U.S. patent number 5,127,071 [Application Number 07/667,301] was granted by the patent office on 1992-06-30 for optical module including receptacle, and method of producing the same.
This patent grant is currently assigned to Sumitomo Electric Industries, Ltd.. Invention is credited to Hisao Go.
United States Patent |
5,127,071 |
Go |
June 30, 1992 |
Optical module including receptacle, and method of producing the
same
Abstract
An optical module comprises at least one optical sub-module
having at least one optical connector for receiving an end portion
of an optical fiber at an end portion of the optical connector so
as to optically couple the end portion of the optical fiber with an
optical operation element, and a molded resin member for holding
the optical connector except for the end portion of the optical
connector; and at least one receptacle for enveloping the end
portion of the optical connector to integrally hold the optical
sub-module, the receptacle having an opening portion for fitting
with an optical plug holding the end portion of the optical fiber
which is to be received by the optical connector. The receptacle is
resin-molded by using a mold die including a core for forming an
opening portion of the optical module, the core having at least one
hold portion for holding a portion of the optical sub-module.
Inventors: |
Go; Hisao (Kanagawa,
JP) |
Assignee: |
Sumitomo Electric Industries,
Ltd. (Osaka, JP)
|
Family
ID: |
26403011 |
Appl.
No.: |
07/667,301 |
Filed: |
March 12, 1991 |
Foreign Application Priority Data
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Mar 13, 1990 [JP] |
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2-61920 |
Mar 13, 1990 [JP] |
|
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2-61921 |
|
Current U.S.
Class: |
385/73 |
Current CPC
Class: |
B29C
70/68 (20130101); G02B 6/4246 (20130101); G02B
6/4292 (20130101); B29L 2031/3406 (20130101); H01L
2224/48091 (20130101); H01L 2924/19105 (20130101); H01L
2224/48227 (20130101); H01L 2224/48091 (20130101); H01L
2924/00014 (20130101) |
Current International
Class: |
B29C
70/68 (20060101); B29C 70/00 (20060101); G02B
6/42 (20060101); G02B 006/00 (); G02B 006/36 () |
Field of
Search: |
;350/96.18-96.21,96.24 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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0183857 |
|
Jun 1986 |
|
EP |
|
0273364 |
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Jul 1988 |
|
EP |
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58-4952 |
|
Jan 1983 |
|
JP |
|
59-119774 |
|
Jul 1984 |
|
JP |
|
59-205775 |
|
Nov 1984 |
|
JP |
|
8810441 |
|
Dec 1988 |
|
WO |
|
9000753 |
|
Jan 1990 |
|
WO |
|
9004799 |
|
May 1990 |
|
WO |
|
630760 |
|
Jun 1982 |
|
CH |
|
2126795 |
|
Mar 1984 |
|
GB |
|
Primary Examiner: Ullah; Akm E.
Attorney, Agent or Firm: Cushman, Darby & Cushman
Claims
What is claimed is:
1. An optical module comprising:
an optical sub-module member having an optical connector means,
said optical connector means including an optical operation element
and an end portion, said end portion of said optical connector
means including means for receiving an optical fiber so as to
optically couple said optical fiber with said optical operation
element, said optical connector means integrally held by a molded
resin member except for said end portion of said optical connector
means; and
a receptacle means for enveloping said end portion of said optical
connector means to integrally hold said optical sub-module member,
said receptacle means including an opening portion operatively
associated with an optical plug, said optical plug holding said end
portion of said optical fiber, said optical fiber to be received by
said optical connector means.
2. An optical module as claimed in claim 1, wherein said optical
sub-module member comprises a single optical sub-module having a
plurality of optical connector means, and wherein said receptacle
means holds said optical sub-module integrally so as to envelope
the entirety of said optical connector means.
3. An optical module as claimed in claim 1, wherein said optical
sub-module member comprises a plurality of optical sub-modules each
having an optical connector means, and wherein said receptacle
means holds said optical sub-modules integrally so as to envelope
the entirety of said optical connector means.
4. An optical module as claimed in claim 1, wherein said optical
sub-module member comprises a single optical sub-module having an
optical connector means, and wherein said receptacle means holds
said optical sub-module integrally so as to envelope the entirety
of said optical connector means.
5. An optical module as claimed in claim 1, wherein said optical
sub-module member comprises a single optical sub-module having an
optical connector means, and wherein said receptacle means holds
said optical sub-module integrally so as to envelope a portion of
said optical connector means.
6. An optical module as claimed in claim 1, wherein said receptacle
means comprises a plurality of receptacles and said optical
sub-module member comprises a single optical sub-module having a
plurality of optical connector means, and wherein said receptacles
integrally hold said optical sub-module such that each of said
receptacles envelopes a portion of each of said optical connector
means.
7. An apparatus for producing an optical module as claimed in claim
1, comprising:
a mold die for resin-molding said receptacle means;
wherein said mold die includes a core for forming said opening
portion, said core having at least one hold portion formed in said
core for holding a portion of said optical sub-module member.
