U.S. patent number 3,770,434 [Application Number 05/189,530] was granted by the patent office on 1973-11-06 for method for making an image screen structure for an apertured-mask cathode-ray tube using a mask having temporary apertures.
This patent grant is currently assigned to RCA Corporation. Invention is credited to Harold Bell Law.
United States Patent |
3,770,434 |
Law |
November 6, 1973 |
**Please see images for:
( Certificate of Correction ) ** |
METHOD FOR MAKING AN IMAGE SCREEN STRUCTURE FOR AN APERTURED-MASK
CATHODE-RAY TUBE USING A MASK HAVING TEMPORARY APERTURES
Abstract
Each of the final-sized apertures of an apertured-mask for a
cathode-ray tube is closed with a film of an organic material. The
central portion of the film closing each final-sized aperture is
then opened so as to provide a temporary aperture smaller than the
final-sized aperture. An image-screen structure is then
photodeposited using the mask with the smaller temporary apertures
as a photographic master. After the screen structure is deposited,
the organic material is removed to restore the permanent mask with
the larger final-sized apertures therein for use in the cathode-ray
tube.
Inventors: |
Law; Harold Bell (Princeton,
NJ) |
Assignee: |
RCA Corporation (New York,
NY)
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Family
ID: |
22697726 |
Appl.
No.: |
05/189,530 |
Filed: |
October 15, 1971 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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872978 |
Oct 31, 1969 |
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Current U.S.
Class: |
430/5;
430/23 |
Current CPC
Class: |
H01J
9/144 (20130101) |
Current International
Class: |
H01J
9/14 (20060101); G03c 005/00 () |
Field of
Search: |
;96/36.1,36,44,45,45.1 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Torchin; Norman G.
Assistant Examiner: Kimlin; Edward C.
Parent Case Text
CROSS REFERENCE TO RELATED APPLICATIONS
This is a continuation-in-part of patent application Ser. No.
872,978, now abandoned, filed Oct. 31, 1969 by H. B. Law and
assigned to the same assignee as this application.
Claims
I claim:
1. In the manufacture of a cathode-ray tube including an
apertured-mask and an image-screen structure, said mask having
therein a plurality of final-sized apertures, the method of making
said image-screen structure for said tube comprising the steps
of:
a. completely closing each of said final-sized apertures of said
mask with a film of organic material,
b. opening the central portion of said film that closes each
final-sized aperture so as to provide a temporary aperture that is
smaller than said final-sized aperture,
c. producing an image screen structure for said tube using said
smaller temporary apertures of said mask as a photographic
master,
d. and then removing said organic material to restore the mask with
the larger final-sized apertures for use in the cathode-ray
tube.
2. The method defined in claim 1 wherein said closing step (a)
comprises
i. coating at least one surface of said mask and substantially
filling each of said final-sized apertures with a slurry comprised
of said organic material and a vehicle therefor,
ii. rotating said mask about an axis perpendicular to the surface
of the center of the mask to spread said slurry over said mask
surface and to remove excess slurry from said surface and said
permanent apertures,
iii. and then drying said coated mask to form a thin film
completely closing each of said final-sized apertures.
3. The method defined in claim 1 wherein said closing step (a)
comprises
i. preparing a preformed solid film of said material,
ii. applying said preformed solid film to at least the apertured
portion of one surface of said mask,
iii. and heating said preformed solid film to adhere said preformed
solid film to said mask surface thereby producing a film completely
closing each of said apertures.
4. The method defined in claim 1 wherein said closing step (a)
comprises
i. casting a film of said organic material by flotation on the
surface of a liquid, the area of said cast film being adequate to
cover at least the apertured portion of said mask,
ii. applying said cast film to at least the apertured portion of
one surface of said mask,
iii. and heating said mask and film to adhere said film to said
mask and a portion of said aperture wall, thereby producing a thin
film closing each of said apertures.
5. The method defined in claim 1 wherein said closing step (a)
comprises
i. immersing said mask in a slurry comprised of said organic
material and a vehicle therefor to form a coating on a surface of
said mask, said material of said coating substantially filling and
completely closing each of said apertures,
ii. and drying said coating to form a film closing each of said
apertures.
6. The method defined in claim 1 wherein said organic material is a
positive-type photosensitive material, and said closing step (a)
comprises coating said photosensitive material on a surface of said
mask, so that a film of said photosensitive material substantially
closes each of said apertures.
7. The method defined in claim 2 wherein said step (i)
comprises
a. coating a first surface of said mask with a slurry comprised of
a photosensitive material
b. coating a second surface of said mask with a slurry comprised of
an ultraviolet light-absorbing material.
8. The method defined in claim 1 wherein said organic material is
selected from the group consisting of acrylic polymers, polyvinyl
alcohols, cellulose acetate polymers, vinyl polymers, colloids,
waxes and lacquers.
9. The method defined in claim 1 wherein said opening step (b)
comprises
i. slowly heating said maks and said films closing said apertures
to soften said films and to cause each of said films to
rupture,
ii. and continuing to heat said mask to permit said ruptured
material to pull back toward the walls of said final-sized
apertures thereby producing said smaller temporary apertures.
10. The method defined in claim 1 wherein said opening step (b)
comprises
directing a flash of radiant energy to said films closing the
final-sized apertures of said mask, said energy being
sufficient
i. to melt and rupture a central region of each of said films,
and
ii. to cause said melted and ruptured film to form a ring of
material at the walls of each final-sized aperture thereby
producing smaller temporary apertures.
