U.S. patent number 3,893,048 [Application Number 05/486,296] was granted by the patent office on 1975-07-01 for matched mic delay line transducer using a series array.
This patent grant is currently assigned to The United States of America as represented by the Secretary of the Army. Invention is credited to Stuart I. Lieberman.
United States Patent |
3,893,048 |
Lieberman |
July 1, 1975 |
Matched MIC delay line transducer using a series array
Abstract
A transducer for a bulk-mode acoustic delay line comprises a
plurality of ries-connected transducers and a series inductance
deposited at the end of the delay line. The number and
configuration of the series-connected transducers is selected such
that the sum of the resistive components of their impedances
matches the driving impedance. The value of the inductance is
chosen to balance the combined capacitive components of the
series-connected transducers. Series contact between the electrodes
of adjacent transducers is achieved by configuring the ground layer
electrode with a finger-like projection which is overlapped by a
similar projection in the top layer electrode of the adjacent
transducer. The overlapping portions of the electrodes are
permitted to make electrical contact with one another by removing
the piezoelectric material from the overlap region.
Inventors: |
Lieberman; Stuart I. (Silver
Spring, MD) |
Assignee: |
The United States of America as
represented by the Secretary of the Army (Washington,
DC)
|
Family
ID: |
23931320 |
Appl.
No.: |
05/486,296 |
Filed: |
July 8, 1974 |
Current U.S.
Class: |
333/141; 310/317;
333/149; 310/334 |
Current CPC
Class: |
H03H
9/30 (20130101); H03H 9/125 (20130101) |
Current International
Class: |
H03H
9/00 (20060101); H03H 9/125 (20060101); H03H
9/30 (20060101); H03h 009/26 (); H03h 009/30 ();
H03h 009/32 () |
Field of
Search: |
;333/3R,72
;310/9.7,9.8,8,8.1,8.2,8.6,8.3,9.1,9.4 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Lawrence; James W.
Assistant Examiner: Nussbaum; Marvin
Attorney, Agent or Firm: Edelberg; Nathan Gibson; Robert P.
Elbaum; Saul
Government Interests
RIGHTS OF THE GOVERNMENT
The invention described herein may be manufactured, used, and
licensed by or for the United States Government for governmental
purposes without the payment to me of any royalty thereon.
Claims
What is claimed is:
1. A transducer arrangement for a bulk mode acoustic delay line
comprising a plurality of series connected, adjacent, closely
spaced transducers disposed on an end surface of said delay line,
each two adjacent transducers of said plurality of transducers
comprising first and second transducers each having,
a thin film metal ground layer electrode, the end of said electrode
of said first transducer extending beyond said first transducer and
abutting said second transducer,
a layer of electromechanical transducer material disposed on said
ground layer electrode and having a transducer material top surface
and at least a side surface at right angles thereto and covering
all but a specified exposed end portion of the transducer ground
layer electrode, said end of said first transducer ground layer
electrode being the end of said specified end portion of said first
transducer ground layer electrode,
and a thin film metal top layer electrode disposed on said top
surface of said transducer material layer and overlying part of
said ground layer electrode, the top layer electrode of said second
transducer extending beyond said ground layer electrode of said
second transducer and into overlying contact with the specified
exposed end portion of the ground layer electrode of said first
transducer to connect said first and second transducers in series,
said top layer electrode of said second transducer being bent at
right angles down a said side surface of transducer material and
then at right angles again into said overlying contact.
2. The transducer arrangement according to claim 1 wherein said
series-connected transducers are arranged in a mosaic pattern of
columns and rows, the series connections between transducers
defining a zig-zag path.
3. The transducer arrangement according to claim 1 further
comprising an inductance connected in series with said transducers
and deposited on said end surface of said delay line, the value of
said inductance being such that its impedance at the operating
frequency of said transducer arrangement is substantially equal to
the impedance of the overall capacitance of said series connected
transducers.
4. The transducer arrangement according to claim 3 wherein said
deposited inductance comprises two deposited inductors, each
deposited to one side of said plurality of transducers and each
deposited inductor defining a zig-zag path.
5. The transducer arrangement according to claim 2 wherein the
metal ground layer electrodes of at least said transducers which
are not the end transducers of said columns and rows are T shaped,
one part of said T forming a tab which includes said specified
exposed end portion.
