U.S. patent number 3,906,171 [Application Number 05/409,665] was granted by the patent office on 1975-09-16 for transducers.
This patent grant is currently assigned to The Rank Organisation Limited. Invention is credited to Michael Braceley.
United States Patent |
3,906,171 |
Braceley |
September 16, 1975 |
Transducers
Abstract
An electro-acoustic transducer with a voice coil which is
encapulated in a setting material and bonded to the diaphragm to
provide an improved temperature rating.
Inventors: |
Braceley; Michael (Bradford,
EN) |
Assignee: |
The Rank Organisation Limited
(London, EN)
|
Family
ID: |
23621478 |
Appl.
No.: |
05/409,665 |
Filed: |
January 2, 1974 |
Current U.S.
Class: |
381/397 |
Current CPC
Class: |
H04R
9/022 (20130101) |
Current International
Class: |
H04R
9/02 (20060101); H04R 9/00 (20060101); H04r
009/00 () |
Field of
Search: |
;179/115.5R,115.5VC |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
|
|
|
|
|
|
|
549,852 |
|
Apr 1930 |
|
DD |
|
1,174,364 |
|
Jul 1964 |
|
DT |
|
Primary Examiner: Blakeslee; Ralph D.
Attorney, Agent or Firm: Brisebois & Kruger
Claims
I claim:
1. A voice coil for an electro-acoustic transducer, said coil
comprising a plurality of turns of insulated wire encapsulated in a
setting material forming an encapsulation, said encapsulation
including a portion extending axially of said coil and forming a
connection between said coil and a diaphragm of an electro-acoustic
transducer.
2. The coil of claim 1 wherein the turns of said winding of said
coil are held together, prior to encapsulation, by a bonding agent,
and said encapsulating material has a higher temperature rating
than said bonding material.
3. The coil of claim 1 wherein turns of said coil are supported on
a former and said encapsulating material has a temperature rating
at least as high as the material of said former.
4. The coil of claim 1, wherein the temperature rating of said
encapsulating material is at least comparable to that of the
insulation material of said windings of said coil.
5. The coil of claim 1, wherein said axial extension of said
encapsulating material is shaped to form at least part of a
diaphragm of an electro-acoustic transducer.
6. The coil of claim 1, wherein said encapsulating material is a
phenolic resin.
7. The coil of claim 1, wherein said encapsulating material is a
glass filled epoxide resin.
8. The coil of claim 1 wherein said encapsulating material is
provided with a filler to improve the thermal conductivity
thereof.
9. A method of manufacturing an encapsulated coil for an
electro-acoustic transducer, comprising the steps of:
winding a selected number of turns of wire,
providing support for said turns,
placing said turns on a mandrel in a moulding cavity of an
injection moulding machine,
injecting an encapsulating material into said moulding cavity to
surround said coil, allowing said encapsulating material to set,
and removing said encapsulated coil from said mould.
10. The method of claim 9 wherein said support provided for said
turns of said coil prior to encapsulation is a former of suitable
material.
11. The method of claim 9 wherein the support provided for said
turns of said coil prior to encapsulation is in the form of a
bonding agent.
12. The method of claim 9 further comprising the step of cooling
said moulding cavity to keep the temperature thereof below a
temperature at which said support for said turns will be
affected.
13. A loudspeaker fitted with the encapsulated coil of claim 1.
Description
The present invention relates to voice coils for electro-acoustic
transducers, and particularly to loudspeaker voice coils having an
improved temperature rating.
One of the problems associated with loudspeaker coils is that of
heat dissipation since the temperature of a coil rises considerably
in use. In general, loudspeaker coils are either wound on a former
which may be made of paper, aluminium foil or a glass-filled
epoxide resin, or alternatively the coils may be "self-supporting."
Self-supporting coils are formed without a former but are held
together with a bonding material. At higher temperatures, say in
the region of 160.degree.C - 180.degree.C, bonding materials tend
to soften and, under the influence of the magnetic field of the
loudspeaker, the turns of the coil tend to separate. The term
"temperature rating" as used in this Specification will be
understood to mean the temperature which a material is able to
withstand for a given period without significant deterioration.
