U.S. patent number 4,785,177 [Application Number 07/025,336] was granted by the patent office on 1988-11-15 for kinematic arrangement for the micro-movements of objects.
This patent grant is currently assigned to Kernforschungsanlage Julich Gesellschaft mit beschrankter Haftung. Invention is credited to Karl-Heinz Besocke.
United States Patent |
4,785,177 |
Besocke |
November 15, 1988 |
Kinematic arrangement for the micro-movements of objects
Abstract
A kinematic arrangement for the micro-movement over long
distances of objs, and in particular, for imparting movement to and
the manipulation of objects which are to be investigated or treated
microscopically. The object is supported on at least one
motion-imparting or kinematic element constituted of piezoelectric
material, which is deformable through the application of electrical
voltages. The supporting point or points of the kinematic or
motion-imparting elements is or are changed in position through a
deformation of the piezoelectric material due to the application of
electrical voltage variations to the kinematic element, which so
changes in its position that the object which is supported by the
kinematic elements will move in desired directions within a plane
predetermined by the supporting points.
Inventors: |
Besocke; Karl-Heinz (Julich,
DE) |
Assignee: |
Kernforschungsanlage Julich
Gesellschaft mit beschrankter Haftung (DE)
|
Family
ID: |
6297479 |
Appl.
No.: |
07/025,336 |
Filed: |
March 13, 1987 |
Foreign Application Priority Data
|
|
|
|
|
Mar 27, 1986 [DE] |
|
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3610540 |
|
Current U.S.
Class: |
250/442.11;
310/328; 310/366; 310/330; 310/369; 850/26 |
Current CPC
Class: |
B82Y
35/00 (20130101); H01L 41/092 (20130101); H02N
2/021 (20130101); H02N 2/025 (20130101); H02N
2/101 (20130101); G01Q 10/04 (20130101) |
Current International
Class: |
H01L
41/09 (20060101); G21K 005/10 () |
Field of
Search: |
;250/306,442.1,440.1
;318/37,38,115,116 ;310/311,328,330 ;378/34 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Fields; Carolyn E.
Assistant Examiner: Miller; John A.
Attorney, Agent or Firm: Scully, Scott, Murphy &
Presser
Claims
What is claimed is:
1. Micromanipulator for the micro-movement of objects, for
imparting relative microscopic movements between the
micromanipulator and objects which are to be examined or treated
microscopically; comprising at least one kinematic element
positioned for supporting or being supported by said object, said
at least one kinematic element being constituted from a
piezoelectric material and being deformable through the application
of electrical voltages, at least a portion of said at least one
kinematic element being hollow-cylindrical; support means for said
object being located at one end surface of said at least one
element; and a closed, continuous electrically-conductive coating
being provided on one cylindrical surface of said at least one
hollow-cylindrical kinematic element, and a plurality of
electrically-conductive part coatings, which are electrically
insulated relative to each other, being provided on the other
cylindrical surface.
2. Micromanipulator as claimed in claim 1, wherein said support
means comprises a single support point projecting from said at
least one kinematic element.
3. Micromanipulator as claimed in claim 1, wherein said support
means comprises a plurality of object-supporting surfaces
circumferentially distributed along the end surface of said at
least one element.
4. Micromanipulator as claimed in claim 1, wherein said part
coatings which are insulated relative to each other extend along
said other cylindrical surface in the direction of the cylinder
axis; and an insulation between said part coatings extending
between said part coatings in parallel with the cylinder axis.
5. Micromanipulator as claimed in claim 1, wherein said
electrically insulated part coatings are provided on the external
cylindrical surface of at least one element.
6. Micromanipulator as claimed in claim 1, wherein means are
provided for applying to said closed coating and to said part
coating a separate electrical operating voltage in conformance with
the intended movement of the object.
7. Micromanipulator as claimed in claim 1, wherein means are
provided for applying a direct voltage superimposable on an
alternating-current voltage required for the operation of said
arrangement.
