U.S. patent number 3,615,931 [Application Number 04/787,470] was granted by the patent office on 1971-10-26 for technique for growth of epitaxial compound semiconductor films.
This patent grant is currently assigned to Bell Telephone Laboratories, Incorporated. Invention is credited to John R. Arthur, Jr..
United States Patent |
3,615,931 |
Arthur, Jr. |
October 26, 1971 |
**Please see images for:
( Certificate of Correction ) ** |
TECHNIQUE FOR GROWTH OF EPITAXIAL COMPOUND SEMICONDUCTOR FILMS
Abstract
Epitaxial growth of Group III(a)-V(a) semiconductor compound
films is effected in an ultrahigh vacuum by directing collimated
molecular beams at the surface of a suitable substrate member
preheated to a temperature ranging from 450.degree.-650.degree. C.
The described process is a nonequilibrium growth technique which
permits the growth of epitaxial films less than 1 micron in
thickness at temperatures appreciably below those commonly employed
in epitaxy.
Inventors: |
Arthur, Jr.; John R. (Murray
Hill, NJ) |
Assignee: |
Bell Telephone Laboratories,
Incorporated (Murray Hill, NJ)
|
Family
ID: |
25141584 |
Appl.
No.: |
04/787,470 |
Filed: |
December 27, 1968 |
Current U.S.
Class: |
117/108;
148/DIG.49; 148/DIG.72; 148/DIG.158; 204/192.25; 423/299;
257/E21.097; 117/105; 117/106; 117/107; 117/953; 117/955; 117/954;
148/DIG.17; 148/DIG.65; 148/DIG.84; 148/DIG.150; 148/DIG.169;
252/62.3GA |
Current CPC
Class: |
C30B
23/02 (20130101); H01L 21/02395 (20130101); H01L
21/02543 (20130101); H01L 21/02631 (20130101); H01L
21/02546 (20130101); C30B 29/40 (20130101); Y10S
148/15 (20130101); Y10S 148/072 (20130101); Y10S
148/084 (20130101); Y10S 148/049 (20130101); Y10S
148/158 (20130101); Y10S 148/017 (20130101); Y10S
148/065 (20130101); Y10S 148/169 (20130101) |
Current International
Class: |
C30B
23/02 (20060101); H01L 21/02 (20060101); H01L
21/203 (20060101); H01l 007/36 (); C01b 031/36 ();
C23c 011/00 () |
Field of
Search: |
;148/1.5,1.6,174,175
;117/106,107.2,93.3,212,213 ;204/192 ;252/62.3 ;23/204 |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
howson; R. P., Journal of Physics (Paris) 25 pp. 212-217 (1964).
.
Davey; J. E., and Pankey; T., Journal of Applied Physics 35, No. 7,
pp. 2,203-09, July, 1964. .
Davey; J. E., and Pankey; T., Applied Physics Letters 12, No. 2,
pp. 38-39, Jan. 1968. .
Davey; J. E., and Pankey; T., Journal of Applied Physics 39 No. 4,
pp. 1,941-48, Mar. 1968..
|
Primary Examiner: Rutledge; L. Dewayne
Assistant Examiner: Saba; W. G.
Claims
What is claimed is:
1. A method for the growth of an epitaxial film of a Group
III(a)-V(a) compound of the Periodic Table of the Elements upon a
substrate surface at subatmospheric pressure, which comprises
focusing collimated molecular beams at least one of which comprises
a III(a)-V(a) compound of the desired epitaxial film upon a
substrate surface, preheated to a temperature within the range of
450.degree.-650.degree. C., for a time period sufficient to effect
growth of a film of the desired thickness.
2. A method in accordance with claim 1 wherein said substrate
possesses an atomically clean surface.
3. A method in accordance with claim 1 wherein said pressure is
less than 5.times.10.sup..sup.-8 torr.
4. A method in accordance with claim 1 wherein said molecular beam
is formed by heating at least one gun member containing the
constituent components of the desired epitaxial film to a
temperature sufficient to vaporize said components and permitting
the resultant vapor to impinge upon a collimating frame.
5. A method in accordance with claim 4 wherein said gun member
contains gallium arsenide.
