U.S. patent number 3,907,660 [Application Number 05/430,424] was granted by the patent office on 1975-09-23 for apparatus for coating glass.
This patent grant is currently assigned to PPG Industries, Inc.. Invention is credited to Frank H. Gillery.
United States Patent |
3,907,660 |
Gillery |
September 23, 1975 |
Apparatus for coating glass
Abstract
Transparent, electroconductive articles produced by cathode
sputtering on refractory substrates, a metal from the group of
elements having an atomic number from 48 to 51 and mixtures
thereof, and preferably a controlled proportion of tin to indium,
in a low pressure atmosphere containing a controlled amount of
oxygen at a controlled substrate temperature within a temperature
range of 400.degree.F. to a temperature at which the substrate
becomes distorted or detrimentally affected, usually at or above
600.degree.F.
Inventors: |
Gillery; Frank H. (Allison
Park, PA) |
Assignee: |
PPG Industries, Inc.
(Pittsburgh, PA)
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Family
ID: |
32329711 |
Appl.
No.: |
05/430,424 |
Filed: |
January 3, 1974 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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241543 |
Apr 6, 1972 |
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60002 |
Jul 31, 1970 |
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Current U.S.
Class: |
204/298.09;
204/192.15 |
Current CPC
Class: |
C03C
17/00 (20130101); C23C 14/086 (20130101); C23C
14/0036 (20130101); C23C 14/34 (20130101) |
Current International
Class: |
C03C
17/00 (20060101); C23C 14/00 (20060101); C23C
14/08 (20060101); C23C 14/34 (20060101); C23c
015/00 () |
Field of
Search: |
;204/192,298 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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520,592 |
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Apr 1940 |
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GB |
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1,147,318 |
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Apr 1969 |
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GB |
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Other References
Steckelmacher et al., "Apparatus for the Controlled Deposition of
Optical Film Systems" Vacuum, Feb. 2, 1959..
|
Primary Examiner: Vertiz; Oscar R.
Assistant Examiner: Langel; Wayne A.
Attorney, Agent or Firm: Pollock; E. Kears Mates; Edward
I.
Parent Case Text
CROSS-REFERENCE TO RELATED APPLICATIONS
This is a continuation of application Ser. No. 241,543, filed Apr.
6, 1972 which is a continuation-in-part of application Ser. No.
60,002 filed July 31, 1970. These earlier applications are now
abandoned. This application is also related to applicants'
copending application entitled "Glass Coated with an Oxide of a
Metal Having an Atomic Number of From 48 to 51" and filed on even
date herewith.
Claims
I claim:
1. An apparatus for applying a uniform, transparent,
metalcontaining, electronconductive coating to a substrate
comprising:
a. means for providing a low pressure atmosphere not exceeding
10.sup..sup.-1 torr and containing a mixture of oxygen and an inert
gas;
b. means for supporting a substrate within said low pressure
atmosphere by supporting said substrate at a plurality of support
points permitting substantially all of the surfaces of said
substrate free from contact by said supporting means;
c. means comprising a cathode and an anode for sputtering said
coating onto said substrate while its temperature is elevated
substantially, said cathode sputtering means having its cathode
spaced from and in facing relation to said supporting means;
and
d. means for radiantly heating said substrate to a substantially
elevated temperature and for maintaining such elevated substrate
temperature during cathode sputtering, said radiant heating means
being spaced from and in facing relation to said supporting means
such that said support means is disposed between said cahode and
said radiant heating means, and said radiant heating means
comprising means for radiating heat toward substantially all the
area embraced by said supporting means.
2. The apparatus according to claim 1 wherein said radiant heating
means comprises electric resistance heating means for operating at
voltages substantially lower than a voltage sufficient to operate a
sputtering cathode.
3. The apparatus according to claim 2 wherein said radiant heating
means is coupled to an alternating current power source for
providing a voltage across said radiant heating means of less than
about 50 volts.
4. The apparatus according to claim 2 wherein said cathode is
coupled to a direct current power source for providing a voltage
between said cathode and said anode of at least about 1,000
volts.
5. The apparatus according to claim 1 wherein said radiant heating
means is provided with means for controlling the voltage thereto
responsive to the temperature of said substrate, and said apparatus
further comprises a plurality of temperature detecting means in
operative communication with the area of said supporting means for
detecting the temperature of said substrate supported thereby at a
plurality of corresponding sites with said plurality of temperature
detecting means being connected in parallel for providing an
average substrate temperature to said controlling means.
6. Apparatus according to claim 1, wherein said cathode has a
sputtering surface that is elongated having a length greater than
one dimension of a substrate receiving portion of said substrate
supporting means; said apparatus further comprising means for
reciprocating said cathode in a direction transverse to its length
with said sputtering surface facing said substrate supporting
means.
Description
BACKGROUND OF THE INVENTION
This invention relates to COATING GLASS and particularly relates to
transparent, electroconductive articles produced by depositing a
transparent conductive film of a metal or metal oxide, preferably
selected from the group of elements having an atomic number from 48
to 51 and mixtures thereof, on a transparent ceramic base using a
vacuum process, such as vacuum evaporation or cathode sputtering,
preferably the latter. In particular, this invention relates to
apparatus for producing such coated articles.
Prior to the present invention, others have attempted to apply
conductive coatings by the vaccum evaporation of various metal
oxides such as indium oxide. These techniques were developed as a
lower temperature coating operation to replace the prior art
pyrolixation processes in which it was necessary to heat the
substrate to a temperature at which it softens and distorts, and/or
loses a temper previously imposed either thermally or chemically at
these elevated temperatures.
In a pure oxygen atmosphere, vacuum evaporation must be done very
slowly to insure that the metal combines with oxygen and to
minimize decomposition which occurs. The films produced often have
to be heated subsequently to the vacuum evaporation process to
improve their electroconductivity.
