U.S. patent number 3,772,105 [Application Number 05/235,176] was granted by the patent office on 1973-11-13 for continuous etching process.
This patent grant is currently assigned to Shipley Company, Inc.. Invention is credited to Charles R. Shipley.
United States Patent |
3,772,105 |
Shipley |
November 13, 1973 |
CONTINUOUS ETCHING PROCESS
Abstract
This invention relates to a continuous process for etching
cuprous metal which process comprises etching copper with the
etchants of the invention, precipitation and removal of the copper
from the etchant and regeneration of the etchant making the same
available for further use. The etchant used comprises complexed
cupric ions as an oxidant. In practice, the etchant is used to etch
copper until the dissolved copper concentration reaches a
predetermined point, typically from 10 to 24 ounces per gallon of
solution. At this point, the etchant is circulated in a loop where
it is treated to precipitate dissolved copper, the precipitate is
removed and the etchant is returned to the etching apparatus for
further use.
Inventors: |
Shipley; Charles R. (Newton,
MA) |
Assignee: |
Shipley Company, Inc. (Newton,
MA)
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Family
ID: |
26737321 |
Appl.
No.: |
05/235,176 |
Filed: |
March 16, 1972 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
|
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58170 |
Jul 24, 1970 |
3650958 |
|
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Current U.S.
Class: |
216/93; 216/105;
216/92; 216/106 |
Current CPC
Class: |
C23F
1/46 (20130101) |
Current International
Class: |
C23F
1/46 (20060101); C23f 001/00 () |
Field of
Search: |
;156/3,8,18,19,345
;96/36.2 ;252/79,1 ;134/13 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Powell; William A.
Parent Case Text
CROSS REFERENCE TO RELATED APPLICATIONS
This application is a continuation-in-part of copending U.S. Pat.
application Ser. No. 58,170 filed July 24, 1970, now U.S. Pat. No.
3,650,958 in the name of Charles R. Shipley, Jr.
Claims
I claim:
1. A process for continuously etching copper comprising dissolving
copper in an etchant and removing formed copper precipitate in an
amount sufficient to prevent saturation of the etchant with said
precipitate, said etchant comprising a source of cupric ions as an
oxidant for copper and at least one non-fuming complexing agent for
said cupric ions, said complexing agent being capable of forming a
solution soluble copper (II) complex at solution pH and said copper
(II) complex being capable of sufficient dissociation in solution
under operating conditions to permit etching of copper at a rate of
at least 0.1 mils per minute, said etching solution having pH of
from about 4 to 13.
2. The process of claim 1 containing as an exaltant for said
etchant at least one member selected from the group of chloride
ions, bromide ions and ammonium ions.
3. The process of claim 2 where the etchant has a pH varying
between about 6 and 8.
4. The process of claim 2 where the etchant has a pH varying
between about 7 and 7.8.
5. The process of claim 3 where the etchant contains cupric ions
present initially in an amount of from 0.1 to 1.2 moles per liter
and complexing agent present in an amount sufficient to at least
complex with all of said cupric ions.
6. The process of claim 3 where the etchant contains chloride or
bromide ions in an amount of from 0.2 to 2.0 moles per liter of
solution.
7. The process of claim 3 where the etchant also contains ammonium
ions in an amount of from 0.5 to 5.0 moles per liter of
solution.
8. The process of claim 3 where the etchant contains chloride ions
in an amount of from 0.2 to 2.0 moles per liter of solution and
ammonium ions in an amount of from 0.5 to 5.0 moles per liter of
solution.
9. The process of claim 8 where in the etchant, the log of the
stability constant (K.sub.1) of the copper (II) complex does not
exceed about 18 at 25.degree. C.
10. The process of claim 8 where the etchant contains an amine
complexing agent.
11. The process of claim 8 where the etchant contains as a
complexing agent an alkanolamine.
12. The process of claim 3 comprising continuously etching copper
with said etchant, enhancing the precipitation of dissolved copper
from solution by at least one of the steps of cooling said etchant
and lowering the pH of said etchant, removing precipitate from said
etchant, replenishing said etchant including adjustment of pH to
the extent necessary, etching additional copper with said etchant
and repeating said process.
13. The process of claim 12 where the etchant contains from about
10 to 24 ounces of dissolved copper per gallon of solution prior to
the step of enhancing the precipitation of dissolved copper.
14. The process of claim 12 where the etchant contains from about
14 to 20 ounces of dissolved copper per gallon of solution prior to
the step of enhancing the precipitation of dissolved copper from
solution.
