U.S. patent number 5,585,827 [Application Number 08/326,515] was granted by the patent office on 1996-12-17 for printer head.
This patent grant is currently assigned to Sony Corporation. Invention is credited to Takaaki Murakami.
United States Patent |
5,585,827 |
Murakami |
December 17, 1996 |
Printer head
Abstract
In the printer head of this invention, the base component 1 and
the lid component 5 can be easily bonded without clogging the
groove 2 that serves as the ink flow channel. The eutectic alloy
layer 3 is formed by a eutectic reaction on the bonding surface
between the base component 1 having the groove 2 composed of
silicon formed thereon and the lid component 5 having the thin gold
film 4 formed thereon. Therefore, the base component/and the lid
component 5 are bonded to each other.
Inventors: |
Murakami; Takaaki (Kanagawa,
JP) |
Assignee: |
Sony Corporation
(JP)
|
Family
ID: |
17500004 |
Appl.
No.: |
08/326,515 |
Filed: |
October 20, 1994 |
Foreign Application Priority Data
|
|
|
|
|
Oct 29, 1993 [JP] |
|
|
5-271436 |
|
Current U.S.
Class: |
347/64; 347/20;
347/65 |
Current CPC
Class: |
B41J
2/1604 (20130101); B41J 2/1623 (20130101); B41J
2/1629 (20130101); B41J 2/1631 (20130101); B41J
2/1642 (20130101) |
Current International
Class: |
B41J
2/16 (20060101); G01D 015/18 () |
Field of
Search: |
;347/63,64,65,20
;228/123.1,198 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
|
|
|
|
|
|
|
56-93566 |
|
Jul 1981 |
|
JP |
|
63-47631 |
|
Sep 1988 |
|
JP |
|
Primary Examiner: Lund; Valerie A.
Attorney, Agent or Firm: Kananen; Ronald P.
Claims
What is claimed is:
1. A printer head for use in an ink jet printer, comprising:
a base component composed of silicon and having a groove formed in
a surface of said base component, said groove having a silicon
oxide protective layer defining an ink flow channel;
a lid component having a gold film layer on a surface thereof, said
lid component being placed in contact with said base component such
that said gold film layer defines a wall of said ink flow channel;
and
a eutectic bond being formed between said gold film layer and said
surface of said base component by a eutectic reaction between said
gold film layer and the silicon of said base component.
2. The printer head according to claim 1, wherein said silicon base
component is composed of silicon single crystal or heat-resistant
glass.
3. The printer head according to claim 1, wherein said lid
component is composed of silicon single crystal or heat-resistant
glass.
4. The printer head according to claim 1, wherein said thin gold
film is formed on a bonding surface of said lid component.
5. The printer head according to claim 1, wherein said silicon
oxide protective layer is generated on a surface of said
groove.
6. A printer head which is used in an ink jet
printer,comprising:
a base component having a groove formed thereon, wherein a silicon
oxide layer is generated on a surface of said groove; and
a lid component bonded to a surface of said base component on which
said groove is formed;
wherein a eutectic alloy layer generated by a eutectic reaction
between gold and silicon is formed on a bonding surface between
said base component and said lid component, and wherein a thin gold
film is formed on a bonding surface of said lid component, said
thin gold film and said silicon oxide layer of said groove together
defining an ink flow channel of said printer head.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a printer head which is preferably
applicable, for example, to an ink jet printer, and a method for
manufacturing thereof.
2. Description of the Related Art
FIG. 1 is a front view showing a construction of one example of a
conventional ink jet printer head disclosed in Japanese Patent
Publication No. 47631/1988 (Japanese Patent Laid-Open No.
93566/1981). A base component 1 is composed of, for example, glass,
metal, silicon (hereinafter referred to as "Si"), and the like. On
the upper surface of the base component 1, fine grooves (recessed
portions) 22 are formed by a technique such as cut processing using
a microcutter, and etching processing. On the surface on which the
grooves 22 of the base component 1 are formed, a lid component 5
made of glass is bonded by a fluid adhesive 21 such as epoxy resin
21 adhesive coated on the projecting portion. Thus, the grooves 22
form an ink flow channel.