Cathode sputtering has also been used to form oxide films of the
aforesaid metals, particularly indium oxide films. Some of these
previous methods of producing sputtered indium oxide films rely on
the oxidation of the cathode and the sputtering of this oxide to
produce the film. The rate of sputtering is limited by the rate of
oxidation of the cathode. The cathode temperature cannot be raised
to increase the rate of oxidation because indium melts at the very
low temperature of about 315.degree.F. Others have tried to
increase the rate of cathode oxidation by using pure oxygen as a
sputtering gas. This is inefficient because oxygen gives a low
sputtering yield and because the stoichiometry of the finished film
is difficult to control. Others have used sequential treatments in
oxygen and argon, the former to oxidize the cathode and the latter
to transfer the oxide from the cathode to the substrate. A multiple
step process is inconvenient, time consuming, expensive and each
added step increases the likelihood of losing control of the
process.
Still another method of obtaining indium oxide films is described
in U.S. Pat. No. 2,825,687 to Preston. In this patent, indium or
other metal oxide is sputtered or the metal is sputtered in an
atmosphere containing only a trace of oxygen to produce a colored
or opaque film, and the film is subsequently heated in air to
develop a permanent conductivity and improve film transmission.
Again this process is inconvenient, time consuming and results in a
high resistance film with inferior optical properties.
In an attempt to improve the optical transmission coefficient as
well as the electroconductivity of the resulting film, it has been
proposed in application Ser. No. 709,135 of Frank H. Gillery and
Jean P. Pressau, filed February 28, 1968 to cathode sputter in a
low pressure atmosphere containing sufficient oxygen to assure the
formation of a colorless film having adequate optical properties
but insufficient electroconductivity, and then to heat the coated
article in an oxygen-deficient atmosphere for sufficient time to
increase the electroconductivity and to discontinue the heating
before the film develops a color. This technique produces films
having a better combination of optical and electrical properties
than those of the hitherto prior art. However, this process
involves either evacuation of oxygen from the low pressure
atmosphere for the post-heating step or removal of the coated
article to an evacuated environment for the post-heating step.
Either alternative is time consuming.
Cathode sputtering causes a substrate to be heated. However, such
heating is hard to regulate and non-uniform coating results. U.S.
Pat. No. 3,369,989 to Kay, et al. discloses apparatus for
controlling the temperature of a substrate by providing substrate
mounting means in the form of a hollow anode enclosing heating and
cooling elements. The upper surface of the anode supports the
substrate in surface to surface contact therewith and is alleged to
be capable of controlling the substrate temperature at
300.degree.C. with 1.degree.C. throughout the extent of a small
substrate. This patent implies that the substrate must be
maintained at a constant temperature throughout the cathode
sputtering operation. The time needed to heat the substrate to an
equilibrium temperature before starting cathode sputtering
increases the time necessary for a complete coating operation. In
addition, if the substrate is glass, whose length and width are
more than 6 inches, it is impossible to maintain the uniformity of
contact needed to provide conductivity of sufficient uniformity
(less than 20% variation in local conductivity throughout the
substrate) to satisfy present commercial requirements.
SUMMARY OF THE INVENTION
It has now been discovered that it is not necessary to maintain the
substrate at a constant temperature throughout the cathode
sputtering operation provided the substrate is heated to a minimum
temperature to about 400.degree.F. before starting the cathode
sputtering and the substrate temperature varies between
400.degree.F. and a temperature below which the substrate becomes
distorted or detrimentally affected during sputtering and the
substrate is cooled to below the temperature at which cathode
sputtering is started before removing the substrate from the low
pressure atmosphere used for cathode sputtering. Frequently, the
low pressure atmosphere is evacuated during the cooling that
follows cathode sputtering.
According to a sophisticated version of the present invention,
cathode sputtering is conducted in a low pressure atmosphere of
oxygen and an inert gas, preferably argon, in which the oxygen
content of the mixture is controlled within limits determined by
the temperature developed in the substrate during the cathode
sputtering operation. Exposed electroconductive heating wires
coupled electrically to a low voltage source are used to heat the
substrate by radiation rather than by convection or conduction by
contact during the cathode sputtering. The heating wires are
equally spaced from one another and are disposed in an area aligned
with and extending beyond the area occupied by the substrate to
insure a uniform blanket of radiant heat at the substrate.
This arrangement using radiant heat is superior to the prior art
heat transfer by conduction by contact when an attempt is made to
coat glass substrates whose length is more than 6 inches and whose
width is more than 6 inches. This superiority from using radiant
heat rather than conduction by contact with an anode to control
temperature makes it possible to control the substrate temperature
independently of the anode temperature, thus bringing better
control to the coating operation.
In coating very large sheets, the cathode target has been made of
an elongated construction having one dimension longer than one
dimension of a substrate and providing means for reciprocating the
cathode along an axis with a displacement greater than the other
dimension of the substrate. U.S. Pat. No. 3,414,503 to Brichard
shows such a device for coating substrates supported in a vertical
plane. This patented apparatus is so arranged that it is impossible
to heat a substrate independently of the heat it develops
incidental to the sputtering process.
Apparatus conforming to one embodiment for performing the present
invention has a series of vertically adjustable supports arranged
in two sets of intersecting rows that provide spaced points of
support for one or more flat or curved substrates as the case may
be. The bottom substreate surface is supported on spaced points
having minimum heat exchange relation at the points of support.
Hence, the radiant heating means disposed to one side of the
supported substrate or substrates is able to provide a uniform
heating pattern over the entire bottom surface of the substrate so
that it now becomes possible to maintain the substrate temperature
approximately uniform even when a cathode is reciprocated in facing
relation to the opposite surface of the substrate, since a
sufficient portion of the heat input to the substrates treated to
contol the substrate temperature radiates from the exposed heating
means and only a minor portion of the heat input results from the
sputtering between the moving cathode and the upper surface of the
substrate, particularly during the early stages of the process
before the substrate attains an equilibrium temperature range.
The metal to be deposited by cathode sputtering may be any metal
known to have cathode sputtering properties. However, excellent
results are obtained using metals from the group having atomic
numbers from 48 to 51 and mixtures thereof, particularly mixtures
of metals having atomic numbers that differ by one. Superior
properties result from films produced by sputtering from a cathode
having a target surface composed of a mixture of indium and tin
containing between 1 and 20% by weight of tin and the balance
indium. The apparatus of this invention may also be effectively
employed to produce metallic films of metals such as chromium as
well as of the metals preferred for the production of metal oxide
films.