8. An apparatus as claimed in claim 7, wherein said hold portion
holds said molded resin member of said sub-module member.
9. An apparatus as claimed in claim 7, wherein said hold portion
holds said end portion of said optical connector means of said
sub-module member.
10. An apparatus as claimed in claim 7, wherein said hold portion
includes at least one aligning ferrule.
11. A method of producing an optical module, comprising the steps
of:
forming an optical sub-module member including an optical connector
means having an end portion for receiving an optical fiber member,
and having an optical operation element, so that said optical
connector means is held except for said end portion by molding
resin constituting a molded resin member, said end portion of said
optical connector means so disposed so as to optically couple said
optical fiber member with said optical operation element;
forming, through resin molding, a receptacle means for enveloping
said end portion of said optical connector means to hold said
optical sub-module member, said receptacle means including an
opening portion operatively associated with an optical plug, said
optical plug holding said optical fiber member to be received by
said optical connector means.
12. A method of producing an optical module as claimed in claim 11,
wherein said optical sub-module member comprises a single optical
sub-module having a plurality of optical connector means, and
wherein said receptacle means holds said optical sub-module
integrally so as to envelope the entirety of said optical connector
means.
13. A method of producing an optical module as claimed in claim 11,
wherein said optical sub-module member comprises a plurality of
optical sub-modules each having an optical connector means, wherein
said receptacle means holds said optical sub-modules integrally so
as to envelope the entirety of said optical connector means.
14. A method of producing an optical module as claimed in claim 11,
wherein said optical sub-module member comprises a single optical
sub-module having an optical connector means, wherein said
receptacle means holds said optical sub-module integrally so as to
envelope the entirety of said optical connector means.
15. A method of producing an optical module as claimed in claim 11,
wherein said optical sub-module member comprises a single optical
sub-module having an optical connector, wherein said receptacle
means holds said optical sub-module integrally so as to envelope a
portion of said optical connector means.
16. A method of producing an optical module as claimed in claim 11,
wherein said receptacle means comprises a plurality of receptacles
and said optical sub-module member comprises a single optical
sub-module having a plurality of optical connector means, wherein
said receptacles integrally hold said optical sub-module such that
each of said receptacles envelopes a portion of each of said
optical connector means.
17. A method of producing an optical module as claimed in claim 11,
wherein said receptacle means is formed through a mold die
including a core for forming said opening portion, said core having
at least one hold portion formed in said core for holding a portion
of said optical sub-module member.
18. A method of producing an optical module as claimed in claim 17,
wherein said hold portion holds said molded resin member of said
sub-module member.
19. A method of producing an optical module as claimed in claim 17,
wherein said hold portion holds said end portion of said optical
connector means of said sub-module member.
20. A method of producing an optical module as claimed in claim 17,
wherein said hold portion includes at least one aligning ferrule.
Description
RELATED APPLICATIONS
This application is directed to subject matter that is generally
related to the subject matter disclosed in the following U.S.
applications:
1) U.S. application Ser. No. 07/573,583;
2) U.S. application Ser. No. 07/670,421; and
3) U.S. application Ser. No. 07/588,990.
BACKGROUND OF THE INVENTION
The present invention relates to an optical module for use in an
optical communication system using light as an information
transmitting medium, such as data link, optical LAN, and so on, and
a method of producing the same. In the following description, the
optical module comprises at least one sub-module having at least
one optical connector, which is fitted in a ferrule of an optical
plug and to which an optical operation element (light emitting
element or light receiving element) is fixed, and at least one
receptacle fitted to the optical plug to prevent the plug from
falling off.
Conventionally, an optical module having a plurality of optical
connectors (a multi-core optical module) has been produced in such
a manner that after single-core optical sub-modules each for
optically coupling an optical operation element and an optical
fiber with each other have been produced, plural ones of the thus
produced single-core optical sub-modules are combined.
Those single-core optical sub-modules may be classified into two,
one being a transmitting module using a light emitting element such
as a light emitting diode as an optical operation element, the
other being a receiving module using a light receiving element such
as a pin photo-diode as an optical operation element.
FIG. 1 shows an example of the structure of a conventional
single-core optical sub-module. As shown in FIG. 1, in the
conventional single-core optical sub-module, an optical operation
element (light emitting or light receiving element) 2 is fixed by
an adhesive or the like to an optical connector 1 to be fitted in a
ferrule (not shown) which is fixed to an end portion of an optical
fiber (not shown), after adjusting its optical axis. The optical
connector 1 to which the optical operation element 2 is fixed, is
fixed to a ceramic package 3 by an adhesive agent or the like. To
the ceramic package 3, in addition to the optical connector 1,
fixed is a substrate 6 supporting an electronic circuit portion
constituted by electronic circuit parts such as a bare chip IC 5
and so on. The bare chip IC 5 and the like mounted on the substrate
6 together with wires connecting them to a wiring pattern on the
substrate 6 are sealed by a lid 7 made of kovar etc. In addition,
in the ceramic package 3, provided are lead pins 8 constituted by
inner leads 8a and outer leads 8b respectively erected from the
inner and outer sides of the package. After the inner leads 8a and
the electronic circuit portion on the substrate 6 are electrically
connected with each other and the electronic circuit portion and
terminals of the optical operation element 2 are also electrically
connected with each respectively by wire bonding or the like, a
cover 10 is fixed to the ceramic package 3 to thereby constitute a
single-core optical sub-module.
