U.S. patent number 3,878,357 [Application Number 04/779,839] was granted by the patent office on 1975-04-15 for component oven.
This patent grant is currently assigned to Texas Instruments Incorporated. Invention is credited to Leo Marcoux.
United States Patent |
3,878,357 |
Marcoux |
April 15, 1975 |
Component oven
Abstract
Method and means for providing a relatively constant ambient for
temperature sensitive devices is disclosed. The method includes the
steps of forming an enclosure, in which the controlled ambient will
lbe effected, at least partially, of a positive temperature
coefficient of resistance (hereinafter referred to as PTC) material
and applying a voltage to the PTC material. The material acts as a
heater and also as its own temperature regulator. The enclosure is
formed, at least partially, by various structures or means
including a single hollow cylindrical element, a stack of annular
discs and two or more pieces of PTC material. Another embodiment
discloses a design particularly useful with transistor-type devices
while yet another is particularly useful with diode-type devices.
Several materials are disclosed which exhibit a PTC
characteristic.
Inventors: |
Marcoux; Leo (Pawtucket,
RI) |
Assignee: |
Texas Instruments Incorporated
(Dallas, TX)
|
Family
ID: |
31950551 |
Appl.
No.: |
04/779,839 |
Filed: |
November 29, 1968 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
|
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508643 |
Oct 24, 1965 |
|
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435166 |
Feb 25, 1965 |
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Current U.S.
Class: |
219/209;
219/505 |
Current CPC
Class: |
H01C
7/022 (20130101); H05B 3/141 (20130101); H05B
3/0014 (20130101); G05D 23/2401 (20130101) |
Current International
Class: |
H01C
7/02 (20060101); H03H 9/05 (20060101); G05D
23/20 (20060101); H03H 9/08 (20060101); H05B
3/14 (20060101); H05B 3/00 (20060101); G05D
23/24 (20060101); H05b 001/00 () |
Field of
Search: |
;219/209,210,510,505 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Albritton; C. L.
Attorney, Agent or Firm: Levine; Harold Haug; John A.
McAndrews; James P.
Parent Case Text
This is a division of application Ser. No. 508,643, filed Oct. 24,
1965 which in turn is a continuation-in-part of Ser. No. 435,166,
filed Feb. 25, 1965, now abandoned.
Claims
I claim:
1. An electronic assembly with built-in thermal regulation, said
assembly including a thermo-sensitive device having a positive
temperature coefficient and a sharp resistance variation in a
regulation range located on both sides of a critical reference
temperature; said device being shaped as a solid block having a
plane warm face; at least one electronic component mounted on said
plane face and electrically insulated therefrom, and means for
applying electric power to said solid block independently of said
component.
2. An electronic assembly with built-in regulation, said assembly
including a thermo-sensitive device having a positive temperature
coefficient and a sharp resistance variation in a regulation range
located on both sides of a critical reference temperature; said
device being shaped as a substantially solid block having a plane
warm face; at least one electronic component mounted juxtaposed
said plane face and electrically insulated therefrom, and means for
applying the electric power to said solid block independently of
said compound.
3. An electronic assembly with build-in thermal regulation, said
assembly including a thermo-sensitive device having a positive
temperature coefficient and a sharp resistance variation in a
regulation range located on both sides of a critical reference
temperature; said device being shaped as a substantially solid
block having a plane warm face; at least one electronic component
mounted in heat transfer relation to said plane face and
electrically insulated therefrom, and means for applying electric
power to said solid block independently of said component.
4. An electronic assembly with built-in thermal regulation, said
assembly including a thermo-sensitive device having a positive
temperature coefficient and a sharp resistance variation in a
regulation range located on both sides of a critical reference
temperature; said device being shaped as a substantially solid
block having a plane warm face; at least one electric component
mounted on said plane face and electrically insulated therefrom,
and means for applying electric power to said solid block
independently of said component.
Description
This invention relates to heating elements, and particularly to
ovens used to provide a constant temperature for temperature
sensitive devices located therein. There are many electronic
components which must be contained in a constant ambient for
effective operation in certain applications. Examples of such
components are crystals, diodes, transistors and so on.
