U.S. patent number 3,676,814 [Application Number 05/009,372] was granted by the patent office on 1972-07-11 for high temperature adhesive overcoat for magnet wire.
This patent grant is currently assigned to Westinghouse Electric Corporation. Invention is credited to David A. Scheidmantel, Floyd F. Trunzo.
United States Patent |
3,676,814 |
Trunzo , et al. |
July 11, 1972 |
**Please see images for:
( Certificate of Correction ) ** |
HIGH TEMPERATURE ADHESIVE OVERCOAT FOR MAGNET WIRE
Abstract
An electrical conductor is coated with a high temperature
thermosetting wire enamel base coat and overcoat of an aromatic
thermoplastic polysulfone adhesive to form a composite insulated
electrical conductor.
Inventors: |
Trunzo; Floyd F. (Monroeville,
PA), Scheidmantel; David A. (Pittsburgh, PA) |
Assignee: |
Westinghouse Electric
Corporation (Pittsburgh, PA)
|
Family
ID: |
21737254 |
Appl.
No.: |
05/009,372 |
Filed: |
February 6, 1970 |
Current U.S.
Class: |
336/205; 29/605;
156/175; 156/182; 174/110SR; 427/116; 427/120; 427/388.2; 428/383;
156/169; 156/180; 156/307.5; 427/118; 427/388.1; 428/379;
428/401 |
Current CPC
Class: |
H01B
3/307 (20130101); H01B 3/308 (20130101); H01B
3/30 (20130101); Y10T 29/49071 (20150115); Y10T
428/2947 (20150115); Y10T 428/298 (20150115); Y10T
428/294 (20150115) |
Current International
Class: |
H01B
3/30 (20060101); H01b 003/42 (); H01f 027/30 () |
Field of
Search: |
;117/218,232,161R,75,128.4 ;260/79.3R |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
|
|
|
|
|
|
|
650,476 |
|
Jul 1964 |
|
BE |
|
1,060,546 |
|
Mar 1967 |
|
GB |
|
Primary Examiner: Martin; William D.
Assistant Examiner: Speer; Raymond M.
Claims
We claim as our invention:
1. An adhesive coated, high temperature insulated electrical
conductor comprising in combination, a metal conductor, a base coat
of a cured solid high temperature thermosetting resin selected from
the group consisting of polyester amide-imide, polyester,
polyamide-imide and polyimide deposited on the conductor, and an
overcoat, between 0.0,001 and 0.005 inch thick, of solid
thermoplastic adhesive consisting essentially of linear aromatic
polysulfone resin having a melting point between 180.degree. C and
260.degree. C deposited over said base coat.
2. The insulated conductor of claim 1 wherein the polysulfone is
selected from the group consisting of polysulfones having the
formulas: ##SPC9##
3. The insulated conductor of claim 1 wherein the polysulfone has
the formula: ##SPC10##
and the thermosetting resin is polyester amide-imide resin.
4. A transformer coil having a plurality of turns of the insulated
conductor of claim 3.
5. A method of making a magnet wire coil for an electrical
apparatus comprising the steps of:
1. depositing a base coat of high temperature thermosetting resin
selected from the group consisting of polyester amide-imide,
polyester imide, polyester, polyamide-imide and polyimide in a
solution on a conductor;
2. passing the coated conductor through an oven having a
temperature between about 100.degree. C and 430.degree. C, at a
uniform speed, to form a solid film;
3. depositing an adhesive overcoat of aromatic thermoplastic
polysulfone resin, having a melting point between 280.degree. C and
260.degree. C, in solution on the base coated conductor; followed
by
4. repeating step (2) to continuously form a base coated conductor
having an overcoat between 0.0,001 and 0.005 inch thick of
adhesive; followed by
5. winding the composite coated conductor into a coil having a
plurality of adjacent contacting conductor turns; and finally
6. heating the composite coated coil between about 200.degree. to
260.degree. C to fuse the thermoplastic polysulfone overcoats of
adjacent conductor turns together.
6. The method of claim 5 wherein the oven of step (2) has a
temperature gradient of between about 100.degree. C at the entrance
and about 430.degree. C near the exit.
7. The method of claim 7 wherein the heating in step (6) is
resistance heating.
8. The method of claim 6 wherein the polysulfone is selected from
the group consisting of polysulfones having the formulas:
##SPC11##
9. The method of claim 6 wherein the polysulfone has the formula:
##SPC12##
and the thermosetting resin is polyester amide-imide resin.