The maximum temperature to which the substrate or substrates are
subjected during sputtering depends on the size and nature of the
substrate. For example, thicker glass sheets as thick as 1/2 inch
may be heated to as high as 800.degree.F. without distortion,
whereas sheets as thin as 0.007 inch maintain good optical shape
without distortion at 600.degree.F. for time sufficient to produce
highly transparent, highly electroconductive films. Chemically
tempered glass sheets are heated only to a maximum temperature of
approximately 500.degree.F. during cathode sputtering to avoid any
deleterious effects on the temper imposed chemically. These
temperatures are below those required for forming transparent
electroconductive films by pyrolysis of a metal salt
composition.
The atmosphere in which cathode sputtering takes place is
preferably at a pressure less than 10.sup.-.sup.1 torr. The
atmosphere is carefully controlled by introducing a metered amount
of oxygen and inert gas (preferably argon) to replace the gas
removed by a vacuum pump.
The electroconductivity of the film is monitored as the film forms
and the substrate is heated by an independent heater to within a
few degrees of a predetermined temperature, preferably above
500.degree.F. The coated article is retained in the sputtering
atmosphere after sputtering is stopped and cooled before exposure
to air. In case where the value of electrical resistivity is not
important, this cooling can be minimal. However, in case the final
resistance desired is a minimum, it is desirable to evacuate the
sputtering atmosphere and cool the coated article to below the
initial cathode sputtering temperature and, even more preferably,
to below 300.degree.F., before removing the article from the
atmosphere and exposing the coated article to air. Post-heating
treatment needed in prior art techniques to obtain a lower
resistance for the film so formed or to improve its luminous
transmittance may be dispensed with provided the substrate
temperature is controlled as taught by the present invention.
According to a more sophisticated operation, the partial pressure
of oxygen in the low pressure atmosphere of the sputtering chamber
is initially relatively high as the cathode sputtering begins and
is reduced as the temperature of the substrate is increased during
the cathode sputtering process performed simultaneously with
independent heating.
This sophisticated version of the present invention involves
initially providing an excess of oxygen over the partial pressure
needed to balance the amount of metal being sputtered during the
initial phase of cathode sputtering after the substrate temperature
reaches a minimum of 400.degree.F. due to the application of heat
from an external heat source. As the temperature of the substrate
increases above the initial temperature at which cathode sputtering
begins, the partial pressure of oxygen is reduced in the mixture
added to replace the gases that are evacuated. The aforsaid
technique develops a clear film that does not require post-heating
in air as is necessary with earlier techniques in which only a
trace of oxygen is used during the sputtering in the low pressure
atmosphere. Furthermore, the conductivity of the resulting coatings
as well as the transparency are superior to those resulting from
prior art techniques involving the initial application of cathode
sputtering in an atmosphere that has an excess of oxygen followed
by post heating in a reducing atmosphere.
A still further improvement provided by the present invention that
results in a more uniform deposition of coating is the use of a
scanning cathode that reciprocates in uniformly spaced relation to
the glass surface to be coated during the cathode sputtering
operation. The reciprocation of the cathode with respect to the
sheet causes each increment of the glass sheet that is sputtered as
the cathode reciprocates in spaced relation to the substrate to be
coated in small increments. This provides greater overall
uniformity of coating for the substrate than a cathode sputtering
operation using a large cathode of substantially the same size as
the large glass sheet to be coated (for example, in excess of 6
inches for each dimension), because plasma emanating from a large
cathode tends to concentrate in the central portion of the cathode
and this concentration results in a similar concentration of
coating on the substrate surface.
Another factor in promoting more uniformity of coating is the use
of a frame of glass or other material surrounding the article to be
coated. This avoids edge effects.
There are many parameters that determine the film forming rate and
the nature of the film formed. The present invention has made
possible the selection of the more important parameters that
determine certain film characteristics during the cathode
sputtering operation to obtain suitable repeatability of optical
and electrical characteristics from article to article. In other
words, the present invention provides a technique wherein a glass
sheet is inserted into a vacuum coating chamber for coating and its
processing is completed to form a coated article having the
requisite optical and electroconductive characteristics before the
article is removed from the vacuum coating chamber.
The present invention uses as its environment an apparatus having a
predetermined size of vacuum chamber, voltage source, target
composition and size, and target to substrate spacing, and, in
cases where large glass sheets (whose length and width exceed 12
inches) are coated, means to reciprocate the target relative to the
substrate at a certain speed of reciprocation. While these
parameters can be changed and can differ from pattern to pattern,
once these parameters are established, the temperature of the
substrate and the partial pressure of oxygen in the low pressure
atmosphere are kept in balance to obtain optimum quality films.
Generally, the electroconductivity of a film produced at a high
substrate temperature during cathode sputtering is more permanent
than that of a film produced at a lower substrate temperature, but
a practical maximum temperature is one that is below the
deformation temperature of the substrate. The composition of metal
used for the cathode, particularly in the case of indiumtin
cathodes, for example, the ratio of tin to indium, is a factor in
the electroconductivity of the film formed. Films from pure indium
cathodes are less electroconductive than those produced using a
small proportion of tin and have less stable electroconductivities.
Typically, indium cathodes having 1% to 20% by weight of tin yield
highly conductive films.
BRIEF DESCRIPTION OF THE DRAWINGS
In the drawings that form part of this description,
FIG. 1 is a perspective view of apparatus of the present invention
with substrate and electrode support structure shown outside the
vacuum chamber;
FIG. 2 is a partly schematic side section of the apparatus of FIG.
1, showing the support structure in the vacuum chamber, and
FIG. 3 is a partly schematiic end view corresponding to the side
view of FIG. 2;
FIG. 4 is a schematic representation of the apparatus of this
invention showing the relationship of the means for controlling
process conditions in the sputtering chamber.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
The following experiments to coat 4 inch square substrates of
soda-lime-silica glass disclose more precisely the effect of the
various parameters on the conductivity, its durability of
conductivity, film forming rate and other factors.
