U.S. patent number 3,827,017 [Application Number 05/309,420] was granted by the patent office on 1974-07-30 for adjustable induction coil for heating semiconductor rods.
This patent grant is currently assigned to Siemens Aktiengesellschaft. Invention is credited to Wolfgang Keller.
United States Patent |
3,827,017 |
Keller |
July 30, 1974 |
ADJUSTABLE INDUCTION COIL FOR HEATING SEMICONDUCTOR RODS
Abstract
An adjustable induction coil is made up of several component
parts, some of which may be disassembled from the remainder in
order effectively to enlarge the inner diameter of the coil, or to
remove the coil from association with a semiconductor rod passing
through the coil, and which is heated by the coil. The coil is
provided with conduits adapted to support a fluid flow for cooling
the coil during operation.
Inventors: |
Keller; Wolfgang (Munich,
DT) |
Assignee: |
Siemens Aktiengesellschaft
(Berlin and Munich, DT)
|
Family
ID: |
5827286 |
Appl.
No.: |
05/309,420 |
Filed: |
November 24, 1972 |
Foreign Application Priority Data
Current U.S.
Class: |
336/62; 219/638;
336/232; 336/223; 422/250.1; 117/222 |
Current CPC
Class: |
C30B
13/20 (20130101); Y10T 117/1088 (20150115) |
Current International
Class: |
C30B
13/20 (20060101); C30B 13/00 (20060101); H01f
027/28 () |
Field of
Search: |
;336/62,232,223
;219/10.79 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Kozma; Thomas J.
Attorney, Agent or Firm: Hill, Gross, Simpson, Van Santen,
Steadman, Chiara & Simpson
Claims
What is claimed is:
1. An induction heating coil for use in heating a semiconductor rod
comprising:
an induction coil adapted to encircle said rod and including a
current conducting loop forming an outer section of said coil and a
plurality of separable inner sections, whereby at least some of
said inner sections may be independently separated from association
with said rod;
said loop formed of a plurality of convolutions of an elongated
tube;
said inner sections being removably connected with an innermost
convolution of said loop, said inner sections being in
substantially continuous electrical contact with said innermost
convolution of said loop, said inner sections having a radially
innermost surface defining a circle for surrounding said rod, said
inner sections being separable from each other along a separating
line;
an insulating space separating one end of said innermost
convolution from the other end of said innermost convolution;
conduit means within said inner sections for supporting a fluid
flow therethrough; and
means for connecting the interior of the tube of said innermost
convolution with said conduit means.
2. A disassembleable induction heating arrangement for floating
zone melting of semiconductor rods comprising:
a flat coil having at least two separable components contacting
each other along a separating line;
means for securing said components together; a fluid passageway
through each of said components; and gasket means for forming a
fluid-tight connection therebetween;
said separating line extending through said coil and being defined
by two parallel planes which extend perpendicular to the plane of
said coil joined to a third plane between and perpendicular to said
parallel planes.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to induction coils and more
particularly to induction coils which are employed in the process
of treating semiconductor rods by the floating zone melting
process.
2. The Prior Art
It is frequently desirable to purify rods consisting of
semiconductor material by subjecting them to a so-called floating
zone melting process, employing an induction coil which heats the
semiconductor rod by induction. A melting zone is established
within the rod, which is encircled by the coil, and this melting
zone is shifted along the length of the rod from one end to
another, by moving the rod relative to the coil. In this manner,
impurities are transported to one end of the rod, leaving the
remaining structure more free of impurities than before. The
floating zone melting process is also used for the breeding of
single crystals by melting a core crystal to one end of the rod,
and guiding a melting zone from the core crystal to the other end
of the rod.
It is desirable to use a variety of sizes of induction coils in
carrying out some heating processes, and it is therefore necessary
sometimes to remove the coil from association with the rod, and to
replace it with one of a different size. When a conventional coil
construction is employed, the coil can be removed only by
disconnecting an end of the semiconductor rod from the apparatus
which supports the rod during its movement relative to the coil.
