U.S. patent number 7,021,995 [Application Number 11/075,749] was granted by the patent office on 2006-04-04 for cmp pad conditioner having working surface inclined in radially outer portion.
This patent grant is currently assigned to Noritake Co., Limited, Noritake Super Abrasive Co., Ltd.. Invention is credited to Yasuaki Inoue, Naoki Toge.
United States Patent |
7,021,995 |
Toge , et al. |
April 4, 2006 |
CMP pad conditioner having working surface inclined in radially
outer portion
Abstract
A CMP pad conditioner including: (a) a disk-shaped substrate
having a working surface which is provided by one of its axially
opposite end surfaces and which is to be brought into contact with
the CMP pad; and (b) abrasive grains which are fixed to the working
surface. The substrate includes a radially inner portion and a
radially outer portion which is located radially outwardly of the
radially inner portion. The working surface in the radially outer
portion is inclined with respect to the working surface in the
radially inner portion, such that a thickness of the radially outer
portion as measured in an axial direction of the substrate is
reduced as viewed in a direction away from an axis of the substrate
toward a periphery of the substrate. A ratio of an outside diameter
of the radially inner portion to an outside diameter of the
substrate is 60 85%.
Inventors: |
Toge; Naoki (Kurume,
JP), Inoue; Yasuaki (Kurume, JP) |
Assignee: |
Noritake Co., Limited (Nagoya,
JP)
Noritake Super Abrasive Co., Ltd. (Kurume,
JP)
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Family
ID: |
34990642 |
Appl.
No.: |
11/075,749 |
Filed: |
March 10, 2005 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20050215188 A1 |
Sep 29, 2005 |
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Foreign Application Priority Data
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Mar 16, 2004 [JP] |
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2004-074671 |
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Current U.S.
Class: |
451/56; 451/443;
451/527; 451/548 |
Current CPC
Class: |
B24B
53/017 (20130101); B24B 53/12 (20130101) |
Current International
Class: |
B24B
1/00 (20060101) |
Field of
Search: |
;451/56,443,444,548,359,526,527,530,533 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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315859 |
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May 1989 |
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DE |
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05023956 |
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Feb 1993 |
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JP |
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A 2001-113456 |
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Apr 2001 |
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JP |
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A 2001-287150 |
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Oct 2001 |
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JP |
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Primary Examiner: Morgan; Eileen P.
Attorney, Agent or Firm: Oliff & Berridge, PLC
Claims
What is claimed is:
1. A conditioner for conditioning a CMP pad, comprising: a
disk-shaped substrate having a working surface which is provided by
one of axially opposite end surfaces thereof and which is to be
brought into contact with the CMP pad; and abrasive grains which
are fixed to said working surface, wherein said substrate includes
a radially inner portion and a radially outer portion which is
located radially outwardly of said radially inner portion, wherein
said working surface of said radially outer portion is inclined
with respect to said working surface of said radially inner
portion, such that a thickness of said radially outer portion as
measured in an axial direction of said substrate is reduced as
viewed in a direction away from an axis of said substrate toward a
periphery of said substrate, and wherein a ratio of an outside
diameter of said radially inner portion to an outside diameter of
said substrate ranges between 60 85%.
2. The conditioner according to claim 1, wherein said abrasive gram
are arranged in a predetermined pattern, and cooperate with each
other to constitute an abrasive monolayer, and wherein said
abrasive grains are bonded to said working surface of said
disk-shaped substrate through a braze material including an active
metal.
3. The conditioner according to claim 2, wherein said disk-shaped
substrate is provided as an annular body, and wherein a ratio of an
inside diameter of said radially inner portion to said outside
diameter of said substrate is not larger than 45%.
4. The conditioner according to claim 1, wherein said working
surface of said radially inner portion is parallel with a plane
perpendicular to said axial direction of said disk-shaped
substrate, such that a thickness of said radially inner portion as
measured in said axial direction is substantially constant.