For all the experiments using glass sheets as substrates, the glass
is cleaned with a mixture of 50% n-propanol in water. If the glass
has a surface stain or other surface defect, mild blocking with
cerium oxide is advised. Otherwise, the cleaning with the
water-n-propanol mixture is sufficient.
After cleaning, the glass is placed in position in the chamber and
the pumpdown is started. This continues until the pressure reaches
10.sup.-.sup.4 torr or below. Argon gas is admitted to the chamber
to maintain this pressure and flush the system for several
minutes.
When the system has been purged of the greater part of its residual
gas, a mixture of argon and oxygen (0.5 to 15% oxygen) is admitted
while still pumping until the pressure is between 5 and 50
millitorr. To conserve gas, the pumping speed is decreased during
coating by an adjustable baffle.
A gradually increasing voltage is slowly applied from a high
voltage source (preferably 5000 volts D.C. or more) to the cathode
and a glow discharge starts. Rapid application of high voltage
often causes arcing and the possibibility of damage to the power
supply.
During pumpdown and voltage application, the substrate is being
raised in temperature by electrical resistance wire heaters
disposed in parallel relation, for example, at 1 inch spacing and 2
inches from the opposite surface of the substrate from that coated.
According to the present invention, coating is not begun until the
substrate is heated to a temperature of 400.degree.F.
During coating, the resistance of the deposited film is monitored
continually. The oxygen concentration is varied to maintain a
controlled rate of resistance decrease. If this is not done, the
presence of too much oxygen can cause too slow a rate of decrease
of resistance or even an increase in resistance. Too little oxygen
can produce an opaque metallic film.
The amount of oxygen required in the gas mixture varies with many
other system parameters as follows:
1. The amount of residual oxygen in the system.
2. The amount of water vapor in the system. The water vapor
decomposes under the influence of the glow discharge. The hydrogen
ions carry current in the system but are ineffective in sputtering
because of their low mass. The oxygen ions produced by dissociation
of water molecules in the system cause oxidation of the film. Even
if the system is pumped or flushed with argon for many hours before
coating, the glow dischrge can still release absorbed water vapor
from the surfaces in the system.
3. The temperature of the substrate, which controls the rate of
reaction of indium or other metal with oxygen and also the
metal-oxygen equilibrium.
4. The rate of deposition. To a certain extent the rate of arrival
of indium on the substrate has to be balanced against the rate of
bombardment by oxygen.
The ionized gas atoms, in this case argon and oxygen ions, are
attracted to the cathode by the applied potential. An exchange of
momentum takes place as the ions penetrate the target. Atoms of the
target material are ejected and also electrons. Both travel away
from the cathode, the charged electrons gaining energy because of
the electric field. At some point (the limit of the cathode dark
space) the electrons have gained sufficient energy to ionize
additional gas atoms and the process is repeated. The metal
continue and are eventually deposited onto the substrate.
The momentum exchange process taking place at the cathode is most
effective with heavy ions such as argon. Argon is chosen for most
sputtering processes because of its low cost and high mass. Xenon
and krypton would produce more efficient sputtering but are
expensive for general use.
The oxygen is present to produce metal oxide rather than metal
films. The metal oxide films are transparent whereas the metal
films are not. In this particular system the oxidation appears to
take place on the substrate, since it is greatly affected by
substrate temperature. Under different conditions, oxidation of the
cathode and oxide sputtering may take place at a slower sputtering
rate not desired for commercial operations.
EXAMPLE I
In a first series of experiments coating glass sheets 4 inches
square using a cathode of 94.4% indium and 5.6% tin by weight, a
cathode-substrate distance of 2 inches, a total gas pressure of 20
millitorr, a substrate temperature of 610.degree.F. provided in
part by heating wires energized at 25 volts A.C. during cathode
sputtering for 15 minutes at a voltage of 2000 volts and a glow
discharge current of 180 milliamperes, in argon atmospheres
containing different oxygen concentrations, the following results
occur:
OXYGEN CON- FILM RESISTANCE RESISTIVITY CENTRATION THICKNESS (A)
OHMS/SQUARE OHM - CMS. ______________________________________ 6.3%
1410 150 1.96 .times. 10.sup.-.sup.3 3.2% 1700 92 1.55 .times.
10.sup.-.sup.3 1.6% 2260 56 1.12 .times. 10.sup.-.sup.3 1.35% 2700
36 0.921 .times. 10.sup.-.sup.3 1.01% 3400 29 0.985 .times.
10.sup.-.sup.3 0.7% Metallic Indium Film
______________________________________
Within the limits of measurement, the above results show the
following:
1. The sputtering rate is greater at lower oxygen
concentrations
2. The specific resistivity generally decreases at lower oxygen
concentrations.
3. The lower limit of oxygen concentration suitable for cathode
sputtering is reached when metallic indium rather than indium oxide
is produced.
EXAMPLE II
The following samples are coated under conditions similar to those
used in Example I except that the substrate temperature and oxygen
concentration is varied to produce the following results.
SUBSTRATE OXYGEN RESISTIVITY TEMPERATURE CONCENTRATION
(OHMS/SQUARE) ______________________________________ 400.degree.F.
1.0% 93 610.degree.F. 1.0% 29 800.degree.F. 1.0% 17 400.degree.F.
1.35% 75 610.degree.F. 1.35% 36 800.degree.F. 1.35% 19
400.degree.F. 1.6% 176 610.degree.F. 1.6% 56 800.degree.F. 1.6% 14
400.degree.F. 3.2% 910 400.degree.F. 3.2% 670 610.degree.F. 3.2% 92
800.degree.F. 3.2% 50 400.degree.F. 6.3% 590 610.degree.F. 6.3% 150
800.degree.F. 6.3% 121 ______________________________________
The above example indicates that the temperature of the substrate
while the film is being deposited is important. The higher
temperatures give the best results but in this work the highest
temperature investigated was 800.degree.F. since much higher
temperatures than this will affect the soda-lime glass substrates
used as samples. At temperatures lower than 400.degree.F., the
oxygen pressure required to produce conductive films becomes so
critical that metallic indium films are often inadvertently
produced. At the lower temperatures also the rate of reaction of
indium atoms with oxygen atoms on the substrate becomes controlling
and the rate of deposition of indium may have to be decreased.
