U.S. patent number 6,483,664 [Application Number 09/409,430] was granted by the patent office on 2002-11-19 for thin film magnetic head and method of manufacturing same.
This patent grant is currently assigned to TDK Corporation. Invention is credited to Akifumi Kamijima.
United States Patent |
6,483,664 |
Kamijima |
November 19, 2002 |
Thin film magnetic head and method of manufacturing same
Abstract
A thin film magnetic head with a sufficient over write
characteristic and a small magnetic pole width. A sub-pole tip is
formed to cover the edge opposite to the air-bearing surface of a
pole tip. The part where the sub-pole tip and the pole tip are
overlapped is used as a sub-magnetic pole portion. The volume of
the sub-magnetic pole portion is larger than that of a magnetic
pole portion which consists of only the pole tip. Thereby, the
saturation of the flux in a region in vicinity of the position of
throat height 0 is suppressed and thus a sufficient over write
characteristic is achieved.
Inventors: |
Kamijima; Akifumi (Tokyo,
JP) |
Assignee: |
TDK Corporation (Tokyo,
JP)
|
Family
ID: |
17695842 |
Appl.
No.: |
09/409,430 |
Filed: |
September 30, 1999 |
Foreign Application Priority Data
|
|
|
|
|
Oct 7, 1998 [JP] |
|
|
10-285770 |
|
Current U.S.
Class: |
360/125.65;
360/123.47; 360/123.49; 360/125.57; 360/125.6; 360/125.62; 360/317;
G9B/5.082; G9B/5.086; G9B/5.135 |
Current CPC
Class: |
G11B
5/3116 (20130101); G11B 5/313 (20130101); G11B
5/3967 (20130101) |
Current International
Class: |
G11B
5/39 (20060101); G11B 5/31 (20060101); G11B
005/147 (); G11B 005/127 (); G11B 005/33 (); G11B
005/21 () |
Field of
Search: |
;360/126,125,119,317,123 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Nguyen; Hoa T.
Assistant Examiner: Watko; Julie Anne
Attorney, Agent or Firm: Oliff & Berridge PLC
Claims
What is claimed is:
1. A thin film magnetic head comprising two magnetic layers, each
of the two magnetic layers having a magnetic pole, each of the
magnetic poles facing each other with a write gap layer in between,
the write gap layer disposed near and in a recording-medium-facing
surface that faces a recording medium, a thin film coil provided
between the two magnetic layers, and an insulating layer that
insulates the thin film coil from the two magnetic layers, wherein
at least one of the two magnetic layers comprises: a first magnetic
pole portion having a first end portion which is positioned
adjacent to the recording medium and a second end portion that is
positioned distal from the recording medium; a sub-magnetic pole
portion, including the second end portion of the first magnetic
pole portion and a sub-pole tip magnetically coupled to the second
end portion of the first magnetic pole portion, the sub-magnetic
pole portion having a greater maximum film thickness than a maximum
film thickness of the first magnetic pole portion; and a yoke that
is magnetically coupled to the sub-magnetic pole portion, the yoke
including a connecting portion and a yoke area, the connecting
portion being in contact with the sub-magnetic pole portion and
having a width in a direction orthogonal to the film thickness of
the sub-magnetic pole portion and parallel to the
recording-medium-facing surface, the width of the connecting
portion being equal to a width of the sub-magnetic pole portion
where the sub-magnetic pole portion is in contact with the
connecting portion in the direction.
2. A thin film magnetic head according to claim 1, wherein the
sub-magnetic pole portion is wider than the first magnetic pole
portion in the direction orthogonal to the film thickness of the
sub-magnetic pole portion.
3. A thin film magnetic head according to claim 1, wherein the
first end portion of the first magnetic pole portion is a
rectangular parallelepiped having sidewalls, the sidewalls being
perpendicular to both the recording medium and to a surface of the
sub-pole tip closest to the recording medium.
4. A thin film magnetic head according to claim 1, wherein the film
thickness of the sub-magnetic pole portion is reduced gradually as
it approaches the recording medium.
5. A thin film magnetic head according to claim 4, wherein the
width of the sub-magnetic pole portion in the direction orthogonal
to the film thickness of the sub-magnetic pole portion is reduced
gradually as it approaches the recording medium.
6. A thin film magnetic head according to claim 1, further
comprising a second insulating layer provided between the write gap
layer and the sub-magnetic pole portion for determining a throat
height.
7. A thin film magnetic head according to claim 6, wherein an edge
of the sub-magnetic pole portion closest to the recording medium is
placed in vicinity of an edge of the second insulating layer
closest to the recording medium.
8. A thin film magnetic head according to claim 1, wherein the yoke
area is wider than the sub-magmagnetic pole portion in the
direction orthogonal to the film thickness of the sub-magnetic pole
portion.
9. A thin film magnetic head according to claim 1, wherein at least
one layer of thin film coil is formed in a region which lies along
a surface opposite to a surface of the sub-magnetic pole portion
facing the recording medium, and a surface of the write gap
layer.