Description
BACKGROUND OF THE INVENTION
This invention relates to high temperature adhesive magnet wire
insulation. In particular, this invention relates to magnet wire
overcoat solutions of modest cost containing thermoplastic linear
aromatic polysulfone resins, that will meet class 155.degree.
C-180.degree. C requirements as a baked overcoat film, and as such,
exhibit a superior combination of adhesive qualities, heat shock
resistance, and thermal stability in air, together with
satisfactory properties as regards flexibility, abrasion
resistance, and the like.
There is a need for replacing the costly varnishing operation
required to bond magnet wire turns in coils of electrical equipment
so that they are rigid and remain in place. There is also a need
for a resinous adhesive having higher operational temperatures than
the presently used epoxy-urethane, polyvinyl formal and polyvinyl
butyral adhesives used to overcoat electrical equipment coils.
We have found that polysulfone resin based overcoats in particular
can solve present problems and fulfill the need for a high
temperature magnet wire adhesive.
Polysulfones were introduced to the market in 1965 as a novel type
of linear aryl polymer consisting of phenylene units linked by
isopropylidene, ether and sulfone groups. This material, having
high deflection temperatures under load and high tensile strength,
was found suitable for use as housings for engineering, electrical
and domestic appliances where heat and/or creep resistance were
important requirements. Applications also encompassed use as
electronic parts including connectors, integrated circuit carriers
and other molded components. They have also been suggested as
possible adhesives, impregnating resins, wire coatings and
electrical insulating materials where severe and corrosive ambient
conditions are found (British Pat. No. 1,060,546) and high
temperature base coat extruded wire insulation (R. K. Waton,
1968-1969 Modern Plastics Encyclopedia, p. 286).
In terms of its chemical makeup, polysulfone has the repeating
structure shown below: ##SPC1##
The most distinctive feature of the backbone chain is the
diphenylene sulfone group: ##SPC2##
This group imparts excellent thermal and oxidation resistance.
Flexibility in the backbone of the polymer to impart toughness is
contributed by the ether linkage and augmented by the
isopropylidene link. Such aryl polymers can be prepared via the
nucleophilic aromatic substitution reaction shown below, where n is
the monomer number: ##SPC3##
Evaluating our high temperature, composite, base enamel-adhesive
overcoated wire involved numerous tests. These will be described
briefly below and their significance indicated.
In the Quick-Elongation Test, a piece of our coated wire, 12 inches
in length, with an S-bend at its midpoint, was placed between a
stationary and movable chuck, and elongated rapidly to break the
wire at a point about 1 inch from either fastener. This test
measures flexibility of the insulation and indicates the degree of
coating adhesion. It is also used as a control test to determine if
the insulation is underbaked or overbaked.
In the Elongation +1X Test, one end of a length of our coated wire
was mounted in a stationary chuck and the other end mounted in a
movable chuck. The wire was elongated a fixed percentage until
flaws appeared in the insulation. The maximum elongation, in
percent, that the insulation will remain flawless and free of
imperfections after being wrapped on a 1X mandrel is considered the
degree of flexibility of the insulation. This test measures the
ductility of an insulation film on a conductor and indicates the
degree to which a wire can be elongated and remain free of cracks,
faults, and other imperfections. This simulates the stretching and
stress to which a wire is subjected when passing over small radii
pulleys, guides, and on coil forms as it is being wound into
finished coils.
In the G.E. Repeated Scrape Abrasion Test, abrasion of our wire
coating was accomplished by moving a 16-mil diameter, No. 11
needle, back and forth a distance of three-eighths inch at a right
angle to the wire by a motor and eccentric shaft mechanism. The
number of cycles required to cause the needle to break through the
insulation is the GESA value.
In the Westinghouse Scrape Test, a 12 inch length of our coated
wire was pulled under a 9-mil diameter weighted steel piano wire at
right angles to the piano wire for a distance of 3 inches on each
of four sides (90.degree. apart). The weight required to scrape off
one-half the insulation on the conductor is considered the scrape
value.
In the Emerson Scrape Test, our coated wire was drawn at 60
ft./min. under and at a right angle to a weighted 51-mil diameter
needle, which was repeatedly placed on and off the moving wire by a
cam action assembly. The weight required to scrape through to the
conductor 8 out of 10 times is the reported single scrape
value.
