TX),
Chamseddine; Ahmad (Round Rock, TX) |
Assignee: |
Augmentix Corporation (Austin,
TX)
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Family
ID: |
44147798 |
Appl.
No.: |
12/204,579 |
Filed: |
September 4, 2008 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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60967355 |
Sep 4, 2007 |
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Current U.S.
Class: |
361/679.34;
455/575.1; 361/679.55; 248/345.1; 220/732; 361/679.36;
361/679.35 |
Current CPC
Class: |
G06F
1/1656 (20130101) |
Current International
Class: |
H05K
7/00 (20060101); H05K 5/00 (20060101); B65D
1/40 (20060101); H04M 1/00 (20060101); A47B
95/00 (20060101) |
Field of
Search: |
;361/679.01-679.61
;321/223.1,223.2,331 ;206/305,320,523,576 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Hoffberg; Robert J
Assistant Examiner: Wu; Jerry
Attorney, Agent or Firm: Sprinkle IP Law Group
Parent Case Text
RELATED APPLICATIONS
This application claims priority under 35 U.S.C. .sctn.119(e) to
U.S. Provisional Patent Application No. 60/967,355, entitled
"System, Method and Apparatus for Using Overmolded Dampeners to
Absorb Shock and Vibration" by Bruce, et al., filed on Sep. 4,
2007, which is hereby fully incorporated by reference herein.
Claims
What is claimed is:
1. A method for protecting electronic components in a computer,
comprising: machining a plurality of chassis openings and a
plurality of lid openings in a computer chassis; injection molding
a material such that a first portion of the material covers a first
outer side surface of a first chassis corner, a second outer side
surface of the first chassis corner, and a third outer side surface
of the first chassis corner and wherein the first portion of the
material partially flows through a first set of the plurality of
chassis openings to form a first chassis corner dampener on the
first chassis corner; injection molding the material such that a
second portion of the material covers a first outer side surface of
a second chassis corner, a second outer side surface of the second
chassis corner, and a third outer side surface of the second
chassis corner and wherein the second portion of the material
partially flows through a second set of the plurality of chassis
openings to form a second chassis corner dampener on the second
chassis corner; injection molding the material such that a third
portion of the material covers a portion of a chassis bottom
surface and wherein the third portion of the material partially
flows through a third set of the plurality of chassis openings to
form a chassis bottom surface dampener on the chassis bottom
surface; and hard mounting the electronic components of the
computer to the computer chassis, wherein a size and a position of
one or more of the first chassis corner dampener, the second
chassis corner dampener and the chassis bottom surface dampener
prevents a force from being applied directly to the first chassis
corner, the second chassis corner or the chassis bottom surface,
and wherein each of the first chassis corner dampener, the second
chassis corner dampener and the chassis bottom surface dampener are
formed with an associated thickness that dampens the force applied
to the first chassis corner dampener, the second chassis corner
dampener or the chassis bottom surface dampener before the force
translates to the computer chassis; and wherein the force applied
to the first chassis corner dampener, the second chassis corner
dampener or the chassis bottom surface dampener is absorbed in,
distributed through, or transferred via the material to inhibit
propagation of the force to the computer chassis.
2. The method of claim 1, wherein the computer chassis comprises a
lid, wherein the method further comprises injection molding the
material such that a fourth portion of the material covers a first
outer side of a first lid corner, a second outer side of the first
lid corner, and a third outer side of the first lid corner and
wherein the fourth portion of the material partially flows through
a first set of the plurality of lid openings to form a first lid
corner dampener on the first lid corner, wherein the first chassis
corner dampener and the first lid corner dampener are proximate
each other when the lid is closed to protect the first chassis
corner, wherein the first lid corner dampener and the first chassis
corner dampener absorb the force applied to the first chassis
corner.
