U.S. patent number 3,658,618 [Application Number 04/868,062] was granted by the patent office on 1972-04-25 for method of providing individual bodies on a basic body.
This patent grant is currently assigned to Telefunken Patentverwertungsgesellschaft m.b.H.. Invention is credited to Wolfgang Gramann.
United States Patent |
3,658,618 |
Gramann |
April 25, 1972 |
METHOD OF PROVIDING INDIVIDUAL BODIES ON A BASIC BODY
Abstract
A method of providing individual bodies on a basic body by
firstly laying the individual bodies on a common support picking
them up and transferring them, by means of a carrier member with an
adhesive surface, to the basic body and holding them on the basic
body until they are secured by suitable means such as glueing or
soldering. Carrier members and support members are provided for
carrying out the method.
Inventors: |
Gramann; Wolfgang
(Nd.-Gemunden, DT) |
Assignee: |
Telefunken
Patentverwertungsgesellschaft m.b.H. (Ulm/Donau,
DT)
|
Family
ID: |
5711519 |
Appl.
No.: |
04/868,062 |
Filed: |
October 21, 1969 |
Foreign Application Priority Data
|
|
|
|
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Oct 25, 1968 [DT] |
|
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P 18 05 174.6 |
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Current U.S.
Class: |
156/235; 294/212;
156/289; 156/299; 156/311; 156/539; 156/579; 257/724; 257/783;
29/840; 438/118; 228/175; 257/E21.51 |
Current CPC
Class: |
H01L
24/83 (20130101); H01L 24/75 (20130101); H01L
21/6835 (20130101); H01L 2924/01033 (20130101); H01L
2924/014 (20130101); H01L 2924/01005 (20130101); H01L
2924/01006 (20130101); H01L 2924/0132 (20130101); H01L
2221/68359 (20130101); Y10T 29/49144 (20150115); H01L
2924/10329 (20130101); H01L 2924/0132 (20130101); Y10T
156/1702 (20150115); Y10T 156/18 (20150115); Y10T
156/1092 (20150115); H01L 2224/83801 (20130101); H01L
2924/01023 (20130101); H01L 2224/8319 (20130101); H01L
2924/0105 (20130101); H01L 2924/01033 (20130101); H01L
2924/01031 (20130101) |
Current International
Class: |
H01L
21/60 (20060101); H01L 21/68 (20060101); H01L
21/67 (20060101); H01L 21/02 (20060101);
B44c () |
Field of
Search: |
;156/91,155,235,236,289,297,299,300,305,311,230,539,541,556,560,579,60,63
;294/1R,64R,65,65.5,DIG.2 ;29/589,590,591 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Quarforth; Carl D.
Assistant Examiner: Gaither; Roger S.
Claims
What I claim as new and desire to secure by Letters Patent of the
United States is:
1. A method for simultaneously securing a plurality of individual
bodies, each of which has a layer of solder and flux on one surface
thereof, to a common basic body, comprising the steps of:
a. placing said individual bodies on a common support member with
the layers of solder and flux resting on said common support
member;
b. laying a carrier member with an adhesive surface over said
individual bodies resting on said common support member and
pressing said adhesive surface against the surfaces of said
individual bodies which are opposite to the layers of solder and
flux so that all said individual bodies adhere to said adhesive
surface of said carrier member;
c. removing said carrier member from over said common support
member with said individual bodies adhering thereto;
d. arranging said carrier member over said common basic body;
e. pressing the layers of solder and flux of said individual bodies
against said common basic body by means of said carrier member;
f. heating said common basic body briefly to the soldering
temperature and continuing the pressure of said individual bodies
against said common basic body until solidification of said solder
and the resultant establishment of a connection between said common
basic body and said individual bodies; and
g. removing said carrier member from said individual bodies after
the individual bodies have been secured to said common basic
body.
2. A method as defined in claim 1, further comprising grouping said
individual bodies on said support in the relationship to one
another which they are subsequently to assume on said basic body
before laying said carrier member therein.
3. A method as defined in claim 1, further comprising providing
said carrier member with a flux with adhesive characteristics at
least at that portion of its surface at which the individual bodies
are to adhere.
4. A method as defined in claim 1, wherein said flux for said
carrier member is selected from rosin varnish and silicone oil.
5. A method as defined in claim 1, wherein said flux for said
carrier is a mixture of resin varnish and silicone oil.
Description
BACKGROUND OF THE INVENTION
The invention relates to a method for the simultaneous provision of
a plurality of individual bodies on a common basic body.