10. A manufacturing method of a thin film magnetic head comprising
two magnetic layers, each of the two magnetic layers having a
magnetic pole, each of the magnetic poles facing each other with a
write gap layer in between, the write gap layer disposed near and
in a recording-medium-facing surface that faces a recording medium,
a thin film coil provided between the two magnetic layers, and an
insulating layer that insulates the thin film coil from the two
magnetic layers, comprising the steps of: forming a first magnetic
pole portion so that a first end portion of the first magnetic pole
portion is positioned adjacent to the recording medium and a second
end portion is positioned distal from the recording medium; forming
a sub-magnetic pole portion, including the second end portion of
the first magnetic pole portion and a sub-pole tip magnetically
coupled to the second end portion of the first magnetic pole
portion, the sub-magnetic pole portion having a greater maximum
film thickness than a maximum film thickness of the first magnetic
pole portion; and forming a yoke that is magnetically coupled to
the sub-magnetic pole portion, the yoke including a connecting
portion and a yoke area, the connecting portion being in contact
with the sub-magnetic pole portion and having a width in a
direction orthogonal to the film thickness of the sub-magnetic pole
portion and parallel to the recording-medium-facing surface, the
width of the connecting portion being equal to a width of the
sub-magnetic pole portion where the sub-magnetic pole portion is in
contact with the connecting portion in the direction.
11. A manufacturing method of a thin film magnetic head according
to claim 10, wherein the sub-magnetic pole portion is formed wider
than the first magnetic pole portion in the direction orthogonal to
the film thickness of the sub-magnetic pole portion.
12. A manufacturing method of a thin film magnetic head according
to claim 10, wherein the first end portion of the first magnetic
pole portion is a rectangular parallelpiped having sidewalls, the
sidewalls being perpendicular to the recording medium and to a
surface of the sub-pole tip closest to the recording medium.
13. A manufacturing method of a thin film magnetic head according
to claim 12 wherein the film thickness of the sub-magnetic pole
portion is reduced gradually as it approaches the recording
medium.
14. A manufacturing method of a thin film magnetic head according
to claim 10, wherein the width of the sub-magnetic pole portion in
the direction orthogonal to the film thickness of the sub-magnetic
pole portion is reduced gradually as it approaches the recording
medium.
15. A manufacturing method of a thin film magnetic head according
to claim 10, wherein the first end portion of the first magnetic
pole portion is a rectangular parallelepiped, and then the
sub-magnetic pole portion is formed in a manner that the second end
portion of the first magnetic pole portion is covered with the
sub-pole tip.
16. A manufacturing method of a thin film magnetic head according
to claim 10, wherein the write gap layer is formed and then a
second insulating layer for determining a throat height is formed
between the write gap layer and the sub-magnetic pole portion.
17. A manufacturing method of a thin film magnetic head according
to claim 16, wherein an edge of the sub-magnetic pole portion
closest to the recording medium is placed in vicinity of an edge of
the second insulating layer closest to the recording medium.
18. A manufacturing method of a thin film magnetic head according
to claim 10, wherein the yoke area is formed wider than the
sub-magnetic pole portion in the direction orthogonal to the film
thickness of the sub-magnetic pole portion.
19. A manufacturing method of a thin film magnetic head according
to claim 11, wherein at least one layer of thin film coil is formed
in a region which lies along a surface opposite to a surface of the
sub-magnetic pole portion facing the recording medium, and a
surface of the write gap layer.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a thin film magnetic head having
at least an inductive-type magnetic transducer for writing and a
method of manufacturing the same.
2. Description of the Related Art
In recent years, performance improvement in thin film magnetic
heads has been sought in accordance with an increase in surface
recording density of a hard disk drive. A composite thin film
magnetic head, which has a layered structure including a recording
head having an inductive-type magnetic transducer for writing and a
reproducing head having magneto resistive (MR) elements for
reading, has been widely used as a thin film magnetic head.
The performance of the reproducing head can be improved in several
ways. One way is to form an MR film from a material which has good
magnetic resistive sensitivity such as a GMR film instead of an AMR
film; another is to adjust a pattern width of the MR film,
especially an MR height. The MR height is the length (height)
between one end of the MR element closer to an air-bearing surface
and the other end thereof. The MR height is originally determined
by an amount of grinding when the air-bearing surface is processed.
The air-bearing surface as used herein refers to a surface of a
thin film magnetic head that faces a magnetic recording medium and
is also called a track surface.
Performance improvement in a recording head has also been expected
in accordance with the performance improvement in a reproducing
head. A factor determining the performance of a recording head is
the throat height (TH). The throat height is the length (height) of
a portion (magnetic pole portion) spreading from the air-bearing
surface to an edge of an insulating layer for electrically
isolating a thin film coil for causing magnetic flux. Reducing the
throat height is desirable in order to improve the performance of a
recording head. The throat height is determined as well by an
amount of grinding when the air-bearing surface is processed.
It is required to increase the track density of a magnetic
recording medium in order to increase the recording density among
the performance of a recording head. This requires a recording head
having a narrow track structure in which the width of a bottom pole
and a top pole sandwiching a write gap layer on the air-bearing
surface is reduced to the order of some microns to submicron.
Semiconductor process technique is used to achieve this narrow
track structure.
FIGS. 21A and 21B show a structure of a composite thin film
magnetic head as an example of a thin film magnetic head of a
related art. FIG. 21A shows a cross section perpendicular to the
air-bearing surface. FIG. 21B shows a cross section parallel to the
air-bearing surface of the magnetic pole portion.
The composite thin film magnetic head has an insulating layer 102
made of, for example, alumina (aluminum oxide, Al.sub.2 O.sub.3) of
about 5 to 10 .mu.m in thickness formed on a substrate 101 made of,
for example, aluminum oxide and titanium carbide (Al.sub.2
O.sub.3.TiC). Further, a bottom shield layer 103 for a reproducing
head is formed from a magnetic material on the insulating layer
102. Alumina or aluminum nitride, for example, is sputtered on the
bottom shield layer 103 to form a bottom shield gap film 104 as an
insulating layer. An MR element 105 for reproduction is formed on
the bottom shield gap film 104. Furthermore, a pair of first
electrode layer 106 which is electrically connected to the MR
element 105 is formed on the bottom shield gap film 104. The first
electrode layer 106 is formed by stacking TiW, CoPt, TiW, and Ta,
for example.