11. The method defined in claim 6 wherein said opening step (b)
comprises
i. exposing portions of said film closing each of said final-sized
apertures to radiant energy to completely solublize only said
central portions and incompletely solublize the peripheral
portions
ii. and completely dissolving away said soluble central portions of
said photosensitive material closing each final-sized aperture
thereby forming said smaller temporary aperture.
12. The method defined in claim 7 wherein said opening step (b)
comprises
i. exposing portions of said photosensitive material coating
through portions of said ultraviolet light-absorbing material to
radiant energy to completely solubilize only said central portions
and incompletely solubilize the peripheral portions of said
photosensitive material
ii. completely dissolving away said soluble central portions of
said photosensitive material closing each final-sized aperture
thereby forming said smaller temporary aperture
iii. and completely dissolving away said ultra-violet
light-absorbing material.
13. The method defined in claim 1 wherein said opening step (b)
comprises
completely dissolving the central portions of said film closing
each permanent aperture thereby forming smaller temporary
apertures.
14. The method defined in claim 1 wherein said opening step (b)
comprises
liquid honing the film closing each final-sized aperture to
completely remove the central portion therefrom to form a smaller
temporary aperture.
15. The method defined in claim 1 wherein said opening step (b)
comprises
removing only the central portion of said film closing each
final-sized aperture by powder blasting said film, thereby forming
said smaller temporary aperture.
16. The method defined in claim 1 wherein said opening step (b)
comprises
directing a flash of radiant energy to said films closing the
final-sized apertures of said mask, said energy being
sufficient
i. to burn and vaporize a central region of each of said films
ii. to cause a peripheral region of each of said burned and
vaporized films to form a ring of material at the walls of each
final-sized aperture thereby producing smaller temporary
apertures.
17. The method defined in claim 1 wherein said removing step (d)
comprises heating said mask to an elevated temperature sufficient
to volatilize and decompose said organic material but insufficient
to cause damage to said mask.
18. The method defined in claim 1 wherein said removing step (d)
comprises dissolving said organic material.
Description
BACKGROUND OF THE INVENTION
This invention relates to a novel method for preparing an image
screen structure for an apertured-mask cathode-ray tube, and
particularly to a method wherein the mask apertures are temporarily
reduced in size and then used to photodeposit elements of the image
screen.
In one prior method of temporarily reducing the size of mask
apertures, disclosed in U. S. Pat. No. 3,231,380 to H. B. Law, a
nonferrous metal is deposited on the aperture walls by
electroplating. In another prior method disclosed in U. S. Pat. No.
3,070,441 to J. W. Schwartz, an inorganic material is deposited on
the aperture walls by cataphoretic coating. Both methods are
undesirable because of problems encountered during the subsequent
removal of the deposited material. In addition, these methods are
not practical for salvage and reuse of the apertured-mask.
SUMMARY OF THE INVENTION
The novel method for making an image screen structure for an
apertured-mask cathode-ray tube includes completely closing each
aperture of the mask with a film of organic material. The central
portions of the films are removed while a desired thickness of the
films is retained adjacent the aperture walls so as to provide
smaller temporary apertures. The image-screen structure is then
produced by photodeposition using the mask with the smaller
temporary apertures as a photographic master. After the screen
elements are deposited, the organic material is removed to restore
the mask with the larger final-sized apertures for use in the
cathode-ray tube.
The film that closes each aperture may be produced by filling the
apertures with the organic material as by spin-coating,
dip-coating, or other suitable coating technique; or by applying a
preformed or cast film to one surface of the mask. The central
region of the film may be opened for example, by softening and
breaking, melting and breaking, burning, selectively rendering
soluble by exposure and dissolving, solvent dissolving, liquid
honing or powder blasting to provide smaller temporary apertures.
The organic material applied to the apertured-mask is easily
removed by baking at about 400.degree.C during subsequent tube
processing or by dissolving.
The novel method permits temporarily closing the apertures of a
formed aperture mask in an economical manner. The material closing
the apertures is easily removed by present manufacturing processes.
In addition, a permanent aperture mask is used to make the
temporary mask. Therefore, if a temporary mask is damaged, or if a
screen structure is improperly made the mask can be salvaged and
reused.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a side view, partly in axial section, of an
apertured-mask color kinescope including an image screen prepared
with the use of a temporary mask made by the present invention,
which temporary mask is produced from the permanent mask of the
kinescope.
FIG. 2 is a fragmentary transverse sectional view of an
apertured-mask after closing the final-sized apertures of the mask
by simultaneously coating both major surfaces of the mask with an
organic material.
FIG. 3 is a fragmentary transverse sectional view of FIG. 2 after
the step of opening the central portions of the aperture
closures.
FIG. 4 is a fragmentary plan view of the mask shown in FIG. 3.
FIG. 5 is a fragmentary perspective view of the mask shown in FIGS.
3 and 4 in position for use as a photographic master in preparing
an image screen for a color kinescope.
FIGS. 6 and 8 are fragmentary transverse sectional views of an
apertured-mask after closing the mask apertures by sequentially
coating the major surfaces of the mask and then after opening the
central portions of the aperture closures.
FIGS. 7 and 9 are fragmentary transverse sectional views of an
apertured-mask after closing the mask apertures by applying a cast
film to only one major surface of the mask and then after opening
the central portions of the aperture closures.
