U.S. patent number 3,812,442 [Application Number 05/230,247] was granted by the patent office on 1974-05-21 for ceramic inductor.
Invention is credited to William L. Muckelroy.
United States Patent |
3,812,442 |
Muckelroy |
May 21, 1974 |
CERAMIC INDUCTOR
Abstract
A nonolithic microminiature inductor comprising a helical
conductive path of deposited metal film immersed in a rectangular
block of magnetic refractory material. The inductor has metal caps
at each end of the block as terminations. These terminations may be
soldered to metallized pads located on a substrate. A method for
making this inductor wherein loops of conductive metal are
deposited onto a thin unsintered magnetically permeable ceramic
sheet with holes for interconnection therein and wherein said holes
are alligned and said sheets are laminated such that upon sintering
said metal forms a helical contiguous conductive path immersed a
contiguous block of ceramic.
Inventors: |
Muckelroy; William L.
(Washington, DC) |
Family
ID: |
22864488 |
Appl.
No.: |
05/230,247 |
Filed: |
February 29, 1972 |
Current U.S.
Class: |
336/83; 336/192;
336/232; 29/602.1; 336/200 |
Current CPC
Class: |
H01F
41/046 (20130101); H01F 17/0013 (20130101); Y10T
29/4902 (20150115) |
Current International
Class: |
H01F
41/04 (20060101); H01F 17/00 (20060101); H01f
017/06 () |
Field of
Search: |
;336/83,200,232,221,192
;340/174CC,174JA ;317/258 ;174/68.5 ;338/308 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Kozma; Thomas J.
Attorney, Agent or Firm: Kelly; Edward J. Berl; Herbert
Elbaum; Saul
Claims
1. A microminiature inductor in the form of a monolithic ceramic
block having appositioned layers, each layer comprising:
a member having a body portion made of magnetically permeable and
electrically insulative metal powder immersed in said block;
a first side of each member having a formation thereon
characterized as a discontinuous conductive loop with conductive
interconnection pads at the ends thereof;
a second side of each member having a formation thereon
characterized as a conductive interconnection pad, the formation on
respective sides of each of said members being identical in
configuration, one of the interconnection pads on the end of each
loop being positioned in registry with the interconnection pad on
the opposite side of the member;
an opening formed through the interconnection pad on the second
side of each member;
the members stacked so that all first sides face in one direction
while the second sides face a second direction;
each member being rotated substantially 90.degree. with respect to
the member above and below it to cause the interconnection pad on
the second side of each member to be in contact with an
interconnection pad on the first side of a juxtaposing member;
metal material from contacting interconnection pads fused together
through a hole in the interconnection pad of a respective second
side thus resulting in a conductive helix formed through the
members with the body
2. The subject matter of claim 1 together with two layers having
conductive bonding pads thereon, the layers being electrically
connected to the helix
3. The subject matter of claim 2 wherein the body of the member
comprises an electrically insulated, magnetically permeable metal
powder immersed in ceramic, said powder and ceramic forming a
contiguous material, whereby said ceramic is made magnetically
permeable by the presence of said powder.
Description
RIGHTS OF THE GOVERNMENT
The invention described herein may be manufactured, used, and
licensed for or by the United States Government for governmental
purposes without the payment to the inventor of any royalty
thereon.
BACKGROUND OF THE INVENTION
This invention relates generally to monolithic microminiature
components for use in the assembly of micro-circuitry using
substrates as a basis onto which the various types of components
are mounted. Less generally this invention relates to a monolithic
microminiature inductance element and a method for making same.
Specifically this invention relates to a microminiature monolithic
inductance element with a magnetically permeable core comprising a
magnetically loaded ceramic material and a process for making in
mass production large quantities of this device at very economical
prices. Moreover, it is related to that class of devices classified
as inductors which possess an innercore having the property of
significantly enhancing a magnetic field. Among the classes of
microelectronic manufacture to which this invention applies are
thick film technology, thin film technology, and hybrid multichip
technology. In any case, the invention is to be used where
reduction in size is required; a large quantity is to be produced;
and cost is an essential factor.