6. A method in accordance with claim 4 wherein a pair of gun
members are employed and in which one contains gallium arsenide and
the other contains gallium.
7. A method in accordance with claim 4 wherein said gun member
contains gallium phosphide.
8. A method in accordance with claim 6 wherein one gun contains
gallium phosphide and the other contains gallium arsenide.
9. A method in accordance with claim 8 wherein the
phosphorus-to-arsenic ratio in the vapor is four times the
phosphorus-to-arsenic ratio in the bulk material.
10. A method in accordance with claim 4 wherein three guns are
employed and in which one gun contains a dopant.
11. A method in accordance with claim 10 wherein said dopant is an
N-type material.
Description
This invention relates to a technique for the growth of epitaxial
compound semiconductor films. More particularly, the present
invention relates to a technique for the growth of epitaxial
semiconductor films of Group III(a)-V(a) compounds of the Periodic
Table of the Elements by a novel physical vapor growth
procedure.
The dynamic growth of the semiconductor industry and the
sophistication of device technology over the past decade have
created stringent demands upon materials from the standpoint of
reliability and physical and electrical characteristics. In order
to meet certain of these demands, workers in the art have focused
their attention with increasing frequency upon epitaxial growth
techniques.
Heretofore, epitaxial films suitable in such applications have been
grown by several techniques, the most popular being solution
epitaxy, chemical vapor growth and physical vapor growth. Although
such techniques have generally been satisfactory from a device
standpoint, the need for a procedure permitting greater flexibility
with respect to doping profiles combined with film thicknesses of
the order of one micron or less has not been met. Additionally, a
need has long existed for a nonequilibrium epitaxial growth
procedure which would permit growth at temperatures appreciably
below those conventionally employed.
In accordance with the present invention, these needs have been
realized by means of a novel physical vapor growth procedure
wherein epitaxial growth is effected in an ultrahigh vacuum at
temperatures ranging from 450.degree.- 650.degree. C. (which
permits impurity profiles to be altered abruptly due to limited
diffusion) the constituent components of the grown films being
furnished to the substrate by collimated molecular beams.
The described technique is premised upon the discovery that Group
III(a)-V(a) elements contained in compound semiconductors are
adsorbed upon the surface of single crystal semiconductors at
varying rates, the V(a) elements typically being almost entirely
reflected therefrom in the absence of III(a) elements. However, it
has been determined that growth of stoichiometric III(a)-V(a)
semiconductor compounds, including mixed crystals, thereof, may be
effected by providing vapors of Group III(a) and V(a) elements at
the substrate surface, an excess of Group V(a) element being
present with respect to the III(a) element, thereby assuring that
the entirety of the III(a) element will be consumed while the
nonreacted V(a) excess is reflected.
Briefly, the inventive technique involves forming an atomically
clean substrate surface in a vacuum chamber, evacuating the chamber
and directing at least one collimated molecular beam containing the
constituent components of the desired crystalline material at the
substrate for a time period sufficient to grow an epitaxial film of
the required thickness. The collimated molecular beams employed
herein furnish not only the constituent components of the film but
also the desired impurities, so permitting the altering of the
composition at will and the production of abrupt changes in
composition or impurity levels, such end being of particular
interest in certain device applications in which either an abrupt
PN junction is required or a ternary composition.
The invention will be more readily understood by reference to the
following detailed description taken in conjunction with the
accompanying drawing wherein:
FIG. 1 is a front elevational view, partly in section, of a typical
apparatus employed in the practice of the present invention;
and
FIG. 2 is a cross-sectional view of a cylindrical gun employed in
the apparatus of FIG. 1.
With reference now more particularly to FIG. 1, there is shown a
vacuum chamber 11 having disposed therein a gun port 12 containing
cylindrical guns 13 and 14, a sputtering port 15 containing a
sputtering gun 16 and a substrate holder 17 connected to a ceramic
insulator 18 by means of shaft 19. Ceramic insulator 18 is
connected by means of shaft 20 to a rotor 21 capable of effecting
rotary motion of shafts 19 and 20. Also shown disposed within
chamber 11 is a liquid nitrogen cooling shroud 22 and a collimating
frame 23 having a collimating aperture 24. Substrate holder 17 is
provided with an internal heater 25 and clips 26 and 27 for
affixing a substrate member 28 thereto. Chamber 11 also includes an
inlet 29 for the introduction of a sputtering gas from source 30
controlled by valve 31 and an outlet 32 for evacuating the chamber
by means of a pump 33.