5. The conditioner according to claim 4, wherein said thickness of
said radially inner portion of said disk-shaped substrate is larger
than a thickness of a radially outer end of said disk-shaped
substrate as measured in said axial direction, by a predetermined
difference amount, and wherein a ratio of said predetermined
difference amount to an average size of said abrasive grains ranges
between 70 150%.
6. The conditioner according to claim 1, wherein said disk-shaped
substrate further includes a radially intermediate portion which is
interposed between said radially inner and outer portions in a
radial direction of said disk-shaped substrate, and wherein said
working surface of said radially intermediate portion is provided
with a first curved surface which has a radius of curvature of at
least 1 mm as measured in an axial cross section of said
disk-shaped substrate.
7. The conditioner according to claim 6, wherein said working
surface of said radially outer portion of said disk-shaped
substrate is provided with a second curved surface which has a
radius of curvature that is larger than said radius of curvature of
said first curved surface.
8. The conditioner according to claim 7, wherein said radius of
curvature of said second curved surface of said radially outer
portion is larger than said outside diameter of said disk-shaped
substrate.
9. The conditioner according to claim 1, wherein said abrasive
grains fixed to said working surface of said disk-shaped substrate
cooperate with each other to constitute an abrasive layer, and
wherein said abrasive layer is divided into a plurality of segments
by a plurality of grooves which are formed to extend along said
working surface.
10. The conditioner according to claim 9, wherein said plurality of
grooves includes first grooves each of which extends substantially
in a circumferential direction of said disk-shaped substrate, and
second grooves each of which extends in a direction away from said
axis of said substrate toward said periphery of said substrate.
11. The conditioner according to claim 10, wherein said conditioner
being rotated about said axis in a predetermined rotating direction
for conditioning the CMP pad, and wherein each of said second
grooves is inclined with respect to a radial direction of said
disk-shaped substrate, such that a radially outer end of each said
second grooves is positioned on a rear side of a radially inner end
of said each of said second grooves as viewed in said rotating
direction.
12. The conditioner according to claim 11, wherein each of said
second grooves is curved such that a degree of inclination thereof
with respect to said radial direction is gradually increased as
viewed in said direction away from said axis of said disk-shaped
substrate toward said periphery of said substrate.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention to a CMP pad conditioner which is used for
smoothing and planarizing a surface of a workpiece such as silicon
wafer in a CMP apparatus.
2. Discussion of the Related Art
In recent years, as a process of smoothing and planarizing a
surface of a silicon wafer or the like, there is commonly practiced
a chemical mechanical polishing (herein after referred to as "CMP")
process.
FIG. 3 shows a conventional CMP apparatus 51 including: a rotary
table 53 which is to be rotated about its axis by a drive shaft 52;
an polishing unit 54 which is disposed above the rotary table 53; a
conditioning unit 55 which is disposed above the rotary table 53;
and a polishing pad 56 which is formed on an upper surface of the
rotary table 53.
The polishing unit 54 includes a polishing spindle head 57 and a
disk-shaped wafer carrier 58 having a lower surface to which a
wafer 59 as a workpiece is to be fixed. In this example illustrated
in FIG. 3, the wafer 59 is sucked by the wafer carrier 58. The
sucked wafer 59 can be rotated together with the wafer carrier 58,
about an axis of the disk-shaped wafer carrier 58 by the polishing
spindle head 57. The conditioning unit 55 includes a conditioning
spindle head 60 and a conditioning disk 61 which can be rotated
about its axis by the conditioning spindle head 60.
The CMP apparatus 51 further includes a slurry supplier 62 provided
to supply an abrasive slurry 63 onto the polishing pad 56. In a
polishing operation, the supplied slurry 63 is caught between the
wafer 59 and the polishing pad 56 which are held in contact with
each other. With the wafer 59 being held contact at its surface
with an upper surface of the polishing pad 56 which is disposed on
the upper surface of the rotary table 53, the contact surface of
the wafer 59 is ground or polished by the slurry 63.