Currently spiral inductors made by the application of thick and
thin films and by substractively etching the inductor are currently
used in manufacturing hybrid microelectronic circuits. Helical
miniature inductors have been available for sometime in monolithic
form factors having iron cores. However, they comprise fine wire,
wound onto iron rods, coated with an epoxy in order to fix the
position of the wire to maintain the characteristics of the device.
Many problems exist with such a structure, one of which is a
possibility of the epoxy breaking down or a particular piece of
wire becoming loose. Such flaws in this type of device under
abnormal physical condition can cause severe changes in circuit
characteristics. This is especially true in military applications
where hardware comprising electronic circuity is subjected to large
accelerations and shocks.
There are other designs of monolithic inductors essentially the
same as the one previously described. The difference is that these
other devices are molded into plastic. And naturally, there are the
myriad of structures for inductive elements which are not
microminiature and which are not monolithic in the sense of this
invention in that the various parts of the inductor are not
chemically bonded or thermally fuzed to each other. In general, in
the past inductors in microminiature form-factors and form-factors
easily applicable to hybrid microelectronic circuits have been
extremely expensive in relationship to the cost of other functional
components to be used in the circuits and therefore offers a cost
factor against the use of such components.
Another inherent disadvantage in the structure of the aforesaid
components is the nature of the conductive terminations formed onto
the device for interconnecting them into the particular circuitry
for which it is needed. In most cases, such as that of the plastic
device it is best to only epoxy such a device to the substrate
using a conductive epoxy material because of the problems involved
in raising the temperature of such a device to that necessary for
soldering into the circuit. The difference in thermal coefficients
between the plastic and the metal terminations at the ends thereof
usually precludes the use of high or even moderate soldering
temperatures for interconnecting such devices into the circuit.
These differences in thermal coefficients are extremely cumbersome
when soldering microminiature devices. In general, in assembling
hybrid circuits it is desirable to reflow solder chips components.
This precludes other sensitive semiconductors from having to be
reheating many times. All devices in use today, except spiral
depositions onto substrates, have significant thermal mismatches in
materials.
In the case of the spiral inductor printed onto a substrate such as
alumina or mylar the coupling between the various turns of the
spiral are not enhanced significantly. Usually there is free space
above the spiral unless some particular type of coating is
applied.
One problem with spiral inductors printed on very thin sheets of
material is the high probability of changes in the Q-factor by
bending of the substrate. Another problem with the spiral is
interconnection. When both terminations of the spiral are on the
same side of the substrate one of the terminations must be crossed
over the respective turns of the spiral. This degrades operation of
the device. Even if terminations are brought out on opposite sides
of the substrate the problem of traversing the respective windings
is still present. Another severe problem with the spiral inductor
and the spiral inductor reversed upon itself is that a tremendously
large amount of substrate is required.
The term "refractory material" is used herein to mean a substance
which will not melt, decompose or materially change under the
processing conditions involving in forming the device herein
described. Refractory material is generally classified into four
broad groups. The group of utility here includes the
polycrystalline materials such as ceramics and includes, for
example, porcelains, steatites, aluminas, and ferrites. The present
invention is described with reference to these ceramics and, more
particularly, thin sheets of alumina with ferrites mixed therein.
However, it should be understood that the present invention is
equally applicable to the other ceramic materials.
The spiral may be formed from a paste of glass, high melting point
metal such as platinum and gold, and a decomposable fluid
suspending agent applied to the refractory oxide by any convenient
method, for example, by dipping, brushing, or spraying. The
relative amounts of materials within the paste may vary over fairly
wide limits. The main consideration is that the metal content be
sufficiently high to insure that the resulting metal film after
processing is continuous. The amount of fluid used as a suspending
agent depends on the method of application. If spraying is used, a
relatively thin suspension is required. If brushing or "squeeze"
screen processes are employed, thicker paste suspension should be
such as to insure good conductivity of the deposition.
Magnetic materials usable for this device include 2-81 permalloy
and carbonyl iron insulated powders, and Ferroxcube III sintered
powder.
Generally, a mean particle size range which is suitable is 0.5 to
25 microns for the paste, with the preferred range being between
0.5 and 15 microns. Smaller particles are equally satisfactory.
As for the glass flux, a glass which fuses and bonds to the ceramic
at a temperature below the melting point of the metal and resists
reduction under the usual processing conditions should be used.