15. The process of claim 12 where copper is precipitated by cooling
the etchant and the addition of hydrochloric acid.
16. The process of claim 15 where the etchant is cooled to a
maximum of 25.degree. F.
17. The process of claim 15 where the etchant is cooled between
5.degree. and 10.degree. F.
18. The process of claim 15 where the acid is added in an amount of
from 1 to 3 moles per mole of copper to be removed.
19. The process of claim 15 where the acid is added in an amount of
from 1 to 2 moles per mole of copper to be removed.
20. The process of claim 15 where the dissolved copper content in
the etchant is reduced to no less than 4 ounces of copper per
gallon of etchant.
21. The process of claim 15 where the etchant is heated back to
operating temperature and the etchant is aerated to convert cuprous
ions to cupric form.
22. The process of claim 15 where replenishers are added to the
etchant to replace those additives lost through drag-out prior to
repeating the etching process.
23. The process of claim 15 where the copper is etched, the etchant
is passed out of a spray etcher containing said etchant to remove
said precipitate, and recycled back to said etcher.
24. The process of claim 15 where the etchant is passed
continuously from an etcher containing said etchant to means to
remove precipitate and back to said etcher and where copper is
dissolved at about the same rate as it is removed as a
precipitate.
25. The process of claim 24 where copper is removed in
sedimentation tanks.
26. The process of claim 24 where copper is removed by
centrifugation.
27. The process of claim 24 where copper is removed by filtration.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to a process for continuously etching
cupreous metal using an etchant containing complexed cupric ions as
an oxidant.
2. Description of the Prior Art
Solutions of cupric ions and complexing agents have been used to
dissolve metal, especially copper and copper alloys. This is
desirable, for example, in place of ordinary machining in order to
remove specified amounts of these metals from surfaces of fragile
or peculiarly shaped objects. A more wide spread application of
this technique is the production of electrical printed circuits. In
this application, a resist or mask in the form of the desired
circuit is placed over a copper film laminated to a base, and the
partially masked copper film is placed in contact with an etchant.
The copper surface not covered by the resist is dissolved while the
copper covered by the resist remains to form the desired circuit
pattern.
One such cupric etchant is the well known, highly acidic cupric
chloride etchant dissolved in hydrochloric acid. Another such
etching solution is disclosed as a secondary etchant in U.S. Pat.
No. 3,231,503. This patent teaches a primary etchant solution of a
chlorite such as sodium chlorite in an alkaline solution containing
an ammonium salt as a complexing agent for the metal stripped. The
etchant is used at a pH of from 8 to 13, preferably above pH 9. It
is disclosed in said patent that the useful life of the etchant can
be extended upon exhaustion of the primary oxidant; i.e., the
chlorite by increasing temperature to utilize dissolved copper in
the cupric state as a secondary oxidant for further dissolution of
copper converting the cupric copper to the cuprous form in the
process. Consequently, at this stage of the etching operation, the
etchant solution is a cupric ion-ammoniacal etchant as it comprises
an ammonium chloride solution of cupric ions as the oxidant having
a pH between about 9 and 13. The ammonia is the complexing agent
holding copper in solution.
An improved cupric ion type etchant is disclosed in co-pending U.S.
Pat. application Ser. No. 58,170 filed July 24, 1970, now U.S. Pat.
No. 3,650,958 in the name of Charles R. Shipley, Jr. This etchant
essentially comprises cupric ions and a non-fuming complexing agent
to maintain said cupric ions and dissolved copper in solution,
preferably an amine complexing agent capable of forming a solution
soluble copper (II) complex, and preferably, a source of chloride
or bromide ions. Though capable of operating within a broad range
of pH dependent upon the selection of the complexing agent, the
etchant is preferably an essentially neutral etchant operating
within a pH range of 7 to 8. The etchants treated herein are
believed to be an improvement over those of the aforesaid U.S. Pat.
No. 3,231,503 because they are non-fuming, thereby avoiding noxious
fumes and in addition, have the capacity of operating within the
preferred pH range of 7 to 8 within which range, they do not attack
materials used in the manufacture of printed circuit boards such as
resists and the like.