8. Micromanipulator as claimed in claim 1, wherein said at least
one kinematic element is rigidly interconnected with a scan element
of a scanning-tunneling microscope supporting the tunnel tip of
said scanning-tunneling microscope.
9. Micromanipulator as claimed in claim 8, wherein said scan
element has a construction analogous to the construction of said at
least one kinematic element.
10. Micromanipulator as claimed in claim 8, wherein the scanning
movements of said arrangement are provided by said at least one
kinematic element.
11. Micromanipulator as claimed in claim 8, wherein said at least
one kinematic element comprises a thermal sensor means for
effecting the temperature measurement of the object.
12. Micromanipulator as claimed in claim 8, wherein said at least
one kinematic element comprises a means for contacting the object
under investigation.
13. Micromanipulator as claimed in claim 1, wherein said
arrangement includes an object treating implement means.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a kinematic arrangement for the
micro-movements of objects also over large distances. In
particular, the kinematic arrangement serves for imparting movement
to and the manipulation of objects which are to be investigated
microscopically.
2. Description of the Prior Art
Mechanically highly-precise operating sequences, in an increasing
measure, are required in the modern micro-technology. The
mechanical control elements which have been heretofore employed for
this purpose to the greatest extent, and which are equipped with
lever systems, gears and micrometer screws, in many instances
cannot meet the necessary demands. In order to carry out
micro-movements, electromagnetic or piezoelectric control elements
are better suited for such purposes.
For instance, extremely precise micro-movements are necessary for
the Scanning-Tunneling Microscope (STM), described in the article
"Das Raster-Tunnelmicroscop", by G. Binnig and H. Rohrer, Helvetia
Phys. Acta--55, 1982, page 726. The STM necessitates the highest
degree of precision and stability for the movement of the object
under investigation. Thus, for the scanning of the object, as well
as for the manipulation of the object, a prerequisite is precision
movements within the nanometer range in order to achieve the
desired results. These movements must be carried out and controlled
dependably, repeatedly and rapidly.
The currently known control elements for STM's utilize a
combination of three piezoelectric control elements for the
scanning operation (a tripod with one control element in each of
the three coordinate directions x, y, z) and further control
elements for the manipulation of the object which operate either
piezoelectrically, electromagnetically or mechanically, G. Binnig
and H. Rohrer, "Das Raster-Tunnelmikroskop", Spektrum der
Wissenschaft, 1985, pages 62-68; J. Moreland, et al.,
"Electromagnetic Squeezer for Compressing Squeezable Electron
Tunnel Junctions", Rev. Sci. Instrum., 55, 1984, page 399. The
complex construction of these control elements is susceptible to
disturbances; vibrations and temperature drifts are almost
impossible to avoid. Moreover, critical is the necessity of a high
voltage operation of these elements.
A two-directional piezoelectric driven fine adjusting device is
disclosed in Ishikawa, U.S. Pat. No. 4,163,168, in which first and
second counter piezo-electric members which are fixed to each other
are expandable and contractable in directions differing from each
other responsive to the selective application of electrical
signals. Slide members are fixed to the piezoelectric members and
some into sliding contact with a base and electrical attraction
devices which are responsive to applied electrical signals for
attracting and fasting the slide members to a movable plate. The
device disclosed herein is cumbersome and does not afford the
accuracy of movement contemplated by the inventive kinematic
arrangement.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the present invention to provide an
arrangement for implementing motion sequences, which features a
high degree of stabililty, a precise control over the movement,
simple construction, low susceptibility to vibrations and a low
temperature drift.
The foregoing object is achieved through the provision of a
kinematic arrangement of the above-mentioned type, in accordance
with which the object is supported on at least one motion-imparting
or kinematic element constituted of piezoelectric material, and
which is deformable through the application of electrical voltages.
