U.S. patent number 3,598,180 [Application Number 05/052,609] was granted by the patent office on 1971-08-10 for heat transfer surface structure.
Invention is credited to Robert David Moore, Jr..
United States Patent |
3,598,180 |
Moore, Jr. |
August 10, 1971 |
**Please see images for:
( Certificate of Correction ) ** |
HEAT TRANSFER SURFACE STRUCTURE
Abstract
A heat transfer surface structure is described wherein both heat
and vaporizable liquid are conveyed through a capillary material to
a free vaporizing surface of the capillary material where the
liquid vaporizes. Heat is conducted from a heat source wall through
a portion of the capillary material to the vaporizing surface where
it escapes as heat of vaporization along with the vapor. The liquid
flows through the pores of the capillary material from a liquid
source to the vaporizing surface under the influence of capillary
forces. The vaporizing surface is divided into a large number of
regions which are close to the heat source wall and are connected
by way of vapor passages to a region external to the capillary
material. Thus, the heat conducting paths through the capillary
material are very short, and vapor can escape freely through
relatively large passages rather than having to force its way
through the pores of the capillary material where it would
interfere with the liquid flow. Such a vented capillary vaporizer
is capable of handing much higher heat flux densities than previous
capillary vaporizers. Four examples of capillary vaporizer are set
forth, two of these for operation where the liquid and vapor are
comingled as in a boiler tube or evaporator tube. One of these has
separated areas of capillary material in thermal contact with the
heat source surface, thereby defining passages therebetween. The
other is similar with added portions of porous materials to form a
manifold having a hierarchy of vapor passages of decreasing number
and increasing cross section, thus increasing the separation
between the regions of liquid input and vapor output. The third
example accepts liquid from a capillary structure or wick as in a
heat pipe, and also has a pair of manifolds in the form of a
hierarchy of passages for vapor flow and capillary paths for liquid
flow. The fourth example receives bulk liquid through a channel,
and delivers the vapor through a separate passage. Thermal
insulation maintains the bulk liquid relatively cool, and active
cooling may be provided. This latter embodiment is unique in its
ability to pump the heat transfer fluid since the output vapor can
be at a higher pressure than the incoming bulk liquid.
Inventors: |
Moore, Jr.; Robert David
(Arcadia, CA) |
Family
ID: |
21978723 |
Appl.
No.: |
05/052,609 |
Filed: |
July 6, 1970 |
Current U.S.
Class: |
165/133;
165/104.26; 165/180; 165/181 |
Current CPC
Class: |
F28D
15/046 (20130101); F28F 13/187 (20130101); F28F
13/003 (20130101) |
Current International
Class: |
F28F
13/18 (20060101); F28D 15/04 (20060101); F28F
13/00 (20060101); F28f 013/06 () |
Field of
Search: |
;165/105,133,180,181 |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
stenger; F. J., "Experimental Feasibility Study Of Water-Filled
Capillary-Pumped Heat-Transfer Loops," NASA Tech. Memorandum
(TMX-1310), 11/1966.
|
Primary Examiner: Davis, Jr.; Albert W.
Claims
What I claim is:
1. A heat transfer surface structure comprising:
a heat source surface;
a quantity of vaporizable liquid and its vapor;
a capillary matrix wet by the liquid and having at least a first
surface portion in thermal contact with the heat source surface, a
second surface portion in contact with the vaporizable liquid, and
a third surface portion from which the principal vaporization of
liquid from the capillary matrix takes place, said third surface
portion being arranged as a multiplicity of regional areas of
vaporization spaced sufficiently closely to each other and to the
first surface portion that the volume of the capillary matrix
through which the liquid must pass between the second surface
portion and the third surface portion remains liquid filled;
a multiplicity of vapor passages sufficiently larger than the
capillary size of the capillary matrix to be vapor filled, said
vapor passages being in vapor communication between the regional
areas of vaporization of the third surface portion and a region
external to the capillary matrix away from which vapor can flow,
and wherein a multiplicity of said vapor passages are embedded
substantially into the capillary matrix material.
2. A structure as defined in claim 1 wherein said regional areas of
vaporization are spaced apart by less than 0.1 inch.
3. A structure as defined in claim 1 wherein the first surface
portion is substantially uniformly separated throughout its extent
from the second surface portion.
4. A heat transfer surface structure comprising:
a heat source surface;
a quantity of vaporizable liquid and its vapor;
a capillary matrix wet by the liquid and having at least a first
surface portion in thermal contact with the heat source surface, a
second surface portion in contact with the vaporizable liquid, and
a third surface portion from which the principal vaporization of
liquid from the capillary matrix takes place, said third surface
portion being arranged as a multiplicity of regional areas of
vaporization spaced sufficiently closely to each other and to the
first surface portion that the volume of the capillary matrix
through which the liquid must pass between the second surface
portion and the third surface portion remains liquid filled;
a multiplicity of vapor passages sufficiently larger than the
capillary size of the capillary matrix to be vapor filled, said
vapor passages being in vapor communication from the regional areas
of vaporization of the third surface portion through the capillary
matrix to a region external to the capillary matrix away from which
vapor can flow.
5. A structure as defined in claim 4 wherein said regional areas of
vaporization are spaced apart by less than 0.1 inch.
6. A structure as defined in claim 4 wherein the capillary matrix
comprises a plurality of bodies of capillary material separated at
least in part by intervening vapor passages.
7. A structure as defined in claim 4 wherein the first surface
portion is substantially uniformly separated throughout its extent
from the second surface portion.
8. A heat transfer surface structure comprising:
a heat source surface;
a quantity of vaporizable liquid and its vapor;
a capillary matrix wet by the liquid and having at least a first
surface portion in thermal contact with the heat source surface, a
second surface portion in contact with the vaporizable liquid, and
a third surface portion from which the principal vaporization of
liquid from the capillary matrix takes place, said third surface
portion being arranged as a multiplicity of regional areas of
vaporization spaced apart less than 0.1 inch and sufficiently close
to the first surface portion that the volume of the capillary
matrix through which the liquid must pass between the second
surface portion and the third surface portion remain liquid filled;
and
a multiplicity of vapor passages sufficiently larger than the
capillary size of the capillary matrix to be vapor filled, said
vapor passages being in vapor communication between the regional
areas of the third surface portion and a region external to the
capillary matrix away from which vapor can flow.
9. A structure as defined in claim 8 wherein said capillary matrix
comprises:
a first volumetric portion relatively nearer the first surface
portion and having a relatively higher thermal conductivity;
and
a second volumetric portion relatively further from the first
surface portion and having a relatively lower thermal
conductivity.
10. A heat transfer surface structure comprising:
a heat source surface;
a quantity of vaporizable liquid and its vapor;
a capillary matrix wet by the liquid and having at least a first
surface portion in thermal contact with the heat source surface, a
second surface portion in contact with the vaporizable liquid, and
a third surface portion from which the principal vaporization of
liquid from the capillary matrix takes place, said third surface
portion being arranged as a multiplicity of regional areas of
vaporization spaced sufficiently closely to each other and to the
first surface portion that the volume of the capillary matrix
through which the liquid must pass between the second surface
portion and the third surface portion remains liquid filled;
a multiplicity of vapor passages sufficiently larger than the
capillary size of the capillary matrix to be vapor filled, said
vapor passages further comprising:
a first multiplicity of passages spaced relatively more closely
together and situated for receiving vapor from the regional areas
of vaporization; and
a second multiplicity of passages spaced relatively less closely
together and in vapor communication between the first multiplicity
of passages and a region external to the capillary matrix away from
which the vapor can flow.
11. A structure as defined in claim 10 wherein said regional areas
of vaporization are spaced apart by less than 0.1 inch.
12. A structure as defined in claim 10 wherein the capillary matrix
further comprises:
a first volumetric portion relatively nearer the first surface
portion and having a relatively larger effective capillary surface
to volume ratio .delta., and
a second volumetric portion relatively further from the first
surface portion and having a relatively smaller effective capillary
surface to volume ratio .delta..
13. A heat transfer surface structure comprising:
a heat source surface;
a quantity of vaporizable liquid and its vapor;
a capillary matrix wet by the liquid and having at least a first
surface portion in thermal contact with the heat source surface, a
second surface portion in contact with the vaporizable liquid, and
a third surface portion from which the principal vaporization of
liquid from the capillary matrix takes place, said third surface
portion being arranged as a multiplicity of regional areas of
vaporization spaced sufficiently closely to each other and to the
first surface portion that the volume of the capillary matrix
through which the liquid must pass between the second surface
portion and the third surface portion remains liquid filled, and
further comprising a first volumetric portion relatively nearer the
first surface portion and having a relatively larger effective
capillary surface to volume ratio .delta. and a second volumetric
portion relatively further from the first surface portion and
having a relatively smaller effective capillary surface to volume
ratio .delta., and
a multiplicity of vapor passages sufficiently larger than the
capillary size of the capillary matrix to be vapor filled, said
vapor passages being in vapor communication between the regional
areas of vaporization of the third surface portion and a region
external to the capillary matrix away from which vapor can
flow.
14. A structure as defined in claim 13 wherein said capillary
matrix further comprises:
a first volumetric portion relatively nearer the first surface
portion and having a relatively higher thermal conductivity;
and
a second volumetric portion relatively further from the first
surface portion and having a relatively lower thermal
conductivity.
15. A heat transfer surface structure comprising:
a heat source surface;
a quantity of vaporizable liquid and its vapor;
a capillary matrix wet by the liquid and having at least a first
surface portion in thermal contact with the heat source surface, a
second surface portion in contact with the vaporizable liquid, and
a third surface portion from which the principal vaporization of
liquid from the capillary matrix takes place, said third surface
portion being arranged as a multiplicity of regional areas of
vaporization spaced sufficiently closely to each other and to the
first surface portion that the volume of the capillary matrix
through which the liquid must pass between the second surface
portion and the third surface portion remains liquid filled, and
further comprising a first volumetric portion relatively nearer the
first surface portion having a relatively higher thermal
conductivity and a second volumetric portion relatively further
from the first surface portion and having a relatively lower
thermal conductivity; and
a multiplicity of vapor passages sufficiently larger than the
capillary size of the capillary matrix to be vapor filled, said
vapor passages being in vapor communication between the regional
areas of vaporization of the third surface portion and a region
external to the capillary matrix away from which vapor can
flow.
16. A structure as defined in claim 15 wherein the first surface
portion is substantially uniformly separated throughout its extent
from the second surface portion.
17. A heat transfer surface structure comprising:
a heat source surface;
a quantity of vaporizable liquid and its vapor;
a capillary matrix wet by the liquid and having at least a first
surface portion in thermal contact with the heat source surface, a
second surface portion in contact with the vaporizable liquid, and
a third surface portion from which the principal vaporization of
liquid from the capillary matrix takes place, said third surface
portion being arranged as a multiplicity of regional areas of
vaporization spaced sufficiently closely to each other and to the
first surface portion that the volume of the capillary matrix
through which the liquid must pass between the second surface
portion and the third surface portion remains liquid filled; a
multiplicity of vapor passages sufficiently larger than the
capillary size of the capillary matrix to be vapor filled, said
vapor passages being in vapor communication between the regional
areas of vaporization of the third surface portion and a region
external to the capillary matrix away from which vapor can
flow;
means for thermally insulating the fluid adjacent the second
surface portion of the capillary matrix from portions of the
external ambient environment having a higher temperature than said
fluid.
18. A heat transfer surface structure comprising:
a heat source surface;
a quantity of vaporizable liquid and its vapor;
a capillary matrix wet by the liquid and having at least a first
surface portion in thermal contact with the heat source surface, a
second surface portion in contact with the vaporizable liquid, and
a third surface portion from which the principal vaporization of
liquid from the capillary matrix takes place, said third surface
portion being arranged as a multiplicity of regional areas of
vaporization spaced sufficiently closely to each other and to the
first surface portion that the volume of the capillary matrix
through which the liquid must pass between the second surface
portion and the third surface portion remains liquid filled;
a multiplicity of vapor passages sufficiently larger than the
capillary size of the capillary matrix to be vapor filled, said
vapor passages being in vapor communication between the regional
areas of vaporization of the third surface portion and a region
external to the capillary matrix away from which vapor can
flow;
means for removing heat from the fluid adjacent the second surface
portion of the capillary matrix, said means being capable of
removing said heat even when, without said means, the region
surrounding said fluid would have at least as high a temperature as
the fluid.
19. A heat transfer surface structure comprising:
a heat source surface;
a quantity of vaporizable liquid and its vapor;
a capillary matrix wet by the liquid and having at least a first
surface portion in thermal contact with the heat source surface, a
second surface portion in contact with the vaporizable liquid, and
a third surface portion from which the principal vaporization of
liquid from the capillary matrix takes place, said third surface
portion being arranged as a multiplicity of regional areas of
vaporization spaced sufficiently closely to each other and to the
first surface portion that the volume of the capillary matrix
through which the liquid must pass between the second surface
portion and the third surface portion remains liquid filled;
a multiplicity of vapor passages sufficiently larger than the
capillary size of the capillary matrix to be vapor filled, said
vapor passages being in vapor communication between the regional
areas of vaporization of the third surface portion and a region
external to the capillary matrix away from which vapor can
flow;
active means for removing heat from the fluid adjacent the second
surface portion of the capillary matrix.
