U.S. patent number 3,661,730 [Application Number 04/868,616] was granted by the patent office on 1972-05-09 for process for the formation of a super-bright solder coating.
Invention is credited to Kazuo Nishihara.
United States Patent |
3,661,730 |
Nishihara |
May 9, 1972 |
PROCESS FOR THE FORMATION OF A SUPER-BRIGHT SOLDER COATING
Abstract
A process for electrodepositing solder on a basis material from
an aqueous, acidic bath comprising stannous and plumbous compounds,
o-toluidine or a 2-alkyl anil as a brightening agent and a
non-ionic surface-active agent as a dispersant, to obtain a
super-bright solder coating on the basis material.
Inventors: |
Nishihara; Kazuo (Tokyo,
JA) |
Family
ID: |
25352018 |
Appl.
No.: |
04/868,616 |
Filed: |
September 22, 1969 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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600044 |
Dec 8, 1966 |
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Current U.S.
Class: |
205/253 |
Current CPC
Class: |
C25D
3/60 (20130101) |
Current International
Class: |
C25D
3/60 (20060101); C23b 005/38 (); C23b 005/46 () |
Field of
Search: |
;204/43,44,53,54R ;106/1
;117/13E |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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1,115,460 |
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May 1969 |
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GB |
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29,070 |
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Dec 1964 |
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JA |
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Primary Examiner: Kaplan; G. L.
Parent Case Text
This application is a continuation in part of application Ser. No.
600,044, filed Dec. 8, 1966 and now abandoned.
Claims
What is claimed is:
1. A process for electroplating onto a basis material a bright
solder of a 70 percent tin and 30 percent lead alloy which
comprises electrodepositing the solder on the basis material from
an aqueous acidic bath comprising () stannous borofluoride and
plumbous borofluoride, (2) 90 g./l. of free HBF.sub.4, (3) 10 ml/l
of formalin, (4) 20 ml/l of a 50 percent solution of O-toluidine in
n-butyl alcohol, as a brightener, and (5) 2 ml/l of a mixture
of
wherein R is an alkyl group having 8 or 9 carbon atoms and n is an
integer of 8 to 15 and
wherein R is an alkyl group having 12 to 18 carbon atoms and n and
n.sup.1 are an interger of 0 to 20 in the ratio of 3:1, with a
current density of 3 A/dm.sup.2.
2. A process for electroplating onto a basis material with a bright
solder of a 60 percent tin and 40 percent lead alloy which
comprises electrodepositing the solder on the basis material from
an aqueous acidic bath comprising (1) stannous borofluoride and
plumbous borofluoride, (2) 70 g./l. of free HBF.sub.4, (3) 10
ml./l. of formalin, (4) 20 ml/l of a 50 percent solution of
O-toluidine in n-butyl alcohol as a brightener, and (5) 2 ml./l. of
a mixture of
wherein R is an alkyl group having eight or nine carbon atoms and n
is an integer of 8 to 15 and
wherein R is an alkyl group having 12 to 18 carbon atoms and n and
n.sup.1 are an integer of 0 to 20 in the ratio of 1:1, with a
current density of 2 A./dm.sup.2.
3. A process for electroplating onto a basis material with a bright
solder of a 60 percent tin and 40 percent lead alloy which
comprises electrodepositing the solder on the basis material from
an aqueous acidic bath comprising (1) stannous borofluoride and
plumbous borofluoride, (2) 70 g./l. of free HBF.sub.4, (3) 10
ml./l. of formalin, (4) 20 ml./l. of a 40 percent solution of
2-ethylanil in isopropyl alcohol, and (5) 2 ml./l. of a mixture
of
wherein R is an alkyl group having eight or nine carbon atoms and n
is an integer of 8 to 15 and
wherein R is an alkyl group having 12 to 18 carbon atoms and n and
n.sup.1 are an integer of 0 to 20 in the ratio of 1:1, with a
current density of 2 A/dm.sup.2.
