U.S. patent number 3,661,538 [Application Number 04/826,709] was granted by the patent office on 1972-05-09 for plastics materials having electrodeposited metal coatings.
This patent grant is currently assigned to Ciba Limited. Invention is credited to Peter Thomas Brown, John Rowland Phillips.
United States Patent |
3,661,538 |
Brown , et al. |
May 9, 1972 |
**Please see images for:
( Certificate of Correction ) ** |
PLASTICS MATERIALS HAVING ELECTRODEPOSITED METAL COATINGS
Abstract
It is known to coat plastics materials, especially
thermoplastics such as ABS, with metal by electrodeposition,
typically with chromium on top of nickel. Conventional methods are
often unsatisfactory when applied to thermosetting resin-based
articles, the metal coating peeling or flaking off when the
articles are subjected to repeated changes in temperature. It has
now been found that copper or nickel coatings adhere well to
surfaces, prepared in a conventional manner, of thermosetting
plastics as well as of thermoplasts, provided that the coatings are
electrodeposited in a manner such that they have an average stress
in tension of at least 2,000 kg./sq. cm. E.g., a molding prepared
from "Araldite" MY 750, HT 972, calcined china clay and glass
fibers, is prepared for electroplating by A. etching with chromic
acid B. depositing a film of palladium through treatment with
stannous chloride and palladium chloride solutions C. depositing a
film of copper or nickel by reduction of copper sulphate or nickel
sulphate solutions. Next, a nickel coating is electrodeposited
under conditions such that it had an average stress in tension of
2,440 to 6,460 kg./sq. cm.: this coating being dull, a bright,
lightly stressed nickel coating was electrodeposited before the
final layer, of chromium, was applied.
Inventors: |
Brown; Peter Thomas (Westley
Waterless, nr. Newmarket Suffolk, EN), Phillips; John
Rowland (Royston, EN) |
Assignee: |
Ciba Limited (Basel,
CH)
|
Family
ID: |
10224690 |
Appl.
No.: |
04/826,709 |
Filed: |
May 21, 1969 |
Foreign Application Priority Data
|
|
|
|
|
May 27, 1968 [GB] |
|
|
25,253/68 |
|
Current U.S.
Class: |
428/626; 205/169;
427/322; 428/388; 428/418; 428/630; 428/644; 428/656; 428/667;
428/669; 428/671; 428/674; 428/935; 428/301.1 |
Current CPC
Class: |
B05D
1/34 (20130101); C25D 5/56 (20130101); Y10T
428/12597 (20150115); Y10T 428/12694 (20150115); Y10T
428/12882 (20150115); Y10T 428/12569 (20150115); Y10T
428/12854 (20150115); Y10T 428/249951 (20150401); Y10T
428/2956 (20150115); Y10T 428/12868 (20150115); Y10T
428/31529 (20150401); Y10T 428/12903 (20150115); Y10T
428/12778 (20150115); Y10S 428/935 (20130101) |
Current International
Class: |
C25D
5/56 (20060101); C25D 5/54 (20060101); B05D
1/00 (20060101); B05D 1/34 (20060101); C23b
005/60 (); C23f 017/00 (); B44d 001/092 () |
Field of
Search: |
;204/30,38,20,29 ;29/195
;117/47A ;106/1 |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
50TH Annual Technical Proceedings, Amer. Electroplaters Society,
1963, pgs 44-46. .
Stress in Electrodeposited Coatings, by Kushner, Metal Finishing,
April 1956, pps 48-50 .
Chemical and Engineering News (C & EN) March 25, 1963, pages
48-49 .
Technology of Electrodeposition by Vagramyan et al., Robert Draper
Ltd., 1961, pps. 269-270 .
Electroplating and Electroforming, by Blum et al., 1949, page 368
.
Modern Electroplating by Lowenheim, 1968, page 262.
|
Primary Examiner: Mack; John H.
Assistant Examiner: Andrews; R. L.
Claims
We claim:
1. An article of plastics material bearing thereon an adherent,
highly stressed, electrolytically deposited film of a metal
selected from the group consisting of copper, nickel, silver,
palladium and gold, which film has an average stress in tension of
at least 2,000 kg./sq.cm.
2. An article as claimed in claim 1, wherein the said film has an
average stress in tension of at most 10,000 kg./sq.cm.
