U.S. patent number 3,608,711 [Application Number 04/866,793] was granted by the patent office on 1971-09-28 for package for electronic devices and the like.
This patent grant is currently assigned to Teledyne, Inc.. Invention is credited to John S. MacIntyre, Mordechai Wiesler.
United States Patent |
3,608,711 |
Wiesler , et al. |
September 28, 1971 |
PACKAGE FOR ELECTRONIC DEVICES AND THE LIKE
Abstract
Small, fragile products such as transistors, diodes and
integrated-circuit dice are packaged on a tape which may be indexed
through various production stages. The tape is formed with spaced
apertures closed on one side by means of a pressure-sensitive
adhesive wall bonded to one side of the tape. Devices are dropped
onto the wall and adhere thereto. Sprocket holes are formed along
the marginal edge of the tape for engagement with an indexing drive
mechanism.
Inventors: |
Wiesler; Mordechai (Lexington,
MA), MacIntyre; John S. (Lynnfield, MA) |
Assignee: |
Teledyne, Inc. (Hawthorne,
CA)
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Family
ID: |
25348426 |
Appl.
No.: |
04/866,793 |
Filed: |
October 6, 1969 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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665635 |
Sep 5, 1967 |
3497948 |
Mar 3, 1970 |
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785209 |
Dec 19, 1968 |
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Current U.S.
Class: |
206/714; 438/118;
414/935 |
Current CPC
Class: |
B65D
73/02 (20130101); Y10S 414/135 (20130101) |
Current International
Class: |
B65D
73/02 (20060101); B65d 085/30 (); B65d
073/02 () |
Field of
Search: |
;206/65,65F,56A,46H,1,80
;40/2 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Dixson, Jr.; William T.
Parent Case Text
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a continuation-in-part of U.S. application Ser.
No. 665,635 filed Sept. 5, 1967 entitled "Method & Apparatus
for Sorting Semiconductor Devices," now U.S. Pat. No. 3,497,948
dated Mar. 3, 1970 and of U.S. application Ser. No. 785,209 filed
Dec. 19, 1968 entitled "Die Sorting System," both applications
being commonly assigned to the assignee of the present application.
Claims
Having thus described the invention what I claim and desire to
obtain by Letters Pat. of the U.S. is:
1. A package for fragile objects such as integrated circuit dice
and the like, comprising:
a. a longitudinally flexible elongated tape formed with a plurality
of spaced pockets in one face thereof, each said pocket defining an
opening larger than the lateral dimension of each said fragile
object, each said pocket having a depth at least equal to the
thickness of each said fragile object; and
b. an adhesive stratum disposed in each said pocket for mounting
said fragile object depositing therein, each said fragile object
secured within each said pocket, respectively, by said adhesive
stratum.
2. A package according to claim 1 wherein said stratum is pressure
sensitive.
3. A package according to claim 1 wherein said tape is formed with
sprocket holes spaced lengthwise along said tape.
4. A package according to claim 1 wherein said tape is formed with
openings spaced along said tape and a stratum of pressure sensitive
adhesive tape is mounted along one face of the tape to close one
side of said opening to form said pockets.
5. A package according to claim 1 wherein said tape is plastic.
6. A package according to claim 1 wherein said tape is metal.
7. A package according to claim 5 wherein said plastic is
polyester.
8. A package according to claim 6 wherein said metal is stainless
steel.
9. A package according to claim 1 including a removable stratum
applied to said tape over the pocket openings.
10. A package according to claim 2 wherein said stratum is of a low
tack characteristic.
11. A package according to claim 1 wherein the depth of said
pockets is greater than the thickness of said objects.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates generally to the packaging of small, fragile
products such as electronic devices and more particularly is
directed towards a new and improved package for use in the testing,
sorting and packaging of individual semiconductive dice formed from
monolithic wafers.
2. History of the Prior Art
In the production of semiconductive devices, particularly
integrated circuits, there has been a need for a simple and
efficient packaging system. Integrated-circuit dice are extremely
small, light and fragile and heretofore have presented problems in
handling and packaging by reason of their physical characteristics.
It is an object of the present invention to provide a packaging
system for small, fragile products and particularly semiconductor
dice wherein the dice may be individually packaged for convenient
storage and handling or for transfer operations from stage to stage
in an assembly process.
Summary of the Invention
This invention features a package for fragile devices such as
semiconductive dice and is comprised of a flexible strip of
material of a thickness exceeding that of the device to be packaged
and formed with longitudinally spaced openings, closed on one side
by means of a pressure sensitive wall on which the device is
deposited and held. Sprocket holes are provided for indexing the
tape through a feed mechanism. The tape may be rolled up for
storage or shipment without damage to the parts.