In the semiconductor art in particular, the problem often arises of
providing a relatively large number of semiconductor devices, that
is to say semiconductor bodies provided with component structures
as well as electrodes etc., separately from one another on a common
base or basic body. This is necessary, for example in the
production of switching circuits which comprise a relatively large
number of components, when the semiconductor material used, such as
compound semiconductors of the groups III-V and II-VI, does not
permit the construction of a monolithic solid-state switching
circuit with the structures of all the components in one
semiconductor body, or when different semiconductor materials are
to be used for the construction of such a switching circuit. Thus
the manufacture of semiconductor devices in which a plurality of
luminescence diodes of gallium-arsenide (GaAs) is used, the diodes
being disposed side by side on a base, and which being used for the
reading of punched tapes or as a solid-state display screen for the
representation of figures and writing, involves enormous
difficulties. For according to the methods hitherto usual, the
diodes are laid individually by hand in the required relationship
to one another on the base or basic body which is then covered, at
its surface adapted for securing the diodes, with a layer of tin or
another solder for example so that the diodes can be firmly
soldered to this base by brief heating of the base to soldering
temperature. This soldering process in turn involves difficulties
in the known methods because when the solder melts the individual
diodes begin to float on the molten solder and are displaced from
their predetermined position. With this method, therefore, it is
often necessary to push individual diodes into their correct
position before the solder solidifies and in the course of this it
is often impossible to prevent solder from being forced up between
the diodes and short-circuiting their PN-junctions.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a method for
the simultaneous provision of a plurality of individual bodies on a
common basic body, which, in particular, also simplifies and
decisively improves the securing of individual semiconductor
components to a common basic body or base.
According to the invention, there is provided a method for the
simultaneous provision of a plurality of individual bodies on a
common basic body, comprising the steps of first laying said
individual bodies on a common support, laying a carrier member with
an adhesive surface over said bodies resting on the support and
pressing it against said support in so that all said individual
bodies adhere to said carrier member, removing said carrier member
from said support with said individual bodies adhering thereto and
arranging said carrier or said basic body so that said individual
bodies to be secured rest with their surface remote from said
carrier body on said basic body, and removing said carrier member
from said basic body after the individual bodies have been
secured.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention will now be described in greater detail by way of
example with reference to the accompanying drawings in which:
FIG. 1 is a perspective view of a support for positioning a
plurality of semiconductor bodies;
FIG. 2 is a perspective view of a carrier member for transferring
the semiconductor bodies from the support of FIG. 1 and,
FIG. 3 is a perspective view of the carrier member of FIG. 2
together with a base on which the semiconductor bodies are to be
positioned and attached.
DESCRIPTION OF THE PREFERRED EMBODIMENT
Basically the invention proposes that during the simultaneous
provision of a plurality of individual bodies on a basic body,
these individual bodies should first be laid on a common support,
that then a carrier member with an adhesive surface should be
brought over these individual bodies lying on the support and be
pressed against the support in such a manner that all the
individual bodies cling to said carrier member. Then the carrier
member with the individual bodies adhering thereto is removed from
the support and placed on the basic body in such a manner that the
individual bodies lie with their surface remote from the carrier
member on the basic body for securing. After the individual dual
bodies have been secured to the basic body, the carrier member is
removed again according to the invention.
The advantage of the method according to the invention consists
primarily in that all the individual bodies are applied to the
basic body in a single operation and so the time-wasting, separate
provision of the individual bodies is eliminated. In addition, with
the method according to the invention, assurance is provided that
the individual bodies are held by the carrier plate up to the
moment when they are firmly bonded to the basic body and thus
cannot be mutually displaced. With the method according to the
invention, therefore, it is possible to determine the subsequent
relationship of the individual bodies to one another on the basic
body by their particular arrangement on the support, and in many
cases this facilitates work considerably, particularly as the
supports used can easily be equipped with auxiliary means which
decisively simplify the necessary grouping of the individual
bodies.
Provided that the individual bodies as well as the basic body used
permit, the securing of the individual bodies to this basic body is
preferably effected by means of a soldered connection although it
would easily be possible, within the scope of the method according
to the invention, to secure the individual bodies by glueing or
other means. Thus when a plurality of semiconductor components are
provided simultaneously on a common base, components and/or base
are provided with a layer of solder and possibly also with a flux
at the surface at which they are to be connected to one another. In
the case of the semiconductor components at least, the provision of
this layer of solder may most appropriately be effected directly
during their manufacture. With the method according to the
invention, the semiconductor components are then laid on the
support so that they rest with their surface provided with solder
on said support. The components are subsequently removed from the
support by means of the carrier member, as described, and pressed
against the base, which is heated to soldering temperature, until
the solder has solidified after the cooling down of the base and a
firm connection is established between base and component.
