U.S. patent number 3,853,091 [Application Number 05/421,020] was granted by the patent office on 1974-12-10 for thin film coating apparatus.
This patent grant is currently assigned to International Business Machines Corporation. Invention is credited to Richard G. Christensen, Richard Wahl.
United States Patent |
3,853,091 |
Christensen , et
al. |
December 10, 1974 |
THIN FILM COATING APPARATUS
Abstract
In vacuum deposition apparatus a horizontally disposed rotatable
platform supports and orbits a plurality of trays about the axis of
rotation. Each tray is rotatable about its own axis and supports a
plurality of wafer holder and orbits said holders about the tray
axis of rotation. Means rotate each holder about its own axis. The
platform, trays and holders are arranged in a generally common
plane.
Inventors: |
Christensen; Richard G.
(Poughquag, NY), Wahl; Richard (Fishkill, NY) |
Assignee: |
International Business Machines
Corporation (Armonk, NY)
|
Family
ID: |
23668864 |
Appl.
No.: |
05/421,020 |
Filed: |
December 3, 1973 |
Current U.S.
Class: |
118/720; 118/53;
118/725; 118/730; 269/57 |
Current CPC
Class: |
C23C
14/505 (20130101) |
Current International
Class: |
C23C
14/50 (20060101); C23c 013/08 () |
Field of
Search: |
;118/48-49.5,53
;117/107.1 ;269/57 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Kaplan; Morris
Attorney, Agent or Firm: Dick; William J.
Claims
What is claimed is:
1. In an apparatus for providing multiple rotation of a plurality
of semiconductor wafers about three parallel axes, said apparatus
comprising: a rotatable platform; a rotatably mounted plurality of
trays spaced about and mounted on said platform and in the same
plane as said platform; each tray including a plurality of
rotatably mounted semiconductor wafer holders; said wafer holders
comprising a cup, an inwardly projecting lip extending about the
periphery of said cup, and wafer retaining means on said lip for
receiving a wafer therein and holding said wafer against said lip;
said retaining means comprising a clip including a radially
projecting tang, resilient means connected to said tang, and means
actuable interiorally of said cup for biasing said tank to maintain
said tang in firm engagement with a wafer held on said lip; a
plurality of source material holders radially spaced about an axis
perpendicular to said platform and spaced axially therefrom; and
means to effect rotation of said platform, said trays and said
holders in the same plane wherein said wafers pass through several
angles with respect to said sources.
2. In an apparatus in accordance with claim 1, including means to
adjustably position the axial distance between said platform and
said source material holders.
3. In an apparatus in accordance with claim 1 wherein said platform
is in a substantially horizontal plane.
4. In an apparatus in accordance with claim 3 including heating
means adjacent said platform on the side thereof opposite the side
exposed to said source material holders, to heat said semiconductor
wafers.
5. In an apparatus in accordance with claim 1 including a focal
plane shutter assembly intermediate said source holders and said
wafer holders, said shutter assembly being movable between a first
position wherein said source holders are shielded from said wafer
holders and a second position wherein a line of sight is provided
between said wafer holders and said source holders.
6. In an apparatus in accordance with claim 1 including heating
means disposed on the side opposite said platform to said source
holders, to heat said wafers held by said wafer holders.
7. Apparatus in accordance with claim 1 including a removable disk
of heat conductive material, said disk being dimensioned to be
retained within said cup, and against said lip.
8. In an apparatus in accordance with claim 7 including a plurality
of teeth on the rim of said cup, and sprocket means mounted on said
tray for engaging the teeth on said rim of said cup.