Also, a pair of second electrode layer 107 is electrically
connected to the first electrode layer 106. The second electrode
layer 107 can be formed from copper (Cu), for example. The first
electrode layer 106 and the second electrode layer 107 constitute a
lead, which is electrically connected to the MR element 105.
As an insulating layer, an upper shield gap layer 108 is formed on
the bottom shield gap layer 104 and the MR element 105. The MR
element 105 is buried in the shield gap layers 104 and 108. A top
shield-cum-bottom pole layer (called bottom pole layer in the
following) 109, made of a magnetic material and used both for a
reproducing head and for a recording head is formed on the upper
shield gap layer 108. A write gap layer 110 made of an insulating
film such as an alumina film is formed on the bottom pole layer
109. A photoresist layer 111 which determines throat height is
formed on the write gap layer 110 in a predetermined pattern. A
first layer of a thin film coil 112 for an inductive-type head for
recording is formed on the photoresist layer 111. Further, a
photoresist layer 113 is formed in a predetermined pattern on the
photoresist layer 111 and the thin film coil 112. A heat treatment
of the temperature of 200-250.degree. C., for example, is applied
for stabilizing the photoresist layer 113. A second layer of a thin
film coil 114 is formed on the photoresist layer 113. A photoresist
layer 115, which is stabilized by heat treatment, is formed in a
predetermined pattern on the photoresist layer 113 and the thin
film coil 114.
The write gap layer 110 is etched partially to form a yoke in the
rear (right-hand side in FIG. 21A) of the thin film coils 112 and
114. A top pole layer 116 made of a magnetic material for the
recording head, that is, a high saturation flux density material
such as permalloy (NiFe) or nitride ferrous (FeN) is formed on the
write gap layer 110, the photoresist layers 111, 113, and 115. The
top pole layer 116 has a contact with, and is magnetically coupled
to the bottom pole layer 109 in the rear of the thin film coils 112
and 114. An over coat layer 117 made of alumina, for example, is
formed on the top pole layer 116. Each of the side walls of a part
of the top pole layer 116, the write gap layer 110 and the bottom
pole layer 109 is formed vertically and in a self-aligned manner to
form a trim structure. This trim structure can prevent widening of
effective write track width caused by widening of magnetic flux in
writing data in the narrow track.
FIG. 22 shows an example of a shape of the top pole layer 116. The
top pole layer 116 has a magnetic pole portion 116a which is placed
closer to the air-bearing surface 120 and a yoke area 116b which is
placed at the position facing the thin film coils 112 and 114. A
part of the yoke area 116b at the side of the magnetic pole portion
116a is tapered off as it is close to the magnetic pole portion
116a. The outer edge of the tapered part is inclined to 45.degree.,
for example, against the surface which is parallel to the
air-bearing surface 120. The TH0, Throat Height position 0, in
figures indicates a position of the edge of the insulating layer
closer to the air bearing surface, which separates thin film coil
electrically.
These days, reducing the write track width, or the width of the
magnetic pole portion (called pole width in the followings), is
required for high surface density writing. FIG. 23 shows an example
of a shape of the top pole layer 116 with narrower pole width than
that of FIG. 22. In this example, the width of the magnetic pole
portion 116a is 0.8-1.2 .mu.m. It is possible that the width of the
magnetic pole portion 116a will be around 0.4 .mu.m of the
submicron order in future.
Conventionally, if the top pole layer 116 is formed like that in
FIG. 22, the magnetic flux caused from the thin film coils 112 and
114 does not saturate on the way but reaches to the top of the
magnetic pole portion.
However, as shown in FIG. 23, for example, when the pole width is
reduced, the flux saturates in vicinity of the Throat Height 0
position, TH0, and the flux does not reach to the top of the
magnetic pole portion. As a result, an over write characteristic,
that is, a characteristic in over-writing data on a recording media
on which something is written already, indicates values as low as
around 10-20 dB, for example, and the sufficient over write
characteristic can not be obtained.
Meanwhile, the top pole layer is formed by the frame plating
method, for example, described in Japanese Patent Application
laid-down in Hei 7-262519. In order to form the top pole layer by
the frame plating method, first, a thin electrode film made of
permalloy, for example, is formed by sputtering, for example, all
over the apex area which is a coil portion formed into a shape like
a mountain. Next, photoresist is applied thereon and patterned
through photolithography. A frame for plating is thus formed.
Further, the top pole layer is formed through the plating method,
using the electrode film formed earlier as a seed layer.
However, the apex area and other areas have, for example, equal to
or more than 7 to 10 .mu.m differences in heights. The photoresist
of 3-4 .mu.m in thickness is applied on the apex area. If the film
thickness of the photoresist on the apex area is required to be
equal to or more than 3 .mu.m, a photoresist film of equal to or
more than 8 to 10 .mu.m, for example, in thickness is formed in the
lower part of the apex area since the photoresist gathers into a
lower area because of liquidity.
To form a narrow magnetic pole portion, a frame pattern with width
of around 1.0 .mu.m each must be formed with a photoresist film. In
other words, a micro pattern with width of 1.0 .mu.m or less must
be formed with a photoresist film of 8-10 .mu.m or more in
thickness. However, it has been extremely difficult to form such a
thick photoresist pattern with a small width in manufacturing.