Description
This invention relates to a process for electro-depositing solder
(alloy of tin and lead) on a basis material from a bath containing
a compound of divalent tin and a compound of divalent lead together
with a brightening agent, and a non-ionic surface-active agent.
By use of the process of this invention, there will be gained the
following advantages:
1. A SOLDER COATING FORMED BY ELECTRODEPOSITING THE SOLDER ON A
BASIS MATERIAL FROM SUCH A BATH HAS A SUPER-BRIGHT SURFACE WHICH IS
NOT LESS SMOOTH THAN THAT OF A COATING FORMED BY A CONVENTIONAL
SOLDER MELT-PLATING PROCESS, SUCH TIN AND LEAD CONTENTS AND SUCH
THICKNESS AS INTENDED BEFORE THE ELECTRODEPOSITION, AND A
SATISFACTORY SIZE DISTRIBUTION OF THE PARTICLES IN THE COATING, THE
SIZE DISTRIBUTION INFLUENCING THE ANTICORROSIVE EFFECT OF THE
COATING ON THE BASIS MATERIAL SURFACE ON WHICH IS IS FORMED,
2. ANY STAINS AND SPOTS ARE NOT CREATED ON THE SURFACE OF THE
COATING DURING AND AFTER THE PLATING OPERATION,
3. THE COATED BASIS MATERIAL WITHDRAWN FROM THE BATH CAN BE EASILY
SUBJECTED TO SUBSEQUENT TREATMENTS SUCH AS WASHING WITH WATER,
4. ESPECIALLY THE ELECTRODEPOSITS COMPOSING THE COATING ARE
ORIENTED DURING THE ELECTRODEPOSITION FROM THE BATH,
5. A LOWER OPERATING TEMPERATURE MAY BE USED IN THE PROCESS,
6. A WIDE VARIETY OF BASIS MATERIALS MAY BE USED IN THE PROCESS,
AND
7. THE COATING WILL NOT BE DEGRADED WITH THE LAPSE OF TIME. And
therefore the process will find many uses in the industrial
world.
On the other hand, the composition of a bath which has normally
been used in a conventional non-bright solder electroplating
process and from which is obtained a coating of alloy consisting of
60 percent Sn and 40 percent, is approximately as follows:
Total tin 60 g./l. Divalent tin 55 g./l. Lead 25 g./l. Free
borofluoric acid 40 g./l. Free boric acid 25 g./l. Glue 5 g./l.
It is very difficult to control an electroplating when a bath of
such composition as above is used in the electroplating because the
ratio of a tin compound to a lead one and the content of glue will
have delicate effects on the electroplating.
In general, in an electroplating using such a bath as above there
usually arises a problem of variations (1) in composition of
electrodeposit (coating of solder), (2) in distribution of the
deposited particles and (3) in thickness of the deposit (coating).
These three variations are correlated to one another in the
plating; and therefore a bath having such a conventional
composition will have disadvantages, when used in the plating, that
a solder coating which has the desired contents of tin and lead,
thickness and uniform distribution of solder particles throughout
the coating (the distribution governing the anticorrosiveness of
the coating) is remarkably difficult to form, that some fairly more
troublesome operations are required for the after treatment of the
coating fresh from the bath, and that, what is more important, the
electrodeposit forming the coating is not oriented at all in its
crystallization state whereby the surface of the coating is rough,
a portion of the plating solution and other liquids such as washing
water used after the plating readily enters into the interstices
between the particles of the coating and the removal of the liquids
from the interstices is not easy and stains and spots are apt to
create in or attach to the coating easily during the plating
operation and subsequent treatments. The conventional solder
electroplating process, thus, has been used only for specific
purposes in spite of many uses being expected if said disadvantages
should be eliminated.