A plurality of single-core optical sub-modules 11 constituted as
described above are assembled to a receptacle 12 as shown in FIGS.
2 and 3 to thereby form a conventional multi-core optical
module.
However, the single-core optical sub-module is, as described above,
constituted by a number of parts and made up by assembling the
respective constituent parts one by one. Therefore, the process of
assembling has been complicated and the number of steps required
therefor has been large. In addition, since expensive material such
as ceramic and so on has been used, reduction of cost or
mass-production of the single optical sub-modules has been
difficult. In such a circumstance, it has been also difficult to
reduce the cost of or to perform mass-production of multi-core
optical modules which are constituted by combining a plurality of
such single-core optical sub-modules.
In addition, a multi-core optical module is attached/detached
to/from a multi-core plug having a plurality of ferrules 13 in the
receptacle 12 in practical use, and, therefore, a high positioning
accuracy is required in attaching the single-core optical
sub-modules 11 to the receptacle 12.
That is, if the positioning accuracy is insufficient, smooth
attachment/detachment will be impossible, and in the worst case,
abrasion or breakage of the ferrules 13 or the optical connectors 1
will be caused. Conventionally, it has been therefore necessary
that the assembling portions of the single-core optical module 11
and the receptacle 12, at which the module 11 is coupled to the
receptacle 12, are formed with high dimensional accuracy, and when
they are assembled with each other, an alignment tool 15 having
aligning ferrules 13, the number of which is the same as that of
the optical connectors to be provided in a multi-core optical
module to be produced, has been used as shown in FIGS. 2 and 3 to
thereby perform accurate positioning. Therefore, together with the
reason that the multi-core optical module is constructed by
combining single-core optical sub-modules which are difficult to be
reduced in their price and to be produced through mass production,
it has been very difficult to reduce the price of the multi-core
optical modules or to produce them through mass production.
In addition, as shown in FIG. 4, when a multi-core optical module
which has been formed through accurate positioning in the
above-mentioned manner, is mounted on a printed circuit board 16 by
screwing, solder reflowing, or the like, there is a case where the
relative positional relationship between the single-core optical
sub-modules constituting the multi-core optical module or between
the receptacle 12 and each of the single-core optical sub-modules
becomes wrong. To prevent this, the expensive aligning tool 15 must
be left in such a state that it is attached to the multi-core
optical module until the mounting of the multi-core optical module
is finished. Accordingly, the workability in mounting has been
poor.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to solve the
foregoing problems and to make it possible to provide an optical
module at a low price through mass production. It is another object
of the present invention to provide an optical module having
superior workability in mounting.
In order to attain the foregoing objects, according to the present
invention, at least one optical connector is held by a molded resin
member except for an end portion thereof at which an end portion of
an optical fiber is to be received, to thereby form an optical
sub-module, and at least one optical sub-module is integrally held
by a receptacle having an opening portion to be fitted with an
optical plug which holds the end portion of the optical fiber.
According to the above configuration it is possible to reduce the
number of parts constituting the optical module.
The optical module according to the present invention is formed by
using a mold die for resin molding. The mold die includes a core
for forming the opening portion of the receptacle, the core having
at least one hold portion holding the end portion of the optical
connector.
By using the mold die, the relative positional accuracy between the
opening portion of the receptacle and the optical connector can be
improved since the accuracy is determined by the dimensional
accuracy realized in the mold die.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an exploded diagram illustrating a conventional
single-core optical sub-module;
FIGS. 2 and 3 are diagrams illustrating a conventional multi-core
optical module and an aligning tool;
FIG. 4 is a diagram illustrating a process to mount a conventional
multi-core optical module on a printed circuit board;
FIG. 5 is a perspective view illustrating a multi-core optical
module according to a first embodiment of the present invention
applied to a two-core light transmitting/receiving module;
FIG. 6 is a partially sectional perspective view illustrating a
state of parts constituting a two-core optical sub-module before
being resin-molded;
FIG. 7 is a perspective view illustrating a state of parts
constituting a two-core optical sub-module after being
resin-molded;
FIG. 8 is a perspective view illustrating a mold die used for
producing a two-core sub-module;
FIG. 9 is an exploded diagram illustrating a mold die for forming a
receptacle used for producing a two-core light
transmitting/receiving module;
FIGS. 10(a) and 10(b) are perspective views illustrating a part of
a core of the mold die shown in FIG. 9 for forming a receptacle
opening portion;
FIG. 11 is a perspective view illustrating a multi-core optical
module according to a second embodiment of the present invention
applied to a two-core light transmitting/receiving module;
FIG. 12 is an exploded diagram illustrating a receptacle forming
mold die used for producing a multi-core optical module; and
FIG. 13(a) and 13(b) are perspective views illustrating a part of a
core of the mold die shown in FIG. 12 for forming an opening
portion of a receptacle.