Glasses having these properties are readily compounded from
mixtures of silica (SiO.sub.2) and various combination of the
oxides of sodium (Na.sub.2 O), calcium (CaO), barium (BaO),
magnesium (MgO), aluminum (A1.sub.2 O.sub.3), boron (B.sub.2
O.sub.3), potassium (K.sub.2 O) and phosphorus (P.sub.2 O.sub.5),
among other elements. Table 1 is illustrative of some suitable
glasses which can be conveniently compounded from typical oxides
specified as to kind and amount in the table. The table is not
intended to be exhaustive of suitable glasses but indicates the
general composition of some readily fusible nonreductible glasses.
It is noted that this table encompasses many common types of
glasses such as the borosilicates, phosphates and silicates.
TABLE I
Melt Ingredient: Parts by Weight Li.sub.2 O 0-15 Na.sub.2 O 0-25
CaO 0-10 BaO 0-20 MgO 0-2 Al.sub.2 O.sub.3 0-35 SiO.sub.2 5-80
B.sub.2 O.sub.3 0-30 K.sub.2 O 0-5 P.sub.2 O.sub.5 0-80
in the preparation of the glasses, the ingredients are smelted
together in a furnace at a temperature sufficient to melt but not
volatilize the constituent oxides, for example, between
1,100.degree. and 1,500.degree. C, until a mass of uniform quality
has been obtained. The melt is fritted by pouring into cold water,
and the resultant frit is ground to the fineness desired. It is
desirable for the glass particles to be finely divided, for
example, in the order of 1/2 micron to 25 microns particle size, so
that the paste mixture will, under the processing conditions,
result in a continuous metal layer adherently bonded to the
ceramic.
The glass and metal particles are suspended in a volatile and
decomposable fluid suspending agent and applied to the refractory
oxide by any of the methods aforementioned. The relative amount of
metal and glass used may vary over fairly wide limits. The main
consideration is that the metal content be sufficiently high to
insure that the resulting metal film after processing is
continuous. Generally, between five to 50 parts by weight of metal
is used for each part by weight of glass.
The fluid suspending medium serves to disperse the paste mixture in
the desired pattern on the substrate and to hold the paste in this
pattern until processing commences. During processing the
suspending medium should volatilize, leaving no residue. The
suspending medium should not react with the metalic or glass
components of the coating composition before or during firing.
To insure proper dispersion and bonding of the paste, many of the
common suspending media contain two components. The first component
acts as a dispersion medium for the paste and as a solvent for the
second component which insures proper bonding of the paste to the
"green ceramic" or refractory oxide until processing commences.
Examples of suitable dispersion media which are solvents for the
below listed binders are benzene; the esters of fatty acids;
alcohols of low molecular weight such as ethyl, butyl, and amyl;
acetates including "Cellosolve acetate" (ethylene glycol monoethyl
ether acetate), and "Carbitol acetate" (diethylene glycol monoethyl
ether acetate); ketones such as acetone and methyl-ethyl-ketone;
and higher ethers such as glycol diethyl ether. Suitable binders
are, for example, the vinyl or substituted vinyl polymers such as
polymethylmethacrylate, polyethylmethacrylate,
polybutylmethacrylate, and polyisobutylmethacrylate and the
cellulose esters and ethers such as cellulose nitrate, cellulose
acetate, cellulose butyrate, methyl cellulose and ethyl cellulose.
Rohm and Haas "Acryloid A-10," a solution of 30 percent
polymethylmethacrylate solids in "Cellosolve acetate" has proved a
good suspending medium.
In general, any ceramic which is resistant to the usual processing
conditions may be used as the refractory substrate. The following
table is illustrative of various ceramic compositions that have
successfully been used. The compositions are expressed in parts by
weight. ##SPC1##
In order to form a ceramic slurry with good flow property, the
forementioned thermoplastic organics are used as flow-promoting
binders for the refractory oxide. The prime step is to coat the
fine alumina particles with these thermoplastics. This step is
facilitated by intense mixing at high temperatures in the range
100.degree. to 400.degree. C. Water emulsions of the organic
plastic agents facilitate the initial mixing of the organic with
the ceramic particulates, and the initial contact can be made by
using an aqueous or non-aqueous slurry and solution. Removal of the
volatile constituents provides an intimate mixture of the organic
and ceramic most often termed "green ceramic."