3. An article as claimed in claim 1, wherein the said film is of a
metal selected from the group consisting of copper and nickel.
4. An article as claimed in claim 3, wherein said film is of copper
and immediately overlies a film, applied by electroless deposition,
of a metal selected from the group consisting of palladium and
silver.
5. An article as claimed in claim 3, wherein said film is of nickel
immediately overlies a film, applied by electroless deposition, of
a metal selected from the group consisting of nickel and
copper.
6. An article as claimed in claim 5, wherein said film, of nickel
or copper, immediately overlies a film, applied by electroless
deposition, of palladium or silver.
7. An article according to claim 6, wherein said film of palladium
or silver is applied by electroless deposition upon a chemically
etched surface of the plastics material.
8. An article according to claim 1, wherein said highly stressed
film of a metal selected from the group consisting of copper and
nickel immediately underlies a lightly stressed, electrolytically
deposited film of a metal selected from the group consisting of
nickel and copper having an average stress in tension of not more
than 1,500 kg./sq.cm., the average thickness of said lightly
stressed film, together with any subsequent, electrolytically
deposited, films of metal, does not exceed ten times that of the
said highly stressed film.
9. An article according to claim 8, wherein said lightly stressed
film of copper, or nickel, has an average stress in tension of
between 1,050 kg./sq.cm. and 1,400 kg./sq.cm.
10. An article according to claim 8, wherein the said lightly
stressed film is of nickel and immediately underlies an
electrolytically deposited film of chromium, cadmium, tin, silver,
gold or lead.
11. An article according to claim 10, wherein the said lightly
stressed film of nickel immediately underlies a film of
chromium.
12. An article according to claim 1, wherein the plastics material
contains an inert filler.
13. An article according to claim 12, wherein the plastics material
contains at least 20 percent by volume of filler.
14. An article according to claim 13, wherein the plastics material
contains at least 50 percent by volume of filler.
15. An article according to claim 12, wherein the filler is
selected from the group consisting of glass fibers and textile
fibers.
16. An article as claimed in claim 1, wherein the plastics material
is a thermoset material.
17. An article as claimed in claim 16, wherein the thermoset
plastics material is a glass fiber laminate.
18. An article as claimed in claim 1, wherein the plastics
material, unfilled or containing inert filler, has a heat
distortion point (measured according to British Standards
Specification 2782, Method 102 G) of at least 80.degree. C.
19. An article as claimed in claim 1 wherein the said plastics
material contains an inert filler and has a heat distortion point
(measured according to British Standards Specification 2782, Method
102 G) of at least 80.degree. C.
20. An article as claimed in claim 1 wherein the plastics material
is selected from the group consisting of cured epoxy resins,
aminoplasts, and phenoplasts.
21. An article of plastics material bearing thereon an adherent,
highly stressed, electrolytically deposited film of a metal
selected from the group consisting of copper and nickel, which film
has an average stress in tension of at least 2,000 kg./sq.cm.
Description
This invention relates to coating plastics materials with metal by
electroplating and to plastics materials so coated.
Increasingly, articles of plastics material are being electroplated
with metals, particularly with chromium deposited on nickel. Before
being plated, the surfaces of the article have to be treated to
render them electrically conductive and also to modify them so that
the electrodeposited metal adheres well thereto. Methods of
achieving this are well known (see e.g. H. Narcus "Metallising of
Plastics," Reinhold, 1960).
First, the article is preconditioned, that is to say, its surfaces
are etched with a substance to promote bonding with the coatings
applied later. The substance used depends on the type of plastics
material to be etched; commonly, a mixture of potassium dichromate,
sulfuric acid and water, sodium-naphthalene-tetrahydrofuran
complexes, a mixture of sulfuric and phosphoric acids, nitric acid,
or organic solvents (such as acetone, generally with hydroquinone
and pyrocatechol) are used. This chemical treatment may be
supplemented with, or replaced by, a mechanical cleansing
operation, the surfaces being abraded by tumbling the article in an
abrasive powder (sometimes with water) or by "vapor blasting" with
very fine particles of abrasive material in a jet of air and water.
Next, in the so-called "sensitizing" and "activating" stages, an
electrically-conducting layer of metal is applied to the article,
sometimes by means of paints containing metal powders, by spraying
on metal powders or by vacuum sputtering, but usually by depositing
the metal from a solution of its salt by chemical reduction. A film
of palladium or silver is deposited by immersing the article in a
solution of stannous chloride or other source of stannous ions, and
then in a solution of, e.g. palladium chloride or silver nitrate.