20. A structure as defined in claim 19 wherein the active means for
removing heat comprises a heat pipe.
21. A structure as defined in claim 19 wherein the active means for
removing heat comprises a thermoelectric cooling device.
22. A heat transfer surface structure comprising:
a heat sink surface;
a quantity of fluid consisting of a vaporizable liquid and its
vapor;
a capillary matrix wet by the liquid and having at least a first
surface portion in thermal contact with the heat sink surface, a
second surface portion through which the fluid is withdrawn from
the capillary matrix, and a third surface portion at which the
principal condensation of vapor takes place; said third surface
portion being arranged as a multiplicity of regional areas of
condensation;
a multiplicity of vapor passages sufficiently larger than the
capillary size of the capillary matrix to be vapor filled; said
vapor passages being in vapor communication between the regional
areas of condensation of the third surface portion and a region
external to the capillary matrix from which the vapor passages
receive vapor.
23. A structure as defined in claim 22 wherein a multiplicity of
said vapor passages are embedded substantially into the capillary
matrix material.
24. A structure as defined in claim 22 wherein a multiplicity of
said vapor passages are in vapor communication from the regional
areas of condensation through the capillary matrix to the region
external to the capillary matrix from which the vapor passages
receive vapor.
25. A structure as defined in claim 22 wherein said regional areas
of condensation are spaced apart by less than 0.1 inch.
26. A structure as defined in claim 22 wherein said vapor passages
further comprise:
a first multiplicity of passages spaced relatively more closely
together and so as to deliver vapor to the regional areas of
condensation; and
a second multiplicity of passages spaced relatively less closely
together and in vapor communication between the first multiplicity
of passages and the region external to the capillary matrix from
which the vapor passages receive vapor.
27. A structure as defined in claim 22 further comprising means for
maintaining the pressure of the liquid in the capillaries of the
capillary matrix lower than the pressure of the vapor adjacent the
third surface portion of the capillary matrix.
28. A structure as defined in claim 22 wherein said capillary
matrix comprises:
a first volumetric portion relatively nearer the first surface
portion and having a relatively higher thermal conductivity;
and
a second volumetric portion relatively further from the first
surface portion and having a relatively lower thermal conductivity.
Description
BACKGROUND
Filed simultaneously herewith are two closely related patent
applications by Robert David Moore, Jr., entitled "Segmented Heat
Pipe", Ser. No. 52,249 and "The Heat Link, A Heat Transfer Device
With Isolated Fluid Flow Paths" Ser. No. 52,642, each of which
describes and claims heat transfer apparatus, including heat
transfer surface structures incorporating principles of this
invention. The content of these copending patent applications is
hereby incorporated by reference for full force and effect as if
set forth in full herein.
Vaporization heat transfer is widely employed in a broad variety of
boilers, heat exchangers, heat pipes and the like. In the ordinary
boiler, where bulk liquid and vapor are comingled for contact with
the heat transfer surface, vaporization takes place in three
well-known stages as the energy input through the solid surface
into the liquid is increased. Initially, the liquid is warmed and
vaporization takes place from the liquid surface without the
formation of bubbles. In the second stage, so-called nucleate
boiling occurs wherein vapor bubbles form at the heated surface and
pass through the bulk liquid to give a very high heat transfer
rate. As the heat flux through the surface into the liquid rises,
the vapor bubbles form at a higher rate and at closer spacing so
that eventually they form a substantially continuous film of vapor
over the surface. The thermal transfer characteristics of the vapor
are appreciably lower than that of the liquid, and this so-called
film boiling results in a sharp decrease in heat transfer away from
the heat input surface. Thus causes a sharp increase in temperature
of the surface, and not only is the heat transfer rate decreased,
but also there is a danger of damage to the surface due to
excessive temperatures. In order to maximize heat flux, it is
desirable to prevent the formation of a continuous vapor film at
the heat transfer surface.
In a conductively heated capillary vaporizer as in a heat pipe a
somewhat different arrangement is employed than in a boiler, since
in a boiler vaporization takes place at the heat input surface
which is normally just a sheet of metal or the like, and in a heat
pipe a porous capillary material is employed for conveying both the
liquid and the heat to the surface or region of vaporization.
Although the heat flux rates obtainable with a conductively heated
capillary vaporizer are quite high, they are limited by the rate at
which vapor can escape from the surface or region of vaporization
or the tendency of the vapor to drive the liquid out of the hotter
portions of the porous matrix, thus cutting off the supply of
liquid to the surface or region at which vaporization occurs. These
limitations are serious since the volume of vapor formed is quite
high compared with the volume of liquid, and the vapor must either
be formed at the surface of the porous capillary material following
heat conduction through the capillary material, in which case a
considerable portion of the capillary material becomes hotter than
the vapor, or the vapor must pass through the pores of the
capillary material with substantial flow resistance. It is,
therefore, desirable to provide a heat transfer surface structure
which will deliver heat and liquid to a surface of vaporization and
remove vapor from the surface with minimized thermal and fluid flow
resistances.
BRIEF SUMMARY OF THE INVENTION
Thus, in practice of this invention according to a preferred
embodiment, there is provided a heat transfer surface on a heat
source surface. A capillary matrix, wet by a vaporizable liquid,
has a first surface portion in thermal contact with the heat
source, a second surface portion in contact with the vaporizable
liquid, and a third surface portion from which the principal
vaporization of liquid from the capillary matrix takes place. The
third surface portion is arranged as a multiplicity of regional
areas sufficiently close to each other and to the heat source
surface that the volume of the capillary matrix, through which the
liquid must pass between the second surface portion and the third
surface portion, remains liquid filled. A multiplicity of vapor
passages sufficiently larger than the capillary size of the
capillary matrix to remain vapor filled are in fluid communication
between the regional areas and another region external to the
capillary matrix to which vapor is free to flow.
DRAWINGS
The above mentioned and other features and advantages of the
present invention will be better understood by reference to the
following detailed description of a presently preferred embodiment
when considered in connection with the accompanying drawings
wherein:
FIG. A illustrates schematically a vapor-liquid interface at the
end of a capillary;
FIG. B illustrates a vapor bubble in a liquid-filled capillary;
FIG. 1 illustrates schematically a porous body for fluid and heat
transfer;
FIG. 2 illustrates schematically a conductively heated capillary
body for fluid transfer and heat transfer;
FIG. 3 illustrates a simple heat transfer surface structure
incorporating principles of this invention;
FIG. 4 illustrates in cross section a compound boiling surface
incorporating principles of this invention;
FIG. 5 is another cross section of the structure of FIG. 4;
FIG. 6 illustrates schematically a fragment of heat transfer
surface incorporating principles of this invention;
FIGS. 7, 8, 9 and 10 illustrate other embodiments of heat transfer
surface structure related to that of FIG. 6;
FIG. 11 illustrates in transverse cross section a wick-fed
vaporizer incorporating principles of this invention, such as may
be used in a heat pipe;
FIG. 12 is a longitudinal cross section of the vaporizer of FIG.
11;
FIG. 13 is another transverse cross section of the vaporizer of
FIG. 11;
FIG. 14 is another longitudinal cross section of the vaporizer of
FIG. 11;
FIG. 15 is a perspective view of a fragment of the vaporizer of
FIG. 11;
FIG. 16 is a magnified view of a portion of the vaporizer of FIG.
11;
FIG. 17 is a transverse cross section of a fragment of a capillary
pump vaporizer structure incorporating principles of this
invention;
FIG. 18 is a cross section transverse to that of FIG. 17; and
FIG. 19 is a magnified view of a portion of the structure of FIG.
17.
Throughout the drawings, like reference numerals refer to like
parts.
In order to obtain maximum heat flux rates from a vaporizer, it is
necessary to allow heat and the vaporizable liquid to reach the
liquid-vapor interface at which vaporization of the liquid takes
place as easily as possible, and also allow the vapor formed to
escape easily. In a boiler or the like where the surface is exposed
to bulk liquid, the formation of a continuous vapor film inhibits
the flow of vaporizable liquid to the heat transfer surface and the
flow of heat to the liquid. Previous arrangements for conductively
heated capillary vaporizers have been limited in either the ability
of the heat to reach the interface, or the liquid to reach the
interface, or in the ability of vapor to leave the interface.
In a typical conventional heat pipe, the capillary vaporizer has a
relatively thick layer of porous material adjacent the wall through
which heat enters the heat pipe in order to obtain an adequate
liquid flow. Both heat and liquid must flow through this material.
If the layer of porous material is too thin the resistance to
liquid flow is high. At high heat flux the liquid may not reach
across the entire porous vaporizer, and excessive temperatures may
be encountered in "dry" regions of the vaporizer. If, on the other
hand, the porous material is too thick, heat entering the heat pipe
through the impermeable wall heats the porous material and the
liquid therein in the region adjacent the wall. When the heat flux
becomes high, the liquid adjacent the wall may vaporize, but the
vapor is effectively trapped by the liquid-filled porous material,
and a situation somewhat analogous to film boiling is encountered.
In this situation, heat must be conducted through both the
vapor-filled porous material and the liquid-filled porous material
to evaporate liquid from the free surface. Thus, in either a free
boiling situation or in a heat pipe, it is desirable to have means
for conveying liquid and heat to the surface where vaporization
occurs with as little resistance as possible, and also provide
means for removing vapor from the vaporization region with minimum
resistance.
In order to thoroughly appreciate the principles and operating
advantages of the heat transfer surface structure provided in
practice of this invention and to define and develop the art
sufficiently that practical use can be made of the invention, the
operating principles of conventional and improved capillary
vaporizers are discussed herein. Emphasis is given to the
limitations on the operation of a capillary vaporizer, particularly
the maximum heat flux rates obtainable, in order to confirm the
relative and absolute performance of the improved capillary
vaporizer and to provide the theoretical basis needed for optimal
engineering design. In one of the improved vaporizers, "pumping"
can be obtained wherein the vapor leaving the capillary vaporizer
is at a higher pressure than the liquid reaching the vaporizer.
The flow of liquid through a porous material under the influence of
surface tension forces is analyzed first and the resulting equation
applied to demonstrate the performance of a radiantly heated
vaporizer. The limiting heat flux of a simple conductively heated
vaporizer is then shown to be far lower, on the order of about 1
percent of that of the radiantly heated vaporizer, due to the small
temperature differential that can be maintained across the porous
material without vapor displacing the liquid from the pores. A
generalized improved vaporizer is then described that has numerous
vapor passages close to the heat source and close to each other so
as to greatly reduce the distance between the heat source and those
surfaces of the porous material from which vapor can freely escape.
Scaling laws and formulas for the maximum heat flux rate are
presented which illustrate the extremely high heat flux capability
of the improved vaporizer which, for example, is often over an
order of magnitude better than previously available with
conventional conductively heated capillary vaporizers or even the
maximum available from nucleate boiling. Various geometries of the
improved vaporizer are then described and illustrated which allow
the new heat transfer surface to be used to advantage in such
diverse applications as boiler tubes, refrigerator evaporators,
high heat flux heat pipes, and advanced heat transfer systems such
as described in the aforementioned copending patent
applications.
In the following discussion, an appreciable use of mathematical
equations is required for a full understanding of the subject
matter to calculate the performance of the improved vaporizer. In
the following discussion, symbols for the various quantities and
parameters as set forth in the following table are employed. This
table not only sets forth the symbols employed and their nature,
but also typical units as employed in examples herein.
---------------------------------------------------------------------------
TABLE OF SYMBOLS
Typical Symbol Name or Description Units
__________________________________________________________________________
.eta. viscosity poise .sigma. surface tension dyne/cm. h heat of
vaporization/unit volume of liquid P.sub.v vapor pressure of liquid
.rho. density gm./cm..sup.3 L as subscript--liquid -- v as
subscript--vapor -- w as subscript--wick -- E as
subscript--evaporator or vaporizer -- k.sub.M heat conductivity of
capillary matrix watts/cm. K k.sub.S heat conductivity of solid
substance forming capillary matrix watts/cm. K .alpha. fluid
conductivity of capillary matrix with unit viscosity fluid
cm..sup.2 .delta. effective matrix pore surface/volume ratio 1/cm.
