U.S. patent number 3,914,464 [Application Number 05/362,220] was granted by the patent office on 1975-10-21 for striped dichroic filter and method for making the same.
This patent grant is currently assigned to Optical Coating Laboratory, Inc.. Invention is credited to Leroy A. Bartolmei, Frederick K. Crosher, Richard Ian Seddon, Michael D. Temple, David G. Thomasson.
United States Patent |
3,914,464 |
Thomasson , et al. |
October 21, 1975 |
Striped dichroic filter and method for making the same
Abstract
Striped dichroic filter having a substantially transparent glass
substrate with a surface and having first and second sets of spaced
parallel stripes disposed on said surface at an angle with respect
to each other and with each of said sets of stripes being capable
of reflecting at least one different color and with the stripes
being formed of a plurality of layers of high and low index
dielectric materials. In the method for making a striped dichroic
filter, first and second sets of spaced parallel stripes are
sequentially formed by sequentially depositing dielectric coating
materials on sequentially formed striped material which is
subsequently etched away to remove the undesired portions of the
coating material so that there remains first and second sets of
spaced parallel stripes at angles with respect to each other and
with each being capable of reflecting at least one different
color.
Inventors: |
Thomasson; David G. (Santa
Rosa, CA), Crosher; Frederick K. (Santa Rosa, CA),
Temple; Michael D. (Santa Rosa, CA), Bartolmei; Leroy A.
(Santa Rosa, CA), Seddon; Richard Ian (Santa Rosa, CA) |
Assignee: |
Optical Coating Laboratory,
Inc. (Santa Rosa, CA)
|
Family
ID: |
26833027 |
Appl.
No.: |
05/362,220 |
Filed: |
May 21, 1973 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
|
|
135131 |
Apr 19, 1971 |
3771857 |
|
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|
Current U.S.
Class: |
430/321; 359/890;
359/891; 427/165; 427/264; 427/270; 430/12; 427/75; 427/259;
427/266; 430/5 |
Current CPC
Class: |
G02B
5/285 (20130101); G03B 33/00 (20130101) |
Current International
Class: |
G02B
5/20 (20060101); G02B 5/28 (20060101); G03B
33/00 (20060101); B05B 005/02 (); B05B
001/32 () |
Field of
Search: |
;117/1.7,8,8.5,33.3,45,69,12R,159,211,215,5.5,33.3CM
;350/164,316,172,317 ;156/3,11 ;96/36.1,36.2 ;340/366B
;313/471,474 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Drummond; Douglas J.
Assistant Examiner: Gallagher; J. J.
Attorney, Agent or Firm: Flehr, Hohbach, Test, Albritton
& Herbert
Parent Case Text
This is a division, of application Ser. No. 135,131 filed Apr. 19,
1971 now U.S. Pat. No. 3,771,857.
Claims
We claim:
1. In a method for making a striped dichroic filter on a
substantially transparent glass substrate having a surface with the
use of a mask having a plurality of spaced parallel stripes
thereon, forming a layer of material on said surface of said
substrate, removing certain portions of the material so that there
remains on said surface a plurality of spaced parallel stripes of
said material with exposed areas of said surface therebetween,
placing a plurality of layers of high and low index dielectric
coating materials on said stripes and on said exposed areas of said
surface to a depth which is substantially less than the height of
the stripes so that the side walls of the stripes are exposed, and
etching away the stripes to permit lifting off of the portions of
the dielectric coating materials carried by the stripes so that
there remains on said surface a first set of stripes formed of said
layers of high and low index dielectric coating materials capable
of reflecting at least one color.
2. A method as in claim 1 together with the steps for forming
additional material on the first set of stripes and on said
surface, removing some of the additional material so that there
remains an additional plurality of spaced parallel stripes of the
additional material with exposed areas of said surface
therebetween, placing a plurality of layers of high and low index
dielectric coating materials on the additional stripes and on said
exposed areas of said surface and said first set of stripes to a
depth which is less than the height of the additional material, and
etching away the exposed additional stripes so as to lift off the
additional coating materials so that there remains a second set of
stripes capable of reflecting at least one color different from the
color reflected by the first set of stripes.
3. A method in claim 1 wherein said material is a negative
photoresist.