6. The transducer arrangement according to claim 5 wherein said end
surface of said delay line is generally circular and wherein said
mosaic pattern resides in a strip extending diametrically across
said end surface, said transducer arrangement further comprising
two spaced terminals secured to said end surface and
electrically-connected to different ends of the series connection
of transducers.
7. The transducer arrangement to claim 6 wherein said terminals are
configured as segments of a circle disposed on opposite sides of
said diametrically-extending strip.
8. The transducer arrangement according to claim 2 wherein said end
surface of said delay line is generally circular and wherein said
mosaic pattern resides in a strip extending diametrically across
said end surface, said transducer arrangement further comprising
two spaced terminals secured to said end surface and
electrically-connected to different ends of the series connection
of transducers.
9. The transducer arrangement according to claim 8 wherein said
terminals are configured as segments of a circle disposed on
opposite sides of said diametrically-extending strip.
Description
BACKGROUND OF THE INVENTION
The present invention relates to improvements in bulk-mode delay
line transducers and, more particularly, to a transducer which is
compact, inexpensive, shock-resistant, and tolerant to
manufacturing process variations.
Typical microwave acoustic longitudinal-mode transducers employ a
piezoelectric film sandwiched between two metal electrode films.
All three films are generally deposited by any suitable technique,
in sequence, on the end of a suitable delay line. The equivalent
impedance of the transducer includes resistive and capacitive
components determined by the dimensions of the piezoelectric film
portion clamped between the two electrodes. More particularly,
since the transducer is, in effect, a piezoelectric capacitor whose
thickness is approximately one quarter of an acoustic wave length,
the impedance is inversely proportional to the area and directly
proportional to the thickness of the piezoelectric material located
between two electrodes. Ideally, the resistive component of the
transducer impedance should be matched to the impedance of the
driving generator for the delay line (typically 50 ohms). At low
frequencies, where the piezoelectric layer is relatively thick, the
area of the transducer may be reduced to permit the resistive
component of the impedance to be 50 ohms. However, too small a
transducer area creates two problems. First, the reduced-size
transducer produces an acoustic beam which is so narrow as to
render it extremely difficult to locate the beam upon its arrival
at the opposite end of the delay line; the proper placement of the
receiving transducer is therefore difficult to achieve. Second, it
becomes difficult to achieve a reliable bond to an extremely small
top electrode. For these reasons, conventional transducers designed
to operate in the vicinity of 3.5 GHz should be at least 0.005 inch
in diameter. This size results in a value of approximately 1 ohm
for the resistive component of impedance and, therefore, some form
of impedance matching to the driving generator is required.
Conventionally, bonding wires are normally employed to connect this
transducer to a matching network.
Ideally, the impedance matching components should be as small and
rugged as the delay line itself. In this respect it is desirable to
provide an impedance matching system which fits on the end face of
the delay line along with the transducer. A conventional
transducer, fabricated with a ground layer deposited over the
entire end face of the delay line, precludes utilization of the end
surface of the insulating delay medium as a substrate for a tuning
or matching component. A solution for this problem is described in
my prior U.S. Pat. No. 3,688,222 wherein I utilize the concept of
overlapping-finger transducer electrodes. More particularly, in may
prior patent the ground layer electrode is deposited over only a
portion of the end of the delay line; likewise the top layer
electrode is deposited over only a portion of the piezoelectric
with only finger-like projections of the two electrodes being
overlapped. With this configuration both the top layer and the
ground layer electrodes are available in the same plane at the end
face of the delay line. Moreover some portions of the end face of
the delay medium are not coated and therefore are available as a
substrate for a matching network. That arrangement achieved its
basic goals but was difficult to fabricate because the matching was
extremely critical and fabrication controls were not sufficiently
refined to permit precise reproduceability.
It is known that many small transducers can be connected in series
at the end of a delay line and that each transducer operates
independently of the others (reference Weinert et al., "A Thin Film
Moasic Transducer For Bulk Waves," I.E.E.E. Transactions on Sonics
and Ultrasonics, July 1972, pages 354 through 357). However no
attempt has been made to utilize this series transducer approach in
a compact rugged package which permits the impedance matching
arrangement to fit on the end face of the delay line. Nor has there
been any prior art attempt to provide a fabrication technique
wherein the series connections between adjacent transducers can be
effected simply and reliably.
It is therefore an object of the present invention to provide a
multi-transducer array which can be simply fabricated at the end of
a delay line utilizing known integrated circuit techniques.
It is another object of the present invention to provide a series
array of transducers which can be deposited along with a series
tuning inductor at the end of a delay line.