FIGS. 10 and 11 are fragmentary transverse sectional views of an
apertured-mask after closing the mask apertures by coating one
major surface of the mask to include the aperture walls and then
after opening the central portions of the aperture closures.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
FIG. 1 illustrates a color kinescope 10 produced by the novel
method which kinescope includes a glass envelope 12 comprising a
funnel portion 14 and a cap 16, which cap 16 includes a transparent
faceplate 18. A plurality of elemental phosphor areas 20, which
collectively comprise two or more groups of different phosphors and
which are individually capable of emitting luminescence of a
particular color (e.g., red, blue, or green) when struck by an
electron beam 21, are deposited on the internal surface 22 of the
transparent faceplate 18. The faceplate 18 (or other transparent
substrate), the elemental phosphor areas 20 and, optionally, a
light absorbing matrix 23 (discussed below) are collectively
referred to herein as an image screen structure 24. Generally, the
image screen structure 24 also includes a light-reflective
conductive layer (not shown) of aluminum as is well known, which
covers the image screen and serves as an electrode.
The elemental phosphor areas 20, are, for illustration purposes,
exaggerated in size and proportion (as are other parts of FIG. 1
and the other FIGURES) and shown as having a dot configuration,
which dots may be arranged in the well-known hexagonal dot pattern
(not shown). Alternatively, each phosphor areas may have a stripe
configuration (not shown), these stripes being arranged in an
alternating array of different color phosphors to provide a line
screen. An apertured shadow mask used with the line screen differs
only in that the apertures are slot shaped instead of round. The
kinescope 10 further includes a number of electron guns and either
electrostatic or magnetic deflection and convergence means, none of
which are shown for simplicity.
In generally parallel, spaced relation with the image screen
structure 24 is a color-selection mask 30 (or mask electrode) which
may be, for example, of the focusing or non-focusing variety, both
of which are known in the art. The mask 30 (focusing or
non-focusing variety) is produced by methods known in the art and
is usually curved and contains final-sized apertures 34. A suitable
frame 32 or other means can be used by support the shadow mask 30.
Unless stated otherwise, for purposes of illustration, the mask 30
is understood to be of the non-focusing mask variety, which is
operated at substantially the same potential as the image screen
structure 24 to form a field-free region therebetween. The mask 30
is made from a sheet or band of conducting material (e.g.,
cold-rolled steel) and has a plurality of apertures 34 of desired
final size therein. The apertures preferably have a double
frustoconical shape, both cones 57a and 57b having their narrowest
dimension located between the major surfaces 60 and 62 of the mask
so as to form a knife edge 56a as shown in FIG. 2. While the
apertures 34 are, for simplicity, shown in FIG. 1 to be
substantially circular in shape, apertures having other shapes may
be used. For example, the mask may be of the "grill" type (not
shown), having slot-shaped apertures.
Color television picture tubes or color kinescopes may be described
by the relative size of the elemental phosphor area excited by the
electron beam. A tube where the electron-beam spot size, as defined
by its associated aperture, is smaller than the phosphor dot it
excites is described as a tube having a positive tolerance. In a
positive-tolerance tube, the phosphor dots are sufficiently larger
than each electron-beam spot to ensure that the entire beam strikes
each dot, even with a limited amount of misregister. A
positive-tolerance tube may be of the matrix or nonmatrix type.
Where the tube is of the positive-tolerance-matrix type, the size
of the elemental phosphor area excited by the electron beam is
smaller than the size of the opening in the matrix.
A matrix-type structure in which the size of the electron spot as
defined by its associate aperture is the same or larger than the
associated opening in the matrix is described as a tube having a
negative tolerance. In a negative-tolerance matrix tube the excited
portions of the elemental phosphor areas (dots) are defined by the
openings in the matrix, and the electron-beam spot is usually
sufficiently larger than the matrix opening to ensure that the
entire matrix opening is excited, even with a limited amount of
misregister.
In FIG. 1, the final-sized apertures 34 are related in size and
position to respective phosphor areas 20 of the image screen
structure 24. The size relationship is such that, where the mask 30
is of the non-focusing variety, each final-size aperture 34 is of
such dimension as to be capable of passing an electron beam 21
whose dimensions, as measured at the screen structure 24, (i.e.,
the spot size of the beam) are at least substantially equal to, or
preferably larger than, the dimensions of the individual phosphor
areas 20 upon which the electron beam impinges. The electron beam
spot size is preferably sufficiently large to provide a negative
tolerance but not so great that the electron beam impinges any
phosphor areas other than the intended phosphor areas. In general,
with a prior art mask having bifunctional apertures of a given size
the size of the light spots produced during screen printing
substantially exceeds that of the electron beam spots produced in
the operation of the kinescope. This results in the size of the
individual phosphor areas being considerably greater than the spot
size of their associated electron beam so that the beam impinges
only a portion of each phosphor area. Such differences in size
between the printing light spots and the electron beam dots are
familiar to the art, the difference therebetween being attributable
to the more extensive penumbra-umbra effect taking place in the
screen printing process. In the present invention, therefore, the
final-size apertures 34 of the mask 30 (considered to be a
non-focusing mask) should be of such size that the electron beam
spot is at least equal in size to and preferably larger than, the
respective phosphor areas. Generally, it is preferred that the
final-size apertures 34 exceed in size their associated phosphor
areas 20.
In the non-focusing variety color kinescope, the image screen
structure and mask are maintained at the same potential; therefore
the beam striking the image screen structure is substantially the
same size as the size of the aperture. In a focusing-type
apertured-mask tube, the image screen structure and the mask are
maintained at different potentials, so that the beam is focused by
the electric field between the image screen structure and the mask,
and the beam striking the image screen structure is smaller than
the size of the aperture. The non-focusing type and the focusing
type tube may be of the positive- or negative-tolerance type. In
the focusing-type matrix and nonmatrix-type tubes, if the apertures
are of a size which permits the focused beam to excite a portion of
the elemental phosphor area smaller than the size of the opening in
the matrix, the tube has a positive tolerance. If the aperture of a
matrix-type tube is of a size such that the focused beam is equal
or larger than the size of the opening in the matrix, the tube has
a negative tolerance.