On a radially outer portion of a lower surface of the conditioning
disk 61, there are fixed abrasive grains such as diamond grains.
The abrasive grains fixed to the lower surface of the conditioning
disk 61 are rubbed against the surface of the polishing pad 56, for
dressing and truing the surface of the polishing pad 56. Thus, the
surface of the polishing pad 56 is prevented from becoming
compacted, and is kept suitably roughened so as to maintain its
abrasive performance.
FIGS. 4A and 4B shows a conventional conditioning disk, which is
principally constituted by a disk-shaped metal substrate 71 and
abrasive grains 73. The metal substrate 71 includes an annular
portion 72 provided by its radially outer portion. The annular
portion 72 is made to protrude in an axial direction of the
substrate 71, and is given a flat end surface. The abrasive grains
73 are disposed on the flat end surface of the annular portion 72,
and arranged in a predetermined pattern. However, when this
conventional conditioning disk is used for conditioning a polishing
pad having an elasticity, the conditioning disk suffers from a
problem that ones of the abrasive grains 73 located at a peripheral
part of the annular portion 72 tends to be easily worn, since a
large load acts on the ones of the abrasive grains 73 located at
the peripheral part. In the worst case, the abrasive grains 73 at
the peripheral part could be fractured or removed from the
substrate 71. If the abrasive grains 73 at the peripheral part were
worn out, the polishing pad no longer could be satisfactorily
dressed and trued. That is, it would be impossible to sufficiently
clean the pad surface and remove high spots on the pad surface. In
other words, the conditioning disk could no longer serve as a
conditioner. Further, if the abrasive grains 73 were fractured or
removed from the substrate 71, the fractured or removed grains left
on the pad surface could cause the workpiece to be scratched, so
that the polishing operation would have to be suspended.
JP-A-2001-113456 and JP-A-2001-287150 (publications of unexamined
Japanese Patent Applications laid open in 2001) discloses CMP pad
conditioners having respective arrangements designed for solving
the above-described problems. In either of the conditioners
disclosed by the two Japanese publications, the disk-shaped
substrate is provided by an annular body, and has a working surface
which is provided by one of its axially opposite end surfaces. The
working surface is entirely or partially defined by a part of a
spherical surface, so as to be convexly curved. That is, the
working surface is entirely or partially provided by a convexly
curved surface having a predetermined radius of curvature as
measured in an axial cross section of the disk-shaped substrate.
Since the working surface is entirely or partially provided by the
convexly curved surface, it is possible to reduce a load acting on
the abrasive grains located in a peripheral or radially outer
portion of the substrate. However, since the flat or non-curved
portion of the working surface is narrow, the conditioner cannot
perform a conditioning operation at a high efficiency. Further,
since the abrasive grains located on a relatively outer portion of
the working surface of the disk-shaped substrate tend to be worn
earlier than those located on a relatively inner portion of the
working surface of the substrate, the pad is likely to suffer from
a wear in a local portion of its surface, which could lead to a
reduction in the pad lifetime. For avoiding the local wear of the
pad surface, it might be possible to feed the conditioner on the
pad surface along a denser tool path with an increased number of
times of its reciprocating motions. However, feeing the conditioner
along the denser path requires a larger length of time as a
conditioning time, and is not therefore practicable.
SUMMARY OF THE INVENTION
The present invention was made in view of the background prior art
discussed above. It is therefore an object of the invention to
provide a CMP pad conditioner capable of avoiding considerable
damage of abrasive grains in its peripheral or radially outer
portion and conditioning evenly over an entire surface of a CMP pad
without causing the surface of the CMP pad to suffer from a local
wear. This object may be achieved according to any one of first
through twelfth aspects of the invention which are described
below.