.epsilon..sub.w wick microstructure efficiency -- .epsilon..sub.E
vaporizer microstructure efficiency -- G vaporizer geometrical
factor -- P pressure .DELTA.P.sub.M pressure drop in pores of
capillary due to viscous drag P.sub.B bubble pressure of liquid
filled capillary material .DELTA.P.sub.F pressure differential
available to drive liquid through porous material d n
.DELTA.P.sub.g gravitational head at evaporator .DELTA.P.sub.R
other pressure differential to overcome viscous drag of fluids
.DELTA.P.sub.x sum of pressure drops external to capillary matrix T
temperature .degree. K. .theta. contact angle liquid to vaporizer
radians g acceleration of gravity F fluid flow rate cm..sup.3 /
sec. H heat flux watts z height of surface of vaporization above
bulk liquid surface cm. R radius cm. R.sub.p pore radius in
capillary matrix cm. A area cm..sup.2 A.sub.p total cross-sectional
area of pores cm..sup.2 w width of single vaporizer slab cm. t
thickness of single vaporizer slab cm. L length of heat pipe cm. x
length or distance cm. n.sub.p number of vapor passages/unit length
no./cm. a thickness of microslabs composing vaporizer matrix cm. b
thickness of microchannels in vaporizer matrix cm. d distance
between vaporizing surface regions cm. S length of vaporizer
strip-unit area of surface 1/cm.
__________________________________________________________________________
Certain simplifying assumptions are also made throughout the
following discussion, and generally speaking the assumptions do not
change the results appreciably in practical situations, including
the example set forth hereinafter. As with almost all simplifying
mathematical assumptions, extreme examples can be found where gross
error would result from the assumptions. The typical conventional
capillary vaporizers and the improved heat transfer structures
hereinafter described are not such examples.
It is assumed that liquid within the porous matrix wets the surface
with a contact angle .theta. equal to 0. This results only in a
mathematical simplicity since if the contact angle is other than 0
the surface tension .sigma. is merely replaced by .sigma.' which is
equal to .sigma. cos .theta. in all of the formulas.
The heat conductivity k.sub.M of the whole porous matrix is assumed
to be the same whether the pores are filled with liquid or vapor.
This is a good approximation leading only to minor inaccuracies for
water or organic fluids in a matrix of high thermal conductivity
metal such as silver, aluminum, copper or gold. Where this
approximation is poor, as in the case where the fluid is a
high-heat conductivity liquid metal, the parametric constants
obtained when solving equations for limiting heat flux in a
conductively heated vaporizer may change, but the mathematical form
of the equations does remain the same.
The porous material is assumed to have uniform pore size, fluid
conductivity, bubble pressure, heat conductivity and the like
throughout its defined boundaries, though in some circumstances, as
pointed out hereinafter, two or more porous materials with
different parameters are employed for improved performance.
Practical, presently available porous materials rarely have uniform
pore size, but calculations based on statistically varying pore
size distributions are unnecessarily complicated and in most
circumstances would merely introduce a geometric factor that would
not alter the comparative merit of one structure as compared with
another. If it is desired to obtain a more exact solution, the
fluid conductivity .alpha. may be measured empirically as a
function of the difference between vapor pressure and the fluid
pressure in the matrix with the results employed directly in a
numerical solution rather than calculating the fluid conductivity
from pore size distributions.
Two idealized geometrical structures are utilized in the
mathematical treatment, a wick matrix having a honeycomb like
structure that is essentially of a bundle of uniform parallel tubes
with very thin walls, and a vaporizer matrix comprising closely
spaced parallel plates of high thermal conductivity which when
optimized turn out to have a plate thickness the same as the width
of the gaps or channels between adjacent plates. While most
presently available capillary matrix structures for either wicks or
vaporizers do not approach these ideal structures closely,
calculations based on the ideal structures determine the
relationships between fluid conductivity .alpha., effective matrix
pore surface to volume ratio .delta., and the ratio of the heat
conductivity of the capillary matrix to the heat conductivity of
the solid substance forming the capillary matrix (k.sub.M
/k.sub.S), and also identify ideal performance figures with which
other real matrix structures can be compared in order to rate their
"efficiency".
Analyzing first the flow through a porous material induced by
surface tension forces as applied to capillary vaporizers, the flow
rate per unit area F/A of a fluid of viscosity .eta. through a
porous material having fluid conductivity .alpha. under a pressure
gradient dp/dx is
Also the maximum static pressure differential or bubble pressure
.DELTA.P.sub.B that can be supported across a liquid vapor
interface in a porous material having an effective pore surface to
pore volume ratio .delta. and filled with a liquid wetting the
porous material with a zero contact angle, and having a surface
tension .sigma. is
The meaning of the bubble pressure .DELTA.P.sub.B and the effective
pore surface to volume ratio .delta. is appreciated by
consideration of FIGS. A and B depicting a liquid having a surface
tension .sigma. at pressure P.sub.L in a pore of radius R which is
terminated, as at the surface of a capillary material, in the
illustration of FIG. A, or which has a vapor bubble in the pore as
in the illustration of FIG. B. In both cases the pore is assumed to
have been evacuated prior to filling with liquid so that no gasses
are present except for the vapor from the liquid. The liquid is
assumed to wet the pore wall with a zero contact angle and the
pore, liquid, vapor and surroundings are all at temperature T. The
liquid has a vapor pressure P.sub.v at temperature T so that vapor
at this pressure fills all spaces not occupied by the liquid.
It is obvious that if the pressure in the liquid P.sub.L is greater
than the vapor pressure P.sub.v, the liquid will flow to the right
in FIG. A and will collapse the vapor bubble in FIG. B, in both
cases replacing the vapor and forcing it to condense. What is less
obvious is that the liquid will remain in the capillary tube of
FIG. A and the vapor bubble will collapse in FIG. B even when the
vapor pressure P.sub.v is greater than the liquid pressure P.sub.L
so long as the sum of the liquid pressure P.sub.L and the bubble
pressure P.sub.B is greater than the vapor pressure P.sub.v. This
is due to the pressure exerted by the surface tension .sigma. in
the curved liquid-vapor interface, which acts like a stretched
elastic membrane. The pressure difference .DELTA.P across the
liquid-vapor interface is
where R.sub.1 and R.sub.2 are the principal radii of the curvature
of the interface. For a circular pore as illustrated in FIGS. A and
B, R.sub.1 =R.sub.2 =R.sub.L, the radius of the spherical
interface.
The bubble pressure P.sub.B is the maximum pressure that can be
supported across the interface
In a pore of radius R, R.sub.1min =R.sub.2min =R, so that the
bubble pressure, P.sub.B =2.sigma./R. In an infinite plane slot
between parallel surfaces spaced apart a distance b, R.sub.1min
=b/2 and R.sub.2min equals infinity so that the bubble pressure
P.sub.B =2.sigma./b.
The surface to volume ratio .delta. of the circular pore is
.delta..sub.pore =2.pi.R/.pi.R.sup.2 =2/R. The surface to volume
ratio of the infinite slot is .delta..sub.slot =2/b. Thus, in
equation 2, P.sub.Btube =.sigma..delta..sub.tube and P.sub.Bslot
=.sigma..delta..sub.slot. The relation of equation 2 is valid, in
general, for most uniform rounded cross sections without sharp
corners or reverse curved regions. Even in structures not fitting
these assumptions, an effective pore surface to volume ratio
.delta. defined as .delta.=P.sub.B /.sigma. is useful. Both P.sub.B
and .sigma. are easily measured and .delta. is dependent only on
the shape and size of the pores, that is, calculation of .delta.
from measurements of P.sub.B using fluids of different .sigma. will
always result in the same value of .delta. for a given capillary
material.
Since the liquid-vapor interface can support a pressure
differential up to the bubble pressure P.sub.B =.sigma..delta., a
pore will remain filled with liquid and any bubble formed in it
will collapse so long as P.sub.L + P.sub. b > P.sub.v or P.sub.L
+ .sigma..delta. > P.sub.v. This is the prime condition for
stable existence of liquid in the pores.
The heat flow per unit area H/A through a porous matrix of heat
conductivity k.sub.M with a temperature gradient dT/dx is
where k.sub.S is the heat conductivity of the solid substance out
of which the capillary matrix is constructed.
The parameters .eta., .sigma. and k.sub.S are properties of the
materials used in a particular embodiment, while the parameters
.alpha., .delta. and k.sub.M /k.sub.S are properties of the
microstructure of the capillary matrix. The first set of parameters
is determined by the choice of materials employed in a particular
example. It is, however, feasible to determine that matrix
structure giving the best possible combination of .alpha., .delta.
and where necessary k.sub.M /k.sub.S for a particular example
chosen. In order to approach this analysis on a stepwise basis, the
matrix structure for a wick will be analyzed first since it does
not involve the additional complicating factor of heat conduction
as is present in a vaporizer.
The ideal wick matrix, as mentioned hereinabove, comprises a bundle
of hexagonal tubes with infinitesimally thin walls forming a
honeycomb structure. The fluid conductivity of each hexagonal tube
is approximately the same as that of a circular tube of the same
area, so that for this analysis the matrix will be treated as a
bundle of circular tubes of radius R.sub.P having a total internal
area A equal to the cross-sectional area of the matrix. It might be
noted that a hexagonal tube has only about 5 percent more actual
wall area and about 2 1/2 percent more effective wall area for
determining the effective matrix pore surface to volume ratio
.delta. so that this is not a damaging assumption. The ratio of
wall area to volume .delta. of a circular pore is
It should be noted that the ratio .delta. for a bundle of N pores
is the same as that for a single pore since both the surface and
volume (actual cross-sectional area) are multiplied by N.
The fluid conductivity .alpha. of the matrix for a fluid of unit
viscosity is the fluid conduction of a single pore divided by the
area of the pore
Optimally both the fluid conductivity .alpha. and the effective
pore surface to volume .delta. should be as great as possible;
however, there is a limitation independent of the radius of the
pore that
For other microstructures than the thin-wall hexagonal tubes
.epsilon..sub.w is always less than 1. Thus, while the wick matrix
microstructure efficiency is independent of a change of scale or
size, that is .epsilon..sub.w will remain the same if the entire
matrix is uniformly expanded or shrunk, this is not true of the
surface to volume ratio .delta. or the fluid conductivity .alpha..
Thus, within the limit imposed by the wick matrix efficiency
.epsilon..sub.w remaining constant, it is possible to optimize the
fluid conductivity .alpha. and surface to volume ratio .delta. for
any given matrix microgeometry by simply changing the scale since
if x is an arbitrary dimension in an arbitrary microgeometry, then
.delta. equal C.sub.1 /x and .alpha. equal C.sub.2 x.sup.2, where
C.sub.1 and C.sub.2 are constants dependent only on the shape and
independent of the size x.
To illustrate the usefulness of the wick matrix efficiency
.epsilon..sub.w and how the parameters introduced so far determine
the operation of a simple type of heat pipe, the maximum heat flux
capacity of such a heat pipe is determined. It is assumed that this
heat pipe comprises a cylinder of capillary material of length L
and cross section A with the bottom surface just touching the
surface of a pool of liquid of density .rho., surface tension
.sigma., and viscosity .eta. which wets the capillary material with
a zero contact angle. The top end of the cylinder lies a distance z
above the liquid surface (the cylinder is not necessarily
vertical), and the top end is radiantly heated so as to evaporate
liquid from this surface. All of this above structure is enclosed
and purged so as to be free from any residual gases other than
vapor of the liquid. The pressure differential .DELTA.P.sub.F
necessary to drive a flow F of fluid through the capillary material
is
and the pressure differential .DELTA.P.sub.g necessary to overcome
the gravitational head is
Thus, the pressure differential .DELTA.P.sub.B that must be
provided by the capillary forces is
or solving for the fluid flow rate F
the maximum heat flux capacity of the heat pipe given a fluid heat
of evaporation per unit volume of h is
Assuming that the scale factor of the microgeometry of the matrix,
which has an efficiency factor of .epsilon..sub.w, can be adjusted
so as to maximize the heat flux H, since
The value of the effective matrix pore surface to volume ratio
.delta. that maximizes the heat flux is found by setting
dH/d.delta. equal 0. Finding
Thus, when one sets the scale of the matrix microstructure so as to
maximize the heat flux H, it is the matrix wick efficiency
.epsilon..sub.w that remains to determine the maximum heat flux
capability H.sub.max of the heat pipe. This is true not only in
this particular example but in all cases where the capillary matrix
acts purely as a wick for liquid flow, that is where it does not
also transmit heat as part of its function. In the more general
case where a pressure differential .DELTA.P.sub.R must also be
present for the circulation of vapor within the heat pipe and
possibly for circulating liquid in a portion external to the wick
equation 14 is readily modified by adding .DELTA.P.sub.R to the
.rho.gz term and letting .DELTA.P.sub.x =.DELTA.P.sub.R +.rho.gz,
that is .DELTA.P.sub.x is set equal to all of the "external"
pressure differences in the total fluid flow system, that is, all
the pressure differences except that required to overcome the
viscous drag in driving the liquid through the capillary matrix
being considered. Then
where .delta..sub.maxH =2.DELTA.P.sub.x /.sigma.. Since
.DELTA.P.sub.R is generally a function of the vapor flow rate in
the heat pipe and hence of the total heat flux, (15) is generally
at least cubic in terms of the heat flux H, and the equation is
most easily solved by numerical approximation rather than an
analytic solution.
