U.S. patent number 3,841,028 [Application Number 05/283,582] was granted by the patent office on 1974-10-15 for apparatus for handling workpieces to be polished.
This patent grant is currently assigned to Crane Packing Company. Invention is credited to Ernest F. Katzke.
United States Patent |
3,841,028 |
Katzke |
October 15, 1974 |
APPARATUS FOR HANDLING WORKPIECES TO BE POLISHED
Abstract
Disclosed is an apparatus for handling workpieces to be polished
on a rotatable disc type of polishing machine and comprising a
workholder mounted on an arm oscillatable in a vertical plane
through substantially 180.degree. so that in one position the
workholder is inverted to facilitate loading and unloading thereof,
and in another position the workholder supports the workpieces by
differential pressure thereon over the polishing disc. The movement
of the arm may be arrested as the workpieces touch the polishing
disc, and an air cylinder on the arm moves the workholder against
the disc and presses the workholder against the disc with a higher
pressure than is permissible with wax-adhered workpieces. At the
termination of the polishing operation the workholder is raised
from the polishing disc and the arm is rotated to invert the
workholder, after which a cleaning spray is automatically applied
to the workpieces.
Inventors: |
Katzke; Ernest F. (Des Plaines,
IL) |
Assignee: |
Crane Packing Company (Morton
Grove, IL)
|
Family
ID: |
23086716 |
Appl.
No.: |
05/283,582 |
Filed: |
August 24, 1972 |
Current U.S.
Class: |
451/339; 451/388;
D15/122 |
Current CPC
Class: |
B24B
41/06 (20130101); B24B 37/345 (20130101) |
Current International
Class: |
B24B
41/06 (20060101); B24B 37/04 (20060101); B24b
007/22 () |
Field of
Search: |
;51/129,131,235,125.5,125 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Whitehead; Harold D.
Attorney, Agent or Firm: Voytech; Charles F.
Claims
I claim:
1. Apparatus for applying workpieces to and removing them from a
substantially horizontally operating abrading tool, said apparatus
comprising a platen, means for mounting the workpieces on said
platen for a movement therewith, an arm having a horizontally
disposed pivot located to one side of the tool, means for
oscillating said arm about its pivot through substantially
180.degree., means for mounting the platen on the arm to cause said
platen at one extreme position of the arm to assume an inverted
position to permit loading of the workpieces thereon and at the
other extreme position to be located over said abrading tool with
the workpieces adjacent said tool, said platen mounting means
comprising means for advancing said platen toward said tool
independently of said arm oscillating means and independently of
said workpiece mounting means, and fluid pressure means for holding
said workpieces against said tool with a predetermined pressure
while said tool is abrading said workpieces.
2. Apparatus as defined in claim 1, and means, automatically
operable upon said arm reaching its extreme position opposite said
first-mentioned extreme position, for spraying said articles with a
cleaning fluid.
3. Apparatus as defined in claim 2, said means for supporting said
workpieces comprising a platen having a plurality of stations
thereon one for each workpiece, means at each station for applying
sub-atmospheric pressure to the workpiece to hold said workpiece on
the platen, manually operable means for controlling the application
of subatmospheric pressure and means controlled by movement of the
platen for controlling the application of the cleaning liquid.
4. Apparatus as defined in claim 1, and comprising further means
operated in timed relation to the position of the portion of said
arm over the tool for initiating the operation of the means for
advancing said workpiece-supporting means toward said tool.
5. Apparatus as defined in claim 2, said means automatically
operable upon said arm reaching its extreme position opposite said
first-mentioned extreme position for spraying said articles with a
cleaning fluid comprising an air-operated valve, a source of air
under pressure, a solenoid-operated valve for controlling
application of air under pressure from said source to said
air-operated valve, and a switch operated by said platen for
energizing said solenoid-operated valve.
6. Apparatus as described in claim 1, said tool comprising a
polishing disc, and means for driving said disc about a vertical
axis, said workpieces comprising discs of a thickness varying from
0.005 inch to 0.015 inch, and pressure-differential operated means
on said workpiece supporting means and comprising the sole means
for holding said workpieces on the workpiece supporting means, said
workpieces being of a material characterized by increased abrading
action by the tool as the temperature of the material increases,
and said predetermined pressure increasing the friction between the
workpiece and tool thereby increasing the temperature of the
workpieces above the melting point of wax to increase the abrading
action of the tool thereon.