FIGS. 14, 15 and 16 are perspective views illustrating optical
modules according to a third, a fourth and a fifth embodiments of
the present invention, respectively.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
A first embodiment of the present invention will be described with
reference to FIGS. 5 to 10.
FIG. 5 shows a multi-core optical module according to the first
embodiment of the present invention when applied to a two-core
light transmitting/receiving module. In the illustrated two-core
light transmitting/receiving module, a two-core optical sub-module
20 having two optical connectors is formed so as to be integrally
held by a receptacle 21 of mold resin. As also shown in FIGS. 6 to
8, the parts constituting the two-core optical sub-module 20, such
as optical connectors 22, lead pins 23 etc., are integrally held by
a molded resin member 25 of mold resin to thereby form the two-core
optical sub-module 20. The optical connectors 22 are held by the
molded resin member 25 so that their end portions at which optical
fibers (not-shown) are to be received, are projected outside, and
the two-core optical sub-module 20 is integrally held by the
receptacle 21 so that the end portions of the optical connectors 22
are enveloped in the receptacle 21. In the two-core optical
sub-module 20 of the illustrated embodiment, a light emitting
element is fixed to one of the two optical connectors and a light
receiving element is fixed to the other optical connector. However,
in the present invention, the multi-core optical sub-module may
have only light emitting elements or only light receiving
elements.
In the receptacle 21, an opening portion 21a is formed so as to
open at the side thereof opposite to the side at which the two-core
optical sub-module 20 is held. End portions of two optical fibers
are held by an optical plug which is to be fitted into the opening
portion 21a. Therefore, when the optical plug is inserted and
fitted into the opening portion 21a, the optical fiber end portions
are received by the end portions of the optical connectors 22
enveloped by the receptacle 21 so that the optical fiber end
portions are optically coupled with the optical operation elements
respectively fixed to the optical connectors 22. Latch holes 21b
are opened in the portions aside the opening portion 21a, and when
the optical plug is fitted into the opening portion 21a, elastic
projections formed in the side portions of the optical plug are
engaged thereto, so that the optical plug is held so as not to be
detached from the receptacle 21. In the receptacle 21, integrally
held are stud pins 26 for fixing the receptacle 21 to a printed
circuit board or the like.
Next, a process of producing the two core light
transmitting/receiving module shown in FIG. 5 will be described
with reference to FIGS. 6 to 10.
FIG. 6 shows a state of the constituent parts such as optical
connectors 22 constituting the two-core optical sub-module 20
before resin molding, and FIG. 7 shows a state of the constituent
parts such as optical connectors 22 constituting the two-core
optical sub-module 20 after resin molding.
The above-mentioned two-core optical module is produced in such a
manner that the two-core optical sub-module 20 is produced and then
the receptacle 21 is produced with the two-core optical sub-module
20 as an insert part. The two-core optical sub-module 20 is
produced, for example, in a manner as follows.
First, as shown in FIG. 6, a light emitting diode 27 and a
photo-diode 28 are respectively fixed to the optical connectors 22
by welding or the like after adjusting their optical axis.
Next, a lead frame 30 is prepared. The lead frame 30 is constituted
by lead pins 23, a frame portion 30a for supporting those pins, and
a substrate portion 30b supported by those parts. An insulating
film of alumina (Al.sub.2 O.sub.3) or the like is formed on the
surface of the substrate portion 30b of the lead frame, and a
conductive wiring pattern including a bonding pad, being made of
aluminum or the like, is formed on the insulating film. On the
substrate portion 30b on which the wiring pattern is formed,
electronic circuit parts such as a bare chip IC etc. are mounted,
and the electronic circuit parts are connected with the wiring
pattern by wire bonding, thereby constituting an electronic
circuit. After mounting the electronic circuit parts on the
substrate portion 30b, the optical operation elements (the light
emitting diode 27 and the photo-diode 28) fixed to the optical
connectors 22 and the lead pins 23 are connected to the electronic
circuit by wires.
After attaching the constituent parts of the two-core optical
sub-module 20 to the lead frame 30 in such a manner as above, those
parts such as the lead frame 30 are put, as they are, into a
transfer molding mold die which will be described later, and
molding resin is poured into this mold die, so that the parts,
except for end portions of the optical connectors and parts of the
lead pins as outer leads, are integrally held by the molding resin
to thereby form the two-core optical sub-module 20 as shown in FIG.
7. As the molding resin to be poured into the mold die, it is
preferable to use poly-phenylene-sulfide (PPS) or epoxy resin
having a high dimensional stability.