The first aspect of the invention provides a CMP pad conditioner
including (a) a disk-shaped substrate having a working surface
which is provided by one of axially opposite end surfaces thereof
and which is to be brought into contact with the CMP pad, and (b)
abrasive grains which are fixed to the working surface. The
substrate includes a radially inner portion and a radially outer
portion which is located radially outwardly of the radially inner
portion. The working surface in the radially outer portion is
inclined with respect to the working surface in the radially inner
portion, such that a thickness of the radially outer portion as
measured in an axial direction of the substrate is reduced as
viewed in a direction away from an axis of the substrate toward a
periphery of the substrate. A ratio of ratio of an outside diameter
of the radially inner portion to an outside diameter of the
substrate is 60 85%.
According to the second aspect of the invention, in the conditioner
defined in the first aspect of the invention, the abrasive grains
are arranged in a predetermined pattern, and cooperate with each
other to constitute an abrasive monolayer. The abrasive grains are
bonded to the working surface of the disk-shaped substrate through
a braze material including an active metal.
According to the third aspect of the invention, in the conditioner
defined in the second aspect of the invention, the disk-shaped
substrate is provided by an annular body. A ratio of an inside
diameter of the radially inner portion to the outside diameter of
the substrate is not larger than 45%.
According to the fourth aspect of the invention, in the conditioner
defined in any one of the first through third aspects of the
invention, the working surface in the radially inner portion is
parallel with a plane perpendicular to the axial direction of the
disk-shaped substrate, such that a thickness of the radially inner
portion as measured in the axial direction is substantially
constant.
According to the fifth aspect of the invention, in the conditioner
defined in the fourth aspect of the invention, the thickness of the
radially inner portion of the disk-shaped substrate is larger than
a thickness of a radially outer end of the disk-shaped substrate as
measured in the axial direction, by a predetermined difference
amount. A ratio of the predetermined difference amount to an
average size of the abrasive grains is 70 150%.
According to the sixth aspect of the invention, in the conditioner
defined in any one of the first through fifth aspects of the
invention, the disk-shaped substrate further includes a radially
intermediate portion which is interposed between the radially inner
and outer portions in a radial direction of the disk-shaped
substrate. The working surface in the radially intermediate portion
is provided by a curved surface which has a radius of curvature of
at least 1 mm as measured in an axial cross section of the
disk-shaped substrate.
According to the seventh aspect of the invention, in the
conditioner defined in the sixth aspect of the invention, the
working surface in the radially outer portion of the disk-shaped
substrate is provided by another curved surface which has a radius
of curvature that is larger than the radius of curvature of the
curved surface providing the working surface in the radially
intermediate portion.
According to the eighth aspect of the invention, in the conditioner
defined in the seventh aspect of the invention, the radius of
curvature of the another curved surface providing the working
surface in the radially outer portion is larger than the outside
diameter of the disk-shaped substrate.
According to the ninth aspect of the invention, in the conditioner
defined in any one of the first through eighth aspects of the
invention, the abrasive grains fixed to the working surface of the
disk-shaped substrate cooperate with each other to constitute an
abrasive layer. The abrasive layer is divided into a plurality of
segments by a plurality of slots or grooves which are formed to
extend along the working surface.
According to the tenth aspect of the invention, in the conditioner
defined in the ninth aspect of the invention, the plurality of
grooves includes first grooves each of which extends substantially
in a circumferential direction of the disk-shaped substrate, and
second grooves each of which extends in a direction away from the
axis of the substrate toward the periphery of the substrate.
According to the eleventh aspect of the invention, in the
conditioner defined in the tenth aspect of the invention, the
conditioner being rotated about the axis in a predetermined
rotating direction for conditioning the CMP pad. Each of the second
grooves is inclined with respect to a radial direction of the
disk-shaped substrate, such that a radially outer end of each the
second grooves is positioned on a rear side of a radially inner end
of the each of the second grooves as viewed in the rotating
direction.
According to the twelfth aspect of the invention, in the
conditioner defined in the eleventh aspect of the invention, each
of the second grooves is curved such that a degree of inclination
thereof with respect to the radial direction is gradually increased
as viewed in the direction away from the axis of the disk-shaped
substrate toward the periphery of the substrate.
