U.S. patent number 3,636,493 [Application Number 05/040,281] was granted by the patent office on 1972-01-18 for resistor with heat dissipating means.
Invention is credited to Richard E. Caddock.
United States Patent |
3,636,493 |
Caddock |
January 18, 1972 |
RESISTOR WITH HEAT DISSIPATING MEANS
Abstract
A disc-shaped metal body or base of anodized aluminum has an
upstanding central post, the body and post being centrally bored to
receive a bolt for stacking or mounting of the resistor. A ceramic
wafer or washer is seated on the body and around the post, and has
a resistive film provided on the upper surface thereof. The
configuration of the resistive film is such that the temperature
generated in the central region of the resistor, relatively
adjacent the post, is greater than is the temperature generated
remote from the post, thus setting up a highly effective thermal
gradient which maximizes the dissipation of heat from the resistor.
Terminal lugs or leads connect to the resistive film and extend
outwardly generally in the plane of the washer, there being a
connection between each lug and the washer by means of a rivet the
ends of which are embedded in thermosetting synthetic resin. All of
the components are maintained protected from the environment by a
mass of thermosetting synthetic resin which extends upwardly from
the film and surrounds the post, the upper surface of the resin
being flush with the top of the post and parallel to the bottom of
the metal body, in order to permit stacking of the resistors. The
body and/or central post incorporate undercut means to prevent
axial and rotational movement of the resin relative to the body,
despite high thermal and other stresses. In accordance with the
method, the preassembled body and ceramic washer (bearing the
resistive film) are mounted as inserts in a mold cavity the depth
of which is approximately equal to the distance between the upper
end of the post and the bottom surface of the metal body. Thus,
despite the absence of a plug in the central bore in the post, no
molding material enters such bore. Molding is effected by transfer
molding, and the mold gate is disposed adjacent the parting line
and also generally adjacent or above the ceramic washer. The
terminal lugs or leads extend outwardly from the mold cavity
through corresponding grooves or recesses located at the parting
line.
Inventors: |
Caddock; Richard E. (Riverside,
CA) |
Family
ID: |
31982203 |
Appl.
No.: |
05/040,281 |
Filed: |
May 25, 1970 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
|
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847783 |
Jul 18, 1969 |
|
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820538 |
Apr 30, 1969 |
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Current U.S.
Class: |
338/52; 174/16.3;
338/254; 338/276; 338/322; 338/226; 338/262; 338/314 |
Current CPC
Class: |
H01C
17/02 (20130101); H01C 10/32 (20130101); H01C
1/14 (20130101); H01C 1/084 (20130101); H01C
1/08 (20130101) |
Current International
Class: |
H01C
1/084 (20060101); H01C 1/14 (20060101); H01C
10/00 (20060101); H01C 10/32 (20060101); H01C
17/00 (20060101); H01C 1/08 (20060101); H01C
1/00 (20060101); H01C 17/02 (20060101); H01c
001/08 () |
Field of
Search: |
;338/51,226,254,262,275,276,308,314,319,322,22 ;174/15R,DIG.5 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Goldberg; E. A.
Parent Case Text
CROSS-REFERENCES TO RELATED APPLICATIONS
This application is a continuation-in-part of application Ser. No.
847,783, filed July 18, 1969, for Power Resistors, by the present
applicant now abandoned. Said application is, in turn, a
continuation-in-part of patent application Ser. No. 820,538, filed
Apr. 30, 1969, for Power Resistors, by the present applicant, now
abandoned.
Claims
I claim:
1. A power resistor, which comprises:
a disc of metal,
said disc having a central opening therethrough sufficiently large
to receive a mounting bolt,
a layer of electrically insulating and thermally conductive
material provided on the upper surface of said metal disc in
effective heat-transfer relationship thereto,
an electrically resistive film provided on the upper surface of
said insulating layer,
termination means for said resistive film,
said termination means including first and second electrical
conductors electrically connected to said film and extending
outwardly therefrom, and
a mass of synthetic resin molded over said resistive film and over
said insulating layer to embed said film and said layer,
said mass of resin also embedding the inner portions of said
electrical conductors,
said mass of resin having an opening therethrough registered with
said opening in said metal disc,
said mass of resin being disposed on only the upper side of said
metal disc whereby the lower surface of said metal disc may be
mounted by said mounting bolt in effective heat-transfer
relationship to an underlying chassis.
2. The invention as claimed in claim 1, in which means are provided
to mechanically lock said mass of resin to said metal disc.
3. The invention as claimed in claim 2, in which said lock means
prevents movement of said resin mass both axially and rotationally
relative to said metal disc.
4. The invention as claimed in claim 1, in which said embedded
inner portions of said electrical conductors lie generally in the
same plane as that of said resistive film.
5. The invention as claimed in claim 1, in which said mass of resin
has an upper surface parallel to said lower surface of said metal
disc, and in which both of said surfaces are planar.
6. The invention as claimed in claim 1, in which said resistive
film extends around said central opening in said disc, and in which
said film has such a configuration that the temperature of said
metal disc at regions relatively adjacent said opening is
substantially greater than that of said metal disc at regions
remote from said opening.
7. The invention as claimed in claim 6, in which said film has a
generally C-shaped configuration, in which said electrical
conductors electrically connect to the respective ends of the C, in
which the inner circular edge of the C is adjacent said opening,
and in which the outer circular edge of the C is adjacent the
periphery of said insulating layer.
8. The invention as claimed in claim 1, in which said mass of resin
has a peripheral wall the diameter of which is generally the same
as the outer diameter of said metal disc, said wall and said resin
serving as the housing of the power resistor.
9. The invention as claimed in claim 1, in which said metal disc
has integrally associated therewith a tubular metal post, the
opening within said post registering with said central opening in
said disc, and in which said mass of resin is molded around said
post whereby said opening in said resin is coincident with said
opening within said post.
10. The invention as claimed in claim 1, in which the upper and
lower surfaces of said metal disc, and said resistive film, are all
planar and parallel to each other.
11. The invention as claimed in claim 1, in which said electrical
conductors are adjacent each other on the same side of the
resistor.
12. A laminar power resistor, which comprises:
a metal disc having a central opening therethrough and having
planar upper and lower surfaces,
a metal post connected fixedly to said disc and extending upwardly
from the upper surface of said disc coaxially therewith,
said post having an axial opening therethrough registered with and
forming an extension of said central opening in said disc,
said openings in said disc and said post being adapted to receive a
mounting bolt,
a heat-transmissive wafer of electrically insulating material,
said wafer having planar upper and lower surfaces parallel to each
other,
said lower surface of said wafer being mounted adjacent, and in
effective heat-transfer relationship relative to, said upper
surface of said metal disc,
said wafer having a central opening therein through which said post
extends,
a planar film of electrically resistive material adhered to said
upper surface of said wafer,
termination means for said resistive film and including first and
second electrical conductors portions of which extend radially
outwardly from said film in generally the same plane as that of
said film, and
a mass of thermosetting synthetic resin molded around said post and
over said film and said wafer, and over the inner portions of said
termination means, to embed the same.
13. The invention as claimed in claim 12, in which said resistive
film extends around said post, in which substantial portions of
said film are located adjacent the peripheral edge portion of said
wafer, in which other substantial portions of said film are located
adjacent the inner edge portion of said wafer near said central
opening therein, and in which the configuration of said film is
such that the temperature created at said other substantial
portions of said film, due to passage of current therethrough from
one of said electrical conductors to the other, is substantially
higher than the temperature created at said first-mentioned
substantial portions due to said passage of current.