Sometimes the silver nitrate is used in aqueous ammoniacal solution
in the presence of an organic reducing agent such as an aldehyde,
with or without prior treatment with stannous chloride. Next,
copper or nickel is applied by electroless deposition, then nickel
is applied by electroplating, followed by, if required, chromium.
Instead of applying nickel by electroplating, silver, palladium, or
gold may be so deposited. In certain circumstances, where the
surfaces of the plastics article have been suitably treated, the
electroless deposition of copper or nickel can be dispensed with,
the article being electroplated with copper instead.
Conventionally, the electroplated layers applied to plastics
articles are only lightly stressed in tension, this stress being
not more than about 1,500 kg./sq.cm.
Thermoplastics materials which have been electroplated include
chiefly acrylonitrile-butadiene-styrene copolymers (ABS), but also
polyolefines, polymethacrylates and polycarbonates. For some
purposes it is desirable to use thermoset plastic materials which,
unlike many thermoplastics materials, do not soften and flow at
moderately high temperatures. However, methods which, when applied
to thermoplastics materials, give rise to electroplated nickel or
copper having adequate adhesion to the substrate, are often
unsatisfactory when applied to thermoset plastics materials, the
electroplated nickel, copper, or certain other metals adhering
insufficiently to withstand the dimensional changes that occur on
repeated heating and cooling, while if the coating is accidentally
perforated the electroplated metal around the perforation peels
off. Because the electroplated nickel or copper fails to adhere,
the overlying chromium plating readily peels off with it.
Recently it has been suggested that metal coatings which are
electrolytically deposited on plastics materials, particularly
poly-(oxymethylenes), adhere firmly and withstand repeated large
changes in temperature provided that these metal coatings have a
ductility and a tensile strength (i.e. the minimum force applied in
tension necessary to rupture the film) which are above certain
values, and that the coated articles have a compressive stress
within a specified range.
It has now been found that electrolytically deposited nickel,
copper, silver, palladium, or gold adhere well to plastics
materials, especially thermoset plastics materials, provided that
the electrolytically deposited layer is highly stressed in
tension.
Stress in tension is associated with a metal coating being
deposited in a condition such that, providing the substrate can be
distorted, the coating contracts, whereas compressive stress is
associated with the contrary condition, the coating having a
tendency to expand.
The present invention provides an article of plastics material
coated with an adherent, highly stressed, electrolytically
deposited film of copper, nickel, silver, palladium or gold, which
film has an average stress in tension of at least 2,000 kg./sq.cm.
and preferably of between 2,300 kg./sq.cm. and 10,000
kg./sq.cm.
The highly stressed film may be of copper, and advantageously
immediately overlie a film, applied by electroless deposition, of
palladium or silver. Or the highly stressed film may be of silver,
palladium, or gold, and especially nickel; such a film is
conveniently applied onto a film, applied by electroless
deposition, of nickel or copper. It is generally more convenient
that such a film is of nickel, since electroless copper baths tend
to be less stable than are electroless nickel baths. These films of
nickel or copper, applied by electroless deposition, in turn
preferably immediately overlie a film, applied by electroless
deposition, of palladium or silver.
Highly stressed films are sometimes dull. In such cases a lightly
stressed, bright film of nickel, copper, silver, palladium, or
gold, i.e. one having an average stress in tension of not more than
1,500 kg./sq.cm., preferably between 1,050 kg./sq.cm. and 1,400
kg./sq.cm., may be electrolytically deposited onto such films.
However, the average thickness of this lightly stressed film,
together with any subsequent, electrolytically deposited films of
metal, should not greatly exceed, say ten times, that of the highly
stressed film, or the advantages of the invention may be
forfeited.
When the lightly stressed film is of nickel, a film of cadmium,
tin, silver, gold, lead, or particularly chromium, may be
electrolytically deposited thereon.