3. The method of claim 1, further comprising injection molding the
material such that a fourth portion of the material covers a first
outer side surface of a third chassis corner, a second outer side
surface of the third chassis corner, and a third outer side surface
of the third chassis corner and wherein the fourth portion of the
material partially flows through a fourth set of the plurality of
chassis openings to form a third chassis corner dampener on the
third chassis corner; and injection molding the material such that
a fifth portion of the material covers a first outer side surface
of a fourth chassis corner, a second outer side surface of the
fourth chassis corner, and a third outer side surface of the fourth
chassis corner and wherein the fifth portion of the material
partially flows through a fifth set of the plurality of chassis
openings to form a fourth chassis corner dampener on the fourth
chassis corner; wherein the first chassis corner dampener, the
second chassis corner dampener, the third chassis corner dampener
and the fourth chassis corner dampener dampen the force applied to
the chassis bottom surface.
4. The method of claim 1, further comprising attaching a door over
a port on the first outer side surface of the first chassis corner,
wherein the size and position of one or more of the first chassis
corner dampener, the second chassis corner dampener and the door
absorb the force applied to the first outer side surface of the
first chassis corner.
5. The method of claim 1, wherein the material is selected to bond
with the computer chassis during the injection molding process.
6. The method of claim 5, the material comprises an elastomer.
7. A shock-dampened computer chassis, comprising: an inside
comprising points for hard mounting electronic components; an
outside comprising: a top surface having a plurality of top surface
openings machined therein; a bottom surface opposite the top
surface having a plurality of bottom surface openings machined
therein; and four side surfaces adjacent to the top surface and the
bottom surface wherein each side surface of the four side surfaces
has a plurality of chassis side surface openings machined therein,
wherein a first chassis side surface of the four chassis side
surfaces joins a second chassis side surface of the four chassis
side surfaces to form a first edge, the first chassis side surface
of the four chassis side surfaces and the top surface join to form
a second edge, and the second chassis side surface of the four
chassis side surfaces and the top surface join to form a third
edge, wherein the first edge, the second edge, and the third edge
join to form a first chassis corner; and a plurality of dampeners,
comprising: a top surface dampener, wherein a first portion of a
material is injection molded into a set of the plurality of top
surface openings to form the top surface dampener; a bottom surface
dampener separate from the top surface dampener, wherein a second
portion of the material is injection molded into a set of the
plurality of bottom surface openings to form the bottom surface
dampener; and a first chassis corner dampener, wherein a third
portion of the material is injection molded into a first one or
more chassis side surface openings from the plurality of chassis
side surface openings, a second one or more chassis side surface
openings from the plurality of chassis side surface openings, and a
first one or more of the plurality of top surface openings and the
plurality of bottom surface openings to form the first chassis
corner dampener; and a second chassis corner dampener, wherein a
fourth portion of the material is injection molded into a third one
or more chassis side surface openings from the plurality of first
chassis side surface openings, a fourth one or more chassis side
surface openings from the plurality of chassis side surface
openings, and a second one or more of the plurality of top surface
openings and the plurality of bottom surface openings to form the
second chassis corner dampener, wherein a size and a position of
one or more of the top surface dampener, the bottom surface
dampener, the first chassis corner dampener, and the second chassis
corner dampener prevents a force from being applied directly to the
first chassis corner, the second chassis corner or the first
chassis side surface of the computer chassis, and wherein each of
the top surface dampener, the bottom surface dampener, the first
chassis corner dampener, and the second chassis corner dampener is
formed with an associated thickness, wherein the force applied to
one or more of the top surface dampener, the bottom surface
dampener, the first chassis corner dampener, and the second chassis
corner dampener is dampened before the force translates to the
computer chassis.
8. The shock-dampened computer chassis of claim 7, wherein
injection molding one or more of the top surface dampener, the
bottom surface dampener, the first chassis corner dampener, and the
second chassis corner dampener further thermally affixes a portion
of the one or more of the top surface dampener, the bottom surface
dampener, the first chassis corner dampener, and the second chassis
corner dampener to the computer chassis.
9. The shock-dampened computer chassis of claim 8, wherein one or
more of the top surface dampener, the bottom surface dampener, the
first chassis corner dampener, and the second chassis corner
dampener are heat stacked to the computer chassis.