14. The invention as claimed in claim 13, in which said resistive
film is generally C-shaped, and in which said conductors connect,
respectively, to the ends of the C.
15. The invention as claimed in claim 12, in which the upper
surface of said mass of resin is parallel to said planar lower
surface of said metal disc and is substantially flush with the
upper end of said metal post.
16. The invention as claimed in claim 13, in which said mass of
resin has a generally cylindrical wall which is substantially flush
with the peripheral edge of said metal disc.
17. The invention as claimed in claim 12, in which said first and
second electrical conductors protrude outwardly from said mass of
resin on the same side of said mass and relatively adjacent each
other.
18. The invention as claimed in claim 12, in which said metal disc
and said metal post are integral with each other and are formed of
aluminum.
19. The invention as claimed in claim 12, in which said wafer is a
thin disc of ceramic.
20. The invention as claimed in claim 12, in which means are
provided to lock said mass of resin to said metal disc, thereby
preventing separation thereof despite strong mechanical and thermal
stresses.
21. The invention as claimed in claim 20, in which said locking
means includes interlocking regions to prevent both axial movement
of said mass of resin relative to said disc and rotational movement
of said mass of resin relative to said disc.
22. The invention as claimed in claim 21, in which the upper edge
of said metal disc is indented inwardly from the extreme peripheral
edge of said disc, in which said insulating wafer is disposed on
the upper surface of the indented portion of said metal disc, in
which part of said mass of resin is disposed in encompassing
relationship around the wall formed by said indented edge of said
metal disc, and in which a plurality of recesses are provided
circumferentially around said wall and are filled with parts of
said mass of resin in order to perform said function of locking
said mass of resin against both axial and rotational movements
relative to said metal disc.
23. The invention as claimed in claim 12, in which said metal post
is tubular and has a substantially cylindrical exterior surface,
and in which said central opening in said insulating wafer is
circular and is only slightly larger than the diameter of said
cylindrical exterior surface of said post.
24. The invention as claimed in claim 12, in which said termination
means includes first and second metal films adhered to said upper
surface of said wafer and in electrical contact, respectively, with
different portions of said film of resistive material.
25. The invention as claimed in claim 24, in which said first and
second electrical conductors are terminal lugs in the form of flat
bands or strips of metal, the inner ends of said terminal lugs
being disposed in flatwise engagement with said metal films, and in
which means are provided to mechanically connect said inner lug
ends to said wafer.
26. The invention as claimed in claim 25, in which said mechanical
connector means each comprises a hollow rivet extended through a
hole in an associated terminal lug and a corresponding hole in said
wafer, in which a counterbore is provided in said lower surface of
said wafer and adapted to receive the lower end of said rivet, in
which the upper and lower ends of said rivets are flared outwardly,
in which the lower end of said rivet is spaced substantially above
said lower surface of said wafer, and in which part of said mass of
resin extends through said rivet and fills said counterbore whereby
to insulate said rivet from said metal disc.
27. The invention as claimed in claim 24, in which said first and
second electrical conductors comprises insulated flexible wires
electrically connected to said metal films and mechanically
connected to said wafer, a length along each of said wires equal to
at least five diameters of the insulation thereon being embedded in
said mass of resin.
28. The invention as claimed in claim 12, in which said termination
means includes first and second metal films adhered to said upper
surface of said wafer and in electrical contact, respectively, with
different portions of said film of resistive material, in which
each of said electrical conductors is a flexible lead enclosed in a
tubular sleeve of electrically insulating and heat resisting
material, in which means are provided to mechanically connect
exposed ends of said flexible leads to said wafer on one side of
said post and in electrical contact with said films, and in which
the unexposed portions of said flexible leads are disposed on said
resistive film and in straddling relationship to said post and
extend generally diametrically from said exposed ends to the
opposite region of the resistor.
29. The invention as claimed in claim 28, in which said mechanical
connector means for each of said leads is a hollow rivet extending
through a lug which is connected to an exposed end of said lead,
said rivet also extending through said wafer and into a counterbore
provided in the lower surface of said wafer, the lower end of said
rivet being spaced a substantial distance above the plane of the
lower surface of said wafer, and in which part of said resin is
disposed in said hollow rivet and in said counterbore to insulate
said rivet from said metal disc.
30. The invention as claimed in claim 12, in which a second metal
disc is mounted above said first-mentioned metal disc and in
electrically insulated heat-transfer relationship to said resistive
film, said second metal disc having an upper surface parallel to
said lower surface of said first-mentioned metal disc, and in which
said mass of resin is provided between said first-mentioned and
second metal discs.
31. The invention as claimed in claim 30, in which a layer of
heat-transmissive and electrically insulating material is provided
between said resistive film and said second metal disc to form the
insulation therebetween, said layer being closely adjacent said
resistive film and closely adjacent said second metal disc to
create a high rate of heat transfer between said film and said
second metal disc.
32. The invention as claimed in claim 30, in which said upper
surface of said second metal disc is flush with the upper end of
said post, and in which the periphery of said mass of resin is a
cylindrical wall which is flush with the peripheral edges of said
first-mentioned metal disc and said second metal disc.
33. The invention as claimed in claim 12, in which said resistive
film is formed of a complex metal oxide in a glass matrix.
34. The invention as claimed in claim 12, in which a plurality of
said resistors are mounted on a mounting bolt in stacked
relationship, and in which a relatively large area metal plate is
provided between each two adjacent resistors in order to form a
heat-transmissive fin to carry heat away from said resistors.
35. The invention as claimed in claim 12, in which each of said
first and second electrical conductors is a terminal lug the inner
end portion of which is embedded in said resin, and in which each
of said lugs has a hole therethrough adjacent the peripheral
portion of said wafer and filled with said resin, the region of
said lug adjacent said hole being adapted to flex and absorb shock
and bending.
36. The invention as claimed in claim 35, in which said lug is
riveted to said wafer at a point between said opening in said wafer
and said hole in said lug.
37. The invention as claimed in claim 35, in which said lug is a
flat band of metal parallel to said upper surface of said
wafer.
38. The invention as claimed in claim 37, in which means are
provided on the sides of said lug, adjacent said hole therethrough,
to form shoulders embedded in said resin.
39. A current-carrying device characterized by a high rate of heat
dissipation, high environmental performance, and high resistance to
breakdown despite relatively large-magnitude applied voltages,
which comprises:
a metal base adapted to be mounted on a metal chassis in effective
heat-transfer relationship thereto,
electrical insulator means mounted above said metal base in
effective heat-transfer relationship thereto,
said insulator means having a hole therethrough and a counterbore
in the underside thereof and registered with said hole,
a current-carrying element provided on the upper surface of said
insulator means in effective heat-transfer relationship
thereto,
termination means for the terminals of said current-carrying
element,
at least one of said termination means including a hollow rivet
extended through said hole and said counterbore,
the portion of said rivet in said counterbore being spaced
substantially above the bottom wall of said insulator means,
and
a mass of synthetic resin provided around said insulator means and
said current-carrying element to embed the same,
a portion of said mass being disposed in said rivet and in said
counterbore to thereby effectively insulate said rivet from said
metal base.
40. The invention as claimed in claim 39, in which said termination
means comprises a terminal lug the inner end of which is embedded
in said synthetic resin, said inner end of said terminal lug having
a hole therethrough and through which said rivet extends to thereby
effectively mechanically lock said terminal lug to said insulator
means, the outer end of said terminal lug protruding from said mass
of resin.