Supports or supporting points for the object on the kinematic or
motion-imparting element are changed in position through a
deformation of the piezoelectric material due to the application of
electrical voltage variations to the kinematic element, which so
changes in its position that the object which is supported by the
kinematic element will move in desired directions within a plane
predetermined by the location of the object on the supports. This
motion can be purely translatory, however, the object can also be
caused to be rotated about an axis or tilted by the kinematic
element.
Pursuant to another aspect of the invention, the kinematic
arrangement may include a plurality of object-supporting kinematic
elements, preferably although not necessarily consisting of three
such elements each possessing a support-point or plane for the
object to be able to impart the desired, above-mentioned motion to
the object. For this purpose, each of the three piezoelectric
kinematic elements is separately actuatable.
Pursuant to a further feature of the invention, it is contemplated
that at least one part of the motion-imparting or kinematic element
is constructed hollow-cylindrically and provides a supporting
surface for the object at the end of the kinematic element. The
supporting surface for the object at the end of the
hollow-cylindrical kinematic element may e.g. consist of a
plurality of circumferentially spaced support balls or spheres; for
example, three equally spaced balls to provide a stable positioning
of the object on the kinematic element. Such a cylindrical
kinematic element possesses a high mechanical rigidity.
Preferably, the hollow-cylindrical kinematic element is or the
kinematic elements are equipped on one of its or their cylindrical
walls with a closed electrically-conductive coating and on its or
their other cylindrical wall with a plurality of
electrically-conductive part coatings which are insulated relative
to each other. In this construction, as a result of the application
of a voltage between the coatings present on both cylinder walls,
there is obtained either a shortening or elongation of the
kinematic element. For effectuating a bending of the kinematic
element, a voltage is applied between the closed coating and a part
coating.
Furthermore, through a superposition of the applied voltages it is
possible to implement all of the positional changes which are
required for the movement of the object. The electrical voltages
which are necessary therefor can be maintained relatively low by
using thin walled kinematic elements.
Expediently, the part coatings which are insulated relative to each
other extend along one of the cylinder walls in the direction along
the axis of the cylinder. The part coatings are separated from each
other by insulations which extend between the part coatings in
parallel with the axis of the cylinder. Due to technology reasons
the electrically conductive part coatings are preferably arranged
on the outer cylinder wall.
By superposition of voltages applied to the inner and outer
coatings and by voltages applied to the part coatings the kinematic
element can be elongated or shortened and can be bended in any
desired direction. The kinematic elements can, thusly, be extremely
exactly controlled in the X, Y and Z direction by the superposition
of the voltages.
An optimized electrical control over the kinematic elements is
attained when every electrically-conductive coating on the cylinder
surfaces of a kinematic element is separately controllable. An
adjustment of the resting position of the kinematic elements can be
achieved through the application of a direct-current (D.C.) voltage
upon which there is superimposed the alternating-current (A.C.)
voltage necessary for the operation.
Preferred areas of application for the inventive kinematic
arrangement are microscopes, including light-optical and electron
microscopes, especially scanning electron microscopes. Hereby, the
kinematic arrangement serves as an object carrier or support for
the objects which are to be examined microscopically. Also for the
analysis and processing of objects utilized in the
micro-technology; for example, in the high-integration electronic
structures, the kinematic arrangement is adapted for the
manipulation of objects. The kinematic element can also be applied
to an axially supported object in order to provide micro
rotations.
Particularly advantageous is the utilization of the kinematic
arrangement as an object support and scanning provision for a
Scanning Tunneling Microscope (STM). For this case of utilization,
the kinematic arrangement is rigidly interconnected with a scan
element on which the tunnel tip is fastened. This type of
connection between the kinematic object support and scanning
elements onto one compact modular unit, leads to a high degree of
mechanical stability and unsusceptibility to temperatures in the
Scanning Tunneling Microscope. In accordance with one embodiment,
the scan element is constructed in the same manner as is a
kinematic element. Hereby, it especially consists of a
hollow-cylindrical piezoelectric material which, on its inner and
outer cylindrical walls, is provided with electrically-conductive
coatings or, respectively, part coatings. This analogous
construction of the scan element and the kinematic elements in the
utilization of the kinematic arrangement in an STM leads to a high
degree of freedom from vibration and to compensation of the
temperature drift. Moreover, the same construction for the
kinematic elements and the scan element also facilitates that the
scanning movement which is necessary for the STM utilization can be
carried out by the kinematic elements instead of the scan
element.
