U.S. patent number 5,475,253 [Application Number 08/132,071] was granted by the patent office on 1995-12-12 for antifuse structure with increased breakdown at edges.
This patent grant is currently assigned to Xilinx, Inc.. Invention is credited to Kevin T. Look, Evert A. Wolsheimer.
United States Patent |
5,475,253 |
Look , et al. |
December 12, 1995 |
**Please see images for:
( Certificate of Correction ) ** |
Antifuse structure with increased breakdown at edges
Abstract
An antifuse is provided which includes a first conductive layer,
an antifuse layer formed on the first conductive layer, and a
second conductive layer formed on the antifuse layer. A portion of
the antifuse layer forms a substantially orthogonal angle with the
first conductive layer and the second conductive layer. This
"corner" formation of the antifuse enhances the electric field at
this location during programming, thereby providing a predictable
location for the filament, i.e. the conductive path between the
first and second conductive layers. This antifuse provides other
advantages including: a relatively low programming voltage, good
step coverage for the antifuse layer and the upper conductive
layer, a low, stable resistance value, and minimal shearing effects
on the filament.
Inventors: |
Look; Kevin T. (Fremont,
CA), Wolsheimer; Evert A. (Sunnyvale, CA) |
Assignee: |
Xilinx, Inc. (San Jose,
CA)
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Family
ID: |
22452325 |
Appl.
No.: |
08/132,071 |
Filed: |
October 4, 1993 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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933428 |
Aug 21, 1992 |
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Current U.S.
Class: |
257/530; 257/209;
257/50; 257/529; 257/E21.592; 257/E23.147 |
Current CPC
Class: |
H01L
21/76888 (20130101); H01L 23/5252 (20130101); H01L
2924/0002 (20130101); Y10S 148/055 (20130101); H01L
2924/0002 (20130101); H01L 2924/00 (20130101) |
Current International
Class: |
H01L
21/768 (20060101); H01L 23/525 (20060101); H01L
23/52 (20060101); H01L 21/70 (20060101); H01L
029/04 (); H01L 049/00 (); H01L 027/02 () |
Field of
Search: |
;257/50,209,529,530 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Other References
Chiang, S.; Forouhi, R.; Chen, W.; Hawley, F.; McCollum, J.; Hamdy,
E.; and Hu, C., "Antifuse Structure Comparison for Field
Programmable Gate Arrays", Actel Corp. IEEE Copyright 1992, pp.
24.6.1-24.6.4. .
Cook, B. and Keller, S., "Amorphous Silicon Antifuse Technology for
BiPolar Proms", BiPolar Circuits and Technology Meeting-Copyright
1986 IEEE, pp. 99-100..
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Primary Examiner: Hille; Rolf
Assistant Examiner: Wallace; Jalencia Martin
Attorney, Agent or Firm: Harms; Jeanette S.
Parent Case Text
CROSS REFERENCE TO RELATED APPLICATION
This application is a continuation-in-part of U.S. patent
application Serial No. 07/933,428, entitled "Antifuse Structure and
Method for Forming", filed Aug. 21, 1992 (Atty.Doc.No. M-9 2164).
Claims
We claim:
1. An antifuse comprising:
a first conductive layer;
a field oxide layer formed on said first conductive layer and
having a via formed therein to the top surface of said first
conductive layer, wherein said via includes a lower portion forming
a profile perpendicular to said first conductive layer, and an
upper portion forming a concave profile;
an antifuse layer formed on said first conductive layer, wherein
the top surface of said antifuse layer follows the contours of said
lower and upper portions of said via; and
a second conductive layer formed on said antifuse layer.
2. The antifuse of claim 1 wherein said antifuse layer includes an
amorphous silicon layer.
3. The antifuse of claim 2 wherein said amorphous silicon layer has
a thickness between 350 .ANG. and 550 .ANG..
4. The antifuse of claim 3 wherein said amorphous silicon layer has
a thickness of approximately 450 .ANG..
