U.S. patent number 3,803,708 [Application Number 05/332,791] was granted by the patent office on 1974-04-16 for method for making a resistor.
This patent grant is currently assigned to Matsushita Electric Industrial Co., Limited. Invention is credited to Masaki Aoki, Mitsuo Wada.
United States Patent |
3,803,708 |
Wada , et al. |
April 16, 1974 |
METHOD FOR MAKING A RESISTOR
Abstract
This disclosure provides a method for making a resistor
comprising at least one resistor film and electrode films adhered
to the inside surface of a hollow substrate such as one having a
cylindrical form. The method includes attaching a flexible transfer
film having resistor and electrode pastes thereon to the inside
surface of the substrate and burning out the transfer film so as to
fix the pastes onto the inside surface as films. The method,
therefore, is very easy to carry out and makes it possible to
obtain a desired pattern of resistor film or films easily.
Inventors: |
Wada; Mitsuo (Suita,
JA), Aoki; Masaki (Neyagawa, JA) |
Assignee: |
Matsushita Electric Industrial Co.,
Limited (Osaka, JA)
|
Family
ID: |
23299866 |
Appl.
No.: |
05/332,791 |
Filed: |
February 16, 1973 |
Current U.S.
Class: |
29/620; 338/258;
338/333; 29/423; 338/294 |
Current CPC
Class: |
H01C
17/281 (20130101); H01C 17/065 (20130101); H01C
17/07 (20130101); Y10T 29/49099 (20150115); Y10T
29/4981 (20150115) |
Current International
Class: |
H01C
17/06 (20060101); H01C 17/065 (20060101); H01C
17/07 (20060101); H01C 17/28 (20060101); H01c
007/00 (); H01c 017/00 () |
Field of
Search: |
;29/620,621,613,423,424
;338/290,294,310,333,258 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Lanham; Charles W.
Assistant Examiner: Di Palma; Victor A.
Attorney, Agent or Firm: Wenderoth, Lind & Ponack
Claims
What we claim is:
1. A method for making a resistor comprising: applying a resistor
paste and an electrode paste in a given pattern of at least one
resistor film with two electrode films in contact therewith on one
surface of a flexible transfer film which will burn out when
heated; attaching said flexible transfer film to an inside surface
of a hollow heat-resistant substrate; heating said heat-resistant
substrate with said transfer film therein so as to burn out said
transfer film and to transfer said resistor paste and said
electrode paste to said inside surface of said heat-resistant
substrate in the form of said at least one resistor film and said
electrode films, respectively; and connecting electrical conductors
to said electrode films.
2. A method as claimed in claim 1, wherein said transfer film is
placed on a carrier sheet prior to having the pastes applied
thereto to form a transfer sheet and is separated from said carrier
sheet after the pastes have been applied thereto and prior to being
attached to said inside surface of said hollow heat resistant
substrate.
3. A method as claimed in claim 1, wherein a flexible synthetic
resin film is used for said transfer film.
4. A method as claimed in claim 3, wherein a synthetic resin film
having a thickness of 1 to 100 microns is used for said flexible
synthetic resin film.
5. A method as claimed in claim 3, wherein a film consisting
essentially of polyvinyl butylate resin having a thickness of 5 to
50 microns is used for said flexible synthetic resin film.
6. A method as claimed in claim 1, wherein said resistor paste and
said electrode paste are applied to said flexible transfer film by
a screen printing method.
7. A method as claimed in claim 1, wherein said transfer film is
attached to said inside surface of said hollow heat-resistant
substrate with the side of said transfer film which is opposite to
the side thereof having said resistor paste and said electrode
paste thereon against the inside surface of said heat-resistant
substrate.
8. A method as claimed in claim 1, wherein said transfer film is
attached to said inside surface of said hollow heat-resistant
substrate by placing a thin liquid layer on the inside surface of
said hollow heat-resistant substrate and adhering said transfer
film to the inside surface by the surface tension of the thin
liquid layer.
9. A method as claimed in claim 1, wherein said heat-resistant
substrate with said transfer film thereon is heated at a
temperature higher than 500.degree.C.