In the head as constituted above, the ink is discharged through the
grooves (ink flow channel) 22 to adhere to the printing paper, so
that printing is performed.
The ink discharge method is divided roughly into two types; an
electric machine conversion method and a heating evaporation
method.
When the electric machine conversion method is applied for the ink
discharge method, a piezoelectric element (electric distortion
element) is bonded and fixed on the upper surface of the lid
component 5. Then, in such a case, the lid component 5 serves as an
oscillation plate, which is distorted by the piezoelectric element
to the side of the grooves (ink flow channel) 22 to reduce the
volume. Thereby pressure is generated in the grooves (ink flow
channel) 22 so that the ink is discharged with the pressure.
Incidentally, some heads available for electric machine conversion
method have a construction in which the piezoelectric element and
the ink directly contact each other instead of a head which has a
construction in which the piezoelectric element generates pressure
in the groove 22 via the lid component 5.
In addition, when heating evaporation method is adopted as the ink
discharge method, a heating element is formed at a predetermined
position in the grooves 22 formed on the base component 1 before
the lid component 5 is bonded to the base component 1. Then, in
such a case, a bubble is generated in the ink inside of the groove
(ink flow channel) by heating the heating element to discharge the
ink with the pressure of the bubble.
In the aforementioned ink jet printer head, the size of the grooves
22 formed on the base component 1 must be miniaturized to enable to
obtain a higher resolution and higher quality in the printing
result.
In addition, recently, a multiple nozzle head, namely the head
provided with a plurality of grooves 22 for discharging ink, as
shown in FIG. 1, has been used as the representative style of head.
It is needed that not only the size of the grooves are made smaller
but also the pitch, or distance between the grooves 22, is made
smaller to attain higher resolution and higher quality.
However, when the size of the grooves 22 and the size of the pitch
are made smaller, there arises a problem in which it becomes
difficult to bond the base component 1 and the lid component 5 by a
fluid adhesive 21.
Namely, in such a case, bonding conditions for bonding the base
component 1 and the lid component 5, such as the coating amount of
the adhesive 21 and the bond pressure, becomes very delicate, so
that a high-level technique is needed. Moreover, when the bonding
conditions do not meet the actual situation, a non-cured adhesive
agent 21 flows into the grooves 22 where the adhesive agent is
cured to clog the grooves 22.
SUMMARY OF THE INVENTION
In view of the foregoing, an object of this invention is to provide
a printer head and a method for manufacturing thereof in which the
lid component is easily bonded to the base component on which fine
grooves are formed, without clogging the grooves.
The foregoing object and other objects of the invention have been
achieved by the provision of the printer head used for an ink jet
printer, comprising the base component 1 having a groove 2 formed
and the lid component 5 fixed by bonding on the surface of the base
component 1 on which the grooves are formed, in which an eutectic
alloy layer 3 generated by the eutectic reaction is formed on the
bonding surface of the base component 1 and the lid component
5.
In this printer head, it can be realized that the eutectic alloy
layer 3 is generated by the eutectic reaction between gold and
silicon.
The method for manufacturing the printer head of the present
invention is a method for manufacturing the printer head used for
the ink jet printer, comprising process for forming the groove 2 on
the base component 1 and process for forming the eutectic alloy
layer 3 by the eutectic reaction between the lid component 5 and
the surface of the base component 1 on which the groove 2 is
formed, and for bonding the base component 1 and the lid component
5.
The nature, principle and utility of the invention will become more
apparent from the following detailed description when read in
conjunction with the accompanying drawings in which like parts are
designated by like reference numerals or characters.