In the example just set forth, the liquid is vaporized from a
surface opposite to the surface from which liquid is introduced to
the wick. An almost identical set of formulas results when the
liquid is evaporated from a side adjacent to the side where the
liquid is introduced. FIG. 1 illustrates a rectangular slab of
capillary material with a width w and thickness t with w much
greater than t and of indefinite length x. Liquid is introduced to
the capillary material at the side having a cross sectional area tx
and evaporated from the adjacent face having an area wx, with the
heat for vaporization being supplied to that face by radiant
heating, for example. Thus, the maximum heat flux capability of the
capillary material is
When the effective matrix pore surface to volume ratio .delta. is
selected to maximize the heat flux H
where once again .delta..sub.maxH =2.DELTA.P.sub.x /.sigma..
Equations 16 and 17 are only strictly accurate when w is very much
greater than t and can, where more accuracy is required,
incorporate a geometrical shape factor G.sub.R which is always less
than 1 but approaches 1 as t/w approaches zero. The shape factor
G.sub.R must in general be calculated numerically for each
particular case and when included in the equations the heat flux is
found by
The function of the capillary matrix is considerably different and
somewhat more complicated when it is used as a conductively heated
vaporizer rather than merely a simple wick since it must conduct
both liquid and heat to the surface at which the liquid vaporizes
so that the heat conductivity k.sub.M of the matrix becomes
important. The surface tension forces between the liquid and matrix
must also support an additional pressure differential since
portions of the matrix must be hotter and therefore the liquid
vapor pressure in that portion greater than at a surface of
vaporization. This is so for causing heat to flow to the surface of
vaporization from the hotter region.
The only exception to this situation in a conductively heated
vaporizer (that is, where the heat is transferred to the surface of
vaporization by conduction through the porous matrix and not by
radiation or convection) is when the surface of vaporization lies
within the capillary matrix between the heat and liquid sources.
Under these circumstances, the vapor must escape from the capillary
matrix by flowing through the pores in the matrix. This is a severe
restriction on operation as can be seen from the situation for
water and water vapor at 100.degree. C where the mass flow rate of
liquid water through a porous material under a selected pressure
differential is about seventy times the mass flow rate of water
vapor through the same porous material under the same pressure
differential. This is due to the much lower density of the water
vapor and thus the much higher flow velocity required to give the
same mass flow rate. The higher velocity far outweighs the effect
of the lower viscosity of the vapor. Also, when the vaporization
surface is between the heat source and the liquid source, the vapor
produced may be largely blocked from escaping since it cannot flow
through the same capillaries occupied by the liquid. Hence, such an
arrangement is not practical structure for most situations. The
examples set forth herein are thus limited to structures where the
surface of vaporization coincides with a surface of the porous
matrix from which vapor may easily escape.
The simplest structure of this type comprises a substantially
rectangular strip of capillary material of width w, thickness t and
length x which is fed with liquid through one face of area tx and
heated through one of the adjacent two faces having area wx. So far
this is exactly the same as the case of the radiantly heated
vaporizer strip hereinabove described. In this latter case,
however, the face wx is heated conductively through an impervious
wall adjacent the face so that vapor can no longer escape from that
face but must escape from the opposite face as illustrated in FIG.
2.
A heat flux density H/A.sub.v =H/wx must pass through the strip
normal to the face wx requiring a temperature gradient dT/dy to
cause heat flow, where
The increase in vapor pressure .DELTA.P.sub.v of the liquid between
y=0 and y where y is the distance of the liquid-vapor interface
from the free or vaporizing surface, is
The pressure gradient dP.sub.M /dz in the liquid necessary to force
the liquid through the matrix is
The pressure in the matrix P.sub.M is assumed to be a function of
only z, that is the liquid flows only in the x direction. This is
an approximation that becomes exact as the thickness decreases and
width increases, that is t/w approaches zero.
The position y of the internal liquid-vapor interface for maximum
heat flux is determined from equations 20 and 22 since along the
liquid-vapor interface .DELTA.P.sub.v -.DELTA.P.sub.M equals a
constant. At maximum heat flux H.sub.max the liquid filled portion
of the capillary will just reach the end in a thin wedge. That is,
the thickness y=0 at a distance z=w. This can be seen since if
y>0 at the far edge of the matrix, then the heat flux could be
increased and, on the other hand, if y<0 at the far edge, then
the heat flux density must be decreased until the liquid extends
across the entire capillary matrix. Also dP.sub.M /dz=dP.sub.v /dz.
Therefore equating the derivitives and solving for dy/dz
##SPC1##
The thickness y is then substituted back into equations 21 and 23
to find ##SPC2##
In some situations, the liquid must be lifted into the vaporizer
region of the capillary matrix against a gravity head
.DELTA.P.sub.g =.rho.gz, and also against a pressure differential
.DELTA.P.sub.R necessary to cause liquid and vapor flow around the
remaining fluid flow circuit of a heat pipe or the like. Then
assuming that .DELTA.P.sub.x is the sum of the gravity head,
driving pressure differential, and other pressure drops external to
the capillary matrix, there is a pressure balance at maximum heat
flux where ##SPC3##
Equation 31 is true when the maximum value of y is equal to or less
than the thickness t so that
It should be recognized that equations 33 and 34 are approximations
since the pressure in the matrix P.sub.M is assumed to be a
function of z only, that is dP.sub.M /dy=0. This is strictly true
only when the liquid flow is normal to the heat flow at all points,
which is the case when the ratio of thickness to width t/w is very
small. For structures where t/w is relatively large, geometrical
correction factors G.sub.1 and G.sub.2 can be added to the
equations. These correction factors are dependent only on the
geometry and approach 1 when the liquid flow becomes nearly
perpendicular to the heat flow. Generally G.sub.1 and G.sub.2 must
be calculated numerically or by analog means.
Equations similar to Equations 33 and 34 can be derived for any
strip geometry (at least where the faces are not extremely concave)
that can be formed from the rectangular geometry hereinabove
described by stretching or shrinking the strips in such a manner
that they are stretched or shrunk in the same amount in the y
direction as in the z direction at each point. The same limitation
that the heat and liquid flows are substantially normal to each
other still exists. The resulting equations, including the
geometric factors, are ##SPC4##
replaces 1/.sub.t in equation 34.
A truncated wedge geometry formed from a sector of a flat circular
disk of radius R.sub.1 and truncated at radius R.sub.0 with liquid
applied to the arcuate face and the heating and vaporizing surfaces
being the two radial faces forms a particularly useful example of
the generalized geometry. Here letting dy=d.theta. and dx=dR/R so
that
where 1/t is the mean value of 1/t.
Thus equation 35 remains unchanged and equation 36 becomes
The general equation 35 for maximum heat flux as limited in range
by equation 36, is applicable to substantially all of the
structures of interest. Equation 36 limits the ratio of effective
matrix pore surface to volume ratio .delta. which can be considered
and thus limits the pressure difference .DELTA.P.sub.x external to
the vaporizer against which the vaporizer can operate since
.DELTA.P.sub.x <.sigma..delta.. This is not a significant
limitation in most vaporizer designs, such as in heat pipes or
surfaces exposed directly to bulk liquid, since in these cases
.DELTA.P.sub.x is small.
A general equation similar to equation 36 for the situation where
##SPC5##
and when equation 40 is maximized with respect to .delta., ##SPC6##
This
The geometrical factors G.sub.1 and G.sub.2 in these equations,
while both approaching 1 as the liquid flow direction approaches
being perpendicular the heat flow direction, are no longer solely
dependent upon the geometry but are also somewhat dependent on C
(equation 40A). This is true since the internal liquid-vapor
interface position for maximum heat flux varies with C in this
case, thus changing the localized flow geometry. Thus is to be
contrasted with equations 35 and 36 wherein the flow geometry for
maximum heat flux is independent of any other variables.
When C is small the values for H.sub.max /x given by equation 41
closely approach those given by Equation 35. For the case when C is
very large, the maximum heat flux H.sub.max / X approaches
which is the same as Equation 19 for the radiantly heated
evaporator where G.sub.1 /G.sub.2 =G.sub.R and (1/t) =1/t. This is
to be expected since the liquid fills almost the entire porous
matrix at high values of C.
Due to its relative simplicity, Equation 35 for maximum heat flux
H.sub.max /x is employed hereinafter although equation 41 can be
substituted in its place as desired in applications involving high
values of .DELTA.P.sub.x or C.
The temperature drop .DELTA.T.sub.v across the vaporizer capillary
matrix between the heated surface and the surface where liquid is
vaporizing is
This temperature drop is generally quite small, being on the order
of only a fraction up to several degrees centigrade, with the
higher values corresponding to higher values of heat flux H/x and
external pressure drop .DELTA.P.sub.x.
In order to provide comparisons of performance parameters in a
vaporizer surface structure, an efficiency factor .epsilon..sub.E
for the matrix structure is desirable. The efficiency
.epsilon..sub.E of a selected capillary matrix microstructure is
defined as the ratio of the maximum heat flux H.sub.max /x for a
vaporizer constructed with the capillary matrix microstructure
relative to that of a vaporizer constructed with an ideal capillary
matrix microstructure. Both matrices are made of the same material
and all the other conditions are identical except for the
microstructure. To implement this an ideal matrix microstructure
geometry must be selected.
In equation 35, the only parameters dependent on the capillary
matrix microstructure are .epsilon..sub.w and k.sub.M. Further
.epsilon..sub.w is dependent only on the microstructure, while
k.sub.M is divisible into two factors, the heat conductivity
k.sub.S of the material the matrix is constructed of, and the
relative heat conductivity of the matrix k.sub.M /k.sub.S which is
dependent only on the matrix structure. Thus, the ideal geometry is
one that maximizes the factor .epsilon..sub.w k.sub.M /k.sub.S
which is proportional to .alpha..delta..sup.2 k.sub.M /k.sub.S. A
suitable standard or "ideal" vaporizer microstructure is one
composed of parallel sheets of heat conducting material of
thickness "a" mutually spaced apart to form channels therebetween
of width "b." For this structure, ##SPC7##
The righthand term in equation 48 is maximized when a=b
##SPC8##
The evaporator matrix efficiency factor .epsilon..sub.E is then
defined so as to equal 1 for the "ideal" vaporizer matrix
microstructure
Using equation 54, equations 35 and 36 for maximum heat flux are
rewritten in terms of the efficiency factor .epsilon..sub.E as
##SPC9##
It is instructive to compare the maximum possible heat flux per
unit length of the radiantly heated vaporizer (equation 19) with
that of the conductively heated vaporizer, assuming ideal
situations wherein .epsilon..sub.w =.epsilon..sub.E =1; G.sub.C =1;
G.sub.R t/w=1 and .sigma..delta. is very much greater than
.DELTA.P.sub.x ##SPC10##
Substituting the appropriate numerical values for water and copper
at 100.degree. C. ##SPC11##
In many cases, the total pressure head .DELTA.P.sub.x is in the
order of from about 10.sup.4 to 10.sup.5 dynes per square
centimeter. That is equivalent to a pressure head of from about 10
to 100 centimeters of water and
Thus, except at unusually high gravity heads or other external
pressure drops, a conductively heated vaporizer strip is limited to
far lower heat flux density than a comparable radiantly heated
vaporizer strip. Since in most cases of interest, the object of the
heat transfer surface is to remove heat from a hot surface or body
where the heat radiated is far less than the heat it is necessary
to remove, the heat usually must be transferred to the vaporizer
conductively. Thus, any means for overcoming the heat flux
limitation of the conductively heated vaporizer is desirable as
leading to greatly increased utility for the structure.
The new type of conductively heated capillary vaporizer surface,
described herein, avoids the heat flux limitation caused by
overheating of the porous matrix and the consequent displacement of
the liquid from it. This is accomplished by keeping the heat from
having to be conducted very far through the matrix and particularly
from having to be conducted across the principal width of the
matrix supplying the liquid. On the other hand, as pointed out
hereinabove, it is desirable to have the surface of vaporization
coincide with a surface of the porous matrix from which the vapor
may escape with minimum restriction.
It is, therefore, an important feature of the capillary vaporizer
surface structure described herein that passages are provided in
the vaporizer structure which form, or connect to, cavities forming
surfaces in the capillary matrix material near the heat source
where the liquid is vaporized and from which the resulting vapor
may escape from the capillary matrix. The passages may lie in
either or both the capillary matrix material or the material
between the heat source and the capillary material so long as the
passages expose, or connect to cavities exposing, surfaces of
capillary material and provide for the escape of vapor formed at
these exposed surfaces.
In a preferred embodiment for large areas and high heat flux
densities, there are a hierarchy of vapor passages wherein very
numerous, very small passages feed vapor into larger, less numerous
passages which may, in turn, feed into a few rather large passages.
Capillary arrays of this type simultaneously minimize the pressure
differential necessary to cause vapor flow from the array and also
minimize the amount of capillary material removed or deleted to
form the passages and thus not available for liquid transport. This
array also allows a network of very closely spaced passages which
form, or are connected to, regional areas of vaporization, to be
placed adjacent the heated surface of the capillary material.