4. A method as in claim 1 wherein said material is a metal.
5. A method as in claim 2 together with the step of forming
additional material on said first and second stripes and said
surface, removing portions of said last named additional material
so that there remains a plurality of stripes in said material with
exposed areas of said surface therebetween, placing a plurality of
layers of high and low index dielectric coating materials on said
last named stripes and on said exposed areas of said surface to a
depth which is substantially less than the height of the last named
additional material such that the side walls of the last named
additional material are exposed, and etching away the exposed last
named additional material so as to lift off portions of the coating
so that there remains a third set of stripes capable of reflecting
at least one color different from the colors reflected by the first
and second set of stripes.
6. In a method for making a striped dichroic filter on a
substantially transparent glass substrate having first and second
surfaces with the use of a mask having a plurality of spaced
parallel stripes thereon, forming a layer of negative photoresist
on said first surface of said substrate, exposing said photoresist
utilizing said mask, developing the photoresist to remove certain
portions of the photoresist so that there remains on said first
surface a plurality of spaced parallel stripes of photoresist,
baking the photoresist, depositing a multilayer dielectric coating
on said photoresist stripes and on said first surface to a depth
which is substantially less than the height of the photoresist so
that the side walls of the photoresist are exposed, and etching
away the exposed photoresist so as to lift off the portions of the
layer of the coating carried by the photoresist and to remove the
remainder of the photoresist so that there remains on said first
surface a first set of spaced parallel stripes of a color
reflecting coating.
7. A method as in claim 6 together with the step of forming an
additional layer of positive photoresist on said surface and on
said color reflecting stripes, exposing the additional photoresist
utilizing the mask to provide a plurality of spaced parallel
exposed stripes which extend at an angle with respect to the color
reflecting stripes, developing the additional photoresist so that
there remains a plurality of photoresist stripes which extend over
said surface and over said color reflecting stripes, baking the
photoresist, depositing a different color reflecting multilayer
dielectric coating on said additional photoresist to a depth which
is less than the height of the additional photoresist so that the
side walls of the additional photoresist are exposed, and etching
away the additional photoresist to lift off the coating material
carried thereby so there remains a second set of stripes of the
different color reflecting coating material which extend at an
angle to the first set of color reflecting stripes.
8. A method as in claim 6 wherein said photoresist is deposited at
a depth of 4 to 6 microns and wherein said coating is deposited to
a depth of approximately 2 microns.
9. A method as in claim 7 wherein said first set of stripes of
coating material reflect in the red and wherein said second named
color reflecting stripes reflect in the blue.
10. A method as in claim 7 together with the step of depositing an
additional layer of positive photoresist on said red reflecting and
blue reflecting stripes, utilizing the master to expose the last
named additional photoresist, removing portions of the last named
additional photoresist so that there remains photoresist stripes
extending at an angle with respect to said first and second sets of
color reflecting stripes, and depositing a color transmitting
multilayer dielectric coating on said last named additional
photoresist and in the spaces between the last named additional
photoresist to a depth so that the side walls of the last named
additional photoresist are exposed, removing the last named
additional photoresist from a portion of the coating material
covered thereby so that there remains a third set of spaced
parallel green reflecting stripes which extend at an angle with
respect to the red reflecting and the blue reflecting stripes.
11. A method as in claim 6 wherein said photoresist is exposed
through the mask by the use of a collimated light source.
12. A method as in claim 6 together with the step of applying a red
antihalation coating to the second surface of the substrate to
minimize second surface reflections from the substrate.
13. A method as in claim 6 wherein said photoresist is a positive
photoresist.
14. A method as in claim 6 wherein heated Xylene is utilized for
etching away the photoresist.
15. A method as in claim 6 wherein said Xylene has a temperature of
approximately 100.degree.C.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to striped dichroic filters which are
particularly useful in connection with color television making it
possible to utilize a single vidicon tube for viewing the scene to
produce a color image and a method for making striped dichroic
filters.
2. Description of Prior Art
Satisfactory striped dichroic filters have heretofore not been
available. Heretofore, filters having a single set of spaced
parallel stripes have been provided. However, even these have not
been satisfactory because the stripes have been formed of materials
which have been relatively soft. There is, therefore, a need for a
new and improved striped dichroic filter.
SUMMARY OF THE INVENTION AND OBJECTS
The striped dichroic filter consists of a substantially transparent
glass substrate which has a surface. A first set of spaced parallel
stripes capable of reflecting at least one color are provided. A
second set of spaced parallel stripes capable of reflecting at
least one color different from said one color reflected by said
first set of stripes is also provided. The first and second sets of
stripes are disposed on said surface at an angle with respect to
each other with the first and second sets overlying each other on
certain areas of said surface. Each of the stripes is formed of a
plurality of layers of high and low index dielectric materials. A
third set of spaced parallel stripes can be provided which are
disposed on said surface at an angle with respect to said first and
second sets of stripes and are capable of reflecting at least one
color different from the one colors reflected by the first and
second sets of stripes.