BRIEF DESCRIPTION OF THE DRAWINGS
In the accompanying drawings:
FIG. 1 is a front view showing the construction of an example of
the conventional ink jet printer head;
FIG. 2 is a perspective view showing the construction of one
embodiment of the ink jet printer head according to the present
invention;
FIG. 3 is a front view of the embodiment shown in FIG. 2;
FIGS. 4A to 4G are views explaining a method for manufacturing the
ink jet printer head of the embodiment shown in FIG. 2;
FIG. 5 is a view showing an equilibrium state of the Au-Si
system;
FIGS. 6A and 6B are views showing a state in which the base
component 1 and the lid component 5 are bonded in the case of
manufacturing a multiple-nozzle head; and
FIG. 7 is a view showing the state of equilibrium of the Al-Si
system.
DETAILED DESCRIPTION OF THE EMBODIMENT
Preferred embodiments of this invention will be described with
reference to the accompanying drawings:
FIG. 2 is a perspective view showing the construction of the ink
jet printer head, which is applied as the printer head of the
present invention, according to one embodiment of the present
invention, and FIG. 3 is a front view thereof. Incidentally, the
same numerals designate parts in FIGS. 2 and 3 corresponding to
parts in FIG. 1.
A base component 1 is composed of, for example, a single crystal of
Si (110). On the upper surface thereof, for example, a recessed
groove 2 is formed which have a size on the order of, for example,
about 20 or 30 [.mu.m].times.20 or 30 [.mu.m]. On the surface of
the groove 2, a silicon oxide layer 2A composed of SiO.sub.2 is
formed. On the upper surface of the base component 1, a lid
component 5 is provided in which a thin gold film layer 4 is formed
on the plane being opposite to the base component 1 via an eutectic
alloy layer 3 as follows, therefore the groove 2 formed on the base
component 1 forms an ink flow channel.
Then, on the surface on which the portion of the upper surface of
the base component 1 where Si is exposed (excluding the groove 2
and the silicon oxide layer 2A formed on the groove 2) and the thin
gold film layer 4 formed on the lid component 5 are contacted, the
eutectic alloy layer 3 (the eutectic alloy of gold and Si) is
formed which is generated by the eutectic reaction between gold and
Si.
In the ink jet printer head constituted described above, for
example, the ink (not shown) is discharged via the groove (ink flow
channel) 2 by the electric machine conversion method or the heating
evaporation method to be stuck onto printing paper, so that the
printing is performed.
In this ink jet printer head, since the portion contacting the ink
is the thin gold film 4 formed on the lid component 5 and the
silicon oxide layer 2A, the printer is excellent in drug
resistance. For example, alkaline ink can be used.
Next, following explanation is the method for manufacturing the ink
jet printer head will be explained referring to FIGS. 4A to 4G. At
the outset, as shown in FIG. 4A, a silicon nitride film (Si.sub.3
N.sub.4 film) 11 is formed by CVD (chemical vapor deposition) and
the like on the upper surface of the base component 1 composed of
single crystal of Si (110). The silicon nitride film 11, it is to
be noted as follows, is used as an etching mask.
Then, of the silicon nitride film 11 formed on the upper surface of
the base component 1, a portion corresponding to the groove 2
(shown in FIGS. 2 and 3) is removed by, for example, photoetching
by heated phosphoric acid. Consequently, the base component (Si) 1
is exposed (FIG. 4B). Furthermore, wet etching by, for example, a
solution of potassium hydroxide is applied to the exposed portion
of the base component 1, thereby the groove 2 is formed (FIG. 4C).
At that time, the silicon nitride film 11 explained in FIG. 4A
functions as an etching mask.
Next, the groove 2 formed in the above manner is undergone the
thermal oxidation and a silicon oxidation layer 2A is formed on the
surface thereof (FIG. 4D). Consequently, the ink does not come into
contact with the silicon itself which constitutes the base
component 1 and flows in the groove 2. Therefore, the reduction in
fluidity caused by water repellency of silicon, the corrosion of
silicon by the ink, and the like can be prevented. Consequently,
the silicon oxide layer 2A serves as a protective film.
Thereafter, as shown in FIG. 4E, only the silicon nitride film 11
formed on the upper surface of the base component 1 is removed by
using, for example, heated phosphoric acid, leaving the silicon
oxide layer 2A remaining.