For temperature measurement of the object, at least one of the
kinematic elements may be equipped with a thermal sensor.
In accordance with another feature of the invention, it is possible
to position the object stationarily, to place the kinematic
arrangement upside down onto the object and let the kinematic
arrangement walk over the surface of the object. Thereby enabling
the investigation of larger objects.
BRIEF DESCRIPTION OF THE DRAWINGS
Further features, advantages, and objects of the present invention
may now be readily ascertained from the following detailed
description of exemplary embodiments thereof, taken in conjunction
with the accompanying drawings; in which:
FIG. 1 generally schematically illustrates a perspective view of a
kinematic arrangement as an object support and scan element
utilized in a Scanning Tunneling Microscope (STM);
FIG. 2 illustrates a perspective view of one of the kinematic
elements;
FIG. 2a illustrates a transverse sectional view through the
kinematic element of FIG. 2;
FIG. 3 illustrates the sequence of movements of the kinematic
elements during the manipulation of an object, with the kinematic
element jumping away from the object (FIG. 3a), with the sliding
movement of the kinematic element along the surface of the object
(FIG. 3b);
FIG. 4 illustrates a transport arrangement for the micro-movement
of objects over a greater distance;
FIG. 5 illustrates a perspective view of a scan element, and FIG.
5a illustrates a transverse section therethrough;
FIG. 6 illustrates kinematic elements with a thermal sensor and an
electrical potential connection to the object including scan
element, shown in a longitudinal sectional view;
FIG. 7 gradually schematically illustrates a perspective view of
another embodiment of a kinematic arrangement pursuant to the
invention;
FIG. 8 illustrates a perspective view of a kinematic element
modified with respect to that of FIG. 2; and
FIG. 9 illustrates a transverse sectional view through the
kinematic element of FIG. 8.
DETAILED DESCRIPTION
FIG. 1 illustrates a kinematic arrangement for a Scanning Tunneling
Microscope (STM) which is constituted of three motion-imparting or
kinematic elements 1, 2, 3; including a scan element 4 which is
herein centrally located intermediate the kinematic elements 1, 2,
3 for the measurement of the tunnel current. All kinematic elements
1, 2, 3 and the scan element 4 (each) possess the same
construction. For the configuration of the elements in the
disclosed embodiment, there are employed cylindrical components
constituted of a piezoelectric material; for example, piezoceramic,
whereby the kinematic elements are provided at one end with a
support 5 for an object 6 which is to be examined with the STM, and
wherein the scan element 4 is equipped with a tunneling tip 7.
The kinematic elements 1, 2, 3 and the scan element 4, in the
embodiment, are fastened onto a common base plate 8. Voltages can
be applied to each of the elements, causing a shortening or
elongation, or a bending of the elements.
The object 6 rests on the supports 5 of the kinematic elements 1,
2, 3 which, in this embodiment, are spherical in shape. Through the
intermediary of this three-pointed support for the object 6, there
is obtained a stable support for the object. The object rests
normally on the supports by gravitational force, however, it can
also be pressed against the supports 5 by the elastic force of a
spring.
The construction of kinematic elements 1, 2 or 3 is elucidated in
FIG. 2 of the drawings. FIG. 2 illustrates the kinematic element
with superimposed support 5 in a perspective representation. A
cross-section through the kinematic element is illustrated in FIG.
2a. The kinematic element consists of a tube of piezoceramic
material 9. In the illustrated embodiment, the piezoceramic tube
possesses an outer diameter of 2 mm and an inner diameter of 1 mm.
