U.S. patent number 3,671,405 [Application Number 05/095,548] was granted by the patent office on 1972-06-20 for method of electroforming on surfaces having projections.
This patent grant is currently assigned to The Budd Company. Invention is credited to Michael Mattia.
United States Patent |
3,671,405 |
Mattia |
June 20, 1972 |
METHOD OF ELECTROFORMING ON SURFACES HAVING PROJECTIONS
Abstract
A method of electroforming on surfaces having relatively high
projections by providing a shield of electrically non-conductive
material to encircle a portion of the length of the projection and
thereafter periodically raising the shield at a rate corresponding
to the rate of deposition on the projections.
Inventors: |
Mattia; Michael (Upper Darby,
PA) |
Assignee: |
The Budd Company (Philadelphia,
PA)
|
Family
ID: |
22252517 |
Appl.
No.: |
05/095,548 |
Filed: |
December 7, 1970 |
Current U.S.
Class: |
205/67; 205/96;
204/DIG.7 |
Current CPC
Class: |
C25D
1/00 (20130101); Y10S 204/07 (20130101) |
Current International
Class: |
C25D
1/00 (20060101); C23b 007/00 (); C23b 005/00 () |
Field of
Search: |
;204/DIG.7,9,23,4 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Other References
Racking Plating Fixtures for Specialised Purposes by J. C. Vaughan
& I. A. Usher Metal Industry Sept. 14, 1945 pgs.
170-172..
|
Primary Examiner: Mack; John H.
Assistant Examiner: Tufariello; T.
Claims
What is claimed is:
1. A method of coating a surface of an object having a main portion
and a projecting portion extending therefrom, comprising the steps
of inserting said object in an electrodeposit bath solution,
providing an electrically non-conductive cylindrical member to
surround said projecting portion along its length except for an
area adjacent said main portion of said object, providing said
cylindrical member with a closure plate aligned with said
projecting portion to restrict the current path around said
projecting portion to prevent excessive build-up of
electrodeposited material along the length of the projecting
portion surrounded by said member, and concentrating a plating
operation at said area at which said projecting portion joins said
main portion of said object.
2. In the method of coating a surface of an object having a
projecting portion as set forth in claim 1 including the step of
providing said closure plate with an aperture aligned with the axis
of said projecting portion to enable escape of gas during
electrodeposition on said projecting portion.
3. In the method of coating a surface of an object having a
projecting portion as set forth in claim 2 including the step of
providing arm means for supporting said cylindrical member, and the
step of providing means to move said arm means and said cylindrical
member along the axis of said cylindrical member.
Description
Heretofore it has been found that when depositing metal such as
nickel on surfaces having relatively high projections excessive
build-up of deposited metal will occur on the free end of the
projections. This build-up alters the current flow in the bath
material and thereby prevents the desired thickness of metal
deposit in areas adjacent the base of the projections. Various
techniques have been tried to obtain the desired thickness of metal
on these surfaces, such as periodic reverse plating and thieving,
but these techniques have been found to be unsuccessful.
Accordingly it is the principal object of this invention to provide
an improved method of electrodepositing on a surface having
relatively high projections which avoids one or more of the
disadvantages of prior art methods.
It is still another important object of this invention to provide
an improved method of uniformly electrodepositing on a surface
having relatively high projections without producing low spots of
insufficient thickness of deposit around the base of the
projections.
In accordance with the invention a method of uniformly
electrodepositing metal on a surface having relatively high
projections which method comprises providing a shield to encircle
the projection along a portion of its length with said shield being
spaced along said surface, electrodepositing the surface and said
projection with the shield in place, and thereafter moving said
shield along the length of the projection away from said surface at
a rate commensurate with the electrodeposition rate.
For a better understanding of the invention together with other and
further objects thereof, reference is had to the following
description taken in connection with the accompanying drawing.
In the drawing,
FIG. 1, prior art, is a perspective elevational view showing a part
with a projection having a layer deposited thereon;
FIG. 2 is a sectional view taken along the lines 2--2 of FIG. 1
showing the projection in section;
FIG. 3 is a perspective view of a part having a projection
extending upwardly therefrom;
FIG. 4 is a view partially schematic showing the part having a
shield about the projection in the presence of a bath solution
enabling deposition on the part;
FIG. 5 is a sectional view taken along the lines 5--5 of FIG. 4 and
showing the shield around the projection in cross section.
Referring now to FIGS. 1 and 2 of the drawing there is shown a
prior art arrangement in which a part 10 having an upstanding
projection 11 has electrodeposited thereon a layer of metal 13 such
as nickel. As seen in FIG. 2 the thickness of the deposited layer
is non-uniform, being much thinner at location A than at location
B. Moreover the top of the projection 11 develops a mushroom type
head 15 which greatly interferes with the laying down of a layer of
uniform thickness adjacent the base of the projection upon top
surface 16 of the part 10.
In order to avoid the non-uniform build-up of layer thickness of
electrodeposited material on a part, reference is now had to FIGS.
3 and 4 wherein a part 21 having a projection 23 extending upwardly
from surface 24 is provided. In accordance with the method of the
present invention, a cylinder shield member 25 is supported over
the projection 23. The inside surfaces 26 of the wall of the
cylindrical member is spaced concentrically from the external
surfaces of the projection 23, while the bottom edge 28 of the
cylindrical member is spaced from the surface 24 of member 21. The
cylindrical member 25 which is of electrically non-conductive
material includes a top wall 29 which has a small aperture 30 in
line with the axis of the projection 23. The small aperture allows
air to escape as the cylindrical member is lowered into the
electro-forming bath 31 and also allows gas to escape during
electrodeposition of the metal. The top wall of the cylinder
further includes an arm 33 mounted on a screw 34 so as to move
axially with said screw. A plurality of electrically non-conductive
upstanding plates 36, 37, 38 and 39 engage the edge surfaces of
plate member 21 to provide uniformity of deposition adjacent its
edges, while plate member 40 of electrically non-conductive
material is applied to the bottom face 39 of the plate member 21 to
prevent deposition of metal on the under surface of the plate
21.
In the present instance the electrodeposition apparatus is shown as
comprising a tank 41 of electrically non-conductive material which
contains the aforementioned electrolytic bath solution 31, which in
the present instance may be a nickel sulfamate bath. Anodes 43
shown immersed in the fluid may be of depolarized nickel and
connected to a current source such as a battery 45. The circuit may
be a variable resistor 44 for varying the current through the bath.
The part to be plated 21, shown in FIG. 5 may be of stainless steel
and is in turn connected to the negative pole of the battery.
In operation as the electrical circuit through the bath 31 is
activated, deposition of metal occurs on the top surface 24 of part
21 as well as around the external surface 47 of projection 23.
However since the cylindrical shield 26 restricts the electron flow
through solution interiorly of the cylinder 25, deposition occurs
on the external surface 47 of the projection 23 at a low rate and
maintains the surface 47 active. The presence of the shield 25
however precludes the build-up of an enlarged mushroom type head 15
as seen in FIG. 1. When the thickness of the deposited layer on
surfaces 24 and 47 reaches a predetermined thickness, screw 34 may
be turned a desired amount to raise sleeve 25 an extent to permit
further deposition on the base portion of projection 23 and on
surface 24 adjacent the base of the projection. In this manner a
uniform build-up of material is applied to the projection as well
as on surface 24. Since the part 21 is of stainless steel, the same
has a passive film hence the separation of the electrodeposited
layer may be readily accomplished.
While there has been described what at present is considered to be
the preferred embodiment of this invention, it will be obvious to
those skilled in the art that various changes and modifications may
be made therein without departing from the invention.
* * * * *