These scrape tests measure the resistance of the insulation to
scrape and abrasion, and the degree of adhesion of the film to the
base metal or the cohesion between coating layers. These properties
are indications of the ability of the enamel base coat and overcoat
films to withstand coil winding abuses.
In the Heat Shock Test, a length of our coated wire was wrapped on
a 1X mandrel 20 times to form a coil. Each test sample was placed
in an oven at a specified temperature. The highest temperature at
which the stressed coils withstood visual breaks or failure
occurring in the insulation after being heated for 1 hour and
cooled to room temperature is considered the heat shock value.
Visual observation was made under a microscope at approximately 23X
magnification. This test indicates the ability of the insulated
wire to withstand heat while in a stressed conditions as
encountered in wound magnet wire coils.
Another test is the Thermal Life Test. This is a test measuring the
expected thermal-class rating of varnished or unvarnished magnet
wires in electrical equipment and is based on the theory of
electrical-insulation deterioration treated as a chemical-rate
phenomenon. The test procedure used was that described in IEEE No.
57. Data for our insulated wire is reported in terms of
hours-to-failure at a given temperature.
Values for the results of all these tests on our composite
insulated wire is reported hereinafter in Table 1.
BRIEF SUMMARY OF THE INVENTION
It has been found that novel high temperature resinous solutions,
based on thermoplastic linear aromatic polysulfone resins having
melting points (point where the resin begins to soften, i.e.,
transition point) above about 180.degree. C, can be made compatible
with high temperature wire enamel base coat films, such as
polyester-amide-imide enamels. These polysulfone resins maintain
the same melting point characteristics after being applied as an
adhesive coating. Polysulfone adhesive coatings having melting
(transition) points below about 180.degree. C will not give the
high temperature characteristics necessary for high temperature
coil class 155.degree. C-180.degree. C requirements.
Polysulfone, dissolved in a suitable solvent such as
dimethylacetamide makes an excellent coil wire adhesive overcoat
solution that we have successfully coated over enameled wire. This
adhesive-enamel coated wire was wound into a magnet wire coil and
the turns of the magnet wire were fused together to a rigid form by
resistance heating and also by heating in a high temperature
atmosphere between about 200.degree. and 260.degree. C. We found
that we could apply the base coat enamel, followed by a coating of
the polysulfone adhesive solution in one continuous operation,
rather than having to coat the two components at different
temperatures in two different operations. This is a tremendous
advantage in manufacturing operations and is due to the similar
coating and curing characteristics of the base enamel and adhesive
overcoat. The combination of a wire conductor with a base coat
enamel and adhesive overcoat, with subsequent coil winding and heat
treatment to cause the adhesive to bond the coils together, results
in a rigid coil having a thermal life rating of about 180.degree.
C.
The use of our adhesive overcoat eliminates subsequent varnishing
and additional baking operations usually associated with bonding
the loose magnet wire turns in a coil into a rigid coil. It also
results in better heat transfer through the coil and in motor
stator slots containing coils because heavy sections of varnish are
eliminated and there is greater space for air circulation.
BRIEF DESCRIPTION OF THE DRAWINGS
For a better understanding of the invention reference may be had to
the exemplary embodiments shown in the accompanying drawings, in
which:
FIG. 1 shows a fragmentary isometric view of a conductor with a
thermosetting insulating enamel base coat and a polysulfone high
temperature adhesive overcoat;
FIG. 2A shows a three dimensional view of a magnet wire transformer
coil, the wound conductors of which may be fused together with the
polysulfone adhesive of this invention;
FIG. 2B shows a sectional view of the coil of FIG. 2A wherein the
conductors are bonded to each other by polysulfone adhesive;
FIG. 3 shows a fragmentary view of a motor stator slot containing
coils; and
FIG. 4 shows a flow diagram of a method for producing the composite
insulated wire of this invention and coils made therefrom.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
The novel high temperature wire adhesive of this invention
comprises resinous solutions of aromatic polysulfone resins. These
are used for overcoating specific high temperature wire enamel
films as shown in FIG. 1.