It is known to provide ovens as described above which utilize a
heater and a thermostat. The thermostat keeps the inside oven
temperature within a certain range by turning on and off the heater
current by use of movable contacts. This type of oven has certain
inherent disadvantages, viz., the temperature varies as a result of
the characteristics of the thermostat--from a maximum to a minimum
back to a maximum and so on. Also, since there is mechanical
movement, the longevity of the device is limited.
Another approach has been what is commonly known as proportional
control whereby relatively complex electrical circuits serve to
limit the power input to the heater to equal the heat loss from the
oven. This is done, for example, by providing a bridge containing a
temperature-sensing device which is used to balance a circuit
containing the heater. This type of control eliminates the on/off
moving contacts and therefore provides more precise temperature
control with no overshoot or thermal cycling, more constant power
requirement and no noise due to mechanical operation although many
devices of this description do emit electrical noise. Also, the
device is relatively complex and expensive.
It is an object of the invention to provide an oven which is
simple, highly reliable, inexpensive, long lasting, of minimal
size, mechanically and electrically silent operating, relatively
insensitive to voltage variations and displays a closely
controlled, relatively constant oven temperature.
It is an object of the invention to provide a heating element which
has a self-regulated temperature.
It is a further object to provide an oven which is characterized by
being of a self-regulating and self-limiting temperature
nature.
It is another object of the invention to provide an oven which will
maintain a relatively constant inside temperature for
temperature-sensitive devices contained therein regardless of
change in heat demand which is simple, reliable, long lasting,
silent operating and has no moving parts.
It is another object of the invention to provide a component oven
which employs solid state control with no moving parts.
The invention accordingly comprises the elements and combinations
of elements, steps and sequence of steps, features of construction
and manipulation and arrangements of parts, all of which will be
exemplified in the structures and methods hereinafter described,
and the scope of the application of which will be indicated in the
following claims.
In the accompanying drawings, in which several of the various
possible embodiments of the invention are illustrated:
FIG. 1 is a vertical partial cross section through one embodiment
of the invention;
FIG. 2 is a cross section along 2--2 of FIG. 1;
FIG. 3 is a schematic wiring diagram of the embodiments of FIGS. 1
and 5;
FIG. 4 is a chart plotting logarithms of resistivity against
temperature of a steep sloped PTC material usable in accordance
with the invention;
FIG. 5 is a vertical partial cross section through a second
embodiment of the invention;
FIG. 6 is a vertical cross section through a third embodiment of
the invention taken on line 6--6 of FIG. 7;
FIG. 7 is a cross section along line 7--7 of FIG. 6 with parts
broken away for clarity;
FIG. 8 is a plan view of a fourth embodiment of the invention with
the cover removed;
FIG. 9 is a vertical cross section taken along line 9--9 of FIG.
8;
FIG. 10 is a vertical cross section taken along line 10--10 of FIG.
8; and
FIGS. 11 and 12 are cross sections of two alternate heating
elements usable in the FIG. 8-10 embodiment.
Similar reference characters indicate corresponding parts
throughout the several views of the drawings.
Dimensions of certain of the parts as shown in the drawings may
have been modified and/or exaggerated for the purpose of clarity of
illustration.
Referring now to FIGS. 1-3, the first embodiment is shown as a
single PTC element oven or chamber 10 which comprises a disc-shaped
base 14 which may be formed of a conventional moldable phenolic
resin or other suitable electrical insulation material, which
mounts a cylindrically-shaped element 18 made of a steep sloped PTC
material such as, for example, Ba.sub.0.997 La.sub.0.003 TiO.sub.3.