FIG. 8 shows an example of the transfer molding mold die by which
the two-core optical sub-modules can be formed at the same time. As
illustrated, the mold die is constituted by an upper mold 35 and a
lower mold 36. In the surfaces of the upper and lower molds 35 and
36 opposite to each other, two cavities 35a and 36a are formed
respectively and a pair of semi-cylindrical recess portions 35b and
36b are formed so as to communicate with the respective cavities.
When the parts such as the lead frames 30 are inserted between the
upper and lower molds 35 and 36 so as to be attached into the mold
die, the end portions of the optical connectors 22 for receiving
optical fiber end portions are to be fitted tightly into these
recess portions 35b and 36b. That is, the pair of optical
connectors 22 are fitted into the recess portions 35b and 36b so
that the positional relationship between the optical connectors 22
relative to each other can be determined accurately. The technical
level of producing the mold dies has reached the degree which makes
it possible to realize a very high dimensional accuracy, so that
the dimensional accuracy and so on required between the pair of
optical connectors 22 provided in the two-core optical sub-module
20 can be sufficiently satisfied.
Therefore, if the recess portions 35b and 36b are formed with the
dimensional accuracy required for the relative positional
relationship and so on between the pair of optical connectors 22
provided in the two-core optical sub-module 20, the two-core
optical sub-module 20 with a high dimensional accuracy can be
produced by fitting the parts such as the lead frame 30 into the
mold die and by pouring molding resin into the cavities in the mold
die to perform molding.
By producing the two-core optical sub-module in such a manner as
described above, it is possible to omit the conventional process of
once producing single-core optical sub-modules and then combining
the thus prepared single core optical sub-modules to thereby
produce the multi-core optical module.
In addition, the molding resin molded by transfer molding has a
high sealing property because of being formed under a high pressure
in the same manner as in the general case of sealing an IC or the
like. It is therefore unnecessary to use a lid or cover which has
been conventionally used for sealing a bare chip IC and so on in
producing single-core optical sub-modules. Further since packaging
can be performed with resin which is more inexpensive than ceramics
or the like which has been used in a conventional package, it is
possible to reduce the packaging cost in a large degree.
After the two-core optical sub-module 20 is resin molded in the
above-mentioned manner, unnecessary parts of the lead frame 30 are
cut off by a press machine or the like, the two-core optical
sub-module 20 is fitted as an insert part into a mold die for
forming a receptacle which will be described later, molding resin
is poured into this mold die for molding a receptacle to thereby
form the receptacle 21 integrally holding the two-core optical
sub-module 20, and a two-core light transmitting/receiving module
as shown in FIG. 5 is completed.
FIG. 9 shows an example of the mold die for molding the receptacle.
As illustrated, this mold die is constituted by upper and lower
molds 40 and 41, there are provided a core 42 for forming the
opening portion, and two cores 43 for forming latch holes. In the
upper and lower molds 40 and 41, there are provided recess portions
40a and 41a for forming the outer shape of the receptacle 21, core
holding portions 40b and 41b into which the core 42 is fitted
slidably, core holding portions 40c and 41c into which the cores 43
are fitted slidably, and recess portions 40d and 41d for receiving
the two-core optical sub-module 20. The recess portions 40d and 41d
are formed so as to be continuous to the recess portions 40a and
41a. The core 42 is fitted into the core holding portions 40b and
41b so as to be held between the upper and lower molds 40 and 41,
and the core projects into a cavity formed by the recess portions
40a and 41a of the upper and lower molds to thereby form the inner
shape of the receptacle 21. Further, as shown in FIG. 10(a), a
fitting recess portion 42a is formed in a top end portion of the
core 42 projecting into the cavity, so that the fitting recess
portion 42a is tightly fitted with the two-core optical sub-module
20 in the state that the end portions of the optical connectors 22
provided in the two-core optical sub-module 20 are enveloped. On
the other hand, the cores 43 are fitted into the core holding
portions 40c and 41c so as to be engaged with the recess portions
42b formed in the side portions of the core 42 to thereby form the
latch holes 21b of the receptacle 21.
The stud pins 26 and the two-core optical sub-module 20 as insert
parts are fitted into such a mold die for forming a receptacle, and
molding resin is poured into the mold die, to thereby form the
receptacle 21 to integrally hold the two-core optical sub-module
20. Accordingly, it is possible to produce a two-core light
transmitting/receiving module with a high dimensional accuracy. The
lead pins 23 provided in the two-core optical sub-module 20 are
bent into a predetermined shape after the resin molding.
Consequently, such a two-core light transmitting/receiving module
as shown in FIG. 5 is completed.
