U.S. patent number 3,788,393 [Application Number 05/248,885] was granted by the patent office on 1974-01-29 for heat exchange system.
This patent grant is currently assigned to The United States of America as represented by the Secretary of the Navy. Invention is credited to Bruno T. Plizak.
United States Patent |
3,788,393 |
Plizak |
January 29, 1974 |
HEAT EXCHANGE SYSTEM
Abstract
Heat transfer is accomplished by having two adjacent chambers
with an oute partition of a first chamber made of heat conductive
material for conducting heat inwardly into the first chamber which
has a coolant liquid flowing through it. A second chamber has a gas
at a pressure higher than the water in the first chamber. A
partition between both chambers is made of a gas porous material so
that the gas in the second chamber penetrates the connecting wall
and flows through the coolant liquid breaking up the formation of
liquid coolant film on the heat conductive material.
Inventors: |
Plizak; Bruno T. (Philadelphia,
PA) |
Assignee: |
The United States of America as
represented by the Secretary of the Navy (Washington,
DC)
|
Family
ID: |
22941102 |
Appl.
No.: |
05/248,885 |
Filed: |
May 1, 1972 |
Current U.S.
Class: |
165/109.1;
361/699; 244/171.8; 165/80.5; 174/15.1; 165/80.4; 165/104.32;
165/185; 244/1R |
Current CPC
Class: |
F28F
3/12 (20130101); F28F 13/02 (20130101) |
Current International
Class: |
F28F
13/02 (20060101); F28F 3/00 (20060101); F28F
3/12 (20060101); F28F 13/00 (20060101); F28f
003/04 (); F28f 013/02 () |
Field of
Search: |
;317/100 ;174/15R
;165/1,105,109,185 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Davis, Jr.; Albert W.
Assistant Examiner: Richter; S. J.
Attorney, Agent or Firm: Sciascia; R. S. Hansen; Henry
McGill; Arthur A.
Claims
What is claimed is:
1. A heat exchanger for dissipating heat from avionic equipment,
comprising:
a first pair of parallel plates;
a continuous sidewall sealingly connected between the peripheries
of said plates to form an enclosure;
a second pair of parallel plates parallelly spaced between said
first pair of plates and sealingly connected at their peripheries
to said sidewall forming thereby one inner and two outer laminated
chambers in said enclosure;
each one of said plates having an opening coextensive with and
aligned with each other opening for communication between opposite
sides of their respective plates;
a pair of gas-porous, liquid-restriction elements contiguously
supported within respective openings of said second pair of
plates;
a pair of heat generative avionic members sealingly supported at
respective openings of said first pair of plates; and
said sidewall further including a pair of inlet openings to
respective ones of said outer chambers for receiving a liquid
coolant, a pair of outlet openings from said respective ones of
said outer chambers for said liquid coolant, and a single inlet
opening to said inner chamber for receiving a gas;
whereby said gas is emitted from said inner chamber through said
pair of elements and said coolant to impinge on the confronting
surfaces of said members.
Description
STATEMENT OF GOVERNMENT INTEREST
The invention described herein may be manufactured and used by or
for The Government of the United States of America for governmental
purposes without the payment of any royalties thereon or
therefor.
BACKGROUND OF THE INVENTION
The present invention generally relates to heat transfer systems
and more particularly to systems suitable for cooling of avionics
equipment by the enhancement of enthalpy and heat of vaporization
of suitable coolants.
Many prior known systems for cooling avionic equipment use
variations of the well-known heat pipe. The heat pipe is a sealed
thermodynamic system relying on internal evaporation and
condensation cycles. It comprises an enclosure, a wicking material
lining the internal walls of the enclosure, and a working fluid for
saturating the wick. One end of the heat pipe is called the
evaporator and serves to absorb heat energy. Vapor formed in the
evaporator is then transported to the other end of the heat pipe
called the condenser. Here the heat is released from the heat pipe
by means of internal condensation of the working fluid to the
internal walls of the heat pipe. The working fluid is then
recirculated to the evaporator end by the capillary action of the
wick where the cycle is repeated.