In the conditioner defined in any one of the first through twelfth
aspects of the invention, in which the ratio of the outside
diameter of the radially inner portion to the outside diameter of
the disk-shaped substrate is 60 85%, it is possible to
substantially avoid concentration of load onto ones of the abrasive
grains located in the radially outer portion of the substrate,
thereby preventing wear and fracture of the ones of the abrasive
grains located in the radially outer portion, and leading to
increase in lifetime of the conditioner. Further, since the wear
and fracture of the abrasive grains are thus prevented, it is
possible to maintain flatness in the profile of the CMP pad and
prevent any local wear in the surface of the CMP, thereby enabling
the CMP pad to exhibit an increased polishing rate and to have a
prolonged lifetime. Still further, since the flatness in the
profile of the CMP pad is thus maintained, a thickness of abrasive
slurry (that is to be interposed between the CMP pad and the
workpiece) can be made constant, thereby making it possible to
significantly reduce micro-scratches given in the workpiece.
If the above-described ratio of the outside diameter of the
radially inner portion to the outside diameter of the substrate is
lower than 60%, the number of ones of the abrasive grains, which
are likely to work for conditioning the CMP pad, is made
excessively small. The reduction in the number of the working
abrasive grains leads to reduction in a pad cut rate and a lifetime
of the conditioner. If the above-described ratio is higher than
85%, it is impossible to sufficiently reduce the load acting on
each of the ones of the abrasive grains located in the radially
outer portion of the substrate. That is, it is not possible to
sufficiently reduce a possibility of damage of each abrasive grains
located in the radially outer portion of the substrate. It is noted
that the term "pad cut rate" may be interpreted to mean an amount
of stock which can be cut or removed from the CMP pad by the
conditioner for a predetermined length of time, and that the term
"polishing rate" may be interpreted to mean an amount of stock
which can be cut or removed from a workpiece (e.g., wafer) by the
CMP pad and the abrasive slurry for a predetermined length of
time.
In the conditioner defined in the fifth aspect of the invention, in
which the ratio of the difference between the radially inner and
outer portions in thickness with respect to the average size of the
abrasive grains is 70 150%, it is possible to sufficiently reduce
the load acting to each of the ones of the abrasive grains located
in the radially outer portion, and to obtain a sufficiently large
number of the ones of the abrasive grains, which are likely to work
for the conditioning of the CMP pad. If the above-described ratio
is lower than 70%, the load acting on each abrasive grain located
in the radially outer portion is made excessively large. If the
ratio is higher than 150%, the number of the working ones of the
abrasive grains is made excessively small. It is noted that the
average size of the abrasive grains may be obtained on the basis of
a grain size distribution which is commonly measured in accordance
with a known method such as Laser Diffraction method, Coulter
Counter method and Sedimentation method.
In the conditioner defined in any one of the sixth through eighth
aspects of the invention, in which the working surface in the
radially intermediate portion is provided by the curved surface
having the radius of curvature of at least 1 mm, it is possible to
sufficiently reduce the load acting on each of ones of the abrasive
grains located in the radially intermediate portion. If the radius
of curvature of the curved surface providing the radially
intermediate portion is smaller than 1 mm, the load acting on each
abrasive grain located in the radially intermediate portion is made
excessively large.
In the conditioner defined in any one of the ninth through twelfth
aspects of the invention, since the abrasive layer formed on the
working surface of the substrate is divided into the plurality of
abrasive segments by the plurality of slots or grooves, the
conditioning performance can be further improved owing to the
grooves which facilitates evacuation of swarf (small chips and
removed abrasive grains) from the conditioning area therethrough
and also introduction of the abrasive slurry into the conditioning
area therethrough.
In the conditioner defined in the eleventh or twelfth aspect of the
invention, since the above-described grooves including the grooves
each of which is inclined with respect to the radial direction of
the disk-shaped substrate such that the radially outer end of the
inclined groove is positioned on the rear side of the radially
inner end of the inclined groove as viewed in the rotating
direction, the evacuation of the swarf through the thus inclined
groove (which is caused by the rotation of the conditioner) can be
made more efficiently.
