U.S. patent number 3,636,235 [Application Number 05/045,335] was granted by the patent office on 1972-01-18 for header having high-density conductor arrangement and method of making same.
This patent grant is currently assigned to Sealtronics, Inc.. Invention is credited to Neal T. Williams.
United States Patent |
3,636,235 |
Williams |
January 18, 1972 |
HEADER HAVING HIGH-DENSITY CONDUCTOR ARRANGEMENT AND METHOD OF
MAKING SAME
Abstract
A header having a high-density density conductor arrangement
having a plurality of equally spaced-apart conductors held in place
by a sealing, electrical insulating material. A method of forming
such a header with a high-density conductor arrangement by
chemically milling or stamping the conductors from a single sheet
of material, leaving them joined by strips at both ends. The
conductors are formed in the shape desired and fused to a base,
after which the upper strip is ground off and the conductors are
plated. The conductors are now ready for use in the final
manufacture of electronic assemblies such as transistors,
integrated circuits, etc.
Inventors: |
Williams; Neal T. (Bloomfield,
NJ) |
Assignee: |
Sealtronics, Inc. (Clifton,
NJ)
|
Family
ID: |
21937287 |
Appl.
No.: |
05/045,335 |
Filed: |
June 11, 1970 |
Current U.S.
Class: |
174/50.56;
174/541; 174/564; 65/59.3; 174/50.64; 428/596; 428/925; 438/121;
29/876; 174/50.61; 428/579; 428/684; 257/E23.184 |
Current CPC
Class: |
H01L
23/045 (20130101); H01L 23/488 (20130101); Y10T
29/49208 (20150115); Y10T 428/12361 (20150115); Y10T
428/12243 (20150115); H01L 2924/0002 (20130101); Y10S
428/925 (20130101); H01L 2924/0002 (20130101); Y10T
428/12972 (20150115); H01L 2924/01079 (20130101); H01L
2924/09701 (20130101); H01L 2924/00 (20130101) |
Current International
Class: |
H01L
23/48 (20060101); H01L 23/02 (20060101); H01L
23/488 (20060101); H01L 23/045 (20060101); H01j
005/40 (); H05k 005/06 () |
Field of
Search: |
;174/50.56-50.58,152.4,50.6,50.61,50.63,52S,DIG.3,50.52,50.54,50.64
;29/630,588-590,472.9,624 ;65/59 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Clay; Darrell L.
Claims
The embodiments of the invention in which an exclusive property or
privilege is claimed are defined as follows:
1. A header having high-density conductor arrangements for
electronic assemblies comprising:
a metal base whose outer perimeter is shaped in the desired shape
of the header;
a metal ring having an internal perimeter larger than that of the
outer perimeter of the metal base and disposed outside the metal
base;
a sheet of spaced-apart conductors disposed between the metal base
and the metal ring and substantially surrounding the metal
base;
the sheet of spaced-apart conductors having a first end and a
second end;
sealing means sealing the first end of the sheet of spaced-apart
conductors between the metal base and the metal ring and insulating
the sheet of spaced-apart conductors therefrom;
the individual ends of the conductors at the said first end
projecting beyond the sealing means for sufficient distance to
permit connections to be made thereto;
the conductors at the said second end of the sheet of spaced-apart
conductors being joined together by a single strip of the material
thereof.
2. The invention of claim 1 including:
a plurality of sheets of spaced-apart conductors, each such sheet
of spaced-apart conductors being of such size so as to conform to
the perimeter of the metal base;
no two such sheets of spaced-apart conductors being of the same
size;
the sheets of spaced-apart conductors being disposed one inside the
other;
the sealing means sealing the plurality of sheets between the metal
base and the metal ring with the conductors of one sheet of
spaced-apart conductors being spaced from the conductors of every
other sheet of spaced-apart conductors.
3. The invention of claim 1 including an insulating ring in contact
with the individual conductors adjacent the said second end of the
sheet of spaced-apart conductors.
4. The invention of claim 3 wherein the insulating ring is internal
of the conductors.