In use of the aforesaid etchants, the metal e.g., copper is
dissolved by one mole of the cupric ion oxidizing one mole of
elemental copper to form two moles of cuprous ion. This continues
until the rate of dissolution decreases to an unacceptable
commercial level due to saturation with dissolved copper. As a
result of high concentration of copper, the etching rate is
substantially decreased and copper begins to precipitate from
solution in a form believed to be either the oxide or hydroxide of
copper. If left in the etchant, etching would stop because of
saturation of the solution and the etching equipment would become
clogged by the heavy, somewhat gelatinous precipitate.
The spent etchant as described above, cannot be readily discarded
because of strict code regulations prohibiting the dumping of
materials which adversely effect the ecology. The dumping of
copper, as an example, is generally prohibited. Moreover, dumping
of the spent etchant is also economically undesirable because the
etchant contains materials that have intrinsic value. For example,
copper dissolved in solution has value as scrap metal or as a raw
material for preparation of fresh etchant. The complexing agent for
the copper is also of value and it would be highly desirable to
recover and/or re-use this material. Various methods have been
proposed for treatment of spent etchant. For example, it has been
proposed to vaporize the water and collect the solids. However,
this method is uneconomical and the recovered solids have to be
further treated to recover their components in useful form. A
further method proposed in the prior art for treating spent etchant
of the ammonium persulphate type rather than the type treated by
the process disclosed herein, comprises electroplating all copper
from solution. This method is generally unacceptable because it has
for an object removal of all copper to permit dumping. The cost of
removing the last remaining parts of copper from solution is
expensive and time consuming. Furthermore, the remaining
persulphate may be destroyed to a degree by the process, thereby
preventing full utilization of the remaining oxidant.
SUMMARY OF THE INVENTION
The subject invention provides a process for etching copper
utilizing the aforesaid etchants comprising complexed cupric ions
which process is continuous, regenerates and re-uses spent etchant
thereby avoiding the problem of dumping spent etchant and the cost
of providing fresh etchant, and permits recovery of dissolved
copper in a commercially useable form.
The etchants contemplated by the subject invention are those
comprising complexed cupric ions as an oxidant, preferably using an
amine complexing agent, and also containing ammonium and chloride
or bromide ions. The preferred etchants are those defined in the
aforesaid U.S. Pat. application Ser. No. 58,170.
In practice, the aforesaid etchants are used to etch copper until
the concentration of dissolved copper in solution reaches a
predetermined point, which concentration may be the saturation
point of the copper in solution, the point where the etching rate
decreases due to the presence of dissolved copper, or any other
convenient point, but preferably a concentration range of from 10
to 24 ounces of dissolved copper per gallon of solution. The
etchant containing dissolved copper in this predetermined
concentration range is preferably circulated in a closed loop
wherein copper is precipitated, the precipitate is removed by any
convenient means such as by filtration and the etchant is returned
to the etching apparatus in a form suitable for further use with
minor replenishment as necessary.
DESCRIPTION OF THE DRAWINGS
In the drawings:
FIG. 1 represents graphically the relationship between dissolved
copper content and etch rate for a preferred etchant
formulation;
FIG. 2 represents a schematic form, a preferred process in
accordance with the invention; and
FIG. 3 is a schematic representation of apparatus suitable for
performing the process of the invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
The preferred etchants treated in accordance with this invention
are those defined in the aforesaid U.S. Pat. application Ser. No.
58,170 which etch in accordance with the following two
reations:
Cu.sup.+.sup.+ + Cu.degree. .fwdarw. 2Cu.sup.+
2Cu.sup.+ + O.sub.2 .fwdarw. 2Cu.sup.+.sup.+
As presented above, one mole of the divalent copper oxidizes one
mole of metallic copper to two moles of monovalent copper dissolved
in solution. The monovalent copper is continuously converted to the
divalent form by aeration such as by bubbling air through the
solution or by use of a spray etcher. Thus, there is always
sufficient divalent copper available in solution for continuous
etching. The process continues until the total concentration of
copper in solution exceeds that which can be solubilized in
solution resulting in a slow-down of etching and precipitation of a
copper salt. The relationship between etch rate and copper
concentration in the etchant can be seen from reference to FIG. 1
of the drawings where as represented, etch rate peaks at between
about 10 and 18 ounces of dissolved copper per gallon of solution
and then rapidly drops off as concentration increases. The
graphical representation typifies the etchants generally treated in
accordance with the invention but specifically represents the etch
characteristics of the etchant of Example 1 below.
To make the etchant, substantially any cupric salt may be used as a
source of the cupric ion. Typical cupric salts include, by way of
example, cupric sulphate, cupric chloride, cupric nitrate, cupric
acetate and the like. The amount of cupric ion initially in
solution is not critical, may vary within broad limits, and to some
extent, is dependent upon the quantity of complexing agent used. A
preferred range comprises from about 4 to 6 ounces as cupric ion
per gallon of solution.