Further experiments were preformed using cathodes of different
compositions and maintaining the substrate at the indicated
substrate temperature for each experiment. The controls and results
obtained are enumerated in Examples III, IV and V for different
cathodes.
EXAMPLE III
Using a cathode composed of 9% tin and 91% indium by weight, a
cathode to substrate distance of 2 inches, a total gas pressure of
23 millitorr, maintaining a substrate temperature at 550.degree.F,
a voltage of 3000 volts and a current of 555 milliamperes during 8
minutes of cathode sputtering produced the following film
thicknesses having the resistance per unit square recorded in the
following table for various samples coating in argon-oxygen
mixtures having the recorded oxygen concentration added by
volume.
______________________________________ RESULTS FROM 9% TIN - 91%
INDIUM CATHODE Oxygen Film Thickness OHMS Per Concentration
Angstroms Square Remarks ______________________________________ 10%
1098 100 Clear film 9% 1298 110 " 8% 1310 110 " 7% 1069 110 " 6%
1472 80 " 5% 1619 65 " 4% 1855 65 " 3% 1885 50 " 2% 2356 25 " 1% 25
Cloudy film 1% 50 Gray film 1% 60 Cloudy film 1% 20 "
______________________________________
EXAMPLE IV
A setup similar to Example III was used except that the cathode was
pure indium, the total gas pressure was 29 millitorr, the substrate
temperature was 600.degree.F, the cathode to substrate distance was
2 inches and a voltage of 3000 volts was impressed for 10 minutes
to produce a current of 500 milliamperes during cathode sputtering
under various concentrations of oxygen.
______________________________________ RESULTS FROM PURE INDIUM
CATHODE OXYGEN FILM THICKNESS OHMS PER CONCENTRATION ANGSTROMS
SQUARE REMARKS ______________________________________ 6.3% 1280 550
Clear film 3.2% 1640 330 " 1.6% 1799 350 " 1.4% 1650 280 " 1.0%
2067 350 " ______________________________________
EXAMPLE V
The following experiments were performed using a cathode composed
of 7.5% antimony and 92.5% tin by weight at a cathode substrate
distance of 2 inches, a voltage of 3000 volts impressing a current
of 600 milliamperes for 15 minutes in various argon-oxygen systems
containing different oxygen concentration at a pressure of 33
millitorr. The results are recorded below:
RESULTS FROM 7.5% ANTIMONY - 92.5% TIN CATHODE OXYGEN OHMS PER
CONCENTRATION SQUARE REMARKS ______________________________________
10% 700 Clear film 5% 250 Clear film 2% 100 Clear film
______________________________________
The concentration of tin in the indium cathode may range from 1 to
20% and has an optimum at around 10 - 15%. If no tin is added, the
lowest resistance films cannot be made even though fairly high
conductivity can be obtained from oxygen variances produced by low
oxygen pressure. The films so made with pure indium cathodes are
prone to change resistance on heating at temperatures above about
150.degree.F., whereas films produced from indium cathodes
containing 10% tin have stabel electrical conductivity even when
heated to 300.degree.F.
For instance, a film made by sputtering a 10% tin-90% indium
cathode at 3000 volts, 250 milliamperes in a 3.2% oxygen, 96.8%
argon 19 millitorr system and 600.degree.F substrate temperature
has a resistance of 90 ohms per square when freshly made. This
changes to 85 ohms per square as it is cooled and exposed to air at
300.degree.F.
A film made by sputtering a pure indium cathode at 3000 volts, 215
milliamperes in an oxygen-argon mixture containing 3.2% oxygen at
22 millitorr and 600.degree.F. substrate temperature has a
resistance of 14,000 ohms per square when freshly made and the
resistance increases to 280,000 ohms per square when it is exposed
to air at 300.degree.F.
A film made by sputtering a pure indium cathode at 3000 volts, 235
milliamperes in an oxygen-argon mixture containing 1.6% oxygen at
24 millitorr and 600.degree.F. substrate temperature has a
resistance of 80 ohms per square when freshly made but this
increases to 150 ohms per square when it is exposed to air at
300.degree.F.
EXAMPLE VI
The following experiments are performed using essentially the same
equipment as before at 3000 volts, 2 inches cathode to substrate
spacing and 600.degree.F. substrate temperature, a cathode
composition of 5.6% tin, 94.4% indium, a current of 180
milliamperes and a pressure of 20 millitorr. Experiments were
performed at various oxygen concentrations. Resistivities were
measured after 15 minutes of cathode sputtering for each oxygen
concentration tested. A first sample developed a film having a
resistivity of 280 ohms per square after cathode sputtering under
such conditions in a system containing 6.3% oxygen. After cooling
in vacuum, the resistivity of the film dropped to 130 ohms per
square. Further exposure to air raised the resistivity to 150 ohms
per square. A second sample cathode sputtered in a system
containing 3.2% oxygen under otherwise identical conditions
developed a film having a resistivity of 75 ohms per square. This
was reduced to 40 ohms per square by 5 minutes at 700.degree.F. in
argon at 0.05 millitorr. A third sample cathode sputtered inn a 1%
oxygen system developed a film having a resistivity of 23 ohms per
square, which became 26 ohms per square after cooling in a vacuum
and remained 26 ohms per square after further exposure to air.
EXAMPLE VII
Using a fixed cathode 5 inches square of 5.6% tin and the balance
indium spaced 1.4 inches from a 4 inch square sample of polished
plate glass in center to center alignment, cathode sputtering for
60 minutes in an atmosphere at 37 millitorr pressure containing 24%
hydrogen, 11% oxygen and 65% argon by volume at a voltage of 3,500
volts D.C. and 750 milliamperes current for 60 minutes developed a
sample temperature of 600.degree.F. A film having an estimated
thickness of 6,000 Angstroms, a resistivity of 3 to 4 ohms per
square and a transmission of about 72% resulted. No attempt was
made to control the substrate temperature.