9. Apparatus for providing multiple rotation of a plurality of thin
workpieces in a common plane, said apparatus comprising: a housing;
a rotatably mounted platform in said housing, a plurality of trays
spaced about and mounted on said platform and for rotation with
respect thereto; a plurality of workpiece holders rotatably mounted
in each of said trays, said wafer holders comprising a cup,
inwardly projecting lip extending about the periphery of said cup,
and wafer retaining means on said lip for receiving a wafer therein
and holding said wafer against said lip; said retaining means
comprising a clip including a radially projecting tang, resilient
means connected to said tang, and means actuable interiorally of
said cup for biasing said tang to maintain said tang in firm
engagement with a wafer held on said lip; a plurality of source
material holders spaced from said platform and in a plane
substantially parallel to said platform; means to provide a source
of heat to said workpiece holders, said means being positioned on
the opposite side of said platform as said source material holders;
and shutter means operative to shield, as desired, said source
material holders from said wafer holders; and means to effect
rotation of said platform, said trays and said holders in the same
plane whereby wafers held by said holders pass through several
angles with respect to said sources.
10. Apparatus for providing a deposition of material on a workpiece
and for providing multiple rotation of a plurality of workpieces
about three parallel axes, said apparatus comprising: a rotatable
platform; a rotatably mounted plurality of trays spaced about and
mounted on said platform and in the same plane as said platform;
each tray including a plurality of rotatably mounted workpiece
holders, said wafer holders comprising a cup, an inwardly
projecting lip extending about the periphery of said cup, and wafer
retaining means on said lip for receiving a wafer therein and
holding said wafer against said lip; said retaining means
comprising a clip including a radially projecting tang, resilient
means connected to said tang, and means actuable interiorally of
said cup for biasing said tang to maintain said tang in firm
engagement with a wafer held on said lip; at least one source
material holder spaced from said workpiece holders and having an
axis substantially perpendicular to the plane of said platform; and
means to effect rotation of said platform, said trays and said
holders in the same plane wherein said wafers pass through several
angles with respect to said source holder.
11. Apparatus in accordance with claim 10 including means for
altering the distance between said source holder and said
platform.
12. Apparatus in accordance with claim 11 including means for
raising and lowering said platform.
13. Apparatus in accordance with claim 10 including a plurality of
source material holders radially spaced about an axis perpendicular
to said platform.
14. Apparatus in accordance with claim 10 wherein said platform is
positioned in a horizontal plane, and heating means substantially
parallel to said platform and positioned on the side opposite said
platform as said source holders.
Description
SUMMARY OF THE INVENTION AND STATE OF THE PRIOR ART
The present invention relates to apparatus for coating a plurality
of thin wafer-like objects, and more particularly relates to
evaporation apparatus for assuring uniform coating of irregular
surfaces of a semiconductor wafer by providing, in conjunction with
complex motion, a single plane of rotation of the wafer in
conjunction with a plurality of material sources, or a single
material source depending upon the nature of the product.
The idea of attempting to assure uniform coating of irregular
surfaces of objects during a coating operation, wherein the objects
are semiconductor wafers, by providing for complex motion of the
wafer is clearly taught in the prior art. For example, U.S. Pat.
No. 3,598,083 to Dort illustrates thin film coating apparatus
having 3.degree. of freedom or rotation wherein the central axis of
the substrates of objects being coated is oblique to the axis of
the source material crucible. While such apparatus does coat
relatively uniformly as compared with a single rotation, dome
shaped cage or double rotation dome shaped holders, it has been
found that it is difficult if not impossible to achieve uniformity
of coating in certain topographies having depressions to be coated
where the depression includes an undercut and it is required that
the coating layer extend uniformly from the upper surface of the
wafer, covering the undercut and the bottomm of the depression.
Alternatively, it has been found that where only the bottom of such
a depression is desired to be covered so that a surface covering
may be removed without removal of the covering on the bottom of the
depression (due to adherence to the covering material on the side
walls of a depression), such single plane multiple rotation is
highly desirable and a uniform coverage of the desired surfaces may
be obtained with a central source and a long distance between the
source and the object to be coated.
In view of the above, it is the principal object of the present
invention to provide apparatus which will more uniformly coat
irregular surfaces of a thin member such as a semiconductor
wafer.
Another object of the present invention is to provide a complex
motion apparatus in which the rotation of the wafer or object to be
coated occurs about three axes which are substantially parallel to
one another and to the axis of at least one crucible.