A complexing agent is preferably used in the make-up of the etchant
and serves two important functions. It solubilizes sufficient
cupric ion to permit etching and further it holds dissolved copper
in solution. As copper is etched, its concentration builds in
solution to the point where the capacity of the complexing agent to
hold additional copper is used up and should begins to precipitate
from solution. In this respect, it shoud be noted that within the
pH range of 4 to 13, cupric salts are fairly insoluble and
insufficient cupric ion could be held in solution to provide a
satisfactory etch rate without the complexing agent. Thus,
increasing the concentration of the cupric ion beyond its normal
solubility limit by means of the addition of the complexing agent
permits addition of sufficient cupric ion to provide a satisfactory
etch rate which is defined for purposes of commercial use as at
least 0.1 mils copper per minute with solution agitation.
The selection of the complexing agent is not critical. One
complexing agent used in the prior art is ammonium hydroxide which
forms a soluble complex with the copper at pH of about at least 8.2
However, the use of ammonium hydroxide as the complexing agent is
least preferred because of the liberation of noxious ammonia fumes
during etching, the resultant loss of this agent by fuming and the
inability to form a copper complex at pH below about 8.2.
Preferably, the complexing agent used is one that is non-fuming so
that it will not liberate appreciable ammonia fumes during the
etching operation. Also, it should form the copper (II) complex
with the cupric ion at the solution pH at which it is desired to
use the etching solution. The complex formed with the cupric ion
should dissociate in solution to an extent that permits etching of
copper at a minimum rate of 0.1 mils per hour. In this respect, it
should be readily apparent that the extent of dissociation of a
complex is dependent upon numerous factors such as solution pH,
solution temperature, concentration of various additives and the
like. Thus, though a particular copper (II) complex may not
dissociate to a sufficient extent under one set of operating
conditions, it may dissociate sufficiently under a different set of
operating conditions to provide a satisfactory etch rate. As a
guideline only, the log of the stability constant (K.sub.1) for a
particular copper (II) complex should not exceed 18 and preferably
should not exceed 12 at 25.degree. C. Stability constants for a
great number of copper (II) complexes are set forth in Martell,
Stability Constants of Metal-Ion Complexes, Special Publication
Number 17, Section II, The Chemical Society, London, 1964,
incorporated herein by reference.
Preferred complexing agents heretofore used with cupric ion to form
an etchant include alkanolamines such as monoethanolamine,
diethanolamine, mono-isopropanolamine, and diisopropanolamine.
The amount of complexing agent used is in excess of that amount
necessary to complex all of the cupric ion initially in solution,
generally at least 1.5 times the amout necessary to complex all of
the cupric ion and preferably, at least that amount capable of
complexing 15 ounces of copper per gallon of solution. The excess
is desirable so as to hold dissolved copper in solution after it is
etched and then oxidized by air to the cupric form.
Ammonium ion in addition to the complexing agent is not required
for the etchants to be operable, but for purposes of this
invention, is desirable as it acts as an exaltant for the etching
rate solubilizing the cuprous ion and is replenished by the process
of the invention. Typical ammonium salts that may be used include
ammonium carbonate, ammonium sulphate, ammonium chloride and the
like. The amount of ammonium salt is not critical and may vary
broadly from no addition to less than that amount which causes
appreciable fuming during the etching operation. The preferred
range comprises between 0.5 moles per liter to 5 moles per liter of
solution and more preferably, from about 1 to 2 moles per liter of
solution.
Chloride and/or bromide ions may be added to the preferred etchants
either in the form of cupric or ammonium chloride or bromide or in
any other convenient form as would be obvious to those skilled in
the art such as sodium chloride or bromide. The function of this
ion is not fully understood, but is believed to increase the
etching rate, possibly by acting as a solubilizer for cuprous
copper formed on the surface of a copper part being etched. The
chloride or bromide ion may be present in minor amounts, the actual
concentration not being critical. Preferably, it is present in
solution in an amount of at least 0.1 moles per liter and more
preferably in an amount of from 0.2 to 3.0 moles per liter. It
appears that there may be a synergism between the ammonium and
halide ions resulting in a substantially increased etching
rate.