41. The invention as claimed in claim 40, in which a conductive
film is provided on said insulator means beneath said inner end of
said terminal lug, said conductive film being connected to one
terminal of said current-carrying element, and in which said
insulator means is a ceramic having a substantial ability to
transfer heat from said current-carrying element to said metal
base.
42. The invention as claimed in claim 40, in which said terminal
lug has a hole therethrough at a region between said rivet and the
protruding outer end of said terminal lug, said hole receiving a
part of said mass of resin, the regions of said terminal lug
adjacent said hole being relatively flexible in order to prevent
transmission of bending and vibrational stresses from the
protruding outer end of said terminal lug to said rivet.
43. The invention as claimed in claim 42, in which the portions of
said terminal lug relatively adjacent said hole therethrough
comprise radially outwardly extending shoulders adapted to bear
against the adjacent regions of said mass of resin to thereby aid
in preventing pulling of said terminal lug out of said resin
mass.
44. The invention as claimed in claim 39, in which said termination
means comprises insulated flexible leads at least one of which is
connected to said rivet, said lead including a portion having a
length equal to at least five diameters of the insulation on said
lead, said portion being embedded in said mass of resin.
45. The invention as claimed in claim 44, in which said lead is
formed of a flexible conductor enclosed in a tubular sleeve of
heat-resisting insulating material, and in which an exposed end of
said flexible conductor is mechanically and electrically connected
to a lug having an opening therein through which said rivet
extends.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to the field of electrical power resistors,
wherein the dissipation of heat, the size of the resistor, the
environmental protection thereof, etc., are major problems.
2. Description of Prior Art
The heat generated when components, such as power resistors, have
current passing therethrough, has always been a problem in the
electronics field. The problem has been magnified in recent years
by the need to make electronic devices extremely compact for use,
for example, in spacecraft. Power resistors conventionally employed
in military and industrial applications are wire-wound devices of
cylindrical shape. In such wire-wound devices, the heat generated
near the top must travel through the same heat-sink area through
which the heat generated near the bottom travels. Because of this,
the temperature gradient between the bottom part of the resistor
and the underlying chassis is different from the temperature
gradient between the top part of the resistor and the chassis.
Consequently, the heat is not removed as efficiently from the top
of the resistor, which increases the possibility of hot spots near
the top and thus increases the likelihood of failure.
In addition to conventional wire-wound resistors as indicated in
the previous paragraph, the prior art includes numerous film-type
resistors wherein the resistor material is a film (for example, of
a complex metal oxide in a glass matrix). These, however, have
heretofore not been able to achieve the high degree of heat
dissipation required of power resistors, and/or have not been
adequately protected against environmental conditions, and/or have
not been sufficiently small, and/or have not been able to meet
various other requirements of the electronics and other industries.
Very importantly, the prior art has not provided a method of
manufacturing small, lightweight, environmentally protected,
stackable power resistors in a highly economical manner, and one
which makes it possible to employ extremely low-cost screw-machined
metal parts as major components of stackable power resistors. The
prior art has not solved problems relating to heat dissipation from
power resistors, the proper mounting and location of the terminals
of such resistors, the ability of the resistors to withstand
relatively high applied voltages, etc.
SUMMARY OF THE INVENTION
The combination of extremely small size, high rate of heat
dissipation, stackability, environmental protection, and low cost
are achieved, along with other major advantages, by the present
invention. This is done by providing a disc-shaped metal body or
base having a central hole or opening for bolt-type mounting on a
metal chassis, the body supporting in heat-transfer relationship a
ceramic washer or wafer on the surface of which is provided a
film-type resistor of a type which generates a higher temperature
toward the center (adjacent the mounting hole) than at the
periphery. A thermosetting synthetic resin is molded over the body
and washer and in such manner that the mounting bolt may extend
through the resin, the resin serving to fully protect the resistor
from the environment. The terminal conductors from the resistive
film extend radially outwardly on one side of the unit, and
generally in the plane of the washer. In accordance with one
important feature of the invention, a bored post extends upwardly
from the metal body and to the upper surface of the thermosetting
resin, such upper surface being parallel to the lower surface of
the body in order that the resistors may be stacked. The terminal
conductors are, in accordance with another important feature,
attached to the film-bearing washer by means of hollow rivets
through which resin is passed, the resin serving as a dielectric to
prevent any electrical discharges between the rivet and the
underlying metal body. Another feature relates to the manner of
locking the resin to the metal body, and to the anchoring of the
terminal conductors in the resin, in order to achieve great
ruggedness and a high degree of resistance to mechanical and
thermal stresses. When the terminal conductors are lugs, they are
provided with stress relieving and locking portions permitting
flexing of the outer (exposed) portions without damage to the
resistor elements. An embodiment is provided wherein metal body
elements are provided above as well as below the film-bearing
washer.
In accordance with the method of the invention, the body, post and
film-bearing substrate (together with preassembled terminal lugs or
wires) are mounted in a mold cavity sufficiently small that the
bore in the post is blocked by the upper cavity wall. This permits
use of extremely low-cost screw-machined bodies and posts, with
large-tolerance (as distinguished from precision) conditions, and
without employing any plugs in the mold. The method further
comprises providing the terminal lugs or wires in mold recesses or
grooves at the parting line of the mold, and similarly locating the
mold gates adjacent the parting line and above the lower portions
of the inserted body. This permits low-cost transfer molding, with
minimized possibility that hydraulic forces will adversely affect
the locations of the mold inserts.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a perspective view of a power resistor, constructed in
accordance with the present invention, and wherein the
thermosetting resin is partially broken away in order to show the
various parts enclosed thereby;
FIGS. 2 and 3 are perspective views of parts of the resistor of
FIG. 1;
FIGS. 4 and 5 are side elevational views of other embodiments of
the power resistor;
FIG. 6 is a perspective view of the washer or substrate element
supporting the resistive film, and showing one embodiment of the
terminal conductors for the power resistor;
FIG. 7 is an enlarged cross-sectional view taken along a portion of
the section line 7--7 of FIG. 6;
FIG. 8 is a perspective view of the washer element, showing a
connection for wire leads to the resistor;
FIG. 9 is a perspective view, with portions broken away,
corresponding to FIG. 1 except showing a different embodiment of
the invention;
FIG. 10 is a greatly enlarged fragmentary sectional view, portions
of which correspond to FIG. 7, and which shows the manner in which
the thermosetting synthetic resin provides various locking,
insulating and environmental protection functions;
FIG. 11 is a view, partially in vertical section and partially in
elevation, illustrating an additional embodiment of the invention
wherein disc-shaped metal bodies are provided above and below the
film-bearing substrate washer;
FIG. 12 is a top plan view of a stack of power resistors between
which are interposed a plurality of cooling fins;
FIG. 13 is a side elevational view of the showing of FIG. 12;
FIG. 14 is a graph or chart showing the variations in power ratings
when the power resistors are stacked with cooling plates interposed
therebetween, and with air forced across the stack at various
rates;
FIG. 15 is a vertical sectional view illustrating schematically a
transfer molding apparatus including a mold cavity wherein are
disposed the metal body and post, ceramic washer, resistive film
and terminal means;
FIG. 16 is a perspective view illustrating the lower portion of the
mold, but with no inserts therein;
FIG. 17 is a view corresponding to FIG. 16 but illustrating inserts
wherein the terminal conductors are flexible leads as distinguished
from flat metal lugs; and
FIG. 18 is a view corresponding to FIG. 9 but illustrating the
embodiment wherein the terminal conductors are leads and
distinguished from lugs.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
A power resistor 1 in accordance with the present invention is
shown in FIG. 1 of the drawing. Such resistor 1 includes a
current-carrying element, in the form of a film 2 of the resistive
material, and which is provided on an underlying supporting means.