Detailed Description of the Drawings
FIG. 1 is a fragmentary view in perspective showing a section of
packaging tape made according to the invention,
FIG. 2 is a view in side elevation thereof,
FIG. 3 is a sectional view in side elevation thereof,
FIG. 4 is a cross-sectional view taken along the line 4--4 of FIG.
1, and,
FIG. 5 is a top plan view thereof.
Detailed Description of the Preferred Embodiment
Referring now to the drawings the reference character 10 generally
indicates a small fragile product such as an integrated circuit die
packaged by a tape 12 for storage, shipment or transfer through
processing and assembling stations. The tape 12 is characterized by
a plurality of openings 14 evenly spaced along the length of the
tape 12 and each of a size sufficient to receive a device 10.
Applied to the rear or bottom face of the tape 12 is a stratum 16
of pressure-sensitive adhesive which closes one side of the
openings 14 to form a pocket for the part 10. The adhesive serves
not only to bond the stratum 16 to the bottom face of the tape but
also serves as a mounting means for holding the part 10 in position
once deposited in the pocket.
Formed along one marginal edge of the tape 12 are sprocket holes 18
for engaging a driving sprocket wheel in an indexing mechanism by
which the tape is advanced longitudinally through various assembly
stations.
In practice, the tape 12 is of a thickness at least equal to and
preferably greater than the thickness of the part 10 which is
packaged. As best shown in FIG. 3 this feature will provide
clearance between the top of the part 10 and the upper surface of
the tape. Thus the top surface of the part 10 will be protected
against abrasion or the like should the tape be wound up into a
roll insofar as the top will not contact a facing convolution of
the rolled tape. It is also desirable that the opening 14 be
somewhat larger than the lateral dimensions of the part 10, not
only to permit receiving a wide range in sizes of parts, but also
to provide clearance for transfer mechanisms and the like employed
to deposit parts in the pockets and remove the same therefrom.
While various materials including metal may be employed for the
tape 12 a polyester such as sold under the trademark MYLAR has been
found to be particularly satisfactory since it provides
longitudinal stability, provides protection against crushing,
distortion and the like and is easy to handle, particularly with
respect to threading the tape to an indexing mechanism.
The stratum 16 preferably is quite thin and its adhesive layer
should have low tack characteristics sufficient to hold the part in
position during handling yet permit a clean, easy release of the
part when required. A polyvinyl chloride stratum 16 of perhaps 1.5
mils thickness and an adhesive stratum of low tack characteristics
also 1.5 mils thickness may be employed to advantage. Typically the
die 10 will range in size from 4 to 6 mils in thickness and perhaps
15 mils square to 40 .times.60 mils.
The tape 12 should therefore exceed the 6 mils thickness of the
part and may be on the order of 10 mils or so, for example.
The openings 14 may be circular as shown or may be of other
configurations such as square, for example. The pressure-sensitive
stratum 16 preferably is narrower in width than the tape 12 to
leave the sprocket hole margin of the tape clear for free access to
the sprocket holes.
Some pressure-sensitive adhesives lose most of their tackiness at
low temperatures although a small release force may still be
required. While cold release is not necessary it may be found
useful in certain applications. Adhesives of this nature must
exhibit a marked change in viscosity with temperature. In this way
a soft tacky material can be frozen into a hard brittle one.
Certain combinations of polymers and tackifier resins are well
suited for the formation of these adhesives.
The polymers must be thermoplastic; that is they must soften when
heated and harden when cool. The ethylene vinyl acetate copolymer
such as Dupont Elfax resins are thermoplastic materials which are
quite suitable for this particular application. The tackifier
resins also must be thermoplastic. It has been found that the
combination of two resin derivatives, namely Staybilite, Ester 3
and Staybilite Ester 10 works well, these products being made by
Hercules Powder Co. Optimum formulation has been found to be 30
parts by weight of Elfax 150, 10 parts by weight of Staybilite
Ester 3, and 60 parts by weight of Staybilite Ester 10.
The ingredients are first blended in a molten state at 300.degree.
F. and then dissolved in a toluene for coating on the tape. A 30
percent solution is used for coating and an adhesive film between
0.75 and 1.0 mils works well.
Numerous modifications may be made to the invention. For example,
sprocket drive holes can be provided along both margins of the tape
and multiple rows of pockets for the parts 10 may be provided.
Also, while a top cover is not necessary it may be found useful to
apply a pressure-sensitive adhesive ply to the top of the tape once
the parts have been deposited in their respective pockets, the
cover tape, of course, having to be removed prior to removal of the
part. Further, in place of through holes closed by the adhesive ply
to form pockets, the tape may be formed with spaced depressions and
a patch of adhesive deposited at bottom thereof.
* * * * *