This is undesirable, especially when relatively large diameter rods
such as 50 to 80 millimeters in diameter, are being treated. The
disconnecting procedure is cumbersome and expensive and it is
desirable to avoid this procedure, if possible.
SUMMARY OF THE INVENTION
A principal object of the present invention is to provide an
induction heating coil which is constructed in a way which permits
it to be dismounted from a semiconductor rod which it is adapted to
heat.
Another object of the present invention is to provide a coil which
has means for adjusting its inner diameter without removing it from
a semiconductor rod which it is adapted to heat.
These and other objects and advantages of the present invention
will become manifest upon an inspection of the following
description and the accompanying drawings.
In one embodiment of the present invention there is provided a coil
having two components which are selectively connectable with each
other and which are adapted to be separated from each other to
permit removal of the coil from the semiconductor rod.
In another embodiment the coil consists of one or more loops with a
ring shaped inner part formed of two components adapted to be
separated from each other and from the coil loops.
BRIEF DESCRIPTION OF THE DRAWINGS
Reference will now be made to the accompanying drawings in
which:
FIG. 1 is a perspective view of a coil incorporating an
illustrative embodiment of the present invention, shown in
separated condition;
FIG. 2 is a plan view of the coil of FIG. 1, shown in assembled
condition;
FIG. 3 is a perspective view of an alternative embodiment of the
present invention;
FIG. 4 is a plan view of a further embodiment of the present
invention;
FIG. 5 is a vertical cross-sectional view of the coil of FIG. 4,
taken along a plane V--V;
FIG. 6 is a plan view of yet another embodiment of the present
invention; and
FIG. 7 is a vertical cross-sectional view of the coil of FIG. 6,
taken along a plane VII--VII.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring now to the drawings, and in particular to FIGS. 1 and 2,
a coil 1 is shown which is adapted to be used for heating a
semiconductor rod and which is selectively separable from the rod.
The coil 1 consists of a single loop, and is provided with a pair
of hollow conductive terminals 34 and 35, which may be connected to
a suitable source of electric potential to establish an electric
current within the coil. The terminals 34 and 35 are also connected
to a source of cooling fluid and to a sink therefor, respectively.
The coil 1 is composed of copper or silver or some other metal with
good conducting properties. It is formed of two component sections
2 and 3, which are in electrical contact with each other along the
end surfaces thereof 4 and 5.
The two sections 2 and 3 each have an interior conduit 31 connected
at one end to the interior of the hollow terminals 34 and 35, and
at the other end to each other via a sealing arrangement which
prevents leakage of the fluid at the joint between the sections 2
and 3. A flange 32 is provided on each of the sections 2 and 3 and
each flange 32 having aligned bolt holes 6, 7 and 8 by which the
flanges 32 may be bolted together by bolts 6a and 7a. An O-ring 9
surrounds the joint between the conduits 31 to insure a fluid-tight
sealing relationship between the two flanges 32 when the same are
bolted together. The surfaces of the two flanges 32 are spaced
slightly from the planes of the surfaces 4 and 5, to accomodate the
thickness of the O-ring 9, permitting good electrical connection
between the surfaces 4 and 5. In one coil, the inner diameter is
about 30 millimeters and the outer diameter is between 80
millimeters and 120 millimeters. Of course the sizes of the coil
diameters depend on the rod sizes which are to be used with the
coil. When it is desired to remove the coil 1 from the rod with
which it is associated, it may be readily separated into two parts
by disconnecting the nuts and bolts associated with the bolt holes
6, 7 and 8, after which the two sections 2 and 3 may be withdrawn
separately from the semiconductor rod. Of course, the fluid flow is
stopped prior to disconnection to avoid spillage.