FIG. 2 is a cross-sectional view of a typical cylindrical gun, such
as 14, shown in FIG. 1. Gun 14 typically comprises a refractory
crucible 41 having a thermocouple well 42 and a thermocouple 43
inserted therein for the purpose of determining the temperature of
the material contained therein.
For purposes of exposition, the present invention will be described
in detail by reference to an illustrative example wherein the
various operating parameters are given.
The first step in the inventive technique involves selecting a
substrate member (relatively dislocation free), obtained from
commercial sources. Suitable substrate members may be selected from
among single crystal elemental and compound semiconductors as well
as certain insulators manifesting lattice constants closely related
to those of the desired epitaxial film. Prime examples of substrate
materials meeting these requirements are silicon, germanium,
gallium arsenide, gallium phosphide, gallium arsenic phosphide,
indium arsenide, indium phosphide, sapphire and the like.
The substrate member selected is initially polished by any
conventional polishing technique for the purpose of removing
impurities from the surface thereof. An etchant such as a
bromine-methanol or hydrogen peroxide-sulfuric acid solution may
optionally be employed for the purpose of further purifying the
substrate surface subsequent to polishing.
Next, the cleaned substrate is placed in an apparatus of the type
shown in FIG. 1 and the system baked for a time period ranging from
5 to 10 hours at a pressure within the range of 10.sup..sup.-5 to
10.sup..sup.-8 torr for the purpose of removing water vapor from
the system. Thereafter, a suitable inert sputtering gas such as
argon is admitted to the vacuum chamber and sputtering initiated
with the substrate member facing the sputtering gun. Sputtering is
continued for a time period ranging from 1 to 3 hours employing a
sputtering voltage ranging from 100 to 250 volts with a current
density within the range of 100 to 500 microamps for the purpose of
removing several monolayers of material from the substrate so as to
form an atomically clean surface thereon. Then, the substrate
member is rotated so as to face the gun port of the apparatus,
inert gas pumped out of the system and the background pressure then
lowered to at least 5.times.10.sup..sup.-8 torr and preferably to a
value of the order of 1.times.10.sup..sup.-9 torr, thereby
precluding the introduction of any deleterious components onto the
substrate surface. The next step in the process involves
introducing liquid nitrogen to the cooling shroud and heating the
substrate member to the growth temperature which ranges from
450.degree.--650.degree. C. dependent upon the specific material to
be grown, such range being dictated by considerations relating to
surface diffusion.
Following, the gun or guns employed in the system, which have
previously been filled with the requisite amounts of the
constituent of the desired films to be grown, are heated to a
temperature sufficient to vaporize the contents thereof to yield a
molecular beam, that is, a stream of atoms manifesting velocity
components in the same direction, in this case toward the substrate
surface. The atoms of molecules reflected from the surface strike
the cooled shroud and are condensed, thereby insuring that only
atoms or molecules from the molecular beam impinge upon the
surface.
As indicated, the present invention relates to the growth of Group
III(a)-V(a) semiconductor compounds and mixed crystals thereof.
Accordingly, the materials furnished to the gun or guns are either
Group III(a)-V(a) compounds or Group III(a) elements. Additionally,
a desired dopant may be added either to an independent gun or
included with the III(a)-V(a) compound. For the purposes of the
present invention, the amount of source materials furnished to the
guns must be sufficient to provide an excess of the V(a) element
with respect to the III(a) element. Similar considerations obtain
with respect to the ternary compounds, such as GaAs.sub.x
P.sub.1.sub.-x. However, it has been found that in regard to this
material the phosphorous-to-arsenic ratio in the vapor must be
about four times the desired phosphorous-to-arsenic ratio in the
bulk.
Thereafter, growth of the desired epitaxial film is effected by
directing the molecular beam or beams at the collimator which
functions to remove velocity components therein in directions other
than those desired, thereby permitting the desired beam to pass
through the collimating aperture to effect reaction at the
substrate surface. Growth is continued for a time period sufficient
to yield an epitaxial film of the desired thickness, a feature of
the subject technique residing in the growth of films appreciably
less than one micron in thickness. Diffusion of a desired dopant
into the grown layer may be effected simultaneously with the growth
of that layer or following growth by rotation of the substrate in
such manner that it faces a gun port containing a doping gun.