The preferred etchants may be used over a wide range of pH,
typically from about 3 to 13. However, in the preferred
embodiments, the etchants are used within the relatively neutral pH
range of from 4 to 10 and most preferably from about 7 to 8. The
essentially neutral range is preferred to substantially reduce
volatilization of ammonia gas; because of the lack of attack on
substrate materials, photo-masks, photoresists and the like; ease
of handling; and safety.
With reference to FIG. 2 of the drawings, there is shown in
schematic form the process of this invention. The etchant is used
to etch the cuprous metal in the etcher until the concentration of
the dissolved copper in the solution reaches a predetermined point,
which concentration may be the saturation point of the copper in
solution, the point where the etching rate decreases due to the
presence of dissolved copper or any other convenient point, but
preferably a concentration range of from 10 to 24 ounces of
dissolved copper per gallon of solution and most preferably, from
14 to 20 ounces of dissolved copper per gallon of solution. When
the predetermined amount of copper is dissolved in the etchant,
preferably the etchant is circulated through the loop illustrated
in FIG. 2.
At this point in the operation, the etch probably contains some
precipitate due to saturation of the solution. However, in order to
increase the etching capacity of the etchant, it is desirable to
precipitate additional copper from solution in the form of a salt.
This can be accomplished by any one of a number of different ways.
For example, the etchant can be cooled to decrease the solubility
of the copper salt in solution. Alternatively, the copper may be
"salted out" of solution by the addition of a precipitant such as
hydrochloric or hydrobromic acid which acid will form the
corresponding halide salt of copper. These two methods may be
combined. The step of precipitating additional copper from the
etchant is preferably carried out externally of the etcher. For
example, with reference to FIG. 2, there is represented both the
addition of the hydrohalide acid and the cooling of the etchant
external to the etcher.
When using a hydrohalide acid to precipitate copper from solution,
preferably, the halide ion should be common to the halide ion
contained in the etchant. For example, if the halide ion is
chloride, hydrochloric acid should be added to the etchant. In
addition, the hydrochloric acid may contain other additives for
replenishment of the etchant such as inhibitors, other complexing
agents that might be lost through "drag-out" and the like. Though
the etchants of the invention do not require substantial
replenishment since active ingredients are not consumed, some minor
replenishment might be required to compensate for this
drag-out.
Further, with use of a hydrohalide acid to salt out the copper, the
amount of hydrohalide added is dependent upon the amount of copper
to be removed from the etchant. Normally, under steady state
operating conditions, the amount of copper to be removed should
essentially equal the amount of copper dissolved during thd etching
operation. For example, it the etch rate is about one ounce of
copper per hour per gallon of solution, the rate of copper removal
should also equal about one ounce of copper per hour per gallon of
solution. In general, approximately one and one half moles of the
hydrohalide acid precipitates about one mole of copper (in a form
believed to be the copper halide salt). However, this ratio is
dependent upon numerous factors such as operating temperature of
the etchant and the complexing system used. Thus, in general, the
amount of hydrohalide acid added may vary between about 1 and 3
moles per mole of copper to be removed and preferably, about one to
two moles per mole of copper.
At some point in the loop, such as illustrated in FIG. 2 of the
drawings, in advance of the hydrohalide acid addition, air is
preferably introduced into the line to aerate the etchant and thus
convert cuprous copper to cupric form as it is the cupric form that
is the oxidant in the etching operation. This step is optional,
especially in a spray etching operation as sufficient aeration
takes place in the spray etcher.
At the next stage of the operation, the etchant may be cooled to
facilitate precipitation of the copper from solution. A substantial
decrease in temperature is not required and further, would be
uneconomincal. A temperature drop of 25.degree. F is possible
though from 5.degree. to 10.degree. F would be preferred.
The precipitate formed by the above operation is somewhat
gelatinous and though it can be removed by as simple an operation
as filtering, somewhat more complex procedures are preferred as the
precipitate clogs the filter medium rather rapidly. FIG. 2 merely
represents the step of removal broadly, though more specific
procedures will be described in greater detail below.
Following removal of the precipitate from the etchant, it is
returned to the etcher, preferably through an external heat
exchanger to bring the etchant back to operating temperature.
Alternatively, the etcher may contain heating means. If a salting
out step is used, pH adjustment at this point may be necessary.
Following temperature and pH adjustment, the etchant has had copper
removed so that it has an increased capacity for further etching of
copper, has had all of the cuprous ions converted to the cupric
form so as to be available for further etching, has had
replenishment to the extent necessary and is otherwise suitable for
further use. Thus, there is no material to dump nor is there any
substantial new chemical costs associated with the process. The
copper salt recovered from the process is of commercial value as a
raw material. Consequently, there is no dumping problems associated
with this material.