Such supporting means comprises two separate elements, which are a
base or body 3 and a wafer or washer 4.
The base 3 is made up of a material that is a good thermal
conductor, namely a metal or a metallic alloy. Preferably, base or
body 3 is anodized aluminum. The base 3 has upper and lower planar
surfaces 5 and 6, respectively, which are parallel to each other.
The lower surface 6 is designed to make good, flatwise, thermal
contact with the chassis (formed of metal) upon which the resistor
1 is mounted, while the upper surface 5 is designed to make good,
flatwise, thermal contact with the planar lower surface of the
wafer 4 which supports resistive film 2.
The base or body 3 is disc-shaped and has a circular central hole 7
in the center thereof. Such hole 7 also extends (in the form of a
bore) through a central post 10 which extends upwardly from the
disc-shaped base 3 centrally thereof. As stated hereinafter, the
disc-shaped base 3 and the post 10 may be very economically formed
as a screw-machined part, the disc and post being integral with
each other. All are (as above indicated) preferably anodized
aluminum, it being a feature of the invention that the present
method does not require that the anodized coating be broken at any
time.
Surface 6 is held in contact with the chassis through the
cooperation of a bolt or screw (not shown) extending through the
hole 7 in post 10 (in the manner described hereinafter relative to
FIGS. 12 and 13).
Element 4 is composed of material which is a thermal conductor so
that the heat will be readily transmitted from the current-carrying
resistive film 2 through elements 4 and 3 to the chassis upon which
the resistor 1 is mounted. The material of element 4 is also an
electrical insulator to isolate the current-carrying film 2 from
the metallic base 3 and from the chassis upon which the resistor 1
is mounted.
The wafer 4 is a thin disc of thermally conductive but electrically
insulating material, namely a suitable ceramic. The diameter of
disc 4 is substantially smaller than that of the underlying
disc-shaped body 3, as shown in FIG. 1. The wafer 4 has a circular
central opening 4a (FIG. 2) which is sufficiently large in diameter
to permit the wafer to be mounted over the central post 10
indicated above. The wafer or washer 4 has parallel, planar upper
and lower surfaces.
The resistor 1 incorporates a very important means for holding the
elements together in good thermal contact, and in a manner which
achieves an extremely high degree of environmental protection. This
comprises a molded thermosetting plastic (synthetic resin) 8. The
plastic 8 is held in contact with the resistive film 2 and with
elements 4 and 3 by an enlarged-diameter upper portion 9 of the
post 10. The plastic 8 is maintained against rotational movement by
the knurls 15 that are cut into the periphery of the
enlarged-diameter portion 9. The shoulder 9a (FIG. 3) formed
beneath enlarged-diameter portion 9 prevents shifting of the
plastic in a direction axial to post 10.
Metallizing films 11 and 12 (FIG. 2) are adherently provided
adjacent each other on the upper surface of element 4, in contact
with the resistive film 2, to form terminations thereof for
connection to terminal conductors. To these metal films 11 and 12
are electrically connected terminal conductors in the form of lugs
13 and 14, respectively, which facilitate the connection of
external leads to the power resistor. The metal films 11 and 12 may
be gold or a gold alloy, such as a gold-platinum alloy. The
terminal lugs 13 and 14 (or flexible leads, described below) may be
brazed directly to films 11 and 12 to mechanically fix the lugs 13
and 14 in place.
Particularly in those embodiments wherein the diameter of the
washer opening (such as 4a) is only slightly larger than that of
the lower end of the metal post, the films 11 and 12 should not
extend radially inwardly to the opening but should instead
terminate at edges spaced outwardly from the opening.
The particular resistive film 2 shown in FIGS. 1 and 2 is annular
(or C-shaped) and covers substantially the entire upper surface of
the disc or wafer (washer) 4 except adjacent the inner and outer
margins thereof and except in the region of the metallizing films
11 and 12. Such films 11 and 12 make electrical contact with the
resistive film 2 at only the ends of the latter. The metallizing
films 11 and 12 do not contact each other but instead,
respectively, make contact with the terminal lugs 13 and 14.
The C-shaped or annular resistive film 2 is one of various films
described in the above-cited patent application Ser. No. 847,783,
particularly relative to FIGS. 12-13 thereof, and which achieves
the effect of creating a higher temperature adjacent the center of
the power resistor 1 than adjacent the periphery thereof. Such
embodiments of FIGS. 12 and 13 are also shown in my copending
application Ser. No. 40,308 filed on even date herewith, for
Film-Type Power Resistor, and Method of Making the Same. This
produces a favorable temperature-gradient relationship relative to
the underlying chassis, as stated hereinafter, and thereby enhances
the heat dissipation abilities of the present power resistor.
In the configuration of FIG. 2, the resistive film 2 may readily
have a length that is 10 times the effective width of the film, so
that the film pattern produces ten squares of resistive film in
series. If the resistive film has a resistance of 100 ohms per
square, a resistor having a value of 1,000 ohms is thus produced.
If the film has a resistance of 10 ohms per square, the resistor
will have a value of 100 ohms. A variety of resistance values may
therefore be produced from this basic pattern by using different
resistive material.
The disc-shaped ceramic washer or wafer 4, having the hole 4a in
the center, is preferably formed of aluminum oxide ceramic,
although it may be formed of various other ceramics such as
beryllium oxide. The resistive film 2 is adherently provided on the
upper surface of the wafer or washer 4 by silk screening or other
methods. Such resistive film is preferably a complex metal oxide in
a glass matrix. After the film is silk screened or otherwise
deposited on the upper surface of the wafer, it is baked (fired)
and then treated in such manner as to achieve the precise
resistance value desired. Reference is made to my copending patent
application, filed on even date herewith.
In the embodiment of FIGS. 1-3, the terminal lugs 13 and 14 are
shown as being attached to the metallizing films 11 and 12 by
brazing. There is described hereinafter, particularly relative to
FIGS. 6, 7, 9 and 10, a method of attachment by means of rivets or
eyelets. The terminal lugs may be formed, for example, of a
suitable metal such as gold-plated brass or "Monel."
Additional embodiments for the power resistor are shown in FIGS. 4,
5, 6, 8 and 9 of the drawings (as well as in FIGS. 11 and 18
described hereinafter). In the embodiment of FIG. 4, the
construction differs from the resistor 1 of FIG. 1 relative to the
way the thermosetting plastic is anchored to the other elements of
the resistor. The resistor 20 of FIG. 4 has a disc-shaped base or
body 21 with a tubular central post 22 that extends above the upper
planar surface 23 on which is positioned a ceramic wafer or washer
24 which supports the film 25 of resistive material. The hole or
bore in the base and post is numbered 22a. The upper surface 23 of
the base 21 is cut or indented back from the cylindrical outer
boundary 26 thereof, and is undercut to form a lip 27. The
peripheral edge of the smaller-diameter planar surface 23 (namely,
the lip 27) has serrations 28 cut therein. These cooperate with the
plastic 29 so that the plastic will not turn with respect to the
other elements of the resistor. Additionally, the plastic is held
in place (against axial shifting) by the annular groove formed
beneath lip 27.
The resistor 30 shown in FIG. 5 has a construction similar to that
of resistors 1 and 20, except that it has a different means for
holding the molded thermosetting plastic 31 in place. In resistor
30, the base or body 32 has a vertical peripheral extension 33 and
a horizontal extension (lip) 34 which hold the plastic in place.