In the method for forming the striped dichroic filter, relatively
thick spaced parallel stripes of the material are formed on the
substrate. Dielectric coating materials are deposited on the
stripes and on the surface to a depth which is insufficient to
cover the side walls of the stripes. The material is then etched
away for lifting off the coating material carried by the stripes so
that there remains a first set of spaced parallel stripes of the
coating materials on the substrate. Additional, relatively thick
spaced parallel stripes of a material are formed on the substrate
and on the first set of stripes. Dielectric coating materials are
deposited on the additional stripes and on said first set of
stripes and said surface to a depth insufficient to cover the side
walls of the additional stripes. The additional stripes are then
etched away to lift off the coating material carried by the
additional stripes so that there remains the second set of spaced
parallel stripes of coating materials on the surface of the
substrate disposed at an angle with respect to the first set of
spaced parallel stripes. If desired, an additional third set of
spaced parallel stripes can be formed on the substrate with the
stripes of each set being capable of reflecting at least one color
different from the colors reflected by the other sets of
stripes.
In general, it is an object of the present invention to provide a
striped dichroic filter in which the stripes are formed by a
plurality of layers of high and low index dielectric materials.
Another object of the invention is to provide a filter of the above
character in which more than one set of stripes is provided with
each set of stripes being disposed at an angle with respect to the
other sets of stripes.
Another object of the invention is to provide a filter of the above
character in which the stripes are formed of materials which can be
readily cleaned without damaging the stripes.
Another object of the invention is to provide a filter of the above
character in which the stripes are relatively durable.
Another object of the invention is to provide a filter of the above
character in which the sets of stripes are disposed on the same
surface of the substrate.
Another object of the invention is to provide a filter of the above
character in which the stripes provide good general
performance.
Another object of the invention is to provide a filter of the above
character in which each set of stripes is capable of reflecting at
least one color different from the other sets of stripes.
Another object of the invention is to provide a filter of the above
character in which high line densities can be obtained.
Another object of the invention is to provide a method for making
striped dichroic filters which utilizes a lift-off technique.
Another object of the invention is to provide a method of the above
character in which a photoresist lift-off technique is
utilized.
Another object of the invention is to provide a method of the above
character which is repeatable.
Another object of the invention is to provide a method of the above
character which has high yield.
Additional objects and features of the invention will appear from
the following description in which the preferred embodiments are
set forth in detail in conjunction with the accompanying
drawing.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a plan view of a striped dichroic filter incorporating
the present invention.
FIG. 2 is an elevational view looking along the line 2--2 of FIG.
1.
FIGS. 3-11 are enlarged cross-sectional views which show the method
for making a striped dichroic filter with stripes of two
colors.
FIGS. 12-15 are cross-sectional views showing additional steps
required for making a filter having stripes of three colors.
FIGS. 16-18 are graphs showing the spectral performance which can
be obtained from a striped dichroic filter.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
In FIGS. 1 and 2, there is shown a striped dichroic filter
incorporating the present invention. As shown therein, the filter
consists of a substrate 21 which is substantially transparent. It
is preferably formed of a low coefficient expansion glass such as
Pyrex type 7052 (Kovar sealing glass) supplied by Corning Glass
Works having an index or refraction of 1.52. The substrate 21 is
provided with two spaced parallel surfaces 22 and 23 which are
highly polished (60-40 over the entire surface) and are very flat
(3) fringes or less over a diameter of the part). The substrate 21
can have any desired size. For example, it can have a diameter of
approximately one inch and have a thickness of approximately 0.1
inch.
A cross-stripe coating 26 is deposited on the surface 22 and forms
the striped dichroics for the filter as hereinafter described. As
will be noted, the coating 26 does not cover the entire surface 22
but is limited so that an outer annular region 22a of the surface
22 remains uncoated. A fiducial mark 28 is provided on the
substrate 21 and is located on the side 23 opposite the side 22 on
which the coating 26 is deposited and is positioned so that it is
visible through the clear surface area 22a. The fiducial mark may
be applied in any desired manner such as by scribing, painting,
etching, sawing and the like.
One method by which the coating 26 is formed on the substrate 21 to
provide the striped dichroic filter may now be briefly described as
follows. A substrate 21 of the character hereinbefore described is
obtained and the fiducial mark 28 is applied to the substrate 21 in
the desired location. The substrate 21 is then thoroughly cleaned.