On the other hand, a conventional solder melt-plating (plating by
dipping a basis material in a bath of molten solder) process can
give a solder coating the surface of which is smooth and bright,
and therefore it has been usually use in place of the conventional
solder electroplating process.
The solder melt-plating process, however, has disadvantages that it
cannot be applied to the plating of a basis material vulnerable to
heat with solder because it requires a high temperature of about
230.degree. - 280.degree. C., it cannot give easily a solder
coating the thickness of which is as predetermined, it can form
nothing but a solder coating the thickness of which is only between
about 3 and about 10.mu. depending partly upon the temperature of a
bath used, it generally forms on a basis material a coating the
thickness at every part of which is not uniform, for example, very
large at one part while very small at another part of the coating
whereby a large number of small particles to be plated cannot be
satisfactorily plated at the same time, and it forms on a basis
material a solder coating which is apt to change in composition
with the lapse of time because of the oxidation of the solder
coating due to being heated during plating operation. And the
aforesaid disadvantages have set severe limits to the uses of the
solder melt-plating process.
An object of this invention is to provide a novel solder
electroplating process from which such disadvantages of the
conventional solder electroplating and solder melt-plating
processes have been eliminated. The novel process of this invention
is characterized in that a plating bath used in this process is
prepared by adding to a solution of a stannous compound and
plumbous compound, any brightening additive selected from a 50
percent solution of o-toluidine in n-butyl alcohol, a 40 percent
solution of a 2-alkyl anil in isopropyl alcohol and a 40 percent
solution of this anil compound in n-butyl alcohol, and any
dispersing additive selected from a polyethylene glycol-derived
alkylphenol-type non-ionic surface-active agent, a polyethylene
glycol-derived ether-type one and a mixture of the polyethylene
glycol-derived alkyl-phenol-type non-ionic surface-active agent and
a polyethylene glycol-derived alkylamide-type one, to obtain a
super-bright coating by the electrodeposition of solder from the
bath.
Another object of this invention is to provide a plating bath which
may be used in the process of this invention.
Examples of the stannous and plumbous compounds are stannous and
plumbous borofluorides (or fluoroborates), respectively.
The alkyl of the 2-alkyl anil compounds which may be used in the
practice of this invention, is methyl, ethyl or propyl.
As is known, said three surface-active agents are represented, in
their order of description, by the following formulas:
wherein R is an alkyl group having carbon atoms of eight to nine
and n is an integer of 8 to 15. R -- (O -- CH.sub.2 --
CH.sub.2).sub.n OH wherein R is an alkyl group having carbon atoms
of 12 to 18 and n is as defined above.
group having carbon atoms of 12 to 18 and n and n' are an integer
of 0 to 20.
The previously-mentioned 2-alkyl anils can be obtained by reacting
an aliphatic aldehyde with o-toluidine, based the well-known Schiff
reaction, in the presence of an excess of alkali catalyst at a
temperature of 10.degree. - 25.degree. C. for 190 - 360 hours. The
reaction is illustrated by the following reaction formulas:
Theory of synthesis:
In the above reaction formula R and R' are alkyl and aryl,
respectively.
The reaction used in this invention is:
wherein R is methyl, ethyl or propyl.
This invention will be better understood by the following examples
in which copper test pieces (10 cm. .times. 10. cm .times. 0.3 mm.)
were used as a cathode.
The general composition of a bath which may be used in the practice
of this invention, is as follows:
45% aqueous solution of 140-180 ml./l. stannous borofluoride (40-50
g./l., calculated as divalent tin) 45% aqueous solution of 20-40
ml./l. plumbous borofluoride (8-16 g./l., calculated as divalent
lead) Brightening agent 20-50 g./l. Formalin (formaldehyde 35%)
10-30 ml./l. Surface-active agent 2-5 g./l. Free HBF.sub.4 50-120
g./.
If divalent tin is present in a bath in an amount of less than 40
g./l., a solder to be obtained will have no brightness; while the
presence of divalent tin in the bath in an amount of more than 50
g./l. will produce a solder coating which is too hard and liable to
crack.