In a typical process, firing of the laminate is done in a furnace
in which both atmosphere and temperature can be controlled. The
firing is done in an reducing atmosphere. This firing step is
carried out under conditions sufficient to volatilize the fluid
suspending media, and to commence formation of a refractory
ceramic-to-glass-to-metal bond. The temperature and firing times
are interdependent. The fluid suspending vehicle used and the
temperature required commences formation of the refractory
ceramic-to-glass-to-metal bond. This temperature is dependent upon
the temperature required to sinter the ceramic and to cause wetting
of the refractory ceramic and at least part of the metal by the
glass in the paste system. Such wetting and sintering temperatures
are dependent upon the glass flux used. Temperatures ranging from,
for example, 1,400.degree. to 1,600.degree. C have been
successfully used.
The maximum temperature is limited by the melting point of the
metal while the minimum temperature is again dependent upon the
wetting and sintering temperature of the glass flux employed and
the temperature required to sinter the ceramic wet by the glass
comprising the paste.
The invention described herein overcomes many of the disadvantages
of the foregoing constructions.
It is therefore the object of this invention to provide a new and
novel process for manufacturing microminiature monolithic
inductance elements with a magnetically permeable core.
It is yet another object of this invention to provide a new and
novel microminiature inductance element with a magnetically
permeable core which is monolithic and comprises materials having
coherent thermal coefficients.
It is yet an additional object of this invention to provide a new
and novel device and process for manufacturing said device which is
economical and easily adaptable to high volume manufacturing.
It is yet an additional object of this invention to provide a
monolithic helical inductor emersed in a magnetically permeable
ceramic material within terminations suitable for attachment by
reflow soldering to thick film circuitry.
It is another object of this invention to provide a microminiature
monolithic inductance element which has a form factor compatible
with that of other components used in hybrid microelectronics.
It is still additional object of this invention to provide a
microminiature monolithic inductance element with a structure made
of ceramic and cermet materials.
It is yet another additional object of this invention to provide an
inductance device having a surface of refractory material.
It is yet an additional object of this invention to provide a
microminiature monolithic inductor with a new and novel core
comprising a magnetically permeable alumina ceramic.
It is yet an additional object of this invention to provide a
helical inductor imbedded in a magnetically permeable alumina
ceramic having a rectangular-solid form-factor.
Yet another additional object of this invention is to provide a new
and novel microminiature monolithic inductor whose electrical paths
are formed by metalization paths of thick films and thin films.
Still an additional object of this invention is to provide a new
and novel method for making a microminiature monolithic inductor in
which the electrical conductive paths are formed onto unfired
alumina ceramic tape by a subtractive etching technique.
Still yet an additional object of this invention is to provide a
new and novel design of metalization which provides a helical
spiral that provides inductivity within a compact area.
These and other objects of the present invention will become more
fully apparent with the reference to the following specifications
and drawings which relate to several variations of a preferred
embodiment of the invention described herein.
SUMMARY
A monolithic microminiature inductor comprising a helical
conductive path of deposited metal film immersed in a rectangular
block of magnetic refractory material. The inductor has metal caps
at each end of the block as terminations. These terminations may be
soldered to metallized pads located on a substrate. A method for
making this inductor wherein loops of conductive metal are
deposited onto a thin unsintered magnetically permeable ceramic
sheet with holes for interconnection therein and wherein said holes
are alligned and said sheets are laminated such that upon sintering
said metal forms a helical contiguous conductive path immersed a
contiguous block of ceramic.
BRIEF DESCRIPTION OF THE DRAWINGS
The specific nature of the invention as well as other objects,
aspects, uses, and advantages thereof will clearly appear from the
following description and from the accompanying drawings, in
which:
FIG. 1a is an illustration of the process of manufacturing
magnetically permeable ceramic tape.
FIG. 1b is a flow chart of the method for manufacturing
magnetically permeable ceramic tape.
FIG. 2a is an illustration of the pattern deposition process by
which conductive paths are formed on the ceramic tape.