The inner wall of the tube 9 is coated with a closed electrically
conductive layer 10, forming the inner electrode. The outer
cylindrical wall of the kinematic element is provided with four
electrically-conductive part coatings forming strip electrodes 11
to 14, which are electrically insulated with respect to each other
through insulations 15. The part coatings 11 to 14 are arranged on
the outer cylindrical wall in parallel with the axis 16 of the
kinematic element, the insulations 15 extend in the direction of
the axis. In the illustrated embodiment, the piezoelectric material
is radially polarized, as indicated in FIG. 2a by arrows 17.
Connected to the inner coating 10 and the part coatings 11 to 14
are electrical conductors 18 to 22, for the application of voltages
to the kinematic element. The required voltages for the movements
of the kinematic elements in the X, Y and Z directions are provided
by the generator 23.
When all part coatings 11 to 14 are on the same electrical
potential, and a voltage is applied between these part coatings and
the inner coatings 10, the kinematic element deforms in the axial
direction; in effect, it either elongates or shortens in the
Z-direction in dependence upon the polarity of the applied voltage.
However, when a voltage is applied between individual part coatings
and the inner coating 10 of the piezoelectric tube 9, the free end
of the kinematic element possessing the support 5 bends
perpendicular to its axis 16 in the X or Y direction. The bending
is intensified when voltages of opposite polarity are applied
between the part coatings arranged opposite each other on the outer
cylindrical wall; thus for example between the part coatings 11 and
13 or 12 and 14, whereby the inner coating is at zero
potential.
Through superposition of the above-mentioned voltages, the
kinematic element can be deformed in such a manner that the support
5 will carry out every movement which is necessary for a desired
change in position of the object, whereby the operating voltages
which are required therefor are relatively low because of the
dimensions and thin walled construction of the kinematic
element.
The kinematic elements 1, 2, 3 and scan element 4 are so adjusted
in height relative to each other than the distance between
tunneling tip 7 and the surface of object 6 reaches a sufficient
small gap needed for tunneling microscopy. A fine adjustment of the
distance between the tunneling tip and the surface of the object is
carried out by the application of a suitable voltage to the
kinematic elements and/or the scan element. The arrangement of
kinematic elements and the scan element on the same base plate, and
the identical, piezoceramic material, dimensions and configurations
for the kinematic elements and scan element leads to the same
thermal expansion behavior and to an ideal compensation of thermal
drifts.
In order to obtain a displacement or rotation of the object, FIG. 3
schematically illustrates two possible motion cycles for the
kinematic elements;
FIG. 3a illustrates a motion cycle, in which for the conveyance of
an object from point A to point B, the support 5 of a kinematic
element is moved in four sequential operating steps, as
follows:
(a) Through the synchronized and uniform elongation of all three
kinematic elements 1, 2, 3, the object is initially raised in a
first step a in the Z-direction away from the operativ position of
the tunneling tip 7.
(b) In the second step b, the kinematic elements are rapidly
lowered in the Z-direction, pivoted hereby in the X-Y plane and
again raised, such that there is obtained a somewhat semi-circular
path as the line of movement. This second step b is so controlled
in duration, that the speed of lowering of the supports 5 in the
Z-direction is higher than the movement of the object in the same
direction under the influence of gravity. The supports 5 of the
kinematic elements detach themselves at point A from the object
during the second operating step, because of the inertia of the
object, and will again support the object at point B at the end of
the operating step.
(c) The third step c is a slow movement of the support 5 in the X-Y
plane, whereby the object remains resting on the three kinematic
elements, and is being transported in the direction of the movement
of the kinematic elements the distance between the points A and
B.
(d) After completion of the transport the object is lowered in the
fourth step to the normal operation distance of the tunnel tip in
Z-direction. At the end of this operating step, the kinematic
elements are again located in their initial position, and the
object has been displaced by the distance between the points A and
B.
