U.S. patent number 3,763,027 [Application Number 05/188,028] was granted by the patent office on 1973-10-02 for sparger.
This patent grant is currently assigned to Oxy Metal Finishing Corporation. Invention is credited to Robert C. Pearson.
United States Patent |
3,763,027 |
Pearson |
October 2, 1973 |
SPARGER
Abstract
A machine for metal plating selected areas of a conductive
workpiece and a sparger employed therein is disclosed. The machine
includes a main frame having the sparger removably mounted therein
and an hydraulic press for holding the workpiece securely against
the sparger during a plating cycle. The sparger has an inlet port
in a first chamber thereof removably connected to a source of
electrolyte under pressure. A top plate of the first chamber has a
pair of holes for each of the selected areas to be plated on the
conducting workpiece. The total area of the holes in the top plate
is small compared with the cross-sectional area of the first
chamber. This provides a flow of electrolyte from the first chamber
to a second chamber through the holes which is relatively uniform
through each of the holes. An upper wall of the second chamber acts
as a baffle plate being solid opposite to the holes in the upper
wall of the first chamber and having cusps therethrough so that the
fluid flows therearound into a third chamber. The third chamber has
collimating holes in the upper wall thereof to provide a collimated
stream of electrolyte to the workpiece to be plated. A source of
electric current is connected to terminals on the sparger to
provide positive and negative terminals during the plating
cycle.
Inventors: |
Pearson; Robert C. (Wyckoff,
NJ) |
Assignee: |
Oxy Metal Finishing Corporation
(Warren, MI)
|
Family
ID: |
22691481 |
Appl.
No.: |
05/188,028 |
Filed: |
October 12, 1971 |
Current U.S.
Class: |
204/224R;
204/237 |
Current CPC
Class: |
C25D
5/02 (20130101) |
Current International
Class: |
C25D
5/02 (20060101); B23p 001/02 (); B01k 003/00 () |
Field of
Search: |
;204/275,129.6,129.65,224,237 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Mack; John H.
Assistant Examiner: Valentine; D. R.
Claims
What is claimed is:
1. A system for providing a uniform amount of electrolyte per unit
area to a first plurality of preselected areas on a conductive
workpiece to be plated from a source of electrolyte; said source of
electrolyte providing a single stream of electrolyte to said
system; said system including:
first means for dividing said single stream of electrolyte into a
second plurality of streams flowing at high velocity;
second means for slowing down and shaping said second plurality of
streams into a third plurality of streams shaped to provide
electrolyte to said first plurality of preselected areas; said
first and third pluralities being equal;
each of said second plurality of streams has equal volume per unit
flowing therein; and
means including a top plate for forming a first chamber having a
preselected cross-sectional area; said top plate having holes
therethrough equal in number to said second plurality for said
third plurality of streams to flow therethrough; said holes having
a total area; said preselected cross-sectional area being large
compared with said total area.
2. The system as defined in claim 1 in which said second means
includes:
a baffle plate for dispersing the flow of said second plurality of
streams to provide dispersed streams; and
a collimating plate for collimating said dispersed streams into
said third plurality of streams.
3. The system as defined in claim 2 in which said first chamber has
an inlet opening therein for receiving said single stream of
electrolyte; said system also including:
pumping means for supplying said single stream to said inlet
opening under pressure.
4. The system as defined in claim 3 also including:
anode means mounted in spaced relationship from said workpiece and
in the path of said second plurality of streams; and
an electric power source operably connected between said workpiece
and said anode means.
5. The system as defined in claim 4 also including masking means
for defining said first plurality of preselected areas.
6. The system as defined in claim 5 also including means for
holding said workpiece against said masking means.
Description
FIELD OF THE INVENTION
This invention relates to a system for electroplating predetermined
areas on conductive workpieces and particularly to a sparger used
therein.
BACKGROUND OF THE INVENTION
There are numerous requirements in the electronic, industrial, and
decorative fields for the selective plating of precious metal onto
selected areas of a conductive workpiece. Presently most of the
selective plating done uses an inert coating which is applied to
the workpiece to mask the areas which are not to be plated. The
coated workpiece is then inserted into a conventional plating bath
as a cathode and electro-plated. The coating must then be removed
after the plating has been completed to provide the finished
selectively plated workpiece.
Many of the coatings used are organic. These coatings normally
dissolve to a certain extent in the electroplating bath. The
disolved organic matter contaminates the bath, requiring constant
refining of the electro-plating bath.
Today, a workpiece which really needs to be plated only in a
selected area with a precious metal, but will serve its intended
function if the entire workpiece is plated is completely plated.
