U.S. patent number 3,895,851 [Application Number 05/390,975] was granted by the patent office on 1975-07-22 for brittle-surfaced connector.
This patent grant is currently assigned to AMP Incorporated. Invention is credited to James Alfred Bolton, Howard Richard Peiffer.
United States Patent |
3,895,851 |
Bolton , et al. |
July 22, 1975 |
Brittle-surfaced connector
Abstract
A crimp-type electrical connector especially useful for
terminating aluminum wires wherein the ferrule portion is at least
internally surfaced with brittle intermetallic compound, preferably
formed by high temperature diffusion of a cladding-metal into the
base-metal of the connector, which compound upon crimping breaks
into small sharp particles which abrade and pierce the surface of
the wire conductor to expose clean non-oxidized metal for forming
intimate joints in the resulting connection.
Inventors: |
Bolton; James Alfred
(Winston-Salem, NC), Peiffer; Howard Richard (New
Cumberland, PA) |
Assignee: |
AMP Incorporated (Harrisburg,
PA)
|
Family
ID: |
23544709 |
Appl.
No.: |
05/390,975 |
Filed: |
August 23, 1973 |
Current U.S.
Class: |
439/387; 174/84C;
439/878; 174/94R; 439/886 |
Current CPC
Class: |
H01R
4/62 (20130101); H01R 4/20 (20130101); H01R
11/12 (20130101) |
Current International
Class: |
H01R
4/58 (20060101); H01R 4/62 (20060101); H01R
011/20 () |
Field of
Search: |
;339/95,97-99,276,278C
;174/84C,94R |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: McGlynn; Joseph H.
Attorney, Agent or Firm: Egan; Russell J.
Claims
We claim:
1. An electrical connector having a crimp-termination means for
receiving an electrical wire and forming a connection therewith
upon crimping thereto, comprising said means being formed of a
conductive base-metal whose surface for engaging said wire is at
least in substantial part an integral, continuous, thin, frangible,
conductive, intermetallic compound layer less than about 300 micro
inchese thick, said layer being composed solely of metals.
2. A connector according to claim 1 wherein said intermetallic
compound layer is at least partially formed of said base-metal.
3. A connector according to claim 2 wherein said base-metal is
copper.
4. An electrical connector having a crimp-termination means for
receiving an electrical wire and forming a connection therewith
upon crimping thereto, comprising said means being formed of a
base-metal chosen from the group consisting of copper, brass,
bronze, or steel and with at least the substantial portion of the
interconnection surface of said means for engaging said wire being
a thin, continuous, integral layer of a brittle intermetallic
compound between 30 and 300 micro inches thick and formed of the
base-metal and of a cladding-metal selected from the group
consisting of aluminum, tin, indium, and their equivalent alloys,
said layer being composed solely of metals.
5. A connector according to claim 4 wherein said base-metal is
copper and interconnection surface is an intermetallic compound
formed of said copper and an aluminum-silicon alloy.
6. A connector according to claim 4 wherein said base-metal is
copper and interconnection surface is an intermetallic compound
formed of said copper and tin.
Description
The present invention relates to electrical connectors, and more
especially to crimp-type electrical connectors primarily useful in
terminating smaller aluminum wires as well as copper wires.
The termination of aluminum wires has always been a significant
problem in the electrical arts due to the formation of a relatively
non-conductive oxide surface layer on the aluminum which interferes
with the formation of an effective aluminum-to-aluminum,
aluminum-to-copper, etc. crimp termination. For example, in the use
of a typical standard copper crimp connector with a cylindrical
ferrule, not only is the original termination somewhat inferior,
but the inevitable micro-fissures remaining with the crimp
structure result in rapid deterioration upon exposure to the
natural environment. This deterioration occurs at such a rapid rate
that under standard quality control testing for copper-wire to
copper-connector crimp terminations (wherein the latter would
result in only a small percentage increase in resistance after
testing) the aluminum-wire to copper-connector connection after
such testing results in at least a 50% increase in the resistance
and more often with essentially open circuit terminations
resulting.
There have been many attempts in the prior art to overcome these
aforementioned difficulties in terminating aluminum wire. For
example in the utility field, the interior of the crimp connector
ferrule was often filled with a corrosion-inhibiting jelly and hard
nickel particles which serve the purpose of breaking through the
oxide layer during the crimp to expose fresh unoxidized aluminum
for cold welding with the metal of the connector, and with the
jelly serving to exclude subsequent corrosion from the external
atmosphere. See for example U.S. Pat. No. 2,815,497. This found
some usefulness in the larger utility-type connectors, but is not
nearly so useful in the 10 to 40 gauge wire range. Additionally,
such connectors are more expensive and difficult to use.