Certain performance characteristics of the heat pipe including heat
flux handling capacity vary depending on the vertical orientation
of the evaporator end with respect to the condenser. During
aircraft maneuvers this is apt to continually change. Other
limitations of the device include heat extraction dependence on
operating temperature level, sonic vapor flow velocities and fluid
entrainment flow, wick dryout, internal generation of
noncondensable gases and shock and vibration problems. In addition
a high heat dissipating component must be mounted to the heat pipe
by suitable means. This introduces thermal impedances that are
detrimental to any heat transfer system.
SUMMARY OF THE INVENTION
It is therefore a general object of the present invention to
provide an improved system for the cooling of avionics equipment.
It is a further object to provide a system that is independent of
attitude or gravity so as to eliminate variation in operational
characteristics during aircraft maneuvers. Another object is to
provide a system whereby the enthalpy and heat of varporization are
more effectively utilized and controlled. A further object is to
provide a system in which liquid evaporating film ajacent the
surface to be cooled may be more uniformly controlled and reduced
than heretofore known. Additional objects are to improve the
operating temperature level and to obviate other known limitations
on effectiveness of prior systems.
This is accomplished in accordance with the present invention by
providing a heat transfer system in which a liquid coolant is
directly applied to a surface to be cooled and a pressurized gas is
uniformly applied to the surface through a gas porous material
forming a part of an enclosure for the liquid coolant. The porous
material is separated from the surface to be cooled by a finite
distance. The physical characteristics of the porous material are
such that the material will readily permit the passage of gas or
vapor molecules but will restrict the liquid coolant from passing
quickly through the porous material by its surface tension
properties. In addition the gas is at higher pressure and will
restrict the flow of liquid through the porous material. Also, the
gas passes through the porous material in a direction opposite to
that of the liquid coolant and quickly dries any liquid that starts
to seep through the material. The gas on striking the surface to be
cooled reduces the thickness of a liquid evaporating film that
forms on the surface thus improving the heat transfer capability of
the device.
BRIEF DESCRIPTION OF THE DRAWING
FIG. 1 is an embodiment according to the present invention
partially shown in cross section;
FIG. 2 is a view along the line 2--2 of FIG. 1;
FIG. 3 is an alternate embodiment of the present invention
partially shown in cross section; and
FIG. 4 is a view of the alternate embodiment along the lines 4--4
of FIG. 3 .
DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring now to FIGS. 1 and 2 there is shown a first embodiment 10
having liquid coolant lines 11 which may be identical and comprised
of hoses or piping for supplying a liquid coolant such as water
through openings 12 of a plate 14. Plate 14 is secured to heat
transfer panels 15 by means of screws 16. The panels 15 are secured
to sidewalls 17 by any conventional means such as screws (not
shown). The plate 14 can be metallic and has four shoulders 18
holding one end of porous membrane panels 19 in place. The porous
membrane panels 19 can be a material such as brass or copper and
can be matched to the gas and coolant used to permit flow of the
gas and restrict flow of the coolant therethrough. Such items are
readily available commercially.
The other end of porous membranes 19 is held in place by the
shoulders 25 of plate 26. Openings 27 in plate 26 are used for
discharging through lines 28 which may be comprised of hoses or
piping. Enclosures 29 are formed by surrounding plates 14 and 26,
porous membrane 19, heat conductor 15 and sidewalls 17.
An inlet 25 receives a gas line 36 which may be comprised of a hose
or piping. Gas such as air flows into an opening 36 where it is
blocked at the far end by the plate 26. The plate 26 can be
metallic and differs noticeably from plate 14 in that there is no
aperture similar to 35 for the flow of gas. The gas is regulated to
a higher pressure than that of the liquid coolant and the porous
membranes 19 permit passage of the gas therethrough into enclosures
or chambers 29. High heat flux components 37 are connected to
conducting plate 15 by means of brazing or screws or any other
well-known method. The high heat flux component 37 may comprise a
transistor or integrated circuit chip and has electrical leads
connected thereto (not shown).