It is another object of the present invention to provide a compact
rugged transducer package for a delay line wherein multiple
transducers are connected in series using integrated circuit
techniques.
SUMMARY OF THE INVENTION
In accordance with the principles of the present invention, each of
the series-connected transducers includes a ground layer electrode
deposited on the end surface of a delay line and having a finger
projecting toward an adjacent electrode. Piezoelectric material is
deposited over the electrodes and removed in the region of the
projecting fingers. A top layer electrode for each transducer is
deposited over the piezoelectric material and extends to contact
the exposed portion of the finger projecting from a ground layer
electrode of the adjacent transducer. The tuning inductor is a
serpentine-shaped inductor connected to the input and output end of
the series transducer array and is deposited along with the ground
layer electrodes. All connections are thus part of the basic
integrated circuit structure. The number and configuration of the
transducers is selected such that their combined series resistance
matches the impedance of the driving generator. The
series-connections between the transducers, on the other hand,
reduces the total capacitance accordingly so that this capacitance
can be tuned out of the circuit by a relatively large and readily
fabricated series inductance.
BRIEF DESCRIPTION OF THE DRAWINGS
The above and still further objects, features and advantages of the
present invention will become apparent upon consideration of the
following detailed description of specific embodiments thereof,
especially when taken in conjunction with the accompanying
drawings, wherein:
FIG. 1 is a plan view of an end of a delay line on which is
fabricated a series-array transducer arrangement according to the
present invention;
FIG. 2 is an electrical equivalent circuit of the transducer and
inductor of FIG. 1;
FIGS. 3, 4 and 5 are diagrammatic representations of successive
stages in the fabrication process of the transducer and inductance
of FIG. 1; and
FIG. 6 is a sectional view through a portion of the end of the
delay line of FIG. 1 and illustrating the transducer arrangement of
the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring to FIG. 1 of the accompanying drawings, a transducer
arrangement according to the present invention is illustrated on
the circular end surface of an acoustic delay line. The transducer
itself is defined within a diametrically extending strip 11 which
is positioned between two spaced terminals 12 and 13. The terminals
are in the form of segments of a circle and serve to provide
electrical connections to externally of the transducer and delay
line. Terminals 12 and 13 are deposited directly on the delay line
and the surface. A serpentine inductor 14 is also deposited on the
delay line end surface and extends from terminal 12 to the first
transducer in an array 15 of series-connected transducers. The last
transducer in the array is connected to a further serpentine-shaped
inductor 16 which has its other end connected to terminal 13. The
transducers in array 15 and the inductor 16 are also deposited on
the end surface of the delay line.
The particular transducer array 15 illustrated in FIG. 1 includes
42 transducers arranged in seven rows of six transducers each. The
number of transducers utilized in array 15 is by way of example
only and not limiting on the scope of the present invention. The
number of transducers utilized in any embodiment is selected to
permit the total series resistance of all transducers to match the
driving impedance of the generator connected to the delay line. The
electrical equivalent circuit of the arrangement in FIG. 1 is
illustrated schematically in FIG. 2. The impedance of each
transducer in array 15 includes a resistive component R and a
capacitive component C. These components are illustrated with
appropriate subscripts to designate the number of the transducer
with which they are associated. Since the transducers are connected
in series, the resistances R.sub.1 through R.sub.42 are additive
and combine with the resistance R.sub.S to define the total
resistive impedance of the equivalent circuit. Resistance R.sub.S
represents the series resistance of the thin-film metallic layers
and the contact resistance between the various layers and is small
relative to the actual resistive component of the transducers. The
series-connection of the transducers serves to reduce the total
capacitance of the array 15 from the value of a single capacitance
in the array. The effect of the capacitance of the array is tuned
out at the operating frequency by inductors 14 and 16. The reduced
overall capacitance of the array permits inductors 14 and 16 to be
larger and therefore more readily fabricated. Inductance 14 is
illustrated as being variable in FIG. 2 to point up the fact that a
final adjustment in the tuning can be achieved by shorting out
various portions of the serpentine inductance after the transducer
assembly has been completed.
Referring to FIGS. 3 through 6 of the accompanying drawings, the
fabrication steps for the transducer arrangement will now be
described. Referring first to FIGS. 3 and 6, the ground layer
metalization is first deposited on the substrate 20 defined by the
end surface of the delay line. The ground layer metalization
includes the ground layer electrode 21 for each transducer in the
array as well as the inductances 14 and 16 and terminals 11 and 12.