5. The antifuse of claim 2 wherein said antifuse layer further
includes a first oxide layer formed on the bottom of said via
between said first conductive layer and said amorphous silicon
layer.
6. The antifuse of claim 5 wherein said first oxide layer is formed
from said first conductive layer.
7. The antifuse of claim 5 wherein said first oxide layer has a
thickness between 35 .ANG. and 70 .ANG..
8. The antifuse of claim 5 wherein said first oxide layer is
titanium oxide.
9. The antifuse of claim 5 wherein said first oxide layer is
tungsten oxide.
10. The antifuse of claim 5 wherein said first oxide layer is a
combination of titanium oxide and tungsten oxide.
11. The antifuse of claim 5 wherein said antifuse layer further
includes a second oxide layer formed between said amorphous silicon
layer and said second conductive layer.
12. The antifuse of claim 11 wherein said second oxide layer is a
silicon dioxide layer.
13. The antifuse of claim 11 wherein said second oxide layer has a
thickness between 10 .ANG. and 30 .ANG..
14. The antifuse of claim 11 wherein said second oxide layer
completely insulates said amorphous silicon layer from said second
conductive layer.
15. The antifuse of claim 1 wherein said first conductive layer
forms a lower conductive terminal of said antifuse.
16. The antifuse of claim 15 wherein said first conductive layer
includes a conductive metal.
17. The antifuse of claim 16 wherein said conductive metal includes
aluminum.
18. The antifuse of claim 16 wherein said conductive metal includes
an aluminum-silicon alloy.
19. The antifuse of claim 16 wherein said conductive metal includes
an aluminum-silicon-copper alloy.
20. The antifuse of claim 16 wherein said conductive metal includes
titanium.
21. The antifuse of claim 16 wherein said conductive metal includes
titanium nitride.
22. The antifuse of claim 16 wherein said conductive metal includes
titanium tungsten.
23. The antifuse of claim 1 wherein said second conductive layer
forms an upper conductive terminal of said antifuse.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to antifuses, and in particular to an
antifuse structure with an increased breakdown at the edges of an
antifuse layer.
2. Description of the Related Art
Antifuses are well known in the art. An antifuse is a structure
which is non-conductive when manufactured, but becomes permanently
conductive by applying a predetermined voltage across its
terminals. Antifuses are typically used in programmable logic
devices to programmably interconnect conductive lines.
FIGS. 1A-1D illustrate a conventional method of forming an
antifuse. Referring to FIG. 1A, a polycrystalline silicon layer 11
is formed on substrate 10 to provide a lower conductive terminal
for the antifuse. An insulation layer 13 is then deposited and
patterned to partially expose polycrystalline silicon layer 11 as
shown in FIG. 1B. Referring to FIG. 1C, an amorphous silicon layer
14 is then deposited and patterned to cover the exposed portion of
polycrystalline silicon layer 11 and portions of insulation layer
13 adjacent to polycrystalline silicon layer 11. Referring to FIG.
1D, conductive layers 18, including titanium layer 15, titanium
nitride layer 16, and aluminum-silicon layer 17, are formed over
amorphous silicon layer 14, and then patterned (not shown) to form
an upper conductive terminal.
However, antifuse 20 requires a relatively high voltage, typically
12-14 volts, to program. Standard transistors used in 5-volt
integrated circuit systems typically break down between 12-14
volts. Thus, special processing is needed to enhance the breakdown
characteristic of the transistors for programming the antifuse.
Moreover, to ensure proper operation of the integrated circuit
system, other structures in the system must be isolated from the
antifuse programming voltages.
Furthermore, antifuse 20 is undesirably affected by internal
temperatures generated during programming. Specifically, during
programming of antifuse 20, the leakage current of this device
increases with the increase in applied voltage. Eventually, the
leakage current focuses on a localized weak spot in amorphous
silicon layer 14. A thermal runaway condition then develops which
results in localized heating and, eventually, filament formation
between the upper conductive terminal and the lower conductive
terminal. The different thermal expansion coefficients of the
materials in different layers of the antifuse structure in turn
cause stresses to develop in the material as it cools after
programming. Over time, these stresses will relax, producing
movement between layers of the antifuse material.