In the above-mentioned example, the fitting recess portion 42a in
which the two-core optical sub-module 20 is to be tightly fitted,
is formed in the core 42 so as to make this core 42 have a function
to determine the relative positional relationship between the
opening portion 21a of the receptacle and the optical connectors
22. Therefore, the dimensional accuracy of the relative positional
relationship between the opening portion 21a of the receptacle and
the optical connectors 22 is determined by the dimensional accuracy
of the fitting recess portion 42a and the outer dimensional
accuracy of two-core optical sub-module 20. Since the two-core
optical sub- module 20 having a high outer dimensional accuracy can
be obtained in the above-mentioned manner, after all, the
dimensional accuracy of the above relative positional relationship
can be determined by the dimensional accuracy in producing the
core. Accordingly, if the sizes M and N of the fitting recess
portion 42a shown in FIG. 10(a) are made close to the outer size of
the two-core optical sub-module 20, it is possible to improve the
relative positional accuracy between the receptacle opening portion
21a and the optical connectors 22 provided in the two-core optical
sub-module 20. In addition, as shown in FIG. 10(b), when a pair of
fitting holes 42c which are tightly fitted to the outside of the
optical connectors 22, are formed with a high dimensional accuracy
in the interior of the fitting recess portion 42a, it is possible
to further improve the relative positional accuracy between the
receptacle opening portion 2aa and the optical connectors 22
provided in the two-core optical sub- module 20.
As in the case of the above-mentioned mold die for forming the
two-core optical sub-module 20, also the technical level of
producing the mold die including the core 42 and so on has reached
the degree which makes it possible to realize a very high
dimensional accuracy, so that the dimensional accuracy required in
the relative positional relationship between the receptacle 21 and
the optical connectors 22 is sufficiently satisfied. Therefore,
without using such an aligning tool as used conventionally, it is
possible to mass-produce two-core light transmitting/receiving
modules with a high dimensional accuracy in their finished state
with superior reproducibility, through the above-mentioned resin
molding. Additionally, the conventional troublesome working of
alignment with an expensive aligning tool is unnecessary when a
multi-core optical module is mounted on a fixed object such as a
printed circuit board. That is, it is possible to easily mount the
multi-core optical module as it is on the fixed object such as a
printed circuit board.
As has been described, according to the first embodiment of the
present invention, in addition to eliminating the necessity that
single-core optical sub-modules which are expensive and have a low
mass-productivity, are combined to constitute a multi-core optical
module as conventionally performed, it is possible to simplify the
process of assembling the constituent parts. Moreover, since the
configuration is made such that the constituent parts are
integrally held by inexpensive molding resin which is to be formed
by transfer molding or the like, it is possible to form a number of
multi-core optical modules at the same time, resulting in a
superior mass productivity. It is therefore possible to provide a
plurality of multi-core optical modules at a low cost.
Further, according to the present invention, the assembling
positional accuracy of the optical connectors relative to each
other or relative to the multi-core optical sub-module is
determined by the high dimensional accuracy realized in the mold
die for molding the multi-core optical sub-module, and the relative
positional accuracy between the receptacle and the optical
connectors is determined by the high dimensional accuracy realized
in the mold die (including the core) for molding the receptacle.
Therefore, without using such an aligning tool as used
conventionally, it is possible to mass-produce multi-core optical
modules with a high dimensional accuracy in their finished state
with a superior reproducibility, through resin molding.
Additionally, such conventional troublesome working of alignment
with an expensive aligning tool is unnecessary when the multi-core
optical module is mounted on a fixed object such as a printed
circuit board, so that it is possible to easily mount the
multi-core optical module as it is on the fixed object such as a
printed circuit board.
A second embodiment of the present invention will be described with
reference to FIGS. 11 to 13.
FIG. 11 is a perspective view illustrating a multi-core optical
module according to the second embodiment of the present invention
applied to a two-core light transmitting/receiving module, and FIG.
12 is an exploded view illustrating a mold die used to form the
multi-core optical module.
In the illustrated two-core light transmitting/receiving module
shown in FIG. 11, two single-core optical modules 120 are
integrally held by a receptacle 121 composed of molding resin. As
also shown in FIG. 12, each of the single-core optical sub-modules
120 is formed by integrally holding parts constituting the
single-core optical sub-module 120 such as an optical connector 122
and lead pins 123 by a molding resin member 125. Each optical
connector 122 is held by the molding resin member 125 in such a
manner that the optical connector 122 is projected at its one end
by which an end of an optical fiber (not-shown) is received. The
two single-core optical sub-modules 120 are held by the receptacle
121 in such a manner that the respective ends of the optical
connectors are included in the receptacle 121. In the illustrated
embodiment, one of the two single-core optical sub-modules 120 is
provided with a light emitting element for light transmission, and
the other one is provided with a light receiving element for light
reception. However, in the present invention, all single-core
optical sub-modules may be for light transmission or for light
reception.