The cylinder forms a cavity 11 in which the components are mounted
as explained infra. Layers 20 and 22 of silver or other conductive
material are attached to the ends of cylinder 18 by any known
process such as firing or ultrasonic soldering. This provides a
good electrical connection with the PTC element 18. A metal liner
53 may be placed in the oven cavity 11 which serves to even-out any
temperature gradients. Electrical insulation 51 and 52 are used to
prevent any short circuiting of the heater current. Conductors 30
and 32 connect layer 20 to a quick-disconnect pin 24 and conductor
28 connects layer 22 to quick-disconnect pin 25. Pins 24 and 25 are
mounted in a conventional potting compound 16 which is of an
electrical as well as a heat insulation material conventional in
the art. The insulation 16 will keep heat losses of the oven to a
minimum. The pins 24 and 25 protrude from potting material 16 as
shown in FIG. 1 and are received in mating clips 26 and 27
respectively. The clips 26 and 27 are contained in bores 33 formed
in base 14. A conventional mounting assembly 40 is attached to the
bottom of the base 14 which includes shank 42 formed with key 44
which serves to properly orientate the oven for insertion in a
receiving means (not shown). The mounting assembly 40 mounts pins
1-8. FIG. 3 shows a schematic wiring diagram indicating the
internal electrical connections of pins 1-8. Conductor 34 joins pin
1 to clip 27 and hence the bottom of PTC element 18 via pin 25,
conductor 28 and layer 22. Conductor 35 joins pin 3 to clip 26 and
hence the top of PTC element 18 via pin 24, conductors 30 and 32
and layer 20. The components 50 (crystals, diodes, etc.) which are
to be mounted in the oven cavity 11 are mounted in supports or
sockets 46 and 48 (the number of supports or sockets provided is
optional, two are shown for convenience). Pins 4 and 6 of the
mounting assembly 40 are connected to socket 46 by conductors 36
and 37 respectively. Pins 2 and 8 are connected to socket 48 by
conductors 38 and 39 respectively. Pin 5 is grounded and pin 7 is
not used. Metal cap 12 encloses the oven 10 and is attached to base
14 by any conventional means, such as screws 13.
Heating and regulating current (ac or dc) is applied through the
PTC element 18 from pin 1 to conductors 34, clip 27, pin 25,
conductor 28, layer 22, through PTC element 18, layer 20,
conductors 32 and 30, pin 24, clip 26, conductor 35 to pin 3.
Element 18 acts as a heater and also as its own temperature
regulator. The current passing through the PTC material causes heat
to be generated thereby heating the oven cavity 11. Once the oven
is warmed up, it is noted that very little temperature variation
occurs within the cavity 11 regardless of ambient temperature
fluctuations outside the oven, i.e., changes in heat demand, or
appreciable fluctuations in the applied voltage. A relatively
constant ambient is provided in the oven for the components
contained therein and this is achieved without moving parts and
without any elaborate, comparatively complex circuitry. The
relatively low heat generation of components within the oven has
been found to have a negligible effect in the inside temperature of
the oven.
For the successful operation of the oven within the purview of the
invention, the self-regulating heating element 18 must be
constructed of material having as a characteristic a large positive
temperature coefficient of resistance (PTC); that is, material in
which the percent change in resistance per degree change in
temperature in the so-called break-point range (about 230.degree.F.
on the curve of FIG. 4) is very large as an example 150 percent per
degree centigrade. This break-point range occurs near the Curie or
transition point of the material and is sometimes referred to as
the PTC anomaly.
FIG. 4 shows the resistivity-temperature curve C of such a
material. While I do not wish to be bound by any particular theory
as to why the oven operates as it does, a possible explanation is
as follows: At temperatures above the anomaly near point b on curve
C very little heating occurs since resistivity increases much more
rapidly than temperature at temperatures above the anomaly.
Therefore, heat generation, which is inversely proportional to
resistivity, drops off drastically above the anomaly. Heat
transferred through regions of relatively high temperature such as
portions of element 18 radially removed from the surface 17, is
accordingly low with the result that the temperature gradient is
also low. When the temperature in a region becomes depressed below
the anomaly, section a of curve c, say by a reduction of
temperature along surface 17, the resulting drop in resistivity
causes a greatly increased current flow and attendent rate of heat
generation in that region along the surface and thus a sharply
increased gradient in those adjoining regions that must conduct the
heat away. As the surface temperature is depressed further, the
anomaly temperature moves radially inward toward the longitudinal
cylindrical axis creating regions of high heat generation as it
passes through. Those regions at temperatures above the anomaly
continue to generate heat at approximately the same low rate and
thus their temperatures are hardly affected by such change in
surface temperature.
In the embodiment of FIG. 1, the greater part of the heat flow is
perpendicular to the current flow. The heat flows radially in
element 18 while the current flows axially. If the outside
temperature decreases, i.e., heat demand is increased, thereby
reducing temperature of the outer surface 17, the resistivity of
that same area will also be reduced. This will cause an increase in
current at the surface 17, however, currents throughout the main
body of the element 18 will remain fairly constant. Heat generation
at the surface will increase, this will tend to offset the
temperature reduction induced by increased heat demand. Hence, the
element will generate heat at the surface 17 where it is most
useful.