10. A method as claimed in claim 1, wherein the inside surface of
said heat-resistant substrate is further coated with a thin layer
of organic resin after the heating step so as to cover said
resistor film and said electrode films therewith.
11. A method as claimed in claim 1, wherein said heat-resistant
substrate has an inside surface which is curved.
12. A method as claimed in claim 1, wherein said heat-resistant
substrate has a cylindrical form.
13. A method as claimed in claim 1, further comprising air tightly
sealing both end openings of the heat-resistant substrate after the
heating step.
14. Method as claimed in claim 1, wherein a paste comprising
cadmium oxide powder, a glass frit and a liquid vehicle is used as
a material for said resistor paste.
15. Method as claimed in claim 1, wherein said electrode paste is
applied to said transfer film in a pattern for forming plural
resistor film segments.
Description
This invention relates to a method for making a resistor comprising
at least one resistor film and electrode films adhered to the
inside surface of a hollow substrate.
A few types of resistors of this kind have already been developed.
This type of resister will hereinafter be called the "inside type."
It is known that resistors of the inside type are superior to a
resistor comprising a resistor film and electrode films adhered to
the outside surface of an insulating substrate such as one having a
cylindrical form, which type is called the "outside type", in that
the hollow substrate acts as a film supporter and as a protector
for protecting the resistor films from environmental
conditions.
One inside type resistor is made as follows. A resistor film is
deposited on the entire inside surface of an insulating hollow
substrate such one having a cylindrical form by spraying raw
resistor liquid, in the case of a metal oxide, or
vacuum-evaporating metal or alloy in the case of a metal or alloy
resistor film. Then, the resistor film on portions of the hollow
substrate are removed by cutting, e.g., spirally, or in a similar
manner.
In this method, however, there are disadvantages that it is very
difficult to remove portions of the resistor film to leave a
complicated pattern of the resistor film and a complicated cutting
method is required for making a desired pattern and trimming the
resistance value. These cutting steps are very difficult because
they must be carried out on the inside surface of the hollow
substrate. Moreover, waste of resistor material caused by the
cutting step cannot be overlooked, and the production yield thereof
is very low.
However, a complicated pattern of the resistor film is very much
desired, e.g., obtaining a desired resistance value, providing a
resistor film which does not suffer a surface corona discharge,
obtaining plural resistor elements, controlling the temperature
distribution of the resistor, and so forth. These are even more
desirable features where the resistor is used under high power
consumption conditions.
Therefore, a principal object of this invention is to provide a
method for making a resistor comprising at least one resistor film
and electrode films adhered to the inside surface of a hollow
substrate, in which it is very easy to carry out the method, it is
very easy to make a desired pattern of the resistor film, and the
method requires a small amount of resistor material and makes
passible inexpensive production and high production yield.
Another object of this invention is to provide a method for making
such a resistor which is stable with respect to environmental
conditions such as humidity.
These and other objects and the features of this invention will
become apparent upon consideration of the following detailed
description taken together with the accompanying drawings, in
which:
FIG. 1 is a perspective view of a transfer film on a carrier sheet
and having one pattern of resistor paste and electrode paste
applied thereto;
FIG. 2 is a perspective view, partially cut away, of a
heat-resistant hollow substrate having a cylindrical form having a
transfer film attached thereto;
FIG. 3 is a cross-sectional view of a resistor which is made by the
method of this invention and which has further been air-tightly
sealed with a further coating on the inside surface;
FIG. 4 is a cross-sectional view of a resistor made by the method
of this invention which is air-tightly sealed and is provided with
a further coating on the inside surface of the end caps;
FIG. 5 is a perspective view of a transfer film having another
pattern of resistor paste thereon;
FIG. 6 is a graph showing the surface temperature distribution in
the direction of the length of a resistor made by the method of
this invention using a pattern of resistor film as shown in FIG. 5;
and
FIG. 7 is a perspective view of a transfer film having still
another pattern of resistor paste and electrode paste thereon.