Elaborate arrays having a multiple step hierarchy of passages are
not necessary in many heat transfer situations. Thus, for example,
an inexpensive very high heat flux "boiling" surface which is in
contact with bulk liquid with which vapor may freely mix, for
example, simply provides a layer of capillary material perforated
by a large number of slits or holes reaching from the bulk liquid
surface through or almost through the capillary material to the
heat source surface. In such a heat transfer surface structure, the
gross heat and liquid flows are in opposed direction, although
within the capillary material, heat flow is substantially normal to
liquid flow.
FIG. 3 illustrates in perspective a capillary vaporizer surface
constructed according to principles of this invention. As
illustrated in this embodiment, there is a heat source wall 11,
preferably of a relatively high thermal conductivity metal. The
heat source wall may, for example, be a wall separating heat
transfer fluids in a heat exchanger, or may be a surface portion of
a heat producing electronic component or the like.
In intimate thermal contact with the heat source wall 11 is a
channeled layer of porous material having a high efficiency
.epsilon..sub.E. It is to be understood that, as used herein, the
term "porous" is meant to include capillary materials whether the
capillary liquid conduits are strictly "pores" or not. Thus, for
example, a solid surface with grooves or a folded foil might be
used instead of a porous matrix in some embodiments. Also, in
describing a capillary as having a larger or smaller pore size,
what is specifically meant is that the capillary structure has a
lower or higher value, respectively, of the effective pore surface
to volume ratio .delta., rather than any particular dimension of
the capillary structure. The channeled layer adjacent the wall 11
can be considered to be a plurality of parallel spaced apart strips
12 of porous material joined to the heat source wall 11.
Preferably, the strips 12 are flared in the portion adjacent the
heat source wall so that a substantially continuous layer of porous
material is provided on the heat source wall with the thickness of
the layer increasing from a very small thickness intermediate the
strips to an appreciable thickness in the principal portion of the
strip. Each of the strips 12 is overlaid by a strip 13 of similar
size having a larger pore size (that is, lower .delta.) than the
porous material forming the strips 12. The larger pore size
material 13 acts as a temporary reservoir of liquid during
operation of the capillary vaporizer surface.
In a typical embodiment, the surface illustrated in FIG. 3 is
employed as a so-called boiling heat transfer surface where the
surface is in contact with bulk liquid that is free to mix with
vapor produced at the surface, that is, the liquid reaching the
porous capillary vaporizer is not previously confined within a
capillary wick adjacent the vaporizer. It should be noted that this
capillary vaporizer surface is not employed exclusively in a
situation where the surface is immersed in a body of liquid but may
be employed in a situation where the surface is intermittently
wetted by a liquid and intermittently exposed only to vapor as may
occur in a high flow rate heat exchanger. In this situation, the
period of time that the surface is not wetted by liquid is
extremely short. Therefore, a relatively small strip 13 of larger
pore material can act as a temporary liquid reservoir of sufficient
capacity to provide liquid to the vaporizer during the intervals
that the local surface is not wetted.
During operation of the heat transfer surface illustrated in FIG. 3
heat flows through the wall 11 and into the porous vaporizer strips
12 at their wide portions. Liquid contacts the vaporizer strips
primarily in the larger pore portion 13, and due to surface tension
forces flows through the coarser pored material to the finer pored
vaporizer strips 12. Heat also flows through the vaporizer strips
12 and vaporization of liquid occurs primarily at the very large
number of regional areas formed by the sloping bottom surfaces 14
in the channels between the strips. These surfaces are nearest heat
source wall, so that the heat need flow only through a relatively
short path of vaporizer, and the surfaces are also adjacent the
channels so that the vapor formed can freely escape from the
capillary vaporizer surface without passing through the pores.
It should be observed that the width and height of the strips of
porous material on the heat transfer surface are quite small, and,
for example, may be about 0.002 to about 0.04 inch. The smaller
sizes are preferable from the point of view of enhanced heat
transfer since a greater total length of strips can be accommodated
on a surface of given area. As pointed out hereinabove, a greater
heat transfer rate can be obtained since the rate is dependent on a
total length of strip and is not affected by the size of the strip,
and close packing of small strips gives higher heat flux density
than fewer longer strips. The smaller strips are, however, somewhat
more difficult to fabricate, and in order to avoid expense, some
sacrifice may be made in heat transfer characteristics and large
strips may be employed.
A porous capillary vaporizer, as illustrated in FIG. 3, is readily
made by bonding a layer of high efficiency porous material to the
heat source wall, preferably by diffusion bonding to avoid plugging
pores, and in a similar manner a layer of coarser pored material is
bonded on the finer material. The surface can then be grooved to
produce the structure illustrated in FIG. 3. It will also be
apparent that the two-layer structure is not required in all
situations, and a less expensive structure can be prepared with a
single channeled layer on the heat source wall.
FIGS. 4 and 5 illustrate in two perpendicular cross sections a
compound capillary vaporizer surface incorporating principles of
this invention. As illustrated in this embodiment there is a heat
source wall 21, which, as before, is preferably a high thermal
conductivity metal through which heat flows into the capillary
vaporizer from some heat source (not shown). Immediately adjacent
and in intimate thermal contact with the heat source wall are a
plurality of capillary vaporizer strips 22 formed of a porous
material having a high efficiency .epsilon..sub.E. The strips are
placed in close proximity to each other so that there are a
plurality of channels therebetween, and the width and height of the
strips 22 is preferably in the same order as those strips
illustrated in FIG. 3.
The strips 22 may have a cross section such as illustrated in FIG.
3, or may merely be rectangular strips either in direct contact
with the heat source wall or with a thin layer (a few mils) of
additional porous material uniformly covering the heat source
wall.
Liquid is delivered to the vaporizer strips 22 in the compound
vaporizer surface by somewhat larger strips 23 running
approximately perpendicular to the smaller strips 22 on the heat
transfer surface. The larger strips 23 are spaced apart to leave
channels 24 therebetween that are larger than the channels between
the smallest strips 22. Overlying the larger strips 23 are bars 26
running approximately perpendicular to the larger strips 23 and
parallel to the heat source wall 21. The bars 26 are mutually
spaced apart to leave channels 27 therebetween that are appreciably
larger than the channels 24 between the larger strips 23. The
larger strips 23 and bars 26 are made of a porous material having a
high wicking efficiency .epsilon..sub.w and would normally have
larger pores (that is, lower .delta.) than the smallest strips 22
immediately adjacent the heat source wall.
As an example of the scale involved, the bars 26 may in one example
be about 0.016 inch wide and 0.032 inch high in a direction normal
to the heat source wall. The size of the bars can, in general,
range upwardly from these values, It might also be noted that the
strips 23 and bars 26 being made of the same material, can be made
in a single operation wherein one ridged die is pressed towards
another ridged die with the ridges of the two dies perpendicular to
each other. This combination of bars and strips can also be made
from a slab of porous material by cutting the channels 24 in one
direction and the channels 27 in opposite direction sufficiently
deeply to intersect.
Overlying the bars 26 and in intimate contact therewith are still
larger bars 28 running parallel to the heat source wall, and
approximately perpendicular to the smaller bars 26. The larger bars
28 are mutually spaced apart to form channels 29 therebetween that
are larger than the channels 27 between the smaller bars 26. These
larger bars are preferably made with an even larger pore diameter
(that is, lower .delta.) than the smaller bars 26. These larger
bars act as temporary liquid reservoirs during operation of the
capillary vaporizer.
In operation, liquid contacts the larger bars 28 either as bulk
liquid in intermittent contact with the exposed faces of the bars
or in some embodiments by an additional wick (not shown) bringing
liquid thereto. The liquid flows from the larger bars 28 under
surface tension forces, as hereinabove described, into the smaller
bars 26 and thence into the strips 23 closer to the heat source
wall. These bars and strips do not have any substantial heat flow
therethrough and behave as wicks for conducting liquid to the
smallest strips 22 in contact with the heat source wall 21. Thus,
the larger strips and bars service as a liquid distribution system
for bringing liquid to the smallest strips 22 where it flows to the
interfaces between the strips 22 and the channels between them,
from which interfaces it evaporates into the channels. These
interfaces are, thus, regional areas of vaporization "formed" by
the channels. In some embodiments a thin layer of porous material
may be provided over the entire heat source wall 21. Such a layer
makes little difference in the maximum heat flux capability of the
vaporizer but can appreciably reduce the temperature across it. The
regional area of vaporization as used herein includes the
interfaces of adjacent strips (in this embodiment) on opposite
edges of the channel and the porous layer, if any, adjacent the
heat source surface.
The vapor that is formed in the channels between the smallest
strips 22 flows into the channels 24 between the larger strips 23.
The vapor either flows directly into the larger channels or may
pass for a short distance parallel to the heat source wall before
reaching one of the larger channels 24. The distance that the vapor
need flow through the small channels between the smallest strips 22
is quite short, so that there is as little as possible flow
resistance in that short passage.
The vapor within the passages 24 between the larger strips then
flows into the still larger channels 27 between the bars 26. The
vapor flows through the larger channels into the still larger
channels 29 between the largest bars 28 and thence escapes from the
capillary vaporizer. Thus, it will be seen that there is a liquid
flow path through the successively smaller and more numerous bars
28 and 26 and the strips 23 to the smallest and most numerous
strips 22. The vapor flows countercurrent to the liquid in a
parallel path from the smallest and most numerous channels through
the successively larger and less numerous channels 24, 27 and 29.
The liquid flow path is thus separated from the vapor flow path,
and there is no interference between the counterflowing fluids.
The liquid flows through porous materials having successively
smaller pore sizes (larger .delta.) so as to support the increased
pressure differentials due to viscous drag and due to the
increasing vapor pressure from the increasing temperature. As the
cross sections become smaller, the number of flow paths increases
so that the total area available for liquid flow remains
substantially constant throughout the structure in any plane
parallel to the heat source wall and the length of the path over
which the liquid flows also decreases so as to minimize the liquid
pressure drop. In a similar manner, the vapor flows through
successively smaller numbers of successively larger channels to
escape from the structure, and the overall area available for vapor
flow remains substantially constant in all planes parallel to the
heat source wall. It is generally preferred that the
cross-sectional area available for vapor flow and liquid flow be
about equal since this yields a near optimum overall heat transfer
efficiency for the capillary vaporizer over a broad range of
operating conditions.
Both of the structures hereinabove described and illustrated in
FIG. 3, and in FIGS. 4 and 5 can be considered as vented capillary
vaporizers since holes or passages are provided for escape or
venting of vapor from the capillary matrix. Determination of the
performance characteristics of a vented capillary vaporizer divides
into two parts (1) the vaporizing surface structure, including the
heated surface and the immediately adjacent capillary material and
passages, that is, the region where heat conduction through the
matrix and evaporation from the passage walls take place, and (2)
the liquid distribution and vapor collection manifolds wherein
fluid flow occurs and heat flow can be ignored.
Considering the second part first, the liquid may be distributed
directly to the capillary material forming the vaporizing surface
structure, that is, the layer of capillary material immediately
adjacent the heat source surface, as in the simple "boiling"
surface structure hereinabove described and illustrated in FIG. 3,
wherein the vapor is likewise directly collected and discharged
into the same region that supplies the liquid so that the liquid
and vapor are comingled. In this type of structure, any heat flux
limitations lie either in the vaporizing surface structure, or in
"mechanical" interference between the incoming liquid and outgoing
vapor, which is best determined empirically since the general
mathematical solution of the dynamic situation without liquid or
vapor manifolds is exceedingly complex.
In a structure as hereinabove described and illustrated in FIGS. 4
and 5, the liquid is distributed to the vaporizing surface
structure by capillary material which also contains passages for
the vapor to escape. The liquid flow is calculated in the same
manner as hereinabove described wherein equations 11 and 15, or18
and 19 were derived utilizing the fluid parameters: density .rho.,
heat of vaporization per unit volume h, surface tension .sigma.,
and viscosity .eta.; and the matrix parameters: fluid conductivity
.alpha., pore surface to volume ratio .delta., and wick matrix
microstructure efficiency .epsilon..sub.w ; and pressure
differences external to the vaporizer, such as .DELTA.P.sub.g and
.DELTA.P.sub.R.
Generally the same calculation procedure is employed. The pressure
drop across the matrix required to force the desired fluid flow
rate is calculated in terms of the fluid properties, the external
pressure differences, and .alpha. and .delta.. Then the equation
.alpha.=.epsilon..sub.w /2.delta..sup.2 is used to eliminate
.alpha. in favor of the efficiency factor .epsilon..sub.w which is
not dependent on scale or size. The external pressure differences
are added and the result set equal to .sigma..delta. and solved for
the fluid flow rate. The expression for the flow rate is then
differentiated with respect to .delta., set equal to zero , and
solved for .delta. so as to get the value of .delta. giving the
maximum flow rate. A capillary matrix structure is then selected
having a .delta. as close as possible to that calculated and
efficiency factor .epsilon..sub.w as high as possible and the
actual values of .delta. and .epsilon..sub.w entered in the
equation for the flow rate, thus giving the solution.