FIG. 3a is a view of the underside and top of various layers of the
inductor.
FIG. 3b is an exploded view of a monolithic inductor and unbent
metal end terminations.
FIG. 3c is an illustration of a monolithic inductor with end
terminations about to be bonded thereto.
FIG. 3d is an illustration of a monolithic inductor having end
terminations formed by coating the ends thereof.
FIG. 3e is an illustration of a finished monolithic inductor.
FIG. 3f is an illustration of a monolithic inductor having its
coated end terminations sintered.
FIG. 4 is a flow chart of the manufacturing process by subtracture
etching.
FIG. 5a is an exploded view of the monolithic inductor showing
internal structure.
FIG. 5b is an illustration of a molded metal end termination or
cap.
FIG. 5c is an illustration showing a metal end cap with metal film
formed thereon.
FIG. 5d shows details of a first outside layer of the monolithic
inductor.
FIG. 5e shows details of an interconnector pattern formed on an
internal layer of the monolithic inductor.
FIG. 5f shows details of a second outside layer of the monolithic
inductor.
FIG. 6a is an illustration of two adjacent layers of ceramic tape
with conductive patterns thereon before lamination.
FIG. 6b is an illustration of two adjacent layers laminated with
the interconnection of the conductive metalization from one layer
to the next.
These and other objects of the present invention will become more
fully apparent with reference to the following specifications and
the drawings which relate to several variations of a preferred
embodiment of the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
The manufacturing process of the present invention will be easily
understood in broad aspects by reference to FIG. 1a wherein there
is illustrated the basic steps in the manufacture of the
magnetically permeable ceramic tape. The construction principle of
the multilayer ceramic inductor chip begins with the mixing of a
slurry 31 of alumina powder and various binders that can be cast in
thin layers 31 on a flat surface 34. However, before casting a
magnetically permeable powder 32 is added to the slurry of ceramic
material 31. A doctor-blade 33 is normally used to achieve the
required thinness and uniformity. Organic binders in the slurry
give enough strength and flexibility to the tape 31 after drying
for removal and handling. Strips 37 are cut out of this tape and
backed with insulating paper 36 and then holes are punched with
tool 38 and the resulted strips are rolled onto roles 39. The
striping or cutting of strips is done with tool 35. In order that
this particular portion of the process may be easily understood it
is presented to flow chart form. In FIG. 1b step 40 consists of
adding a portion of magnetic powder to the ceramic slurry 31. The
proportion of the magnetic material to the ceramic material may
vary between 5 and 30 percent of the volume of the ceramic
material. The next step of the process 41 is to spread this slurry
material by doctor blade to the desired thickness. After step 41 is
accomplished the ceramic sheet material is dryed, step 42, by
convection or infrared or other heat transfer means. Once the
ceramic sheet material is dry it acquires a plastic and rubber like
characteristic and becomes very flexible, yet not brittle. In step
43, this tape-like, rubber-like material is cut into long strips
37. In order to prevent the slurry tapes from sticking together due
to temperature changes during rolling, a paper or plastic backing
is appositioned, step 44, to the tape and the tape is then in step
45 punched with holes at the required locations. The long strips of
tape are next rolled onto reels, step 46. This completes the
process for formation of the tape.
The next phase necessary in the production of these monolithic
microminiature inductance elements with magnetically permeable
ceramic cores is a formation of conductive paths by pattern
deposition as shown in FIG. 2a. The reels of ceramic tape 39 are
fed through a printer 47 which screens the conductive pattern
necessary to form the inductance element onto the tape 37. The tape
37 is then fed through a drying oven or apparatus 49 which removes
the highly volatile components of the metalization silk screened
onto the substrate 37. After the metalization is dryed the paper is
separated from the ceramic tape 37 and rolled onto reels 50 for
reuse. The ceramic tape 37 is then fed into a compression and
lamination apparatus 51 along with reels of tape from other lines
similar to the one we have described as illustrated in 52. Sections
of these sheets are alligned and stacked and the stacked structure
53 is compressed and laminated by compression apparatus 51 and the
resulting compressed structure is cut from the tape sources and
trimmed with cutting apparatus 54. These large compressed sheets of
ceramic tape with metalization thereon contain many inductors.
