U.S. patent number 3,911,327 [Application Number 05/489,172] was granted by the patent office on 1975-10-07 for mounting assembly for integrated circuits heat sink and clamp means.
This patent grant is currently assigned to SGS ATES Componenti Elettronici SpA. Invention is credited to Giuseppe Cossuta, Bruno Murari, Sergio Orsucci.
United States Patent |
3,911,327 |
Murari , et al. |
October 7, 1975 |
Mounting assembly for integrated circuits heat sink and clamp
means
Abstract
A mounting assembly for an integrated circuit comprises a
synthetic-resin flexible spacer body having a face and unitarily
formed with a pair of end regions having a predetermined height
above the face and with a central region bridging the end regions
and having a maximum height above the face smaller than the height
of the end regions by a distance at most equal to the thickness of
the integrated-circuit package to be mounted. Each of the end
regions is formed with the throughgoing hole alignable with a
similar hole in a heatsink plate and in a circuit board so that
screws passing through each of these holes can clamp the end
regions between the rigid heatsink plate and the circuit board with
the central region pressing the integrated-circuit package
resiliently against the heatsink plate.
Inventors: |
Murari; Bruno (Milan,
IT), Cossuta; Giuseppe (Milan, IT),
Orsucci; Sergio (Milan, IT) |
Assignee: |
SGS ATES Componenti Elettronici
SpA (Milan, IT)
|
Family
ID: |
11220191 |
Appl.
No.: |
05/489,172 |
Filed: |
July 17, 1974 |
Foreign Application Priority Data
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Jul 19, 1973 [IT] |
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26760/73 |
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Current U.S.
Class: |
361/718;
174/16.3; 257/707; 257/727; 257/E23.092; 257/E23.084; 361/704;
257/719; 174/138R |
Current CPC
Class: |
H01L
23/4334 (20130101); H01L 23/31 (20130101); H01L
23/4006 (20130101); H01L 2023/4087 (20130101); H01L
2023/4081 (20130101); H01L 2023/4025 (20130101); H01L
2924/0002 (20130101); H01L 2924/0002 (20130101); H01L
2924/00 (20130101) |
Current International
Class: |
H01L
23/40 (20060101); H01L 23/28 (20060101); H01L
23/34 (20060101); H01L 23/31 (20060101); H01L
23/433 (20060101); H05k 007/20 () |
Field of
Search: |
;317/100
;174/DIG.3,DIG.5,15R,16R,52PE ;357/79,80,81 |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
IBM Tech. Discl. Bulletin, External Module Heat Sink Fastened to
Board, Cunavelis and Ing, Vol. 14, No. 1, June 1971..
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Primary Examiner: Tolin; Gerald P.
Attorney, Agent or Firm: Ross; Karl F. Dubno; Herbert
Claims
We claim:
1. A semiconductor circuit board assembly comprising:
an integrated-circuit package having a pair of opposite sides;
a heatsink plate engaged with one of said sides and provided with
apertures;
a synthetic-resin flexible spacer body having a face and unitarily
formed with a pair of end regions having a predetermined height
above said face and with a central region extending between said
end regions and having a maximum height above said face smaller
than the height of said end regions by a distance at most equal to
the thickness of said package between said sides, each end region
being formed with a throughgoing bore at said face, said package
being located in said central region between said sides;
a circuit board formed with holes aligned with said bores; and
clamping means extending through said apertures, said bores and
said holes, thereby gripping said end regions between said heatsink
plate and said circuit board and thereby pressing said package with
said central region against said heatsink plate.
2. The assembly defined in claim 1 wherein said body is insulating
and thermoplatic.
3. The assembly defined in claim 2 wherein said face is
substantially planar.
4. The assembly defined in claim 3 wherein said end regions are
spaced apart by a distance greater than the overall length of said
package.
5. The assembly defined in claim 4 wherein said central region has
a minimum height adjacent said end regions less than said maximum
height.
6. The assembly defined in claim 5 wherein said central region is
subdivided into a middle section of said maximum height and a pair
of end sections tapering from said maximum height to said minimum
height, whereby when clamped against said other side of said
integrated-circuit package only said middle section engages
same.
7. The assembly defined in claim 6 wherein said body is elongated
and said end regions have a width transverse to the longitudinal
centerline of said body equal to approximately twice the
corresponding transverse width of said central region.
8. The assembly defined in claim 1 wherein said clamping means
includes a pair of screws each extending through a respective bore
and hole, said board also being formed with a pair of bores
alignable with said holes and receiving said screws.
9. The assembly defined in claim 1 wherein said body and said board
are substantially more flexible than said heatsink plate.
Description
FIELD OF THE INVENTION
The present invention relates to a mounting assembly for an
integrated circuit. More particularly this invention concerns an
arrangement for securing an integrated circuit package and a
heatsink to a printed-circuit board.
BACKGROUND OF THE INVENTION
An integrated circuit is usually incapsulated in a synthetic-resin
body and provided with a so-called thermal mass having a face
intended to disipate heat produced in the integrated circuit. The
amount of heat energy which can be disipated by this thermal mass
is often relatively limited so that in many high-power
installations it is necessary to provide a heatsink on the
integrated-circuit package in engagement with the thermal mass.
Such heatsinks are generally rigid with the package and result in
insufficient heat disipation for two main reasons. First of all
some the contact feet penetrate more deeply into the holes in the
printed circuit board than other contact feet. Secondly the surface
of the package in contact with the heatsink is occasionally not
perfectly smooth so that the heat-sink does not lie in direct
heat-conducting relationship with this surface at all points. Such
difficulties considerably reduce the heat-disipation capacity of
the mounting assembly.
OBJECT OF THE INVENTION
It is therefore an object of the present invention to provide an
improved semiconductor circuit assembly.