The pressure drop due to vapor flow in the passages is calculated
using standard techniques for fluid flow. Care must be taken in
these calculations since the vapor flow often shifts from laminar
in the smaller passages to turbulent flow in the larger passages.
The pressure drop thus calculated is included as one of the
"external" pressure drops in the liquid flow calculations. In
finding the vaporizing surface characteristics, it is important to
note that the use of multiple passages to vent a capillary
vaporizer does not alter the basic equations 55 and 56 giving the
maximum heat flux per unit length, and the maximum values of
.sigma..delta. or P.sub.x for a conductively heated capillary
vaporizer strip. Multiple vapor passages in the vaporizing surface
structure, however, permits the use of as large a number of
vaporizer strips per unit length as is necessary to obtain the
desired heat flux density. Thus, for example, a passage through a
porous material adjacent and parallel to the heat source surface
creates two vaporizer strips, one on each side thereof, each
capable of the heat flux per unit length given in equation 55.
Thus, increasing the number of passages adjacent the heat source
surface, increases the maximum available heat flux proportionately
until a limit is reached wherein the resistance to vapor flow
becomes excessive due to the small size of passages.
The increase in heat flux occurs since the flux is not dependent on
scale, i.e., size, but only on shape.
In the same manner as for parallel strips, a hole normal to the
heat source surface penetrating through or nearly through the
capillary matrix produces a circular vaporizer "strip" around the
hole where it approaches the heat source surface and such a hole
also serves to increase the heat flux capability of the surface,
although due to the unusual shape of the "strip", quantitative
determination of the increase is mathematically more difficult.
Calculation of the maximum heat flux per unit heat source area
H.sub.max /A.sub.v for any selected vaporizer surface structure is
straightforward when the evaporator strip shape efficiency factor
G.sub.1 and the fluid and matrix parameters are known, since
where S is the total length of the vaporizer strips per unit heat
source area. Thus, for example, if there are n.sub.p passages per
unit distance, forming an equal number of regional areas of
vaporization, each of which is composed of two vaporizer strips,
side by side and parallel and adjacent to the heat source surface,
then S=2n.sub.p and
Thus, the heat flux density is directly proportional to the density
of passages.
The geometrical shape efficiency factors G.sub.1 and G.sub.2 may
pose appreciable difficulty in mathematical determination except
for a few very simple shapes, such as a thin rectangular slab or a
wedge. For other shapes, either rough estimates can be made based
on similarities to the thin slab or wedge shapes or analog or
numerical solutions must be resorted to. This, however, does not
interpose any substantial difficulties since, as pointed out
hereinabove, each shape has a single numerical value for the
factors G.sub.1 and G.sub.2 independent of any other factor. Thus,
all scaling and size laws are implicit in equation 55 and do not
require a knowledge of the geometrical factors G.sub.1 and G.sub.2
which are required only when the numerical value of the maximum
heat flux must be calculated and not when the effect of various
parametric changes is required. Generally, it is preferred to use
structures having as high a value of the geometrical shape factor
G.sub.1 as possible to maximize the heat flux per unit area
H.sub.max /A.sub.v. Therefore, structures described herein are
selected to have an estimated value for the geometrical factor in
the range of about 0.5 to 1.0.
In order to illustrate the magnitude of the heat flux densities
involved in the improved vented capillary vaporizer, constants
appropriate to water in a copper matrix at 100.degree. C are
employed in equation 61. First, the product of surface tension
.sigma. and effective pore surface to volume ratio .delta. is found
from equation 56 ##SPC12##
Further assuming reasonable values for the geometric constant
G.sub.2 =1, efficiency of the vaporizer matrix .epsilon..sub.E =0.2
thermal conductivity ratio k.sub.S /k.sub.M =4 and a geometry w 1/t
=1 then the product .sigma..delta. 1.18.times.10.sup.6
dynes/cm..sup.2 which is slightly over one atmosphere. It might be
noted that for the "ideal" case, where .epsilon..sub.E =1, and
k.sub.s /k.sub.M =2, then the product
.sigma..delta.=2.94.times.10.sup.6 dynes/cm..sup.2 Usual operating
conditions for a vaporizer have "external" pressure gradients
.DELTA.P.sub.x values ranging from about 10.sup.4 to about
2.times.10.sup.5 dynes/cm..sup.2, that is about 10 centimeters to 2
meters equivalent water head. Higher values of .DELTA.P.sub.x can
be dealt with as indicated in equations 39 through 42.
Now finding the maximum heat flux per unit area H.sub.max /A.sub.v
for water in a copper matrix at 100.degree. C. ##SPC13##
Further assuming that G.sub.1 =0.8, .epsilon..sub.E =0.2, and
.DELTA.P.sub.x =.sigma..delta./4, then H.sub.max /A.sub.v
=34.5n.sub.p watts/cm..sup.2 and .DELTA.P.sub.x =3.0.times.10.sup.5
dynes/cm..sup.2.
Theoretically, the number of vapor passages, or regional areas of
vaporization, per unit length n.sub.p can be made as large as
desired, and only limit on H.sub.max /A.sub.v lies in the fact that
the external pressure .DELTA.P.sub.x contains a term equal to the
pressure drop due to the vapor flow out of the vaporizer and
through the rest of the system, if any. This term is usually one to
10 times the maximum vapor velocity pressure .rho..sub.v .sup.v /2
for most vaporizer designs with the simple structures of FIGS. 3, 4
and 5 being close to one. Thus the external pressure drop
.DELTA.P.sub.x increases with increasing heat flux H.sub.max
/A.sub.v, thereby decreasing the term
(.sigma..delta.-.DELTA.P.sub.x). As a practical matter there are
also other considerations with very large values of n.sub.p since
construction of the vented vaporizer becomes increasingly difficult
as the passages or channels become smaller, and also higher values
of the effective surface to volume ratio mean smaller pores which
are clogged more easily by deposits left when the liquid
evaporates.
Thus, for example, a vaporizing surface structure suitable for many
applications would have a number of channels n.sub.p of about 40
per centimeter, that is, about 0.010 inch between channels. This
gives a maximum heat flux per unit area of about 1,380 watts per
square centimeter for water in a porous copper matrix at
100.degree. C. A vaporizer surface structure for spot cooling a
small area, such as an electronic device, may have as many as 200
channels per centimeter so that the maximum heat flux H.sub.max
/A.sub.v is in the order of 6,900 watts per square centimeter for
water in a copper matrix at 100.degree. C. These heat flux
densities are more than an order magnitude above those that are
usually available with pool boiling, for example, which has a
maximum heat flux of about 100 watts per square centimeter for
water at atmospheric pressure. MOst other vaporization or
convective cooling systems have even lower heat flux densities than
pool boiling.
FIG. 6 illustrates in cross section a single vaporizer strip
structure similar to that illustrated in FIG. 3. The structure
includes a heat source wall 31, which is impervious to liquid and
vapor and through which heat flows to the larger parallel face of a
trapezoidal cross section vaporizer strip 32 formed of relatively
small pore, high thermal conductivity porous material. On the
smaller parallel face of the trapezoidal vaporizer strip 32 is a
feeder strip 33 of relatively larger pore material in intimate
contact with the smaller pore material of the vaporizer. The liquid
(not shown) is at least intermittently in contact with the feeder
strip 33, and the liquid flows through the porous matrix to the
sloping faces 34 of the trapezoidal strip as indicated by the solid
arrows. Vaporization of the liquid occurs principally at the
surfaces 34, and vapor escapes from the region between the strip
and an adjacent similar strip as indicated by the dashed
arrows.
The vaporizer strip structure illustrated in FIG. 6 essentially
forms two vaporizer strips in the sense that S is used in equation
60, or it can be considered that the space on either side of the
porous material is combined to be equivalent to one passage.
Equation 61 may therefore be used to calculate the maximum heat
flux density, with n.sub.p being the frequency of vaporizer strip
structures on the surface. The vaporizer strip structure
illustrated in FIG. 6 can be considered to be formed of two
truncated sectors having liquid entering from one face, heat
entering from a second face, and vapor escaping from a third face,
with the direction of heat flow and liquid flow being substantially
perpendicular. Approximate calculations for such a structure
indicate a geometrical shape factor G.sub.1 of about 0.8 to 0.9 for
this geometry.
FIG. 6 also shows by a dashed line 36 an internal liquid-vapor
interface within the porous matrix of the vaporizer. This interface
36 arises since the heat source wall is at a higher temperature
than the vaporizing surface 34 in order for heat to flow from the
wall to the surface. When operating at high heat flux densities
there is a region near the heat source, as indicated by the
interface line, where the temperature in the matrix is sufficiently
high to drive liquid from the pores and replace it with vapor. At
low heat flux, the difference in temperature across the vaporizer
will be relatively low, and the interface 36 will be relatively
nearer the heat source wall or may disappear when the matrix is
completely liquid filled. When the heat flux is high, the
temperature gradient will be higher, and the interface will be
relatively nearer the vaporizer surfaces. Eventually there is a
maximum continuous heat flux which cannot be exceeded without the
internal liquid-vapor interface moving so near the surface as to so
"choke" the liquid flow that insufficient liquid is supplied to
replace that vaporized, leading to a "drived-out" condition and
possibly damage to the structure. The heat transfer surface
structure will accommodate any heat flux less than the maximum
available.
FIG. 7 comprises a capillary vaporizer surface structure which can
be considered to be a detail of a larger structure such as
illustrated in FIGS. 4 and 5. As illustrated in FIG. 7, the heat
source wall 21 has a smaller strip 22 in intimate thermal contact
therewith, and the strip 22 is also in contact with a larger feeder
strip 23 of larger pored material. As seen in this detail, liquid
flows from the larger strip 23 through the smaller vaporizer strip
22, which can for purposes of calculation be considered to be two
connected vaporizer strips. The liquid flow is indicated by solid
arrows in FIG. 7 and vapor flow from the side faces 38 of the
vaporizer strip 22 is indicated by dashed arrows.
As in FIG. 6, a vapor-liquid interface 39 occurs within the
vaporizer strip bounding the region where the temperature is high
enough that only vapor is stable, and the lower temperature region
where liquid is stable within the porous matrix. The three
dimensional shape of the interface 39 is complicated by the fact
that liquid also flows through the vaporizer strip 22 in a
direction along its length, that is, normal to the plane of the
paper in FIG. 7, and the interface is further from the heat source
wall in the portion of the smaller strip 22 between the larger
feeder strip 23 and the wall, then it is beneath a channel 24 (FIG.
5) between a pair of feeder strips 23.
FIGS. 8, 9 and 10 illustrate alternative detailed structures of a
capillary vaporizer surface structure incorporating principles of
this invention. In each of these figures, A single vaporizer strip
structure and one-half of a channel on each side thereof is
illustrated, and it will be understood that similar parallel
structures occur repetitively on the heat transfer surface.
As illustrated in FIG. 8, a heat source wall 41 is coated with a
continuous layer 42 of fine pored, relatively high thermal
conductivity vaporizer material, from the opposite surface of which
vaporization occurs as indicated by the dashed arrows. A larger
pore size feeder strip 43 seen in cross section has a narrowed
portion with a small face 44 in contact with the vaporizer strip
42. Liquid flows from the feeder strip 43 to the vaporizer 42 as
indicated by the solid arrows. An internal liquid vapor interface
46 occurs within the vaporizer 42 at high heat fluxes and the
maximum heat flux is obtained when the interface just contacts the
surface from which vaporization occurs at the midpoint of the
channel between adjacent feeders 43.
FIG. 9 illustrates a heat transfer surface structure that is
mathematically substantially identical to the structure illustrated
in FIG. 8. As illustrated in this embodiment, a heat source wall 47
is provided with V-shaped grooves, the sides of which are lined
with a fine pored capillary material 48. A portion of the vaporizer
at the crest of ridges in the heat source wall 47 is in contact
with a relatively coarse pore feeder strip 49 running approximately
perpendicular to the ridges. Liquid flows from the feeder 49
through the capillary material 48, as indicated by the solid
arrows. Vapor escapes from the surface of the capillary material
into the V-shaped channels as shown by the dashed arrows. A vapor
liquid interface 51 forms between the heat source wall 47 and the
surface of the capillary material from which vaporization occurs,
in substantially the same manner as hereinabove illustrated in FIG.
8.
FIG. 10 illustrates a heat transfer surface structure particularly
useful when the external pressure drop .DELTA.P.sub.x against which
fluid flow must be provided is relatively high. In this structure a
heat source wall 53 is provided with raised rectangular ridges 54
so as to define a plurality of rectangular channels 56
therebetween. The tops of the raised portions 54 of the wall are in
intimate thermal contact with a porous matrix 57 that is supplied
with a vaporizable liquid. The liquid flows through the porous
matrix as indicated by the solid arrows, and vaporization occurs at
the face 58 of the matrix adjacent the channels 56 as heat flows
from the wall into the matrix. At high heat fluxes a liquid vapor
interface 59 forms in the porous matrix as before. The regions of
porous matrix forming the vaporizer strips for purposes of
calculating the maximum heat flux have unusually large thickness to
width ratios 1/w(1/t )>1, and therefore will allow more area for
fluid flow, which proves useful when the external pressure
.DELTA.P.sub.x is high so that .delta. must be high to support the
pressure differential, thus forcing the fluid conductivity .alpha.
to be low.