Referring to FIGS. 1 and 2, the method of this invention comprises:
applying a resistor paste 4 and an electrode paste 3 in a given
pattern on one surface of a flexible transfer film 2; attaching the
flexible transfer film 2 to an inside surface 6 of a hollow
heat-resistant substrate 7; heating the heat-resistant substrate 7
with the transfer film 2 attached thereto so as to burn out the
transfer film 2 and to transfer the resistor paste 4 and electrode
paste 3 to the inside surface 6 of the heat-resistant substrate 7
as at least one resistor film and electrode films, respectively;
and connecting electrical conductors 10 to the electrodes.
FIG. 1 shows one example of a substantially flat transfer film 2
having a given pattern of resistor paste 4 and electrode paste 3
applied thereto. These pastes can be applied by using any
techniques. For example, well known methods such as a screen
printing method, a spraying method, a brushing method, a gravure
printing method and a relief printing method can be used. It is
clear that it is very easy to apply the resistor and electrode
pastes even in a complicated pattern on a substantially flat
surface of the transfer film, compared with the direct application
of the pastes to the inside surface of a hollow substrate.
Particularly, the method of this invention exhibits its advantage
when the substrate is a hollow substrate, the inside surface of
which is curved, such as a substrate having a cylindrical form or
an elliptical form. When the inside surface of the hollow substrate
is irregularly curved, it is especially difficult to cut the
resistor film coated on the entire inside surface by using a
conventional method as mentioned beforehand. However, the method of
the present invention can be easily performed even in the case of
such an irregularly curved inside surface. The material which can
be used for the transfer film is a film that can carry the resistor
paste without damaging the pattern of the resistor paste even when
it is rolled or bent so that it can be attached to the inside
surface of the hollow substrate and that can be burned out by a
heating step carried out at a high temperature. It is further
preferred that the transfer film becomes sticky when subjected to
the heating step until the transfer film burns out (e.g., during
heating at a temperature of 70.degree. to 200.degree.C) in order to
adhere the transfer film to the inside surface of the hollow
substrate in a stable manner and in order that the resultant
resistor and electrode films be very strongly fixed to the inside
surface. Preferred materials usable for the transfer film include
e.g. a sythetic resin such as vinyl, polystyrole, polyethylene,
butyrates, cellulose, derivatives of cellulose and mixtures of
these materials. The range of the thickness of the transfer film
depends on the material used for the transfer film. However, it
should be noted that a transfer film having a thickness which is
too small is not suitable because of its mechanical weakness and a
transfer film having a thickness which is too great is also not
suitable because it is very difficult to attach such a thick
transfer film to the inside surface of the hollow substrate along
the curve of the inside surface and also because such a thick
transfer film does not burn out easily during the heating step.
Usually, the preferred range of the thickness of the transfer film
is between 1 micron and 100 microns. For example, a polyvinyl
butyrate resin film having a thickness of 5 to 50 microns is very
suitable for the transfer film.
If necessary, the resistor paste and the electrode paste in the
given pattern on the transfer film can be checked for pin holes and
cracks. This is a step which is almost impossible to carry out in
the conventional method as described above, because the desired
pattern of a resistor film is made after a complete resistor film
is provided; on the inside surface of a hollow substrate according
to the conventional method. In order to make possible such a check
during the carrying out of the method according to this invention,
it is preferred that the transfer film be light transparent,
although such is not an essential condition. If such a check is
carried out, the production yield which is attributable to this
invention and which is much higher than that of the conventional
method can be still further increased.
In order to make it easy to hold the transfer film temporarily
before it is attached to the inside surface of a hollow substrate,
a carrier sheet 1 as shown in FIG. 1 can be used, although it is
not necessary to use such a carrier sheet. The assembly of a
carrier sheet 1 and a transfer film 2 on said carrier constitutes a
transfer sheet 5. All that is required with the transfer sheet is
that it be easy to strip the transfer film from the carrier sheet
manually or mechanically. If a check of the resistor paste and
electrode paste in the given pattern is required while they are
still on the transfer sheet, it is preferred that the transfer film
and the carrier sheet both be light transparent, although such is
not required.