Yet another object of the present invention is to provide thin film
coating appratus including, in one embodiment, a plurality of
source material holders with means to effectively and rapidly
shield the holders from the wafers being coated.
Still another object of the present invention is to provide means
for uniformly heating the wafers to be coated from the back sides
thereof to aid the coating material in adherence to the irregular
surface of the wafers.
Still another object of the present invention is to provide in an
evaporator, means to adjust the distance between the source
material and the wafer holder.
Other objects and a more complete understanding of the invention
may be had by referring to the following specification and claims
taken in conjunction with the accompanying drawings in which:
Fig. 1 is a fragmentary perspective view of apparatus constructed
in accordance with the present invention;
FIG. 2 is an enlarged fragmentary sectional view (foreshortened) of
the apparatus illustrated in FIG. 1;
FIG. 3 is an enlarged fragmentary plan view taken along line 3--3
of FIG. 2;
FIG. 4 is an enlarged fragmentary plan view of a portion of the
apparatus illustrated in FIG. 3; and
FIG. 5 is a fragmentary sectional view taken along line 5--5 of
FIG. 4.
Referring now to the drawing, and especially FIG. 1 thereof,
apparatus 10 used for depositing thin films of material on thin
objects or workpieces such as semiconductor wafers, is illustrated
therein. As shown, the apparatus includes a conventional coating
chamber or vacuum envelope 11 housing apparatus 12 constructed in
accordance with the present invention. The envelope 11, as is
conventional, is connected to a source of vacuum (not shown) to
evacuate the chamber in accordance with customary or usual
practice.
The apparatus 12 is mounted on a base 13, and comprises a rotatable
platform 15 (in the preferred embodiment horizontally disposed)
including a plurality of rotatably mounted trays 25 spaced about
and mounted on the platform and in the same plane thereof. Each of
the trays 25 includes a plurality of rotatably mounted object of
wafer holders 35, in the illustrated instance semiconductor wafers,
and includes means, hereinafter described, for retaining the wafer
with one surface exposed downwardly. Underlying the platform 15 is
a material source holder or crucible, in the illustrated instance
three such holder cups 45, 46, and 47 which are radially spaced
about an axis perpendicular to the platform 15 while being spaced
axially therefrom. Drive means 55 (see FIG. 2) serve to effect
rotation of the platform 15, the trays 25 and the holders 35 in the
same plane wherein the wafers pass through several angles with
respect to the source holders or the axes thereof. Overlying the
platform 15 is heater means 75 positioned adjacent the platform and
substantially parallel thereto for heating the backside of the
workpieces.
In order to support the platform 15 for driving rotation about the
central axis thereof, a plurality of adjustable, telescopically
engagable stanchions 16 are spaced about the platform and mounted,
as by a retaining block 16A on a drive ring 18. At their extended
or upper end the stanchions are connected to a platform ring 23
which extends about the periphery of the platform 15. The
stanchions 16 are made adjustable in a conventional manner as by
pins 16B and apertures 16C so that the height of the platform may
be adjusted relative to the source holder cups, depending upon the
operation to be performed.
In order to impart driving motion to the drive ring 18, the drive
means 55 is frictionally engaged to the ring and effects rotation
thereof about the central axis of the apparatus, i.e.,
substantially perpendicular to the plane of the platform 15. To
this end, and referring to FIG. 2, a shaft 56 is connected to the
frustoconical, smooth surfaced drive member 57 which mates with a
complementary angled surface 58 on the internal periphery of the
drive ring 18. As shown, the shaft 56 contains suitable thrust
bearings as at 59 to support the structure, there being similar
frustoconical smooth surface drive idlers 60 spaced 120.degree.
apart from the main drive which serve to support the drive ring 18.
As illustrated, the idlers 60 are suitably mounted for rotation on
pedestal mounts 61 which are connected to the base 13.