The above experiment involved the use of hydrogen. In view of the
danger involved in handling hydrogen, efforts were directed to
developing another technique to produce highly transparent, highly
electroconductive metal oxide films by cathode sputtering in the
absence of hydrogen.
Smaller substrates have more uniform films when so treated and
larger substrates less uniform films when so treated. Accordingly,
apparatus containing a scanning cathode modified from that
disclosed in U.S. Pat. No. 3,414,503 to Brichard and containing
heating and cooling elements positioned to control the substrate
temperature during a vacuum coating operation was developed to coat
substrates having minimum dimensions of about 6 inches on each
side. The apparatus is described below.
The resistance of a film after deposition can be changed according
to how it is treated. The film after deposition is close to
equilibrium with the atmosphere at the temperature involved. If the
film is exposed to more oxidizing conditions, it tends to increase
in resistance; if it is exposed to more reducing conditions it
tends to decrease in resistance. The rate of change is dependent on
the film temperature, and with the stability of the film as
discussed before.
Thus, it is unwise to allow air to come into contact with the film
at temperatures above 300.degree.F. On the other hand, if a lower
resistance is desired, the film can beneficially be cooled from its
operating temperature in high vacuum (say below 10.sup..sup.-4
torr).
Prior to the present discovery of the benefits of heating the
substrate to a controlled temperature above 400.degree.F. during
the cathode sputtering operation, the cathode sputtering operation
in low pressure atmospheres was difficult to control and it was
only occasionally that coated glass samples having adequate optical
properties and electroconductive properties were produced. Of about
two hundred experiments performed wherein the sputtering was
started at whatever substrate temperature existed in the vacuum
chamber, the resistances obtained were considerably higher and
optical transparencies lower than those obtained with the
temperature controlled substrate operation suggested by the present
invention, even though the experiments were performed with small
articles that, in retrospect, are easier to coat uniformly than
larger articles. Furthermore, many experimental samples formed
metallic films and those that were electroconductive had
resistances that varied by as much as more than 100:1 ratio from
one locality to another.
An illustrative example of apparatus suitable for performing the
present invention will be described in order to facilitate the
ability of one skilled in the art to produce transparent
electroconductive articles having superior optical and
electroconductive properties, particularly those having dimensions
of at least 6 inches.
DETAILED DESCRIPTION OF APPARATUS
Referring to the drawings, a typical apparatus for cathode
sputtering comprises a horizontally disposed chamber 10 arranged in
the form of a horizontally oriented cylinder 72 inches long and 66
inches in diameter having hinges 11 on which a door 12 is pivoted
open. Clamps 13 (FIG. 3) are provided to lock the door 12. Another
end door 14 is closed at its other end. Exhaust openings 16 are
connected to a vacuum manifold (not shown). An additional gas
supply opening 18 receives a mixed gas supply line 20. The latter
extends from a T connection 22 between gas feed lines 24 and 26
communicating with sources of argon and oxygen (not shown),
respectively. The feed lines 24 and 26 are valved to control inward
flow of the respective gases at a metered rate of flow for each
gas. The chamber 10 is supported in spaced relation above the
ground on vertical posts 28.
A lower pair of parallel tracks 30 extend horizontally the length
of the cylindrical chamber 10 to receive a heater supporting
carriage 32. An upper pair of parallel tracks 33 is also provided
for purposes to be described later. The heater supporting carriage
32 has rollers 34 that ride on the tracks 30 from a position within
the cylindrical chamber 10 to a lower set of tracks 36 supported on
a loading table 38 disposed outside the chamber 10. The loading
table 38 is provided with pivoted casters 39 to facilitate placing
the loading table 38 in alignment with the cylindrical chamber 10
both before and after a cathode sputtering operation.
The heater supporting carriage 32 is provided with an anode plate
40 that supports a water cooling system 41 on its lower surface and
a series of spacers 42 of electrical insulating material that
support a bus bar 44 in spaced, electrically insulated relation to
said anode plate on its upper surface. A grounded bar 46 extends
parallel to bus bar 44. The bus bars 44 and 46 are 1/2 inch by 2
inch in cross section and 6 feet long and are interconnected at
each inch of length by one of a series of parallel heating wires
48.
The wires occupy an area aligned with and extending beyond the
edges of the substrate. Pivots 50 are connected at one end to the
grounded bus bar 46 and at their other end to a grounded expansion
spring 52. The spring loading keeps the heating wires straight and
parallel as they become heated during the application of voltage
across the bus bars.
An insulated power line 54 connects the bus bar 44 to a source of
A.C. voltage (not shown) outside the chamber 10 through an
insulated terminal 55. This source is preferably no more than 50
volts and the heating wires are nichrome type 5 wire (17 gauge) and
are approximately 3 feet long.
The anode plate supports a series of posts 56 arranged in
checkerboard arrangement to support one or more glass sheets during
a cathode sputtering operation. The posts 56 are off-set with
respect to the paths traversed by the parallel heating wires 48 and
are of such size that the glass is spaced about 2 inches from the
plane occupied by the heating wires 48. A thermal sensing device 49
peers through an aperture in anode plate 40 and is focused on the
substrate to record its temperature.
The posts 56 and the anode 40 are both vertically adjustable in any
manner well known in the art, such as by adjustment nuts and
externally threaded shafts. The posts 56 are provided with rounded
or pointed heads 57 to provide minimum areas of contact while
supporting the substrate G. The posts may be adjusted vertically to
support flat or curved glass. The spacing between adjacent post may
be from 1 to 6 inches depending on the size of substrate treated
and the temperature of treatment.
The loading table 38 is provided with an outer and upper pair of
tracks 58 that extend horizontally laterally beyond and above the
plane occupied by the first set of tracks 36 in position to form
extensions of tracks 33 within the vacuum chamber 10. These outer
tracks 58 support an upper carriage 60 which comprises a frame
larger and higher than the heater supporting carriage 32 and enable
one to transfer the upper carriage 60 into and out of the chamber
10.