Further, during an exposure of photolithography, a light for the
exposure is reflected by a bottom electrode film as a seed layer,
and the photoresist is exposed also by the reflection light causing
deformation of the photoresist pattern so that a sharp and accurate
photoresist pattern can not be obtained. As a result, the top pole
layer can not be formed in a desired shape; the side walls of the
top pole layer take a shape of being rounded, for example. This is
the case in particular when the top pole layer 116 is formed in the
shape of that shown in FIG. 23. The reflection lights reflected by
the bottom electrode film impinge in the vicinity of the border of
the magnetic pole portion 116a and the yoke area 116b. These
reflection lights include not only the light in the vertical
direction but also the light reflected from the slope of the apex
area in the diagonal or horizontal direction. The reflection lights
affect on the exposure of the photoresist layer, and it easily
allows a wider photoresist pattern than that with the desired
value, which determines pole width.
SUMMARY OF THE INVENTION
The invention is presented to solve these problems. The first
object is to provide a thin film magnetic head, which can obtain a
sufficient over write characteristic even if pole width is reduced,
and a method of manufacturing the same.
In addition to the first objective, the second object is to provide
a thin film magnetic head, which can precisely control the pole
width even if pole width is reduced, and a method of manufacturing
the same.
A thin film magnetic head of the invention comprises an
inductive-type magnetic transducer for writing which has two
magnetic layers and a thin film coil provided between the magnetic
layers with an insulating layer in between, the magnetic layers
including two magnetic pole portions which are magnetically coupled
to and face each other in part of the sides facing a recording
medium with a write gap layer in between and comprise at least one
layer for each magnetic layer, wherein at least one of the two
magnetic layers comprising: a magnetic pole portion, one edge of
which is placed closer to the surface facing the medium which face
a recording medium; a submagnetic pole portion, one edge of which
is magnetically coupled to the other edge of the magnetic pole
portion, having a greater film thickness than that of the magnetic
pole portion; and a yoke area being magnetically coupled to another
edge of the sub-magnetic pole portion.
According to the invention, a manufacturing method of a thin film
magnetic head comprising an inductive-type magnetic transducer for
writing which has two magnetic layers and a thin film coil provided
between the magnetic layers with an insulating layer in between,
the magnetic layers including two magnetic pole portions which are
magnetically coupled to and face each other in part of the sides
facing a recording medium with a write gap layer in between and
comprise at least one layer for each magnetic layer, comprises
steps of: forming a magnetic pole portion so that one edge of the
magnetic pole portion is placed closer to the surface facing the
medium which faces the recording medium; forming an sub-magnetic
pole portion, one edge of which is magnetically coupled to the
other edge of the magnetic pole portion, having a greater film
thickness than that of the magnetic pole portion; and forming a
yoke area being magnetically coupled to another edge side of the
sub-magnetic pole portion.
In the thin film magnetic head and the method of manufacturing the
same of the invention, a sub-magnetic pole portion having a greater
film thickness than that of the magnetic pole portion is
magnetically coupled to the other edge of the magnetic pole
portion. Therefore, it is possible to obtain a large volume of pole
in vicinity of the throat height 0 position even if the width of
the magnetic pole portion, or the pole width is reduced. Also, it
is possible to suppress flux saturation in vicinity of the throat
height 0 position and to obtain submicron order of pole width.
Further, in the thin film magnetic head and the manufacturing the
same of the invention, the sub-magnetic pole portion may be wider
than the magnetic pole portion.
Further, in the thin film magnetic head and the manufacturing the
same of the invention, the magnetic pole portion may be formed to
be vertical to the surface facing the medium and to the edge
surface closer to the surface facing the medium of the sub-magnetic
pole portion.
Further, in the thin film magnetic head and the manufacturing the
same of the invention, at least the film thickness of the
sub-magnetic pole portion may be formed to be reduced gradually as
it is closer to the surface facing the medium.
Further, in the thin film magnetic head and the manufacturing the
same of the invention, after the magnetic pole portion is formed as
a magnetic layer with a rectangular section, the sub-magnetic pole
portion may be formed by covering a part opposite to the surface
facing the medium of the magnetic layer with at least one layer of
other magnetic layers.
Further, in the thin film magnetic head and the manufacturing the
same of the invention, after the gap layer is formed, an insulating
layer for determining a throat height may be formed between the gap
layer and the sub-magnetic pole portion of one of the magnetic
layers.
Further, in the thin film magnetic head and the manufacturing the
same of the invention, the edge closer to the surface facing the
medium of the sub-magnetic pole portion may be placed in vicinity
of the edge closer to the surface facing the medium of the
insulating layer.
Further, in the thin film magnetic head and the manufacturing the
same of the invention, it is preferable that the yoke area be
formed wider than the sub-magnetic pole portion.
Further, in the thin film magnetic head and the manufacturing the
same of the invention, at least one layer of thin film coil may be
formed in a region spreading over the surface opposite to the
surface facing the medium of the sub-magnetic pole portion and the
surface of the gap layer.
Other and further objects, features and advantages of the invention
will appear more fully from the following description.
BRIEF DESCRIPTION OF THE DRAWINGS
FIGS. 1A and 1B are cross-sectional views for describing one step
of a manufacturing procedure of a thin film magnetic head according
to a first embodiment of the invention.
FIGS. 2A and 2B are cross-sectional views for describing the
procedure following FIGS. 1A and 1B.