After it has been cleaned, a layer 31 of material such as a layer
of a conventional negative photoresist such as Eastman Kodak KTFR
is applied to the surface 22 until it has a thickness ranging from
4 to 6 microns. The photoresist can be applied in any desired
manner such as by dropping liquid photoresist onto the surface 22
while the substrate 21 is being spun. After the layer 31 of
photoresist has been applied, it is permitted to dry. This drying
can be facilitated by placing the substrate 21 in an oven or other
suitable heating means to provide a pre-exposure bake at
atmospheric (no vacuum) for a suitable period of time so that the
photoresist is dry as, for example, 10 minutes at 75.degree.C.
(167.degree.F.).
After the photoresist has been permitted to dry, a red antihalation
coating 22 (see FIG. 4) is applied to the fiducial mark on side 23
of substrate 21 by brushing or spraying it on and is then permitted
to air dry. One material found to be satisfactory for this purpose
is supplied by Norland. The red antihalation coating is provided to
prevent second surface reflection from the surface 23 of the
substrate. If the antihalation coating were not present, some of
the ultra-violet energy would be reflected back by the second
surface 23 to expose additional portions of the photoresist which
would be undesirable. In other words, a ghost image would be
produced in the photoresist. The antihalation coating on the
surface 23 serves to make the surface 23 look as if there were no
discontinuity and, in addition, the antihalation coating serves to
absorb ultra-violet energy so that in effect the glass substrate 21
appears to have infinite depth and, therefore, does not provide a
second surface reflection.
The photoresist is then exposed through a master mask such as a
chrome photomask utilizing collimated light from a light source
which includes a Xenon arc lamp. This ensures that a collimated
beam will strike the mask and will penetrate the photoresist layer
31 in straight lines. The fiducial mark 28 is utilized to align the
substrate 21 with the mask. The ultraviolet light emanating from
the Xenon arc source polymerizes the photoresist where it strikes
the photoresist.
After the photoresist layer 31 has been exposed, the antihalation
layer 32 can be removed in a suitable manner such as by the use of
Scotch tape.
The photoresist layer 21 is then developed by utilizing a suitable
developer such as Eastman Kodak KTFR developer which removes the
photoresist which has not been polymerized by the ultra-violet
light. After use of the developer, the substrate is rinsed with a
KTFR rinse and then blown dry. These steps are repeated as
necessary until the development is complete which can be
ascertained by visual inspection of the photoresist layer 31 under
a microscope. After the photoresist has been developed, there are
provided a plurality of spaced parallel stripes 31a of the
photoresist material with spaced parallel recesses 36 in the
photoresist exposing the surface 22 as shown in FIG. 5.
After the recesses 36 have been formed in the photoresist, the
substrate with the photoresist remaining is baked under a vacuum
ranging from approximately 10.sup..sup.-1 to 10.sup..sup.-1 torr at
a temperature of approximately 200.degree.C. for a minimum of
approximately 8 hours. Baking hardens the photoresist layer and, in
addition, causes some of the various solvents that are entrapped in
the photoresist to be outgassed.
It should be appreciated that the KTFR which has been utilized as a
photoresist in a positive resist which, when exposed to heat or
more light, becomes harder and harder. It is possible to utilize a
negative photoresist such as KEMR. However, the use of such
photoresist is not as desirable because such a resist when it is
exposed to light or to a high temperature becomes softer rather
than harder.
After the stripe-like recesses 36 has been formed, the substrate 21
can be cleaned with a detergent and then rinsed in deionized water
and dried by blowing air on the same. The resist is in the form of
parallel raised stripes 31a extending across the substrate 21. It
is desirable that the stripes 31a be from 2 to 3 times thicker than
the multilayer coating which is to be deposited in the recesses. To
avoid excessive shadowing during application of the multilayer
coating, a width to height ratio of at least five is desirable for
the lines or stripes 31a.
After the photoresist stripes 31a have been formed as shown in FIG.