The upper carriage 60 supports a set of brackets 62 at each
longitudinal end thereof. A shaft 63 having sprockets 64 and 65
fixed thereto interconnects the aligned brackets of each set and a
chain 66 or 68 is entrained about each pair of sprockets 64 or 65,
respectively. One of the shafts 63 is connected to a reversing
drive motor (not shown) located outside the chamber 10. Chain 66 is
connected to a lug 70 connected to wheels 72 that ride on a rail
74. The lug 70 is connected to one side of a transverse bar member
76. A similar lug 78 is connected to chain 68. The other end of the
transverse bar member 76 is connected to wheels 79 that ride on a
rail 80 parallel to rail 74. Actuation of the reversing drive motor
causes the transverse bar member 76 to reciprocate transverse to
its length.
The transverse bar member 76 is attached in insulated relatiion to
a cathode 77. The latter has a coating of metal (for example 5% tin
and the rest indium) on its bottom surface. A cathode connection 82
is connected to the transverse cathode 77. A flexible insulated
wire 83 interconnects the cathode connection 82 to a coupling (not
shown) adapted for connection to the cathode of a high D.C. voltage
power source (not shown) to supply power for sputtering located
outside the chamber 10. A pair of water connectors 90 are connected
to cooling pipes 91 supported between the bar member 76 and the
cathode 77 to cool the latter when necessary. Flexible water lines
92 of electrically insulated material, such as plastic,
interconnect the connectors 90 to a water source through a feed
through 94 carried at the bottom of the chamber 10. Other suitable
water and electrical connectors are mounted in the wall of the
chamber 10 in a similar manner. For example, another flexible water
line 92 feeds water to the water cooling system 41 for the anode
40.
When the reversing drive motor is actuated, the cathode 77 scans
the glass substrate G supported at the top of the checkerboard
array of posts 56.
The carriages 32 and 60 are removable from the chamber 10 for
loading and unloading glass sheets (including framing sheets that
abut the edges of the substrate to avoid edge effects) and for any
maintenance needed. The electrical connectors are very carefully
insulated and are sufficiently long to allow for movement of the
cathode 77 and the carriages 32 and 60. The connectors can be
attached to exterior water sources at various additional feed
throughs. Suitable packing seals are provided to maintain a good
seal for the chamber 10 at each feed through. These connectors and
seals are available commercially and form no part of the present
invention.
The apparatus is provided with sensing and control devices to
monitor and control processing conditions in accordance with the
preferred methods of carrying out this invention. The temperature
of the substrate is measured before, during and after sputtering by
a plurality of thermocouples, 101, preferably chromel-alumel
thermocouples, which are placed between the posts, 56, and
positioned so that the bead of each thermocouple is in contact with
the underside of the substrate. The signal leads, 102, of the
thermocouples are brought out through the chamber wall by means of
a sealed feed through. The thermocouples may be connected in
parallel to provide a signal corresponding to the average substrate
temperature or may be separately maintained and connected to
conventional indicators, recorders or controllers, 103. One to ten
thermocouples will typically be employed.
The thermocouple signal upon which control is based is directed to
a conventional temperature indicator, recorder, controller, 103, by
wire conductors. The temperature controller, 103, is connected to a
variable auto transformer, 104, on the primary of a conventional
low voltage transformer, 105, which has its secondary connected to
bus bar, 44, by means of powerline, 54. Alternatively, the control
loop may be designed for manual control with no conventional
indicator, recorder, controller provided but rather with the
control thermocouple signal directed to a conventional indicator,
recorder. In this instance an operator controls the temperature by
manual adjustment of the variable auto transformer, 104, responsive
to the observed recorded temperature.
The temperature of the substrate may also be monitored by an
externally positioned thermal sensing device, 49, such as a
radiation pyrometer. A pyrometer, for example an Ircon radiamatic
pyrometer, may be positioned outside the chamber and aimed through
a window, 17, in the chamber wall and through an opening, 43, in
the anode plate, 40, at the substrate, with the device focused at
the substrate. The window, 17, will preferably be constructed of a
high infrared transmittance material, such as calcium fluoride, and
the pyrometer will be calibrated to compensate for any infrared
absorption by the window. The pyrometer signal leads may be
connected to a conventional indicator, recorder, controller and
powerstat as described before, providing an alternate means of
temperature control responsive to a detected substrate temperature.
Also, the pyrometer or thermocouples may be connected through an
indicator, recorder, controller to valve operators, 106, operating
the position of the valves on lines 24 and 26, or these valves may
be operated manually responsive to indicated or recorded
temperatures.
The means for controlling oxygen and argon in flow comprises valves
on the lines 24 and 26. Preferably micrometer calibrated needle
orifice valves will be employed -- these are characterized in the
art as "controlled leak valves". In the practice of this invention
described here "Vactronic" valves have been used in combination
with Brooks rotometers. The inflow of oxygen and argon may be
controlled by manual adjustment of these valves responsive to the
indicated or recorded substrate temperature provided by the means
described above, or a conventional controller may be employed in
combination with a stepping motor, pneumatic actuator or the like
to act as a valve operator, 106, adjusting the valve positions.
The preferred means for monitoring the conductivity or resistance
of the films during sputtering comprises a monitor plate, 110,
connected by means of electrical leads, 113, to an externally
positioned indicator, recorder or controller, 114, preferably a
conventional ohmmeter. The monitor plate, 110, is preferably a 4
inch-by-4 inch glass plate having ceramic silver bus bars, 111 and
112, on opposite sides of one major surface. An electrical lead is
connected to each bus bar, and these leads, 113, are connected to
an ohmmeter, such as Simpson Model 260 or the like. The monitor
plate, 110, is placed adjacent a workpiece or, substrate, G, to be
sputter coated and is sputter coated simultaneously with the
workpiece. The resistance is noted during sputtering, and the
valves on lines 24 and 26 are adjusted responsive thereto. This
adjustment may be manual, or the indicating meter employed may be a
conventional indicator, recorder, controller, 114, connected to a
valve operator, 115, as described above.