The polysulfone resin can be made by the condensation of bisphenol
with activated aromatic dihalides. In one method of making this
resin, 51.36 grams (0.225 mole) of high purity bisphenol A,
[2,2-bis (4-hydroxyphenyl) propane], 115 grams of dimethyl
sulfoxide and 330 grams of chlorobenzene are added to a reaction
vessel and heated to about 70.degree. C. Air is displaced from the
system by flushing with nitrogen and 0.45 moles of 50 percent
aqueous sodium hydroxide is added, resulting in two liquid phases:
one chlorobenzene and the other a disodium salt dissolved in
aqueous dimethyl sulfoxide. The system is brought to reflux using a
fractionating column. Water is removed and the chlorobenzene that
codistills is continuously returned until the temperature reaches
140.degree. C, at which point the disodium salt of bisphenol A
appears as a precipitate.
A 50 percent solution of 64.61 grams (0.225 mole) of
4,4'-dichlorodiphenyl sulfone in dry chlorobenzene maintained at
110.degree. C is then added over a 10-minute period, the excess
solvent being allowed to distill at a rate sufficient to hold the
material temperature at about 160.degree. C. When all the sulfone
has been added, polymerization is continued until the desired
degree of polymerization is reached: ##SPC4##
where n is the monomer number.
The viscous polymer is then cooled and diluted with about 700 grams
of chlorobenzene. The by-product sodium chloride is removed by
vacuum filtration and the solution is coagulated in three or four
volumes of ethanol. The resulting material is dried in a vacuum
oven. The yield is about 90 percent of theory. Further details of
preparation can be found in an article by R. H. Johnsen et al. in
the Journal of Polymer Science, Part A-1, Vol. 5, pp. 2375-2395
(1967).
This linear aromatic polysulfone resin is a thermoplastic, has a
melting point of about 187.degree. C and a deflection temperature
of about 174.degree. C at 264 psi. (ASTM method D648). Thermal
stability is provided by the high strength bonds of the diphenylene
sulfone group. This group is an aromatic entity, and capable of a
high degree of resonance. A strongly resonant structure produces
bonds that are stronger than otherwise possible. Therefore, large
amounts of incident energy in the form of heat can be dissipated
without chain scission or crosslinking taking place.
Other polysulfones that are useful as the resin component of high
temperature magnet wire adhesive enamel solutions would include
[(4,4'-diphenoxy)-4,4'-diphenylsulfonyl] -4,4'-diphenoxydiphenyl
sulfone: ##SPC5##
polysulfone (polyarylether)
where the monomer number n is about 3. This linear aromatic
polysulfone is a thermoplastic, has a melting point of about
227.degree. C and can be prepared by reacting the potassium salt of
4-hydroxy-4'-phenoxydiphenyl sulfone with 4,4'-difluorodiphenyl
sulfone for about 4 hours at between 135.degree. C and 155.degree.
C. Further details of preparation can be found in an article by W.
F. Hale et al. in the Journal of Polymer Science, Part A-1, Vol. 5,
pp. 2403-2405 (1967).
Other linear aromatic polysulfone thermoplastic resins suitable for
adhesive overcoats of our invention can be made by Friedel-Crafts
polycondensation of dinuclear aromatic sulfonyl chlorides and
aromatic hydrocarbons: ##SPC6##
where the monomer number n = 20 -- 500; and ##SPC7##
where the monomer number n = 45 -- 1,000.
In the above reaction, the sulfone group has a deactivating effect
on the aromatic ring to which it is attached or becomes attached
during polymerization. With proper temperature control the
deactivating effect prevents more than monosulfonation in any one
aromatic ring. Chain branching or crosslinking is thus avoided. The
synthesis requires only small quantities of ferric chloride
catalyst (about 0.1 to 1.0 mole percent depending upon the solvent,
at reaction-temperature from 80.degree. to 250.degree. C). The
solvents that are preferred as a reaction medium include acetylene
tetrachloride and dimethyl sulfone.
These linear polyarylsulfones contain no aliphatic carbon-carbon
bonds and have melting points of about 250.degree. C and deflection
temperatures as high as 370.degree. C at 264 psi. For a detailed
description and synthesis of these two polymers, reference may be
made to French Pat. No. 1,453,031 and British Pat. No. 1,060,546.
The value of n (repeating monomer number) in the formula for these
two polymers is such that the inherent viscosity (.eta. inherent) =
(1n. .eta. relative)/C = 0.2-2.0. The relative viscosity (.eta.
relative) is determined by dividing the flow time in a capillary
viscometer of a dilute solution of the polymer by the flow time for
the pure solvent. The concentration (C) is 1.0 gram of polymer per
100 ml of solution and the measurements are made at 25.degree. C in
dimethyl-formamide solution.