FIGS. 3A and 3B are cross-sectional views for describing the
procedure following FIGS. 2A and 2B.
FIGS. 4A and 4B are cross-sectional views for describing the
procedure following FIGS. 3A and 3B.
FIGS. 5A and 5B are cross-sectional views for describing the
procedure following FIGS. 4A and 4B.
FIGS. 6A and 6B are cross-sectional views for describing the
procedure following FIGS. 5A and 5B.
FIGS. 7A and 7B are cross-sectional views for describing the
procedure following FIGS. 6A and 6B.
FIGS. 8A and 8B are cross-sectional views for describing the
procedure following FIGS. 7A and 7B.
FIGS. 9A and 9B are cross-sectional views for describing the
procedure following FIGS. 8A and 8B.
FIGS. 10A and 10B are cross-sectional views for describing the
procedure following FIGS. 9A and 9B.
FIGS. 11A and 11B are cross-sectional views for describing the
procedure following FIGS. 10A and 10B.
FIGS. 12A and 12B are cross-sectional views for describing the
procedure following FIGS. 11A and 11B.
FIG. 13 is a perspective view showing a structure of a top pole
layer of a thin film magnetic head according to the first
embodiment of the invention in vicinity of the air-bearing surface
thereof.
FIG. 14 is a plan view for describing the relationship of the
positions of a magnetic pole portion, a sub-magnetic pole portion
and a yoke area of a thin film magnetic head according to the first
embodiment of the invention.
FIG. 15 is a plan view for describing a modified example according
to a first embodiment of the invention.
FIGS. 16A and 16B are cross-sectional views for describing one step
of a manufacturing procedure of a thin film magnetic head according
to a second embodiment of the invention.
FIGS. 17A and 17B are cross-sectional views for describing the
procedure following FIGS. 16A and 16B.
FIGS. 18A and 18B are cross-sectional views for describing the
procedure following FIGS. 17A and 17B.
FIGS. 19A and 19B are cross-sectional views for describing the
procedure following FIGS. 18A and 18B.
FIGS. 20A and 20B are cross-sectional views for describing the
procedure following FIGS. 19A and 19B.
FIGS. 21A and 21B are cross-sectional views for describing a
structure of a thin film magnetic head of the related art.
FIG. 22 is a plan view showing an example of a shape of a top pole
layer in a thin film magnetic head of the related art.
FIG. 23 is a plan view showing an example of a shape of a top pole
layer in a thin film magnetic head when a pole width is
reduced.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Embodiments of the invention will be described with reference to
the drawings in the followings.
First Embodiment
First, the manufacturing method of a composite thin film magnetic
head will be described as the manufacturing method of a thin film
magnetic head according to a first embodiment of the invention with
reference to FIGS. 1A and 1B to 12A and 12B. FIGS. 1A, 2A, 3A, 4A,
5A, 6A, 7A, 8A, 9A, 10A, 11A and 12A show cross sections vertical
to the air-bearing surface. FIGS. 1B, 2B, 3B, 4B, 5B, 6B, 7B, 8B,
9B, 10B, 11B and 12B show cross sections parallel to the
air-bearing surface of the magnetic pole portion.
In the manufacturing method according to this embodiment, as shown
in FIGS. 1A and 1B, an insulating layer 2 of about 5 .mu.m in
thickness made of alumina (Al.sub.2 O.sub.3), for example, is
deposited on a substrate 1 made of aluminum oxide and titanium
carbide (Al.sub.2 O.sub.3.TiC), for example. Then, a bottom shield
layer 3 of 2-3 .mu.m in thickness for a reproducing-head portion
made of a magnetic material is formed on the insulating layer
2.
As shown in FIGS. 2A and 2B, alumina or aluminum oxide is sputtered
on the bottom shield layer 3 to form a bottom shield gap layer 4 of
30-150 nm in thickness thereon as an insulating layer. An MR film
of tens of nanometer in thickness for forming an MR element 5 for
reproduction is formed on the bottom shield gap layer 4. Then, a
photoresist pattern is formed selectively at the position where the
MR element 5 should be formed on the MR film. The photoresist
pattern should be a shape whose cross section is T-type, for
example, so that the photoresist pattern can be lifted off easily.
Next, the MR film is etched by ion-milling, for example, using the
photoresist pattern as a mask to form the MR element 5. The MR
element 5 may be either a GMR or an AMR element. Next, a pair of a
first electrode layer 6 of tens of nanometer in thickness, which is
electrically connected to the MR element 5, is formed on the bottom
shield gap layer 4 using the same photoresist pattern as a mask.
The first electrode layer 6 may be formed through stacking TiW,
CoPt, TiW, Ta, for example. Then, the photoresist pattern is lifted
off.
As shown in FIGS. 3A and 3B, a pair of a second electrode layer 7,
which is electrically connected to the first electrode layer 6, is
formed in a predetermined pattern. The thickness of the second
electrode layer 7 may be 150 nm in thickness, for example. The
second electrode layer 7 may be formed from copper (Cu), for
example. The first electrode layer 6 and the second electrode layer
7 constitute a lead, which is electrically connected to the MR
element 5.
As shown in FIGS. 4A and 4B, an upper shield gap layer 8 of 30-150
nm in thickness used as an insulating layer is formed on the bottom
shield gap layer 4 and the MR element 5. The MR element 5 is thus
buried within the shield gap films 4 and 8. Then, an upper shield
layer-cum-bottom pole layer (called bottom pole layer in the
followings) 9 of about 3 nm in thickness is formed on the upper
shield gap layer 8. The bottom pole layer 9 is made of a magnetic
material and used both for a reproducing head and for a recording
head.