If the loudspeaker coil is wound on a former the drive from the
coil to the diaphragm of a loudspeaker is transmitted via the
former, which normally has a smaller diameter than the winding.
This indirect transmission of drive from a coil via a former to a
diaphragm does not provide the best possible coupling between the
winding of the coil and the diaphragm of the loudspeaker.
The present invention seeks to provide a loudspeaker coil in which
both of the abovementioned disadvantages can be overcome, and which
is both simple to manufacture and robust in use.
According to the present invention, there is provided a voice coil
for an electro-acoustic transducer, comprising a plurality of turns
of insulated wire, in which the coil is encapsulated in a setting
material, the encapsulation including a portion extending axially
of the coil for forming a driving connection between the coil and a
diaphragm of the transducer.
If the turns of the winding of the coil are held together by a
bonding agent it is preferred that the encapsulating material has a
higher temperature rating than the bonding material, and if the
turns of the coil are supported on a former it is preferred that
the encapsulating material has a temperature rating at least as
high as the material of the former. Preferably, the temperature
rating of the encapsulating material is at least comparable to that
of the insulation material of the coil. In embodiments of the
invention using self-supporting coils, difficulties due to
softening of the bonding material are reduced since the
encapsulation material will provide structural support for the
turns of the winding even at a temperature higher than that at
which the bonding material starts to soften.
The encapsulating material can be used to transmit drive directly
to the diaphragm of a loudspeaker whether the coil is of the
self-supporting type or wound on a former. The axial extension of
the encapsulation may be shaped in such a way that it can transmit
drive to the diaphragm efficiently.
Preferably the extension of the encapsulating material for
transmitting drive to the diaphragm of a loudspeaker is shaped at
the end to assist in forming a secure connection between the coil
and the diaphragm. In this way, for conical diaphragm loudspeakers,
a better coupling between the winding and the diaphragm cone can be
achieved than in the previous arrangements with conventional coils
wound on formers where the drive was transmitted via the former. In
the case of self-supporting coils where drive could any way be
transmitted directly from the windings to the diaphragm the
encapsulation does not greatly improve the coupling between the
coil and the diaphragm but on the other hand does overcome the
problem, mentioned above, due to softening of the bonding material
at higher temperatures.
In an alternative embodiment of the invention the axial extension
of the encapsulation is shaped to form at least part of a diaphragm
of a loudspeaker. If desired the extension could be shaped to form
the whole diaphragm of a loudspeaker so that the coil of the
loudspeaker would be encapsulated within a unitary structure
including the diaphragm. Such an arrangement would obviously permit
extremely good coupling between the coil and the diaphragm.
The encpasulation can be undertaken for coils having any number of
turns arranged in any number of layers although conveniently the
winding has from one to four layers of turns.
Various setting materials are suitable for use as the encapsulating
material although phenolic resin and glass-filled epoxide resin are
both particularly suitable. The encapsulating material may be
provided with a filler to improve the thermal conductivity thereof
so that heat is more effectively radiated into the magnet structure
of the loudspeaker. In the case of glass-filled epoxide resin the
filler for improving thermal conductivity may be used in addition
to or in place of glass fibres.
If a winding is supported on a former the former may be dispensed
with after encapsulation or may be originally of a minimum length
to support the coil before encapsulation and retained after
encapsulation. Alternatively, a former may be provided and used to
transmit drive to the diaphragm of a loudspeaker if this is
desired.
Normally, the encapsulated coil will be coated on the outside and
the two ends, although for certain applications it may be desirable
to coat only the outside and one end.
According to another aspect of the present invention there is
provided a method of manufacturing an encapsulated coil for an
electro-acoustic transducer comprising the steps of winding a
selected number of turns of wire, providing support for the turns,
placing the turns on a mandrel in a moulding cavity of an injection
moulding machine, and injecting an encapsulating material into the
moulding cavity to surround the coil.
If the winding is of the self-supporting type the method preferably
further comprises the step of cooling the moulding cavity to keep
the temperature thereof below a temperature at which the bonding
agent of the self-supporting winding will be affected.
