U.S. patent number 3,906,185 [Application Number 05/521,880] was granted by the patent office on 1975-09-16 for heated insole construction.
This patent grant is currently assigned to Comfort Products, Inc.. Invention is credited to Erik O. Giese, Alexander Louis Gross.
United States Patent |
3,906,185 |
Gross , et al. |
September 16, 1975 |
Heated insole construction
Abstract
An electrically heated insole construction adapted to be fitted
into a shoe or boot, the insole having a layer of plastic mesh
material with the openings in the mesh providing air insulation
spaces, and a layer of plastic electrically insulated material
overlying the mesh material in a toe portion of the insole and
having an electrically conductive circuit printed thereon.
Inventors: |
Gross; Alexander Louis (Aspen,
CO), Giese; Erik O. (Key Biscayne, FL) |
Assignee: |
Comfort Products, Inc. (Aspen,
CO)
|
Family
ID: |
24078525 |
Appl.
No.: |
05/521,880 |
Filed: |
November 7, 1974 |
Current U.S.
Class: |
219/211; 219/523;
219/529; 219/536; 607/111; 36/2.6 |
Current CPC
Class: |
H05B
3/26 (20130101); A43B 3/0005 (20130101); A43B
7/04 (20130101); H05B 2203/003 (20130101); H05B
2203/036 (20130101); H05B 2203/013 (20130101) |
Current International
Class: |
A43B
7/04 (20060101); A43B 7/00 (20060101); H05B
3/22 (20060101); H05B 3/26 (20060101); H05B
001/00 (); H05B 003/16 () |
Field of
Search: |
;219/211,523,528,529,536
;128/383 ;36/2.6,43-44 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Albritton; C. L.
Attorney, Agent or Firm: Pennie & Edmonds
Claims
We claim:
1. An electrically heated insole construction having a heel area
and a toe area adapted to be fitted into a shoe, said insole
construction comprising a layer of plastic mesh material with the
openings in the mesh material providing air insulation spaces, a
layer of electrically insulative plastic material overlying said
layer of mesh material in the toe area of the insole, an
electrically conductive circuit printed on the side of said
insulation material opposite said layer of plastic mesh, and
electrical wiring connected to said printed circuit and adapted to
extend to a source of electric power.
2. An electrically heated insole construction according to claim 1
wherein said plastic mesh material comprises two layers of
fabric-like material separated by a spacing material and wherein
said electrical wiring extends between said layers of fabric-like
material.
3. An electrically heated insole construction according to claim 2
wherein said spacing material comprises a corrugated monofiliment
extending across the width of said insole and wherein said
electrical wiring extends lengthwise of said insole in grooves
formed by the corrugation of the monofiliment.
4. An electrically heated insole construction according to claim 1
having in addition a protective lining overlying said mesh material
and said insulative material to provide a lining for said
insole.
5. An electrically heated insole construction according to claim 4
having in addition a layer of pressure-sensitive adhesive on the
side of said plastic mesh opposite said insulation material whereby
said insole may be affixed in a shoe.
6. An electrically heated insole construction according to claim 5
having in addition a layer of plastic foam material affixed to the
side of said electrically insulative material opposite said
conductive circuit.
7. An electrically heated insole construction according to claim 5
wherein said lining layer comprises a heat sealable plastic film
and having in addition a further heat sealable plastic film
interposed between said layer of pressure-sensitive adhesive and
said layer of mesh material and wherein the heat sealable plastic
films are sealed together about their peripheries.
Description
BACKGROUND OF THE INVENTION
Various forms of insole constructions have been proposed in order
that boots, shoes and other footwear may be electrically heated.
Examples of such structures are illustrated in the following U.S.
Pat. Nos. 1,275,451, 1,430,404, 2,028,347, 2,692,326 and 3,621,191.