Any resistor pastes which can be coated on a transfer film in a
given pattern and can be fixed to the substrate by the heating step
can be used for the resistor pastes in the method of this
invention. For example there can be used a resistor paste mainly
comprising conductive particles and glass frit dispersed in a
liquid vehicle and in which the conductive particles are preferably
of metal or metal oxide powder, or a mixture or alloy of these
powders such as silver, palladium, gold, palladium oxide, ruthenium
oxide, indium oxide or cadmium oxide. One typical resistor paste
preferred in the method of this invention comprises, as solid
ingredients, 55 to 90 percent by weight of a mixture consisting
essentially of 20 to 92 percent by weight of finely divided CdO and
8 to 80 percent by weight of finely divided glass frit, and 10 to
45 percent by weight of liquid vehicle, which resistor paste is
very stable during the heating step.
The thickness of a resistor paste applied to the flexible transfer
film according to this invention is preferably 1 to 100 microns in
order to obtain good electric stability and good results in the
successive steps. For obtaining such a thickness, a very good
method for applying the resistor paste to the transfer film is a
screen printing method.
As for the electrode paste, any known electrode pastes can be used.
In forming the pattern of pastes, it is necessary that a portion of
the electrode paste be in contact with the resistor paste.
FIG. 2 shows is a perspective view, partially broken away, of a
hollow substrate 7 having a cylindrical form having a transfer film
already attached thereto.
With respect to the hollow substrate 7, not only such the
cylindrical substrate shown but any hollow substrate having an
irregularly curved inside surface can be used. Any heat resistant
material which can withstand the heat during the heating step and
having a electrically insulating characteristic can be used for the
hollow substrate. For example, ceramics and heat-resistant glasses
such as alumina, forsterite, mullite, zirconia, beryllia steatite,
Pylex (trade name: Corning Glass Works) and dehydro ceramic glass
can be used as a material for the substrate.
In attaching the transfer film to the inside surface 6, it is
necessary that the side of the transfer film which is opposite to
the side thereof having the resistor paste and electrode paste
thereon be against the inside surface 6. If the transfer film is
attached to the inside surface 6 with the side of the transfer film
having the pastes thereon against the inside surface 6, then good
adhesion of the pastes to the inside surface can not be
obtained.
Any suitable technique can be used for attaching the transfer film
to the inside surface 6 of the hollow substrate along the curve of
the inside surface. One method is to use an electrostatic
attractive force, in which an electrostatic charge of one polarity
is applied to the inside surface 6 and an electrostatic charge of
the opposite polarity is applied to the transfer film. Thus, the
inside surface and the transfer film attract each other. Another
method is to attach the transfer film mechanically and forcibly to
the inside surface 6. Still another method which is very preferable
is to use the surface tension of a thin liquid layer interposed
between the inside surface 6 and the transfer film. For inserting
the transfer film into the hollow of the substrate, a rod or
something like that which is smaller in cross-section than the
hollow and can be inserted in the hollow may be necessary.
In carrying out the heating step, the heating temperature and
heating time depend on the kinds of materials used for the transfer
film, substrate and pastes and also on the desired resistance
values. What is required is that the heating step burns out the
transfer film and changes the resistor paste and the electrode
paste to at least one rigid resistor film having a desired
resistance value and electrode films, respectively. As for the
heating temperature, therefore, the maximum heating temperature is
usually higher than 500.degree.C and lower than 900.degree.C. As
for the heating time, it is difficult and is almost useless to
express it in figures, because it depends very much on the factors
as set forth above. Usually, a heating time of at least a few
minutes is required for heating at a maximum temperature.
Electrical conductors 10 can then be connected to the electrode
films.
The thus formed resistor has a resistance value deviating very
little from the desired value. The deviation is much less than in
the case of the conventional method.
FIG. 3 is a cross-sectional view of a resistor which is thus
formed, and in which the inside surface of the heat-resistant
substrate is further coated with a thin layer of organic resin 8 so
as to cover the resistor film and the electrode films for
protecting the resistor film from corona discharge more completely
than when the effect of corona discharge is reduced by designing a
suitable pattern of resistor film and so forth for that purpose.
The material of the thin layer of organic resin can be e.g., epoxy,
phenol, meramin and silicon resin. Furthermore, in FIG. 3, the
hollow substrate is air-tightly sealed at both end openings by end
caps 9. The end caps can be of metal and are connected to
electrical conductors (lead wires) 10. This air-tight sealing is to
improve the electrical characteristics with respect to such
conditions as humidity and load life of the resultant resistor.