10. The shock-dampened computer chassis of claim 7, wherein
injection molding at least one of the first portion of the
material, the second portion of the material, the third portion of
the material and the fourth portion of the material to form one or
more of the top surface dampener, the bottom surface dampener, the
first chassis corner dampener, and the second chassis corner
dampener mechanically affixes a portion of the one or more of the
top surface dampener, the bottom surface dampener, the first
chassis corner dampener, and the second chassis corner dampener to
the computer chassis.
11. The shock-dampened computer chassis of claim 7, wherein the
computer chassis is a laptop computer chassis having a chassis and
a lid, further comprising: a third chassis corner dampener, wherein
a fifth portion of the material is injection molded into a fifth
one or more chassis side surface openings from the plurality of
second chassis side surface openings and a sixth one or more
chassis side surface openings from the plurality of fourth chassis
side surface openings, and a sixth portion of the material is
injection molded into a set of the plurality of top surface
openings, wherein, when the lid of the computer chassis is in a
closed position, the fifth portion of the material and the sixth
portion of the material are proximate each other to form the third
chassis corner dampener.
12. The shock-dampened computer chassis of claim 11, wherein the
material comprises an elastomer.
13. A system for protecting components in a laptop computer
chassis, comprising: a computer chassis having a plurality of
chassis openings machined therein; a lid having a plurality of lid
openings machined therein; and a plurality of dampeners, wherein
each dampener in the plurality of dampeners is formed by injection
molding at least a portion of a material into a set of the
plurality of chassis openings or the plurality of lid openings,
wherein the plurality of dampeners comprises: a top surface
dampener formed by injection molding a first portion of the
material into a first one or more lid openings in the plurality of
lid openings; a bottom surface dampener separate from the top
surface dampener formed by injection molding a second portion of
the material into a first one or more openings in the plurality of
chassis openings in a bottom surface; and a first chassis corner
dampener formed by injection molding a third portion of the
material into a first one or more chassis side surface openings in
the plurality of chassis openings in a first chassis side surface
and a second one or more chassis side surface openings in the
plurality of chassis openings in a second chassis side surface, and
injection molding a fourth portion of the material into a second
one or more lid openings in the plurality of lid openings, wherein
when the lid is closed, the third portion of the material and the
fourth portion of the material form the first chassis corner
dampener; a second chassis corner dampener formed by injection
molding a fifth portion of the material into a third one or more
lid openings in the plurality of lid openings and injection molding
a sixth portion of the material into a third one or more chassis
side surface openings in the plurality of chassis openings in the
first chassis side surface and a fourth one or more chassis side
surface openings in the plurality of chassis openings in a third
chassis side surface, wherein when the lid is closed, the fifth
portion of the material and the sixth portion of the material form
the second chassis corner dampener; and a set of points for hard
mounting electronic components in the computer chassis, wherein the
first chassis corner dampener and the second chassis corner
dampener are separate, wherein a size and a position of the top
surface dampener, the bottom surface dampener, the first chassis
corner dampener and the second chassis corner dampener prevent a
force from being applied directly to the first chassis corner, the
second chassis corner, the first chassis side surface or the second
chassis side surface, and wherein each of the top surface dampener,
the bottom surface dampener, the first corner dampener and the
second corner dampener are formed from the material with an
associated thickness that dampens the force before the force
translates to the computer chassis, wherein the material comprises
an elastomer.
14. The system of claim 13, further comprising one or more of:
injection molding a seventh portion of the material into a fifth
one or more chassis side surface openings in the plurality of
chassis openings in the first chassis side surface to form a first
chassis side surface dampener, injection molding an eighth portion
of the material into a sixth one or more chassis side surface
openings in the plurality of chassis openings on a fourth chassis
side surface, a ninth portion of the material into an seventh one
or more chassis side surface openings in the plurality of chassis
openings on the third chassis side surface, and a eighth one or
more openings in the plurality of chassis openings on the bottom
surface to form a third corner dampener, wherein the third chassis
corner dampener comprises at least one of a port access opening and
a media storage device access opening.