The oven inherently operates in the range which includes the
anomaly point, this is approximately 230.degree.F. on the curve
shown in FIG. 4. The material, which temperature-resistivity curve
is shown, is lanthanum doped barium titanate, the preparation of
which is described infra. Ordinarily, the barium titanate family of
ceramics has an electrical resistivity of a magnitude greater than
10.sup.12 ohm cm, however proper doping can reduce the resistivity
to less than 10.sup.2 ohm cm. Lanthanum doping of barium titanate
produces an exceptionally steep slope of the
resistivity-temperature curve at temperatures above the anomaly
point combined with a relatively low base resistivity at
temperatures below the anomaly point. Other doping elements may be
used to modify the anomaly temperature, the base resistivity and
the rate of change of resistivity with temperature above the
anomaly temperature.
As an example, one self-regulating heater element 18 was made using
Ba.sub.0.997 La.sub.0.003 TiO.sub.3 as follows.
The raw materials used were reagent grades of barium carbonate
(BaCO.sub.3), lanthanum carbonate La.sub.2 (CO.sub.3).sub.3 :
5H.sub.2 O and titanium dioxide (TiO.sub.2). These were weighed out
to an accuracy of about .+-. 0.25 percent to form stoichiometric
mixtures, plus 0.1 mole percent excess TiO.sub.2 in order to assure
the formation of a liquid phase during final firing. These
materials were mixed and a sufficient amount of distilled water was
added to form a 20 percent solid mixture by weight. This mixture
was ball milled and dried. The dried product was powdered and
calcined in order to convert the material into the desired doped
compound (Ba.sub.0.997 La.sub.0.003 TiO.sub.3) by firing at
approximately 1100.degree.C. in air and cooled. The material, in
the form of a porous cake, similar in texture and appearance to
soft blackboard chalk, was broken up and wet milled as above, dried
comminuted and sieved from .+-. 40 to --270 (U.S. standard Sieves).
The resulting powder was again immediately dried to drive off any
moisture which might have been absorbed during comminution and
sieving and finally pressed into the desired cylindrical shape
using conventional closed die ceramic-pressing techniques on a
hydraulic press. The resulting compacted powder body was fired to
the ceramic state at about 1500.degree.C. Further details regarding
the preparation of similar PTC material may be found in copending
application, filed Apr. 13, 1964, Ser. No. 359,370, assigned to the
assignee of the instant invention.
Any material which displays a relatively steep positive sloped
resistivity-temperature curve can be used as the heat
generating-self regulating element in accordance with the present
invention such as the carbon black filled cross-linked polyethylene
disclosed in copending applications of Francis Buiting and Joseph
Waseleski, Jr., Ser. No. 472,108, filed July 15, 1965, and assigned
to the assignee of this invention.
FIG. 5 shows another embodiment of the invention. It is important
to achieve a homogeneous heater element of constant density so that
the resistivity is consistent, i.e., internal cracks or
non-conducting inclusions must be avoided. The oven in FIG. 5 lends
itselve to the achievement of such uniformity by employing a
stacked disc configuration. The only difference between oven 10 of
FIG. 1 and oven 100 of FIG. 5 is the form of the PTC
heater-regulator element and electrical connection thereof. The
description of the remainder of the device will, therefore, not be
repeated.
The heater-self regulator assembly 118 is composed of a plurality
of annular discs 106, the number of which is a matter of choice but
shown in FIG. 5 as eight, are sandwiched between discs 102 and 104.
These discs are made of PTC material having the same characteristic
of a steep-positive slope resistivity-temperature curve at
temperatures above the anomaly point as that material used in
cylinder 18. A conductive layer is attached by conventional means
to the faces of each of these discs, the layers shown in FIG. 5
numbered from 107-112. The even-numbered layers 108-110 are
electrically connected to conductor 131 by conductors 120.