Therefore it is an object of this invention to develop a crimp-type
electrical connector for terminating solid or stranded aluminum
wire, which is particularly useful in the smaller wire gauge ranges
(e.g. 10 gauge to 40 gauge) all with a longevity and termination
quality on the order of that achieved by copper terminations to
copper wiring. It is a further object of this invention to achieve
the foregoing result with a connector whose physical confirmation
and field utilization is substantially identical to standard copper
wire connectors and as such can utilize existing connector
manufacturing tools and existing application tooling. It is a still
further object of the present invention that the foregoing results
be achieved by a relatively simple and comparatively inexpensive
connector.
According to the present invention, these and other objects and
advantages of the present invention will be achieved by the
treatment of crimp-type connectors formed from typical base-metal
materials such as copper, brass, bronze, steel or the like with a
cladding-metal such as aluminum, tin, indium, their equivalent
alloys, or the like wherein the cladding-metal has been applied to
the base-metal so as to diffuse substantially entirely into the
surface of the base-metal to form a thin surface layer of the order
of 30 to 300 micro inches thick of a brittle intermetallic compound
of said base-metal and said cladding-metal. As will be developed
more fully below, this intermetallic compound surface layer may be
formed on the surface of flat metal stock from which the connectors
are formed, or may be formed on the surface of the otherwise
completed connector as one of the last finishing steps in its
manufacture.
In this specification and the accompanying drawings we have shown
and described preferred embodiments of our invention and have
suggested various alternatives and modifications thereof; but it is
to be understood that these are not intended to be exhaustive and
that many other changes and modifications can be made within the
scope of the invention. These suggestions herein are selected and
included for purposes of illustration in order that others skilled
in the art will more fully understand the invention and the
principles thereof and will thus be enabled to modify it and embody
it in a variety of forms, each as may be best suited to the
conditions of a particular use.
FIG. 1 is an isometric view of a standard crimp-type connector in
which the present invention would commonly be utilized.
FIG. 2 is a vertical cross-section of the connector in FIG. 1 with
the intermetallic layer illustrated in exaggerated thickness and
delineation for purposes of clarity on the internal surface of the
barrel and tongue of the connector.
Referring to the drawings, a common type of a closed barrel crimp
connector 1 is utilized to illustrate the preferred embodiment of
this invention. The connector 1 is composed of a crimp termination
means 2; in the form of a barrel portion of ferrule 2, for
receiving the wire 3 therein and a tongue portion 4 having an
eyelet 5 for receiving a terminal post therethrough. The thin
intermetallic layer 6 has been specifically illustrated in FIG. 2
as being formed on the internal surface of the base metal 7.
The brittle intermetallic conductive layer 6 not only typically
serves as a protection for the base metal 7 against oxidation or
the like, but is believed to give this novel connector its unique
characteristics by reason of the extremely brittle or frangible
surface which it forms. This surface 6 during crimping of the
barrel 2 onto the wire 3 breaks into small sharp particles which
abrade and pierce the surface of the conductor and, particularly in
the case of aluminum, thereby expose clean non-oxidized aluminum
while simultaneously exposing clean non-oxidized base-metal. During
the crimping these exposed and cleaned surfaces of the terminal and
conductor rub and work against each other under pressure and form
extremely intimate joints or possibly cold welds.
The intermetallic surface 6 can be prepared in a number of ways. In
one embodiment, a copper connector 1 was dipped in a molten bath of
an aluminum silicon alloy protected by a common aluminum brazing
flux. This produced a very hard frangible surface resulting in
connectors which when crimped to solid aluminum wire showed
exceptional life, even under adverse testing conditions. This
dipping method is not only dangerous due to spattering and
corrosiveness, but also proved very difficult to control; therefore
giving non-uniform surfaces of uneven thickness. Consequently a
preferred method of forming the intermetallic layer 6 is by
plating, roll cladding, or the like of the cladding-metal onto the
base-metal in a thickness typically up to about 200 micro inches
and thereafter heat treating to cause the entire cladding-metal to
diffuse into the surface of the base-metal (the thickness of which
resulting intermetallic compound layer 6 should not exceed about
300 micro inches). Because of the brittle nature of the surface 6
formed, it is advantageous to postpone the heat treatment until
after the stamping and forming operation has been finished. In an
example of the foregoing a thin aluminum cladding is rolled onto
the surface of a relatively thicker copper sheet, which after
stamping and forming into a connector is thereafter heat treated to
allow the aluminum and copper to intermingle and form an
intermetallic compound. Similarly, a copper connector 1 which has
been tin plated is thereafter heated to a high enough temperature
to allow diffusion to occur between the tin and copper causing a
tin-copper intermetallic compound to form. Similarly, steel may be
plated with tin or coated with aluminum and at sufficiently higher
temperature will form a hard brittle intermettalic which when
crimped on aluminum wire will break through the aluminum oxide skin
and mechanically lock the wire to form a good electrical connection
of high mechanical strength.