Another object is the provision of an improved mounting assembly
for an integrated circuit.
Yet another object is to provide such an assembly which ensures
good heat disipation by the heatsink so that the integrated circuit
can operate with maximum efficiency.
SUMMARY OF THE INVENTION
These objects are attained according to the present invention in a
semiconductor circuit assembly comprising an integrated circuit
having a pair of opposite sides, and a heatsink plate engageable
with one of the sides. A synthetic-resin flexible spacer body has a
face on one side and is unitarily formed with a pair of end regions
having a predetermined height above the face and with a central
region extending between the end regions and having a maximum
height above the face smaller than the height of the end regions by
a distance at most equal to the thickness of the integrated-circuit
package between its sides. Each of these end regions is formed with
a throughgoing bore opening at the face of the body and alignable
with holes in a circuit board engageable with the face. Clamping
means is provided which is engageable through the bores and the
holes for clamping the end regions between the heatsink plate and
the circuit board and for pressing the one side of the package
against the heatsink with the central region pressing against the
other side of the package.
The assembly according to the present invention insures maximum
heat disipation because the flexible spacer body resiliently
presses the package against the underside of the heatsink so as to
insure good thermal contact therebetween. In addition this spacer
body, according to the present invention, is made of insulating
material, preferably a thermoplastic synthetic resin such as a
polyester, so that heat conduction between the integrated-circuit
package and the circuit board is minimized.
In accordance with the present invention the face of the spacer
body is secured to that side of the printed-circuit board which
does not carry conductors. Thus the contact feet of the
integrated-circuit package pass through respective holes in the
circuit board and are soldered on the opposite side thereof to the
respective conductors.
According to yet another feature of this invention the heatsink
plate is similarly formed with a pair of holes alignable with the
bores in the end regions and the holes in the circuit board so that
the clamping means comprises screws which engage through these
holes and bolt the assembly tightly and rigidly together.
In this manner the variations in thickness of the resin capsule
containing the integrated-circuit are compensated for both by the
elasticity of this spacer body and of the circuit board, this
latter normally being a polyvinyl. These deformations create a
resisting force which presses the thermal mass of the integrated
circuit body tightly against the rigid metallic heat-sink at all
times.
According to yet another feature of this invention the central
region of the spacer body has an overall length generally equal to
the overall length of the integrated-circuit package so that the
end regions can flank this integrated-circuit package. In addition
this central region is of maximum height at its middle and of
lesser height toward the end regions. The central region is
elongated and, according to yet another feature of this invention,
has a width substantially narrower than the width of the end
regions so as to impart to the spacer body a dumbbell-like shape
allowing the integrated-circuit package to straddle this central
region.
BRIEF DESCRIPTION OF THE DRAWING
The above and other objects, features, and advantages will become
more readily apparent from the following, reference being made to
the accompanying drawing in which:
FIG. 1 is a top plan view of the spacer body and circuit board of
the assembly in accordance with the present invention;
FIG. 2 is a longitudinal section through the spacer body
corresponding generally to line II -- II of FIG. 1;
FIG. 3 is a side view of the spacer body according to this
invention; and
FIG. 4 is a longitudinal section through the complete assembly in
accordance with this invention.
SPECIFIC DESCRIPTION
As shown in FIG. 1 a spacer body generally indicated at 1 has a
planar face 1' adapted to engage the unclad surface 12' of a
printed circuit board 12 formed with two rows of small-diameter
holes 6. The body 1 is made unitarily of a single piece of
polyester and has a pair of like end regions 2 and 3 bridged by a
central region 4.
As also shown in FIGS. 2 and 3 each of the end regions 2 and 3 has
a height A above the face 1' which is equal to approximately three
times the maximum height B of the central region 4. In addition
each of these end regions 2 and 3 has a width F transverse to the
longitudinal center line l of the assembly which is equal to
slightly more than twice the transverse width G of the uniformly
wide central section 4. Furthermore this central region 4 is
subdivided into a central section 4' flanked by two like end
sections 4". The central section 4' has a longitudinal length D
which is equal to approximately twice as much as the longitudinal
length E of each of the end sections 4" which drop regularly from
the maximum height B above the face 1' to a minimum height H equal
to approximately 4/5B.
As shown in FIG. 4 the assembly has a heat sink plate 7 formed with
a pair of like cylindrical bores 16 lineable with the bores 5
formed in the end regions 2 and 3 and with bores 17 formed in the
printed-circuit board 12.
An integrated-circuit package 18 of generally parallele-pipedal
shape with a planar upper surface 18' and lower surface 18"
comprises an integrated circuit chip 9 carried on a thermal mass 8
imbedded in a synthetic-resin block 10 having a length slightly
shorter than the overall length C of region 4. This package 18 is
of the L type as defined in Linear Integrated Circuits Data Book
(1973: Motorola). The integrated circuit 18 has 14 contact feet 11
arranged in two rows of seven feet each, each of the feet 11 being
receivable through a respective hole 6 so as to be soldered to the
clad side 12" of the circuit board 12. The screws 13 each provided
with a nut 14 and lock washer 15 pass through the holes 16, 5, and
17 so as to clamp the end regions 2 and 3 between the aluminum
heatsink plate 7 and the board 12 and so as to press the surface
18' of the integrated circuit 18 against the underside of the plate
7 by means of the resilient central region 4 of the spacer body 1.
In this manner good heat-conducting contact is made between the
thermal mass 8 and the heatsink 7. Deformations occur both in the
central region 4 and in the printed circuit board 12 between the
screws 13 which are well within the elastic limits of these
elements so that they are in no way damaged. When clamped tightly,
the circuit board 12 between the screws 13 frequently bend
outwardly slightly away from the mounting assembly.
* * * * *