Description
TECHNICAL FIELD OF THE DISCLOSURE
The present disclosure generally relates to mobile computers and
other portable or handheld devices and in particular to using
overmolded dampeners to dampen shock and vibration.
BACKGROUND OF THE DISCLOSURE
Modern handhelds and mobile computers are used in harsh or extreme
environments and may be exposed to shock and vibration from contact
with other objects or by accidental drops.
SUMMARY OF THE DISCLOSURE
Embodiments of a computer may have overmolded dampeners to absorb
shock and vibration.
One embodiment of a method for dampening a mobile computer may
include hard mounting components to the computer chassis and
affixing dampeners to the identified areas of the chassis. Some
embodiments may include the steps of determining the dampening
requirements for the computer and identifying areas of the computer
on which dampening material may be affixed. The step of determining
the dampening requirements of the computer may also involve
identifying the maximum shock or vibration that a critical
component may withstand before failure.
Other objects and advantages of the embodiments disclosed herein
will be better appreciated and understood when considered in
conjunction with the following description and the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
A more complete understanding of the present disclosure and the
advantages thereof may be acquired by referring to the following
description, taken in conjunction with the accompanying drawings in
which like reference numbers indicate like features and
wherein:
FIGS. 1A-1C depict perspective views of one embodiment of a laptop
computer with one embodiment of a system for dampening shock and
vibration;
FIG. 2 depicts a perspective view of one embodiment of a portion of
a system for dampening shock or vibration to a computer;
FIG. 3 depicts an exploded view of one embodiment of a portion of a
system for dampening shock or vibration associated with a top
surface;
FIG. 4 depicts an exploded view of a base chassis of a computer and
corner dampeners;
FIGS. 5A and 5B depict perspective views of one embodiment of a
door; and
FIGS. 6A and 6B depict perspective views of one embodiment of a
door.
DETAILED DESCRIPTION
The inventive system, method and apparatus for using overmolded
dampeners to absorb shock and vibration and the various features
and advantageous details thereof are explained more fully with
reference to the non-limiting embodiments detailed in the following
description. Descriptions of well known starting materials,
manufacturing techniques, components and equipment are omitted so
as not to unnecessarily obscure the disclosure in detail. Skilled
artisans should understand, however, that the detailed description
and the specific examples, while disclosing preferred embodiments
of the disclosure, are given by way of illustration only and not by
way of limitation. Various substitutions, modifications, and
additions within the scope of the underlying inventive concept(s)
will become apparent to those skilled in the art after reading this
disclosure. Skilled artisans can also appreciate that the drawings
disclosed herein are not necessarily drawn to scale.
As used herein, the terms "comprises," "comprising," "includes,"
"including," "has," "having" or any other variation thereof, are
intended to cover a non-exclusive inclusion. For example, a
process, product, article, or apparatus that comprises a list of
elements is not necessarily limited to only those elements, but may
include other elements not expressly listed or inherent to such
process, article, or apparatus. Further, unless expressly stated to
the contrary, "or" refers to an inclusive "or" and not to an
exclusive "or". For example, a condition A or B is satisfied by any
one of the following: A is true (or present) and B is false (or not
present), A is false (or not present) and B is true (or present),
and both A and B are true (or present).
Additionally, any examples or illustrations given herein are not to
be regarded in any way as restrictions on, limits to, or express
definitions of, any term or terms with which they are utilized.
Instead, these examples or illustrations are to be regarded as
being described with respect to a particular embodiment and as
illustrative only. Those of ordinary skill in the art will
appreciate that any term or terms with which these examples or
illustrations are utilized encompass other embodiments as well as
implementations and adaptations thereof which may or may not be
given therewith or elsewhere in the specification and all such
embodiments are intended to be included within the scope of that
term or terms. Language designating such non-limiting examples and
illustrations includes, but is not limited to: "for example," "for
instance," "e.g.," "in one embodiment," and the like.