5. The invention of claim 3 wherein the insulating ring is external
of the conductors.
6. The method of making a header having high-density conductor
arrangements for electronic assemblies comprising:
making a conductive sheet having a plurality of spaced-apart
individual conductors joined at both ends by strips of the
conductive sheet;
placing the conductive sheet around a metal base so that the said
sheet substantially surrounds the metal base and so that the metal
base is between the two said strips and close to one of them;
placing a metal ring opposite the metal base and surrounding the
conductive sheet so that the conductive sheet is between the metal
base and the metal ring;
sealing the conductive sheet between the metal base and the metal
ring to hold the conductive sheet in position such that the strip
close to the metal base is out of contact with the seal so formed
and the conductive sheet is insulated from the metal base and the
metal ring;
grinding off the said strip close to the metal base;
plating the conductive sheet.
7. The invention of claim 6 including:
removing the strip at the other end of the conductive sheet after
plating.
8. The invention of claim 7 including before removing the strip at
the other end of the conductive sheet:
placing insulating means in contact with the plurality of
conductors at the said other end to form a plug.
9. The invention of claim 6 including prior to sealing;
making a second conductive sheet having a plurality of spaced apart
individual conductors joined at both ends by strips of the
conductive sheet;
placing the second conductive sheet around the metal ring so that
the said second sheet substantially surrounds the metal ring and so
that the metal ring is between the two said strips and close to one
of them;
placing a second metal ring opposite the metal ring and surrounding
the second conductive sheet so that the said second sheet is
between the two metal rings;
sealing the combination so that the said conductive sheet is sealed
between the metal base and the metal ring to be held in position
such that the strip close to the metal base is out of contact with
the seal and the conductive sheet is insulated from the metal base
and the metal ring and so that the second conductive sheet is
sealed between the metal ring and the second metal ring to be held
in position such that the strip close to the metal ring is out of
contact with the seal and the second conductive sheet is insulated
from the metal ring and the second metal ring;
grinding off the strip of the second conductive sheet close to the
metal ring;
plating the second conductive sheet.
10. The invention of claim 9 including:
removing the strip at the other end of the second conductive sheet
after plating.
Description
The invention relates to headers having high-density conductor
arrangements for use in providing connecting leads for electronic
assemblies such as transistors, integrated circuits,
microelectronic circuits and the like. In particular, the invention
is directed toward providing more precise assembly and higher
conductor packing densities than have been attainable
heretofore.
In the prior art, the individual conductors were individually
sealed in the outer metal ring. This requires large finished sizes
because the individual conductors must be held in position during
sealing by tooling which is subject to high temperatures, wear and
initial machining deviations. In some prior art assemblies, the
conductors are joined at one end by a connecting band. Even these
assemblies are subjected to positioning inaccuracies due to the
bending of the unsupported ends of the conductors.
Moreover, hermetic defects are generated by material handling in
the assembly procedures and such handling increases in proportion
with the increase in the number of conductors. This increased
handling reduces the yield.
To obtain uniform plating of the conductors it is necessary to join
them at one end. Except for the prior art assemblies, which are
joined by a band at one end, it is necessary to electrically
connect the individual conductors by special wiring or racks prior
to and during the plating operation.
Operator inaccuracy or machine errors result in defects which
proliferate as the number of conductors is increased. Bent
conductor ends, missing conductors and uneven spacing either reduce
the productive yield or make it difficult for the end user to use
the finished product.
It is an important object of the invention to provide a header
having a high-density conductor arrangement by creating precise
spacing of the individual conductors thus making high-conductor
packing densities possible.
It is a further object of the invention to provide a method for
making such an arrangement.
These and other objects, features, uses and advantages will be
apparent during the course of the following description when taken
in conjunction with the accompanying drawings.