It will be understood by those skilled in the art that the
composition of the grown layer can be altered at will. Thus, for
example, ternary compounds of the type alluded to hereinabove can
be grown by using three source beams and the value of x can be
precisely controlled and altered at any time during growth by
appropriate beam regulation.
Several examples of the present invention are given by way of
illustration and are not to be construed as limitations, many
variations being possible within the spirit and scope of the
invention.
EXAMPLE I
This example describes a process for the growth of an epitaxial
film of gallium arsenide upon a gallium arsenide substrate
member.
A gallium arsenide substrate member evidencing few dislocations,
obtained from commercial sources, and initially polished by
conventional mechanical polishing techniques was inserted in an
apparatus of the type shown in FIG. 1. In the apparatus actually
employed, two guns were contained in the gun port, one gram of
gallium arsenide and one-half gram of gallium being placed in the
respective guns. Following, the vacuum chamber was evacuated to a
pressure of the order of 10.sup..sup.-6 torr and the system baked
at 250.degree. C. for 12 hours. Following the baking procedure, 10
microns of argon were admitted to the system, the substrate rotated
in such manner as to face the sputtering port and sputtering
effected at 200 volts with a current of approximately 500 microamps
for a period of 2 hours, thereby effecting the removal of several
monolayers of material from the substrate surface. Then, the argon
was pumped out of the system, the substrate member rotated so as to
face the gun port and heated to a temperature of approximately
600.degree. C., the background pressure of the system being
1.times.10.sup..sup.-9 torr. At this time, liquid nitrogen was
introduced to the cooling shroud and the guns heated, the gallium
arsenide gun to a temperature of 1,250.degree. K. and the gallium
gun to 1,300.degree. K., thereby resulting in vaporization of the
materials contained therein and the consequent flow of molecular
beams toward the collimating frame which removed velocity
components in the beams which were undesirable. The beams were
focused upon the substrate surface for a period of 1 hour, so
resulting in the growth of an epitaxial film of gallium arsenide
upon the substrate 1 micron in thickness.
EXAMPLE II
The procedure of example I was repeated, with the exception that
the gun port contained only one gun which was initially filled with
one gram of gallium arsenide. At a temperature of 1,250.degree. K.
(gun temperature) it was found that 50 times as much arsenic (in
the form of diatomic species) was emitted from the gun as gallium
so that for the growth of gallium arsenide, it was necessary to use
but one source material. Growth was continued for a time period of
1 hour, so resulting in the growth of a gallium arsenide epitaxial
film upon the gallium arsenide substrate one-half micron in
thickness.
EXAMPLE III
The procedure of example II was repeated with the exception that
the solitary gun contained 1 gram of gallium phosphide. Growth was
continued for a period of 1 hour, so resulting in the growth of an
epitaxial film of gallium phosphide upon the gallium arsenide
substrate one-half micron in thickness.
EXAMPLE IV
The procedure of example III was repeated with the exception that a
gallium phosphide substrate was employed. Growth was continued for
a time period of approximately 1 hour, so resulting in the growth
of an epitaxial film of gallium phosphide, one-half micron in
thickness.
EXAMPLE V
This example describes the growth of an epitaxial film of
GaAs.sub..25 P.sub..75. The procedure of example I was employed
utilizing 1 gram of gallium phosphide and 1 gram of gallium
arsenide in the respective guns. The gallium phosphide gun was
heated to a temperature of 1,212.degree. K. and the gallium
arsenide gun to a temperature of 1,140.degree. K., heating being
continued for a time period of approximately 2 hours during which a
film of GaAs.sub..25 P.sub..75 1 micron in thickness grew upon the
substrate.
EXAMPLE VI
The procedure of example I was repeated with the exception that a
third gun was employed containing one-half gram of tellurium which
was heated to a temperature of 400.degree. C. during the operation
of the procedure, so resulting in the formation of an N-type
gallium arsenide epitaxial film, 1 micron in thickness.
* * * * *