FIG. 2A shows a partial top view of antifuse 20 after programming
in which filament 19 joins titanium layer 15 (FIG. 1D) and
polysilicon layer 11. Note that FIG. 2A illustrates an edge 21 of
amorphous silicon layer 14 that contacts polycrystalline silicon
layer 11. As described above, stress relaxation occurs within
amorphous silicon layer 14, not at its boundaries. Therefore,
referring to FIG. 2B, if shearing occurs in prior art antifuse 20
due to stress relaxation, the sheared portion 19' of filament 19
significantly reduces the surface area 19A for conducting current,
thereby resulting in instability of the resistance provided by
antifuse 20.
Therefore, a need arises for an antifuse which programs at a
relatively low programming voltage and ensures a stable resistance
irrespective of shearing conditions.
SUMMARY OF THE INVENTION
In accordance with the present invention, an antifuse comprises a
first conductive layer, an antifuse layer formed on the first
conductive layer, and a second conductive layer formed on the
antifuse layer. A portion of the antifuse layer forms a
substantially orthogonal angle with the first conductive layer and
again with the second conductive layer. This "double corner"
formation of the antifuse layer enhances the electric field during
programming. Thus, the resulting filament, i.e. the conductive path
between the first and second conductive layers formed during
programming, consistently forms along this corner.
The present invention provides advantages under shearing conditions
due to stress relaxation that typically occur within the programmed
antifuse structure. Specifically, because a filament in accordance
with the present invention is formed at one of the boundaries of
the antifuse, not within the antifuse structure, the filament is
substantially unaffected by shearing conditions caused by stress
relaxation. Therefore, an antifuse in accordance with the present
invention provides a stable resistance even under stress relaxation
conditions.
Furthermore, in contrast to the prior art antifuses which have a
programming voltage of 12-14 volts, an antifuse in accordance with
the present invention has a programming voltage of 8-9 volts. Thus,
ordinary transistors which break down at 12-14 volts can be used
both for programming antifuses and for logic functions.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1A-1d illustrate one method of forming a conventional
antifuse,
FIG. 2A shows a partial view of the conventional antifuse
illustrated in FIG. 1D after programming.
FIG. 2B shows a partial view of the conventional antifuse
illustrated in FIG. 1D after shearing occurs.
FIG. 3A-3J illustrate one method of forming an antifuse in
accordance with the present invention.
FIG. 4 shows a partial view of the antifuse illustrated in FIG. 3J
after programming.
DETAILED DESCRIPTION OF THE DRAWINGS
FIGS. 3A-3J illustrate the steps to provide one embodiment of an
antifuse in accordance with the present invention. Referring to
FIG. 3A, a conductive layer 101, approximately 4500 .ANG. to
7000< thick, is formed on substrate 100. In this embodiment of
the present invention, conductive layer 101 includes two layers,
bottom layer 101A and top layer 101B. The bottom layer 101A is
aluminum (Al) having a thickness of approximately 3500 .ANG. to
6500 .ANG.. The top layer 101B is titanium-tungsten (TiW) having a
thickness of approximately 1000 .ANG. to 3000 .ANG.. Layer 101B is
formed on top of layer 101A to prevent the diffusion of aluminum
into a to-be-formed amorphous silicon layer (shown in FIG. 3H). In
other embodiments, bottom layer 101A is aluminum-silicon (AlSi) or
aluminum-silicon-copper (AlSiCu) and top layer 101B is
titanium-nitride (TiN). In yet other embodiments of the present
invention, conductive layer 101 is formed solely from
titanium-tungsten (TiW). Conductive layer 101 forms the lower
conductive terminal (hereinafter lower conductive terminal 101) of
the to-be-formed antifuse.