The trays 25 are mounted for rotation in or on the platform 15, the
platform and trays serving as a shield, in a manner which will be
more fully explained hereinafter, and separate the source material
from the heaters 75 mounted on the backside of the platform 15. To
this end, the platform 15 comprises a plurality of segments 19,
each segment containing a tray 25 and including radially extending
expansion joints 20 with overlapping lip termini 21 which serve to
shield the heaters 75 from the source material, while allowing for
expansion and contraction of the metal segments 19. The expansion
joints 20 are connected to braces 22 to the platform ring 23. The
trays 25, in turn, are suspended in a cutout 26 in the segment 19
as by a cantilever arm 27, one end of which is connected to the
platform ring 23, and the other end of which includes a bushing 28
and shaft 29, the lower end of the shaft 29 being rigidly secured
to the tray 25, while the upper end of the shaft is coupled to a
driver sprocket 30. An enlarged gear or sprocket 31 is mounted
intermediate the bushing 28 and the tray, and connected to the
shaft 29 for rotation therewith. A drive sprocket 32 is connected
to a shaft 33 which passes through the platform ring 23, the drive
sprocket 32 being connected to the driven sprocket 30, and thus the
shaft 29 as by a drive belt 34.
In order to impart motion to the trays 25, the shafts 33 are
connected as through universal joints 34' to adjustable length
drive shafts 62 (see FIG. 2). A second universal joint 63 connects
the drive shaft 62 to a stub shaft 64 which is mounted for rotation
as by a bearing 65 in the drive ring 18. As shown best in FIG. 2,
the stub shaft 64 is connected, at its lower terminal end, to a
gear 66 which mates with an internally toothed ring gear 67 rigidly
secured as by posts 68 to the base 13. Thus as the drive ring 18 is
rotated, the idler gear 66 are forced into rotation by the
stationary teeth of the ring gear 67, thereby affecting rotation of
the drive shafts 62 and causing the trays 25 in the platform to
rotate.
In order to provide further rotation of a wafer, means are provided
to effect rotation of the wafer holders, the wafer holders 35 being
adapted to retain a wafer in a position where a major surface
thereof faces the crucibles or source material holders 45, 46 and
47. To this end, and referring now to FIGS. 3, 4, and 5, the wafer
holders 35 comprise a cup having an inwardly projecting
circumferentially extending lip portion 36 on the lower portion
thereof, and wafer retaining means 37 for retaining a wafer or
workpiece 40 on the lower side of the cup, against the lip so as to
expose the surface 40A of the wafer to the source material. The
wafer retaining means 37 includes a plurality of clip-like
retainers 37A, 37B, and 37C, each of which includes a tang 38 which
is bent inwardly to overlie the lip 36 of the cup and to capture
the wafer 40 and press the wafer against the lip 36. The tang 38 of
the clip extends through the peripheral lip 36 of the cup into the
interior of the cup where it terminates in an enlarged spade-like
section 38A. A spring retainer 39, associated with each of the
clips serves to bias the enlarged spade-like section 38 against the
wall of the cup thereby forcing the tang section against the
periphery of the wafer like workpiece 40. In this manner, when it
is desired to remove a wafer from the lip, the spade-like section
38A may be biased away from the wall by a simple purging
action.
In order to provide uniform heating of the workpiece by the heater
75 which is superimposed of the platform 15, a removable disk 41 of
heat conductive material is provided intermediate the wafer and the
heater. The disk 41 is dimensioned to rest in the cup 35 against
the inner surface of the lip 36 in close proximity to the wafer
like workpiece 40. In the preferred embodiment, it has been found
that a material such as copper obtains a uniform heat relatively
quickly and therefore is a relatively inexpensive and yet excellent
medium for heat transmission to insure such uniformity of heating
of the semiconductor wafer.
In order to drive the cup, so that it rotates not only with the
tray 25 but also about its own central axis, the rim of the cup 35
is provided with a plurality of teeth 42 which mesh with the teeth
of the sprocket or gear 31 so that upon rotation of the sprocket,
the teeth 42 of the cups in engagement with the sprocket effect
rotation of the cups. As shown, the cups may be nested in a
plurality of shouldered cutouts 42' in the tray 25 and held in
position to ensure rotation of the cups as by stub posts 43
projecting upwardly from the tray and engaging the wall of the
holders. The shouldered cutouts also serve to prevent the source
material from impinging on the heater 75.