The final-size apertures of a focusing-type mask are significantly
greater in size than their respective individual phosphor areas
whether the color tube is of the positive tolerance type (i.e., the
beam spot is smaller than a corresponding phosphor area) or the
negative tolerance type. In most color kinescopes in the prior art,
there is a single aperture in the apertured-mask for each trio of
phosphor dots (i.e., one dot each of red, green and blue
phosphors). However, for purposes of simplicity, each aperture 34
is shown to correspond in position with only one phosphor area
20.
In the operation of the kinescope 10, electrons are emitted by the
electron guns (not shown) and thereafter directed, by means known
in the art, as an electron beam 21 through the apertures 34 to
impinge upon the phosphor areas 20. Because a larger electron beam
spot is produced and impinges upon an entire individual phosphor
area, the kinescope 10 exhibits improved characteristics, such as
increased image brightness and contrast, over prior art
kinescopes.
Im making an image screen structure 24 for an apertured-mask color
kinescope shown in FIG. 1, a coating of an organic material is
provided on a mask 30 having final-sized apertures. The coating is
comprised of a portion forming a film which completely closes each
final-sized aperture. The film closing each final-sized aperture
may be produced by the methods of Examples 1 through 6 described
below. The film may be produced by controllably applying material
to both major surfaces of the mask as shown in FIGS. 2 and 6, or to
only one major surface of the mask as shown in FIGS. 7 and 10. FIG.
2 illustrates simultaneous coating of both major surfaces of an
apertured mask 30, while FIG. 6 illustrates sequential coating of
both major surfaces of an apertured mask 30. FIG. 7 illustrates the
film extending over and completely closing the mask apertures at
one major surface, while FIG. 10 illustrates the coating disposed
on the aperture walls and the film completely closing the mask
apertures at the narrowest dimension.
In one embodiment shown in FIGS. 2 and 3 of the present invention,
a color kinescope 10 as shown in FIG. 1 is manufactured by steps
including the production of a temporary mask 70 (partially shown in
FIG. 3) for screen printing. The first step in making the temporary
mask 70 (partially shown in FIG. 3) is the provision of a coating
50 of an organic film-forming material on a completed mask 52
(similar to 30 of FIG. 1) to make a coated mask 40.
The coating 50 (shown in FIG. 2) is comprised of films 54 which
extend across and substantially close the final-sized apertures 53
(similar to 34 of FIG. 1), and, preferably, are disposed at the
aperture walls 56. The coating 50 of the organic film-forming
material is further comprised of areas 58 which are integral with
the films 54 and are disposed at the major surfaces 60 and 62 of
the mask 52.
The films 54 are of a substantially concavo-concave shape and have
relatively thin central regions 64 and relatively thick peripheral
regions 66. Such a concavo-concave shape is attributable to surface
tension forces acting on the fluid organic material during coating
of the mask 52. The coating is then dried and the central regions
64 of the films 54 (shown in FIG. 2) are opened to provide smaller
temporary apertures 74 as shown in FIG. 3.
In another embodiment shown in FIGS. 6 and 8, a color kinescope 10
shown in FIG. 1 wherein the electron beam spot size is at least as
great as, and, preferably, greater than, the individual phosphor
areas comprising the image screen, is manufactured with the use of
a temporary mask 120 shown in FIG. 8. The temporary mask 120 is
prepared by providing a first coating 104 and a second coating 112
to a mask 52 having final-size apertures 53 to obtain the coated
mask 102 shown in FIG. 6. Those numerals in FIGS. 6 and 8 which are
identical to those of FIGS. 2 and 3 indicate corresponding
elements. The first coating 104 is comprised of first films 106
which are disposed at and completely close the final-size apertures
53 of the mask 52 shown in FIG. 6. These first films 106 are
partially disposed on the walls 56 of the apertures 53. The first
films 106 have relatively thin central regions 117 and relatively
thick peripheral regions 122. The target mask 52 is also provided
with a second coating 112 comprised of second films 114 which
overlie and are substantially coextensive with the first films 106
these second films 114 are also being partially disposed on the
aperture walls 56. The second films 114 also have relatively thin
central regions 124 and relatively thick peripheral regions 126.
The coatings 104 and 112 are of different materials, the second
coating 112 consisting of a positive-type photosensitive resist,
such as Shipley resist marketed by Shipley Co., Newton, Mass., and
the first coating 104 consisting of an ultraviolet light-absorbing
composition, such as polyvinyl alcohol with a carbon pigment. Both
coatings 104 and 112 may optionally have respective areas 116 and
118 thereof disposed at respective major surfaces 60 and 62 of the
mask 52. The double coating on the mask 52 can be made by
sequentially applying each coating 104 and 112 from a different
side thereof. The thin central regions 124 of the second films 114
of the second coating 112 are opened and the entire first coating
104 is removed to provide smaller temporary apertures 115 as shown
in FIG. 8.
Where it is desired, a temporary mask may be produced from a mash
52 having a coating applied to only a single surface such as second
coating 112 shown in FIG. 6 (as contrasted to a coating 50 shown in
FIG. 2, applied to both surfaces) of a mask, the coating being
disposed on parts of the aperture walls. the apertures and to open
the central regions 134 of these films 132 such
In a further embodiment shown in FIGS. 7 and 9 a color kinescope 10
shown in FIG. 1 can be produced with a temporary mask 128 shown in
FIG. 9. A temporary mask is produced by applying at one major
surface 62 of a mask 52 a cast film 130 of a suitable organic
material to form a coated mask 127 as shown in FIG. 7. The cast
film 130 is comprised of opaque films 132 disposed at and extending
above the final-sized apertures 53, these films 132 preferably
having a concavo-concave shape. The cast film 130 is heated to
cause the film to melt and conform to a portion of the walls of the
such that opaque bands 133 as shown in FIG. 9 are formed at the
periphery of the final-sized apertures 53 which partially close the
apertures and define smaller temporary apertures 135. The organic
film-forming material is subsequently removed to restore the mask
to its original condition, after which, the mask is incorporated
into a kinescope.