However, the provision of these organic resin layer 8 and the end
caps 9 is not required for the resistor to fall within the
inventive scope of this invention. Moreover, in order to further
improve the air-tight sealing, conductive organic paints or solder
can be used to fill the gaps between each end cap and the inside
surface of the substrate.
Further, when protection of the resistor from corona discharge
produced at, e.g., the high voltage side and at the electrical
conductors 10 is required, rubber seal caps 11 can be provided as
shown in FIG. 4.
By designing the pattern of the resistor paste on the transfer film
in a manner as shown in FIG. 5, the voltage load life
characteristics of the resistor can be further improved when it is
applied to e.g. a hollow substrate having a cylindrical form. The
pattern of FIG. 5 is designed in a manner so that the density of
the path of the resistor paste is higher towards the ends than
towards the center. The curve B of FIG. 6 represents the
temperature distribution of a resistor in a cylindrical substrate
and having a pattern as shown in FIG. 5, while the curve A of FIG.
6 represents the temperature distribution of a resistor in a
cylindrical substrate and having a uniform pattern as shown in FIG.
1. The curve B is flat, while the curve A is not. Therefore, the
resistor having the characteristic represented by the curve B has a
longer voltage load life in this respect. The pattern of FIG. 5 can
be formed just as easily as the pattern of FIG. 1. However, the
pattern as of FIG. 5 is difficult to form by the conventional
method as described above.
Moreover, referring to FIG. 7, a plurality of resistor film
segments 4 and electrode film segments 3 can be made as easily as
forming the pattern of FIG. 1. However, a pattern such as that of
FIG. 7 is very difficult or almost impossible to form by the
conventional method as described above.
The following Examples are given to illustrate the invention. In
the Examples, all the possible combinations of the materials usable
for the method of this invention are not illustrated, because it
would require an unduly large number of pages to illustrate all the
possible combinations. However, since the point of this invention
is in the method, this invention should not be limited to the
materials used in the Examples. Similarly, the conception of the
method of this invention should not be limited to the specific
details of the method described in the Examples.
EXAMPLE 1
A flexible transfer film was placed on a carrier paper having a
thickness of about 150 microns. A conventionally prepared glass
frit having a composition of 70 percent by weight of PbO, 8 percent
by weight of ZnO, 12 percent by weight of PbF.sub.2 and 10 percent
by weight of B.sub.2 O.sub.3 was pulverized. The pulverized glass
frit was mixed with CdO powder in a ratio of 40 percent by wieght
of glass frit and 60 percent by weight of CdO. This mixture was
mixed with a liquid vehicle consisting of 20 percent by weight of
cellulose acetate butyrate and 80 percent by weight of carbitol
acetate to form a resistor paste having a composition consisting of
74 percent by weight of the mixture of the glass frit and CdO and
26 percent by weight of the liquid vehicle.
The resistor paste was applied by using a screen printing method to
one surface of the flexible transfer film in a pattern in which the
parts of the pattern were at a uniform pitch as shown in FIG. 1 and
having a total path 225mm long and 1.5mm wide. The transfer film
was polyvinyl butylate resin having a thickness of 15 microns and
was light transparent. The resistor paste had a viscosity of 1200
poises and the surface resistivity of the resistor paste was
adjusted to 10 kilo ohms per square by heating. The printed paste
was then dried in an oven at 60.degree.C for 30 minutes for
evaporating off the liquid vehicle. Thereafter, an electrode paste
mainly comprising Ag-Pd (No. 8151 DuPont, U.S.A.) was applied to
the transfer film having the printed resistor paste thereon in a
form as shown in FIG. 1 and then was dried in a manner the same as
mentioned above in connection with the resistor paste. Then, the
transfer film was stripped from the carrier sheet manually. The
resistor paste on the transfer film was checked for pin holes,
scratches and uniformity of thickness mainly by eye with the aid of
a light beam.