Broadly, the invention comprises chemically milling or stamping a
plurality of equally spaced conductors from a single sheet, leaving
both ends of the conductors joined by conductive strips. The
desired number of conductors are severed from the sheet and they
are formed into the desired configuration. One end of the
conductors is placed in a sealing jig with the strip elevated from
the seal area so that the strip remains free when the combination
is hermetically sealed. This effectively positions the conductors
in the proper relationship. The end strip nearest the hermetic
sealing is ground off and the conductor ends are ground to the
desired height above the seal.
The combination is then plated in a plating solution (such as gold
for semiconductor use). The plating procedure is uniform because
the conductors are all connected by the remaining strip or band
which also helps to protect the conductors from damage. Now, the
electronic components are installed and connected to the individual
pins. When assembly is completed, the lower band is removed so that
the individual conductors are available for connection in the
external electronic system.
It is also within the contemplation of the invention to surround
the conductors with an internal or external insulating ring or a
combination of both to form a plug to thereby permit the unit to be
readily inserted into and removed from a mating receptacle.
Moreover, a plurality of conductive sheets may be used and various
shapes and configurations of the finished units may be produced
utilizing the teaching of the invention.
In the accompanying drawings, forming a part of this application,
and in which like numerals are employed to designate like parts
throughout the same:
FIG. 1 is a plan view of an embodiment of the invention;
FIG. 2 is a sectional view, taken on lines 2--2 of FIG. 1, viewed
in the direction of the arrows;
FIG. 3 is an elevational view of a typical, chemically milled or
stamped sheet used in carrying out the teachings of the
invention:
FIG. 4, on the same sheet as FIGS. 1 and 2, is an exploded view
showing the parts used in making the embodiment of FIGS. 1 and
2;
FIG. 5 is an elevational view of an alternative mounting base which
may be used with the embodiment of FIGS. 1 and 2;
FIG. 6 is a view similar to that of FIG. 1 of a further embodiment
of the invention;
FIG. 7 is a sectional view, taken on the lines 7--7 of FIG. 6,
viewed in the direction of the arrows;
FIG. 8 is a view similar to that of FIG. 4 of the embodiment of
FIGS. 6 and 7;
FIG. 9 is a view similar to that of FIG. 1 of a two-row embodiment
of the invention;
FIG. 10 is a view similar to that of FIG. 6 of a two-row embodiment
of the invention;
FIG. 11 is a view similar to that of FIG. 2, but inverted, showing
the use of an insulating ring inside the conductors to form a
plug-in-type unit;
FIG. 12 is a view similar to that of FIG. 11, showing the use of an
insulating ring outside the conductors to form a plug-in-type unit;
and
FIG. 13 is a view similar to that of FIG. 11, showing the use of
two insulating rings, one inside and one outside the conductors, to
form a plug-in-type unit.
In the drawings, wherein, for the purpose of illustration, are
shown various embodiments of the invention, the numeral 20
designates an embodiment of conductor arrangement of the invention
for use as an electronic component header. Header 20 is seen to
comprise (FIGS. 1 and 2) an outer metallic ring 22 and a plurality
of conductive pins 24 joined at one extremity by strip or band 26
and sealed within the ring 22 by hermetic seal 28 of glass or other
sealing material with the conductor ends 25 projecting above the
seal.
Header 20 is formed by chemically milling or stamping a sheet of
conductive material 30 so as to form a plurality of individual
conductors 24 joined at both ends by strips 26 and 32 (FIG. 3). The
required number of conductors are cut from the sheet and are formed
into the desired configuration (FIG. 4). Assembly proceeds by
placing the upper end of the conductive sheet 31 between glass
rings 34 and 36 so that strip 32 and a portion of the individual
conductors project above the rings. Metallic base 38 and ring 22
are fitted inside ring 34 and outside ring 36, respectively. Now,
the heat required to cause the glass to flow and seal the
conductors in place is applied.
For the so-called "matched seal" technology, the conductors, the
metallic base and the ring are typically iron-nickel-cobalt alloys
such as Kovar and the sealing material is Corning 7052 glass. For
the so-called "compression seal" technique, the conductors, and the
metallic base are formed of nickel iron alloy such as No. 52 alloy,
the outer ring is typically formed of cold rolled steel and the
sealing material is Corning 9010 glass. It should be noted,
however, that any other sealing material, which is capable of flow,
may also be used. This would include plastic, epoxy molding,
Mycalex and similar material.