FIG. 10 illustrates an apertured-mask 52 with the organic material
controllably applied on one major surface 62 to provide a coating
on the walls 56 of the final-sized apertures 53 and a thin film 140
completely closing each of the final-sized apertures 53. The thin
film 140 includes relatively thin central regions 142 and
relatively thick peripheral regions 143. During coating, the
material initially fills the apertures without passing through to
coat the opposite major surface 60 of the mask 52. FIG. 11
illustrates the coated mask 138 of FIG. 10 with the central regions
142 of the thin film 140 opened to provide a smaller temporary
aperture 144.
Methods for Closing the Apertures
Example 1: Position a mask 52 having a plurality of final-sized
apertures 53 therein so as to permit rotation about an axis
perpendicular to the mask 52. A liquid organic material coating 136
is then applied on the surface of the mask 52. The preferred method
of applying the coating 136 is to contact one major surface 62 of
the mask 52 against a tank of liquid while rotating and tilting the
mask 52. Other alternative methods include spraying, flowing, or
pouring the liquid over one major surface 62 of the mask 52. After
the coating 136 is applied, the mask 52 may be rotated to spread
the material and remove excess material from the final-sized
apertures 53. The coating 136 is then dried to a nonviscous or
semisolid condition, producing a film 140 completely closing each
of the apertures as shown in FIG. 10. The coating 136 may be dried
prior to or during the process of opening the films 140, which is
described below.
The preferred formulation of liquid organic material is a polyvinyl
alcohol solution containing about 3.3 percent solids. Alternative
formulations which may also be used substitute either gelatin or
fish glue for the polyvinyl alcohol in similar proportions.
Cellulose acetate dissolved in acetone with 1 to 8 percent content,
vinyl acetate dissolved in acetone with 1 to 8 percent solids
content, and methyl methacrylate dissolved in toluene with 1 to 8
percent solids content may also be used.
Example 2: Apply a preformed thermoplastic solid film in sheet form
over one surface of the mask 52 as shown in FIG. 7. The solid film
is then heated to substantially conform the solid film to one major
surface of the mask 52. During the heating, the central region of
the film closing each of the apertures melts to form a thin film.
The thin film may extend over the apertures 53 at one major surface
62 as shown by the coating 130 in FIG. 7 or conform to the large
frustum shape of a double frusto-conical shaped aperture completely
closing each aperture 53 at the knife edge formed by the
intersection of the two cones as shown by the second coating 112 in
FIG. 6.
The preferred material of the solid film is polyvinyl acetate.
Other materials such as lacquer, wax, gelatin, fish glue, cellulose
acetates, polyvinyl acetate and methyl methacrylate may also be
used.
Example 3: Prepare an organic film by flotation casting and then
apply the film to a mask 52 by contacting one major surface of the
mask 52 against the film. The mask 52 and flotation film as then
heated to dry the film and produce a thin film closing each of the
apertures substantially as shown by first coating 104 or second
coating 112 in FIG. 6. The film substantially conforms to one major
surface of the mask 52 including a portion of the walls 56 of each
final-sized aperture 53. The preferred materials of the liquid
flotation film are methyl methacrylate or cellulose nitrate.
Example 4: Dip or immerse a mask 52 in an organic material to
obtain a coating over all the surfaces of the mask 52, and closing,
but not filling, each of the final-sized apertures 53.
Such immersion can be done with the use of simple tanks (not shown)
containing the fluid organic material, batch-type or continuous
processes being employable for coating the mask 52. Then the
organic coating is dried, as by air drying, or controllably dried,
as with a moisture chamber or oven to form films 54 completely
closing the final-sized apertures 53 as shown in FIG. 2.
A temporary mask can also be produced by controlled immersion of
the mask in an organic film-forming material or by other controlled
application of the organic film-forming material to the mask. Such
a mask having a coating on a single surface thereof would be
comparable to the mask 52 of FIG. 6 with only second coating 112
thereon. The preferred materials are the same as described in
Examples 1 and 3.
Example 5: Prepare a positive-type photosensitive, film-forming
resist (i.e., one whose solubility is increased by exposure to
suitable radiation), such as, for example, a Shipley resist,
marketed by Shipley Co., Newton, Mass., to produce a coated mask 40
similar to that shown in FIG. 2 or a coated mask 138 similar to
that shown in FIG. 10. Apply the resist coating by either of the
methods described in Examples 1 or 4. The apertures of the mask 52
are completely closed by the coating 50. The coating 50 is dried to
provide films 54 which completely close the final-sized apertures
53 and are opaque as shown in FIG. 2.
Example 6: Apply a coating to a mask 52 as in Example 1 to about
line 6--6, which coincides with the narrowest dimension of the
apertures 53 of the respective film-forming materials. Thus, in the
application of the first coating 104 the film-forming material is
substantially restricted by surface tension forces to the parts of
the aperture walls located between the major surface 60 and line
6--6. Continuing the example, the first coating 104 is then dired
to produce thin films 106. The second coating 112 is then applied
as in Example 1, to the opposite major surface 62 of the target
mask 52 and dried to produce thin films 114. Each of the films 114
and 106 preferably have at least one concave surface (e.g., the
film configuration is substantially plane-concave), relatively thin
central regions 117 and 124 respectively and relatively thick
peripheral regions 122 and 126 respectfully. It is preferred that
the second coating 112 is a photosensitive resist material such as
Shipley resist, marketed by Shipley Co., Newton, Mass., and the
first coating 104 is an ultraviolet light-absorbing material such
as polyvinyl alcohol with a carbon pigment.