Description
This invention relates to abrading machines such as lapping and
polishing machines and particularly to a means for handling
workpieces of a thin disc-like shape to be abraded by said
machine.
An important component used in the electronic art is the silicon
wafer. This wafer varies from 0.005 inch to 0.015 inch thick and is
disc-shaped in outline. It is important for its electrical
characteristics that such wafer is made with parallel, highly
polished surfaces, and that for uniformity the polishing be done
automatically and under controlled conditions.
Rotating disc-shaped polishing tools have been used for polishing
wafers, the latter being adhered by wax to a flat platen which is
pressed against the rotating tool and held there for a
predetermined time. For maximum production per hour, it is
desirable that the time required to polish a wafer, or a batch of
wafers, be kept to a minimum, which means that the pressure on the
wafer during polishing should be as high as surface finish will
permit. The higher pressures, however, increase the friction
between the wafer and polishing disc which then heats up the wafer
and melts the wax holding the wafer to the holder. The wafers thus
loosened are destroyed, as are those at other stations on the
polishing machine contacted by the loose wafers, resulting in an
appreciable monetary loss to the polisher.
In my co-pending application, Ser. No. 202,965 filed Nov. 29, 1971
for APPARATUS FOR POLISHING WAFERS, there is disclosed and claimed
a differential pressure-operated workpiece holder which eliminates
the use of wax as an adherent for the wafers and which permits
higher pressure to be used on the wafers to speed up the polishing
operation. Although the wafers are heated by the polishing tool, it
has been found that the higher temperature assists in breaking down
the surface of the wafer and hence speeds the polishing operation.
It is necessary, however, to go through several steps each time a
polishing cycle is effected, the steps being to load, invert, press
upon the polishing tool, return, wash the wafers while on the
holder, and unload; and it is accordingly an object of this
invention to provide means for automatically providing each of
these operations for a wafer polishing machine except the load and
unload operations.
More specifically, it is an object of this invention to provide a
pressure-differential operated means for oscillating a workholder
from a load position to a work position and, back again, the work
position being held under a predetermined pressure.
For another object, this invention seeks to provide a
pressure-differential operated arm on which is mounted a
workholder, the arm being oscillated about a horizontal axis,
wherein the mounting for the workholder on the arm includes a
pressure-differential operated motor for providing operating
pressure to the workholder, with control means automatically
operated by the position of the arm for applying and releasing the
pressure, and with timer means for moving the arm to invert the
workholder and to apply a cleansing spray to the workpieces.
These and other objects of this invention will become apparent from
the following detailed description of a preferred embodiment of the
invention when taken together with the accompanying drawings in
which
FIG. 1 is a plan view of a polishing machine incorporating this
invention;
FIG. 2 is a side elevational view, partly in section of the machine
of FIG. 1;
FIG. 3 is a side elevational view, partly in section and on an
enlarged scale of the workholder of this invention; and
FIG. 4 is a schematic diagram of the controls for the workholder of
FIG. 3.
The form of polishing machine selected to illustrate this invention
is shown in plan view in FIG. 1. The workpieces are thin wafers of
silicon or the like used as electronic components and are of disc
form. The flat surfaces of the wafers are required to be polished
to a predetermined standard, and with the polishing cycle
calculated to produce such standard polish upon the wafers and the
time required to load and unload a workholder it has been
determined in the illustrative machine that a single polishing disc
with four work stations could be readily tended by one
operator.
Thus, the machine shown in FIG. 1 is comprised of a frame 10 on
which is mounted a polishing disc 11 rotatable about a vertical
axis and driven by an appropriate motor shown at 12 in FIG. 2. A
control panel 13 extends over disc 11 in proximity to four work
stations 14, 15, 16 and 17 and contains four sets of
manually-operated switches only one of which sets is shown in
outline at 18. One set of switches is supplied for each station. A
separate master control panel 19 is located on a post 20 supporting
the sets 18 of station switches. Said master control panel contains
switches (not shown) for controlling (1) motor 12 for driving disc
11, (2) a vacuum pump for generating the vacuum used to hold the
wafers on the workholder, (3) a polishing compound pump for
supplying the disc with abrasive for the polishing operation and
(4) a master switch which controls the electrical energy to the
entire machine. These controls, though necessary for the successful
operation of the machine as a whole, form no part of this invention
and hence will not be described in detail.