As shown in FIGS. 5A and 5B, a write gap layer 10, which is made of
an insulating film such as alumina film, is formed to 0.1-0.3 .mu.m
in thickness on the bottom pole layer 9.
As shown in FIGS. 6A and 6B, an insulating layer 11 for determining
throat height is formed on the write gap layer 10. The thickness of
the insulating layer 11 may be 1.0-3.0 .mu.m, for example. The
insulating layer 11 may be formed by heating the photoresist layer,
for example, or may be formed from alumina film, silicon oxide
film, silicon nitride film and so on. Then, a contact hole 10a is
formed by etching the write gap layer 10 partially to form a yoke
in the rear (right-hand side in FIG. 6A) of the insulating layer
11.
As shown in FIGS. 7A and 7B, an upper pole tip portion, pole tip 12
made of a magnetic material for the recording head is formed to
spread over the air-bearing surface and the insulating layer 11 by
a frame plating method, for example. The thickness of the pole tip
12 may be about 1.0-3.0 .mu.m, for example. At the same time, a
pole layer 13 of about 1.0-3.0 .mu.m, for example, in thickness for
forming the yoke is formed in the contact hole 12a by using the
same material as the one used for the pole tip 12.
As shown in FIGS. 8A and 8B, a sub-pole tip 14 which is wider than
the pole tip 12 is formed on the pole tip 12 by a frame plating
method, for example. The sub-pole tip 14 is about 1-5 .mu.m, for
example, in width and about 1-3 .mu.m, for example, in thickness.
At the same time, a pole layer 15 of about 1.0-3.0 .mu.m, for
example, in thickness for forming the yoke is formed on the pole
layer 13 by using the same material as the one used for the
sub-pole tip 14.
As shown in FIGS. 9A and 9B, the write gap layer 10 and,
furthermore, the bottom pole layer 9 are etched by 0.3-0.5 .mu.m,
for example, by ion-milling using the sub-pole tip 14 as a mask to
form a trim structure. The trim structure can prevent widening of
effective write track width by suppressing widening of flux in
writing data.
As shown in FIGS. 10A and 10B, an insulating layer 16 made of
alumina, for example, of 1-6 .mu.m, for example, in thickness is
formed on the whole surface. Then, the insulating layer 16 is
polished and flattened to the surface of the sub-pole tip 14 and
the pole layer 15. As the polishing method for this process,
mechanical polishing or CMP (chemical mechanical polishing) may be
used. Flattening the insulating layer 16 exposes the surface of the
sub-pole tip 14 and the pole layer 15, while creating a structure
in which the space between the pole tip 12 and the sub-pole tip 14,
and the pole layers 13 and 15 is filled with the insulating layer
16.
As shown in FIGS. 11A and 11B, a thin film coil 17 for an inductive
recording head is formed on the insulating layer 16 by a plating
method, for example. The thickness of the thin film coil 17 may be
3 .mu.m, for example. Then, a photoresist layer 18 is formed on the
insulating layer 16 and the thin film coil 17 in a predetermined
pattern. A heat treatment of the temperature of 200-250.degree. C.,
for example, is applied for stabilizing the photoresist layer 18.
Then, a thin film coil 19 of 3 .mu.m in thickness is formed on the
photoresist layer 18. A photoresist layer is formed on the
photoresist layer 18 and the thin film coil 19 in a predetermined
pattern. A heat treatment of the temperature of 200-250.degree. C.,
for example, is applied for stabilizing the photoresist layer.
Further, a top pole yoke 21 for a recording head, made of a
magnetic material, is formed on the sub-pole tip 14, the insulating
layer 16, the photoresist layers 18 and 20 in thickness of about
2-3 .mu.m, for example. The top pole yoke 21 has a contact with and
is magnetically coupled to the bottom pole layer 9 through the pole
layers 13 and 15 formed in the contact hole 12a in the rear of the
thin film coils 17 and 19.
Further, as shown in FIGS. 12A and 12B, the over coat layer 22 made
of alumina, for example, is formed on the top pole yoke 21 in
thickness of 30-40 .mu.m, for example. At last, a thin film
magnetic head according to this embodiment is completed through
forming an air-bearing surface of a recording head and a
reproducing head by a slider machine processing.
In this embodiment, each of the bottom pole layer 9, the pole tip
12, the sub-pole tip 14 and the top pole yoke 21 is formed with
NiFe (Ni: 80 weight percentage, Fe: 20 weight percentage). However,
they may be formed with NiFe (Ni: 50 weight percentage, Fe: 50
weight percentage) or high saturation flux density materials such
as Sendust, nitride ferrous (FeN) or its compound, amorphous of
FeCoZr. A structure of stacking more than two kinds of the
materials may be also possible.
In this embodiment, the throat height is determined by the
insulating layer 11, and the throat height 0 position, TH0, is at
the edge of the insulating layer 11 on the air-bearing surface side
thereof, as shown in FIG. 12.
FIG. 13 is a perspective view for showing a structure of a top pole
layer of a thin film magnetic head according to this embodiment
manufactured as described above in vicinity of the air-bearing
surface (the surface facing the medium) thereof. FIG. 14 shows a
plan view of the top pole layer.