These linear aromatic polysulfone thermoplastic resins are used in
solution and cured to form adhesive films over specific high
temperature thermosetting wire enamels. The high temperature wire
enamels which form the base coating on the wire conductor and with
which these adhesive solutions are compatible in terms of curing
temperature and curing characteristics include polyester
amide-imide, polyester imide, polyester, polyamide-imide and
polyimide resinous enamels. Of these, the preferred enamel is the
polyester amide-imide, which is described in U.S. Ser. No. 730,833,
now U.S. Pat. No. 3,555,113, filed on May 21, 1968 and assigned to
the assignee of this invention. Polyester imide resins are
described in British Pat. Nos. 973,377 and 996,649; polyamideimide
resins are described in U.S. Pat. No. 3,179,635; polyimide resins
are described in U.S. Pat. Nos. 3,179,630, 3,179,631, 3,179,632
3,242,128 and British Pat. No. 941,158 and polyester resins are
described in Brydson, Plastics Materials, D. Van Nostrand
Publishing Co., pp. 431-450 (1966). Reference can be made to the
aforementioned book and patents for the detailed synthesis of these
classes of resins. A specific example for their preparation will,
however, be given below.
Generally, the polyester imides can be prepared by reaction of a
polyester with a diimidodicarboxylic acid. In a conventional
manner, a polyester is produced from 388 grams of dimethyl
terephthalate, 112 grams of ethylene glycol and 75 grams of
glycerine, reacted at a temperature between 180.degree. and
215.degree. C. This terephthalate resin is reacted at the same
temperature with 137 grams of a diimidodicarboxylic acid
precipitate that is a reaction product prepared by (1) adding 0.3
moles of 4,4' diamino-diphenylmethane to a solution of 0.6 moles of
trimellitic acid anhydride dissolved in 500 grams of a commercial
cresol at 150.degree. C and (2) stirring the mixture at 140.degree.
C for 6 hours and cooling to form a precipitate which is filtered
and washed. When the diimidodicarboxylic acid precipitation has
been completely taken up by the terephthalate resin, 1.8 grams of
cadmium acetate are added. Condensation is continued for 3 hours at
215.degree. C and finally under vacuum. The resin obtained is
dissolved in 450 grams of commercial cresol and a solution of 9
grams of butyl titanate in 27 grams of cresol is added. This is
diluted with a mixture of 2 parts of solvent naphtha and 1 part of
cresol to give a wire enamel solution, suitable for coating copper
wire, having a solids content of about 37 percent.
Polyamide-imides can generally be prepared by reacting 35 grams of
m-amino-benzoyl-p-aminoanilide in 206 grams of dimethylacetamide
with 32 grams of pyromellitic dianhydride, added to the solution
over a 5-minute period to form a soluble polymeric intermediate
suitable as a wire enamel solution for coating copper or other type
conductors.
Polyimides can be prepared by dissolving 209.7 grams of
4,4'-diaminodiphenyl ether in 739.5 grams of N,N-dimethylacetamide
and 1,479.0 grams N-methyl-2-pyrrlidone at 25.degree. C. To this
solution 221.7 grams of pyromellitic anhydride is added with rapid
agitation to give a polyamic acid solution having a polymer content
of about 16.5 percent by weight. To this solution is added 0.01
gram moles of formic acid per 100 grams of polyamic acid. This
solution is suitable as a wire enamel solution for coating copper
wire. Curing of the applied enamel solution at elevated oven
temperatures converts the polymeric solution to baked polyimide
enamel film.
In a wire-enamel formulation and in the adhesive overcoat solutions
of this invention, the selection of an appropriate solvent is
important. Although benzene and its homologs, toluene and xylene
are relatively inexpensive, so that there is a considerable
incentive to use them for modest cost formulations, these solvents
tend to lack the aggressive solvent power that is required to
dissolve some of the resins heretofore described. Some more
expensive and aggressive solvents, such as phenol, o-cresol,
m-cresol, p-cresol, and the isomeric mixture of cresols (monomethyl
phenols) referred to as "cresylic acid" have been found useful.