The presence of less than 8 g./l. of divalent lead will decrease
the solderability of a solder coating to be obtained, and that of
more than 16 g./l. of divalent lead will produce a blackish solder
coating.
The use of the brightening agent in an amount of less than 20 g./l.
will give no brightness to a solder coating to be obtained, while
that of the agent in an amount of more than 50 g./l. will give no
increased brightness thereby making this uneconomical.
If formalin (formaldehyde 35 percent) is used in an amount of less
than 10 ml./l. a solder coating being produced will have a dull
brightness, while the use of more than 30 ml./l. of such formalin
will no longer serve to increase the brightness of the coating.
The use of less than 2 g./l. of a surface-active agent will
accelerate the decomposition of the brightening agent thereby
decreasing the bright surface portion of a coating to be obtained,
while that of more than 5 g./l. thereof will hinder the effect of
the brightening agent.
And, the use of less than 50 g./l. of free HBF.sub.4 will decrease
the solubility of an anode used in the bath, and that of more than
90 g./l. will tend to allow the metals to excessively increase in
concentration in the bath.
The solder coatings obtained according to this invention usually
have at least 80 mirror plane brightness area as measured by Hull
cell test.
EXAMPLE 1
(Electrodeposition of solder comprising 90% Sn and 10 percent
Pb)
Composition of the bath used:
45% aqueous solution of stannous borofluoride 180 ml./l. (50 g./l.,
calculated as divalent tin) 45% aqueous solution of plumbous
borofluoride 20 ml./l. (8 g./l., calculated as divalent lead) Free
HBF.sub.4 110 g./l. 40% solution of 2-methyl anil in isopropyl
alcohol 20 ml./l. Polyoxyethylene alkyl aryl ether 2 ml./l.
Formalin (Formaldehyde conc., 35%) 10 ml./l. Distilled water
balance
Operational conditions:
Cathode (substrate to be plated) Cathode current density 2
A/dm.sup.2 Temperature C. Anode Tin 90% - Lead 10% Alloy Agitation
The agitation was effected by rocking gently the cathode, which was
basis material to be plated, during plating.
The coatings obtained by the electrodeposition from said bath and
under said conditions were super-bright alloy of 90 percent Sn and
10 percent Pb as intended.
The same results were obtained when said procedure was repeated
except that said solution of brightening agent and surface-active
agent were substituted by a 50 percent solution of o-toluidine in
butyl alcohol and polyoxyethylene oleyl ether, respectively.
EXAMPLE 2
(Electrodeposition of solder comprising 90 percent Sn and 10
percent Pb)
The procedure of Example 1 was repeated, but substituting as the
brightening agent the 2-methyl anil by 2-ethyl anil. The same
results as in Example 1 were obtained.
EXAMPLE 3
(Electrodeposition of solder comprising 80 percent Sn and 20
percent Pb)
The composition of the bath used in this Example was as
follows:
45% aqueous solution of stannous borofluoride 160 ml./l. (45 g./l.,
calculated as divalent tin) 45 percent aqueous solution of plumbous
borofluoride 30 ml./l. (12 g./l., calculated as divalent lead) Free
HBF.sub.4 90 g./l. 40% solution of 2-methyl anil in n-butyl alcohol
20 ml./l. Polyoxyethylene oleyl ether 2 ml./l. Formalin
(formaldehyde 35%) 10 ml./l. Distilled water balance
The electrodeposition was effected under the same conditions as in
Example 1 except for the proportions of the stannous and plumbous
compounds and the composition of the anode used in the bath.
EXAMPLE 4
(Electrodeposition of solder comprising 80 percent Sn and 20
percent Pb)
The same procedure of Example 3 was followed, but using as the
brightening agent 2-ethyl anil instead of the 2-methyl anil. The
solder coating obtained was the same as that obtained in Example
3.