To facilitate the description and understanding herein, inductance
16 and terminals 11 and 12 are not illustrated in FIG. 3; moreover,
the ground layer electrodes 21 of only six transducers are
illustrated in order to prevent undue complexity in the
description. Typically the ground layer metalization is deposited
by evaporation directly on the end surface of the substrate 20. For
purposes of the specific embodiment being described herein, the
ground layer metalization comprises 100 A of chromium and 800 A of
gold. The metalization is evaporated over the entire end surface;
then, utilizing photoresist protection, the ground pattern around
the electrodes, inductors and terminals are selectively etched. It
is to be especially noted that each ground layer electrode 21
includes a finger 22 which projects toward the next electrode 21 in
the array. As will become clearer from the description of FIG. 5
below, it is this finger 22 at which the top layer electrode of one
transducer makes electrical contact with the ground layer electrode
of an adjacent transducer.
Referring now to FIGS. 4 and 6 of the accompanying drawings, the
piezoelectric layer 23 is deposited over electrodes 21. The
piezoelectric material may be zinc oxide, cadmium sulfide, or any
known material possessing piezoelectric properties. Typically the
piezoelectric layer is sputtered over the region containing
electrodes 21 to a thickness of approximately 4000 A. A protective
photoresist coating is then applied and the piezoelectric layer 23
is etched at contact portion 24 in each of the fingers 22. The
piezoelectric film layer 23 thus covers all of each ground layer
electrode 21 except for the small contact portion 24 defined by the
selective etching.
Referring now to FIGS. 5 and 6 of the accompanying drawings, the
top layer metallization is applied. This is done by first coating
the piezoelectric layer 23 with photoresist and then placing a
delineation rejection mask configured to permit the top layer
electrodes to be positioned as desired. The top layer is then
evaporated (typically 100 A chromium, 1000 A gold) and the
photoresist and unwanted metal are then removed. The top layer
electrode 25 for each transducer overlies a portion of the ground
layer electrode 21 of that transducer, this portion being stippled
in the drawing for purposes of identification. In addition each top
layer electrode 25 extends along the piezoelectric layer 23 and
into the contact region 24 of an adjacent transducer. Thus, at one
of of its ends the top layer electrode sandwiches piezoelectric
layer 23 between it and the ground layer electrode 21. At its other
end, top layer electrode 25 makes contact with the ground layer
electrode of the next transducer. Series interconnection between
the transducers is thus permanent and reliable. Connections to and
from the inductors 14 and 16 (not shown) are made in the same
way.
In a typical embodiment, the transducers were each configured in a
0.005 inch square, resulting in slightly greater than 1 ohm
resistance for each transducer in the array. Multiplied by 42, this
resistance is increased to a value of approximately 50 ohms, the
driving impedance of a typical driving generator in a microwave
system. Naturally the size and number of the transducers can be
varied accordingly to effect matching to substantially any
impedance value. In an embodiment constructed a 27 nH series
inductance (inductances 14 and 16) was sufficient to tune out the
overall series capacitance of the transducers.
The structure fabricated as described requires no external matching
components and therefore permits the entire delay line-transducer
package to be fabricated with minimal length. The package is rugged
and the integrated circuit fabrication techniques insure electrical
connections which are highly shock-resistant. The arrangement is
suitable for mass production using standard techniques. The
resulting transducer is insensitive to process variations because a
combination of multiple individual transducers tends to average out
parameter variations which might occur in a single transducer.
Moreover, slight variations in the parameters of individual
transducers result in a stagger tuning effect which broadens the
passband of the overall transducer. That is, slight differences in
the actual frequencies of the transducers combine to provide a
broader band width than is possible with a single transducer.
Moreover, multiple transducers connected in series can withstand
substantially higher applied voltages without electrical breakdown
than is possible with a single transducer.
It should also be noted that the arrangement described herein
permits multiple transducer arrays to be fabricated in a single
manufacturing process.
It will be appreciated that certain specific details described
herein are not to be considered limiting features of the present
invention. For example, the metal utilized in the electrodes may be
varied from that described in the specific example. Moreover the
thickness of each layer may differ from that described. It should
also be pointed out that the configuration of each transducer can
be different to achieve whatever overall effect is desired.
Further, the piezoelectric material utilized may differ from
transducer to transducer.
I wish it to be understood that I do not desire to be limited to
the exact details of construction shown and described, for obvious
modifications can be made by a person skilled in the art.
* * * * *