5, the substrate 21 is placed in a vacuum coating chamber and a
suitable multilayer dielectric coating 38 such as a coating capable
of reflecting at least one color such as red is deposited on the
substrate 21 on the side facing the photoresist 31. The coating is
deposited on the stripes 31a and in the recesses 36 and has a
thickness which is substantially less than the depth of the
recesses 36 so that the upper portions of the side walls of the
photoresist stripes 31a will be exposed as shown in FIG. 6. By way
of example, the coating 38 can have a thickness of approximately 2
microns, whereas the photoresist 31 can have a thickness from 4 to
6 microns. It is desirable that the photoresist in general have a
thickness which is substantially greater than the thickness of the
coating which is to be applied because the thickness of the
photoresist may vary over the surface of the substrate 21 and it is
necessary that the photoresist stripes 31a have a height which is
substantially above the coating 38 within the recesses 36 so that
the side walls of the photoresist stripes will be exposed.
The red reflecting coating 38 is designed so that it will match
with the index of refraction of the glass substrate 21 which can
have an index of refraction of 1.52 and the other side can match
into an index of approximately 2.0 which is the index of refraction
of thephotocathode of a vidicon tube with which the dichroic filter
is to be utilized. A suitable design for a red reflecting coating
is set forth below. ##EQU1##
As can be seen from the above, the red reflecting or Cyan
transmitting coating consists of a red reflecting stack which is
centered at 715 nanometers and reflects from approximately 590 -
750 nanometers (see FIG. 16). Anti-reflection layers are provided
on each side of the stack. The low index material can be a suitable
quartz-like material such as quartz (SiO.sub.2) having an index of
refraction of 1.46 which is formed by silicon monoxide (SiO) which
is gas reacted with oxygen to produce silicon dioxide (SiO.sub.2).
The high index material is titanium dioxide which has an index of
refraction of 2.3. The antireflection layers consist of two layers.
The one adjacent the surface 22 has a quarter wave optical
thickness at 792 nanometers and the other low index layer has a
quarter wave optical thickness at 420 nanometers. Both layers serve
to match the 1.52 index of the glass substrate 21. The other
anti-reflection coating is formed of a low index material and has a
quarter wave optical thickness at 500 nanometers and matches the
red reflecting coating into the 2.0 index of the photocathode.
Thus, the multilayer coating is comprised of 16 layers and is
reflecting from 590 to 750 nanometers.
After the coating operation has been completed, the substrate 21 is
immersed in a suitable solvent as, for example, Xylene which is
preferably at an elevated temperature as, for example,
100.degree.C. After soaking in the hot Xylene for a suitable period
of time, preferably in excess of 1 hour, it has been found that the
hot Xylene first attacks the exposed side walls of the resist
stripes 31a and thereafter loosens, swells and dissolves the
resist. After a suitable period of time, the substrates or parts 21
can be removed from the hot Xylene and the parts rubbed lightly
with a cotton ball to readily remove any excess resist which
remains on the substrate so that all that remains are a first set
of spaced parallel lines 35a formed from the coating 38. Thus, it
can be seen that the photoresist stripes are lifted from the
substrate 21 by the hot Xylene to produce the lines 38a.
By way of example, the lines formed by the coating 38 can have a
thickness of approximately 1.7 microns and a width of approximately
25 microns.
The substrate is then baked at 550.degree.F. for approximately 2
hours, after which it is cleaned with a detergent and thereafter
rinsed with deionized water and dried by blowing air on the
same.
After the substrate has been cleaned, another layer 41 of a
material such as KTFR, a positive photoresist, is spun onto the
surface 22 and over the stripes 38 as shown in FIG. 8 so that the
photoresist has a depth ranging from 4 to 6 microns. The
photoresist layer 41 is then baked at an atmospheric temperature of
approximately 75.degree.C. for a period of approximately 10 minutes
and a red antihalation coating 42 is applied to the surface 23 of
the substrate 21 or, in other words, is applied to the fiducial
mark side of the substrate 21.
The master mask 33 is positioned so that it overlies the substrate
21 and so that the stripes on the master mask are positioned at a
predetermined angle with respect to the stripes 38 as, for example,
an angle of approximately 41.degree.. The photoresist layer 41 is
then exposed to a collimated light source utilizing a Xenon arc
lamp to expose the photoresist in the manner similar to the manner
in which the photoresist layer 31 was exposed. The antihalation
coating 42 is then removed by the use of Scotch tape. The
photoresist layer 41 is then spray developed utilizing KTFR
developer and then rinsing with a KTFR rinse. The substrate 21 is
then dried by blowing air on the same. The undeveloped photoresist
which has been removed leaves parallel recesses 43 and a plurality
of spaced stripes 41a of photoresist which overlie and cross the
red reflecting stripes 38a and overlie the surface 22.
