U.S. patent number 3,614,480 [Application Number 04/865,747] was granted by the patent office on 1971-10-19 for temperature-stabilized electronic devices.
This patent grant is currently assigned to Bell Telephone Laboratories, Incorporated. Invention is credited to Carl N. Berglund, Martin P. Lepselter.
United States Patent |
3,614,480 |
Berglund , et al. |
October 19, 1971 |
TEMPERATURE-STABILIZED ELECTRONIC DEVICES
Abstract
Vanadium oxide exhibits a substantial and relatively abrupt
change in conductivity as the temperature of the material is varied
through a particular characteristic temperature (about 68.degree.
C.). In accordance with our invention, a vanadium oxide resistor is
employed as a temperature-sensing element in the control circuit of
a heater to stabilize the operating temperature of an electronic
circuit at about 68.degree. C. over a wide range of ambient
temperatures.
Inventors: |
Berglund; Carl N. (Plainfield,
NJ), Lepselter; Martin P. (New Providence, NJ) |
Assignee: |
Bell Telephone Laboratories,
Incorporated (Murray Hill, NJ)
|
Family
ID: |
25346135 |
Appl.
No.: |
04/865,747 |
Filed: |
October 13, 1969 |
Current U.S.
Class: |
327/513; 327/564;
257/467; 257/537; 257/539; 257/E23.08 |
Current CPC
Class: |
H01L
23/34 (20130101); G05D 23/1906 (20130101); G05D
23/24 (20130101); H01C 7/047 (20130101); H01L
27/0211 (20130101); H03K 17/14 (20130101); H01L
2924/0002 (20130101); H01L 2924/0002 (20130101); H01L
2924/3011 (20130101); H01L 2924/00 (20130101) |
Current International
Class: |
H01L
27/02 (20060101); H01L 23/34 (20060101); G05D
23/24 (20060101); G05D 23/20 (20060101); H01C
7/04 (20060101); H03K 17/14 (20060101); H03k
017/14 (); H05k 001/00 () |
Field of
Search: |
;317/234C,235
;307/202,202,310 ;338/22 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Kallam; James D.
Claims
What is claimed is:
1. Apparatus for maintaining an electronic device at a stabilized
elevated operating temperature comprising:
A body of material including the device whose temperature is to be
stabilized;
Electrically energizable heat-generating means mounted in intimate
thermal energy transfer relationship with the body for heating the
device; and
control means including temperature sensitive means connected to
the heat-generating means for controlling the rate of heat
generation in the heat-generating means; said temperature sensitive
means comprising a resistor including material selected from the
group consisting of the 3-d transition materials which exhibit a
relatively abrupt change in conductivity at a transition
temperature corresponding essentially to the desired elevated
operating temperature, and being located to have its recited in
claim 1 wherein the temperature means includes a resistor,
controlled by the temperature of the body.
2. A device recited in claim 1 wherein the temperature sensitive
means comprises vanadium oxide.
3. A device as recited in claim 1 wherein the temperature means
includes a resistor, the operative part of which consists
essentially of vanadium oxide.
4. An electronic device adapted for operation at a stabilized
elevated temperature comprising:
a body of material including the device whose temperature is to be
stabilized;
electrically energizable heat-generating means mounted in close
thermal energy transfer relationship with said body for heating
said body;
a vanadium oxide resistor in close thermal energy transfer
relationship with said body for sensing the temperature of said
body; and
circuit means to which said vanadium oxide resistor is connected
for controlling the rate of heat generation in the heat-generating
means.
5. A device as recited in claim 4 wherein the vanadium oxide
resistor consists essentially of vanadium dioxide.
6. A temperature stabilized semiconductor integrated circuit device
comprising in combination:
a body of silicon including at least one device whose temperature
is to be stabilized; and
means for stabilizing the operating temperature of the device
comprising electrically energizable heat-generating means in
combination with a temperature sensitive means which includes a
resistor consisting essentially of vanadium oxide.