The above process can be performed in a batch operation wherein the
etchant is used to etch copper until the predetermined
concentration is reached and then cycled to remove the copper
halide salt or alternatively, can be operated on a continuous basis
where the etchant is continuously passed through the above
described loop and copper is etched at about the same rate as it is
removed from solution. Finally, a combination of the batch and
continuous processes may be used where copper is etched
continuously with some precipitate removed continuously, and the
bulk of the precipitate being removed during a shut-down period
such as during the night.
EXAMPLE
Cupric chloride dihydrate.sup.(1) 0.8 pounds per gallon
monoethanolamine 1.3 pounds per gallon ammonium salts.sup.(2) 2.2
pounds per gallon ammonium hydroxide 0.2 pounds per gallon water to
1 gallon (1) Equivalent to 4.8 ounces of cupric ion per gallon of
solution. (2) A combination of ammonium salts including ammonium
chloride and ammonium nitrate.
Approximately 300 gallons of the above etchant are used to fill a
spray etching apparatus having a 75 gallon capacity and three
sedimentation tanks external to the spray etching apparatus but
connected thereto by the necessary piping, pumps and the like as to
form a closed loop such as that illustrated in FIG. 3 of the
drawings. The spray etching apparatus (1) is filled throughout this
run, with a succession of copper clad boards ("1 ounce" copper
laminated epoxy panels having a copper laminate thickness of 0.0013
inches) which are continuously conveyed and sprayed with the
etchant.
The solution in the etching apparatus (1) is heated to and
maintained at between 120.degree. and 130.degree. F with pH
maintained between about 7.2 and 7.8.
Prior to start-up, or even during the etching operation, the
etchant is passed through the loop represented in FIG. 3 at a rate
of about 300 gallons per hour so that every hour, all of the
etchant has passed through the loop as shown in FIG. 3. The etchant
passes from the etching apparatus (1) to and through a series of
sedimentation tanks (2), (3) and (4), through a heat exchanger (5)
and back to etching apparatus (1).
Etching is started and initially, the etch rate is about 1 ounce of
copper per gallon of solution per hour or about 75 ounces of copper
per hour as there are 75 gallons of etchant in the etchant
apparatus (1) in contact with the copper. Preferably, etching is
continued for about 4 to 5 hours without addition of hydrochloric
acid during which period of time, the etch rate increases due to
increased dissolved copper content. After 5 hours of etching, the
dissolved copper content will be about 12.5 ounces per gallon of
solution and the etch rate will be at its maximum of about 1.8
ounces per hour per gallon of solution. At this point in the
process, in this particular example, hydrochloric acid addition
should begin with sufficient hydrochloric acid added so that copper
will be removed at substantially the same rate as it is dissolved.
In this respect, it takes about 1.5 moles of hydrochloric acid to
precipitate about one mole of the copper. Therefore, the
hydrochloric acid is added in an amount of about 4.2 ounces per
hour per gallon or about 20 pounds per hour.
The precipitate is preferably collected in overflow type
sedimentation tanks (2), (3) and (4) as illustrated in FIG. 3 of
the drawings. As a practical matter, the precipitate may not form
immediately upon contact of the hydrochloric acid with the etchant
and there might be a continued increase in dissolved copper content
in the etchant until "steady state" conditions are reached. At the
end of an 8 hour shift, the system is typically closed down and
allowed to stand over night. During this period, substantially all
precipitate will settle out of solution.
Following the sedimentation tanks, the etchant is passed through
the heat exchanger whereby it is heated to operating temperature of
about 120.degree. to 130.degree. F. Typically, in this loop with
the addition of hydrochloric acid at room temperature and passage
through the sedimentation tanks, the etchant would have dropped
about 10.degree. in temperature. This is desirable as it enhances
precipitation of the copper salt from solution. Following return to
operating temperature, there is addition of preferably a hydroxide
to increase the pH to the operating pH, for this etchant, pH of
about 7.5. Ammonium hydroxide and sodium hydroxide are both
satisfactory for this purpose, ammonium hydroxide being
preferred.
In the above example, other recovery means may be substituted for
the sedimentation tanks. For example, a centrifuge may be used or
conventional filer means. Difficulty filter been experienced with
use of a filter as the precipitate is in gelatinous form and
quickly clogs most filter materials.
* * * * *