In the embodiment, the pole tip 12, the sub-pole tip 14 and the top
pole yoke 21 constitute the top pole layer, which corresponds to
one of the two magnetic layers of this invention. The part 12A of
the pole tip 12, which is not covered by the sub-pole tip 14,
corresponds to the magnetic pole portion according to the present
invention. The part 12B where the pole tip 12 and the sub-pole tip
14 are overlapped corresponds to the sub-magnetic pole portion
according to the present invention. The top pole yoke 21
corresponds to the yoke area according to the present invention.
The width of the top pole yoke 21 is equal to the width of the
sub-magnetic pole portion 12B, for example, in this. embodiment.
The top pole yoke 21 comprises the connecting portion 21A which is
magnetically coupled to the sub-pole tip 14 and the yoke area 21B
which is formed to be wider than the connecting portion 21A.
In the embodiment, the top pole layer is divided into the pole
portion including the pole tip 12 and the sub-pole tip 14 and the
yoke area constituted by the top pole yoke 21. As a result, the
pole tip 12 can be formed on an almost flat surface without any
apex area. Accordingly, the pole tip 12 can be micronized down to
the order of half-micron or quarter-micron.
Further, in the embodiment, the sub-pole tip 14 is magnetically
coupled to one edge of the pole tip 12, which faces the air-bearing
surface at the other edge. The top pole yoke 21 is magnetically
coupled to the sub-pole tip 14.
The magnetic pole portion 12A comprises the pole tip 12, which is
narrow. On the other hand, the sub-magnetic pole portion 12B has a
layered structure by stacking the pole tip 12 and the sub-pole tip
14. Moreover, the connecting portion 21A of the top pole yoke 21 is
overlapped on the layered structure. In other words, the magnetic
layer of the sub-magnetic pole portion 12B is bigger than that of
the magnetic pole portion 12A in width and thickness, that is, in
volume.
Further, in the embodiment, the edge of the sub-magnetic pole
portion 12B to the air-bearing surface thereof is placed in
vicinity of the edge of the insulating layer 11 closer to the
air-bearing surface thereof, that is, at the throat height 0
position, TH0. The vicinity of the throat height 0 position, TH0,
as used herein refers to the range of plus or minus 0.5 .mu.m of
the throat height 0 position, TH0. The position of the edge closer
to the air-bearing surface of the connecting portion 21A of the top
pole yoke 21 may not be exactly the same as the position of the
edge closer to the air-bearing surface of the sub-pole tip 14.
In the embodiment, the magnetic pole portion 12A which is a
rectangular parallelepiped is perpendicular both to the air-bearing
surface and to the edge surface closer to the air-bearing surface
of the sub-magnetic pole portion 12B. In other words, the magnetic
pole portion 12A and the sub-magnetic pole portion 12B form a
complete convex shape with their plain surfaces. The convex shape
can be obtained by patterning a magnetic layer to the convex shape
at a time by photolithography. However, when the pole portion is
micronized to the order of submicron, the photoresist causes a
considerable deformation of the pattern in its corners.
Accordingly, it is difficult to keep a sharp and accurate convex
shape.
On the other hand, in the embodiment, first, the pole tip 12 is
formed in a micro rectangular parallelepiped and then the sub-pole
tip 14 is placed on the edge opposite to the air-bearing surface of
the pole tip 12, thereby the sub-magnetic pole portion 12B is
formed. Accordingly, it is possible to form the sub-magnetic pole
portion 12B into a sharp and accurate shape without the deformation
of the pattern as described above.
In the embodiment, the width of the pole portion is reduced in two
levels: at the magnetic pole portion 12A and at the sub-magnetic
pole portion 12B. However, the width or thickness of the
sub-magnetic pole portion may be reduced in two or more levels by
applying the method described above repeatedly so as to reduce the
width or thickness of the whole pole portion in multiple levels.
FIG. 15 shows an example of the sub-magnetic pole portion that is
divided into the sub-magnetic pole portions 14a and 14b.
In the embodiment, the sub-magnetic pole portion 12B with the
sub-pole tip 14 is wider and thicker compared to the pole tip 12 of
the magnetic pole portion 12A. According to the embodiment, the
volume of the magnetic layer in vicinity of the throat height 0
position, TH0, can be bigger than the volume of the sub-magnetic
pole portion without the sub-pole tip 14. Also, it is possible to
prevent flux saturation in vicinity of the throat height 0
position, TH0.
As described above, according to the embodiment, the volume of the
sub-magnetic pole portion 12B is bigger than that of the magnetic
pole portion 12A. Therefore, it is possible to obtain the
sufficient over write characteristic even if the pole width is
reduced to the order of half-micron or quarter-micron, for example.
Particularly, at least the magnetic pole portion 12A is formed with
a high saturation flux density material. The flux thus does not
saturate on the way, but effectively reach the magnetic pole
portion 12A. As a result, an efficient recording head can be
achieved.
Second Embodiment
Next, the second embodiment of the invention will be described with
reference to FIGS. 16A and 16B to 20A and 20B. FIGS. 16A, 17A, 18A,
19A and 20A show cross-sectional views vertical to an air-bearing
surface. FIGS. 16B, 17B, 18B, 19B and 20B show cross-sectional
views parallel to the air-bearing surface of a magnetic pole
portion.
In the manufacturing method of a thin film magnetic head according
to this embodiment, the thin film magnetic head is manufactured in
the same steps as in the first embodiment until the sub-pole tip 14
and the pole layer 15 are formed. Then, in this embodiment, an
insulating layer 30 made of alumina, for example, is formed in the
region between the pole tip 12 and the sub-pole tip 14, and the
pole layers 13 and 15, where a thin film coil should be formed. The
thickness of the insulating layer 30 may be 0.1-0.5 .mu.m, for
example. However, the insulating layer 30 is dispensable.