The operating steps b and c can be repeated for so long, until the
object has reached the operating position wich is desired for the
STM examination. Thereafter follows step d for approaching the
tunneling distance between tip 7 and object surface.
A motion sequence for the kinematic elements which is simplified in
comparison with the above-described sequence is illustrated in FIG.
3b. The kinematic elements are, in accordance therewith, actuated
in only two operating steps;
(a) As the first step a there is effected a rapid movement of the
support 5 on the object surface from point A towards point B.
During this movement of the kinematic elements, because its inertia
the object again remains in an almost unchanged position.
(b) During the second step b the kinematic elements are slowly
returned to their initial positions carrying the object over the
distance between the points A and B.
Each of the motion sequences represented in FIGS. 3a and 3b can be
carried out as a single step or can be repeated by applying of
voltage pulse sequences to the kinematic elements. The step width
and the step frequency of the supports on the kinematic elements
can be varied within a wide range by a suitable control of voltage
amplitude and pulse frequency. With the used piezoelectric
kinematic elements reproducible micro steps of less than 10 nm
could be carried out.
The motion sequences which can be carried out by means of the
kinematic elements are not limited to the movements illustrated in
FIGS. 3a and 3b. To the contrary, it is possible to correlate the
movement of the kinematic elements with the applicable case of
utilization. For example, in addition to the abovedescribed motion
sequences, there are also possible elliptical movements of the
supports, or an upward throw of the object with a rapid positional
change of the supports. The control of the motion sequences is
hereby carried out with consideration being given to the inertia of
the object.
By means of the described kinematic arrangement it is also possible
to impart rotation to the objects around an axis perpendicular to
the support plane. The rotation of the object is effected through
suitable vectorial addition of the voltages in the X- and
Y-direction for each individual kinematic element. Moreover, the
objects can also be tilted. For this purpose, the individual
kinematic elements are to be differently elongated or shortened.
The kinematic arrangement, in addition to translatory motions also
allows for a rotation and tilting of the objects.
The described kinematic elements can also be applied for a precise
transport of objects over extended distances. A transport table 24
with a plurality of mutually neighboringly arranged kinematic
elements 25 is illustrated in FIG. 4. The kinematic elements are
spaced relative to each other in such a distance, that the object
will be supported all the time by at least 3 kinematic elements.
The object can be transported to any position on the table 24.
FIG. 5 illustrates, in a perspective representation, a scan element
4 of a kinematic arrangement for an STM as shown in FIG. 1. The
scan element is constructed in the same manner as a kinematic
element. It possess a tube 26 of the same, radially-polarized
piezoelectric material as does the tube 9 in FIG. 2. It is provided
on its internal cylindrical wall with a closed
electrically-conductive coating 27 forming an inner elctrode, and
on its external cylindrical wall with electrically-conductive part
coatings 28 to 31, with insulating layers 32 in between. In
contrast to the kinematic element, a tunnel tip 7 is connected to
the scan element instead of the support 5.
FIG. 5 schematically illustrates the electrical connections for the
scan element 4. The tunnel current is conducted from the tunneling
tip 7 via the conductor 33 to the amplifier 34. The output voltage
of the amplifier is employed for the movement of the scan element
in the Z-direction (axial direction).
For scanning the tunneling tip 7 in the X- and Y-direction, two
sweep generators 35 and 36 are used. The base potential of these
generators is superimposed by the control voltage for the
Z-direction. The outputs of the sweep generators are connected via
the conductors 37, 38 and 39, 40 with the part coatings of the scan
elements 28, 30 and 29, 31. The inner electrode 27 is in this
embodiment connected to ground potential. In this manner, the inner
electrode can serve as a shielding for the electrical conductor
33.
FIG. 6 shows in a cross-sectional view different feedthroughs for
conductors inside the kinematic elements 2, 3 and the scan element
4. The conductor 33 is connected to the tunnel tip and is shielded
by the grounded inner electrode of the tube. The tunnel current is
amplified and measured in the known and usual manner for STM's.