The inner edge of the horizontal extension 34 is serrated to
prevent the plastic from turning with respect to the other elements
of the resistor 30. The vertical extension 33 extends upwardly, and
has a cylindrical exterior surface. The horizontal extension 34
extends radially inwardly in spaced relationship above the upper
surface of base or body 32.
In fixing the terminal lugs in place where they make electrical
contact with the metal film at which the resistive film terminates,
it is important to employ a mechanical connection that will give
good electrical contact between the metal film and the terminal
lug. Such a mechanical connection is shown in FIGS. 6, 7 and 10
wherein a wafer 40 has a film 41 of resistive material printed
thereon. Additionally, as terminations of the resistive film 41
there are provided a metal film 42 and a metal film 43 printed on
the wafer 40 at the ends of the resistive film 41. In electrical
contact with the metal film terminations 42 and 43 are a terminal
lug 44 and a terminal lug 45, respectively. Lugs 44 and 45 are
riveted to the wafer or washer 40 by means of hollow eyelets or
rivets 46 and 47, respectively. Such rivets, and the associated
anchor and dielectric relationships, are described in detail
hereinafter with particular reference to FIGS. 7 and 10.
There will next be described the embodiment of FIGS. 9 and 10. Such
embodiment incorporates the terminal lug and rivet constructions of
FIGS. 7 and 8.
The power resistor 49 (FIG. 9) has a base or body 50 of anodized
aluminum, and also has a central, upwardly extending post 51 formed
integrally therewith and also of anodized aluminum. Post 51 is
tubular or hollow, having a cylindrical exterior surface 52 and a
smaller-diameter cylindrical interior surface 53. The latter
extends clear to the bottom surface of base or body 50, thus
forming the "bore" through the base 50 and through post 51 for
reception of a bolt or other mounting means. Post 51 corresponds to
the post 22 shown in FIG. 4.
The upper end of post 51 is disposed in a plane which is
perpendicular to the common axis of base 50 and the post, thus
forming a planar radial surface 54 which is parallel to the planar
bottom wall of base or body 50. The difference between the
diameters of the inner surface 53 and the outer surface 52 is
sufficiently great that the post wall has substantial thickness,
thereby creating considerable strength and also increasing the
thermal conductivity of the post.
The periphery of base or body 50 is cylindrical and coaxial with
the post surfaces 52 and 53. Stated more definitely, such base is
peripherally stepped or indented to provide two peripheral
cylindrical surfaces, namely a larger-diameter surface 55 and a
substantially smaller-diameter surface 56 (FIGS. 9 and 10).
The larger-diameter cylindrical surface 55 of base 50 is flush with
a cylindrical wall 57 of the thermosetting synthetic resin
(plastic) 58 which holds the parts in position and provides
environmental protection, insulating and locking functions as
described in detail below. The plastic also has an upper surface 59
disposed in a plane perpendicular to the axis of the resistor and
flush with the radial wall or end 54 of post 51. The junction of
cylindrical surface 57 with radial surface 59 is preferably rounded
or radiused.
The smaller-diameter cylindrical surface 56 shown in FIGS. 9 and 10
is substantially flush with the corresponding cylindrical edge 60
(FIG. 10) of the ceramic wafer or washer 40 described above
relative to FIGS. 6 and 7. Such surface 56 has formed therein
throughout the entire circumference thereof a plurality of spaced
"sprocket" holes or recesses 61. Each such "sprocket" hole or
recess 61 is spaced below the upper surface of the central region
of base 50 (the surface on which the ceramic 40 rests), so that
resin 58 entering each hole 61 will not only prevent rotational
movement of the body relative to the resin but will also prevent
axial movement thereof relative to the resin (in a direction
parallel to the axis of the resistor).
As previously indicated, the base 50 and its integrally associated
post 51 are screw-machined parts formed inexpensively of aluminum
and then anodized.
The remainder of the embodiment of FIGS. 9 and 10 will be described
hereinafter relative to the rivets or eyelets 46 and 47 and
associated recess and anchor means for the respective terminal lugs
44 and 45. A layer of suitable thermally conductive and
heat-resistive adhesive may be provided between the lower surface
of ceramic washer 40 and the upper surface of the body 50, thus
insuring against any separation therebetween. Such adhesive may
comprise, for example, a polyamide resin.
GENERAL OPERATION OF THE ABOVE-DESCRIBED RESISTORS 1, 20, 30 AND
49, AND OF THE RESISTORS DESCRIBED HEREINAFTER RELATIVE TO FIGURES
11 AND 18
As indicated above, each of the resistors described in the
specification is rigidly and tightly secured to an underlying
chassis plate or fin (formed of aluminum or other excellent thermal
conductor), by means of a bolt which extends through the central
bore in the metal body and post. There is therefore excellent,
flatwise heat-transfer contact between the bottom surface of the
base or body and the upper surface of the chassis.
Each of the resistors described in the present specification is of
laminar construction, there being an equal length thermal path from
each portion of the resistive film to the adjacent portion of the
underlying chassis. Thus, for example, and referring to FIG. 4, the
distance from the peripheral edge of resistive film 25 downwardly
(vertically) to the bottom surface of base or body 21 is equal to
the distance between the inner edge of such film 25 downwardly
(vertically) to the bottom surface of base 21. Accordingly, there
is excellent transfer of heat from the resistive film 25 (or other
film described herein) to the chassis.
The amount of heat transferred through the thermosetting synthetic
resin (such as 8, 29, 58, etc.) is relatively small since such
resin is not a good thermal conductor. It is an important feature
of the present invention that, despite the fact that the resin is
not a good thermal conductor, the heat dissipation characteristics
of the present resistor are far more favorable than are the heat
dissipation characteristics of power resistors conventionally
employed in the art.
Although the resin is not a good thermal conductor, it is
emphasized that the central post (such as 10, 22, 51, etc.) is an
excellent thermal conductor and aids in transmitting heat from the
body or base to the surrounding region (especially when stacking is
effected as described hereinafter relative to FIGS. 12 and 13).
Also, where the bolt employed to mount the resistor has an outer
diameter substantially equal to the inner diameter of the post, and
where the bolt is formed of a good thermal conductor, such bolt
aids in dissipating heat from the resistor.
As described above, the resistive film 2, 25, 41, etc., (and
certain other films, such as those described in copending
application filed on even date herewith) has such a configuration
that the temperature adjacent the post is greater than at the
periphery of the resistor. For example, and referring to the
particular resistive film illustrated in the drawings of the
present application, the length of the current path around the
smaller-diameter portion of the film is much shorter than is the
length of such path around the larger-diameter portion of the film.
Accordingly, the current flowing through the resistor tends to be
greater at regions near the post than at regions remote therefrom.
Since the power (and thus generated heat) is equal to the square of
the current times the resistance, it follows that there will be
more heat generated near the post than remote therefrom. The
temperature is therefore greater near the post than remote
therefrom, and (since the thermal paths from all portions of the
resistor to the underlying chassis plate are the same) the
temperature at the chassis portion relatively adjacent the central
post will be greater than the temperature relatively adjacent the
periphery of the resistor body.
There is therefore set up in the chassis plate or fin a thermal
gradient which is favorable to the efficient conduction of heat
away from the resistor, it being emphasized that heat tends to flow
from hot to cold and that therefore a higher temperature in the
center will tend to cause flow of heat from such center radially
outwardly through the chassis plate or fin.