This is because it has been found that the cost of applying and
removing inert coating through the workpiece and refining the
electro-plating baths is greater than the cost of precious metal
applied to areas unnecessarily. This is true even when the cost of
the additional precious metals is significant with respect to the
cost of the entire workpiece.
A machine for plating selected areas of a workpiece is disclosed in
a copending U.S. Pat. application of Albert M. Martini et al., Ser.
No. 39,014, Filed--May 20, 1970, entitled "Machine for Selective
Plating" in which the conductive workpiece to be plated is masked
by a top plate of a manifold or sparger. It has been found that the
above system satisfactorily masks the workpiece but when multiple
areas are to be plated, the quantity of electrolyte provided to
each area varies thereby providing different plating thicknesses on
each of the preselected areas.
Therefore it is an object of this invention to provide an improved
machine for electro-plating a conductive workpiece in preselected
areas.
It is a further object of this invention to provide a machine for
selectively plating preselected areas of a conductive workpiece
with uniform thickness of plating on each of the preselected
areas.
BRIEF DESCRIPTION OF THE INVENTION
In accordance with this invention a system is provided for
providing a uniform amount of electrolyte to a plurality of
preselected areas on a conductive workpiece from a single stream of
electrolyte. The system includes a plate for dividing the stream of
electrolyte into equal volume paths at high velocity and a second
plate for slowing down and shaping the flow of electrolyte in each
path for application to the respective preselected areas.
In the preferred embodiment the slowing down and shaping is
performed by a pair of plates, one of which forces the fluid to
flow towards the periphery of the sparger and the second one
collimates the fluid before it is applied to the workpiece.
DESCRIPTION OF THE DRAWINGS
FIG. 1 is a functional diagram partially in block diagram form and
partially in section showing a system embodying the principles of
this invention;
FIG. 2 is a sectional view through the line 2--2 of FIG. 1 showing
a conductive workpiece having been plated in accordance with the
teachings of this invention;
FIG. 3 is an exploded view showing three central plates and
portions of anodes in a sparger used in the system of FIG. 1;
and
FIG. 4 is a sectional view through the line 4--4 of FIG. 1 showing
additional details of the sparger construction.
DETAILED DESCRIPTION OF THE DRAWINGS
Referring first to the FIG. 2, we see a copper workpiece 10 having
two small circular regions 11a and 11b which have been selectively
gold plated thereon by a machine built in accordance with the
teachings of this invention.
In FIG. 1, we see the workpiece 10, shown in half scale, mounted
for plating in the apparatus of this invention. The apparatus
includes a sparger 12, a tank of electrolyte from the tank 13, a
pump system 14 for circulating electrolyte from the tank 13 through
the sparger 12 onto the workpiece 10 and a hydraulic press 16 for
holding the workpiece 10 against the sparger 12 during the plating
operation.
The sparger 12 is mounted in a trough 17 which rests on a support
18. An outlet pipe 19 extends out from the bottom of the trough 17
and through the support 18. The sparger 12 is held above the bottom
surface of the trough 17 by two supports 21 and 22. The trough 17
and the supports 21 and 22 are constructed from materials which are
chemically inert in the electrolyte to be used in the plating
process.
Referring now to FIGS. 1, 3 and 4 we see that the sparger 12 is
formed from five horizontally arranged plates 23 through 27 forming
four fluid receiving chambers 28 through 31 therein. A pair of
anodes 32 and 33 are embedded in the sparger 12 to provide a source
of ions for the plating operation.
The anodes 32 and 33 extend from the bottom plate 23 through to the
second, third and fourth plates 24, 25 and 26 respectively,
terminating slightly above the fourth plate 26. The anodes 32 and
33 completely seal the holes provided therefore in the bottom plate
23 rendering that plate fluid tight. In a like manner, the anodes
32 and 33 seal holes 34 and 36 through which they pass in the
second plate 24. It should be noted that a pair of small holes 37
and 38 and 39 and 40 each having an equal area of opening flank the
holes 34 and 36 respectively in the plate 24. These holes 37
through 40 are not blocked by the anodes 32 and 33.