In FIG. 3, an alternative embodiment is illustrated which is like
the embodiment shown in FIGS. 1 and 2 except that the separating
line between the two sections 2 and 3 lies partly in the plane of
the coil, rather than being transverse thereto as in the embodiment
of FIGS. 1 and 2. In other words, the separating line extends
through the coil and is defined by two parallel planes which extend
perpendicular to the plane of the coil joined to a third plane
between and perpendicular to the parallel planes. The two sections
2 and 3 are connected for good electrical contact therebetween, and
with a fluid-tight seal, by means of screws 6b and 7b. The screws
6b and 7b are received in aligned apertures in the two sections 2
and 3, those in the section 3 having cooperating threads. The
screws 6b and 7b are located on opposite sides of junction between
the interior conduits of the two sections. The interior conduit in
each section is formed so that the junction between the sections 2
and 3 is disposed solely on the horizontal surface 10, in the
manner shown in FIG. 7, which is described hereinafter. This
insures that a fluid-tight seal is achieved by surrounding the
opening on one side or the other with a gasket member such as an
O-ring.
The embodiment of FIG. 3 is preferable to that illustrated in FIGS.
1 and 2 in some circumstances, when the screws 6b and 7b, being
oriented differently from the bolts 6a and 7a, are more
accessible.
In FIGS. 4 and 5 an alternative embodiment of the present invention
is illustrated, showing an induction heating coil or loop 11
composed of copper, silver or the like having three convolutions 12
connected between the hollow terminals 34 and 35. The coil 11 is
formed of tubular material to support a stream of cooling fluid.
The winding includes two arcuate inner sections 13 and 14 which are
in electrical contact with the inner convolution of the coil 11. A
flange 30 is attached by means of soldering, welding or the like,
to the inner convolution 12 of the coil 11, and the sections 13 and
14 are connected to the flange 30 by means of screws 15-22. As
illustrated in FIG. 5, a solder joint 24 fills the space between
the flange 30 and the inner convolution of the coil. A gap is
provided in the flange 30 between the beginning and end of the
inner convolution 12, to avoid short circuiting the convolution. A
gap is also provided between the sections 13 and 14 at this
location for the same purpose.
When the screws 15-22 are removed, the two inner sections 13 and 14
are separated and removed, thereby increasing the inner diameter of
the coil 11 from that illustrated in FIG. 4 to that illustrated in
the dashed line 23, which defines the inner surface of the flange
30. The coil illustrated in FIGS. 4 and 5 may, therefore, be
employed in a process which requires coils of different inner
diameters during the course of the process. Of course it can also
be used in a process involving a single semiconductor rod which is
mounted in a way which permits the coil 11 to be removed therefrom
only when its inner diameter is as large as the dashed line 23.
In FIGS. 6 and 7 another embodiment of the present invention is
illustrated. This embodiment resembles that shown in FIGS. 5 and 6
except that the inner sections 13 and 14 are provided with an
interior conduit for cooling purposes. The coil 11 has two
convolutions 12, and the flange 30 is soldered by a solder joint 24
to the inner convolution of the coil, just as in the embodiment of
FIGS. 4 and 5. As best illustrated in FIG. 7, the flange 30 has a
rectangular cross-section, and includes a horizontal bore 36
communicating at one end with the interior of the inner convolution
12 of the coil 11, and at the other end with a vertical bore
aligned with a vertical bore 37 provided in the sections 13 and 14
and leading to the hollow interior of the sections 13 and 14. By
this means the inner convolution is connected to the inner sections
at four locations, and cooling fluid flows through the hollow inner
sections 13 and 14, as well as through the coil 11, as illustrated
by the arrows 25. Both of the sections 13 and 14 have end walls
closing off the ends of the conduit therewithin, so no sealing
arrangement is needed at the vertical plane of contact between the
sections 13 and 14. Four O-rings 26-29 surround the four fluid
junction points between the two inner sections 13 and 14 and the
ring flange 30, as best illustrated in FIG. 6, to insure a
fluid-tight connection therebetween. Screws 15-22 interconnect the
inner sections 13 and 14 to the ring flange 30 in the same manner
as has been described in reference to FIGS. 4 and 5.
The embodiment shown in FIGS. 6 and 7 may be employed in the same
manner as that illustrated in FIGS. 4 and 5, but the embodiment of
FIGS. 6 and 7 achieves the additional advantage of permitting
cooling of the inner sections 13 and 14.
* * * * *