Particularly useful solvents for polysulfone solid resins are
dimethylacetamide, acetylene tetrachloride, nitrobenzene, dimethyl
sulfone, N-methylpyrrolidone, and especially cresylics and mixtures
thereof with xylene, "Solvesso 100" and "Solvesso 150" described
hereinafter.
A suitable solvent may be used alone in the wire-enamel and
adhesive overcoat solution formulations, but in most circumstances
it is desirable to reduce the cost of the formulations by using a
substantial portion, up to 60 weight percent, of a diluent. These
are compounds or mixtures of compounds, that although not
themselves of such great solvent power as to be useful alone, will
serve satisfactorily to extend and tend to liquify the formulation
being made. The chief requirement is that the diluent have a
suitable boiling temperature range (about 125.degree. to
200.degree. C) and be substantially unreactive with the desired
chemical reactions to be effected. Various aliphatic and
carbocyclic hydrocarbons, esters, aldehydes, alcohols, etc., are
suitable. Good results have been obtained with the use of a
hydrocarbon fraction of aromatic nature boiling at
161.degree.-177.degree. C. under 1 atmosphere of pressure, such as
that sold commercially under the name "Solvesso 100," or the
similar cut boiling at 187.degree.-211.degree. C, sold commercially
under the name "Solvesso 150."
The particular advantage in our invention is of course the
application of our high temperature adhesive solutions over the
enumerated high temperature wire enamel base coat films, on round,
flat metal foil or rectangular conductors. The cured base-adhesive
coated conductors may then be wound in a plurality of turns as
magnet wire in a coil, such as that shown for example in FIG. 2A,
and then fused together.
The manner of using wire-enamel formulations is one known to those
skilled in the art. A wire or conductor is coated with enamel
solution by dipping, spraying, or other suitable means. For
example, in one preferred method a die is used to wipe off excess
liquid after passing the wire through the base coat solution, to
produce on the conductor or wire a build (increase in diameter of
the insulated wire due to the insulation addition) of suitable
thickness. The build is usually about 0.001 to 0.005 inch with
successive coatings, each generally followed by heating in an oven
or vertical tower to cure the enamel composition. This can be done
in suitable continuously operating equipment, for example a 15-20
foot enameling tower, having an entrance temperature of about
100.degree. C and an exit temperature on the order of 430.degree.
C, with a temperature of about 380.degree. C three-fourths of the
way through the tower. A line speed of preferably about 15 to 40
feet per minute can be used, depending on the characteristics of
the wire-enamel formulation.
In the method of applying our adhesive overcoat solution, we
additionally overcoat the enamel film with a 0.0,001 to 0.0,050
inch build of the adhesive film, preferably, as part of a
continuous operation of coating the wire conductor. This adhesive
overcoat solution may be cured in the enameling tower and the wire
may be wound into a plurality of magnet wire turns and bonded or
fused together as shown in FIG. 2B, a cross sectional illustration
of the coil of FIG. 2A, by subjecting the conductor to a high
current or heating the coil unit in a high temperature
atmosphere.
Other applications besides magnet wire transformer coils include
use in electric motor stator slots as shown in FIG. 3. The wire
conductors 30, base coated with a high-temperature wire enamel 31
and an aromatic polysulfone adhesive overcoat 32 may be wound in
the coil retaining slots 34 between the teeth 35 of the main
magnetic core 36 of the stator of a dynamoelectric machine such as
a motor. The polysulfone adhesive overcoat may then be fused
together at coil winding contact points 37. Also shown are slot
liners 38 which may be formed of paper, asbestos or other suitable
material. The irregular interstices or air spaces 39 between
adjacent insulated conductors can also be seen.
The fusion temperature of the adhesive coated wire may range
between about 200.degree. and 260.degree. C but preferably between
210.degree. and 235.degree. C. Fusion temperatures above
260.degree. C shorten the life of the base coat enamel without
contributing to bonding strength of the adhesive overcoat and
temperatures below 200.degree. C will not give adequate bond
strength for coil applications.
The polysulfone adhesive coating thickness should be in the range
of about 0.1 to 5 mils build (0.0,001 to 0.005 inches of film added
to the diameter of the wire) for wire sizes No. 42 A.W.G. to No. 4
A.W.G. (0.0,025 inch diameter to 0.204 inch diameter). Under 0.1
mils build for No. 42 A.W.G. wire and under 2.0 mils build for No.