Conductor 131 is connected to pin 125. Layer 112 is electrically
connected to pin 125 by conductor 122. Odd-numbered layers 107-109
are connected to conductor 130 by conductor 121. Conductor 130 is
electrically connected to quick-disconnect pin 124. Bottom layer
111 is connected to clip 126 by conductor 123. It may be seen that
this provides a stack of discs, electrically connected in parallel
and that the greater part of the heat flow is radial and therefore
perpendicular to the current flow. This will provide even better
temperature control than element 18 because it will minimize the
effects of any localized areas of non-uniform density and hence
will make resistivity more consistent throughout the stacked
assembly 118.
Bottom disc 104 is provided with bores 115 to provide space for
conductors 136, 137 and 138, 139 which lead to sockets 146, 148
respectively. Cavity 150 may be provided in base 140, if desired,
to give still more room for the conductors. Conductors 134 and 135
connect clips 127 and 126 to pins 1 and 3 to complete the
electrical connections in the same manner as described supra in
reference to conductors 34, 35 in FIG. 1.
Instead of employing conductive layer metal tabs may be inserted
between the PTC discs to provide the electrical connections
therefore. It should be noted that separate voltage sources could
be supplied to the several discs of equal or varying magnitude to
provide a desired axial temperature gradient if desired.
In FIGS. 6 and 7 is shown an oven 200 which is particularly useful
with transistors. Transistor 202 is shown with three leads 203, 204
and 205, although it is obvious that any number of leads would come
within the purview of this invention. Transistor 202 is
telescopically received in mounting can 210. Can 210 is formed with
an annular flange 212 of a good thermal conductor such as aluminum.
An electrical insulation layer is provided on the outer surface of
can 210. Although this may be done in various ways, such as by
coating with a thermoplastic resin, heat conduction should be kept
at an optimum level. Employing anodized aluminum meets the above
requirements. Flange 212 of can 210 abutts shoulder 222 formed in
tubular casing member 220 of a thermally and electrically
insulating material, such as a thermoplastic (e.g. Nylon). End 225
of casing 220 has an annular flange 226 in which are formed slots
224. Transistor leads 203, 204 and 205 are located in slots 224 and
are retained therein by shoulders 228. These slots are shown to be
rectangular in shape but could be any other convenient shape, such
as eliptical. The PTC heater regulator element 230 is ring-shaped
and fits closely around can 210. Layers 232 and 234 of silver or
other conductive material serve as terminal surfaces on opposite
faces of element 230. Leads 236 and 238 are electrically connected
as by soldering, to layers 232, 234 respectively. The leads, as
shown, contact the layers throughout approximately 360.degree.
thereby insuring uniform electrical conductivity through element
230. Electrically and thermally insulating potting compound 240 of
a conventional type is infilled around element 230. Shoulder 244 is
formed in end portion 225 of casing 220 which seats disc 242,
formed of an electrical insulating material such as a resin
impregnated fiberboard. Disc 242 is provided with slots 246 to
provide access for PTC heater leads 236 and 238. Shoulder 244 is
positioned to provide a predetermined air gap 250 between disc 242
and can 210 and potting material 240 thereby resulting in a desired
thermal insulation. Instead of relying on air gap 250, some other
thermal insulation could be used.
A cover member 260 is positioned closely around casing 220 and can
be formed of the same electrically, thermally insulating material
as the casing, i.e., Nylon. Cover 260 is provided with projection
262 which serves as a component wedge to maintain transistor 202
firmly in mounting can 210. Annular projection or wedge 264 in
cover 260 contact leads 203, 204 and 205 biasing them against hub
221 of casing 220. This construction serves to minimize heat loss
through leads 203, 204 and 205. That is, it decreases the effective
size of the heat sink of the transistor leads. The transistor 202
is in close thermal relation to heater 230 resulting in more
efficient control. It has been found useful to apply a coating of a
heater transfer compound to the outer periphery of mounting can
210, such as a silicon compound. This facilitates heat conductance
from the PTC element 230 through mounting can 210 to transistor
202. One such compound available is GE G641 INSULGREASE. A coating
of this heat transfer compound may also be applied to the outer
periphery of transistor 202, further facilitating heat conductance
from the PTC heater.
It will be noted that in this embodiment and in the ones described
infra the component is in intimate thermal contact with the PTC
heater-regulator element.