BRIEF DESCRIPTION OF THE DRAWINGS
The above and other objects, features, advantages and technical and
industrial significance of this invention will be better understood
by reading the following detailed description of the presently
preferred embodiments of the invention, when considered in
connection with the accompanying drawings, in which:
FIG. 1 is a view showing a configuration of a CMP pad conditioner
in the form of a conditioning disk constructed according to a first
embodiment of the invention;
FIG. 2 is a view showing a working surface of a conditioning disk
constructed according to a second embodiment of the invention;
FIG. 3 is view showing a conventional CMP apparatus;
FIG. 4A is a view showing a conventional conditioning disk;
FIG. 4B is a cross sectional view of the conditioning disk of FIG.
4A; and
FIG. 5 is a cross sectional view of a part of another conventional
disk.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Referring first to FIG. 1, there will be described a CMP pad
conditioner in the form of a rotary conditioning disk 1 which is
constructed according to a first embodiment of the invention. This
conditioning disk 1 includes: a disk-shaped metal substrate 2
having a working surface which is provided by one of its axially
opposite end surfaces; and abrasive grains 3 which are fixed to an
entirety of the working surface of the metal substrate 2. The metal
substrate 2 includes a radially inner portion 4 and a radially
outer portion 5 which is located radially outwardly of the radially
inner portion 4. The disk-shaped metal substrate 2 is provided by
an annular body, and a center hole 6 formed therethrough. The
working surface in the radially inner portion 4 is parallel with a
plane perpendicular to an axial direction of the metal substrate 2,
such that a thickness of the radially inner portion 4 as measured
in the axial direction is substantially constant. The working
surface in the radially outer portion 5 is inclined with respect to
the working surface in the radially inner portion 4, such that a
thickness of the radially outer portion as measured in the axial
direction is reduced as viewed in a direction away from an axis of
the metal substrate 2 toward a radially outer end or periphery of
the metal substrate 2. While the working surface in the radially
inner portion 4 is provided by a substantially flat surface, the
working surface in the radially outer portion 5 is provided by a
convexly curved surface which has a predetermined radius R of
curvature as measured in an axial cross section of the metal
substrate 2.
The abrasive grains 3 are arranged in a predetermined pattern, and
cooperate with each other to constitute an abrasive monolayer. In
other words, the abrasive layer composed of the abrasive grains 3
is formed on the working surface of the metal substrate 2. The
abrasive grains 3 are bonded to each other and to the working
surface of the metal substrate 2 by a braze material including an
active metal. The thickness of the radially inner portion 4 of the
metal substrate 2 is larger than a thickness of a radially outer
end of the radially outer portion 5 (i.e., a thickness of a
periphery of the substrate 2) as measured in the axial direction,
by a predetermined difference amount T, such that a ratio of the
predetermined difference amount T to an average size of the
abrasive grains 3 is 70 150%.
As to specific dimensions of the conditioning disk 1, the
disk-shaped metal substrate 2 has an outside diameter D1 of 100 mm,
and an inside diameter D2 of not larger than 45 mm. The radially
inner portion 4 of the metal substrate 2 has an outside diameter D2
of 80 mm. The radially outer portion 5 of the metal substrate 2 has
a width L of 10 mm as measured in a radial direction of the metal
substrate 2. The above-described difference amount T between the
thickness of the radially inner portion 4 and the thickness of the
radially outer end of the radially outer portion 5 is 0.15 mm. The
radius R of curvature of the convexly curved surface providing the
radially outer portion 3 is 333 mm.
The disk-shaped metal substrate 2 further includes a radially
intermediate portion which is interposed between the radially inner
and outer portions 4, 5 in the radial direction of the metal
substrate 2. The working surface in the radially intermediate
portion is provided by a convexly curved surface which has a radius
r of curvature of 4 mm as measured in the axial cross section of
the substrate 2. The working surface in the radially intermediate
portion may be regarded as a transition portion of the working
surface which is interposed between a flat or non-inclined portion
of the working surface in the radially inner portion 4 and an
inclined portion of the working surface in the radially outer
portion 5. In other words, the flat or non-inclined portion and the
inclined portion of the working surface are smoothly connected via
the transition portion of the working surface.