The nickel, copper, silver, palladium or gold may be deposited in
the two conditions, viz highly stressed and lightly stressed, by
using plating baths of differing composition and/or pH. For
example, nickel baths usually contain nickel chloride and nickel
sulfate, and different ratios of chloride to sulfate ions favor
formation of nickel in a more highly, or less highly, stressed
condition : other things being equal, when chloride ions
preponderate, the nickel is more highly stressed, and when sulfate
ions are in the majority, the nickel is less highly stressed. Use
of a less acidic plating solution (typically having a pH of between
5 and 6.8) also favors formation of a more highly stressed layer
than does use of one having a pH below 5.
Various methods are available for determining the stress in tension
(see e.g., Chapter 14, by Kushner, in "Electroplater's Process
Control Handbook" edited by D. Gardner Foulke and Francis D. Crane,
published by Reinhold). A convenient method is that of Graham and
Soderberg, which is described by Kushner. In this method, thin shim
steel about 7 cm. long and 1 cm. wide is bent into an arc of known
radius of curvature, and the reverse (inner) surface is coated with
a lacquer to prevent the metal being deposited on that surface. The
shim steel is firmly clamped to a sheet steel base about 3 mm.
thick to prevent bending during plating, and nickel, copper,
silver, palladium, or gold is then electrodeposited. The plated
shim steel is removed, and the change in radius of curvature due to
the tensile stress of the film of electrodeposited metal is
measured. The average stress in tension, S.sub.a, can be found by
means of the relationship
where t is the thickness of the base, d is the thickness of the
deposit, E is Young's modulus for the base, and r.sub.b and r.sub.a
are the radii of curvature of the shim steel strip before and after
plating.
For ease of electroplating the plastics material should contain a
filler; the filler should, of course, be inert, i.e. resistant to
attack by the various solutions employed. It is further desirable
that the filler be present in a substantial amount, the plastics
material containing at least 20 percent, and better at least 50
percent, by volume of the filler. Suitable fillers include china
clay, which may be calcined (molochite) and titanium dioxide, but
glass fibers or fibers of a textile such as a polyester are
particularly preferred.
The plastics article should be etched, preferably by chemical means
because the surface finish of mechanically etched plastics material
may be poor unless a very thick layer of metal is applied by
electroplating : to apply such layers is uneconomic, and further,
they do not adhere as well as those of conventional thickness.
Chromic acid mixtures (potassium dichromate-sulphuric acid-water)
are usually suitable.
The process of the present invention may be applied to
thermoplasts, such as a polyolefine, a polymethacrylate, a
polycarbonate, an acrylonitrile - butadiene-styrene copolymer, or a
polysulfone, but it is particularly suitable for plating cured
thermoset plastics materials, especially such materials which are
subjected in use to temperature of at least 80.degree. C. and which
accordingly, containing filler if necessary, have a heat distortion
point (measured according to British Standards Specification 2782
Method 102G) of at least 80.degree. C. The thermoset plastics
material may be, for example, a cured epoxy resin, i.e. obtained by
curing a substance containing on average more than one 1,2-epoxide
group per molecule such as a polyglycidyl ether or a polyglycidyl
ester; a cured aminoplast, such as a melamine-formaldehyde resin;
or a cured phenoplast, such as phenol-formaldehyde resin. The
filled thermoset plastics material may be a glass fiber laminate.
Such laminates, electroplated with silver, palladium, or gold, are
useful for printed circuits.
The following examples illustrate the invention.
EXAMPLE I
The plastics articles employed were prepared from an epoxy resin
moulding composition, the ingredients of which were:
Parts by weight
__________________________________________________________________________
a polyglycidyl ether of bisphenol A, epoxy content 5-5.2 equiv./kg.
23.3 bis(4-aminophenyl)methane, (curing agent) 6.3 "superfine
molochite" (filler) 60 modified Montan wax, available from Hoechst
under the designation "OP Wax" (release agent) 0.33 glass fibers
silane-treated (filler) 10
__________________________________________________________________________
In place of the OP wax, other release agents such as calcium
stearate, glycerol monostearate, stearic acid, or carnauba wax
could be used. The articles were formed by transfer molding, the
molding time being 3 minutes and the temperature 165.degree. C.
Radio frequency preheating was used.
At the conclusion of each of the following stages, the articles
were rinsed with distilled water.
Etching
Moldings so prepared were etched by immersion for 10 to 20 minutes
at room temperature, or better at 65.degree. C., in a mixture of
11g. of potassium dichromate, 250 ml. of distilled water and 750
ml. of concentrated sulfuric acid.