Then, as shown in FIG. 4F, one surface of the lid component 5 on
which a thin gold film 4 is formed is brought into contact with the
base component 1 so that the thin gold film 4 is confronted to the
surface on which the groove 2 is formed. It is to be noted that the
lid component 5 is composed of, for example, a heat resistant
glass, such as Pyrex.RTM. glass and the like, and one surface
thereof is ground and the thin gold film 4 is formed by vapor
deposition and so
After the lid component 5 is brought into contact with the base
component 1, namely after the thin gold film 4 formed on the lid
component 5 is brought into contact with Si exposed on the upper
surface of the base component 1, pressure is applied thereto. Then,
it is heated at about 400 [.degree. C.], for example, in the
inactivated gas atmosphere such as nitrogen gas and argon gas
during scrubbing (rubbing).
Then, between the thin gold film 4 and the upper surface of the
base component 1 contacting each other, namely between gold and Si,
the eutectic crystal reaction proceeds to form a eutectic alloy
layer 3 and to form a fused state. When the eutectic alloy layer 3
is cooled down, it hardens, namely, the portion at which the thin
gold film 4 formed on the lid component 5 contacts the base
component 1 except for the groove 2 is made into selectively
eutectic alloy. This allows the base component 1 and the lid
component 5 to be strongly bonded without clogging the groove 2
(FIG. 4G).
Here, FIG. 5 shows the equilibrium state of the gold(Au)-Si system.
As is apparent from FIG. 5, since Au and Si have a melting point of
1,063 [.degree. C.] and 1,404 [.degree. C.], respectively, these
metals are not molten at 400 [.degree. C.]. However, since Au-31
at. % Si has a melting point of 370 [.degree. C.] at the eutectic
point, the eutectic reaction occurs during heating at 400 [.degree.
C.] at the interface of Au/Si. This forms an eutectic alloy of Au
and Si at the contact portion of the thin gold film 4 and the base
component 1 to generate a fused state.
As described above, an example is shown herein below in a case
where the base component 1 and the lid component 5 are bonded with
the eutectic alloy layer 3.
______________________________________ Heating temperature about
400 [.degree.C.] Applied Pressure about 50 to 150 [g] Scrub time
about 1 to 3 [sec] Scrub cycle about 5 to 30 times Scrub
Oscillation about several to more than tens [.mu.m] Inactivated gas
atmosphere about 2 to 10 [l/min]
______________________________________
In this manner, a case has been explained in which the present
invention has been applied to a single-nozzle ink jet printer head.
However, the present invention is not only limited to this, but can
be applied to a case of a multiple-nozzle head having a plurality
of nozzles. FIGS. 6A and 6B show a state where the base component 1
is bonded to the lid component 5 when a multiple-nozzle head
having, for example, three grooves (nozzles) 2-1 or 2-3 is
manufactured. Incidentally, referring to FIGS. 6A and 6B, all the
portions of the thin gold film 4 which contacts with the portion of
the base component 1 except for the grooves 2a, 2b, and 2c are
regarded as the eutectic alloy layer 3.
Furthermore, a method for bonding by the eutectic reaction
described in this embodiment can be applied not only when the base
component 1 and the lid component 5 are bonded, but also to other
situations. Namely, in the head shown in FIGS. 1, 2, and 3, an
orifice plate is usually provided on a surface to which ink is
discharged: This method can be applied in a case where the orifice
plate and the head are bonded. In this case, if the orifice plate
is formed of, for example, nickel and the like, it can be proper to
have the orifice plate contact the head after an Au thin film is
formed.
Furthermore, in this embodiment, silicon single crystal or heat
resistant glass, such as Pyrex glass, is used as the base component
1 or the lid component 5. However, this invention is not limited to
this.
In other words, as the base component 1, the materials such as
stainless steel and so on can be used on which a thin silicon film
layer can be formed by some methods (for example, CVD standing for
plasma chemical vapor deposition and the like) using some material,
and have heat resistance against the melting point at the eutectic
point of silicon and gold. In addition, as the lid component 5, the
materials for example, silicon or metal can be used on which can
form a thin gold film by some methods, and has heat resistance
against the melting point at the eutectic point of silicon or
gold.