The films produced by the methods described in anyone of the
Examples 1 through 6 are then opened as described in Examples A
through H to provide smaller temporary apertures.
Methods for Opening the Film
Example A: Subject the coated mask produced by either of Examples 2
and 3 to a heat lamp or uniform temperature to soften the coating
material. The heat is applied at a slow rate to decrease the
surface tension of the material causing the films to break and the
material to pull back towards the walls of the apertures forming
smaller temporary apertures 115 and 135 as shown in FIGS. 8 and 9.
It is believed that the amount of opening obtained is a function of
film thickness, surface tension and viscosity of the material
composition, and amount of heat applied.
Example B: Open the central regions of the films produced by either
of Examples 2 and 3 by exposing the coated mask to a controlled
flash of radiant energy emitted from a Xenon flash lamp 68 located
at the vicinity of the center of curvature of the mask 52 or closer
to the mask. As used herein with respect to the films, the terms
"open" or "remove" means the total elimination of the central
regions of the films so that no obstruction remains and smaller
temporary apertures are produced. The level of energy of the flash
is adjusted so as to melt and rupture the thinner central regions
of the films, thereby producing a temporary mask 70 (FIG. 3) 120
(FIG. 8) or 128 (FIG. 9) having, at the walls of the various
apertures 53, bands of organic film-forming material comprising at
least part of the peripheral regions of the films. These bands
define temporary apertures 115 (FIG. 8) and 135 (FIG. 9) which are
substantially smaller in size than the mask apertures 53 so as to
provide in screen printing, phosphor dots (e.g., 20 of FIG. 1) of
desired dimension on the target screen.
The important feature is that high heat is applied by radiation for
a very short time so that the shadowed part of the films are not
heated. The melted central regions then rupture, forming a ring of
material on the walls 56 of the final-sized apertures 53 producing
smaller temporary apertures 115 and 135 as shown in FIGS. 8 and 9.
It is preferred that this process by used with Examples 2 and 3
which have one coating on one major surface of the mask. Where the
apertures are of double frusto-conical shape, it is preferred that
the coating is on the screen side or major surface 62 of the mask
52.
For a mask with a final-size aperture 53 of about 16 mils diameter,
a temporary aperture of about 12 mils diameter will respectively
provide an electron beam spot size of about 17.8 mils diameter and
a phosphor dot of about 14 mils diameter. The bands are supported
by the walls 56 of the apertures 53, thereby being strengthened and
having comparatively high resistance to breaking and other injury.
Generally, the thickness of the film portions can be controlled by
adjusting the viscosity of the compositions used to apply the
film-forming materials, the more viscous compositions generally
providing thicker film portions.
Example C. Follow the method described in Example B except that the
lamp 68 is positioned about 6 to 7 inches from the coated mask and
operated with high energy such as 1350 joules. The central region
of each of the films produced by any of the methods described in
Examples 1 through 4 is then opened by burning or vaporization
producing smaller temporary apertures 74, 115, 135 and 144
respectfully as shown in FIGS. 3, 8, 9 and 11. Such removal is
achieved by a more rapid heating of the organic film-forming
material at the thinner central regions by the radiant energy than
at the thicker peripheral regions, the former having a lower heat
capacity. The radiant energy causes the central regions to be
vaporized or burned off. The thickness distribution of the films
are comparable so that their respective central regions can be
eliminated substantially uniformly, thereby providing smaller
temporary apertures of substantially uniform size and shape.
Example D: The coated mask 102 prepared by the method of Example 6
(shown in FIG. 6) is exposed to ultraviolet light for a sufficient
time to permit removal of the central regions 124 of the films 114
to produce smaller temporary apertures 115 as shown in FIG. 8. The
films 114 (consisting of positive-type photoresist) are exposed to
ultraviolet radiation from a lamp 68 which is first passed through
the ultraviolet light-absorbing films 106. The light-absorbing
films 106 act as a light filter, more ultraviolet light being
transmitted through the thinner central regions 117 thereof than
through the thicker peripheral regions 122 As a result of this
higher transmission, the central regions 124 of the films 114 are
rendered completely soluble before much of the peripheral regions
126 thereof. The central regions 124 of the films 114 are then
removed by "developing" in a manner known in the art (e.g., washing
with developing compositions such as Shipley developer marketed by
Shipley Co., Newton, Mass.) to produce opaque bands at the walls 56
of the final-size apertures 53, which bands define smaller
temporary apertures 115 used in screen printing. The first coating
104 is completely removed after the exposure of the central regions
124. In the preferred method the first coating 104 is also removed
by the Shipley developer. The remaining bands are eliminated after
completion of the screen printing operation shown in FIG. 5 either
by baking, or chemical dissolution (in suitable solvents known in
the art) such elimination preferably being carried out in
conjunction with the removal of resist material from the printed
screen.
Example E: The closed apertures in the coated mask 40 produced by
anyone of the methods of Examples 1, 3 and 4 are opened by liquid
honing. In liquid honing a coated mask is immersed in a tank and a
liquid containing silica particles of approximately 40 to 100
microns in size is flowed over the coated mask. The particles cut
away parts of the coating. Since the central regions of the films
are relatively thin, these parts are removed first to produce
smaller temporary apertures 74, 115, and 144 as shown in FIGS. 3,
8, and 11 respectfully.