In circumstances where it is desirable to obtain maximum coverage
and uniform distribution not only of the surface of the wafer, but
of any undercuts in recesses in the surface of the wafer, it is
desirable that a multiplicity of sources such as the sources 45, 46
and 47, which are radially spaced from the central axis of the
platform while being axially spaced therefrom, are provided. As
shown best in FIG. 1, the source material holders or crucibles
45-47 are each mounted on a separate post 48 with a common
conductive plate 49, joining in the illustrated instance, carbon
electrodes 50 and 51. Insulators 52 through which suitable wiring
may pass join the common plate 49 to the carbon electrodes which
serves to heat the source material in the cricibles, located inside
of the shields 45A, etc. It should be recognized, however, that the
source material may be heated in any conventional manner as by low
or high frequency induction heating or even E beam heating
depending upon the source material. Thus the resistance heating
scheme illustrated is not critical to the operation of the
apparatus as above described.
In accordance with one feature of the invention, means are provided
to shade and expose the wafers from and to the source holding cups
so that the wafers are exposed to the source material when desired.
To this end and referring now to FIGS. 1 and 2, a focal plane
shutter assembly 80 is positioned intermediate the source holders
and the wafer holders, the shutter assembly being movable between a
first position, wherein the source holders are shielded from the
wafer holders, and a second position wherein a line of sight is
provided between the waafer holders and the source holders. As
illustrated, the shutter assembly comprises a plurality of plates,
in the present instance three designated 81, 82 and 83 for purposes
of identification, the plates being generally arcuate in form and
supported from a center shaft 87 as by radially extending arms 85
which are connected to a hub 86. A central shaft 87, connected to
the hub, extends through a sleeve bearing and the like 88 which is
mounted on a brace or support 89 suitably connected as by arms 90
to upstanding pillow blocks 91 which are mounted on the base 13. In
order to rotate the shutter assembly between its first position
wherein the source holders are shielded from the wafer holders and
a second position where a line of sight is provided between the
wafer holders and the source holders, the center shaft 87 is
connected through the brace or support 89 to a drive plate 92, the
drive plate having a plurality of pins or projections 93 depending
therefrom which are engagable by a pawl 94 operatively connected as
through an arm 95 to an actuator shaft 96. As desired, the pawl may
be energized through the shaft 96 by either air or electric
solenoid control causing engagement of the pawl against the pins
and therefore rotation of the drive plate 92.
In instances where the maximum edge coverage is desired of
depressions in the workpiece, the maximum angle of the source
material with respect to the rotating wafers is when the platform
15 lies closely adjacent the source holders 45, 46 and 47 thereby
assuring maximum exposure of any undercuts in the surface of the
wafer of the boiling source material. However, in instances where
the operation to be performed is one utilizing, for example, a lift
off process, that is where only surface coverage of the depression
or of the exposed surface is to be covered so that a peeling
operation may take place and the metal or other material deposited
from the source holder is in the bottom of the recess or depression
in the semiconductor wafer, it is desirable to have the platform 15
spaced farther from the source holder or holders. To this end, the
stanchions 16 as well as the drive 62, inasmuch as they are
adjustable, may be positioned so as to space the wafer holders in a
remote position with regard to the source material holders.
Additionally, if minimum vertical wall (relative to the depressions
or recesses in the wafer) coverage is desired, a central source
material holder may be employed, and a more conventional type
centrally located shutter assembly may be employed.
Although the invention has been described with a certain degree of
particularity, it is understood that the present disclosure has
been made only by way of example and that numerous changes in the
details of construction and the combination and arrangement of
parts and the mode of operation may be made without departing from
the spirit and the scope of the invention as hereinafter
claimed.
* * * * *