FIG. 2 shows another rotary conditioning disk 8, which is
constructed according to a second embodiment of the invention. This
rotary conditioning disk 8 is substantially identical with the
above-described rotary conditioning disk 1 except that an abrasive
layer 13 is divided into a plurality of segments by a plurality of
slots or grooves 11, 12 which are formed to extend along the
working surface of the metal substrate 2.
Described specifically, the plurality of grooves 11, 12 includes
first grooves 11 each of which extends substantially in a
circumferential direction of the disk-shaped metal substrate 2, and
second grooves 12 each of which extends in a direction away from a
center hole 14 (farmed through the metal substrate 2) toward the
periphery of the metal substrate 2. Each of the second grooves 12
is inclined with respect to a radial direction of the metal
substrate 2, such that a radially outer end of each second groove
12 is positioned on a rear side of a radially inner end of the
second groove 12 as viewed in a rotating direction of the rotary
conditioning disk 8, i.e., in the counterclockwise direction as
seen in FIG. 2. Each second groove 12 is curved such that a degree
of its inclination with respect to the radial direction is
gradually increased as viewed in the direction away from the center
hole 14 toward the periphery of the metal substrate 2. Since each
second groove 12 is inclined with respect to the radial direction
of the metal substrate 2 as described above, swarf can be displaced
radially outwardly along the second grooves 12 while the
conditioning disk 8 is being rotated. Thus, the evacuation of the
swarf through the second grooves 12 can be made efficiently.
For verifying a technical effect provided by the present invention,
a test was conducted by using a total of seven conditioning disks
(Example 1, Example 2, Comparative Example 1, Comparative Example
2, Comparative Example 3, Comparative Example 4 and Comparative
Example 5), which are specified as follows:
Example 1 is identical with the above-described conditioning disk 1
of FIG. 1, wherein the ratio of the outside diameter of the
radially inner portion of the metal substrate to the outside
diameter of the metal substrate is 80%, while the difference amount
between the thickness of the radially inner portion of the metal
substrate and the thickness of the radially outer end of the metal
substrate is equal to the average size of the abrasive grains.
Example 2 is identical with Example 1, except that the metal
substrate further has the first and second grooves, as in the
above-described conditioning disk 8 of FIG. 2.
Comparative Example 1 is identical with the above-described
conventional conditioning disk shown in FIGS. 4A and 4B.
Comparative Example 2 is identical with the conditioning disk
disclosed in JP-A-2001-113456, wherein super abrasive grains 75
each having obtuse cutting edges are fixed to a radially inside
portion of the working surface of the disk-shaped metal substrate
while super abrasive grains 76 each having sharp cutting edges are
fixed to a radially outside portion of the working surface of the
substrate.
Comparative Example 3 has substantially the same configuration as
the conditioning disk 1 of FIG. 1, but is different from the
conditioning disk 1 in that the ratio of the outside diameter of
the radially inner portion of the metal substrate to the outside
diameter of the metal substrate is 55%, while the ratio of the
above-described difference amount to the average size of the
abrasive grains is 160%.
Comparative Example 4 has substantially the same configuration as
the conditioning disk 1 of FIG. 1, but is different from the
conditioning disk 1 in that the ratio of the outside diameter of
the radially inner portion of the metal substrate to the outside
diameter of the metal substrate is 90%, while the ratio of the
above-described difference amount to the average size of the
abrasive grains is 60%.
Comparative Example 5 has substantially the same configuration as
the conditioning disk 1 of FIG. 1, and is identical with the
above-described Example 1 in that the above-described difference
amount is equal to the average size of the abrasive grains, but is
different from the above-described Example 1 in that the ratio of
the outside diameter of the radially inner portion of the metal
substrate to the outside diameter of the metal substrate is 80% or
more and in that the radius of curvature of the curved surface of
the transition portion between the non-inclined and inclined
portions is 0.11 mm.