These latter rolling and plating methods not only give much greater
control over the uniformity of thickness of the intermetallic layer
6, but also over the placement of such layer on the surface of the
connector 2. For example in the dip method, the entire surface of
the connector 2, if totally immersed, would be coated with the
intermetallic layer. However, the plating and rolling methods can
be adapted to restrict the intermetallic layer to just one surface
of the base metal from which the connector 1 is formed (as is the
case illustrated in FIG. 2), or even be restricted to the internal
surface of the barrel portion 2 alone.
Consistently superior results have been achieved with the use of a
connector made according to the present invention when crimped on
solid aluminum wire 3. Somewhat less consistent results are
achieved when stranded aluminum wire is used in place of solid
aluminum wire. This is understandable, because the superior
function of the inventive connector is due to the interaction
during the crimp between the outer surface of the wire 3 and the
intermetallic layer 6. In the case of multi-filament stranded
aluminum wire only those portions of those strands of the wire 3 in
contact with the intermetallic surface 6 are deriving benefit from
this superior interaction and the aluminum-to-aluminum surface
interaction of the strand surfaces within the wire remain as before
and are therefore subject as before to relatively rapid failure due
to corrosion from naturally occurring external phenomena resulting
from heat cycling, creep and the like.
However, by carefully controlled crimping methods insuring a high
degree of crimping, but not so much as to lose the wire by undue
extrusion from the crimping area, the reliability of the inventive
connectors is increased even in the case of stranded aluminum
wires. Terminations from the inventive connectors are in any event
greatly superior to prior art crimp-type terminations to stranded
aluminum wire.
It should be emphasized that for the intermetallic surface 6 to be
effective, essentially all of the cladding-metal should be diffused
into the base-metal, and vice versa, so that little or no
unmodified cladding-metal remains on the surface.
In a series of experiments, a number of copper connectors of the
type illustrated in FIG. 1 were plated with tin in an ordinary
stannate plating bath, or with tin plated over a flash plated
copper, or plated with a bright tin which contains an organic
brightener that gives the plated tin a shiny appearance; or
alternatively with an indium plating. The plating thicknesses
ranged between 50 and 300 micro inches at a diffusion temperature
of 800.degree. or 1000.degree.F for diffusion times ranging from 30
seconds, through 5, 10 and up to 20 minutes. As a standard of
comparison three connectors with copper-copper standard tin (100
micro inches), bright tin (50 micro inches), and indium (100 micro
inches) plating, respectively, were subjected to normal
environmental quality control testing along with the aforementioned
tin or indium intermetallic compound surfaced inventive connectors,
as follows: air quenched thermal shock (plus 150.degree.C to
-55.degree.C, 15 cycles), current overload (15 minutes on and 15
minutes off at 40 amperes for 12 gauge wire or 52 amperes for 10
gauge wire), humidity (96% at 90.degree.C for 100 hours), and salt
spray (5% sodium chloride for 48 hours at room temperature).
By comparison, in some cases the standard aluminum terminations,
after testing, showed open circuits while in the best cases they
showed such deterioration of resistance that their resistance was
50% higher than their initial values. In contrast, the connectors
prepared according to the present invention were, after testing, 10
to 15% higher than their initial values. The foregoing
environmental testing was made on otherwise identical copper
base-metal connectors crimped to solid aluminum wire by the same
crimping tool.
From these foregoing experiments, it was determined that for tin
(as the cladding-metal) on a copper connector (as the base-metal)
the preferred thickness of the plating applied for subsequent
diffusion should range between 30 and 200 micro inches. Upon
diffusion this would result in a maximum significant depth of
diffusion of about 300 micro inches. Any amount less than this
foregoing range would not give a sufficient surface treatment to
achieve a meaningful effect while any more than this range would
result in excessive brittleness and cracking of the surface prior
to crimping, all resulting in undesired unreliability. The
preferred temperature for effecting this diffusion of the plating
tin into the copper is from 600.degree.F to 1200.degree.F with a
diffusion time of from 5 to 30 minutes.
Naturally steel would require considerably higher temperatures and
similarly dipping into molten baths will require similarly higher
temperatures (1000.degree. to 1400.degree.F in the case of tin).
The temperature ranges are generally determined by having to be
high enough in order for the diffusion to be swift enough to be
economically feasible but below the melting temperature of the
intermetallic compounds and of the base-metal.
* * * * *