The temperature of the surface of the object can be measured by
means of a thermal sensor 41, which is located inside the support 5
of the kinematic element 3, as shown in FIG. 6. The connections to
the sensor are led through the inner of the tube of the kinematic
element. In the embodiment of FIG. 6 a second kinematic element 2
is equipped with a conductor 42 which is connected to the support
5. Placing the object 6 onto the supports 5 provides an electrical
conduct between the object and conductor 42. The potential of the
object 6 can thus be varied or determined or the connector 42 can
be used to measure the tunnel current beween object 6 and tunnel
tip 7.
A further type of micromanipulator is illustrated in FIG. 7. The
kinematic arrangement consists of only one kinematic element 50
similar to that in FIG. 2. The reference numbers correspond to
identical construction elements. However, instead of a single
support 5, the kinematic element has a plurality of supporting
points or spheres 54 arranged circumferentially at the rim of the
piezoceramic tube 9 in order to form a probe carrier. In FIG. 7 the
minimum number of only 3 supporting spheres are shown. However,
shape and number of the supports 54 can be varied depending on the
special demands.
The FIGS. 8 and 9 illustrate a possible variation of the kinematic
element or scan element shown in the FIGS. 2 and 5. In this
embodiment, only three outer electrodes are provided rather than
four as in the previously described construction. This variation
takes into account that the kinematic element can be bent in all
X-Y-directions using only three electrodes.
The kinematic arrangement which is illustrated in the exemplary
embodiment is not only employable for the movement of the object in
an STM. Understandably, it can also be employed for the
manipulation of an object for any kind of micromovement; for
microscopic examinations, as well as for treatment of objects in
the microtechnology. For example, it can be employed for
microlithography; for this purpose the tunneling tip has to be
replaced by a suited tool. Beside this, the general construction of
the kinematic arrangement can, in principle, be maintained
unchanged.
In modern high-integration technology the demand for precise
spatially resolved analysis and treatment techniques is steadily
growing. In the large scale integration of semiconductor devices,
sub micron structures are envisioned. This goal can hardly be
reached with conventional methods like optical or particle beam
technology.
A kinematic arrangement of the described type is not only capable
to analyze structures down to atomic dimensions using the STM
method, but also to produce structures with lateral resolutions in
the nm range. In the simplest instance, the construction of such an
arrangement can be similar to that of the previously described STM
application. The object which is to be analized or treated again
rests on at least three supporting elements. For treatment purposes
the tunnel tip has to be replaced by a treating tool. This treating
tool, for example, can consist of a sharply-pointed diamond tip
which can be conveyed over the surface of the object digging
apertures and carving structures on the surface of the object. The
operations can be implemented at high speeds and with high
precision using computer controls. Since the arrangement is capable
of transporting the object with high resolution over large
distances, semiconductor wavers of large dimensions can be
implemented with microstructures.
Adapted as a further treating implement, which can be mounted on a
kinematic element, is also a field-emission tip. Caused by electron
or ion emission, or only by high electrical fields, surface atoms
and molecules can be locally activated. This procedure can be
utilized, for example, for the localized cracking of hydrocarbon
compounds, which leads to a chemical conversion of the "treated"
molecules.
A further utilization for the described kinematic arrangement with
a treating element is in the field of microbiology. Organic
molecular chains, viruses or bacteria can not only be analyzed, but
through the application of fields at localized target points, a
separation or modification of the molecular chain can be carried
out. This capability of a local operation in the molecular range
also opens completely new possibilities in the field of genetic
technology.
It is also logical, within the scope of the invention, that the
kinematic element or elements or the arrangement are inverted so as
to be supported on the upper surface of a positionally fixed or
stationary object which is to be scanned. In other words the
kinematic arrangement is capable to walk or crawl over the surface
of the object in a "beetle-like" manner, allowing thus the
investigation or treatment of larger objects.
* * * * *