Prior art constructions as exemplified in these patents for the
most part provide for electrical resistance elements in the form of
conventional wiring to be embedded in insoles with the result that
heat, in addition to being directed to the bottom of the user's
foot, is also directed to the sole of the shoe such that this heat
is for the most part wasted. Since the prior art constructions
depend upon power packs for the source of electric power and
because the power packs have a limited capacity, the heat wasted in
heating the sole of the shoe represents a substantial drain on the
limited capacity of the power pack. The use of plastic insulation
layers in heated insole constructions has been proposed in order to
reduce the flow of heat to the sole of the shoe. See for example
application Ser. No. 416,209 filed Nov. 15, 1973. Such
constructions utilize conventional electrical wiring which wiring
allows heat to be radiated evenly around the circumference of the
wiring such that only a small part of the heat is directed towards
the user's foot.
It is an object of our invention to provide for an electrically
heated insole which assures that heat will be directed primarily
towards the foot of the user rather than towards the bottom sole of
the shoe into which the insole is fitted thus making the best use
of the limited capacity of the power pack.
GENERAL DESCRIPTION OF THE INVENTION
Broadly, our invention comprises an electrically heated insole
having a heel area and a toe area which may be fitted into the
bottom of a shoe, boot, or other footwear. The insole comprises in
part a layer of plastic mesh material where the openings of the
mesh form air insulation spaces. A layer of electrically insulative
plastic material overlies the layer of mesh material in the toe
area of the insole and has an electrically conductive circuit
printed on the side of the plastic layer opposite the plastic mesh
material. In this manner heat generated in the printed circuit when
it is connected to a power source by electrical wiring will be
directed towards the foot of the user and prevented by the air
insulation spaces of the mesh material from being conducted to the
sole of the shoe. Preferably the mesh-like material comprises two
layers of a fabric-like material knitted or woven from a plastic
monofiliment which layers are separated by corrugated monofiliment
material. The monofiliment material extends across the width of the
insole and forms grooves running the length of the insole through
which electrical wiring may extend from the printed circuit to the
heel portion of the insole. A layer of a protective lining material
may overlie the mesh material and the printed circuit to give a
smooth protective surface. A layer of pressure-sensitive adhesive
is applied to the mesh-like material in order that the insole may
be affixed into the shoe.
In a further form of the invention an additional foam-like plastic
material is interposed between the mesh material and the
electrically insulative layer having the printed circuit to provide
a further layer of insulation between the printed circuit and the
sole of the shoe into which the insole is to be fitted.
In a still further form of the invention, a film of a heat sealable
material is interposed between the mesh-like material and the layer
of pressure-sensitive adhesive and is heat sealed about its
periphery to the protective lining material which may also comprise
a heat sealable material. In this manner the mesh-like material is
encased by the heat sealable materials and thus further increases
the insulation properties of the air spaces.
DESCRIPTION OF THE DRAWINGS
FIG. 1 is a diagrammatical view of an electrically heated insole
constructed according to the invention illustrating the connection
between the insole and a power pack carried by a user;
FIG. 2 is a partial sectional top view of a heated insole
construction according to the invention;
FIG. 3 is an enlarged side sectional view of FIG. 2 taken along
lines 3--3;
FIG. 4 is a view similar to FIG. 3 of a second embodiment of a
heated insole; and
FIG. 5 is a view similar to FIG. 3 of a third embodiment of a
heated insole .
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring to FIG. 1, there is illustrated a heated insole 1
constructed according to the invention connected by electrical
wiring 2 and 3 to a power pack 4 adapted to be mounted by a clip or
other means to the belt of a user. As shown the electrical wires 2
and 3 extend down the inside of the legs of the user's trousers and
are joined by means of a conventional plug and socket arrangement 5
to wiring connecting with the insole. The batteries contained in
the power pack 4 are of the rechargeable type which may be
conveniently recharged by mounting on a charging unit. When the
power pack is to be recharged, it is detached from the wires 2 and
3 by removing a connecting plug 6 and moved to the charging unit.
The amount of power withdrawn from the power pack and thus the
amount of heat to be generated by the heated insole is regulated by
disconnecting and connecting the plug 6. Batteries which are
commercially available may be recharged 250 times or more and are
sufficient to provide power for approximately eight hours, the
length of a working day during which the heated insoles would be
operable.