The anodes 32 and 33 also pass through and seal holes 41 and 42 in
the third plate 25. The holes 41 and 42 in the plate 25 are flanked
by a pair of cusps 43 and 44 and 46 and 47 respectively. It should
be noted that the holes 37 through 40 are arranged on a
longitudinal axis of the sparger 12 while the cusps 43, 44, 46 and
47 are aligned with respect to a transverse axis thereof. As a
result the portions of the plate 25 directly above the holes 37
through 40 are solid while the portions of the plate 24 below the
cusps 43, 44, 46 and 47 are also solid. The holes 37 through 40 can
be seen best in FIGS. 1 and 3 while the cusps 43, 44, 46 and 47 can
best be seen in FIGS. 3 and 4. Finally, the anodes 32 and 33 pass
through a pair of holes 48 and 49 in the fourth plate 26 with
sufficient clearance to form an annulus of clearing
therearound.
The sparger 12, as well as the plates 23 through 27, are made from
inert nonconducting material. Therefore, the anodes 32 and 33 have
been provided as a source of local current for the plating process.
It should, of cource, be understood that anodes can be provided in
other ways in which case in accordance with this invention the
holes 34, 36, 41 and 42 would not be provided but an annulus would
still be provided where the holes 48 and 49 are provided in this
embodiment. The fifth plate 27 of the sparger 12 has a pair of
holes 51 and 52 aligned with anodes 32 and 33. A mask 56 having
beveled holes 57 and 58 therethrough is mounted in spaced
relationship from the plate 27 with the holes 57 and 58 aligned
with the holes 51 and 52.
In operation the workpiece 10 is held against the mask 56 by a ram
53 of the hydraulic press 16 having a neoprene layer 54 attached
thereto. Electric power from a power source 54 is appropriately
applied to the anodes 32 and 33 and the workpiece 10. The pump
system 14 pumps electrolyte from the tank of electrolyte 13 through
an inlet port 56 into the first chamber 28 of the sparger 12.
Since the cross-sectional area of the chamber 28 is large compared
with the total area of the holes 37 through 40, energy supplied by
the pumping system 14 to the electrolyte appears primarily as
potential energy (i.e. pressure) rather than kinetic energy (i.e.,
velocity). In this way relatively equal velocity and therefore
relatively equal volumes pass through each of the equal size holes
37 through 40 into the second chamber 29. It should be appreciated
that if the cross-sectional area of the first chamber 28 was small
compared to the total area of the holes 37 through 40, the pressure
therein would not build up and a large portion of the energy in the
electrolyte would be kinetic. As a result much greater variations
would be present in the flow through the holes 37 through 40. This
becomes particularly acute when long spargers are employed and also
when the spacing between the anodes (for multi-anode operation) is
unequal.
It is, of course, appreciated that the first plate 23 could be
curved upward along its length to provide the equal flow without
the necessity for the large cross-sectional area of the chamber 28.
This approach, however, to equalization of flow through the holes
37 through 40 requires a far more expensive manufacturing process
for the sparger 12.
The fluids flowing through the holes 37 through 40 are at a high
but equal velocity. In most cases the velocity thereof is greater
than required for proper plating. Therefore, the plate 25 blocks
direct flow of the streams flowing through the holes 37 through 40.
Rather, the second chamber 29 fills and flow is directed towards
the outer walls of the sparger 12 through the scallops 43, 44, 46
and 47. The plate 25 acts in this way as a baffle.
The fluid flowing through the scallops 43, 44, 46 and 47 fills the
third chamber 30 and flows through the annulus formed by the holes
48 and 49 and the anodes 32 and 33. The collimated stream therefrom
flows through the holes 51 and 52 of the plate 27 and through the
holes 57 and 58 of the mask 58 and then onto the workpiece 10
providing relatively equal volumes and velocities of electrolyte to
each of the preselected areas 11a and 11b on the workpiece 10 for
plating.
The bevels of the holes 57 and 58 are provided to carry electrolyte
away from the sparger 12 after striking the workpiece 10. The fluid
thus carried away is returned to the tank of electrolyte 13 after
flowing to the bottom of the trough 17.
It should be understood that while this embodiment has been shown
with two anodes and two preselected areas 11a and 11b to be plated,
the principles taught in here are particularly applicable to long
spargers in which multiple preselected areas are to be plated.
It should be obvious that the size of the preselected areas 11a and
11b of the workpiece 10 will require one of a set of relationships
between the nominal diameter of the annulus, the diameter of the
holes 51 and 52, the distance from the plate 27 to the mask 56 and
the dimensions of the holes 57 and 58 in the mask 56.
It should be further noted that controls can be provided in series
with each of the anodes 32 and 33 to adjust current densities to
further insure equal thickness plating on each of the preselected
areas 11a and 11b.
While this invention has been described with respect to a
particular embodiment thereof, numerous others will become obvious
to those or ordinary skill in the art in light thereof.
* * * * *