After formation of this lower conductive terminal, a layer of
undoped oxide, for example silicon dioxide, is deposited at a
temperature of about 400.degree. C. to a thickness of approximately
15,000 .ANG.. This oxide serves as a sacrificial oxide during the
subsequent planarization process. Specifically, as shown in FIG.
3A, a photoresist layer 102A is deposited on layer 102. Then, an
etch removes photoresist layer 102A and approximately 9,000 .ANG.
to 11,000 .ANG. of oxide layer 102.
As is well known in the art, photoresist layer 102A forms a planar
surface on the somewhat irregular surface of oxide layer 102.
Etching of thinner portions of photoresist occurs more rapidly than
thicker portions of photoresist. Thus, after removal of photoresist
layer 102A and a portion of oxide layer 102, a substantially planar
surface is provided on oxide layer 102 as shown in FIG. 3B.
Referring to FIG. 3C, after the oxide etch, another oxide layer
103, approximately 8000 .ANG. thick, is deposited at a temperature
of about 400.degree. C. to a thickness between 9,000 .ANG. and
10,000 .ANG. on oxide layer 102 to ensure adequate isolation
between lower conductive terminal 101 and the to-be-formed upper
conductive terminal.
Then, a photoresist layer 104 is deposited and patterned as shown
in FIG. 3D. A subsequent isotropic etch forms the opening 105A
which is shown in FIG. 3E. Typically, this isotropic etch uses a
conventional, diluted HF solution which etches down approximately
5500 .ANG. to 7500 .ANG.. In one embodiment of the present
invention, the HF solution etches down 6500 .ANG.. In other
embodiments, other etching processes, such as a plasma etch, are
used to provide the angle 140, typically 40 degrees, which is
measured from the beginning of the slope (point 140A) to the end of
the slope (point 140B). This angle ensures good step coverage of
the to-be-formed antifuse layer and the upper conductive layer in
opening 105A.
Referring to FIG. 3F, an anisotropic etch removes a portion of
oxide layer 103 and oxide layer 102, thereby exposing lower
conductive terminal 101. In this embodiment, the anisotropic etch
is a plasma etch including a mixture of Freon-23 (CHF.sub.3) and
oxygen (O.sub.2) at approximately 25.degree. C. This anisotropic
etch provides the via 105B.
Subsequent to via definition, an oxygen plasma treatment is
performed. During this oxygen plasma treatment, the temperature of
the antifuse structure rises from approximately 25.degree. C. to
approximately 125.degree. C. The combination of elevated
temperature and reactive oxygen plasma produces an oxide layer 106
on lower conductive terminal 101 in via 105B as shown in FIG. 3G.
Oxide layer 106 is typically an oxide of the material of lower
conductive terminal 101. Thus, oxide layer 106 is either titanium
oxide, tungsten oxide, or a mixture of titanium oxide and tungsten
oxide. In this embodiment, oxide layer 106 is between 35 .ANG. and
70 .ANG. thick.
Then, referring to FIG. 3H, an amorphous silicon layer 107 is
deposited in via 105B as well as areas adjacent to via 105B.
Amorphous silicon layer 107 is typically deposited to a thickness
of between 350 .ANG. and 550 .ANG. to ensure that this deposition
follows the contour of via 105B. In one embodiment of the present
invention, amorphous silicon layer 107 is 450 .ANG. thick and is
formed by using pure silane gas (SiH.sub.4) at a temperature of
300.degree. C. and a pressure of 250 mTorr. In another embodiment,
a mixture of silane gas and nitrogen (N.sub.2) at a temperature of
300.degree. C. is used to produce amorphous silicon layer 107. In
that embodiment, amorphous silicon layer 107 has a typical nitrogen
content (measured by number of atoms) of between 10% to 20%.