Particularly when the securing of the individual bodies to the
basic body is effected by means of soldering, the carrier member
may advantageously be provided with a flux which has adhesive
properties such as rosin varnish or silicone oil, at least at that
portion of its surface to which the individual bodies are to
adhere. In this manner, the carrier member acquires the adhesive
surface necessary for carrying out the method according to the
invention or adhesive properties of the carrier member which may
already have been caused by other substances are at least
reinforced while at the same time assurance is provided that a
sufficient quantity of flux will be present for the soldering
operation.
A carrier member which consists of silicone rubber, at least at the
surface at which the individual bodies are to adhere, is
particularly suitable for carrying out the method according to the
invention. As a result of the use of this rubber, the carrier
member already has the adhesive surface necessary for carrying out
the method according to the invention without a coating of the
above-mentioned adhesive flux or another adhesive substance.
The carrier member which is preferably plane at its surface adapted
to receive the individual bodies, as is the support, may be
mounted, for example, on the carrying arm of a micromanipulator, so
as to simplify in this manner the provision of very small
individual bodies on basic bodies having only small dimensions, as
for example the provision of a plurality of semiconductor
components on a common base.
The arrangement of the individual bodies on the support can be
rationalized by providing the support with a plurality of recesses.
The individual bodies are then inserted in these recesses and are
thus automatically in the required position in relation to one
another, predetermined by the arrangement of the recesses.
Furthermore, when such a support provided with recesses is used,
there is also the possibility of placing a large number of
individual bodies initially at random on the support and then
occupying each of these recesses, the lateral dimensions of which
match the individual bodies, with such a body by shaking and/or
holding said support inclined, and removing the individual bodies
which are not accommodated in recesses from the support.
The recesses, which are preferably arranged in the form of a grid,
are naturally so constructed that all the individual bodies
accommodated therein project from the recesses with their surface
remote from the support.
Such a support with recesses arranged in the form of a grid can
easily be realised by placing a grating made of metal for example
or a wire netting on as plane a surface as possible, in which case
the meshes of this grating or netting form recesses to receive the
individual bodies.
Referring now to the drawings, FIG. 1 shows a support 1 on the
surface of which there are provided several cell-like recesses 2.
The edges of the recesses are formed by a grating 3 for example a
metal grating which is laid on the plane surface of the support 1
and secured there. As the Figure shows, the sizes of the openings
in the grating or meshes forming the recesses are selected so large
that one flat individual body 4, for example a semiconductor
component, just fits into each of the recesses arranged in the form
of a grid. The thickness of the grating is less than the height of
the bodies 4 so that these bodies project from the recesses with
their surface remote from the support 1.
FIG. 2 shows a carrier member 5 for transferring the individual
bodies 4 from the support to the basic body or base. This carrier
member comprises a handle 6 on its upper side, in the manner of a
stamp, to improve manipulation. The carrier member consists, at
least at its plane face 7, of silicone rubber which imparts
adhesive characteristics to this face so that the individual bodies
resting on this support remain suspended, as illustrated in FIG. 2,
after the carrier member has been pressed against the support. The
adhesive properties of the carrier member can, of course, likewise
be improved here by providing at least the face 7 of the carrier
member with a flux having adhesive properties before it is
used.
FIG. 3 shows the carrier member 5 and a housing base 8 on which the
semiconductor components 4 adhering to the carrier member are to be
secured by means of a soldered connection. The base 8, which
comprises a plurality of electrode leads 9, lies on a heating plate
10. The electrode leads 9 project, then, through bones provided in
this heating plate specially for this purpose. In order to secure
the semiconductor components 4 to the base 8, this is first heated
to soldering temperature by means of the heating plate and then the
carrier member with the components is pressed against the base.
Base and/or semiconductor components are provided with solder and
flux, as described above, so that after the heating plate 10 has
cooled down, for example by switching off a heating current heating
said plate, the components are secured to the base 8 in the
predetermined position.
FIGS. 1 to 3 naturally only give a diagrammatic illustration of the
means to be used advantageously in carrying out the method
according to the invention. As a result of the teaching of the
invention, however, it is easily possible to adapt the carrier
member in its specific construction, to each particular application
in an optimum manner in the sense of the invention.
* * * * *