EXAMPLE 5
(Electrodeposition of solder comprising 70 percent Sn and 30
percent Pb)
Composition of the bath used:
45% aqueous solution of stannous borofluoride 140 ml./l. (40 g./l.,
calculated as divalent tin) 45% aqueous solution of plumbous
borofluoride 40 ml./l. (16 g./l., calculated as divalent lead) Free
HBF.sub.4 90 g./l. 50% solution of o-toluidine in butyl alcohol 20
ml./l. Polyoxyethylene alkyl aryl ether 2 ml./l. Formalin
(formaldehyde 35%) 10 ml./l. Distilled water balance
The electrodeposition was carried out under the same conditions as
in Example 1 except for the proportions of the stannous and
plumbous compounds and the composition of the anode used in the
bath.
EXAMPLE 6
(Electrodeposition of solder comprising 70 percent Sn and 30
percent Pb)
The same procedure of Example 5 was followed, but substituting the
solution of o-toluidine by a 40 percent solution of 2-propyl anil
in isopropyl alcohol in the same amount.
The same results as those in Example 5 were obtained.
As is seen from the foregoing, the baths employed in said six
Examples varied from one another particularly in amount of the
stannous and plumbous sources and in kind of a brightening agent.
They gave the desired solder coatings, respectively.
EXAMPLE 7
(Electrodeposition of 90 percent Sn - 10 percent Pb solder)
Composition of the bath used:
45% aqueous solution of stannous borofluoride 140 ml./l. (40 g./l.
calculated as divalent tin) 45% aqueous solution of plumbous
borofluoride 35 ml./l. (15 g./l., calculated as divalent lead) Free
HBF.sub.4 110 g./l. 50% solution of o-toluidine in n-butyl alcohol
40 ml./l. Formalin (formaldehyde 35%) 20 ml./l. Polyoxyethylene
alkyl aryl ether 4 ml./l. Distilled water balance
Operational conditions:
Cathode current density 1 A/dm.sup.2 Temperature 20.+-.2.degree. C.
Anode 90% Sn - 10% Pb alloy Agitation The cathode was gently rocked
during plating.
The electrodeposition was effected from the above bath under the
above operational conditions, thereby obtaining the desired
super-bright solder coating comprising 90 percent Sn and 10 percent
Pb.
EXAMPLE 8
(Electrodeposition of 90 percent Sn - 10 Pb solder)
The procedure of Example 7 was repeated, but substituting the
o-toluidine solution by a 40 solution of 2-methyl anil in isopropyl
alcohol in the same amount by volume.
The same results as in Example 7 were obtained.
EXAMPLE 9
(Electrodeposition of 90 percent Sn - 10 percent Pb solder)
The same procedure of Example 7 was followed, but replacing the
solution of o-toluidine by a 40 percent solution of 2-ethyl anil in
n-butyl alcohol in the same amount.
The same results as in Example 7 were obtained.
EXAMPLE 10
(Electrodeposition of 80 percent Sn - 20 percent Pb solder)
The same procedure of Example 7 was followed, but using 90 g./l. of
free HBF.sub.4 and 15 ml./l. of formalin and using a cathode
current density of 2 A./dm.sup.2, 30 ml./l. of the same brightening
agent and 3 ml./l. of the same surfactant.
The solder coating thus obtained was super-bright and had the
expected composition of 80 percent Sn and 20 percent Pb.
EXAMPLE 11
(Electrodeposition of 80 percent Sn - 20 percent Pb solder)
The procedure of Example 10 was repeated, but substituting the
solution of the brightening agent in isopropyl alcohol for that in
n-butyl alcohol.
EXAMPLE 12
(Electrodeposition of 80 percent Sn - 20 percent Pb solder)
The same procedure of Example 10 was followed, but substituting the
solution of o-toluidine by a 40 percent solution of 2-propyl anil
in the same amount.