To improve the amorphous nature of amorphous silicon layer 107,
i.e. break up any small crystals and reduce leakage, an argon
implant, not shown, is performed at a dosage of 1.times.10.sup.16
atoms/cc and an energy of 30 keV. Other implant dopants such as
silicon, oxygen, or arsenic are alternatively used in other
embodiments. Then, a photoresist layer (not shown) is deposited and
patterned to define the edge 107A of the antifuse. An anisotropic
etch etches the exposed portions of amorphous silicon layer 107,
thereby providing the edges 107A shown in FIG. 3H. Subsequent to
this anisotropic etch, another oxygen plasma treatment is
performed, thereby forming a silicon dioxide layer 108
approximately 10-30 .ANG. thick which covers amorphous silicon
layer 107 as shown in FIG. 3I. Finally, an upper conductive
terminal 131 is formed using conventional methods.
In one embodiment shown in FIG. 3J, upper conductive terminal 131
includes a titanium layer 109, a titanium-tungsten layer 110, and
an aluminum-silicon-copper alloy layer 111. In other embodiments,
upper conductive terminal 131 is formed from consecutive layers of
titanium, titanium-nitride, titanium-tungsten, or consecutive
layers of aluminum (formed on amorphous silicon layer 107),
aluminum-silicon, and aluminum-silicon-copper.
In the embodiment of the present invention shown in FIG. 3H,
antifuse 130 typically needs a programming voltage between 7.5 and
10 volts to form a conductive filament 132 which connects upper
conductive terminal 131 and lower conductive terminal 101. Because
standard transistors can withstand this low antifuse programming
voltage, transistors in the antifuse structure can be small,
density is high, and no special transistor processing seeps are
needed.
Moreover, a prior are antifuse having a typical length of 1500
.ANG. provides an undesirably high resistance value on the order of
150.OMEGA.. In contrast, the short length, i.e. approximately 350
.ANG. to 550 .ANG. , of conductive filament 132 provides a
significantly lower resistance value of approximately
50.OMEGA..
Furthermore, a prior art antifuses exhibits an unstable resistance
value at stress current close to the programming current. A more
detailed explanation of this phenomena is described in an article
entited, "Antifuse Structure Comparison for Field Programmable Gate
Arrays" by S. Chiang et al., IEEE IDEM, pages 611-614, 1992, which
is herein incorporated by reference in its entirety. In contrast,
an antifuse in accordance with the present invention provides a
stable resistance value both under low current stress and under DC
current stress close to the programming current over a time period
of more than 1,000 hours.
As described above, the present invention provides that a portion
of the composite antifuse layer, i.e. oxide layer 106, amorphous
silicon layer 107 and oxide layer 108, forms a substantially
orthogonal angle with the lower conductive terminal 101 and the
upper conductive terminal 131. This "double corner" formation of
the composite antifuse layer enhances the electric field at this
location during programming, thereby ensuring a predictable
location, and therefore resistance, of filament 132.
Furthermore, the present invention provides advantages under
shearing conditions due to stress relaxation in the programmed
antifuse. Specifically, stress relaxation typically occurs within a
structure, not at its boundaries. Therefore, referring back to FIG.
2B, if shearing occurs in prior art antifuse 20, the sheared
portion 19' of filament 19 significantly reduces the surface area
19A for conducting current, thereby resulting in instability of the
resistance provided by antifuse 20. In contrast, filament 132 of
the present invention which is formed at one of the boundaries of
antifuse 130 is substantially unaffected by shearing conditions
caused by stress relaxation. Therefore, an antifuse in accordance
with the present invention provides a low, stable resistance even
under the above-described adverse conditions.
Therefore, the antifuse of the present invention provides the
following advantages: a predictable location of the antifuse
filament, minimal shearing effects on the filament, a relatively
low programming voltage, and a low, stable resistance value.
The above description of the present invention is meant to be
illustrative only and not limiting. Other embodiments will be
apparent to those skilled in the art in light of the detailed
description. The present invention is set forth in the appended
claims.
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