These laminated structures 56 are then carried by a belt 55 to a
sintering oven 57 which cures the ceramic at temperatures up to
1,600.degree. C. transforming the laminated structure 56 into a
monolithic mass of conductor, ceramic, and magnetically permeable
powder immersed and surrounded by the various granules and
molecules of alumina ceramic. Once this essential step is completed
it is necessary to use a diamond cutter 58 to cut out the various
conductors comprised in structure 56. The above steps are
illustrated in flow chart form in FIG. 2b. Note that in step 66 of
FIG. 2b metal terminations are attached to the individual inductive
elements. Step 66 is a final increment in the production of these
elements. In particular, FIG. 3a shows the various steps necessary
in order to form the proper pattern and to get the proper
interconnections between the various layers to compose a helical
inductor. If we were to take an inductor cut from the laminated 56
which, for instance, is comprised of seven individual layers of
tape the structure would look as indicated and illustrated in FIG.
3a.
In order to appreciate the relationship between the various layers
in the laminated structure 56, continuing reference is made to FIG.
3a. Reference character A represents a first layer or lamination
that has its top side indicated by 207 and its bottom side
indicated by 200. The top side 207 has a large rectangular
metalization or bonding pad 240 thereon. This pad is used to bond
the resulting helical inductor to other circuits. A hole 241 is
formed in a corner of the pad 240. The bottom side 200 of the layer
A has a small rectangular interconnection pad 220 formed thereon.
The hole 241 previously mentioned in connection with the top side
207 is the same hole 241 that passes through the interconnection
pad 220. If one where to flip the layer A from the bottom side 200
to the top side 207, by rotating the layer to the left as it is
being flipped, the configuration as depicted in FIG. 3a, for the
top side 207 will be seen. The supporting tape between the
conductive portions 220 and 240 constitutes the ceramic tape
previously discussed which is magnetically permeable but
electrically insulative.
A similar relationship between top and bottom sides exists for
layer B. The layer B has a single, discontinuous loop formed on the
bottom side 201. Interconnection pads 221 and 222 are positioned in
spaced perpendicular relationship to each other. A hole 243 is
formed through the interconnection pad 221. This hole, as well as
the previously mentioned hole 241 is formed at 38 in FIG. 1a. The
top side of the layer B has a single interconnection pad 242 with
the hole 243 passing therethrough. Thus, the hole 243 passes
through the interconnection pad 242 on the top side as well as the
interconnection pad 243 of the loop which is formed on the bottom
side of layer B. To visualize the relationship between the top and
bottom sides in three dimensions, one must visualize the bottom
side 201 being flipped over to the opposite top side, the flipping
occuring by turning the layer B over to the left in which case it
will be clear that the hole 423 in the top side is positioned in
registry with the hole 243 of the bottom side. This relationship
between top and bottom sides of the layers in the lamination 56
exists for the upper and lower depicted layers in FIG. 3a. As a
result, seven layers are shown. When the layers are arranged in
juxtaposition with one another, then the following relationship
exists between interconnecting members.
The upper most layer 240 is connected with an underside
interconnection pad 220, through a conductor existing in the
opening 241. In the present invention, the conductor referred to is
actually fused metal that is contributed by the bonding pad 240 on
the top side and the interconnection pad 220 on the bottom side.
The interconnection pad 220 contacts the interconnection pad 242 of
top side 208 in the next lower layer B. Fused metal from the hole
243 forms a conductive path between the pad 242 and the pad 221 on
the under side 201. A thin loop or conductor in the form of a
generally U-shaped configuration continues the conductive path to
the pad 222 at the other end of the loop. Thus far, a conductive
path has been formed between the bonding pad 240 and the first turn
of the resulting helical inductor laminate inductor 56. Next comes
the top side 209 of the next layer. When so situated in the
laminated structure, contact is made between the pad 222 of the
previously mentioned loop and an interconnection pad 245 in 209. A
hole 244 passes through the interconnection pad 245 and a similarly
situated interconnection pad 223 on the bottom side of this layer.