After the combination is assembled, and the conductors are sealed
in place, the upper strip 32 is ground off, leaving the ends 25
projecting above the seal. In the same operation, the ends 25 may
be ground to uniform height. Next, the assembly is placed in the
plating bath and the conductors are plated. Because one of the
plating connections is made to strip 26, the plating on the
conductors is very uniform. The combination is now ready for
internal wiring. The desired electrical circuits are wired to the
conductor ends 25 and the strip 26 is removed by cutting the
conductors 24 above the upper edge of the strip. This effectively
frees and separates the conductors 24, making the finished assembly
ready for use.
If desired, base 40 with stud 42 (FIG. 5) may be substituted for
base 38. It is noted that whichever base is used, only five parts
must be handled in the production of the header 20 of the
invention.
FIGS. 6-8 illustrate a further embodiment of a square header 44 in
which only eight parts are handled. Header 44 is formed of four
sheets 31 of conductors 24 having upper strips 32 and lower strips
26, base 46, sealing rings 48 and 50 and outer ring 52. The
combination is assembled as described earlier and the strips 31 are
sealed as shown at 54. Then the upper strips 32 are removed and the
ends 25 are ground to the correct height. The leads may now be
plated as described earlier. Following which, the electronic
components are connected to the lead ends 25 and the lower strip 26
is removed.
The embodiment of FIG. 9 is assembled in the same manner as that of
FIG. 1. It comprises an outer ring 56, two concentric sets of
conductors 24 and a base 58. Assembly and construction follows the
same procedure as was described earlier. It should be noted that
three, mating, sealing rings are used in order to seal the
conductors in place.
The embodiment of FIG. 10 is assembled in the same manner as that
of FIG. 6. It comprises an outer ring 60, an inner base 62 and
eight sets of conductors 24. Assembly and construction follows the
same procedure as was described earlier. It should be noted again
that three, mating, sealing rings are used in order to seal the
conductors in place.
It can readily be seen that any number of concentric rings of
conductors may be used to increase the number of conductors while
occupying relatively little space.
The embodiments of FIGS. 11-13 utilize the teaching of the
invention to produce a plug-type header for ready insertion into
and removal from a mating plug. After the pins of any of the
previously described embodiments have been plated, an insulator 64
is formed inside the pins and in contact with them. Then strip 26
is removed. Insulator 64 may be a plastic, epoxy or other material
which is applied in liquid form in a jig or it may be a solid ring
made of glass, ceramic, plastic, Mycalex or similar material which
is bonded into place with epoxy or similar material. FIG. 11 is
shown inverted from FIG. 2 since, when solid rings are used, it is
easier to put them in place with the bottom of the assembly up.
When the unit is finished and the internal wiring is completed, it
may be plugged into a receptacle having individual contacts which
connect to the outside of the individual pins 24 of the header
20.
Ring 66 of FIG. 12 is formed of material similar to that of ring 64
of FIG. 11. The completed header may make contact by means of the
tips of pins 24 in the usual plug-in receptacle. Alternatively, a
receptacle may be used which fits inside the header pins and whose
individual contacts make contact with the inside of the individual
pins 24 of the header 20.
Rings 68 and 70 of FIG. 13 are formed of material similar to that
forming rings 64 and 66. Ring 68 is inside the pins and ring 70 is
outside the pins and contact is normally made to the protruding
tips of pins 24. However, special sockets may be used which will
permit contact to be made to the inside and/or the outside of the
pins.
It is also within the contemplation of the invention to substitute
a disc for either ring 64 or ring 68.
While particular embodiments of the invention have been shown and
described, it is apparent to those skilled in the art that
modifications are possible without departing from the spirit of the
invention or the scope of the subjoined claims.
* * * * *