4 A.W.G. wire and the coil windings will not adhere with sufficient
bond strength during the adhesive fusing step.
FIG. 4 illustrates a process for making our composite high
temperature enamel base coat-polysulfone adhesive overcoat
insulated conductor and fused magnet wire coils made therefrom. A
flat, rectangular or round, copper, aluminum, silver or other type
conductor may be annealed, after which it is passed through an
enamel applicator containing the aforedescribed high temperature,
base coat wire enamel solutions. Dies may be used to wipe off the
excess enamel from the conductor after it passes through the
applicator to achieve a coating of the desired thickness. The base
coated wire is then passed through an enameling tower or oven,
which may be from about 10 to 40 feet long, at a desired uniform
speed of between 2 to 600 ft/min depending on the wire diameter.
The oven or tower will have a temperature gradient from about
100.degree. C at the entrance to about 380.degree. C three-fourths
of the way through, to about 430.degree. C near the exit end. The
conductor enters the oven with the applied solution coating and
exits having a cured film build thereon. After at least one pass
through the base coat enamel applicator and oven, the base coated
conductor is passed through an applicator containing an adhesive
overcoat solution that is compatible with the base coat resinous
film. The conductor is then, in a continuous operation, passed
through the oven heretofore described (about 2 to 600 ft/min with a
temperature gradient from about 100.degree. C to 430.degree. C).
The number of passes (shown as 2,2', 3 and 4 in FIG. 4) may vary
widely depending on the desired final build of base coat and
adhesive overcoat. The wire may then be stored and used for various
applications or used as magnet wire when wound into a coil and the
magnet wire turns fused together at between about 200.degree. and
260.degree. C. The fusion temperatures for whatever application
must be between about 200.degree. and 260.degree. C to insure good
bonding of the thermoplastic polysulfone adhesive overcoat of
adjacent conductors.
EXAMPLE 1
A polyester amide-imide resin enamel base coat solution at about 30
percent solids, prepared in accordance with the aforementioned
patent application was coated on No. 18 A.W.G. (0.040 inch dia.)
round copper wire and cured in an electrically heated vertical wire
enameling tower 18 feet high. The bottom half of the tower was
maintained at between about 100.degree. and 340.degree. C and the
top half was maintained at between about 340.degree. and
430.degree. C. The wire coating speed was about 25 feet per minute.
The enamel solution was metered onto the wire by means of passing
the wire through an enamel solution pan and then using the
conventional dog box die coating method to give a 0.5 mil (0.005
inch) build or coating for each pass through the pan and die, i.e.,
the diameter of the wire was increased by 0.5 mils for each pass.
After five successive passes through the enamel solution pan, dog
box dies of increasing size, and the enameling tower, a high
temperature thermoset base enamel film build of about 2.5 mils was
obtained.
From a second pan, our polysulfone enamel solution, at about 30
percent solids, was metered onto the base coated wire prior to the
sixth pass of the wire through the same enameling tower at the same
temperature in a continuous operation, by means of another dog box
die to give a 1.0 mil build or coating of high temperature
thermoplastic adhesive overcoat. The total composite adhesive
insulating film build on the conductor was 3.5 mils thick. We found
no need to use separate enameling towers or different curing
temperatures with the adhesive overcoat, saving both time and
expense.
The thermosetting polyester amide-imide wire enamel base coat
solution was prepared from a blend of (1) a polyester amide-imide
of trimellitic anhydride, ethylene glycol and metaphenylenediamine,
(2) a polyester of dimethylterephthalate, tris(2-hydroxyethyl)
isocyanurate and ethyleneglycol, (3) an ester-urethane-isocyanate
compound prepared from dimethylterephthalate, tris(2-hydroxyethyl)
isocranurate and tolylene diisocyanurate and a small amount of
phenolformaldehyde resin and tetraisopropyltitanate in a solution
of cresylic acid to give about 30 percent solids content and a
viscosity of 8.0 poises at 25.degree. C.
The thermoplastic linear aromatic polysulfone resin can be prepared
from 2,2-bis(4-hydroxyphenyl) propane (bis-phenol A) and
4,4'-dichlorodiphenylsulfone as previously described. It is sold
commercially as Union Carbide Corp. P1700 Natural 11 grade Bakelite
polysulfone extrusion and molding compound. This polysulfone is of
low molecular weight polysulfone and has the formula: ##SPC8##
where the monomer number n has an average of about 50-65.