Because of the above and various other factors, such as those
discussed below, the power resistors of the present invention, even
though very much smaller in size than the wire-wound power
resistors conventionally employed, easily exceed the requirements
for power resistors established by the Department of Defense and as
set forth in Military Specification Manual MIL-R-18546.
As but one example, a power resistor manufactured in accordance
with the present invention, and having a rating of 30 watts, is
only about one-half the size of a conventional commercial power
resistor having a power rating of only 25 watts. Such commercial
(last-mentioned) resistor is approximately the size for a 20-watt
resistor by the Department of Defense in its specification manual
MIL-R-18546.
The 30-watt resistor indicated in the preceding paragraph is less
than 1 inch (namely, 0.85 inch) in diameter and is only one-quarter
inch in thickness. When fastened to an aluminum chassis plate, the
resistor has higher power capabilities than any resistor of
comparable size previously available in the art.
As another example, a 15-watt unit manufactured in accordance with
the present invention has a diameter of only 0.60 inch, and is only
0.188 inch thick.
The resistors may be economically manufactured to close resistance
tolerance, such as plus or minus 1 percent. The insulation
resistance is high, such as 10,000 megohms, dry. In addition, such
factors as moisture resistance, life, etc., exceed military
requirements.
The resistance of the present resistors to thermal shock,
mechanical shock, vibration, etc., is extremely high. Because the
thermosetting synthetic resin is locked to the metal base or body
not only against axial movement but also against rotational
movement, factors such as mechanical and thermal shock do not
separate the resin from the metal. The assembly is thus maintained
in a unitary condition and capable of resisting attack by moisture,
etc.
It is also emphasized that the thermosetting resin is the housing
for the resistor, there being no "potting" or other
requirements.
It is a major feature of the present power resistors that they are
noninductive, particularly in comparison to conventional wire-wound
power resistors which have relatively high inductance. Although
wire-wound resistors may be made with relatively low inductance by
employing bifilar winding techniques, these are expensive and the
need therefor is eliminated by the present resistor.
By using different shapes, thicknesses, etc., of resistive film,
the present resistors of standard size may be made with a very wide
variety of resistance values. For example, the resistance values
may range from 10 ohms to 200 kilohms without changing resistor
size. Reference is made to copending patent application filed on
even date herewith, for further description of methods of obtaining
different resistance values.
It is important that the present resistors are characterized by
relatively little "drift" of (change in) resistance value, despite
extreme changes in environment such as relative to temperature. For
example, in the operating range of from 25.degree. C. to
275.degree. C., the drift in resistance value is less than one-half
of 1 percent for each 100.degree. C. temperature change.
The present resistor, being characterized by the circular or
washer-shaped configuration, with the mounting hole in the middle,
is relatively cheap to manufacture, thin, small in diameter, light
in weight, and extremely convenient to mount (either singly or in
stacks) in effective heat-transfer relationship to a chassis or
fin.
Because the terminal lugs or wires are disposed on only one side of
the resistor, it is very convenient to mount the resistor in
various types of electrical circuits. Furthermore, by locating the
terminal lugs on only one side of the resistor, the greatest
possible surface area of the ceramic wafer is utilized, and in an
efficient manner.
FURTHER DESCRIPTION OF TERMINAL CONSTRUCTIONS, BOTH LUGS AND
FLEXIBLE LEADS
Referring to FIGS. 6, 7, 9 and 10, the mechanical mounting of each
of terminal lugs 44 and 45 is made by inserting one of the rivets
or eyelets 46 and 47 through registered holes in the lug and in
ceramic wafer 40. Since each of the mechanical connections is
identical to the other, only one (that relative to terminal lug 44)
will be described in detail.
The rivet or eyelet 46 associated with lug 44 is extended through a
hole 63 in such lug, and also through a hole 64 in ceramic wafer
40. The underside of wafer 40 is provided with a "counterbore" 65
registered with hole 64, the size of the counterbore being
sufficiently large that the lower rivet end ("head") will be spaced
well above the lower surface of the wafer 40 as illustrated. The
upper end of rivet or eyelet 46 is rolled over the upper surface of
terminal lug 44, thus making good electrical contact between such
terminal lug and the underlying metal film 42, while also firmly
mechanically attaching the lug to the washer.
The hole or passage 66 in hollow rivet 46 is sufficiently large in
diameter, and the amount of recessing of the lower end of the rivet
relative to the plane of the bottom wall of wafer 40 is
sufficiently great, that the resin 58, during molding thereof, will
flow through the hole or bore 66 and will completely fill the
counterbore below the rivet. This is an important consideration,
because the portion of the resin below the rivet serves as an
insulator or dielectric to prevent electrical discharges from
occurring between rivet 46 and the base or body 50. Thus, for
example, a voltage of on the order of 300 volts may be applied to
the terminal lug 44 without resulting in any discharge or arcing to
base 50.
The inner end of each of the terminal lugs 44 and 45 is provided
with a rectangular opening 67, such opening being disposed
primarily over the ceramic wafer 40 at the peripheral portion
thereof. Each such opening performs two functions, namely: (1) a
stress-relief function whereby bending, shock and vibration applied
to the external portion of the terminal lug will be absorbed in the
vicinity of the opening 67 instead of being transmitted to the
rivet 46 or 47 or associated part, and (2) an anchoring function in
that the opening fills with the thermosetting resin 58 and
therefore tends to maintain the terminal lug in position despite
strong pulling forces exerted on the projecting end thereof.
The inner end of each lug 44 and 45 is also shaped generally as an
arrow point (except rounded at the extreme inner end), so that
laterally extending shoulders (or steps) 68 are provided. These
also provide an anchoring function tending to minimize the
possibility of pulling of either terminal lug out of the resistor.
The shoulders or steps 68 are, like the opening 67, spaced radially
inwardly from the peripheral surface 57 of the resin 58.
Proceeding next to a description of terminal conductors in the form
of flexible wire or lead terminals or connectors, as distinguished
from lugs, FIG. 8 illustrates a ceramic wafer 70 having a film 71
of resistive material provided thereon and which terminates in
metal-film terminals 72 and 73. Metal bobbins, eyelets or rivets 74
and 75 are provided in electrical contact with films 72 and 73,
respectively. Such bobbins 74 and 75 may be attached to wafer 70 in
the same manner as the rivets 46 and 47 are attached to wafer 40,
and as illustrated in FIG. 10 so that a layer of plastic or resin
is provided between the lower bobbin ends and the underlying
surface of metal base 50.
A wire lead 77 is wrapped around the upper end of each bobbin 74
and 75, and is suitably soldered or otherwise affixed to such
bobbin. Alternatively, the wire leads 77 may be attached directly
(as by brazing) to the metal film terminals 72 and 73.
A length of each of the wire leads 70 is maintained within the
resin 58 to thereby prevent the wire leads from being readily torn
from the terminals. More specifically, a length of lead 77 equal to
or greater than five diameters of the wire is embedded in the
compound or plastic (resin). Each lead 77 is insulated, as
described below relative to FIG. 18. The diameter of the "wire,"
referred to in the second sentence of this paragraph, is not that
of the conductor but instead the outer diameter of the insulating
sleeve on the conductor.
FIG. 18 illustrates the same resistor that is illustrated in FIGS.
9 and 10, except with flexible-lead terminations instead of
terminal lugs. Thus, the resistor of FIG. 18 is given the number
49a.
The resistor 49a incorporates two insulated leads 78 each formed of
thin strands of aluminum, silver, copper, etc. Each lead is covered
with a tubular "Teflon" insulating sleeve 79. The leads are
mounted, respectively, on opposite sides of the center post 51.