A hollow substrate having a cylindrical form (inside diameter:
12mm; outside diameter: 18mm; length: 100mm) of forsterite ceramic
was prepared. The transfer film was then wound on the surface of an
assist rod having a diameter of 10mm in a manner such that the
surface of the transfer film having the resistor paste thereon was
toward the assist rod. The inside surface of the hollow substrate
was wetted with a thin water layer. The assist rod was inserted
into the hollow of the substrate and was touched to the inside
surface of the hollow substrate and then was rotated slowly with
the assist rod being in contact with the inside surface so as to
attach the transfer film to the curved inside surface with the aid
of the thin water layer in a manner such that the surface of the
transfer film having the resistor paste thereon did not touch the
inside surface. Then, the substrate was heated in an oven at a
temperature of 90.degree.C for 30 minutes so as to soften the
transfer film and increase the adherence of the transfer film to
the inside surface of the hollow substrate. Thereafter, the
substrate with the transfer film was heated in a tunnel furnace at
a maximum temperature of 760.degree.C for 10 minutes. Thus, a
resistor film and electrode films fixed in a desired pattern to the
inside surface of the hollow substrate were obtained.
Then, the inside surface of the hollow substrate except for a
portion of the electrode films was coated with a silicon resin film
by a dipping method and cured at a temperature of 180.degree.C for
2 hours for the purpose of resin curing. Then, metal end caps each
having a lead wire therein were fitted tightly on both ends of the
substrate with the lead wires connected to the electrode films on
the inside of the substrate.
The resistance of this resistor was 1550 kilo ohms.
The voltage load life characteristic of this resistor was measured
and compared with that of a conventional outside type resistor
which had the same resistance (1550 kilo ohms) and had the same
size as the resistor made by the method of this invention, with the
results shown in Table 1.
TABLE 1. Load life test
(for 1000 hours at 70.degree.C under 6 watts)
Initial Resistance resistance change (kilo ohms) (%) This invention
1550 -0.5 Outside type 1550 -4.8
EXAMPLE 2
A resistor was prepared in a similar manner to that in Example 1.
The difference between Example 2 and Example 1 was in the structure
of the air-tight sealing and electrical insulation at both ends of
the hollow substrate as shown in FIG. 4. Both end portions of the
resistor were sealed air-tightly by coating conductive silver paste
thereon. Thereafter, insulation caps of silicon rubber were fitted
on the both ends. A lead wire with an insulation coating extended
outwardly through the center portion of each cap.
A humidity test of this resistor was carried out. The result was
compared with that of a resistor which was not air-tightly sealed,
with the results shown in Table 2. A voltage load life test of the
resultant resistor was carried out. The result was compared with
that of a conventional outside type resistor, with the results
shown in Table 3.
TABLE 2. Humidity test
(90% R.H. at 60.degree.C for 1000 hours)
Initial Resistance Sealing resistance change (kilo ohms) (%)
air-tight 1550 0.3 not air-tight 1550 2.3
TABLE 3. Load life test
(under 90% R.H. and 6 watts at 60.degree.C for 1000 hours)
Initial Resistance resistance change (kilo ohms) (%) This invention
1550 -0.2 Outside type 1550 -3.5
EXAMPLE 3
A resistor was prepared in a similar manner to Example 1. The
difference between Example 3 and Example 1 was in the pattern of
the resistor paste. In this Example 3, a pattern as shown in FIG. 5
was employed. The pitch of the parts of the path of the pattern was
three times higher at an end part than at the center portion as
shown in FIG. 5. By changing not only the pitch but also the width
of the pitch, the length of the path at the center portion was
about three-fifths of the total length of the path. The temperature
distribution of this resistor was measured under an applied power
of 6 watts. The maximum temperature measured was 90.degree.C and
was located at the center part of the resistor. A resistor having
the same size but having a uniform pattern as shown in FIG. 1 had a
maximum temperature of 108.degree.C under the same conditions.
EXAMPLE 4
A resistor was prepared in a similar manner to that in Example 1.
The difference between Example 4 and Example 1 was in the pattern
of the resistor paste and the electrode paste. The pattern was that
of FIG. 7. Thus, a plurality of resistor film segments and
electrode film segments were formed. Four insulated lead wires were
soldered to the electrode film segments.
* * * * *