Fused metal during the compression step causes the interconnection
of the pads. A second loop exists on the bottom layer 202 which
terminates in another interconnection pad 224 at the opposite end
of the loop. Thus, a conductive path has been completed through two
windings of the helical inductor. The top side of the next layer
lays in juxtaposition with the bottom layer 202 of the layer above
it. More specifically, the interconnection pad 224 of side 202
contacts the interconnection pad 246 of top side 210 in the forth
layer. A hole 247 is formed through the layer and an
interconnection pad 225 on the bottom side 203 of this bottom
layer. The interconnection pad 225 is connected to a third loop or
winding that terminates outwardly in an interconnection pad 226.
Thus far described, a conductive pad has been formed between the
bonding pad 240 and the interconnection pad 226 thus completing
three windings of the helical inductor. The next lower lamination
has its top side 211 positioned against the lower side 203 of the
lamination above it. Particularly, the previously mentioned
interconnection pad 226 contacts the interconnection pad 248 on the
top side 211. A hole 249 passes through the interconnection pad 248
and an interconnection pad 227 on the bottom side 204 of the fifth
layer. A conductive loop or winding connects the interconnection
pad 227 to the interconnection pad 228 at the opposite end of the
winding. The hole 249 again permits the fusing of metal between the
interconnection pads 248 and 227 on opposite sides of the layer
thus creating a conductive path through the layer. Thus far
described, an electrical path has been described between the
bonding pad 240 and a fourth winding of the helical inductor.
Continuing with the next lower lamination, the top side 212 of the
sixth layer includes an interconnection pad 250 with a hole 251
formed therein. This hole passes through a similarly disposed
interconnection pad 229 on the bottom side of the sixth layer. As
in other cases, an additional winding is formed on this bottom
side. The hole 251 again provides space for fused metal from the
interconnection pads 250 and 229 to interconnect these pads through
the layer. The interconnection pad 230 at one end of the fifth
winding contacts an interconnection pad 252 on the top side of the
seventh layer. A hole 253 is formed through the interconnection pad
253. This hole passes through the rectangular metalization or
bonding pad 231 which exists on the bottom side of the seventh
layer. Due to the presence of this hole, metal fuses between the
interconnection pad 252 and the bonding pad 206 to complete an
electrical path through the complete helical inductor including the
five turns on the bottom sides of the second-sixth layers of the
structure.
It is most significant to note that the present invention includes
the inventive concept of using an identical configuration on the
bottom sides of previously discussed second-sixth layers in FIG.
3a. Further, the same simple interconnection pad exists on the top
side of these layers. Thus, by merely using seven identical layers
a helix can be formed by rotating each layer or lamination by
90.degree. with respect to the one above it and below it. The top
most or first layer A and the last or bottom most layer, which is
the right most layer in FIG. 3a, are identical. They only differ in
that the top side of the top most layer A is reversed in
relationship to the bottom most layer. This type of modular
approach expedites the fabrication of the device and results in
minimum cost considerations.
Referring now to FIGS. 3b, 3c, 3d and 5b we outline two possible
methods for providing terminations for the monolithic inductor. One
specie comprises one kovar cross-shaped (FIG. 3b) or u-shaped
(FIGS. 5b and 5c) sheet attached to each end of the monolithic
inductor 67. The kovar metal sheet termination 69 or a sheet made
out of a similar metal such as gold or silver or platinum or lead
tin is attached to the bonding pad 73 at the end of the inductor
either by soldering 69 and binding the tabs around the end of the
inductor or welding 69 to the bonding pad 73. Bonding pads 73 and
bonding pads 72 can be coated with high temperature solder and then
joined. This joining may be accomplished by an electric heating
means 70. One way of attaching the terminations 69 formed onto the
inductor 67 and thus forming 68 is to use the combination of
members 71 and 70 as a high resistance heating element passing
current thereinto and thus joining the terminations to the inductor
by soldering. Another possibility is to use member 71 as the
electrodes of a high resistance weld apparatus and thus weld the
end terminations 69 to the attachment pad 73. An alternative
process is to dip each end of the monolithic inductor 67 into a
thixotropic paste 74 and coat each end thereof as illustrated in
75. The entire structure 75 is then sintered in a high temperature
oven. Several compositions of paste 74 are acceptable. Among these
are gold, platinum-gold, platinum-silver, copper, palladium-silver,
molymanganese, and lead-tin. The final product of this process is
so illustrated in FIG. 3e.