It is noted that the seven conditioning disks are the same in the
outside diameter of the metal substrate and the grain size of the
abrasive grains which are 100 mm and #100/120, respectively.
In the test, a pad conditioning operation was first carried out by
using the above-described seven conditioning disks, under
conditions as specified in Table 1. A wafer polishing operation was
then carried out by using each polishing pad which had been
conditioned by a corresponding one of the seven conditioning disk
in the pad conditioning operation, under conditions which are the
same as those specified in Table 1 except for the polishing time
and used slurry. The wafer polishing operation was continued for
one minute with use of W2000 as the slurry. A result of the
polishing operation is shown in Table 2.
TABLE-US-00001 TABLE 1 Used machine Lapping machine Number of
revolutions of conditioning disk (min.sup.-1) 100 Number of
revolutions of rotary table (min.sup.-1) 100 Load (1bf) 6 Polishing
pad IC1400 Slurry Pure water Conditioning time (Hr) 20
TABLE-US-00002 TABLE 2 Polishing rate Pad lifetime Micro (.mu.m/Hr)
(wafers) scratches Example 1 150 130 50 Example 2 180 150 35
Comparative Example 1 100 100 100 Comparative Example 2 110 105 95
Comparative Example 3 120 105 90 Comparative Example 4 110 110 95
Comparative Example 5 130 105 90
Table 2 shows values in respective items (polishing rate, pad
lifetime and micro scratches) in the wafer polishing operation with
use of each of the polishing pads which were conditioned by the
respective seven conditioning disks. In this Table 2, the value in
each item in the polishing operation with use of one of the
polishing pads, which was conditioned by the conditioning disk of
Comparative Example 1, is set at 100 as a reference value.
In the pad conditioning operation, the damage of the abrasive
grains in the radially outer portion was remarkably smaller in the
conditioning disk of each of Examples 1 and 2 than in the
conditioning disk of Comparative Example 1. Meanwhile, the abrasive
grains in the radially outer end portion of the conditioning disk
of each of Comparative Examples 2 and 3 were not brought into
contact with the polishing pad. Further, the conditioning disks of
each of Examples 1 and 2 exhibited a higher pad cut rate than the
conditioning disk of each of Comparative Examples 2 5. The
polishing pad conditioned by the conditioning disk of each of
Examples 1 and 2 was satisfactorily flattened in its profile,
without suffering from any local wear.
In the wafer polishing operation, the polishing pad conditioned by
the conditioning disk of Example 2 exhibited the highest polishing
rate, as is apparent from Table 2.
As is clear from the foregoing description, the present invention
is advantageously applicable to a CMP pad conditioner which is used
in a CMP apparatus for flattening a surface of a workpiece such as
a wafer. The present invention restrains load from being
concentrated to ones of the abrasive grains located in the radially
outer portion of the disk-shaped disk, thereby making is possible
to prevent wear, breakage and other damage of each of the abrasive
grains. That is, the present invention contributes to prolongation
in the lifetime of the conditioner and remarkable increase in the
pad cut rate exhibited by the conditioner. Further, the conditioner
constructed according to the present invention is capable of
conditioning the CMP pad such that the conditioned CMP pad is given
a high degree of flatness without suffering from any local wear.
The CMP pad conditioned by the conditioner of the invention has a
prolonged lifetime, and is given an increased capacity of
transporting the slurry to the pad/wafer interface, thereby making
it possible to remarkably reduce micro-scratches and other defects
on the wafer.
While the presently preferred embodiments of the present invention
have been illustrated above, it is to be understood that the
invention is not limited to the details of the illustrated
embodiments, but may be embodied with various other changes,
modifications and improvements, which may occur to those skilled in
the art, without departing from the spirit and scope of the
invention defined in the following claims.
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