U.S. patent number 3,657,805 [Application Number 05/000,067] was granted by the patent office on 1972-04-25 for method of housing semiconductors.
This patent grant is currently assigned to Texas Instruments Incorporated. Invention is credited to Clair Allen Johnson.
United States Patent |
3,657,805 |
Johnson |
April 25, 1972 |
METHOD OF HOUSING SEMICONDUCTORS
Abstract
In a method of housing semiconductors, a sealing collar formed
from a nickel-cobalt-iron alloy is mounted on a ceramic boat. An
LSI slice is then mounted on the boat within the collar. Finally, a
lid formed from the material of the collar is welded to the distal
end of the collar. In a second embodiment of the method, the boat
is formed from a ceramic ring, a nickel-cobalt-iron alloy plate and
a molybdenum plate. In a third embodiment, an LSI slice and at
least one conventional integrated circuit are mounted on the boat
within the collar.
Inventors: |
Johnson; Clair Allen (Sherman,
TX) |
Assignee: |
Texas Instruments Incorporated
(Dallas, TX)
|
Family
ID: |
21689760 |
Appl.
No.: |
05/000,067 |
Filed: |
January 2, 1970 |
Current U.S.
Class: |
29/825;
257/E21.509; 257/699; 257/E23.189; 257/672; 438/123; 438/125;
29/827; 29/832 |
Current CPC
Class: |
H01L
24/80 (20130101); H01L 23/057 (20130101); H01L
25/18 (20130101); H01L 2924/00 (20130101); H01L
2924/00014 (20130101); H01L 2924/00 (20130101); H01L
2224/45144 (20130101); H01L 2924/01074 (20130101); Y10T
29/49121 (20150115); H01L 2924/01042 (20130101); H01L
2924/014 (20130101); Y10T 29/49117 (20150115); H01L
2924/01078 (20130101); H01L 2924/01029 (20130101); H01L
2924/01082 (20130101); H01L 2224/45144 (20130101); H01L
2924/01006 (20130101); H01L 2924/351 (20130101); H01L
2224/48091 (20130101); H01L 2924/01005 (20130101); H01L
2224/48137 (20130101); H01L 2924/01079 (20130101); H01L
2224/49171 (20130101); H01L 2924/351 (20130101); Y10T
29/4913 (20150115); H01L 2924/01013 (20130101); H01L
2224/48091 (20130101); H01L 2924/01033 (20130101); H01L
2924/14 (20130101) |
Current International
Class: |
H01L
21/60 (20060101); H01L 23/02 (20060101); H01L
25/18 (20060101); H01L 23/057 (20060101); H01L
21/02 (20060101); B01j 017/00 () |
Field of
Search: |
;29/576,577,588,589
;317/234G,234H |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Campbell; John F.
Assistant Examiner: Hall; Carl E.
Claims
What is claimed is:
1. A method of housing semiconductors comprising:
a. forming a semiconductor slice receiving member by attaching a
first plate having a first coefficient of thermal expansion to a
second plate having a second coefficient of thermal expansion and
then mounting the second plate in the center of an annular body
having a coefficient of thermal expansion similar to that of the
second plate;
b. attaching a collar to said receiving member;
c. positioning a semiconductor device, having substantially said
first coefficient of thermal expansion, and further having a front
surface for electrical connections thereto, a back surface for
mounting on said first plate with said back surface contiguous with
said first plate; and
d. thereafter attaching a lid to a portion of the collar remote
from the slice receiving member for completely enclosing said
semiconductor slice.
2. A method of housing semiconductors according to claim 1 wherein
the positioning step comprises attaching said back surface to said
first plate within the annular body, thereby rendering access to
said front surface prior to said attaching of lid.
3. A method of housing semiconductors comprising:
a. forming a semiconductor slice receiving member by
1. attaching a first plate having a first coefficient of thermal
expansion to a second plate having a second coefficient of thermal
expansion; and
2. mounting the second plate in the center of an annular body
having a coefficient of thermal expansion substantially similar to
that of said second plate;
b. attaching a collar to said annular body of said slice receiving;
member;
c. positioning a semiconductor slice having a coefficient of
thermal expansion similar to that of said first plate on said slice
receiving member and mounting said semiconductor slice within said
collar on said first plate; and thereafter
d. attaching a lid to a portion of said collar remote from said
slice receiving member.