This is shown in FIG. 17, which relates to the molding of the
resistor 49a. Prior to such mounting, the exposed end of each lead
78 is connected (as by silver brazing) to the upper surface of a
terminal lug 80. Each terminal lug is connected to the ceramic
wafer or washer 40, in the manner described relative to FIG. 10, by
a rivet 81 the lower end of which is insulated from body 50 by a
portion of resin 58.
As shown in FIGS. 17 and 18, the leads are connected to the wafer
on one side of the resistor 49a (i.e., on one side of post 51) but
are then passed generally diametrically thereacross (on opposite
sides of post 51, as shown in FIG. 17) and emanate from the resin
58 on the opposite side of the resistor. Thus, the leads are
embedded in the resin or plastic for at least the five wire
diameters (outer diameters of sleeves 79) referred to above. The
lead portions which are disposed over the resistive film 41 do not
make contact therewith due to the presence of the insulating
sleeves 79.
DESCRIPTION OF FIGURES 11-14, INCLUSIVE
As previously stated, it is a major feature of the invention that
the various resistors described herein may be mounted in stacked
relationship relative to each other, with cooling fins or plates
disposed therebetween. Thus, the upper and lower surfaces of each
resistor (at least one such surface being thermally highly
conductive) are parallel to each other. Furthermore, the tubular
metal posts insure against crushing of the resin or plastic, and
aid in dissipation of the generated heat. Another reason why such
stacking is permitted is that the terminal conductors do not extend
out of the upper and/or lower surfaces but instead are disposed
between the same. Such terminal conductors are on the same side of
the resistor in order that electrical connections to the resistor
may be facilitated, and in order that the surface of the ceramic
washer may be utilized in the most efficient manner.
Each of the resistors shown in FIGS. 12 and 13 is designated by the
numeral 90 and is the same as shown in FIG. 4. Each such resistor
90 may also be identical to the ones shown in other figures which
show complete resistors (for example, FIGS. 9, 18, etc.).
In FIG. 13, eight of the power resistors 90 are shown as separated
by rectangular, thermally conductive plates 91 preferably formed of
aluminum. End plates, such as plate 92, may also be included in the
stack. The stack is held together by a bolt 93 and its cooperating
nuts 94 and 95, such bolt 93 passing through the central holes in
the resistors 90 and also through holes in plates 91 and 92. The
holes in the plates 91 and 92 have the same diameters as do the
holes in the resistors.
The stack may be mounted with the plates or fins in a vertical
position, or in a horizontal position, or in some intermediate
position. When the stack is mounted with the plates or fins in the
vertical position, a larger amount of heat is carried off by
convection currents.
A chart or graph showing various possible power ratings for
individual power resistors of the type shown in FIG. 4, for
example, and when stacked as shown in FIGS. 12 and 13, is shown in
FIG. 14. Such figure relates to data concerning stacks wherein each
plate 91 and 92 is 2 inches by 2 inches by 0.04 inch, and is formed
of aluminum. Each of the resistors 90 (of the type shown in FIG. 4,
for example) has a diameter of about six-tenths of an inch.
Line 100 of FIG. 14 representatively shows the power rating versus
airflow across the individual resistors and plates of the stack.
The measured power rating of the individual resistors with cooling
by convection only, and when the plates were positioned in a
horizontal plane, is shown by dot 101 on line 100. The increased
power rating when the plates were positioned in a vertical plane is
shown by dot 102 on line 100.
Air at 25.degree. C. and at 1.0 atmospheres was ducted around the
resistors in the stack to produce the curve 100 of FIG. 14. The
airflow was measured in cubic feet per minute (CFM) and provided
sufficient cooling to greatly increase the power rating of the
resistors in comparison to the rating with convection cooling
only.
The combination of the stacking and the ducted air, for cooling
purposes, not only increases the power rating of the resistors, but
also provides an effective way of localizing and removing the heat
generated by the resistors. As but one example, a stack of the
resistors may be located in a computer, and air may be ducted over
the stack and then vented to the room. This cools the resistors
without heating the air in the interior of the computer. Of course,
fluids (gases and liquids) other than air may be employed to cool
the resistors.
Referring next to FIG. 11, there is illustrated a power resistor
which is more expensive to manufacture than the others described in
this specification, but which is adapted for stacking as stated
above relative to FIGS. 12 and 13.
The resistor of FIG. 11 has a first metal base 110 of disc-shaped
construction similar to the base or body 21 of FIG. 4. The resistor
further includes an electrically insulating (ceramic) wafer or
washer 111 positioned on the base 110. The wafer 111 carries a film
112 of resistive material, and also carries termination means such
as terminal lugs or leads (not shown). On the side of the resistive
film 112 opposite the base 110 is located a second base 113
separated from the resistive film 112 by an electrically insulting
(ceramic) wafer 114. The base 110 has the previously described
center post 115, which projects through openings in washers 111 and
114, and through a corresponding opening in the second base
113.
The elements are held together by molded thermosetting plastic
(synthetic resin) 116 which locks in undercut edges in the bases
110 and 113, similarly to the locking provided in the resistor of
FIG. 4 and including serrations 28a. The resistive film 112 is thus
sandwiched between two bases having smooth mounting surfaces for
attaching to cooling fins.
METHOD OF THE INVENTION
Referring next to FIG. 15, there is schematically represented the
transfer molding apparatus adapted to be employed in molding the
thermosetting synthetic resin (plastic) such as 8, 29, 31, 58 and
116.
The mold apparatus illustrated in FIG. 15 comprises an upper mold
member 117 having a lower planar surface, and a lower mold member
118 having an upper planar surface. The two planar surfaces are
adapted to meet each other in flatwise engagement (except at the
cavities, gates, etc.) at the "parting line" 119.
Upper mold 117 has formed in the lower surface thereof an upper
mold cavity 120 which is generally cylindrical in shape, and which
corresponds to the portion of each resistor 1, 20, 30, 49, etc.,
generally above the ceramic wafer or washer 4, 24, 40, etc. The
"bottom" wall of upper mold cavity 120, namely the mold surface 121
shown in FIG. 15, is planar.
Formed in the upper portion of lower mold member 118 is a lower
mold cavity 122 the shape of which corresponds generally to the
shape of each resistor at a region generally below the wafer or
washer 4, 24, 40, etc. The upper and lower mold members 117 and 118
are adapted to be locked to each other by suitable means, not
shown, and with the upper and lower mold cavities 120 and 122
registered with each other. Suitable means, such as electric
heating elements, not shown, are provided to maintain the mold in
heated condition.
A platen 123, which is also heated by a suitable means, not shown,
is provided above and in contact with the upper surface of upper
mold member 117. The platen has a cylindrical "transfer pot" 124
therein and which communicates with a downwardly convergent sprue
125 in member 117. The lower end of the sprue, in turn,
communicates with a laterally extending gate or runner 126 and thus
with the mold cavity. More specifically, the gate or runner 126 is
formed in the upper wall of lower mold member 118, so that resin
passing therethrough will enter the lower mold cavity 122 and will
then flow to the upper mold cavity. Sprue 125 may also be located
in lower mold 118, in which case the platen and transfer pot are
provided beneath the mold instead of thereabove.
Alternatively, a gate or runner (not shown) may be provided in the
lower wall of upper mold member 117, preferably at a region
adjacent the parting line 119.
Suitable means, including an actuator schematically represented at
127 and a piston schematically represented at 128, are employed to
force thermosetting resin downwardly from transfer pot 124 through
sprue 125 and gate or runner 126 into the mold cavity. The piston
128 fits in the transfer pot and thus is adapted, upon downward
movement of the piston, to force the heated thermosetting resin
into the mold cavity under pressure.