While each particular operation and each particular apparatus has
different minimum oxygen partial pressures required to produce a
clear film at each substrate temperature, the following parameters
were established for a glass sheet 2 feet by 3 feet. The parameters
include an atmosphere of 20 millitorr, a cathode to substrate
spacing of 2 inches, 3,000 volts D.C., a cathode 6 inches wide and
40 inches long, a scanning path 36 inches long over the sample, a 2
inch frame of glass surrounding the sample and reciprocating the
cathode in a direction transverse to its length at a speed to
provide a complete cycle in 20 seconds. The following minimum
partial pressures of oxygen are estimated at the following
substrate temperatures to produce a clear, metal oxide film of low
resistance: 20% or 4 millitorr at 300.degree.F., 9% or 2 millitorr
at 400.degree.F., 5% or 1 millitorr at 500.degree.F., 4% at
600.degree.F., and 3% at 700.degree.F. (or below 1 millitorr at
above 500.degree.F.)
In a typical operation using an initial oxygen partial pressure of
about 10% when the substrate temperature is 400.degree.F. at the
onset of the cathode sputtering, and reducing the rate of oxygen
flow as the substrate temperature increases while maintaining the
argon flow constant and while evacuating with a vacuum pump rated
at 1,300 cu. ft. per minute produces a film having a resistance of
2 ohms per square and 76% total luminous transmission coefficient
as measured by a Gardner Hazemeter after one hour of such
treatment. Such high transmission and high conductivity combination
is not possible with prior art techniques.
EXAMPLE VIII
Ten samples of 1/8 inch thick twin ground plate glass were cathode
sputtered using the illustrated apparatus at a 1.5 inches cathode
to substrate spacing with a cathode 6 inches wide and 40 inches
long having a sputtering surface composed of 10% tin and and 90%
indium, for 75 minutes at a D.C. voltage of 3,200 volts with
heating wires initially energized at 24 volts (350 amperes) for 10
minutes, followed by 5 minutes at 20 volts (250 amperes) followed
by 12 volts (150 amperes) for 2 minutes, then no voltage for the
remainder of the cathode sputtering. The cathode was reciprocated
at an average linear speed of about 18 feet per minute and the
atmosphere of the coating chamber was 4.46% oxygen and the balance
argon maintained at a pressure of about 30 millitorr. The chamber
was evacuated after 75 minutes of sputtering and the coated
substrates were cooled to about 250.degree.F. in the evacuated
atmosphere before their removal. The coated samples had a
transmission coefficient of 76% though a thickness of about 7,000
Angstroms and a resistivity of 2 ohms per square.
The term ohms per square has been used hereinabove to describe the
conductivity of the film formed by the novel process of this
invention. Although specific resistivity is usually utilized to
describe or compare the conductivity of materials, it is
inappropriate for describing the conductivity of very thin films
because of the difficulty of measuring the thickness of the
film.
Specific resistance is the resistance between opposite faces of a
cubic centimeter of material and is expressed by the equation
##EQU1## where .rho. is the specific resistance, R is the
resistance of the conductor, A is the cross-sectional area of the
conductor, and L is the length of the conductor. For a thin film,
this expression becomes ##EQU2## wherein W and L are the surface
dimensions and t is the film thickness. For a square area of
surface, W and L are equal and .rho. = R .times. t or R (resistance
for a square area of surface) = .rho./t. Thus, the conductivities
of various types of films having approximately equivalent thickness
may be directly compared by comparing resistance per square.
While the examples enumerated above concentrate on cathodes having
indium coatings and indium-tin alloys as coatings, it is understood
that other metals and alloys from the group of elements of atomic
numbers 48 to 51 may be used, for example, tin cathodes containing
up to 15% antimony produce films having better than 70% luminous
transmittance and about 100 ohms per square and cadmium cathodes
containing up to 20% indium produce films having better than 60 %
luminous transmittance and about 1,000 ohms per square in
resistivity.
The samples produced by cathode sputtering in an atmosphere in
which the heating elements provided a controlled uniform
temperature pattern throughout the area of the substrate had
electrical conductivities that did not vary by more than 20% from
the most conductive to the least conductive areas. Very rarely are
films produced that lack the requisite transparency (over 70%) and
electroconductive properties including uniformity of
electroconductivity as well as low electrical resistivity (below 10
ohms per square) for substrates having at least 6 inch lengths and
6 inch widths. By comparison, earlier efforts to coat glass
substrates without uniform heating thereof by heating means
independent of the heat induced by sputtering resulted in coatings
whose electroconductivities varied by a factor as high as 10 to 1
from protion to portion of the coated substrate even when scanning
the cathode.
Another obvious improvement brought about by the present invention
is seen from comparisons of electroconductive and optical
properties of films produced by cathode sputtering with those
produced by spraying a metal salt composition on a substrate heated
to pyrolizing temperature. For example, an article having 10 ohms
resistance between oppositely disposed bus bars for an indium oxide
coating has a transmission coefficient of only 68% when produced by
spraying and 85% for the same composition produced by cathode
sputtering using the temperature control criteria described above.
In addition, articles with cathode sputtered films have
significantly less distortion than those produced by heating to a
temperature sufficient for pyrolysis followed by spraying.
The apparatus aspect of the present invention makes it possible to
irradiate the substrate simultaneously with the cathode sputtering
operation. This hitherto unobtained result is made possible by
limiting the voltage applied to the spaced heating elements in the
form of the resistance wires 48 to a maximum of 50 volts. This
voltage, particularly it if is a A.C. voltage, is insufficient to
cause arcing between the heating wires and grounded elements within
the chamber. The heating elements are spaced from or insulated from
grounded elements.
Irradiating with heat produced by electrically energized heating
wires enables the present apparatus to uniformly heat substrates
that do not have optically flat surfaces. Prior art temperature
controllers for the substrate which supported the substrate by
contact were limited for efficient use with substrates having
optically flat surfaces.
While the description of working embodiments has been provided for
illustrative purposes, it is understood that variations thereof may
be made with out departing from the spirit of the invention as
defined in the claimed subject matter that follow.
* * * * *