Next, as shown in FIGS. 17A and 17B, a thin film coil 31 for an
inductive recording head is formed on the insulating layer 30 by
plating, for example.
Then, as shown in FIGS. 18A and 18B, an insulating layer 32 made of
alumina, for example, is formed on all over the surface of the
insulating layer 30 and the thin film coil 31. The thickness of the
insulating layer 32 may be 1-6 .mu.m, for example. The insulating
layer 32 is ground and flattened to the surface of the sub-pole tip
14 and the pole layer 15 by CMP, for example. Flattening the
insulating layer 32 leads to the exposure of the surface of the
sub-pole tip 14 and the pole layer 15. Also, the thin film coil 31
between the pole tip 12 and the sub-pole tip 14, and the pole
layers 13 and 15 is buried in the insulating layer 32.
As shown in FIGS. 19A and 19B, a thin film coil 33 is formed on the
insulating layer 32 by plating, for example. Then, the photoresist
layer 34 is formed on the insulating layer 32 and the thin film
coil 33 in a predetermined pattern. A heat treatment of the
temperature of 200-250.degree. C., for example, is applied for
stabilizing the photoresist layer 34.
Further, the top pole yoke 21 for the recording head made of a
magnetic material, for example, is formed on the sub-pole tip 14,
the insulating layer 32, the photoresist layer 34 and the pole
layer 15. The thickness of the top pole yoke 21 may be about 2-3
.mu.m, for example. The top pole yoke 21 has a contact with and is
magnetically coupled to the bottom pole layer 9 through the pole
layers 13 and 15 which are formed on the contact hole 10a in the
rear of the thin film coils 31 and 33.
Next, as shown in FIGS. 20A and 20B, an over coat layer 22, made of
alumina, for example, is formed on the top pole yoke 21. The
thickness of the over coat layer 22 may be 30-40 .mu.m, for
example. At last, an air-bearing surface of the recording head and
a reproducing head is formed through a slider machine processing,
and thus the thin film magnetic head according to this embodiment
is completed.
In the embodiment, the thin film coil 31 is buried in the
insulating layer 32 between the pole tip 12 and the sub-pole tip
14, and the pole layers 13 and 15. The top pole yoke 21 thus has a
smaller difference in height than that of the first embodiment, and
the top pole yoke 21 is micronized to the order of half-micron or
quarter-micron.
In this embodiment, when the thin film coil 31 is buried, the thin
film coil 31 just needs to be buried into the lower part than the
surface of the sub-pole tip 14. Therefore, the film thickness of
the pole tip 12 is not limited by the film thickness of the thin
film coil 31. As a result, the pole tip 12 can be more
micronized.
According to this embodiment, the thick insulating layer 30 is
formed between the thin film coil 31 and the bottom pole layer 9 in
addition to the thin write gap layer 10. Therefore, the insulating
pressure resistance between the thin film coil 31 and the bottom
pole layer 9 is increased, and a leak of the magnetic flux from the
thin film coil 31 is reduced.
Other structures, operations and effects in this embodiment are
identical to those of the first embodiment.
The invention also includes other various modifications, not
limiting to the embodiments. In the embodiment, the insulating
layer 11 for determining a throat height is formed on the write gap
layer 10, and then the pole tip 12 and the sub-pole tip 14 are
formed on the insulating layer 11. However, the pole tip 12 and the
sub-pole tip 14 may be formed on the write gap layer 10 without
forming the insulating layer 11. In this case, the throat height is
determined by the edge opposite to the air-bearing surface of the
pole tip 12.
Each of the embodiments describes the thin film magnetic head
having the structure in which the MR element for reading is formed
closer to the substrate and then the inductive-type transducer
element for writing is stacked on the MR element. However, the
order of stacking may be reversed; the inductive-type transducer
element for writing is formed closer to the substrate, and then the
MR element for reading is stacked on the inductive-type transducer
element. This structure is achieved as follows. A magnetic film
with a function as the top pole layer described in the embodiments
is formed on the substrate, and then another magnetic film with a
function as the bottom pole layer described in the embodiments is
formed faced therewith with a write gap film in between.
Preferably, the top pole layer of the inductive-type transducer
element also functions as the bottom shield layer of the MR
element.
Furthermore, in a different embodiment, all of the insulating
layers formed between each two thin film coils constituting the
coil area of the inductive-type transducer element may be inorganic
insulating layers.
The present invention can be also applied to a thin film magnetic
head, which has only an inductive-type transducer element and
performs writing with the inductive-type transducer element.
As described, according to the thin film magnetic head, or the
manufacturing method of the thin film magnetic head of the
invention, the sub-magnetic pole portion with greater film
thickness and volume than the magnetic pole portion is provided
adjacent to the pole portion. Thus, precise control of the pole
width can be achieved and sufficient over write characteristic can
be obtained even if the pole width of the pole portion is
reduced.
Particularly, according to the thin film head or the manufacturing
method of a thin film magnetic head of one aspect of the invention,
a magnetic layer with a rectangular section is formed as an
magnetic pole portion, and then a part of the magnetic layer
opposite to the surface facing the medium is covered with at least
another magnetic layer, thereby the covered area is used as the
sub-magnetic pole portion. Thus, the pole portion and the
sub-magnetic pole portion can be formed with high precision.
Obviously many modifications and variations of the present
invention are possible in the light of the above teachings. It is
therefore to be understood that within the scope of the appended
claims the invention may be practiced otherwise than as
specifically described.
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