Embodiments described herein may be useful for constructing a
rugged computer that can withstand harsh and extreme conditions.
Computers, particularly laptop computers, are used by the military,
commercial and individuals in situations in which the computer may
be dropped, may encounter vibration for periods of time, may be
exposed to rain, dust, salt water environments or high humidity
environments, and the like.
In a system for dampening shock and vibration, electronic
components such as a motherboard, a hard drive, an optical disk
drive, and the like, which are traditionally dampened individually,
may be hard mounted to the base chassis for a laptop computer.
Individually dampening each electronic component increases the
complexity of dampening the computer. For example, individually
dampening each component raises the possibility that a resonance
vibration from nearby components may damage an electronic
component. Thus, individually dampened components may still be
damaged by shock or vibration.
Embodiments disclosed herein may include dampeners positioned
relative to corners, edges or surfaces of a laptop to dampen shock
and vibration before it reaches the base chassis, such that the
electronic components are protected from shock and vibration. As
used herein, the term dampener may refer to any material affixed to
the base chassis for dampening shock or vibration. Dampeners may be
affixed to various areas on the chassis. A dampener affixed on a
corner may be referred to as a corner dampener. Similarly, a
dampener affixed to a side of the chassis may be referred to as a
side dampener, a dampener affixed to an edge may be referred to as
an edge dampener, a dampener affixed to a surface may be referred
to as a surface dampener, and the like. When discussing the
dampeners generally, no reference identifiers are used in this
disclosure. When referring to a type of dampener, a numeric
identifier may be used (e.g. corner dampener 237). When referring
to a particular dampener, an alphanumeric identifier may be used
(e.g. corner dampener 237a affixed to front right corner of
laptop).
Dampening a mobile computer or handheld with a system of dampeners
may include a first step of hard mounting all electronic components
to a base chassis. After hard mounting the components, the
dampening requirements for the computer as a whole may be
determined. In some embodiments, determining the dampening
requirements for a computer may involve identifying the value of a
shock or vibration that, when applied to the chassis, causes
failure of the component. For example, the dampening requirement
for a laptop computer may be the maximum force that can be applied
to the base chassis before the motherboard cracks, the hard drive
fails, or the display fails. Identifying the value of a shock may
include reviewing data provided by a manufacturer,
computer-simulated analyses, or empirically testing the device
(e.g., performing a drop test). MIL-STD 810F describes performance
standards for one type of drop test, and there may be other
standards as well. After identifying a shock that could damage the
computer or otherwise render it unavailable for use, areas on the
chassis may be identified for positioning of a system to dampen the
shock. Identifying the areas may include identifying access doors,
vents, ports, or other openings over which a dampener should not be
positioned. U.S. patent application Ser. No. 12/204,586 entitled
"System, Method and Apparatus for Battery Cooling and Protection,"
which is hereby incorporated by reference, describes one example of
a door over which positioning a dampener may not be desirable. U.S.
patent application Ser. No. 12/204,160 entitled "System, Apparatus
and Method for Cooling Electronic Components" describes one example
of a vent over which positioning a dampener may not be desirable.
Identifying areas may include identifying corners, edges and
surfaces for which it is desirable to dampen a shock. In some
situations, weight of the mobile computer or handheld may be an
issue. In theses situations, identifying areas for which it is
desirable to position the system may include ensuring the total
weight of the computer and the affixed system for dampening shock
and vibration does not exceed a desired amount. Thus, although it
may be desirable to affix dampeners to the entire chassis, the
weight of the computer and dampeners may be such that affixing
dampeners to the computer chassis may require affixing dampeners to
a portion of the chassis. For example, it may be desirable to
provide a laptop computer for use in extreme conditions, but that
still weighs less than 9 pounds. If the other computer components
weigh 8.5 pounds, a system for dampening the computer must weigh
less than 8 ounces but still protect the electronic components
inside the chassis.