7. A device as recited in claim 6 wherein the vanadium oxide
resistor comprises a relatively thin layer of vanadium oxide
disposed over the surface of the body.
8. Means for stabilizing the temperature of a body of material at
an elevated temperature comprising in combination:
a transistor disposed in close thermal energy transfer relationship
with the body for heating the body; and
a vanadium oxide resistor connected in shunt with the base emitter
junction of the transistor for controlling the rate of heat
generation in the transistor; said vanadium oxide resistor also
disposed in close thermal energy relationship with the body so that
its temperature is controlled by the temperature of the body.
9. Apparatus as recited in claim 8 further comprising means for
biasing the transistor and the resistor by an amount sufficient to
elevate the temperature of the body to the vanadium oxide
transition temperature.
10. An electronic device adapted for operation at a stabilized
elevated temperature comprising:
A body of material including the device whose operating temperature
is to be stabilized;
Electrically energizable heat-generating means mounted in close
thermal energy transfer relationship with said body for heating
said body;
temperature sensitive means connected to the heat-generating means
and mounted in close thermal energy transfer relationship with the
body for controlling the rate of heat generation in the
heat-generating means, the temperature sensitive means including a
resistor, an operative part of which is a material which exhibits a
conductivity transition at a predictable transition temperature;
and
means for biasing the heat-generating means and the resistor by an
amount sufficient to elevate the temperature of the body, the
heat-generating means, and the resistor to the transition
temperature.
11. Apparatus as recited in claim 10 wherein the resistor is
coupled to the heat-generating means in such a way that heat is
generated when the temperature of the resistor is substantially
below the transition temperature and heat is not generated when the
temperature of the resistor is substantially above the transition
temperature so that the operating temperature is stabilized about
the transition temperature.
12. Apparatus as recited in claim 11 wherein the conductivity
transition material is a film of vanadium oxide having a transition
temperature at about 68.degree. C.
Description
BACKGROUND OF THE INVENTION
This invention relates generally to semiconductor devices; and,
more particularly, to such devices which include provision for
stabilizing their operating temperature for improved operating
characteristics and improved reliability.
Most conventional semiconductor devices are inherently temperature
sensitive; and, accordingly, these exhibit wide variations in
certain of their operating characteristics in response to
variations in their operating temperatures. Inasmuch as variations
in ambient temperature produce corresponding changes in operating
temperature if the device is not in some way temperature
stabilized, the design of semiconductor circuits suitable for
operation in a wide range of ambient temperatures is complicated by
having to account for these variations.
In addition to causing variations in operating characteristics,
temperature variations can cause other problems in semiconductor
devices. For example, differences in thermal coefficient of
expansion among the composite of different materials usually
employed can cause intolerable strains and stresses when wide
temperature variations are experienced. Further, at relatively low
temperatures, e.g., room temperature and below, moisture can become
absorbed on the surface of a device and can act as an electrolyte
for interelectrode plating when operating voltages are applied to
the device. This interelectrode plating is believed to be a major
cause of device failure at the lower temperatures.
Heretofore, in the prior art, balanced bridge temperature control
systems have appeared most promising from the standpoint of
reliability and accuracy. See, e.g., U.S. Pat. No. 3,449,599,
issued June 10, 1969, to J. J. Henry. However, these systems
usually have been adapted for maximum flexibility and accuracy and
not, apparently, for economy of either physical space or cost.
SUMMARY OF THE INVENTION
In view of the above and other considerations, it is an object of
our invention to provide simple and inexpensive means for
stabilizing the operating temperature of an electronic circuit at
an elevated operating temperature.
It is a further object of our invention to reduce the size of a
temperature control system.
To these and other ends, in accordance with our invention, there is
provided a vanadium oxide (vo.sub.2) resistor as a
temperature-sensing element in combination with electrically
energizable heat-generating means for stabilizing the operating
temperature of an electronic circuit over a wide range of ambient
temperatures.