The present invention also comprehends a loudspeaker when provided
with an encapsulated coil as defined above.
Two embodiments of the present invention will now be more
particularly described, by way of example, with reference to the
accompanying drawings, in which
FIG. 1 is a longitudinal section of a conventional cone/coil
assembly and
FIG. 2 is a longitudinal section of a first embodiment of the
invention.
FIG. 3 is a longitudinal section of a second embodiment of the
invention.
Referring to FIG. 1, the conventional assembly comprises a coil
former 11, on which is wound a coil 12. The wire of the coil is
normally coated with adhesive, which serves the purpose of bonding
the turns of the coil to each other and also to the former. The
layer of adhesive bonding the coil 12 to the former 11 is indicated
at 13. The former 11 is inserted into the neck of the cone 14 and
is held in position by a further layer of adhesive 15.
It will be seen that there is no mechanical constraint which would
prevent the turns of the coil from separating under the influence
of a magnetic field if the current in the coil raises the
temperature to the point at which the adhesive softens. It will
also be apparent that the drive between the coil and the cone is
transmitted via the former, which has a smaller diameter than the
coil, and the drive is to that extent indirect. In addition, two
layers of adhesive are involved in the transmission of energy, and
loss of energy can take place in the adhesive material.
In the embodiment of the invention shown in FIG. 2, a former 21
carries a winding 22, and although there is a layer of adhesive 23
between the coil winding 22 and the former 21 this merely
facilitates the handling of the coil until it has been
encapsulated. The winding 22 is enclosed in an encapsulation 24 the
material of which may be a phenolic resin or a glass-filled epoxide
resin or any other suitable temperature resistant setting material.
The encapsulation 24 has a part 24a extending axially of the coil
in driving connection with a diaphragm 25 of the loudspeaker. The
function of the encapsulation 24 is first to provide a mechanical
restraint for the turns of the coil 22, and secondly, via the axial
extension 24a, to provide drive, at the same diameter as the coil
22, to the loudspeaker cone 25. A layer of adhesive 26 is used to
bond the axial extension 24a of the encapsulating material 24 to
the cone 25.
It will be seen that, should the adhesive 23 of the coil 22 become
softened due, for example, to overheating during use, the
encapsulating material 24, being more resistant to heat, will hold
the turns of the coil 22 together so that the loudspeaker will
continue to function properly. It will also be seen that, in
contrast to the coil of FIG. 1, only one layer of adhesive is
involved in the transmission of the drive from the coil, and that
much of the adhesive transmits drive by compression or tension at
the conical face of the diaphragm 25, rather than in shear, which
is the case with the layers 13 and 15 of the prior art device shown
in FIG. 1.
Further, it can be seen that, in the encapsulated form, the coil of
FIG. 2 does not rely on the former 21 for support. If the coil 22
were of the self-supporting type, the result after encapsulation
would have much the same properties as the embodiment shown in the
drawing.
Referring now to the embodiment of FIG. 3, a coil 31 is initially
supported on a former 32, and in this case the encapsulating
material 33 has an axial extension 34a and a part 34b formed as a
portion of a diaphragm. This embodiment has similar advantages to
that of FIG. 2, and in addition it dispenses completely with glued
joints. Again the former 32 is only used as a support in the
initial stages of manufacture and could be omitted if a
self-supporting coil were employed.
Any of the embodiments described above may be manufactured by
injection moulding. The winding 22 or 31 is first formed and then
located in the moulding cavity of an injection moulding machine on
a mandrel which is preferably of the expanding type to ensure that
the coil does not move during the moulding process, and also to
ensure that the roundness of the coil is maintained during
moulding. An encapsulating material of a thermosetting type, such
as a phenolic resin is then injected into the moulding cavity which
is cooled by water cooling so that the bonding material or the
material of the former is not deleteriously affected by the
temperature.
The use of a glass-filled epoxide resin for the encapsulating
material has various advantages over phenolic resins. For example,
it may be injection moulded at a lower pressure than phenolic
resin, for example at 200 lbs. per square inch. Moreover
glass-filled epoxide resin is less brittle than phenolic
resins.
* * * * *