The same results as in Example 10 were obtained.
EXAMPLE 13
(Electrodeposition of 70 percent Sn - 30 percent Pb alloy)
The procedure of Example 7 was repeated but using 90 g./l. of free
HBF.sub.4 and 10 ml./l. of formalin and using a cathode current
density of 3 A./dm.sup.2, 20 ml. of the same brightener solution
and 2 ml./l. of a mixture of polyoxyethylene alkyl aryl ether and
polyoxyethylene alkyl amide in a ratio by volume of 3 : 1.
EXAMPLE 14
(Electrodeposition of 60 percent Sn - 40 percent Pb solder)
The procedure of Example 7 was followed, but using 70 g./l. of free
HBF.sub.4 and 10 ml./l. of formalin and using a cathode current
density of 2 A./dm.sup.2, 20 ml./l. of the same brightener solution
and 2 ml./l. of a mixture of polyoxyethylene alkyl aryl ether ad
polyoxyethylene alkyl amide in a ratio by volume of 1:1.
EXAMPLE 15
(Electrodeposition of 60 percent Sn - 40 percent Pb solder)
The procedure of Example 14 was repeated, but replacing the
solution of o-toluidine by a 40 percent solution of 2-ethyl anil in
isopropyl alcohol in the same amount.
The results obtained were the same as those obtained in Example
14.
As is apparent from Examples 7 to 15, the electrodeposition in
these Examples was effected to see if a solder coating having the
desired composition of tin and lead was obtained by varying a
cathode current density used and varying the kinds and amounts of
the additives used (brightening agent, surface-active agent, free
HBF.sub.4 and formalin) while keeping identical the remaining
operational conditions and the compositions of the principal
constituents (tin and lead) of the baths between these Examples;
and the solder coatings thus obtained were the desired ones as
expected.
The ratio (percent) of Sn to Pb content in a solder coating to be
obtained varies with a temperature used. For instance, in some
cases, the use of higher than 20.degree. C. will increase the
content of Sn, while that of lower than 20.degree. C. will decrease
it. It was thus preferable that the temperature should be kept at
20.degree. C. .+-. 2.degree. C. during the electrodeposition of
Examples 4 to 9.
In connection with the surface-active agent, there was obtained a
solder coating comprising 60 percent of tin and 40 percent of lead
in Examples 14 and 15, using a mixture of polyoxyethylene alkyl
aryl ether and polyoxyethylene alkyl amide in a ratio by volume of
1:1. If a solder coating is desired to contain more than 60 percent
of tin (consequently less than 40 percent of lead) when formed by
using the same procedure of any one of these Examples except for a
mixing ratio between these two surfactants, the ratio will be more
than 1:1, and vice versa.
The surface of solder coatings obtained by the process of this
invention is much brighter than that of those obtained by the
conventional processes, and the solder particles present in the
former surface are more minute than those present in the
latter.
In addition, using a bath according to this invention, any coating
the composition of which is as desired can be formed by varying the
bath in contents of a stannous and a plumbous compound and/or by
varying the current in density; and my experiences have shown that
the contents of tin and lead in a solder coating formed according
to this invention are accurate to within about 1 - 3 percent of
those predetermined. The brightness of the coating is not
necessarily enhanced in proportion to the increase of the amount of
a brightening agent used in the bath, and, more particularly, the
brightness will be enhanced till the concentration of the agent
reaches a certain high level while it will no longer be enhanced
after the concentration has exceeded the level. The use of the
agent in unduly large amounts will thus cause greater consumption
of the agent thereby constituting poor economy.