4. The method of housing semiconductors according to claim 1
wherein the collar extends away from the slice receiving member and
is attached to the slice receiving member by a malleable braze
joint.
5. The method of housing semiconductors according to claim 4
wherein the lid is formed from the same material as the collar and
wherein the lid attaching step is carried out by welding the lid to
the collar.
6. The method of housing semiconductors according to claim 5
wherein the lid attaching step is characterized by attaching an
edge of the lid to an edge of the collar.
7. A method of housing semiconductors including the steps of:
a. providing a semiconductor slice receiving boat including a
substrate having a cavity for receiving a semiconductor slice, a
sealing rim extending around the cavity on said substrate, and a
plurality of conductive strips between said substrate and said
rim;
b. forming a sealing collar having the same periphery as that of
the sealing rim and having a pair of end portions;
c. mounting the sealing collar on the receiving member with one end
portion of the sealing collar in engagement with the sealing
rim;
d. mounting a semiconductor slice in the slice receiving cavity of
the boat;
e. providing a lid including an edge portion having the same
periphery as the other end portion of the sealing collar, and
f. mounting the lid on the sealing collar with the edge portion of
the lid in engagement with the other end portion of the collar.
8. The method of housing semiconductors according to claim 7
wherein the steps of forming a sealing collar and forming a lid are
characterized by forming said collar and said lid from a material
having a coefficient of thermal expansion similar to that of the
material of the boat.
9. The method of housing semiconductors according to claim 7
wherein the step of mounting the lid is carried out by welding the
edge portion of the lid to the other end portion of the collar.
10. The method of housing semiconductors according to claim 7
wherein the boat forming step includes the additional step of
attaching a conductive lead to each of said conductive strips.
11. The method of housing semiconductors according to claim 10
including the additional step mounting the boat in a carrier that
engages and positions each of the leads.
12. The method of mounting semiconductors according to claim 7
wherein the slice mounting step is further characterized by
mounting at least one integrated circuit in the cavity between the
LSI slice and the collar.
Description
In the past, integrated circuits have comprised discrete units.
Typically, a plurality of identical integrated circuits are
fabricated simultaneously in the form of a relatively large slice.
During the latter stages of such an operation, the individual
integrated circuits of the slice are separated from each other and
are thereafter individually mounted in suitable housings.
More recently, the concept of large scale integration (LSI) has
been proposed. In accordance with the LSI concept, many of the
various integrated circuits and other components comprising an
electronic system are formed on a single slice. Preferably, extra
or spare components are also provided so that in the event one of
the components of the system is or becomes defective, a similar
component can be substituted.
In the use of the LSI system, the various components of the slice
are not separated from one another. Thus, it is necessary to
provide a housing for the entire LSI slice. Such a housing must
satisfy at least two requirements. First, it must form a hermetic
seal around the slice. Second, it must permit access to the slice
so that the system on the slice can be repaired, if necessary.
This invention relates to a method of housing semiconductors that
meets both of these requirements. In accordance with the preferred
embodiment of the invention, a semiconductor device is mounted on a
device receiving member within a sealing member and a lid is joined
to the sealing member. If access to the device is required, the
joint between the lid and the sealing member is removed.
A more complete understanding of the invention may be had by
referring to the following detailed description when taken in
conjunction with the drawings, wherein:
FIG. 1 is an illustration of an initial step in the first
embodiment of a method of housing semiconductors employing the
invention;
FIG. 2 is an illustration of a second embodiment of the method;
FIG. 3 is a prespective view of a carrier assembly useful in the
practice of the invention;
FIG. 4 is an enlarged prespective view similar to FIG. 3 in which
certain parts have been broken away;
FIGS. 5, 6, and 7 are illustrations of intermediate steps in the
first embodiment of the method;
FIGS. 8, 9, 10, 11 and 12 are illustrations of modified versions of
the step shown in FIG. 7;
FIG. 13 is an illustration of a third embodiment of the method,
and
FIG. 14 is the sectional view taken generally along the line 14-14
in FIG. 13.