The substrate 21 is then taken and placed in a vacuum oven and
baked at a temperature of approximately 200.degree.C. for a minimum
of 8 hours in a vacuum of 10.sup..sup.-1 to 10.sup..sup.-2 Torr. As
in the previous step, this baking causes outgassing of any
entrapped solvents in the photoresist and, in addition, hardens the
photoresist. The substrate 21 is then cleaned with a detergent,
rinsed in deionized water and dried by blowing air on the same. A
multilayer dielectric reflecting coating 46 capable of reflecting
at least one color different from the one color reflected by the
first set of stripes is then deposted over the photoresist stripes
41a, the red reflecting stripes 38a and on the surface 22 as shown
in FIG. 10. The reflecting coating 46 which can reflect a color
such as blue is deposited to a suitable depth as, for example,
approximately 2 microns. It is necessary that the photoresist
stripes 41a have a height which is significantly greater than the
coating 46 so that the side walls of the photoresist are exposed as
shown in FIG. 10 for reasons pointed out with respect to stripes
31a.
A design for a suitable blue reflector is set forth below.
##EQU2##
It can be seen that the design for the blue reflecting or yellow
transmitting coating includes a blue reflecting stack centered at
394 nanometers which reflects from approximately 350 to 485
nanometers (see FIG. 17). Anti-reflecting layers are provided on
both sides of the blue reflecting stack. Thus, there is provided a
layer of low index material having a quarter wave optical thickness
of 600 nanometers for matching to the red reflecting coating. On
the other side of the blue reflecting stack, there is provided a
layer of high index material having a quarter wave optical
thickness at 82 nanometers and a layer of low index material having
a quarter wave optical thickness at 318 nanometers for a total of
17 layers for the blue reflecting coating. The last layer of the
blue reflecting stack combines with the layer having a quarter wave
optical thickness of 72 nanometers to provide a combined layer
having a quarter wave optical thickness at 279 nanometers. The low
and high index materials utilized for the layers can be of the type
hereinbefore described in conjunction with the red reflecting
coating.
After the blue reflecting coating has been deposited upon the
substrate, the substrate is immersed in hot 100.degree.C. Xylene
for a suitable period as, for example, preferably in excess of 1
hour. As explained previously, the hot Xylene attacks the exposed
side walls of the photoresist stripes 41a so that the portions of
the coating 46 overlying the photoresist stripes can be lifted off
so that there remains two sets of stripes, one, the red reflecting
stripes 38a and the other blue reflecting stripes 46a which cross
over each other at an angle of approximately 41.degree.. One set of
stripes 38a reflects the red energy and transmits blue and green
energy. The second set of stripes 46a reflects blue energy and
transmits green and red energy. In the areas where the stripes
cross each other, the coating serves to transmit the green and
reflect the red and the blue. In other areas where there is no
coating on the surface 22, substantially 100% of the light is
transmitted. These respective areas have been indicated in FIG. 11
in which the areas are identified with letters as set forth
below:
C = clear area
-R = red reflector (or Cyan by transmittance)
-B = blue reflector (or yellow by transmittance)
G = green transmitter (overlap of -R and -B)
The design for the composite (intersections) of the red and blue
reflecting coatings 38a and 46a is shown below: ##EQU3##
The red and blue reflector stacks can be readily identified. The
last reflecting layer of the red stack and the first
anti-reflecting layer of the blue stack are combined to provide the
layer formed of low index material having a quarter wave optical
thickness of 1100 nanometers. A curve showing the results of Cyan
plus yellow which provide magenta is shown in FIG. 18.
After the substrate has been soaked in Xylene for a suitable period
of time, the photoresist is lifted off by gently scrubbing the
resist from between the stripes 46a. The substrate is then cleaned,
rinsed with ionized water and blown dry with air. The substrate is
then baked at a suitable temperature, such as 550.degree.F., for a
period of approximately 2 hours.
For the 715 nanometer red reflecting stack, the Herpin index in the
region of interest is 1.0. For the 394 nanometer blue reflecting
stack, the Herpin index varies from about 0.9 to 1.5. The Herpin
indices are numbers which are generated for the dielectric stack
based upon the indices of refraction of the materials utilized in
the stack.
This completes the dichroic filter so that it can be utilized in
conjunction with a vidicon tube as hereinafter described.