The four work stations 14, 15, 16 and 17 and their controls are
identical and hence for brevity only one station 17 will be
described. Said station is shown in elevation in FIG. 2 and in
enlarged elevation in section in FIG. 3. As shown in FIG. 2, it is
comprised of a vertically disposed pneumatic rotary actuator 21
which is essentially a pneumatic cylinder 22 (FIG. 3) the rod 23 of
which carries a gear rack 24 meshing with a pinion 25 the shaft of
which is connected to an arm 26. A workholder, shown generally at
27 in FIG. 2, is mounted on the end of arm 26 through a
pressure-differential operated motor 28, said arm in one position
overlying polishing disc 11 and pressing the workpieces upon the
surface of said disc and in another position, shown dotted in FIG.
2, substantially 180.degree. away from the said one position,
supporting the workholder 27 in an inverted position so that the
workpieces rest on top of the holder and can readily be placed upon
and removed from the workholder.
Referring now specifically to FIG. 3, the cylinder 22 of pneumatic
rotary actuator 21 is double acting and has ports 29 and 30 leading
to opposite sides of a piston 31 therein. Extending below cylinder
22 is a rod 32 on which is an abutment 33 the function of which is
to operate limit switches 34 and 35 at the ends of the
reciprocating movements of rod 32. Said switches control certain
operations of the station as will be described in detail
hereinafter.
The workholder 27, as shown more clearly in FIG. 3, comprises a
plate 36 preferably circular in outline and having a flat surface
37 upon which the workpieces 38 are held by differential pressure.
To this effect surface 37 is provided with relieved areas under the
workpieces 38 connected by passages 39 to a source of
sub-atmospheric pressure. The details of construction of the
relieved areas are disclosed in my co-pending application for
APPARATUS FOR POLISHING WAFERS filed Nov. 29, 1971 Ser. No.
202,965.
Plate 36 is secured to a piston rod 40 of a double acting
pressure-differential operated motor 41 having ports 42, 43 for
conducting fluid under pressure to one side or the other of the
piston 44 of motor 41. Motor 41 is secured to the end of arm 26 and
hence is movable therewith. It is contemplated that arm 26 will be
rotated through 180.degree. to invert workholder 36 so that the
workpieces can be readily loaded upon and unloaded from said
workholder. It is also contemplated that workholder 36 will be
moved and held against the polishing disc 11 to press the
workpieces thereagainst and thus accelerate the polishing process.
Finally, it is desirable that the polished workpieces, while still
on the workholder, be sprayed with water to wash off any polishing
compound that may adhere to them. The means by which the movements
of cylinder 22 and motor 41, and the application of water spray are
controlled will be described with reference to the diagram of FIG.
4 to which attention is now directed.
Inasmuch as air under pressure is generally available in shops and
factories where polishing is done, the motive fluid for cylinder 29
and motor 41 is air under pressure. Although hydraulic power can
also be used, it involves the use of a separate pump, a reservoir
and filters, all of which add to the cost of the machine.
Furthermore, to avoid the use of a large solenoid-operated valve to
control the water for the spray, the motive power for the water
spray valve is also air under pressure controlled by a
solenoid-operated valve. For brevity the components of the machine
and its controls are shown schematically in FIG. 4.
The sequence of operations for a full cycle at one station is as
follows, assuming that the disc has been set in rotation and the
polishing compound is flowing upon the rotating disc: (1) the
workholder is loaded with workpieces (manual); (2) the vacuum is
turned on to establish the differential pressure by which the
workpieces are held on the workholder (manual); (3) a switch is
turned on to start the timer for the polishing cycle (manual); (4)
arm 26 is rotated to a positive stop where the workholder holds the
workpieces just above the disc. The weight of the workholder, and
absence of any air under pressure in the motor 41, allows the
workholder to descend slowly to the polishing disc; (5) motor 41 is
operated to press the workpieces against the disc which had
previously been set in rotation, and to hold the workpieces against
the disc for the entire polishing operation (automatic); (6) a
second timer (to be hereinafter described) operates the motor 41 to
raise the workpieces off the disc 11 (automatic); (7) arm 26
returns to its starting position (automatic); (8) a water spray is
automatically turned on to wash the workpieces (automatic); (9)
vacuum is turned off (manual); (10) workpieces are removed from
workholder 36 (manual).