Referring now to FIG. 1, an initial step in a first embodiment of a
method of housing semiconductors employing the invention is shown.
In accordance with the first embodiment, an LSI slice receiving
member 10 includes a boat 12 formed from a high aluminum ceramic or
a beryllia ceramic. The boat 12 includes a central slice receiving
cavity 14, an inner lip 16 that extends around the cavity 14 and an
outer lip 18 that extends around the outer periphery of the boat. A
sealing rim 20 extends around the cavity 14 of the boat 12 between
the inner lip 16 and the outer lip 18.
The boat 12 has outside dimensions of 21/4 .times. 21/4 .times. 1/8
inch and is preferably formed from separate pieces that are fused
into an unitary structure. Prior to the fusing operation, a
plurality of electrically conductive connector strips 22 are formed
on one of the pieces. In the finished boat 12, the strips 22 extend
from the upper surface of the inner lip 16 under the rim 20 to the
upper surface of the outer lip 18.
The LSI receiving member 10 further includes a sealing collar 24
that extends around the slice receiving cavity 14 of the boat 12.
The collar 24 is attached to the upper surface of the sealing rim
20 of the boat 12 by a malleable braze joint 26 and is preferably
formed from a material having thermal expansion characteristics
that match those of the material of the boat 12. For example, the
collar 24 may be formed from an alloy containing 29 percent nickel,
17 percent cobalt and 54 percent iron. Such a material is sold
under the trademark "KOVAR". Alternatively, the collar 24 may be
formed from a malleable material, such as copper, or the like.
During the fabrication of the ceramic boat 12 of the LSI slice
receiving member 10, the connector strips 22 are interconnected by
a conductive strip that extends along the outer edge of the outer
lip 18 of the boat 12. By means of such a strip, a brazing material
is simultaneously electro-plated to at least the outer portions of
all of the strips 22 of the boat 12. Thereafter, the connector
strips 22 are electrically disconnected from one to another,
preferably by forming a beveled surface 28 along the outer edge of
the outer lip 18 of the boat 12 and thereby removing the conductive
strip extending between the connector strips 22.
After the strips 22 have been electrically disconnected at least
one lead frame 30 is attached to the LSI slice receiving member 10.
The lead frame 30 includes a plurality of individual leads or pins
32 that are electrically interconnected at their distal ends. Each
lead 32 is connected to one of the connector strips 22 of the boat
12 by positioning the lead 32 in engagement with its respective
strip 22 and thereafter melting the brazing material on the strip
22. When all of the pins 32 are attached to the strips 22, the
electrical interconnections between the pins 32 are employed to
simultaneously electro-plate successive layers of nickel and gold
over the exposed portions of all of the pins 32 and all of the
strips 22.
Referring now to FIG. 3, the LSI slice receiving member 10 is
mounted in a carrier assembly 34 at the conclusion of the
electro-plating operation. As is best shown in FIG. 4, the carrier
assembly 34 includes an upper member 36 and a lower member 38. A
plurality of teeth 40 extend downwardly from the upper member 36
and are positioned along inner and outer rows. The lower member 38
is positioned between the rows of teeth 40 and is clamped to the
upper member 36 by a plurality of socket head screws 42 each having
an upwardly extending projection 44. Thus, when the LSI slice
receiving member 10 is in the carrier assembly 34, each pin or lead
32 of the member 10 is clamped between the upper and lower members
36 and 38 of the assembly 34 and is positioned between two pairs of
the teeth 40 of the upper member 36.
After the LSI slice receiving member 10 is positioned in the
carrier assembly 34, the interconnections between the distal ends
of the leads 32 of the lead frames 30 are removed. It is best shown
in FIG. 5, a LSI slice 46 is then positioned in the slice receiving
cavity 14 of the boat 12 and is secured to the boat 12 by adhesive
means 48 such as solder, epoxy, etc. Thereafter, the connector
strips 22 of the LSI slice receiving member 10 are connected to
terminals on the LSI slice 46 by individual gold wires 50.
Preferably, the wires 50 are connected to the strips 22 and to the
terminals of the slice 46 by one of the commonly employed chisel
bonding or ball bonding techniques.