The capillary vapor strip designs illustrated in FIGS. 6 to 10 are
merely exemplary of good vaporizer designs, and it should be
apparent to one skilled in the art that many more shapes and
combinations of shapes of porous materials can be used to form the
porous matrix and the passages to vent vapor from the surfaces
where vaporization occurs.
A "simple" capillary vaporizer surface structure as illustrated in
FIG. 3 (as contrasted to a "compound" boiling surface as
illustrated in FIG. 4 and 5) permits a particularly large number of
different configurations since the vapor passages only have to
penetrate through or nearly through the capillary matrix material
between the heat source wall and the region occupied by combined
liquid and vapor. Also, the passages in any capillary vaporizer may
be of almost any shape, for example, grooves, slots or holes of any
shape, and even random structure such as a large pore matrix in
which the large pores are the vapor passages, and the matrix is
composed of material that is itself a fine pore matrix that carries
the liquid. Layers of such material, with the size of the larger
pores, and possibly the smaller pores, increasing with increasing
distance from the heat source surface may also be used as an
inexpensive alternate to structures such as illustrated in FIGS. 4
and 5.
Fabrication techniques are equally varied since the passages may be
formed by bonding closely spaced strips, cylinders, grids, or even
irregular lumps of porous material to the heat source surface and
to each other. Another fabrication technique for a capillary
vaporizer surface is to first coat the impervious heat source
surface with a continuous layer of porous material and then
multiply crack the porous matrix, for example, by stretching or
bending the composite layers, or by further sintering of the porous
material to induce additional shrinkage.
Except for the simplest types of capillary vaporizer surfaces for
contact with bulk liquid, the vented capillary vaporizers comprise
at least a heat source surface, a vaporizer surface structure and a
liquid feed structure. Both of the latter being of capillary
material for inducing liquid flow due to surface tension forces. It
is important to distinguish these two structures since during
operation of the vaporizer the capillary material forming the
surface structure transmits both heat and liquid while the
capillary material forming the feed structure need transmit only
liquid, and in many situations it is desirable that it be a good
thermal insulator. These functional differences between the two
structures are reflected in the efficiency factors for the two
materials; that for the feed structure or wick being
.epsilon..sub.w =2.alpha..delta..sup.2 ; while the efficiency
factor for the vaporizing surface structure is .epsilon..sub.E
=2.delta.(3.alpha.(k.sub.M /k.sub.S)).sup.1/2. In some situations,
both the surface vaporizer structure and the feed structure may be
fabricated of the same porous material for lower cost; however,
there may be some sacrifice in performance.
The vented capillary vaporizers provided in the practice of this
invention may be categorized in steps of increasing complexity of
structure and as to the extent to which the liquid and vapor flow
are thereby isolated.
A "simple" heat transfer surface is hereinabove described and
illustrated in FIG. 3, and comprises a layer of porous material
bonded to a heat source surface and perforated with passages
penetrating directly into the porous material to, or almost to, the
heat source surface. The vapor produced is thus vented directly
into the same region carrying the liquid.
A "compound" heat transfer surface is hereinabove illustrated in
FIGS. 4 and 5, and is similar to the simple structure but with
passages carrying at least a portion of the vapor a short distance
parallel to the heat transfer surface before venting it into the
region of mixed liquid and vapor. Thus, in a portion of the region
adjacent the surface, the outgoing vapor and incoming liquid have
separate flow paths. The compound surface can be considered to be a
simple heat transfer surface capped with feeder strips of porous
material perpendicular to the vaporizer strips on the heat transfer
surface forming liquid and vapor manifolds for separated
countercurrent flow of the two fluids.
A third type of vented capillary vaporizer is one where the liquid
is fed thereto by a wick such as, for example, in a heat pipe. In
this structure, the liquid is always in some capillary structure,
either the wick, an intermediate feeder, or the vaporizer, and the
flow paths of the liquid and vapor are thereby separated. There is
no need, however, to thermally or mechanically isolate the liquid
filled wick from the vapor since the capillary forces in the wick
support the pressure difference between the liquid and vapor. If,
for some reason, the vapor impinging on the wick is superheated,
liquid will merely evaporate from the surface of the wick to keep
it cool. Thus, the actual vaporizer surface structure can be quite
similar to the compound boiling surface, with the feed structure in
contact with a wick. Such a wick-fed vaporizer structure is
illustrated in FIGS. 11 through 16, hereinafter described in
greater detail.
A fourth type of vaporizer can be characterized as a "capillary
pump" vaporizer that is employed when the incoming liquid to the
vaporizer is in bulk, and it is desired that the outgoing vapor be
at a higher pressure than the incoming liquid. By bulk liquid is
meant that the liquid is not flowing through a capillary structure
sufficiently fine pored to support the desired pressure difference.
In a capillary pump vaporizer, the incoming liquid must be both
mechanically and thermally isolated from the outgoing vapor until
the liquid flows into a sufficiently fine pored matrix within or
adjacent the vaporizer to support the required pressure
differential. If the incoming liquid is not thermally isolated and,
if necessary, cooled, its temperature and thus its vapor pressure
will approach that of the outgoing vapor which may cause bubbles
and eventual vapor lock in the incoming liquid passage. Generally,
at least part of both mechanical and thermal isolation is achieved
by separating the bulk liquid input manifold from the complex
vaporizer structure by a wicking layer of low thermal conductivity
porous material with sufficiently fine pores to support the
pressure difference between the liquid and vapor. A capillary pump
type of vaporizer is illustrated in FIGS. 17 to 19 and described
hereinafter in greater detail.
FIGS. 11 to 14 show in cross-sectional views one of the third type
of vented capillary vaporizer wherein liquid is fed thereto by a
wick. FIG. 15 shows one element of this rather complex structure in
perspective to help clarify the shape of the parts and FIG. 16
magnifies a small portion of FIG. 14 for greater clarity. Such a
wick-fed, vented vaporizer design is suitable for use in a multiply
segmented heat pipe such as described and illustrated in the
aforementioned copending patent application entitled SEGMENTED HEAT
PIPE. Such a vaporizer design is also useful in ordinary heat pipes
or the like where it is desired to maximize the heat flux density
while minimizing the temperature drop across the capillary
vaporizer by having a very short heat conduction path.
As illustrated in this embodiment, a cylindrical impervious wall 61
bounds the structure on the sides. A heat source wall or partition
62 separates the vented capillary vaporizer from a heat source 63,
which is not illustrated in great detail but which can be a
somewhat similar surface structure or some other surface adapted
for vapor condensation as in a segmented heat pipe or may be a
primary heat source. Immediately adjacent the heat source wall 62
is a thin evaporator surface layer 64 of porous material having a
high efficiency .epsilon..sub.E (FIG. 16).
It is convenient in discussing the vented vaporizer illustrated in
FIGS. 11 through 16 to define orthogonal x and y coordinates lying
in a plane parallel to the heat source wall 22. Thus, the cross
sections of FIGS. 11 and 13 are taken in planes parallel to the xy
plane. The cross section of FIG. 12 is taken in a plane parallel to
the plane containing the y-axis and the axis of the tube, and FIGS.
14 and 16 are cross sections taken in a plane parallel to the plane
containing the x-axis and the axis of the tube.
Parallel to the heat source wall 62 and extending in the y
direction are a plurality of parallel strips 66 of porous material,
each having a cross section substantially as illustrated in FIG. 8
with a narrow edge in contact with the porous layer 64 on the heat
source wall and dividing the free surface of the porous layer 64
into a number of regional areas of vaporization. The plurality of
strips 66 defines a plurality of intermediate channels 67 lying
parallel to the heat source wall and extending in the y direction.
The parallel strips 66 serve to deliver liquid to the porous
material 64 on the heat source wall, and the channels 67 serve to
carry vapor away from the porous material as liquid is vaporized in
the manner hereinabove described for FIG. 8.
Extending transversely to the strips 66 in contact with the porous
layer are a plurality of larger strips 68 of rectangular cross
section and extending parallel to the heat source wall in the x
direction. The spaces between the larger strips 68 form larger x
direction channels 69, each of which is in fluid communication with
a plurality of the smaller y direction channels 67 so that vapor
from a plurality of the smaller channels feeds into the larger
channels 69 during operation of the vaporizer. The larger strips 68
are in contact with the smaller strips 66 and can even be formed
integrally therewith of the same material. Both sets of strips are
formed of a porous material having a high wicking efficiency
.epsilon..sub.w. In a typical embodiment for a heat pipe about
one-half inch diameter the smaller channels 67 may be present with
a frequency in excess of about 100 channels per inch, and the
larger channels 69 may be provided in the order of about 36
channels per inch.
In order to feed liquid to the larger strips 68, a capillary
wicking structure is provided which can be conveniently divided
into a conventional cylindrical fluid source wick 71 of porous
material extending along the tubular wall 61 from some cooler
region (not shown) towards the other end of the heat pipe, and a
somewhat more complex wicking structure between the fluid source
wick 71 and the larger strips 68. The interior surface of the wick
71 defines a passage denominated herein as a vapor way.
This intermediate wicking structure includes a ring 72 of porous
material and having an outside diameter approximately that of the
tubular wall 61 of the heat pipe. At the end of the ring in contact
with the porous wick 71, the inside surface 74 of the ring 72 is in
the form of an elliptical cylinder having the major axis of the
ellipse in the x direction and the minor axis in the y direction as
seen in the cross section of FIG. 11. In order to mate with this
elliptical inside shape, the inside of the wick 71 is provided with
a pair of beveled portions 73 so as to provide an elliptical cross
section at the end of the wick in contact with the end of the ring
72.
The elliptical internal surface 74 of the ring 72 extends the full
length of the ring at the major axis, that is, in a plane in the x
direction as seen in FIG. 14. The inside surface of the ring is
also provided with a beveled region 76 which can be considered as
the surface of an elliptical cone, that is, a cone having an
elliptical base and an axis normal to and centered on the
elliptical base. The major axis of the elliptical cone is in the y
direction, and the minor axis is in the x direction, and in the
plane where the ring 72 comes in contact with the larger strips 68
the minor axis of the elliptical cone is equal to the major axis of
the elliptical inside surface 74 on the ring. That is, at the
median plane parallel to the x axis there is no bevel on the inside
of the ring and there is a maximum bevel at the y median plane. The
major axis of the elliptical cone in the plane in contact with the
larger strips is greater than the diameter of the tubular wall 61
so that the only end surface portion of the ring 72 in contact with
the larger strips 68 comprises a pair of opposed crescent-shaped
sectors each having a circular outside edge and an elliptical
inside edge as seen in the cross section of FIG. 13. The
crescent-shaped portions of the ring 72 in the plane of the cross
section of FIG. 13 are in contact with a plurality of the larger
strips 68 near their ends so that liquid passes from the wick 71
through the ring 72 into the ends of the larger strips.
Delivering liquid solely to the ends of the larger strips 68 by the
crescent-shaped portions of the ring 72 in this embodiment is not
sufficient for supplying liquid across the full face of the vented
capillary vaporizer at maximum heat flux; therefore, in order to
supply liquid to the larger strips at a region intermediate their
ends, a pair of similar parallel crossbar structures 77 having
their greatest extent in the y direction are provided across the
ring. A portion of the crossbars 77 is illustrated in perspective
in FIG. 15 for the purpose of clarifying the shape of the crossbar
and slope of a pair of outer faces 78. Each of the crossbars 77 has
a flat face 79 (seen in the cross section of FIG. 13) in contact
with the larger strips 68 for transferring liquid thereto. The ends
81 of the bars 77 are in contact with, or integral with, the ring
72 for accepting liquid therefrom (one of the curved ends 81 is
hidden at the far end of the bar 77 illustrated in FIG. 15).
The two sloping outer faces 78 of the bars are opposite the flat
face 79 in contact with the larger strips 68. The two faces 78
slope so that the crossbar is relatively thicker on one side 82
nearer the axis of the heat pipe, and relatively thinner on the
opposite side 83 more remote from the axis of the heat pipe. The
two faces 78 also slope from their intersection with the ring 72
where they are relatively further from the flat face 79 toward a
central intersection of the two faces where they are relatively
nearer the flat face 79. These two directions of slope of the faces
78 result in their intersecting along a straight line
interconnecting a point 84 on the higher side 82, and a second
point 86 on the lower side 83. The point 86, more remote from the
axis of the heat pipe, is at, or nearly at, the flat face 79 of the
crossbar, and the point 84, nearer the axis of the heat pipe, is
appreciably more remote from the flat face 79 than is the other
point 86.