In certain applications, there is a need for an additional set of
stripes on the dichroic filter which serve as a reflector for a
different color such as green. For such stripes, it is necessary to
provide a coating which has a relfection from approximately 505 to
585 nanometers to provide a relatively narrow reflection band in
the green. This additional set of stripes is provided in a manner
very similar to the manner in which the previous stripes were
provided on the dichroic filter. Thus, after the steps have been
completed to form the dichroic filter as shown in FIG. 11, the
dichroic filter is cleaned and then a layer 51 of a KTFR positive
photoresist is spun onto the substrate 21 and overlies the red
reflecting stripes 38a and the blue reflecting stripes 46a to a
suitable depth as, for example, 4 to 6 microns. The substrate is
then subjected to a pre-exposure bake for a period of 10 minutes at
75.degree.C. A red antihalation coating 52 is applied to the back
side for the side 23 of the substrate 21 carrying the fiducial mark
for a purpose hereinbefore described. The photoresist layer 51 is
then exposed through the master 33 with the master having its
stripes aligned at a predetermined angle with respect to the red
reflecting and blue reflecting stripes as, for example, an angle of
45.degree. with respect to the red reflecting stripe and an angle
of 45.degree. with respect to the blue reflecting stripes. The
photoresist is again exposed through a collimated light source
utilizing a Xenon arc. After exposure, the antihalation coating 52
is removed and the KTFR is developed by utilizing a spray
developer. The substrate is then rinsed with the KTFR rinse to
remove the undeveloped photoresist to provide recesses 53 formed
between stripes 51a of the photoresist. The photoresist is then
vacuum baked at approximately 200.degree.C. for a minimum of 8
hours in the manner hereinbefore described and thereinafter is
cleaned, rinsed in deionized water and blown dry with air. A
multilayer dielectric coating 56 is then deposited upon the
substrate on the photoresist stripes and on the red reflecting
stripes 38a and the blue reflecting stripes 46a as shown
particularly in FIG. 14. The green reflecting coating can have a
design as follows:
1.52 H L (0.14L H 0.14L).sup.12 L 1810 63 844 1880
To obtain a narrow reflection band, a mismatched stack is utilized.
As is well known to those skilled in the art, a normal stack is
defined as one which consists of a one-to-one ratio of high index
layers to low index layers. The present green reflecting stack is a
mismatched stack which has a ratio of 31/2 times more high index
material than low index material which results in a narrow band
pass. The green reflecting stack is centered at 844 nanometers and
reflects from 505 to 585 nanometers. Anti-reflecting layers are
provided on both sides of the green reflecting stack. Thus, there
is provided a layer of high index material having a quarter wave
optical thickness of 1810 nanometers. There is also provided a
layer of low index material which has a quarter wave optical
thickness at 63 nanometers. This anti-reflection coating serves to
match the green reflecting coating to the red reflecting stripes
and also to the blue reflecting stripes. The outer anti-reflection
layer has a quarter wave optical thickness at 1880 nanometers,
which is utilized for matching the green reflecting stripes to
air.
Zirconium oxide (ZrO.sub.2) with an index of refraction of
approximately 2.0 was utilized as a high index material, whereas
Vycor was utilized as the low index material. Zirconium oxide was
utilized as a high index material rather than titanium dioxide
because the high index layers are relatively thick. To make
titanium dioxide layers of this thickness would require a
substantial amount of time and also reduce the glow step which must
be utilized with titanium oxide to reduce the absorption to an
acceptable level. The use of zirconium oxide is also advantageous
in that it provides a narrower rejection band as contrasted with
silicon oxide and a quartz-like material such as Vycor or
quartz.
After the coating 56 has been deposited, the substrate 21 is baked
at a temperature of 550.degree. for approximately 2 hours, after
which the substrate is immersed in hot 100.degree.C. Xylene for a
suitable period as, for example, 1/2 hour to 1 hour, after which it
is gently rubbed to lift off the photoresist stripes and the
portions of the coating carried thereby so that there only remains
spaced parallel green reflecting stripes 56a which cross over the
red reflecting stripes 38a and the blue reflecting stripes 46a as
shown in FIG. 15. The various areas of the dichroic filter formed
of the three types of stripes can be identified as follows:
C = clear
-R = red reflector (or Cyan)
-B = blue reflector (or yellow)
G = green transmitter (or overlap of -R and -B)
-g = green reflection
After the photoresist has been lifted off, the substrate can be
cleaned, rinsed with deionized water and dried, after which it is
baked at 550.degree.F. for approximately 2 hours. The dichroic
filter is then complete and is ready for use. By way of example,
dichroic filters in accordance with the present invention were able
to meet the following specifications. The red reflecting (Cyan) and
blue reflecting (yellow) stripes were both placed on a single
surface of the substrate. A stripe frequency of 500 line pairs per
inch was readily achieved. The red reflecting and blue reflecting
stripes were oriented at 41.degree. .+-. 1.degree. with respect to
each other.