In the receptacle 121, an opening portion 121a is formed so as to
open at the side opposite to the side at which the receptacle holds
the single-core optical sub-modules 120. The respective ends of two
optical fibers are held by an optical plug which is to be fitted
into the opening portion 121a, so that if the optical plug is
fittingly inserted into the opening portion 121a, the respective
end portions of the two optical fibers are received by the
respective ends of optical connectors enveloped in the receptacle
121 so as to be optically coupled with optical operation elements
fixed to the optical connectors. Latch holes 121b are opened in the
side portions aside the opening portion 121a, so that when the
optical plug is fitted into the opening portion 121a, elastic
projections formed at side portions of the optical plug are engaged
with those latch holes 121b to thereby prevent the optical plug
from coming off from the receptacle 121. Further, stud pins 126 for
fixing the receptacle 121 to a printed circuit board or the like
are integrally held in the receptacle 121.
Next, the case where the above-mentioned two-core light
transmitting/receiving module is produced by use of a mold die
shown in FIG. 12, will be described. The illustrated mold die for
resin molding the receptacle 121 is constituted by an upper mold
130, a lower mold 131, a core 132 for forming the opening portion,
and two cores 133 for forming the latch holes. In the upper and
lower molds 130 and 131, there are formed not only recess portions
130a and 131a for forming an outer shape of the receptacle 121, but
also core holding portions 130b and 131b for slidably mounting the
core 132 therein, and core holding portions 130c and 131c for
slidably mounting the cores 133. Further, recess portions 130d and
131d in two pairs for receiving the single-core optical sub-modules
120 are formed respectively. The pairs of recess portions 130d and
131d are formed so as to continue with the recess portions 130a and
130b respectively. The core 132 is mounted in the core holding
portions 130b and 131 b so as to be held between the upper and
lower molds 130 and 131 and so as to project into a cavity formed
by the respective recess portions 130a and 131a of the upper and
lower molds 130 and 131 to thereby form an inner shape of the
receptacle 121. In the end portion of the core 132 projecting into
the cavity, fitting holes 132a are formed as shown in FIG. 13(a) so
that they can be tightly fitted to the respective ends of the
optical connectors 122 respectively provided in the single-core
optical sub-modules 120 to thereby hold the optical connectors 122.
On the other hand, the cores 133 are mounted in the core holding
portions 130c and 131c and engaged with recess portions 132b formed
in the side portions of the core 132 to thereby form the latch
holes 121b of the receptacle 121 respectively.
When a two-core light transmitting/receiving module is produced
through resin molding by use of such a mold die as described above,
at first, the single-core optical sub-modules 120 are prepared, the
respective ends of the optical connectors 122 provided in the
single-core optical sub-modules 120 are fit into the fitting holes
132a of the core 132 respectively, and then the thus assembled core
132 and single-core optical sub-modules 120 are attached to the
core holding portions 130b and 131b and the recess portions 130d
and 131d of the upper and lower molds respectively. In advance of
this, the stud pins 126 are attached to the lower mold 131. Then
the cores 133 for forming latch holes are mounted in the core
holding portions 130c and 131c respectively, and the inner end
portions of the cores 133 are engaged with the respective recess
portions 132b of the core 132. Thereafter, plasticized molding
resin is injected into the cavity formed by the respective recess
portions 130a and 131a of the upper and lower molds to thereby form
the receptacle 121 which is holding the two single-core optical
sub-modules 120 integrally. Then, the lead pins 123 provided on
each of the single-core optical sub-modules 120 are bent into a
predetermined shape to thereby obtain a two-core light
transmitting/receiving optical module having such a structure that
the receptacle 121 is holding the two single-core optical
sub-modules 120 integrally as shown in FIG. 11.
In the above-mentioned procedure of resin molding, description has
been made such that the single-core optical sub-modules 120
together with the core 132 are attached to the upper and lower
molds 130 and 131 after making the core 132 hold the respective
ends of the optical connectors 122 provided in the respective
single-core optical sub-modules 120. However, the single-core
optical sub-modules 120 may be attached to the recess portions 130d
and 131d of the respective upper and lower molds 130 and 131 in
advance and thereafter the respective ends of the optical
connectors 122 provided in the single-core optical sub-modules 120
may be fitted in the fitting holes 132a of the core 132
respectively.
As the molding resin to be injected into the mold die, it is
preferable to use poly-phenylene-sulfide (PPS) or epoxy resin
having a high dimensional stability.