It is well known that certain crystalline compounds of the 3-d
transition metals exhibit a substantial and relatively abrupt
change in conductivity as the temperature of the material is varied
through a particular characteristic temperature. See, e.g., U.S.
Pat. No. 3,149,298, issued Sept. 15, 1964, to E. T. Handelman, and
assigned to the assignee hereof. As is well known in the art, the
3-d transition elements are those elements numbered 21 through 28
in the Periodic Table of the Elements. In particular,
monocrystalline samples of V0.sub.2 have exhibited changes in
conductivity by a factor of greater than 10.sup.4 over a
temperature interval of 2.degree. C. at about 68.degree. C. In
deposited thin films of VO.sub.2 the conductivity transition
usually occurs in a somewhat broader temperature interval (several
degrees centigrade) centered at about 68.degree. C. and is not so
substantial (10.sup.2 or greater). See, De.g., "Structural and
Electrical Properties of Vanadium Oxide Thin Films," G. A. Rozgonyi
et al., Journal of Vacuum Science and Technology, Vol. 5, No. 6,
p.194, 1968. However, even using films having this less sharply
defined conductivity transition, a temperature control system in
accordance with our invention is capable of stabilizing the
operating temperature of an electronic circuit to within several
degrees centigrade; and this is more than sufficient for many
applications.
More specifically, now, in accordance with a presently preferred
embodiment of our invention, there is provided a vanadium oxide
resistor in the bias circuit of a simple heater, De.g., a
transistor, to maintain the controlled circuit at an elevated
operating temperature. Both the heater and the vanadium oxide
resistor advantageously are disposed in intimate thermal energy
transfer relationship with the controlled circuit for optimum
responsiveness. For example, both the vanadium oxide resistor and
the heater advantageously are disposed in a monolithic
semiconductor wafer along with the controlled circuitry.
In operation, as temperature increases through about 68.degree. C.
the conductivity transition of V0.sub.2 causes the V0.sub.2
resistor to assume a relatively low resistance which causes the
heater to be biased off. Conversely, as temperature decreases
through about 68.degree. C. the V0.sub.2 resistor reverts to its
high-resistivity state causing the heater to be biased on. This
heating pushes the temperature back toward 68.degree. C.
It will be apparent that a temperature control system in accordance
with our invention, as summarized hereinabove, is operable only for
ambient temperatures below about 68.degree. C. since no cooling
apparatus has been described. Further, it will also be apparent
that cooling apparatus can be connected to our control system such
that the cooling apparatus turns on when the V0.sub.2 switches to
the low-resistance resistance state and so that the heater turns on
when the v0.sub.2 switches to the high-resistance state.
However, cooling apparatus usually is complex, expensive, and
bulky; and, therefore, is usually undesirable for use with
miniaturized semiconductor devices to which our invention primarily
is directed. Heating apparatus, on the other hand, can be virtually
as simple, small and inexpensive as desired. Further, for many
applications, the ambient temperature is not expected to exceed
68.degree. C. (about 155.degree. F.); and so for these applications
cooling apparatus would be superfluous.
BRIEF DESCRIPTION OF THE DRAWING
The aforementioned and other objects, features, and advantages of
our invention will be more readily understood from the following
detailed description taken in conjunction with the accompanying
drawing in which:
FIG. 1 is a graph of conductivity versus temperature for a typical
material exhibiting the conductivity transition utilized by our
invention;
FIG. 2 shows a schematic diagram of a simple control circuit in
accordance with a presently preferred form of our invention;
FIG. 3 shows a cross section of one small portion of a
semiconductor wafer including one possible integrated circuit
embodiment of the control circuit of FIG. 2; and
FIG. 4 shows a generalized cross section of a
temperature-stabilized integrated-circuit device in accordance with
a presently preferred form of our invention.
It will be appreciated that for simplicity and clarity of
explanation the figures have not necessarily been drawn to
scale.