On FIG. 4 is shown a flow chart of the manufacturing process by
substractive etching. Summarizing this process, first the tape is
coated with a layer of metal. This may be done either by spraying
of a thick-film thixotropic paste or by vacuum deposition of a
metal by thin-film technique. Both sides of the tape are coated.
Next each side of the tape is coated with photoresist. This may be
done by spraying or other dipping or bathing means. The photoresist
is exposed in a pattern appositioned to both sides as illustrated
in step 82. Next the photoresist is developed in the proper
solution and then the tape is immersed in an etchant to remove the
unwanted areas of metal. Upon completion of this step 83 the
photoresist is removed from the metallization in step 84.
On step 86 one electrode layer is aligned and juxtaposed to a layer
comprising one layer of the inductor. After completion of the
previous step 86 the next layer is rotated 90.degree. and alligned
and juxtaposed. This step 87 is repeated n times, n being
proportional to the value of the inductance desired. Finally, the
top electrode layer is properly alligned and juxtaposed, step 89.
The alligned and juxtaposed layers including the electrode layers
are then compressed under pressure. The compressed layers are
sintered in a high temperature kiln at temperatures above
1,500.degree. C. The center sections are then cut into single
inductors utilizing a diamond saw, step 92. Next, the electrodes
are applied to the inductors, step 93. In the final step of
manufacture of these inductors the electrodes are either welded
onto the pad as shown in step 94, sintered onto the inductor as
shown in step 95, or soldered on as shown in step 96.
FIG. 5a provides an exploded view of the monolithic microminiature
inductor without end terminations. FIG. 5a also shows the various
building blocks necessary to construct a complete inductor. Note
that each building block has only one hole for interconnection.
Tracing the electrical path from the termination bonding pad 119 is
FIG. 5d, the metallization may be followed through hole 114 to the
pad 109 in FIG. 5a which is connected to the conductive pad 111.
This pad 111 is then connected to inductive pad 109 of the next
layer 201. Pad 112 is connected via hole 112 to pad 109. Pad 109 of
layer 101 is connected via path 110 through a metallized hole in
102 to conductive pad 113. The conductive pad 113 of layer 102 is
connected to pad 109 of layer 103 and then to pad 111 thereon. The
conductive pad 111 of layer 103 connects to pad 109 of layer 104
which connects to pad 111 thereon. Pad 111 of layer 104 connects to
pad 116 shown in FIG. 5f. Metallized hole 115 interconnects pad 116
of layer 105 with termination bonding pad 120 thereon.
In FIG. 5b the end termination comprising kovar metal is
illustrated. This end termination 122 has on its inner central face
a solder material 123 for connection and joining to a termination
bonding pad 120 or 119. Soldering or welding may be accomplished by
applying the appropriate amount of thermal power to the portion
124. In the case of welding, a current is passed through the
termination 122 at the point 124.
Turning further to FIGS. 6a and 6b the intricacies of
interconnecting a metallization pad on the surface of one layer or
segment to a metallization pad on the surface of another layer or
segment are described. FIG. 6a shows two layers 102 and 103 of
ceramic tape with metalizations 109 and 111 thereon and
through-hole 112 therein before lamination and interconnection.
Ceramic tape 103 is positioned and alligned on top of ceramic tape
102. Appositioned onto ceramic tape 102 is a metallization
connection pad 111. This metalization connection pad 111 is
connected to metalization connection pad 109 through aperture or
hole 112. It is noted that hole 112 is metalized throughout. FIG.
6b shows two ceramic tape layers appositioned to each other and
appropriately compressed. What is shown in ceramic tape 103 on top
of and juxtaposed to the ceramic tape 102. Metallized hole 112 is
compressed into metallized connection layer and pad 111 forming a
continuous conductive path from 111 to pad 109 with the
metalization in hole 112 serving as the connecting means.
It is to be understood that barium titanate (BaTiO.sub.3) may also
be used in the slurry to enhance the properties of the refractory
ceramic.
The inventor wishes it to be understood furthermore that he does
not desire to be limited to the exact detail of construction shown
and described herein for obvious modifications will occur to a
person skilled in this art.
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