U.S. patent number 3,737,729 [Application Number 05/152,874] was granted by the patent office on 1973-06-05 for electronic package and method of construction.
This patent grant is currently assigned to Zeltex, Inc.. Invention is credited to Durland B. Carney.
United States Patent |
3,737,729 |
Carney |
June 5, 1973 |
ELECTRONIC PACKAGE AND METHOD OF CONSTRUCTION
Abstract
An electronic package including a case, circuit board, and
elongated electric leads extending from the interior side of said
circuit board to the outside of the case and having a snap action
interfit with the case automatically locking the parts in attached
position upon assembly. The exterior side of the circuit board is
coated to provide the exterior side of the package.
Inventors: |
Carney; Durland B. (Concord,
CA) |
Assignee: |
Zeltex, Inc. (Concord,
CA)
|
Family
ID: |
22544818 |
Appl.
No.: |
05/152,874 |
Filed: |
June 14, 1971 |
Current U.S.
Class: |
361/740; 361/759;
361/776; 174/546; 174/555; 174/556 |
Current CPC
Class: |
H05K
5/0091 (20130101); H05K 3/3405 (20130101); H05K
5/064 (20130101); H05K 2201/10424 (20130101); H05K
3/3447 (20130101); H05K 2201/1034 (20130101) |
Current International
Class: |
H05K
5/00 (20060101); H05K 5/06 (20060101); H05K
3/34 (20060101); H05k 005/00 () |
Field of
Search: |
;174/52S,52PE,DIG.3
;317/11CC,11PH,118,120 ;338/312,313 ;339/17C,17CF ;29/626,627 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Schaefer; Robert K.
Assistant Examiner: Tolin; Gerald P.
Claims
I claim:
1. An electronic package comprising:
a case having a closed side and a peripheral wall;
a circuit board carried by and providing a closure for said
case;
a plurality of U-shaped spring leads each having one leg connected
to and extending interiorly from the interior side of said board
and a spring-leg portion thereof extending from said first named
leg to a position exterior of said case and in resilient
compression against said case wall; and
snap means formed by said wall and at least one of said spring-leg
portions in resilient compression against said case wall holding
said board in position in relation to the case.
2. A package as defined in claim 1, said leads being disposed on
parallel rows adjacent opposite edges of said board;
said wall confronting said edges being formed with a plurality of
spaced projections forming interfitting portions to cofunction with
said resilient compression of said spring-leg; and
at least certain of said spring-legs having a width fitting between
said projections and provided with enlarged portions engaging
behind the interior ends of said projections locking said board and
case together.
3. A package as defined in claim 2, the exterior ends of at least
certain of said projections providing a seat for said board.
4. An electronic package as defined in claim 1, and a coating of
electrical insulation material mounted on the opposite side of said
circuit board and defining an exterior side of said package.
5. A method of constructing an electronic package having externally
extending leads, a case having a closed side and a peripheral wall,
a circuit board dimensioned for fitting within said case with the
side edges of said board confronting said peripheral wall, and
electronic components, comprising:
mounting of said components on a first side of said board;
selecting leads of resilient current conducting material and
attaching said leads to said board adjacent its periphery to extend
from said first board side;
connecting said components and leads at the opposite side of said
board in a manner providing a substantially smooth surface at said
second side;
forming said leads with spring suspended legs extending in a
reverse direction to overlie opposite side edges of said board in
spaced relation thereto;
forming said legs and peripheral wall with interfitting and
interlocking portions;
coating said second side of said board with an electrical
insulation material defining an exterior side of said package;
positioning said board with its first side facing interiorally of
said case toward the closed side thereof with said legs engaged
with said peripheral wall; and
moving said board in a direction interiorally of said case
resiliently compressing said legs against said peripheral wall and
until said portions are moved into registration to effect snap
action latching of said board and case.
Description
The invention relates to electronic apparatus and, more
particularly, to cases and housing constructions therefor.
Electronic apparatus commonly employs circuit boards for mounting
and connecting the various electronic components, and the circuit
boards are, in turn, mounted within suitable cases or housings with
electric leads brought out from the housing for connection to
external circuitry. The present invention uses a novel mechanical
association and co-functioning of the circuit board, leads and case
to provide an improved production and assembly technique, resulting
in optimum use space, the need for fewer parts and for an easier,
more rapid and lower cost assembly of units.
Another object of the invention is to provide an electronic package
of the character described which lends itself to modular
construction with the electric leads serving as pins positioned for
insertion in standard DIP PC board receptacles, and wherein the
leads are afforded a range of movement for fitting standard
spacings such as customary 0.5 inch and 0.6 inch center-to-center
spacing found in dual in-line pin receptacle boards.
A further object of the present invention is to provide an
electronic package of the above character which is tamper proof
without the use of potting material and which may be nevertheless
repaired when required.
The invention possesses other objects and features of advantage,
some of which of the foregoing will be set forth in the following
description of the preferred form of the invention which is
illustrated in the drawings accompanying and forming part of this
specification. It is to be understood, however, that variations in
the showing made by the said drawings and description may be
adopted within the scope of the invention as set forth in the
claims.
Referring to said drawings:
FIG. 1 is a perspective view of a part of the electronic package
showing a first step in assembly;
FIG. 2 is a cross sectional view;
FIGS. 3, 4 and 5 are perspective views of the part shown in FIG. 1
in subsequent steps in the assembly of the package;
FIG. 6 is an exploded view of the circuit board and case parts of
the package oriented for assembly;
FIG. 7 is a perspective view of the completed package shown in
normally inverted form;
FIG. 8 is a fragmentary cross sectional view on an enlarged scale
of a part of the package; and
FIG. 9 is a fragmentary cross sectional view taken substantially on
the plane of line 9--9 of FIG. 8.