In the control diagram shown in FIG. 4, air under pressure is
connected to a station supply pipe 45 from which it is conducted
through a pipe 46 to a solenoid-operated valve 47 and thence as
dictated by valve 47 to ports 42 and 43 on motor 41 the function of
which is to move workholder 36 against polishing disc 11. A second
branch pipe 47 conducts air under pressure to an air valve 48 which
controls a small pressure differential motor on a water valve 49
controlling in turn the spray water from a water line 50.
Pipe 45 is connected to a valve 51 which controls the admission of
air under pressure to cylinder 22 of the fluid actuator 21 (FIG. 2)
for arm 26. Valves 47, 48 and 51 are solenoid operated to open and
spring-returned to closed position. The solenoids in turn are
controlled by timers 52, 53 and 54, timer 52 controlling the
polishing cycle and being manually adjustable to the length of time
required to polish a workpiece, and timers 53 and 54 being fixed as
to duration and designed to produce a short delay in the
application of electric current to the solenoid valves operated
thereby. Each station has a manually-operated "start" switch 55
which controls all electrical equipment for that station and a
manually-operated "cycle" switch 56 which energizes timer 52 to
start the polishing cycle.
The operation of the machine is as follows:
Initially, cylinder 22 is in the position wherein its piston and
attached gear rack 23 are in their lowermost position. Workholder
plate 36 is therefore in its inverted position radially removed
from polishing disc 11 and ready to be loaded. The vacuum has been
turned off by manually-operated switch 57 which controls the
solenoid-operated valve 58 for the vacuum to plate 36. Workpieces
are placed upon plate 36 over the areas influenced by vacuum as
described in detail in my aforesaid co-pending application Ser. No.
202,965; and when the plate is filled, the station switch 55 is
turned on to activate the electrical components of the station
following which the vacuum switch 57 is turned on to cause the
workpieces to be held by differential pressure on plate 36. Next,
cycle switch 57 is turned on to energize timer 52 and start the
automatic sequence of operations.
The energization of timer 52 actuates a series of switches 58, 59,
60 and 61 which are reversed when the timer times out. Switch 58 is
a holding switch for timer 52 so that manual switch 56 need not be
held down during the polishing cycle. Switch 59 energizes a
solenoid 62 on air valve 51 to cause said valve to admit air under
pressure to the bottom of actuator 22 and thus raise rack 23 to
rotate pinion 25 and arm 26 toward polishing disc 11. When rack 23
reaches the end of its stroke, limit switch 34 is actuated to
activate timer 53 which when it times out energizes a solenoid 63
on valve 47 to admit air under pressure to port 42 of pressure
cylinder 41 and thus move workholder plate 36 toward polishing disc
11 and hold it against the disc with a predetermined pressure.
Since the polishing disc had been set in motion previously and
remains in motion until the machine is to be shut down, the
polishing operation commences and continues until timer 52 times
out.
With timer 52 timed out, switches 58 and 59 are opened and switch
60 is closed to energize a solenoid 68 on valve 51 to condition
said valve to admit air under pressure to the top of cylinder 22
which lowers rack 23 and raises workholder plate 36 off the
polishing disc 11. Simultaneously, with the energization of switch
60 a switch 61 is closed by timer 52 which energizes a solenoid 65
on valve 47 to remove air pressure from plate 36 and to raise said
plate with respect to cylinder 41.
Upon completion of the reverse rotation of arm 26, limit switch 35
is activated by abutment 33 to energize a solenoid 66 on air valve
48 the air from which then operates water valve 49 to spray water
upon the polished workpieces. A timer 54 is activated
simultaneously with solenoid 66 and when it times out, a switch 67
is opened to de-energize solenoid 66 and thus, through the
spring-returned valves 48 and 49 shut off the water to the spray.
Vacuum switch 57 is then opened to remove differential pressure
from the workpieces and the polished workpieces are subsequently
removed and replaced with workpieces to be polished. The operator
moves to the next station that has timed out and that is ready for
removal of polished workpieces and loading of workpieces to be
polished.
The machine herein described thus automatically brings the
workpieces to the polishing disc, brings pressure to bear upon the
workpieces while they are being polished, to speed up the polishing
operation both from the standpoint of increased abrading action as
well as of disintegration through chemical action which is
accelerated by the increased temperature of the workpiece surface,
removes the pressure and brings the workpieces back to the loading
position.
It is understood that although the invention has been described
with reference to its application to a machine for polishing
wafers, it can be used with machines for lapping or grinding other
workpieces, and the scope of this invention therefore is not to be
limited to the wafers and polishing machine herein disclosed but is
to be determined by the appended claims.
* * * * *