The novel insole constructed according to the invention comprises a
plastic mesh-like layer 10 preferably made of saran fiber
comprising two layers of fiber-like material 11 and 12 which are
separated by a corrugated monofiliment 13. As shown, a plurality of
air pockets 14 are formed which reduce the convection flow of air
between the layers 11 and 12.
An electrically insulative plastic layer 15 overlies layer 10 on
the top portion of the insole and comprises a plastic layer 16
which may be of a polyester material having printed thereon a
conductive circuit 17 over which a further layer 18 which is of the
same material as layer 16 extends. Circuit 17 in turn connects with
lead wires 2' and 3'. The layer 15 is affixed to the layer 10 by an
adhesive 19. By utilizing a conductive circuit which is printed on
the film 16 rather than conventional resistance wiring, a greater
effective surface area of the resistance circuit is created which
improves the transfer of heat in vertical directions.
A protective lining 20 is applied to the layer 15 by an adhesive
21. The lining 20 may comprise a cloth material having a
moisture-absorbing capacity or a vinyl material having a
moisture-absorbing capacity and including a fungus retardant. The
lining increases the comfort to the user by providing
moisture-absorbing capacity and also by providing sufficient
friction for foot stabiltiy when engaged by the foot of the user.
In addition the lining provides a degree of protection to the
printed circuit, a degree of rigidity to the insole and serves to
improve the appearance of the insole.
The mesh-like layer 10 has a pressure-sensitive adhesive 22 on the
lower side thereof over which a protective layer of paper 23
extends. When the insole is to be applied in a shoe, the protective
layer of paper 23 is peeled off of the adhesive 22 and the insole
applied to the interior of a shoe. Pressure of the user's foot on
the insole will be sufficient to then affix the insole to the
shoe.
As shown in FIG. 2 the electrically insulative layer 15 is shaped
to cover only the toe area of the insole. This is because in
practice it has been found that under cold weather conditions
discomfort arises mainly from one's toes becoming too cold rather
than other areas of the foot, such as the heel or arch. It has been
found that if the toes are heated, this is usually sufficient to
provide the degree of heat necessary to give the required degree of
comfort while at the same time eliminating any unnecessary heating
of other areas of the foot which would result in excess draining of
the capacity of the power pack.
The use of the layer of mesh-like material besides providing the
air chambers 14 which improve the insulative effect of the material
also provides channels through which the wires 2' and 3' extend
along the length of the insole thus providing protection for the
wiring. The wires extend to the heel area of the insole and for a
short exposed area beyond the heel area and are adapted to be taped
to the inside heel of the shoe. A short portion extends outside the
shoe and is connected by the plug assembly 5 to the wires 2 and
3.
FIG. 4 illustrates a further embodiment of the invention which is
generally similar to that of FIG. 3 with the exception that a
further layer of plastic foam material 25 is interspersed between
the layer of mesh material 10' and the layer 15 of electrically
insulative plastic material. This particular construction provides
still greater insulation between the printed resistance portions 17
supplying the heat and the sole portion of a shoe which need not be
heated.
Referring to FIG. 5 a further form of an insole constructed
according to the invention is shown which differs from the
constructions of FIGS. 3 and 4 in that the lining 20' comprises a
layer of vinyl plastic and in that a further vinyl layer 26 is
interspersed between the mesh-like layer 10 and the
pressure-sensitive adhesive layer 22. Layer 26 and lining 20' are
heat sealed together along their peripheries such that the
mesh-like layer 10 and spaces 14 are encased between the vinyl
layer 26 and the lining 20'. This construction increases the
insulative properties of the layer 10 by preventing flow of air
into and out of the chambers 14 around the edges of the insole. At
the same time, the vinyl layer 26 and lining 20' provide additional
structure for holding the complete insole in assembled relation. A
layer of adhesive 27 affixes the vinyl layer 26 to the mesh-like
layer 10.
* * * * *