When the connector strips 22 of the boat 12 have been connected to
their respective terminals on the slice 46, various tests are
performed. For example, the LSI slice receiving member 10 is
subjected to a vacuum test to determine whether any leaks exist
either in the structure of the boat 12 or in the malleable braze
joint 26. Also, as is best shown in FIG. 6, the LSI slice receiving
member 10 is positioned in a test fixture 52, whereupon various
electrical tests are performed on the slice 46.
The test fixture 52 includes a body 54 having a cavity 56 formed in
it which receives the lower member 38 of the carrier assembly 34. A
plurality of conductive pins 58 are mounted in the body 54 for
engagement with the leads 32. The pins 58 are connected to the
output of a computer controlled LSI slice testing apparatus (not
shown) and serve to form electrical connections between the testing
apparatus and the LSI slice 46. The test fixture further includes a
heat sink (not shown) which engages the lower surface of the boat
12 of the LSI slice receiving member 10 and serves to remove heat
from the slice 46.
At the conclusion of the various testing operations, the LSI slice
receiving member 10 is sealed. The sealing step is illustrated in
FIG. 7 and comprises positioning a sealing lid 60 over the slice
receiving cavity 14 of the member 10 and thereafter forming a weld
62 between the outer edge of the lid 60 and the outer edge of the
collar 24. The lid 60 has outside dimensions that are substantially
equal to the inside dimensions of the collar 24 and is preferably
formed from the same material as the collar 24.
The weld 62 is preferably formed by employing a plasma arc welder
to melt the outer edges of the collar 24 and the lid 60.
Alternatively, a welding rod may be employed to form the weld 62.
The weld 62 can also be formed by directing a welding current
between a pair of rollers mounted in engagement with the collar 24
and the lid 60, respectively. Finally, the weld 62 need not be a
true weld and can be brazed joint, etc.
During the sealing step, a dry atmosphere is maintained around the
slice 46. Alternatively, the slice receiving cavity can be filled
with an inert gas before the lid 60 is attached to the collar 24.
Finally, the slice receiving member 10 can be filled with a
pressurized gas such as helium. The latter procedure is helpful in
testing the assembly for leaks.
Various modified versions of the sealing step shown in FIG. 7 are
illustrated in FIGS. 8 through 12. The version shown in FIG. 8
differs from the version shown in FIG. 7 in that a sealing collar
24a having an L-shaped cross section is employed. The version shown
in FIG. 9 differs from the version shown in FIG. 8 in that a band
of brazing material 64 is positioned between a collar 24b and the
lid 60. In the use of the version shown in FIG. 9, a weld formed by
surrounding the collar 24b with an induction heating coil and
thereafter operating the coil to melt the band 64.
The versions of the sealing step shown in FIGS. 10, 11, 12 differ
from the versions shown in FIGS. 7, 8, and 9 in that a flat lid 60a
is employed. In each case, the lid 60a is joined to an outwardly
extending flange 66 formed on the distal end of a collar. In the
version shown in FIG. 10, the lower portion of a collar 24c is
shaped similarly to the lower portion of the collar 24a shown in
FIG. 8, whereas the version shown in FIG. 11, the lower portion of
a collar 24d is shaped similarly to the lower portion of the collar
24 shown in FIG. 7. The version shown in FIG. 12 differs from the
version shown in FIG. 10 principally in that a ring of ceramic
material 68 is positioned between a collar 24e and a lid 60a to
provide additional strength.
At the conclusion of the sealing step, the method of housing
semiconductors according to the present invention is complete. The
finished LSI assembly has the general appearance of the LSI slice
receiving member 10 shown in FIG. 3. Of course, the slice receiving
cavity 14 of the member 10 is covered by a lid 60 and the
interconnecting portions of the lead frames 30 are removed.
The finished LSI assembly is subjected to a variety of tests
including mechanical and thermal shock tests, bake out and thermal
cycling tests, centrifuge tests, etc. Finally, the LSI assembly is
put into use. During the testing and the use of the LSI assembly,
the carrier assembly remains attached to the leads extending from
the boat. The carrier assembly protects the assembly and may be
provided with identification means, if desired.