The thermosetting synthetic resin employed in practicing the
present method is preferably a thermosetting silicone molding
compound containing a filler of very short glass fibers and silica.
Such a thermosetting silicone compound is molded at about
250.degree. C. After molding, the molded parts are placed in an
oven and postcured first at 150.degree. C. and then at 300.degree.
C.
As shown in FIGS. 15-17, inclusive, the upper surface of the lower
mold member 118 (or of the corresponding lower mold member 118a,
FIG. 17, employed for molding of embodiments, such as that of FIG.
18, wherein flexible leads are molded into the resistor) is
recessed to receive the terminal lugs (or leads). Thus, FIG. 16
shows recesses 144 and 145 in the upper surface of the lower mold.
These are shaped to snugly receive lugs 44 and 45, which are flat
or striplike. FIG. 17 illustrates grooves or recesses 179 in the
upper surface of the corresponding lower mold member 118a, and
adapted to receive in snug relationship the insulating sleeves 79
on the leads 78 of the embodiment of FIG. 18.
It is important to the present method that the spacing between the
upper cavity wall 121 and the opposed bottom wall 129 of lower mold
cavity 122 is, when the mold is fully closed, substantially equal
to the spacing between the upper end of the metal post and the
lower surface of the body or base (that is to say, for example, the
spacing between the radial end 54 and the bottom wall of base 50,
FIG. 9). Preferably, the spacing between the upper end of the post
(such as post 51 in FIG. 9) and the bottom wall of the base (such
as base 50, FIG. 9) should be one- or two-thousandths of an inch
greater than the distance between mold walls 121 and 129 when the
mold is fully closed. Thus, when the base, post and associated
parts are mounted in the mold cavity as shown in FIG. 15, the mold
will not close completely but there will instead be a very slight
gap (such as one or two thousandths of an inch) at the parting line
119. Such gap is shown, in exaggerated manner, in FIG. 15. With
such a relationship, or even when there is a very slight gap, such
as one or two-thousandths of an inch, between the upper end 54
(FIG. 9) of post 51 and the opposed upper mold wall 121, the
molding compound will not flow downwardly into the bore or hole in
the post.
The relationship described in the previous paragraph makes it
unnecessary to employ plugs in association with the mold, which
plugs would otherwise be inserted into the bore or passage through
the post in order to prevent ingress of resin. Since no plugs need
be employed in the mold, there are no problems relative to
concentricity, tolerance, etc., which makes it possible to employ
extremely inexpensive screw-machined parts for the base (such as
50) and the post (such as 51) integral therewith.
The fit of the base 50 in lower mold cavity 122 is sufficiently
close or snug that no substantial amounts of resin will flow
downwardly past cylindrical wall 55 (FIGS. 9 and 10). However, the
sizes of rivet passage 66 and of counterbore 65 (and the spacing
between the lower rivet end and the upper surface of base 50) are
sufficiently great (much more than a few thousandths of an inch)
that resin will fill the rivet and the counterbore.
The method of the invention will next be summarized relative to the
particular resistor 49 shown in FIGS. 9 and 10, and containing the
resistive element shown in FIG. 6 (or containing certain other
resistive elements such as those described in application filed on
even date herewith).
A disc-shaped base 50, and the integrally associated hollow post
51, are formed on a screw machine of aluminum stock and then
anodized. The ceramic wafer or washer 40 is formed in a press, and
providing the hole 64 and counterbore 65 (FIG. 10). The washer is
then fired. Thereafter, it is silk screened or otherwise provided
with termination films 42 and 43 of metal. The washer 40 is then
fired again to cause the metal films to adhere firmly thereto. The
resistive film 41 is then applied by silk screening or other means.
Thereafter, the washer 40 is again fired and then abraded to
achieve the desired resistance value, as described in the copending
application filed on even date herewith.
The terminal lugs 44 and 45 are riveted to the wafer by rivets 46
and 47. Alternatively, and as shown in FIGS. 17 and 18, the
terminations are made by rivets which secure to wafer 40 the lugs
80 connected to "Teflon" protected leads 78. The lower surface of
each wafer 40 may then be adhesively secured to the upper surface
of base 50 as indicated above.
The insert thus formed is then mounted in the mold cavity as shown
in FIG. 15, with the terminal lugs 44 and 45 in the corresponding
recesses 144 and 145 (FIG. 16) in lower mold member 118.
Alternatively, such recesses could be formed in the upper mold
member 117. When the terminal conductors are flexible leads 78, 79,
they fit in grooves 179 in mold portion 118a (FIG. 17).
It is a feature of the invention that, as shown in FIG. 15, the
gating (gate 126, for example) is substantially in the plane of the
parting line 119, which parting line is parallel to and adjacent
the ceramic wafer 40 and the resistive film 41 thereon. The gating
may also be in a plane somewhat above the ceramic wafer 40 and
associated resistive element. However, the gating should not be
substantially below the wafer 40 since the hydraulic forces
incident to molding would then tend to effect disassembly of the
washer 40 from the underlying base. Such disassembly could only
occur between the wafer 40 and the base, it being emphasized that
all portions of the base 50 and post 51 are locked in the mold by
the relationship (described above) between surfaces 121 and 129.
Thus, the post 51 performs the additional function of effectively
locking the base in position.
Because of the indicated gating, the step of providing an adhesive
between wafer 40 and the body or base 50 may be omitted.
It is also an important feature that the terminal lugs or the
corresponding flexible leads emanate from the mold cavity in
substantially the plane of parting line 119, and in generally the
plane of wafer 40. Thus, the terminal lugs or leads are on the side
of the part, not the top or bottom, so that the parts may be
stacked. In addition, the described relationship greatly
facilitates the molding operation.
After the assembled parts have been placed in the mold as shown,
the above-described transfer molding operation is effected to
completely fill the voids in the mold cavity 120, 122 with the
thermosetting synthetic resin. The mold is maintained closed until
the resin sets, following which the above-indicated post-curing
operation is performed. After the mold opens, it is a simple matter
to clean out the material in runner 126 and prepare the mold for a
new operation.
It is emphasized that the material entering the mold may readily
flow around the annular groove formed between the cylindrical wall
of lower mold cavity 122 and the indented wall 56 (FIGS. 9 and 10)
of the base and immediately beneath wafer 40. The molding material
may not, however, flow adjacent the bottom portion of base 50.
The described operation provides a finished resistor characterized
by an extreme degree of environmental protection, by firm locking
of the thermosetting resin to the inserts, and by the other major
features described above. The upper surface of the resin is flush
with the upper end of post 51, as is particularly desirable for
stacking, heat-transfer, and other purposes.
As indicated above, the terminal lugs 13, 14, 44, 45, are flat
bands or strips of metal. Such lugs are relatively thin, and have
parallel planar upper and lower surfaces. They also have parallel
edges except at the "arrow points" forming shoulders 68, FIG.
9.
The "Teflon" insulating sleeves 79 for the leads 78, FIGS. 17 and
18, are heat-resisting and therefore are not damaged by the
above-described transfer molding operation.
The generally annular "C-shaped" resistive films 2, 41, etc., have
concentric inner and outer circular edges (interrupted at the
termination regions). Such edges are, respectively, near the inner
and outer marginal edges of the washer 4, 40, etc.
The use of the term "wafer," as employed in the present
specification and/or claims, is not intended to denote or imply
that the insulating substrate for the resistive and metal films is
circular or round.
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