DETAILED DESCRIPTION
More particularly now, with reference to FIG. 1, a portion 11 of
the graph shows a substantially constant and relatively low
conductivity at temperatures below the characteristic temperature
T.sub.c of transition. At temperatures above T.sub.c, portion 12 of
the curve shows a substantially constant and relatively high
conductivity. At T.sub.c, the transition temperature, conductivity
ideally increases (or decreases) abruptly, as indicated by portion
13 of the curve. In imperfect crystals and thin films, however, the
conductivity transition usually occurs over a temperature interval
(several degrees centigrade), as shown by portion 14 of the curve.
Particularly in thin films, there is usually some hysteresis in the
conductivity versus temperature curve, as shown by portion 15 of
FIG. 1. This hysteresis is at least partially due to built-in
stresses in the films.
Referring now to FIG. 2, there is shown a schematic diagram of a
simple control system in accordance with a presently preferred form
of our invention. A transistor 21 is shown with the common node of
a series pair of bias resistors 22 and 23 connected to its base
terminal. Resistor 22, connected between the collector and base of
transistor 21, is selected from the well-known resistors which
maintain a fairly constant resistance over the temperatures to be
experienced, De.g., a carbon resistor or any of a variety of
impedance devices commonly used in integrated circuits. Resistor 23
includes a material which undergoes a conductivity transition such
as described with reference to FIG. 1. Vanadium oxide (V0.sub.2) is
presently preferred for resistor 23, for reasons discussed
hereinbelow.
In operation, a voltage (+V) is applied to the collector of
transistor 21 and the emitter is grounded. The resistor values are
adjusted so that transistor 21 is biased on at temperatures below
T.sub.c (conductivity transition temperature). The power dissipated
in transistor 21 provides heat energy which tends to raise the
temperature of both resistors. The resistor values are also
adjusted so that when the temperature of resistor 23 increases
through T.sub.c the resistance of resistor 23 decreases to a value
small enough to cause transistor 21 to be biased substantially
off.
Thus, for ambient temperatures less than T.sub.c, the operating
temperature of any circuits in intimate thermal relationship with
transistor 21 and resistor 23 will oscillate about T.sub.c. The
amplitude of this thermal oscillation will depend upon the
abruptness of the conductivity transition of resistor 23 and upon
the amount of thermal hysteresis in that resistor.
In a particular embodiment which was constructed and tested,
resistor 22 was about 7,000 ohms; resistor 23 varied from about
30,000 ohms at a temperature below T.sub.c to about 50 ohms at a
temperature above T.sub.c ; and +V was about 7.5 volts. The
operating temperature of transistor 21 was stabilized to within a
few degrees centigrade at about 68.degree. C. over an ambient from
room temperature to about 70.degree. C.
It will be appreciated that it would be desirable for some
applications to provide a higher stabilized operating temperature,
De.g., up to about 200.degree. C. so that a greater range of
ambient temperatures could thereby be accommodated. However, no
practical thin film materials are presently known to exhibit such a
conductivity transition within the range of temperatures from about
70.degree. C. to 200.degree. C. One material, silver sulfide
(Ag.sub.2 S), is known to exhibit a conductivity transition at
about 170.degree. C.; however, this material exhibits ionic
conductivity due to mobile silver ions under applied electric
fields. Because of the instability resulting from this ionic
conductivity, silver sulfide will generally be undesirable for most
uses in accordance with our invention. Of course, if a suitable
material is discovered, it may be substituted for resistor 23, as
desired, within the scope of our invention.
With reference now to FIG. 3, there is shown a portion of a
semiconductor wafer 31 including one of the many possible
integrated circuit embodiments of the control circuit of FIG. 2. A
semiconductive bulk portion 32, e.g., of P-type silicon, includes a
pattern of localized conductivity type zones within the bulk and a
composite of layered patterns formed thereover. N-type zone 33
provides the collector; P-type zone 34 provides the base; and
N-type zone 35 provides the emitter for transistor 21. P-type zone
36 provides fixed resistor 22. N.sup.+ -type zone 37 provides a
low-resistance path, within the bulk, around the aforementioned
zones.