The sloping structure of the crossbars 77 is provided for
maintaining a cross section in the bars proportioned to the
quantity of liquid that flows through the cross section as affected
by the distance over which the liquid must flow through the bar to
reach the desired strips 68 while also keeping the cross-sectional
area open for venting the vapor from each region proportioned to
the vapor flow from that region. The same principle is responsible
for the bevel 73 on the wick 71 and the bevel 76 on the ring 72.
The rationale behind the shape of the crossbar can be further
recognized by noting the dashed lines 87 on FIG. 13 which represent
the bounds of the area of surface structure to which liquid is
delivered by one of the crossbars 77. Liquid is delivered to
regions outside the bounds of the lines 87 by the other crossbar or
the crescent-shaped portions of the ring 72. From these bounds it
will be seen that the area to which liquid is delivered nearer the
center of the heat pipe is larger than the area more remote from
the center. It will also be noted that the distance liquid need
flow in the crossbar from its intersection with the ring to the
center is greater on the side 82 nearer the center of the heat
pipe, and shorter on the side 83 more remote from the center of the
heat pipe.
The sloping faces 78 on the crossbars and the bevels 73 and 76 on
the wick and ring, respectively, are provided for enlarging the
area through which vapor passes as it leaves the region bounded by
the channels 69. The slopes and bevels provide the largest possible
cross-sectional area and shortest path length for the vapor without
significant hindering of liquid flow cross section. It should be
recognized that the regions bounded by the two crossbars 77, and
between the crossbars and ring form a manifold with and condensing
relatively large passages in serial flow connection with the more
numerous smaller channels 69 which are further in fluid
communication with the smallest most numerous channels 67 adjacent
the heat source surface, thus assuring that all the vapor formed at
the regional areas of vaporization on the surface of the porous
layer 64 flows into the vapor way within the central passage of the
wick. In this way, the vented capillary vaporizer illustrated in
FIGS. 11 through 16 for a wick-fed heat pipe is analogous to the
compound vented capillary vaporizer hereinabove described and
illustrating in FIGS. 4 and 5 except that instead of feeding liquid
to the vaporizer from a source of bulk liquid, as in FIGS. 4 and 5,
the liquid reaches the heat pipe vaporizer by way of a wick 71 and
the vapor is delivered to a vapor way instead of being directly
returned to mix with the bulk liquid.
FIGS. 17 through 19 illustrate the fourth type of vented capillary
vaporizer which can be considered to be a capillary pump wherein
the output vapor pressure can be higher than the input bulk liquid
pressure. FIGS. 17 and 18 are cross sections through a single
region of heat transfer surface structure and it should be
understood that a plurality of side-by-side structures such as
illustrated in FIG. 17 may be repeated indefinitely to cover a
large surface area. A single repetition of the structure such as
illustrated in FIG. 17 may, for example, be provided every one-half
inch or more along the surface, and such a structure may have an
indefinite length in a direction along that of FIG. 18 as may be
limited only by the flow capacity of the liquid flow conduits, and
cooling means provided as hereinafter described. The structure
illustrated is, of course, only part of the heat transfer system
and elsewhere means are provided for containing and condensing or
releasing the vapor formed.
FIG. 19 is an enlarged detail of the structure adjacent a heat
source wall 89. Immediately adjacent the wall, and in thermal
contact therewith, are a multiplicity of rectangular strips 90
forming a multiplicity of channels 91 and an equal number of
regional areas of vaporization. Running transversely to the fine
strips 90 are larger strips 92, having channels 93 therebetween,
and these larger strips 92 are in contact with still larger strips
94, having channels 95 therebetween. Thus, the structure nearest
the heat source provides a hierarchy of strips 94, 92 and 90 of
decreasing size and increasing number for conducting liquid toward
the heat source wall, and a hierarchy of channels 91, 93 and 95 of
increasing size and for conducting vapor away from the heat source
wall and directing it into the gaps between adjacent delivery
structures for flow into the vapor way common to several structures
such as illustrated in FIG. 17 making up the heat transfer surface
structure.
The arrangement provided in FIGS. 17 to 19 differs from the related
structure hereinabove illustrated in FIGS. 4 and 5 in that liquid
is delivered to the larger strips 94 by a thermal isolation matrix
96 in contact therewith. The thermal isolation matrix is a porous
material having a high wicking efficiency .epsilon..sub.w and as
low a thermal conductivity as possible. The structure illustrated
in FIGS. 17 and 18 also differs from that hereinabove illustrated
in FIGS. 4 and 5 in that the vapor generated adjacent the heat
source surface is collected in a vapor way external to the liquid
delivery structures while remaining well isolated from the incoming
bulk liquid.
The thermal isolation matrix 96 is in intimate thermal contact with
a matrix cooler plate 97 formed of a high thermal conductivity
metal. Transverse grooves 98 in the cooler plate 97 transmit liquid
from approximately triangular conduits 99 to the cooler surface of
the thermal isolation matrix 96. One wall of each of the liquid
conduits 99 is formed by the wall 101 of a conventional heat pipe.
The heat pipe also comprises a conventional wick 102 and an open
vapor passage 103 for extracting heat from liquid in the conduits
99 and from the matrix cooler plate 97 for delivery to a cooler
heat sink (not shown). A layer of thermal insulation 104 surrounds
the heat pipe and liquid conduits and a metal sheath 105 and
channel wall 106 prevent liquid in the conduits and vapor
surrounding the structure for contacting the insulation. The liquid
channel wall 106 also conducts heat to the heat pipe to help keep
the liquid in the channel cool.
In operation, the capillary pump-type of vented vaporizer,
illustrated in FIGS. 17 and 18, takes bulk liquid that is not in a
capillary structure into the conduits 99 for delivery to the porous
thermal isolation matrix 96 by way of the transverse grooves
98.
The bulk liquid entering the conduits 99 is at a relatively lower
pressure than the vapor escaping from the channels 95 nearer the
heat source surface, and the liquid pressure continues to drop as
it flows through the conduits 99, grooves 98, and the various
capillary matrix structures. In order to prevent the occurrence of
vapor in the liquid flow path, the temperature of the liquid must
be sufficiently low at any point that its vapor pressure at that
temperature is less than the sum of the liquid pressure and the
bubble pressure at that point. As previously pointed out, the
bubble pressure is .sigma..delta. or .sigma.(1/R.sub.1 +1/R.sub.2)
where R.sub.1 and R.sub.2 are the major radii of curvature of the
liquid vapor interface of the largest bubble that can form in the
pore or channel. When the liquid wets the pore or channel walls,
then R.sub.1 and R.sub.2 are approximately half the width and half
the thickness of the pore or channel, respectively. Thus, for a
circular pore of radius R.sub.p the bubble pressure is
2.sigma./R.sub.p. In the macroscopic structures, such as the
conduits 99 and grooves 98, R.sub.1 and R.sub.2 are generally so
large that the bubble pressure is negligible, and the liquid in
them must remain cool enough that the vapor pressure of the bulk
liquid is less than the liquid pressure. In the very small pores of
the capillary matrix, however, the radii R.sub.1 and R.sub.2 are
also very small or, which is equivalent, the effective pore surface
to volume ratio .delta. is large, so that the bubble pressure can
be quite high, and the vapor pressure may be considerably greater
than the liquid pressure without any bubbles forming. Thus, the
temperature within such a capillary matrix may be slightly greater
than the temperature of the vapor formed at a free surface of the
capillary matrix without forming vapor bubbles in the matrix, while
the temperature of the bulk liquid must be kept enough cooler than
the temperature of the vapor formed at the free surface of the
capillary matrix to balance the liquid-vapor pressure
difference.
In order to keep the bulk liquid sufficiently cool to prevent its
vaporization, the thermal isolation matrix is selected with as low
a thermal conductivity as possible for minimizing the quantity of
heat transferred from the vapor within the channels 95 through the
matrix to the face in contact with the bulk liquid. Such thermal
isolation by means of a low thermal conductivity material is
sufficient in some circumstances such as, for example, as in an
apparatus as described and illustrated in the aforementioned
copending patent application entitled "Heat Transfer Device With
Isolated Fluid Flow Paths." If the thermal isolation is not
sufficient, a heat pipe such as illustrated in FIGS. 17 and 18 is
provided in thermal contact with the bulk liquid for extracting
surplus heat therefrom for preventing vaporization. A heat pipe is
preferred in such an application because of the high rate of heat
transfer available with relatively small temperature difference;
however, it is to be understood that other active or passive
cooling means than the heat pipe can be employed as desired, such
as, for example, a fluid flow cooling tube. or a heat radiating or
conducting rod or fin, or a thermoelectric cooling device.
In each of the above described vented capillary vaporizers, it is
preferred that the vapor passages in the portion immediately
adjacent the heat transfer surface be spaced apart by less than
about 0.1 inch. If the passages are spaced apart by appreciably
more than about 0.1 inch, the additional expense of preparing the
structure is not justified by the increase obtained in heat flux
density. The vented capillary vaporizer structure is more expensive
to fabricate than most simple heat transfer structures. Its major
advantage is that it is capable of handling much higher heat flux
densities than any but the most expensive and complex systems,
which must use high pressure pumps and under-cooled liquids in
order to obtain comparable heat flux densities. This is true of
those devices that exploit in full the highly advantageous
characteristics of the vented capillary vaporizer.
As shown in equation 60 and 61 hereinabove, the maximum heat flux
density H.sub.max /A.sub.v is proportional to the total length of
vaporizer strip per unit heat source area, which, in turn, is
proportional to the number of passages or regional areas per unit
length n.sub.p for passages parallel to the heat source wall. That
is, H.sub.max /A.sub.v n.sub.p. This can also be expressed in terms
of the nearest neighbor distance d between passages or regional
areas adjacent the heat source surface. H.sub.max /A.sub.v 1/d, or
H.sub.max A.sub.v /d. In this form, the proportionality holds, not
only for passages parallel to the heat source wall, but also for
any shape of vented capillary vaporizer so long as the shape
remains unchanged while all dimensions are scaled proportionately.
A particularly interesting example is a square array of round
passages of diameter D perpendicular to the heat source surface.
Here, the maximum heat flux density is approximately the same as
for the passages parallel to the heat flux surface so long as
D/d=2/.pi. since the total effective length of "vaporizer strip"
per unit heat source area is the same for both examples. In the
terminology used herein a passage close and parallel to the heat
source surface creates a single regional area of vaporization along
it, which for purposes of calculation is divided into two vaporizer
strips.
In order to evaluate how small the passage spacing d must be made
for the vented capillary vaporizer to be economically competitive,
one can best compare its maximum heat flux density with the maximum
obtainable with the liquid vaporizing situation of pool boiling.
Since the heat flux densities obtained are a function of the liquid
employed, water is specified in both examples. Such an example has
been set forth hereinabove for the vented capillary vaporizer as
equation 63 wherein it was pointed out that H.sub.max /A.sub.v
=34.5n.sub.p watts/cm..sup.2, or substituting d=1/n.sub.p, the
maximum heat flux density is H.sub.max /A.sub.v =34.5/d
watts/cm..sup.2.
The maximum heat flux density available for water in pool boiling
is about 100 watts/cm..sup.2. Thus, in order to obtain comparable
performance 34.5/d=100 watts/cm..sup.2, or d=0.345 cm., or 0.136
inch. In order to be economically practical, the spacing d should
afford some heat flux advantage over a simple and inexpensive pool
boiling situation. Thus, a spacing d between channels less than
about 0.1 inch is preferred. Usually, the spacing between passages
or regional areas will be much smaller than 0.1 inch since
manufacturing costs of the heat transfer surface structure go up
less rapidly than the number of channels produced until very high
values of n.sub.p are reached, that is, the channels become a very
short distance apart. With a heat transfer surface structure having
channels closer than about 0.1 inch spacing, it is usually less
expensive to fabricate a smaller area of higher maximum heat flux
density than a larger area of lower maximum heat flux density
having the same total heat flux capacity.
Several embodiments of heat transfer surface structures
incorporating principles of this invention have been described and
illustrated herein. It will be apparent, however, that many
modifications can be made in these structures. Thus, for example,
such structures can be employed in heat transfer environments other
than in a heat pipe or in a boiler or refrigeration evaporating
tubes as discussed hereinabove. The structures have been described
for vaporization of liquid, however, many of the structures
described and illustrated are also suitable for condensing vapor,
such as, for example, at the cooler end of a heat pipe, when the
condensed liquid is removed with a wick or as bulk liquid at
sufficient temperature and pressure to prevent bubble formation.
The structure is in most cases identical, that is the channel
pattern is the same. The material may be different for providing
different thermal conductivity and effective pore surface to volume
ratio. Otherwise, the only difference is that the direction of flow
of liquid and vapor is reversed within and near the structure. A
number of geometrical shapes have been identified for structures
providing liquid to a heat transfer surface in one area and
permitting vapor to escape in another area. Other structures
performing this function will be apparent to one skilled in the
art.
* * * * *