Oven 300, which is particularly useful for diodes and the like, is
shown in FIGS. 8-10. A diode 310 is shown positioned in oven 300
and has two leads 311 and 312 which extend therefrom through the
walls of the oven. Oven 300 comprises a hollow tubular-shaped PTC
heater element 320. Element 320 as shown is octagonal in cross
section, although it is obvious that the number of faces provided
is a matter of choice, providing rectangular faces 322, 324, 326,
328, 330, 332, 334 and 336. Layers 323, 327, 331 and 335 of silver
or other conductive material are attached in a conventional manner
to faces 322, 326, 330 and 334 respectively. Thus, alternate faces
are electrically conductive. Ribs 338 are provided in casing 340
and serve to center PTC element by contacting the non-electrical
conducting faces 324, 328, 332 and 336. Casing 340 is generally
cylindrical in shape and composed of an electrically and thermally
insulating material such as a thermoplastic resin. An aperture 342
is provided in bottom wall 344 of the casing to permit passage of
lead 311. Diode seating member 350 is telescopically received in
the bore of PTC element 320 and fits closely therein. Member 350 is
constructed of a good thermally conducting but electrically
insulating material, such as anodized aluminum. Before inserting
diode 310 in seating member 350 a coating of heat transfer compound
may be applied to the outer periphery of diode 310 and member 350.
As explained supra, this serves to facilitate heat conductance from
the PTC heater element 320 through setting member 350 to the diode
310 and avoids hot spots and the like. An electrically insulating
washer 352 overlies the outer end of PTC element 320 and also
retains member 350 within casing 340. Terminal members 354 and 356
are welded to leads 358 and 360 as best seen in FIG. 9 and are
separated by electrically insulating terminal separator 362.
Terminal member 354 is provided with two downwardly depending
fingers 364, 366 which are in good electrical contact as by
soldering with layers 327 and 335 respectively, as best seen in
FIG. 10. Terminal member 356 is provided with downwardly depending
fingers 368 and 370 which are in good electrical contact as by
soldering with layers 323 and 331 respectively.
The terminal members and associated washers are covered by cap 372
which is provided with slots 374 in which leads 358, 360 are
located and aperture 376 through which diode lead 312 extends. Cap
372 is also constructed of electrically and thermally insulating
material, e.g. Nylon, and is provided with an annular rib 378 which
is received in a mating groove 346 in casing 340.
FIGS. 11 and 12 are cross sections of two other PTC heating
elements which can be used in place of element 320.
Referring first to FIG. 11, PTC element 380 is composed of two
halves 381, 382. Electrically conductive layers 383 and 384 are
attached in a conventional manner to opposite faces of half 381
while layers 385 and 386 are attached to opposite faces of half
382. Lead 358 is electrically connected to layers 383 and 386 while
lead 360 is electrically connected to layers 384, 385. It will be
seen that current will pass from the outer layers 383, 386 through
the PTC halves 381, 382 to layers 384, 385 thereby causing the
element 380 to generate heat in accordance with the present
invention.
FIG. 12 shows another PTC heater assembly 387 useful in the diode
oven of FIGS. 8-10. Assembly 387 is composed of a plurality of PTC
slabs 388 enclosed by electrically and thermally insulating member
391. The PTC slabs 388 have outer electrically conductive layers
392 and inner electrically conductive layers 393 conventionally
attached respectively thereto. Diode seating member 394 retains the
slabs in place and is constructed of material which is thermally
conductive but electrically insulating, similar to member 350, e.g.
anodized aluminum. A silicone heat transfer compound may be applied
to the outer surfaces of element 394 to enhance the thermal
conductivity from the heating PTC slabs 388. Lead 358 is
electrically attached to outer layers 392 and lead 360 is
electrically attached to inner layers 393 to effect a passage of
current from the outer layers 392 to the inner layers 393.
It will thus be seen that the embodiments of the present invention
offer numerous advantages over the prior art. Among them are for
example low cost; minimal size; solid state control with no moving
parts; self-regulation using no moving contacts, sensing circuits,
amplification circuits, etc.; extreme simplicity; and ease of
fabrication.
In view of the above, it will be seen that the several objects of
the invention are achieved and other advantageous results
attained.
As various changes could be made in the above constructions and
methods without departing from the scope of the invention, it is
intended that all matter contained in the above description or
shown in the accompanying drawing shall be interpreted as
illustrative and not in a limiting sense. Also, it is to be
understood that the phraseology or terminology employed herein is
for the purpose of description and not of limitation.
* * * * *