After areas are identified, dampeners may be affixed to the
chassis. Affixing the system to the chassis may involve chemically,
mechanically or thermally affixing a material to the areas
identified for positioning. Affixing the system to the chassis may
involve overmolding a material to the areas identified for
positioning. Overmolding is an injection molding process wherein a
chassis is positioned in an injection molding machine and a
material is injected into the machine to form a dampener onto the
chassis. If properly selected, the overmolded material will form a
strong bond with the chassis that is maintained in the end-use
environment. The use of primers or adhesives may not required to
achieve an optimum bond between the overmolded material and the
chassis.
Once the material is affixed to desired areas, computer simulation
or empirical testing may be used to ensure the dampening system is
adequately protecting electronic components in the chassis from
shock and vibration.
A laptop computer may have a system of dampeners affixed to areas
of the chassis to absorb shock and vibration that could damage
components in the chassis. FIGS. 1A-1C depict perspective views of
one embodiment of laptop computer 10 with one embodiment of system
100 having a plurality of dampeners for dampening shock and
vibration. Laptop computer 10, which may include base chassis 20,
handle 22, vent 28, I/O door 26, battery access door 57 and
electronic components (not shown). DELL Computers, of Round Rock,
Tex. is one example of a vendor of laptops 10. Those skilled in the
art will appreciate that laptop computer 10 may have other ports,
openings, outlets and vents than those depicted in FIGS. 1A-1C and
may have components located on different sides, or components may
be a different size, or the like, depending on the vendor.
Dampeners may be formed from dampening material affixed to various
areas including surfaces, edges or corners of computer 10. As
depicted in FIGS. 1A-1C, a portion of one embodiment of system 100
for dampening shock and vibration to components may include corner
dampeners 237, side dampeners 238, dampening regions 239, and
surface dampeners 240 and 250. Thus, for computer laptop 10 such as
depicted in FIGS. 1A-1C, corner dampeners 237, side dampeners 238,
dampening regions 239, and surface dampeners 240 and 250 may be
affixed to areas of computer 10 to dampen shock based on a value
before which a critical component fails. System 100 for dampening
shock or vibration to computer 10 may include corner dampener 237a
(such as shown in FIG. 1A) affixed to the corner formed by the
intersection of side 11 and side 12 to protect computer 10 from
shock or vibration associated with impacting computer 10 on the
front right corner (e.g., a corner drop). Similarly, system 100 may
include corner dampener 237b (such as shown in FIG. 1A) affixed to
the corner formed by the intersection of side 11 and side 14
(opposite side 12) to protect computer 10 from shock or vibration
associated with impacting computer 10 on the back right corner,
corner dampener 237c (such as shown in FIG. 1A) affixed to the
corner formed by the intersection of side 12 and side 13 (opposite
side 11) to protect computer 10 from shock or vibration associated
with impacting computer 10 on the front left corner, corner
dampener 237d (such as shown in FIG. 1B) affixed to the corner
formed by the intersection of side 13 and side 14 to protect
computer 10 from shock or vibration associated with impacting
computer 10 on the back left corner, and similarly corner dampeners
237e-h. For purposes of this disclosure, a corner dampener on the
lid of the laptop may be formed from two dampeners proximate each
other. That is, dampener 237a and dampener 237e may form a corner
dampener when the laptop is closed dampeners 237c and 237f may form
a corner dampener when the laptop is closed, dampeners 237d and
237h may form a corner dampener when the laptop is closed, and
dampeners 237b and 237q may form a corner dampener when the laptop
is closed.
In some embodiments, dampeners may dampen shock and vibration
applied to an edge of computer 10. Side dampeners 238 may be
affixed to the edges of computer 10 to dampen shock and vibration.
For example, FIG. 1C depicts side dampener 238a affixed to computer
10 on side 12 and side dampener 238b affixed to computer 10 on side
14.
In some embodiments, dampeners may dampen shock and vibration
applied to a surface of computer 10. Surface dampeners 240 and 250
may dampen shock and vibration directed to a surface. For example,
FIG. 1C shows surface dampeners 250 affixed to computer 10 to
dampen shock and vibration directed at surfaces 16.