In the finished LSI assembly, the slice receiving member forms a
hermetically sealed housing around the LSI slice. Because the
collar and the lid of the slice receiving member are formed from a
material having a coefficient of thermal expansion matched to that
of the slice receiving boat and because the collar and the boat are
interconnected by a malleable joint, the housing withstands wide
variations in temperature without developing leaks. If access to
the slice is ever required, the housing can be opened by simply
sanding away the weld between the collar and the lid.
Referring now to FIG. 2, a second embodiment of the method of
housing semiconductors employing the invention is shown. The second
embodiment is identical to the first embodiment except that the
boat 12' of the second embodiment is comprised of three parts
including a ring 70, a plate 72 and a plate 74. Preferably, the
boat 12 is fabricated by brazing the ring 70, the plate 72 and the
plate 74 to one another.
In accordance with the second embodiment, the ring 70 is formed
from a ceramic material. The plate 72 is formed from a material
having thermal expansion characteristics similar to those of the
ceramic material, for example, a nickel-cobalt-iron alloy may be
employed. On the other hand, the plate 72 is formed from a material
having thermal expansion characteristics that match those of the
material of an LSI slice, for example, tungsten or molybdenum.
When the boat 12' is so constructed, thermal stresses imposed
between the LSI slice and the plate 74 during the operation of the
slice are minimized. Likewise, thermal stresses are minimized
between the plate 72 and the ring 70. Since the thermal expansion
characteristics of the plate 74 and the plate 72 are not matched,
stresses are imposed between the components. However, since neither
the plate 72 nor the plate 74 is an active component, and since the
plates 72 and 74 are brazed together, such stresses produce
substantially no deleterious effects.
A third embodiment of the method of housing semiconductors is
illustrated in FIGS. 13 and 14. The third embodiment is virtually
identical to the first embodiment in so far as the steps
illustrated in FIGS. 1 and 3 through 12 are concerned. One
difference between the third embodiment and the first embodiment is
that the rim 20", the collar 24" and the lid 60" of the third
embodiment are square rather than round.
A very important difference between the third embodiment and the
first embodiment is that a cavity 76 is formed in the boat 12" of
the LSI slice receiving member 10" between the slice receiving
cavity 14" and the rim 20". A conventional integrated circuit 78 is
positioned in the cavity 76 and is connected to certain terminals
on the LSI slice 46" and to certain of the connector strips 22" by
a plurality of gold wires 80. Typically, the integrated circuit 76
is employed in the third embodiment to perform a function that
cannot be performed by the various components of the LSI slice 46".
Therefore, the third embodiment of the method results in an LSI
assembly that is virtually identical to the assembly resulting from
the use of the first embodiment in so far as outward appearance is
concerned, but which has greater utility in that it can perform at
least one additional function.
The use of the method of housing semiconductors that is shown in
the drawings and described herein results in several advantages
over other housing methods. For example, in the practice of the
various versions of the sealing step shown in FIGS. 7 through 12,
the lid is joined to the collar by a weld. This is advantageous
because it permits the use of multiple passes to assure the
formation of a seal, if necessary. Also, a weld is easily removed
to permit access to the slice.
It should be noted that in each case, the weld is formed along a
line positioned a considerable distance from the slice. In and of
itself, this protects the slice form damage due to heat. Also, the
location of the weld permits the positioning of heat sink members
between the outer edge of the collar and the slice while the weld
is being formed.
The mounting of the slice receiving member in the carrier assembly
also results in several advantages. For example, the carrier
assembly protects and maintains the alignment of the leads of the
assembly. The carrier assembly also positions both the LSI slice
and the leads of the slice receiving member relative to test
fixtures. By means of the projections of the socket head screws,
the carrier assembly permits the stacking of LSI assemblies during
shipping, storage, etc. Finally, each carrier assembly can be
suitably tagged, whereupon an automatic system can be employed to
store and dispense LSI assemblies.
Although various embodiments of the invention are illustrated in
the drawings and described herein, it will be understood that the
invention is not limited to the embodiments disclosed but is
capable of rearrangement, modification and substitution of parts
and elements without departing from the spirit of the
invention.
* * * * *