Example F: The closed apertures in the coated mask produced by
anyone of the methods of Examples 1, 3, 4 and 5 may be opened by
dissolving the central regions of the films. The central regions of
the various dry film portions can be removed with a slow-acting
solvent that uniformly dissolves material from the coating. Where
the material is an acrylic or a polyvinyl alcohol, toluene and
alcohol are respectively suitable as solvents. Non-Active diluents
can be added to the solvents to adjust the dissolution rate of the
coating. While dissolution takes place at most, if not all, of the
exposed surfaces of the coating, considerable amounts of the
peripheral regions remain after the central regions are removed
because of the differences in thickness therebetween. There then
result the bands such as 72 shown in FIG. 3 of the organic
film-forming material located at the walls 56 of the final-size
apertures 53.
For the polyvinyl alcohol of Example 1, a preferred solvent is a
solution of 95 percent denatured alcohol and 5 percent 2-propanol.
One method of dissolving is to immerse the coated mask 40 for about
10 seconds in the solvent, remove from the solvent and then remove
excess solvent on the mask by an air blast. An ethylene glycol
solution may also be used as a solvent. The undissolved peripheral
region 66 describes a temporary aperture 74 smaller than the
final-sized aperture 53 as shown in FIG. 3. The edge of the opening
in the films 54 contains a small bead formed by surface tension
forces after dissolution of the central region 64 on the softened
but not dissolved peripheral region 66.
Example G: The closed apertures in the coated mask produced by any
one of the methods of Examples 1, 3 and 4 may be opened by a
dry-powder blast. The powder blast removes the central region of
the films by attrition leaving a peripheral region describing a
temporary aperture 74, 115 and 144 smaller than the final-sized
apertures 53 as shown in FIGS. 3, 8, and 11 respectfully. In a
preferred method small particles of silica approximately 40 to 100
microns in size are air blasted over the coated mask. Since the
central regions are very thin they are removed producing smaller
temporary apertures.
Example H: Expose the coated mask 40 produced by Example 5 to
suitable radiation (e.g., ultraviolet light) from a lamp 68 located
in the vicinity of the center of curvature of the mask, such that
the films 54 (shown in FIG. 2) are rendered soluble in developing
compositions known in the art and the central regions 64 develop
out. Some of the peripheral regions 66 of the films 54 (shown in
FIG. 2) may be incidentally exposed to the radiation and rendered
soluble to a certain depth but because these peripheral regions are
considerably thicker than the central regions 64, a portion of the
peripheral regions 66 will remain on the mask 52 after the central
regions 64 are removed. The soluble central regions 64 are then
removed to produce smaller temporary apertures 74.
Method for Removing The Coating
The organic film forming material is eliminable from the mask
preferably by air baking (combustion or decomposition and/or
vaporization or volatilization) thereof (either or both of these
preferably being achievable at or below the maximum processing
temperatures generally employed in color kinescope manufacturing,
for example, at or below 500.degree.C.) and/or dissolution in
agents (preferably, but not necessarily limited to, water) which
are not detrimental to the mask, and leave substantially no
residue. A suitable temperature for such combustion (decomposition)
or evaporation (volatilization) is about 400.degree. to
450.degree.C. This temperature is employed in known kinescope
manufacturing processes, for removing resist deposits (not shown)
which are employed in image screen production from the image screen
24 (FIG. 1).
If it is so desired, the film-forming material may be eliminated
from the mask separately from those operations involving the
removal of resist deposits from the image screen. Such elimination
of the film-forming material can be done before or after the
removal of the screen resist materials and can be done by the
abovementioned methods such as, for example, by baking or
dissolution.
General Considerations
It is preferred that the organic material be "film forming." A
"film-forming" material is defined to be one which, when applied in
a fluid condition, to a mask is capable of wetting the mask so as
to provide films at individual ones of the apertures closing the
apertures. The film may be in a wet, dry or plastic condition
dependent on the organic material selected, the method of producing
the film and the method of opening the film. The film portion is
preferably of a concavo-concave shape, as shown in FIG. 2, or a
plano-concave configuration, but it can be of other (e.g.,
concavo-convex configuration). In general materials which are
film-forming and exhibit relatively high surface tension properties
facilitate the production of such concavo-concave film
portions.
Several organic compositions, as previously described, are suitable
film-forming materials for practicing this invention, including
those which are strong absorbers of printing-light (e.g.,
ultraviolet) and, particularly, those which are plastic- and
thermoplastic-type materials. Specific examples of these organic
compositions are: cellulose, vinyl copolymers, and acrylic
copolymers; polyvinyl alcohols; gelatin; and fish glue. The organic
compositions can be provided in the fluid state by dissolving in a
suitable evaporable solvent (e.g., toluene or alcohol for acrylic
materials), or by heating the organic compositions.
It is preferred that the coating at the walls of the apertures
forming the smaller temporary apertures be substantially opaque
during the depositing of the viewing screen. Film-forming materials
may be used which are naturally substantially opaque or which may
be provided with opaquing materials known in the art.
Alternatively, the film-forming materials can be such as to provide
non-opaque film portions, the central regions of which film
portions are removed as discussed below, and the other regions of
these film portions subsequently converted to an opaque conduction
by coating these other regions with an opaque material, such as
carbon.