Dampeners may collectively dampen shock and vibrations to a side or
surface of computer 10. For example, corner dampener 237a and
corner dampener 237b may dampen shock applied to side 11 of
computer 10.
In some embodiments, areas identified for placement of dampening
material may accommodate other features of laptop 10. For example,
corner dampeners 237a and 237c may have a portion disposed between
handle 22 and base chassis 20.
Identifying areas for placement of dampening material or system 100
may include identifying areas over which no dampening material may
be placed. For example, FIG. 1B depicts an alternate perspective
view of the embodiment depicted in FIG. 1A, with laptop 10
including vent 28 for cooling internal components of laptop 10, I/O
port 30, power port 32 and communication port 33. Identifying an
area for a dampener may include determining that vent 28 cannot be
covered and thus corner dampener 237d must be configured to not
impede air flow into or out of vent 28. U.S. patent application
Ser. No. 12/204,160 entitled "System, Apparatus and Method for
Cooling Electronic Componets," which is hereby incorporated by
reference, describes one example of vent 28.
FIG. 1C depicts an alternate perspective view of the embodiment
depicted in FIG. 1A. FIG. 1C shows dampener assembly 130 including
corner dampeners 237a-h, side dampeners 238a-b and dampening
regions 239a-b affixed to top surface 40 and surface dampeners 250
affixed to bottom surface 16.
Bottom surface 16 may include battery access door 57, vent 28, and
other doors or access plates that limit the amount of space on
which a dampener may be mounted. In some embodiments, one or more
of corner dampeners 237, side dampeners 238, dampening regions 239,
and surface dampeners 250 may collectively absorb a shock or
vibration applied to bottom surface 16. For example, if computer 10
is dropped onto a flat surface, surface dampeners 250 may absorb a
portion of the shock or vibration, and may further compress such
that corner dampeners 237 or other dampeners 238 or 239 may absorb
a portion of the shock or vibration. Dampeners 250 may also be
referred to as "feet."
One or more dampeners 237, 238, 239, 240 or 250 may absorb a shock
or vibration applied to computer 10. The material from which
dampeners of system 100 are manufactured may absorb a portion of
the shock or vibration, may distribute a portion of the shock or
vibration over a larger area, or may transfer the shock or
vibration into another plane or direction such that components hard
mounted in base chassis 20 are not exposed to the full shock or
vibration. For example, computer 10 may have system 100 such that,
if computer 10 is dropped on bottom surface 16, a portion of the
shock is absorbed by feet 250, a portion is absorbed by corner
dampeners 237, and a portion is distributed to side dampeners 238
and dampening regions 239.
FIG. 2 depicts a perspective view of one embodiment of a portion of
system 100 for dampening shock or vibration to computer 10. Corner
dampeners 237e-h, side dampeners 238a-b and dampening regions
239a-b may be combined into surface dampener 240 to form a portion
of system 100 for dampening shock and vibration associated with top
surface 40 of laptop computer 10.
Embodiments of dampeners may dampen shock and vibration applied
directly thereto. Thus, for example, if computer 10 is dropped on
corner dampener 237, corner dampener 237 may dampen the shock or
vibration associated with the drop. Combinations of dampeners 237,
238, 239, 240 and 250 may collectively dampen shock or vibration
applied to computer 10. So, for example, if computer 10 is dropped
on an edge, corner dampeners 237 and side dampeners 238 may
collectively dampen the shock or vibration associated with the
drop. As another example, if an object is dropped on top surface 40
of computer 10, corner dampeners 237, side dampeners 238, dampening
regions 239 and surface dampeners 240 and 250 forming system 100
may collectively dampen the shock or vibration associated with the
object contacting top surface 40.
Affixing dampeners to computer 10 may involve overmolding the
dampening material to chassis 20. FIG. 3A depicts an exploded view
of one embodiment of a portion of system 100 for dampening shock or
vibration associated with top surface 40. In some embodiments, top
surface 40 of laptop computer 10 may be manufactured or machined
and include openings 120 at various locations. Top surface 40 of
laptop computer 10 may also include cutouts 24 located along the
edges of top surface 40.