The P1700 resin pellets were first dried in an oven for 16 hours at
135.degree. C to remove any residual moisture. Thirty grams of the
dried P1700 polysulfone was added to 46 grams of "Solvesso 100" and
23 grams of cresylic acid to make approximately a 30 percent solids
solution. This was then roller-milled for about 16 hours at room
temperature until all the polysulfone resin was in solution at
which time it was ready for use as an adhesive overcoat enamel
solution having a viscosity of 8.0 poises at 25.degree. C.
The base coat-adhesive coated wire described above was then wound
into a magnet wire coil for an electrical apparatus and heated in
an oven for 6 hours at 250.degree. C and then cooled. The
thermoplastic polysulfone adhesive overcoat softened during heating
and after cooling fused the coil wires together to form a rigid
coil, solidly bonded together without undue amounts of resinous
adhesive.
The coated wire described above was also wound into standard bond
strength test coils and fused in an oven at 225.degree. C. These
coils were then heat aged at 175.degree. C and 200.degree. C for
120 days with excellent bond strength results when tested at
150.degree. C. Here the number of pounds applied to break the bond
of a long coil the ends of which rested on a support was recorded.
Polyvinyl butryal and epoxy adhesives could not withstand the
temperatures used in these tests.
EXAMPLE 2
A coated wire was prepared using the same method and equipment of
Example 1 with a final 2.5 mil enamel film build of the same
polyester amide-imide used in Example 1 overcoated by a 1.0 mil
adhesive film build of polysulfone. The polysulfone was a higher
molecular weight polysulfone than used in Example 1, however,
having the formula (I), as shown heretofore in the specification,
where the monomer number n had an average of about 65-80. This
polysulfone is sold commercially as Union Carbide Corp. 3500 grade
Bakelite polysulfone extrusion and molding compound. It was
similarly dissolved as in Example 1, in "Solvesso 100" and cresylic
acid to make approximately a 30 percent solids solution. The
amide-imide-ester solution was also prepared as in Example 1.
EXAMPLE 3
A coated wire was prepared using the same method and equipment of
Example 1 with a final 2.5 mil enamel film build of the same
polyester amide-imide used in Example 1. The polyester amide-imide
solution was prepared as in Example 1. No polysulfone overcoat
adhesive was used however.
A variety of tests hithertofore described were run on the coated
wires of the Examples. The results of those tests are tabulated
below in Table 1.
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TABLE I
Enamel Ex. 1 Ex. 2 Ex. 3
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Coating Speed 25 25 25 Build (mils):basecoat + 2.5+1.0 2.5+1.0 2.5
overcoat (overcoat) overcoat Quick Elongation Test OK OK OK
Elongation + 1X Test (%) greater greater 25 than 35 than 35 G.E.
Repeated Scrape 19-20 17-20 22-25 Abrasion Test (700 gr. load)
(cycles) Westinghouse Scrape Test (oz) 65 65 45 Emerson Scrape Test
(lbs) 40 (wire 40 (wire 32 broke broke) Heat Shock - 1X Test at
225.degree. C OK OK OK 250.degree. C OK OK failed slightly
275.degree. C OK OK failed moderately Thermal Life Test (hrs) at
225.degree. C 100% OK 100% OK 100% OK after after after 2352 2352
2352 250.degree. C 1368 1872 1620 275.degree. C 449 449 245
__________________________________________________________________________
as can be seen from this data, our combination of high temperature
base enamels and high temperature adhesive overcoats meet
155.degree. C-180.degree. C requirements easily. They exhibit
superior thermal life and heat shock properties than a wire having
the same base coat but no high temperature adhesive overcoat. Our
composite wire is flexible, resistant to abrasion, and with thin
overcoat films, it will fuse easily in a coil configuration to form
solid bonded coils without an excess of resin, thus allowing
excellent heat transfer through the bonded coil. Such a composite
wire coil eliminates varnishing operations and allows long range
operational temperatures as high as 190.degree. C.
The adhesive overcoat can be used on the enumerated high
temperature base coat enameled round and rectangular metal (copper,
silver, aluminum, etc.) conductors or on flat metal foil conductors
in all motors, dry and liquid filled type transformers, TV yoke
coils and other electrical equipment where turns of wire or foil or
two parallel conductors need to be bonded to form a rigid
structure.
* * * * *