Furthermore, in this embodiment, the thin gold film 4 is formed on
the lid component 5 by vapor deposition. However, the present
invention is not only limited to this, but, for example, the thin
gold film 4 can be formed on the lid component 5 by plating or some
other methods. In the case of plating, after the lid component 5
formed of the heat-resistant glass is plated with nickel, it may be
further plated with gold by electrolysis.
In this embodiment, the eutectic alloy layer 3 is formed of Au and
Si. However, the present invention is not only limited to this, but
the eutectic alloy layer may be formed of such a metal as Sn (tin)
and Pb (lead), Au and Ge (germanium), Au and Sn, or Al (aluminum)
and Si, each having a melting point of 183 [.degree. C.], 356
[.degree. C.], 280 [.degree. C.], or 577 [.degree. C.] respectively
at the eutectic point.
Provided that, in this case, each thin film can be formed on the
base component 1 and the lid component 5 by vapor deposition or
plating, and the base component 1 and the lid component 5 have heat
resistance against the melting point at the eutectic point.
Furthermore, many substances can be used for the two materials
forming the eutectic alloy layer 3. However, if the difference
between the melting point of each of the single material and the
melting point at the eutectic point is small, temperature control
must be accurately performed during the heating operation. Thus, a
larger difference between them is preferable.
More specifically, the equilibrium state of the aforementioned
Al-Si system becomes like that shown in FIG. 7, which shows that
the melting point of a single substance, Al or Si, is 660 [.degree.
C.] or 1,404 [.degree. C.] respectively, and the melting point at
the eutectic point is 577 [.degree. C.]. In this case, the
difference between the melting point of a single substance Al and
the melting point at the eutectic point is small, probably only
about 8.3 [.degree. C.]. Thus, it is necessary to control the
temperature at heating so that the temperature exceeds 577
[.degree. C.] without exceeding 660 [.degree. C.,], which means the
scope of allowable error for temperature control is narrow.
Consequently, when the accuracy of temperature control is low, the
eutectic reaction does not take place, and a single substance such
as Al may be melted in some cases, although this is
undesirable.
It is to be noted that, in the case of the combination of Au and Si
described in the embodiment, even the smaller difference, between
the melting point of Au single substance and the melting point at
the eutectic point of Au and Si, is about 693 [.degree. C.], which
is sufficiently large. Consequently, the temperature control can be
simple compared with the combination of Al and Si.
Furthermore, in this embodiment, when the base component 1 and the
lid component 5 are bonded, two components are heated while
scrubbing, but scrubbing may not be performed. However, heating
accompanied by scrubbing further promotes the eutectic
reaction.
Still furthermore, the present invention can be applied to any type
of ink jet printer head such as a bubble jet type of edge-shooter
or side shooter and the like. Furthermore, the present invention
can be applied to another type of printer head constructed by
bonding the lid component to the base component, in addition to the
ink jet printer head.
It is to be noted that the melting points of the Si single
substance in FIGS. 5 and 7 are not equal. This is because
conditions such as air pressure and the like are different when the
melting point is examined.
As described above, in accordance with the printer head of the
present invention and the method for manufacturing thereof, the
base component having a groove formed thereon is bonded to the lid
component by forming the eutectic alloy layer by the eutectic
reaction. Consequently, the base component and the lid component
can be easily bonded without clogging the groove.
Furthermore, in accordance with the present invention, the eutectic
alloy layer can be generated by eutectic reaction between gold and
silicon, so that the resistance against corrosion can be
improved.
While there has been described in connection with the preferred
embodiments of the invention, it will be obvious to those skilled
in the art that various changes and modifications may be made
without departing from the true spirit and scope of the invention.
It is aimed, therefore, to cover in the appended claims all such
changes and modifications as fall within the true spirit and scope
of the invention.
* * * * *