A preferred method of opaquing is to spray the coated mask with
about 1 percent carbon dispersed in acetone after the films are
opened. A pigment of about 1 percent carbon dispersed in the
polyvinyl alcohol water film-forming material composition may also
be used. There also can be added to these compositions a
water-soluble dye such as for example Uvinul, marketed by General
Aniline and Film which is strongly ultraviolet light absorbing. As
used with respect to the film-forming coatings herein, the term
"opaque" is defined to include both coatings which are impervious
to radiant energy and coatings which scatter or diffuse radiant
energy so as to redirect the radiant energy from its original path,
thereby substantially limiting the radiant energy performing the
screen printing to that passing through the temporary apertures in
the films.
The temporary mask 70, 120, 128 or l46 produced by any one of the
Examples A through H is then positioned in spaced relation with a
suitable transparent substrate 80 such as faceplate 18 (FIG. 1) and
used as a photographic master to "print" the various elemental
phosphor areas 82, 84, and 86 of the respective phosphor groups
(red, blue, and green) on the substrate 80 as shown in FIG. 5. The
printing process is known in the art (see, for example, U.S. Pat.
No. 3,406,068 to H. B. Law). Briefly, one surface 88 of the
transparent substrate 80 is coated with a mixture (not shown)
comprising a first one of the desired phosphors and a suitable
photo-sensitive material and then exposed to a suitable light which
is passed through the smaller temporary apertures of the temporary
mask. Those portions of the phosphor coating (not shown) struck by
the light rays are hardened, the unhardened portions of the coating
being removed, by washing, for example, to leave a pattern (not
shown) of phosphors of a first color mixed with the hardened resist
material. This sequence of steps is repeated for the other
phosphors. The hardened resist material is subsequently removed
from the phosphor dots by baking or by chemical dissolution methods
known in the art. An electron gun (not shown) intended for a
particular phosphor group is located at each point 90, 92, or 94 so
as to be in substantially the same spatial relation with the image
screen structure (e.g., 24 of FIG. 1) as the light source (not
shown) used for printing that particular phosphor group. The paths
followed by the light rays during printing and by the electrons
during operation of the kinescope are indicated, for purposes of
illustration, by the lines 96, 98, and 100.
The screen printing operation may include providing, with the use
of any of the temporary masks disclosed herein, a light-absorbing
matrix (e.g., 23 of FIG. 1) of an opaque, non-light-reflective
material to the image screen structure (e.g., 24 of FIG. 1). For
purposes of this invention, such a matrix provided to an image
screen structure is considered to be included in the term "image
screen structure." Color television picture tubes which may include
a light-absorbing matrix on the inner surface of the faceplate
forming a part of the screen structure are described in U.S. Pat.
Nos. 2,842,697 to E. J. Bingley and U.S. Pat. No. 3,146,368 to J.
P. Fiore et al. This can be done, for example, by coating a surface
of the bare transparent substrate 80 (e.g., 18) with a relatively
translucent mixture (not shown) comprised of a material which has a
relatively low light absorption and is convertible to a condition
which is more light-absorbing (e.g., manganese oxalate or manganese
carbonate, which can be converted from a comparatively translucent
condition to an opaque, non-light-reflective condition by heating
in a manner known in the art) and a "positive-type" photosensitive
resist (i.e., one which is soluble where exposed to light and
remains insoluble elsewhere) and then exposing the coating to
suitable light passed through the smaller temporary apertures of
the temporary mask. Then, the unhardened portions of the coating
are washed away and the relatively low light-absorbing material of
the remaining portions of the coating is converted to its
light-absorbing condition. The phosphor areas (e.g., 82, 84, and 86
of FIG. 5) are then printed at openings in the matrix, as described
above. The phosphor areas may, if desired, be somewhat larger than
the openings of the matrix so that portions of the respective
phosphor areas are disposed on the matrix itself. The "effective
size" of such phosphor areas is, therefore, equal to the size of
their respective matrix opening. As used with respect to the
phosphor areas of a matrix-bearing image screen, the term "size" is
defined to be the effective size thereof. Where it is desired, the
phosphor areas may be printed before the conversion of the material
to its light-absorbing condition. Alternatively, the phosphor areas
may be printed before the provision of the matrix, the preliminary
mask being used for producing both of these. Where it is desired, a
light-absorbing matrix can, with a temporary mask, be provided to a
transparent substrate, with the subsequent phosphor printing being
done by applying a phosphor-photoresist mixture to the substrate
surface on which the matrix is located and, then, exposing the
mixture to light from a source located on the side of the substrate
opposite the surface thereof bearing the matrix. The light passes
through and is defined by the matrix openings.
Upon completion of the printing of the image screen, the organic
film-forming material is eliminated (by baking or chemical
dissolution) to provide a target mask 52 (similar to 30 of FIG. 1).
Such elimination of the bands can be done by processing the
temporary mask in conjunction with the previously mentioned removal
of the resist material from the phosphor screen. In this way,
existing equipment can be used for restoring the target mask to its
original condition with no increase in the number of processing
steps being required to remove the bands. The target mask 52 is
then incorporated into a kinescope in the manner shown in FIG.
1.
The production of color kinescopes according to the method
disclosed herein results in a number of advantages. Among them is
the producibility of kinescopes having relatively large negative
tolerances, this with presently available commercial apparatus.
Also, the present method does not require costly equipment for the
application of the organic materials and does allow the combination
of the operation for the removal of the film-forming material with
that of the removal of resist deposits from the screen, thereby
avoiding both additional processing steps and the need for costly
film-removing equipment. Furthermore, the present method allows the
manufacture of kinescopes having target masks of non-planar contour
by means of known mask-making processes, without the subjection of
the material for temporarily reducing the aperture size to the
mask-annealing steps involved in such processes. Still further, the
bands of film-forming material which serve to reduce the aperture
size of the target masks can be physically supported by the walls
of the apertures, thereby imparting strength to the bands and
minimizing breakage of such bands.
* * * * *