The red reflecting (Cyan) filter had 50% absolute transmittance at
595 millimicrons .+-. 7 millimicrons. Transmittance was 80% average
or greater from 400 to 535 millimicrons in media of N = 2.0.
Transmittance was 5% or less from 600 to 700 nanometers when in
media of N = 2.0. The blue reflecting (yellow) filter had a 50%
absolute transmittance at 480 nanometers .+-. 7 nanometers.
Transmittance was 80% average or greater from 512 to 700 nanometers
when in a media of N =2.0. Transmittance was 5% or less from 400 to
418 nanometers when in media of N = 2.0.
The line width variation from one dichroic filter to another in the
mean width of the Cyan and yellow lines over a clear substrate was
within 20% of nominal. On any particular dichroic filter, the
respective mean dimensions of all solid areas of a given color were
within 10% of the largest dimension recorded.
In general, it can be stated that there has been provided a method
which utilizes a resist lift-off technique dor producing striped
dichroics of excellent quality which is very hard and durable. It
will pass conventional rubber eraser tests and various humidity
tests so that the filter can be readily cleaned. In addition, it
can readily withstand the processing steps which are encountered in
incorporating the same in a vidicon tube as hereinafter described.
The filter has excellent spectral performance with high reflection
in the required regions and high transmission outside of the
rejection region.
In order to utilize the striped dichroic filter, it is necessary to
position the striped dichroic filter in the image plane. One manner
in which this can be accomplished is by placing the striped
dichroic filter within a vidicon tube and integral with the face
plate of the vidicon tube so that it is in the image plane for the
vidicon tube. Alternatively, a fiber optic face plate can be
provided for the vidicon tube to take the image plane from the
inside of the vidicon tube and to bring it to an exterior surface
to which the striped dichroic filter can be secured. In this way,
it will be possible to cement the stripes directly to the face of
the fiber optics face plate. Still another manner in which the
striped dichroic filter could be utilized is by the use of a relay
lens which again moves the image plane from the inside of the face
of the vidicon tube. With utilization of such relay lenses, it
would be possible to separate the stripes and place them on
separate substrates if desired.
Although the preceding method which has been described for making
striped dichroic filters incorporating the present invention has
stressed a resist lift-off technique, it should be appreciated that
a metal lift-off technique can be utilized if desired. In utilizing
the metal lift-off technique or method, a metal layer would be
deposited on the surface 22 in place of the resist layer 31 to a
similar thickness as, for example, a thickness of 5 to 6 microns.
Nickel or chromium have been found to be suitable for this purpose.
Thereafter, a photoresist layer is applied to the metal layer and
the photoresist layer is exposed in the conventional manner and the
undeveloped photoresist removed to expose a striped pattern in the
metal. The metal is thereafter etched away by a suitable etch to
expose the surface 22. A coating which is to form the first set of
stripes of the dichroic filter can then be deposited in the
recesses in the metal and also on the metal. The coating is again
applied to a thickness which is substantially less than the
thickness of the metal stripes so that portions of the side walls
of the metal stripes are exposed and can be subsequently etched
away to lift off the undesired coating material and the metal so
that there remains a set of multi-layer dielectric stripes of the
type hereinbefore described. When the next set of stripes is ready
to be formed, a metal layer can again be deposited on the stripes
in the same manner as the layer of photoresist to a depth of 5 to 6
microns and the same steps repeated to form the next set of
stripes. Thus, it can be seen that a striped dichroic filter can be
made utilizing a metal lift-off technique as well as the resist
lift-off technique hereinbefore described. The resist lift-off
technique has been chosen as a preferable method because it
requires fewer steps and also because the deposition of the nickel
or chromium metal to a suitable thickness requires a substantial
period of time as, for example, 2 hours in a coating chamber.
Although the striped dichroic filter described has been
particularly adapted for the utilization with color television, it
is readily apparent that in place of the colored stripes that have
been provided, stripes having other color characteristics can be
readily provided.
It is apparent from the foregoing that there has been provided a
striped dichroic filter and method for making the same which has
excellent characteristics and which is particularly adapted for use
in conjunction with a single tube vidicon camera for obtaining the
necessary color information from the scenes being viewed by the
vidicon tube. The color information which is obtained is matrixed
to provide the red, blue and green information from either the two
types of dichroic filters which are disclosed.
* * * * *