In some embodiments, top surface 40 having openings 120 and cutouts
24 may be over-molded with material such that a portion of the
material enters openings 120 and cutouts 24. As a result of the
over-molding process, surface dampener 240 formed from the
overmolding process may be affixed to top surface 40.
Overmolding may provide other advantages as well. For example, the
use of overmolding eliminates the need for screws or other
fasteners to hold dampeners to computer 10. Reducing the number of
screws may result in a lower overall weight of laptop 10, a
reduction in the number of steps for assembling laptop 10, a
reduction in manufacturing costs or reduce the likelihood of
material failure near a fastener.
FIG. 4 depicts an exploded view of base chassis 20 and corner
dampeners 237. Base chassis 20 may include openings 120 or cutouts
24 to allow a material to be over-molded to base chassis 20. Base
chassis 20 may have openings 120 and cutouts 24 formed therein.
Base chassis 20 may then be inserted into an injection molding
machine. A material may be injected into a mold such that the
material flows through openings 120 and cutouts 24. Once the
material is allowed to cool, the material may form dampeners. In
one embodiment, the material used to form dampeners is
Invision.RTM.. Invision is a product of Invision, Sharon Creek,
Ohio.
In some situations, sides 11, 12, 13 and 14 may not be continuous
surfaces, and dampeners for a side or a corner may not be
continuous. For example, side 11 includes an opening for access to
one type of media storage device, side 14 includes a vent and side
13 includes a communication port. In some embodiments, the design
or shape of a dampener may be affected by the presence of openings,
ports, vents, or the like. In some embodiments, a door may be
desired for protecting an I/O port, an opening for memory storage
device (such as a DVD player), a communication port, a USB port, or
some other feature of computer 10. To prevent shock and vibration
from reaching base chassis through exposed ports, slots or the
like, doors that dampen shock and vibration may be used.
FIGS. 5A and 5B depict perspective views of one embodiment of door
207, which may be useful for covering a USB port. Door 207 may
include openings 349 for screws or other mechanical fasteners for
securing door 207 to computer 10. Door 207 may further include
living hinge 210, door pull 208 or lock 209. In some embodiments,
living hinge 210 may be aligned such that door 207 opens in a
vertical plane. Door 207 may dampen all or a portion of a shock or
vibration applied to door 207. Door 207 may be manufactured from
the same material used to manufacture other components of system
100, such as dampeners. In some embodiments, door 207 may be
affixed to base chassis 20. In some embodiments, door 207 may be
affixed to a dampener.
FIGS. 6A and 6B depict perspective views of one embodiment of door
258, which may be useful for covering a RJ45 communication port.
Door 258 may be similar to door 207. In some embodiments, door 258
may include living hinge 210, openings 349 for screws or other
mechanical fasteners for securing door 258 to base chassis 20, door
pull 208 and latch 209. In some embodiments, living hinge 210 may
be aligned such that door 258 opens in a vertical plane. Door 258
may dampen all or a portion of a shock or vibration applied to door
258. Door 258 may be manufactured from the same material used to
manufacture dampeners of system 100. In some embodiments, door 258
may be affixed to base chassis 20. In some embodiments, door 258
may be affixed to corner dampeners 237.
Further modifications and alternative embodiments of various
aspects of the invention will be apparent to those skilled in the
art in view of this description. Accordingly, this description is
to be construed as illustrative only and is for the purpose of
teaching those skilled in the art the general manner of carrying
out the invention. It is to be understood that the forms of the
invention shown and described herein are to be taken as the
presently preferred embodiments. Elements and materials may be
substituted for those illustrated and described herein, parts and
processes may be reversed, and certain features of the invention
may be utilized independently, all as would be apparent to one
skilled in the art after having the benefit of this description of
the invention. Changes may be made in the elements described herein
without departing from the spirit and scope of the invention as
described in the following claims.
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