Sensitizing
The etched mouldings were immersed for 2 to 4 minutes at room
temperature in a solution of 10 g. of stannous chloride (SnCl.sub.2
.sup.. 2H.sub.2 O) and 40 ml. of concentrated hydrochloric acid in
1 liter of distilled water, and then for 3 to 5 minutes, at room
temperature or at 35.degree. C., in a solution of 1 g. of palladium
chloride (PdCl.sub.2 .sup.. 2.sub.2 O) and 10 ml. of concentrated
hydrochloric acid in 4 liters of distilled water.
Electroless copper or nickel coating
The next stage was coating with either copper or nickel.
To coat the articles with copper, the following solutions were
prepared, and mixed in equal volumes when required for use
##SPC1##
the articles being immersed therein for 5 to 10 minutes at room
temperature.
To coat the articles with nickel, they were immersed for 4 to 6
minutes at 65.degree. to 85.degree. C. in a solution containing 35
g. of nickel sulfate (NiSO.sub.4 .sup.. 6H.sub.2 O), 10 g. of
sodium citrate (Na.sub.3 C.sub.6 H.sub.5 O.sub.7 .sup.. 2H.sub.2
O), 10 g. of sodium acetate (NaC.sub.2 H.sub.3 O.sub.2.sup..
3H.sub.2 O), 15 g. of sodium hypophosphite (NaH.sub.2
PO.sub.2.sup.. H.sub.2 O), 20 g. of magnesium sulfate
(MgSO.sub.4.sup.. 7H.sub.2 O) and 1 liter of distilled water.
Highly stressed electroplated nickel coating
The articles were then electroplated with nickel from a solution
held at 30.degree. to 35.degree. C. and containing, per liter of
distilled water, 300 g. of nickel sulfate (NiSO.sub.4.sup..
6H.sub.2 O), 64 g. of nickel chloride (NiCl.sub.2.sup.. 6H.sub.2
O), 32 g. of boric acid, 18 g. of sodium formate and 8 g. of cobalt
sulfate (CoSO.sub.4.sup.. 7H.sub.2 O), the current density being 1
to 2 amps/sq. dcm. The pH of this solution was 5.3; in some
experiments the pH was adjusted before plating to 5.6 or 6.1 by
adding nickel carbonate or to 4.2 by adding concentrated sulfuric
acid. The coating was on average 0.02 mm. thick. As determined by
the Graham-Soderberg method, the tensile stresses of nickel plated
at the different pH values were:
pH tensile stress
__________________________________________________________________________
(kg./sq.cm.) 4.2 1260 5.3 2440 5.6 3780 6.1 6460
__________________________________________________________________________
At the lowest pH, 4.2, the tensile stress of the nickel was
insufficient and the nickel had inadequate adhesion.
Lightly stressed nickel coating
This was applied from a conventional proprietary formulation
available under the designation "Silvercrown Supersonic Bright
Nickel" from Silvercrown Limited, Slough, Bucks., England. The
bath, which was kept at 37.degree. to 43.degree. C., had a pH in
the range 3.5 to 4.5, and the current density was 2.7 to 4.3
amps./sq. dcm. This coating also has an average thickness of 0.02
mm. In place of "Silvercrown Supersonic Bright Nickel" there was
also used successfully:
"EFCO Bright Nickel" (a proprietary formulation available from
Electro-Chemical Engineering Co. Ltd., Woking, Surrey, England) the
bath being kept at 45.degree. to 55.degree. C. and having a pH of
3.9, and the current density being 3.2 to 5.4 amps./sq. dcm.;
or
"Canning Super Gleamax Bright Nickel" (a proprietary formulation
available from W. Canning and Co. Ltd., Birmingham 18, England),
the bath, which had a pH of 3.9 to 4.5, being kept at 45.degree. to
50.degree. C. and the current density employed being 4.3 amps./sq.
dcm.
Chromium-plating
The nickel-plated articles were finally plated with chromium. There
was used a proprietary formulation, "Silercrown Bright Chromium,"
available from Silvercrown Limited, Slough, Bucks., England; the
bath was kept at 38.degree. to 42.degree. C., the current density
was 11 to 13 amps./sq. dcm., and the maximum voltage at strike was
5. The plating time was 2 minutes. In place of "Silvercrown Bright
Chrome Solution" there was also used a bath containing 250 g. per
liter of chromic oxide (CrO.sub.3) and 2 g. per liter of
concentrated sulfuric acid : this bath was kept at 50.degree. C.
and the current density was 10 to 20 amps./sq. dcm.