The electronic package of the present invention comprises briefly a
case 11; a circuit board 12 having an edge 13, see FIG. 8,
juxtaposed to a wall 16 of the case and having a side 17 disposed
interiorly of the case for mounting of electronic components as
depicted in FIGS. 1 and 6; and at least one elongated electric lead
18, see FIG. 8, formed of resilient material and connected to board
12 and extending from interior side 17 exteriorly of the package
between edge 13 and wall 16 with the lead in resiliently pressed
engagement with the wall; and means as best illustrated in FIGS. 8
and 9 interlocking lead 18 and wall 16 in assembled position. In
accordance with the present invention, the interlocking means
comprises interfitting portions on the lead and wall which
automatically provided a snap interfit upon movement of the
portions into registration. These portions here consist of a
plurality of spaced projections 21 formed on wall 16 for
accommodating a plurality of leads 18 here mounted at opposite side
edges 13 and 14 of circuit board 12 and which cooperate with
projections 21 on opposite side walls 16 and 22 of the case. The
leads are formed of flat, elongated strips of current-conducting
resilient material such as beryllium copper and which have reduced
width portions 23 having a width fitting between projections 21 and
relatively enlarged adjacent portions 24 which engage behind the
interior ends 26 of projections 21 to lock the leads in place. As
will be seen in FIGS. 1 and 2, portions 24 comprise the full width
of the conductor strip whereas portions 23 are reduced in width so
as to define a shoulder therebetween for interlocking behind the
interior ends 26 of projections 21. The outer ends 27 of the strips
are again reduced to standard pin size. As will also be best seen
from FIG. 8, the outer surfaces 28 of projections 21 are lined up
along the opposite walls 16 and 22 of the case to provide a support
for the interior surface 17 of the circuit board whereby the latter
is effectively locked in place on the case.
Preferably and as here shown, the leads are formed to provide
leaf-type springs for resilient engagement with the side walls 16
and 22. Accordingly, the leaves are bent or otherwise formed of
generally U-shape having a first leg or portion 31 extending
interiorly of the case generally perpendicularly to side 17 and a
contiguous second spring suspended leg or portion 32 extending from
portion 31 at an acute angle; and importantly, the interlocking
structure is provided on the second portion which also extends
exteriorly of the case.
One of the important features of the present package is that the
circuit board 12 becomes part of and, more specifically, the bottom
of the case with the underside 34 of the circuit board defining the
underside of the case. The lead latching construction avoids the
need for potting and the entire interior space of the case becomes
available for components thus maximizing the use of space and
reduction in overall size. The pins 18 are located at the very
edges of the circuit board and case which allows closely adjacent
placement of other modular units. Also, the retaining of the leads
between projections 21 provides a positive spacing and alignment of
the leads while clearance between the confronting side edges of the
circuit board and case permit considerable flexibility in location,
row center line to center line, facilitating insertion into PC
boards or PC board/socket combinations with considerable tolerance
latitude. In this connection, it will be noted that the leads are
not solidly captured in a lateral direction in the sockets provided
by projections 21 but are permitted flexibility of motion to
accommodate themselves to openings in the PC board.
In order to effectively use the underside 34 of the circuit board
as the exterior surface of the case, there is applied in accordance
with the present invention a coating of electrical insulation
material to this surface. An epoxy may be applied for this purpose,
as by a sponge 36 as depicted in FIG. 5. An epoxy or other similar
type material will provide a hard, durable exterior surface for the
unit as well as electrical insulation. Preferably, a circuit board
technique is used which provides a smooth, flush underside prior to
the application of the coating.
The snap-in assembly of the circuit board and case as above
described provides a tamper proof construction since the circuit
board cannot be removed without breaking the case. When repair is
required, the case will be broken, the circuit board removed and
repaired, and then inserted into a new case.
A description of the method of construction of the package follows.
The leads are initially obtained as lead frames with a top frame
bar 37. The first step is the conventional one of "stuffing" of
components and lead frames into the top side 17 of the PC board
which is then flow soldered in a conventional manner. The next step
is the trimming of the leads flush with the bottom surface 34 of
the circuit board as depicted in FIG. 2. The next step is the
forming or bending of the lead frames to provide the acute angled
portions 31 and 32 as seen in FIG. 3; and the trimming off of the
lead frame tie bar as seen in FIG. 4 thus freeing up the individual
leads. At this point the unit may be electrically tested before
proceeding with the balance of the assembly steps.
The next step is the coating of the bottom side 34 of the board
with the epoxy or equivalent coating. This can be conveniently done
by inverting the assembly as seen in FIG. 5 so that the bottom side
34 is uppermost and the leads are at this point spaced widely from
the opposite edges of the board leaving the surface of the board
easily and fully accessible. A layer of epoxy or equivalent coating
may be flowed onto the surface by means of a sponge 36, or the
material may be brushed on or otherwise applied. Upon setting of
the epoxy material, the circuit board and leads are ready for
insertion into the case, and the two parts are preferably oriented
for insertion as depicted in FIG. 6 so that the knees 41 of the
leads are disposed in parallel rows and oriented to enter the open
side 42 of case 11. The parts are preferably mounted in a press for
the final step of telescopically displacing the parts to their
final position. As the outturned lead portions 32 engage the rim of
the case at the open upper extremities of walls 16 and 22, they are
resiliently compressed inwardly so as to enter the case; and when
the reduced portions 23 register with projections 21, the leads
will spring outwardly with snap action into their interlocked
position as shown in FIG. 9.
* * * * *