A bath according to this invention contains an organic brightening
agent and non-ionic surface-active agent as well as a stannous and
a plumbous compound, the two metallic compounds being contained in
the bath in such amounts that a solder coating composed of tin and
lead in the desired ratio may be formed on a basis material by the
electrodeposition thereon of the tin and lead from the bath. The
combined use of the brightening agent and surface-active agent
allows the formation of stable micells thereof in the bath which is
a strongly acidic solution and the micells function anionically
whereby the concentrations of the two agents are the highest in the
neighborhood of the anode during electrolysis, and on the other
than the concentrations are higher at interfaces including the
surfaces of the bath and cathode therein than at other portions of
the bath when the surface-active agent is present in the bath. In
this case the surface-active agent functions as a carrier for the
brightening agent thereby to carry electrically the latter agent in
the form of a compound like a complex salt with stannous and
plumbous ions, to the cathode. The brightening agent thus carried
to and near the cathode becomes too unstable to be kept in said
form and then liberated in the bath when contacted with a solution
of a high value of pH produced by electrolysis on the surface of
the cathode; and, because the brightening agent which is an organic
additive is hydrophobic, this agent is pushed towards the cathode
from every part of the bath solution, attached to the surface of
alloy of tin and lead deposited from the bath and then adsorbed in
the alloy.
The adsorption of the brightening agent effected according to said
mechanism mainly serves to restrict the electrodeposition from the
bath thereby to obtain a solder coating composed of electrodeposits
of satisfactorily oriented micro-crystallinity. The thus-obtained
coating has super-brightness at the surface which has never been
achieved by the few conventional processes for the formation of a
bright or a semi-bright coating by plating. In addition, the
brightening agent can be prevented from wasteful consumption such
as by decomposition because the brightening and the surface-active
agent in the bath according to this invention from micells therein,
and the latter agent plays more effectively the same role as that
of the glue used in the conventional solder plating; and therefore
there can be obtained, by electrodeposition from the bath, any
coating the thickness and composition of which are respectively as
predetermined.
In the practice of this invention, what suitable amounts of the
brightening and the surface-active agent should be present in a
bath can be readily determined by using Hull cell method and
therefore these agents can be easily kept under control during
plating operation. A process of this invention, thus, is superior
to the conventional ones in easiness of controlling the
concentrations of the agents in the bath, and in operational
manners and economy which will be mentioned later. Because of its
advantages as mentioned above, the process of this invention can be
used for forming on a basis material a super-bright solder coating
composed of tin and lead in any desired ratio, whether the basis
material is to be stationarily (as in the case of usual stationary
plating) or movingly (as in the case of barrel plating) plated in a
bath.
In addition, a solder plate obtained by the process of this
invention is constituted of electrodeposited metallic particles
which are very microcrystalline and well oriented, and, therefore,
the plate can subsequently be readily and completely dried thereby
to prevent it from internally creating stains and from being
externally adhered to by dirts during the handling of it.
A solder plate according to this invention is remarkably improved
in antirust property and brightness as compared with that composed
of coarse particles according to a conventional solder plating
process, and tin and lead from a bath according to this invention
can also be deposited in greater thicknesses without such dendritic
electrodeposits as seen in the conventional solder plate even if
they are electrodeposited to a thickness of more than 2,000 microns
on a basis material.
A process of this invention has further advantages that this
process can be carried out at a room temperature while a solder
melt-plating process necessarily carried out at a very higher
temperature, basis materials which are being plated at the same
time in the same bath do not adhere to one another during plating
operation, a solder coating can be formed in any thickness as
desired, a plating operation can be performed with a remarkably
improved efficiency because barrel plating can also be carried out
using a bath according to this invention, the composition of the
plating bath can be controlled in any way as desired and the
surface of the solder coating is less degraded than that of the
conventional one.
As seen from the foregoing advantages, a process of this invention
is a novel and superior one which can be used for forming not only
anticorrosive coating but also preliminary solder coating on
various basis materials for use in many fields of industry,
especially the field of electronic industry, for preparing
containers for foodstuffs and for manufacturing machines and
appliances, and the process will make many contributions to the
various fields of industry.
* * * * *