For purposes of comparison, moldings prepared from the same epoxy
resin formulation were plated as described above except that the
electrodeposition of the nickel was effected under conventional
conditions.
The bath was similar to that employed to deposit the highly
stressed coating, but it contained 50 g. of sodium formate per
liter of distilled water instead of 18 g., and no cobalt sulfate;
its pH was 4.5 and its temperature 40.degree. C., while the current
density was 2.7 to 3.2 amps./sq. dcm. The nickel so deposited had
essentially the same average thickness as the combined average
thicknesses of the two layers of nickel electrodeposited as
described above, i.e. an average of 0.05 mm. compared with the
average total of 0.04 mm. for the two layers electrodeposited in
accordance with this invention. The tensile stress of the single,
conventionally electrodeposited layer was 1,400 kg./sq.cm. Chromium
was then applied by electroplating in a conventional manner.
The Jaquet peel test could not be carried out with the
chromium-plated moldings having coatings of nickel electrodeposited
as described in accordance with the process of this invention; the
adhesion was so great that the coating could not be pried off. On
the other hand, the chromium could readily be peeled off from the
castings prepared in the conventional manner.
The coatings produced as described by the process of this invention
were distinguished by their resistance to repeated extreme changes
in temperature. Samples of the chromium-plated moldings were held
at -72.degree. C. or at -85.degree. C. for 1 hour, then immediately
placed in an oven heated to 145.degree. C. for 1 hour : next, the
samples were immediately cooled to -72.degree. C. or -85.degree. C.
and the process repeated. After six, or even eight, cycles of
cooling and heating, the coatings still adhered to the underlying
plastics material, whereas the chromium on moldings plated in a
conventional manner could be peeled off before fewer than six such
cycles had been completed.
EXAMPLE II
In other experiments there were used:
a. moldings of a thermoplastic resin, viz. a polysulfone available
from Union Carbide Corporation under the designation "Polysulfone P
1700," containing 10 percent by weight of molochite,
b. moldings prepared from an asbestos- filled phenol-formaldehyde
resin, and
c. moldings prepared from a mineral- filled melamine-formaldehyde
resin.
These moldings were electroplated with nickel in accordance with
the invention, and then with chromium, as described above. The
chromium plating remained intact despite the articles being
subjected to four cycles of cooling to -60.degree. C. for 1 hour
and then heating at 80.degree. C. for 1 hour, with intervals of
only 15 minutes between each heating or cooling stage.
EXAMPLE III
A laminate was prepared by a wet lay-up technique from eight layers
of glasscloth, and as the thermoset material, a mixture of 100
parts by weight of an epoxide resin, a polyglycidyl ether of
bisphenol A (i.e. 2,2-bis(4-hydroxyphenyl)propane) having a
1,2-epoxide content of 5.2 equivalents per kilogram, and 27 parts
by weight of 4,4'-diaminodiphenylmethane. The assembly was heated
at 150.degree. C. for 1 hour under a pressure of 7 kg./sq.cm., and
the resin was post-cured at 180.degree. C. for 3 hours.
Laminates were also made by a "prepreg" technique : layers of
glasscloth were impregnated with a solution in ethyl methyl ketone
of the same mixture of epoxide resin and curing agent, and the
mixture was advanced to a B-stage resin by heating for 30 minutes
at 100.degree. C. The resin was cured by heating as before, i.e.
for 1 hour at 150.degree. C. under a pressure of 7 kg./sq.cm. and
then for 3 hours at 180.degree. C.
The laminates were etched, sensitized and coated with nickel by
electroless deposition as described in Example I. Next, a
highly-stressed coating of copper was applied from a bath
containing, per liter, 19 g. of cuprous cyanide, 45 g. of sodium
cyanide, and 4 g. of sodium hydroxide. The bath was kept at
40.degree. to 45.degree. C. and the current density was 2.15
amps/sq.dcm. A highly adherent copper film, having a stress in
tension of more than 2,000 kg./sq.cm., was obtained.
Coatings of silver, likewise showing good adhesion and being highly
stressed in tension, were electrodeposited on similar glasscloth
laminates bearing nickel applied by electroless deposition.
* * * * *