By the way, in the above described mold die, the two fitting holes
132a are formed in the core 132 as hold portions for holding the
respective end portions of the optical connectors 122 provided in
the respective single-core optical sub-modules 120 so as to make
the core 132 have a function of determining the relative positional
relationship between the optical connectors 122 and the relative
positional relationship between the opening portion 121a of the
receptacle 121 and each of the optical connectors 122. Accordingly,
on the basis of the accuracy cf the inner size of the fitting holes
132a, the accuracy of the relative positional relationship between
the fitting holes 132a, and the accuracy of the outer size of the
optical connectors 122, the dimensional accuracy related to the
relative positional relationship between the optical connectors 122
and the relative positional relationship between the opening
portion 121a of the receptacle 121 and each of the optical
connectors 122 are determined. Since it has been possible to obtain
optical connectors 122 having high accuracy in size conventionally,
after all, the dimensional accuracy on those relative positional
relationships depends on the dimensional accuracy in producing the
core 132. The technical level of producing mold dies for resin
molding including the core 132 and so on has reached the degree
possible to realize a very high dimensional accuracy so as to
satisfy the dimensional accuracy required in the relative
positional relationship between the optical connectors 122 and the
relative positional relationship between each of the optical
connectors 122 and the receptacle 121. Therefore, without using
such an aligning tool as used conventionally, it is possible to
mass product two-core light transmitting/receiving modules with a
high dimensional accuracy in their finished state having a superior
reproducibility by the above-mentioned resin molding. Additionally,
a conventional troublesome work of alignment with an expensive
aligning tool is unnecessary when a multi-core optical module is
mounted on a fixed object such as a printed circuit board, and it
is therefore possible to easily mount the multi-core optical module
as it is on the fixed object such as a printed circuit board.
In the dimensional accuracy relating to the relative positional
relationship between the optical connectors 122 and the relative
positional relationship between each of the optical connectors 122
and the opening portion 121a of the receptacle 121, strictness is
more required for the dimensional accuracy related to the center
axial lines of the inner diameter portions of the optical
connectors 122 receiving the respective end portions of the optical
fibers rather than for the dimensional accuracy related to the
center axial lines of the outer diameters of the connectors 122. In
the above-mentioned embodiment, the optical connectors 122 are
positioned with reference to their outer diameter center axial
lines. Accordingly, if the center axial lines of the outer
diameters of the optical connectors do not accord with those of the
inner diameters of the same, relative dimensional errors are
generated correspondingly between the center axial lines of the
inner diameters and between the receptacle opening portion 121a and
the center axial lines of the inner diameters. In order to prevent
such an error, it is preferable that aligning ferrules 135 tightly
fitting into the optical connectors 122 from their ends are
provided in the center portions of the fitting holes 132a formed in
the core 132, as shown in FIG. 13(b).
In this embodiment, as single-core optical sub-modules, used are
not conventional single-core optical sub-modules each obtained by
successively assembling constituent parts such as an optical
connector on a package of ceramics or the like as shown in FIG. 1,
but single-core optical sub-modules in which the constituent parts
such as an optical connector are held integrally in molding resin.
This is because if the assembling accuracy of the optical
connectors 122 relative to the outer size of the single-core
optical sub-modules 120 as a whole is low, it is necessary to form
the recess portions 130d and 131d receiving single-core optical
sub-modules in a mold die more largely in view of the assembling
tolerance. Thus, a large space is generated between the
conventional single-core optical sub-modules and the mold die, so
that a burr is generated at the molding of a receptacle, resulting
in undesirable appearance. In order to prevent such a state,
therefore, in this embodiment, used are single-core optical
sub-modules in each of which the constituent parts such as an
optical connector are held integrally in molding resin. In the case
where single-core optical sub-modules are formed in such a manner
that the constituent parts such as optical connectors are held
integrally in molding resin, the single-core optical sub-modules
are formed while the end portions of the optical connectors are
tightly held by the mold die for forming the single-core optical
sub-modules. Accordingly, it is possible to obtain single-core
optical sub-module with a high positional accuracy in assembling
the optical connectors therein correspondingly to the high
dimensional accuracy realized in the mold die.
As has been described above, according to this embodiment of the
present invention, the dimensional accuracy between a plurality of
optical connectors held integrally in a receptacle and the relative
positional accuracy of an opening portion of the receptacle and
each of the optical connectors are determined by the high
dimensional accuracy realized in a mold die (including a core) used
in forming the receptacle.
Therefore, without using such an aligning tool as used
conventionally, it is possible to mass produce multi-core optical
modules with a high dimensional accuracy in their finished state
and with a superior reproducibility, through resin molding.
Additionally, a conventional troublesome work of alignment with an
expensive aligning tool is unnecessary when a multi-core optical
module is mounted on a fixed object such as a printed circuit
board, so that it is possible to easily mount the multi-core
optical module as it is on the fixed object such as a printed
circuit board.
Although the above described embodiments relate to two-core optical
modules, it is needless to say that the present invention is also
applicable to a single-core optical module as shown in FIGS. 14 and
15 in addition to a multi-core optical module having more than
three optical connectors. In FIG. 14, a receptacle 121 integrally
holds a single-core optical sub-module 120 to envelope the entire
portion of an optical connector (third embodiment). In FIG. 15, a
receptacle 121 integrally holds a single-core optical sub-module
120 to envelop a portion of the optical connector 122 (fourth
embodiment). Further, in FIG. 15, a latch projection 121c is
provided instead of a latch hole 121b in FIG. 14. FIG. 16 shows an
optical module according to a fifth embodiment of the present
invention, in which a plurality of receptacles 121 integrally hold
a multi-core optical sub-module 20 such that each of the
receptacles envelopes a portion of each of optical connectors
22.
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