A pattern of dielectric material, e.g., silicon oxide, provides
electrical isolation between electrodes on the surface of the
semiconductor; and, additionally, provides a substrate upon which a
pattern of vanadium oxide 39 can be formed to provide resistor
23.
An electrode 40 provides electrical connection to N.sup..sup.+
-type 37 and thus to the collector of the transistor. Electrode 41
provides electrical connection to the emitter of the transistor.
Electrode 42 provides a common electrical connection to: the base
of the transistor (zone 34); one end of resistor 22 (zone 36); and
one end of resistor 23 (pattern 39). Electrode 43 provides
electrical connection to the end of resistor 23; and electrode 44
provides electrical connection between the other end of resistor 22
and the collector of transistor 21 via semiconductive zone 37.
A plurality of methods for fabricating semiconductor integrated
circuits similar to that shown in FIG. 3 are well known in the art.
However, a brief description of some possible techniques for
forming the vanadium oxide layers may aid the practitioner inasmuch
as the particular technique used should depend upon the particular
circuit in which the vanadium oxide resistor is used and upon the
desired accuracy of temperature control.
It is known in the art that thin films of vanadium oxide formed on
amorphous substrates, e.g., silicon oxide, usually do not exhibit a
sharply defined conductivity transition. For example, as reported
in the aforementioned publication by Rozgonyi et al. a thin film of
vanadium oxide formed directly on glass by reactive sputtering
exhibited a conductivity transition by a factor of only 77 with an
hysteresis of 7.degree. C. As will be appreciated, this type of
characteristic is suitable for those applications in which the
operating temperature need not be so precisely controlled.
However, if more precise control is desired, a technique, such as
disclosed in the copending U.S. application Ser. No. 776,732, filed
Nov. 18, 1968, now U.S. Pat. No. 3,491,000, issued Jan. 20, 1970,
and assigned to the assignee hereof, may be advantageous. As
disclosed therein, if a thin layer of tantalum oxide (T.sub.2
0.sub.5) is formed over the amorphous substrate prior to forming
the vanadium oxide layer, the conductivity transition of the
vanadium oxide is more sharply defined.
A variety of techniques for forming the vanadium oxide also are
well known in the art. For example, one can deposit a thin layer of
vanadium and then convert this layer to its oxide, as disclosed by
R. J. Powell in Stanford Electronics Laboratories Report No.
5220-1, May, 1967. Alternatively, reactive sputtering may be used
to deposit directly the vanadium oxide layer, as disclosed in the
aforementioned publication by Rozgonyi et al. Still another
technique includes reactive evaporation of vanadium in an oxygen
atmosphere followed by an annealing process, as disclosed in
Philips Res. Rept., Vol. 22, p.170 (1967) by K. van Steensel et
al.
With particular relation now to integrated circuits, FIG. 4 shows a
generalized cross section of a presently common type of integrated
circuit technology. A semiconductor wafer 51 having conductive
beam-lead connections 52 and 53 is registered with and attached to
corresponding, preformed conductive portions 54 and 55 on an
insulating substrate 56, e.g., a circuit board, as disclosed, for
example, in U.S. Pat. No. 3,426,252, issued Feb. 4, 1969, to M. P.
Lepselter and assigned to the assignee hereof.
As presently contemplated, a control circuit embodiment, such as
shown in FIG. 3, can be included as a small portion of wafer 51 in
FIG. 4. There may be a plurality of wafers 51, each including its
own control circuit, attached to a single insulating substrate. In
this manner, the good thermal conduction properties of each
semiconductor wafer enable close thermal relationship between the
control circuit and the controlled circuits in each wafer.
Alternatively, there may be provided a separate wafer 51 providing
the temperature control circuit mounted on a single insulating
substrate along with other wafers which do not contain their own
control circuits. In this case, the electrode connections (52-55)
and the insulating substrate (56) are advantageously selected to
provide close thermal relationship between the wafer(s) which
contain the control circuit (s) and those wafers which do not.
* * * * *