The operation of the device will now be explained with reference to
FIGS. 1 and 2. High heat flux generators 37 conduct heat through
conductor surface 15 into enclosures 29. The liquid coolant such as
water is supplied to enclosure 29 for removing heat from the inner
surface of conducting plate 15. A gas such as air is supplied to
enclosure 36 through opening 35 and being regulated to a higher
pressure than that of the liquid coolant flows through gas porous
plates 19 and the liquid coolant. The gas then impinges against the
inner surface of conducting plate 15 to dissipate liquid film
formed on the inner surface of plate 15 thereby enhancing the heat
removal by the liquid coolant. Much of the liquid coolant becomes
vapor and the liquid coolant, vapor and gas are removed through
outlets 27 over lines 28. The lines 28 may discharge either
overboard in an open loop system or to a condenser for liquifying
the vapor and then to a vent for removing gases before recycling.
Neither the condenser nor the venting is shown as neither comprise
a part of this invention and are not required for operation of the
device in an open loop cycle operation.
FIGS. 3 and 4 show an alternate embodiment of the present
invention. Like components are given the same numerals as those
described in FIGS. 1 and 2 and these components will not be further
described. A plate 51 which may be solid metal such as copper or
brass is bonded to porous material 52 which has a circular
cross-sectional area as shown in FIG. 4. The porous material 52 may
be made out of copper or brass or any suitable compatible material
for bonding with plate 51. The porous material 52 has the same
physical characteristics as membrane 19 of FIG. 1. A pair of plates
53 have high heat flux components 37 mounted to them. These plates
differ from plate 15 in that they have a circular cutout 54 with a
similar cross section as porous component 52.
The operation of the device shown in FIGS. 3 and 4 is somewhat
similar to that of FIGS. 1 and 2, differing in that the gas
entering inlet 35 is blocked by plate 51 and only enters enclosure
29 through porous material 52. This directs the gas directly to the
bottom plate of heat flux generator 37 for dissipation of the
liquid film. The size of cutout 54 is chosen so that the plate 53
does not contact the portion of generator 37 where the majority of
thermal cooling takes place.
There has therefore been shown a highly effective heat extraction,
heat transfer and cooling technique that is applicable to cooling
high heat flux surfaces such as mounting boards, printed circuit
boards, chassis, etc., which are used for mounting high flux
density devices, parts, components, etc., in a limited space. It
provides a method whereby the enthalpy and heat evaporization of
coolants are more effectively utilized, enhanced and controlled for
extracting waste heat from hot high heat flux surfaces. It
increases the rate of evaporation and consequently the rate of heat
extraction by incorporating a porous material passing a gas under
pressure to the surface from which the heat is to be extracted. The
coolant is kept in the chamber in which the heat is to be extracted
by a material porous to gas and highly resistant to liquids.
Additional features are the utilization of the suitable open pore
porous structures which are separated from the surface from which
heat is to be extracted and used to control and more effectively
utilize the heat evaporization of coolants. The porous structure
separates the gas flow into high velocity air jets for impaction
with the surface to be cooled. This breaks up the coolant film at
the hot surface, exposes more particle or coolant surface for heat
absorption and evaporation. The gas also acts as a vehicle for
removing coolant vapors. The porous material acting as gas jet
impactors reduces the coolant film resistant to heat transfer with
the resultant increase in the overall effective film coefficient of
heat transfer.
It will be understood that various changes in the details,
materials, steps and arrangements of parts, which have been herein
described and illustrated in order to explain the nature of the
invention, may be made by those skilled in the art within the
principle and scope of the invention as expressed in the appended
claims.
* * * * *