U.S. patent number 3,584,189 [Application Number 04/752,331] was granted by the patent office on 1971-06-08 for temperature stabilizer for integrated circuits.
This patent grant is currently assigned to Texas Instruments Incorporated. Invention is credited to Leo Marcoux.
United States Patent |
3,584,189 |
Marcoux |
June 8, 1971 |
TEMPERATURE STABILIZER FOR INTEGRATED CIRCUITS
Abstract
A self-regulating heater for integrated circuits and the like is
removably carried in a connector assembly. The connector assembly
includes a housing which on one side is adapted to receive an
integrated circuit unit or the like and which on the other side
removably receives in a force fit a base plug which in turn is
adapted to be plugged into a circuit board. The heater includes a
heating element composed of material having a positive temperature
coefficient of resistance. Contacts are provided on the heating
element which are in resilient spring connection with heater
terminals mounted in the base plug. By reaction the heating element
is pressed against a heater plate also carried within the connector
assembly. A rim of the heater plate is supported upon the margin of
an opening or window in the housing so that an integrated circuit
unit or the like mounted on the housing is placed in heat-exchange
relationship with the heater plate whereby the temperature of the
integrated circuit unit or the like is stabilized. Interchange may
readily be made between various heater elements to provide desired
changes in the regulated temperature.
Inventors: |
Marcoux; Leo (Pawtucket,
RI) |
Assignee: |
Texas Instruments Incorporated
(Dallas, TX)
|
Family
ID: |
25025853 |
Appl.
No.: |
04/752,331 |
Filed: |
August 13, 1968 |
Current U.S.
Class: |
219/209; 219/510;
219/504 |
Current CPC
Class: |
H05K
7/1092 (20130101) |
Current International
Class: |
H05K
7/10 (20060101); H05b 003/06 () |
Field of
Search: |
;317/100,101,11CC
;339/17CF,17LC ;310/8.9,9 ;219/209,210,505,504,510 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Trune; J. V.
Assistant Examiner: Albritton; C. L.
Claims
I claim:
1. A temperature stabilizer for circuit devices having conductive
leads, comprising plug means, a PTC anomaly heater in the plug
means, said heater having an exposed heating surface, said plug
means including heater terminals extending therefrom, said heater
terminals being connected to said heater, springs electrically and
removably connecting the heater terminals with said heater, means
for removably mounting circuit devices including jacks in the plug
means, additional terminals connected to said jacks respectively
and extending from the plug means, said jacks being arranged
adjacent to the exposed heating surface for the reception of
circuit device leads and to removably place a circuit device having
said leads in heat-exchange relationship with the exposed portions
of said heater.
2. A temperature stabilizer for pin-type integrated circuits,
comprising a plug element, an enclosing housing connected therewith
forming an assembly, said housing formed with a window therein, a
PTC anomaly heater located in the assembly and having a heating
surface disposed at said window, heater terminals extending from
said plug element and electrically connected with said heater,
jacks located in the assembly, operating terminals extending from
said jacks respectively to the exterior of the plug element, said
housing having openings for receiving and directing pins of an
integrated circuit into said jacks, whereby an integrated circuit
may be brought into heat-exchange relationship with said portions
of the heater exposed in said window.
3. A temperature stabilizer according to claim 2 wherein there is a
separable connection between the housing and the plug element
whereby they may be separated and reassembled for effecting heater
substitutions.
4. A temperature stabilizer according to claim 3 wherein the
connections between said heater terminals and the heater are in the
forms of springs which bias the heater toward said window.
5. A temperature stabilizer according to claim 4 wherein the heater
is in the form of a bar of said PTC anomaly material nested in a
heater plate having a heater surface fitting within said window and
flanges internally engaging the margins of the window under
pressure from said springs.
6. A temperature stabilizer for multiple-pin, dual in-line
integrated circuits, comprising a hollow rectangular plug element,
a rectangular housing connected therewith, said housing forming a
rectangular window, a PTC anomaly heater located between the
housing and the plug element and having a rectangular heated
surface extending through said window, heater terminals extending
from said plug element, springs electrically connecting the heater
terminals with said heater, rows of jacks located between the
housing and the plug dually aligned on opposite sides of the
heater, operating terminals extending from said jacks and dually
aligned on the exterior of the plug element, said housing having
dually aligned openings on opposite sides of said heated surface
for guiding pins of an integrated circuit into said jacks, whereby
an integrated circuit may be brought into heat-exchange
relationship with said exposed portions of the heater.
7. A temperature stabilizer according to claim 6 wherein there is
an openable force-fit between the housing and the plug whereby they
may be separated and reassembled for effecting heater
substitutions.
8. A temperature stabilizer according to claim 7 wherein the heater
is in the form of a dished plate with a bar of said PTC anomaly
nested therein, said heater plate having flange means seating
behind the margin of said window under pressure from said
springs.
9. A temperature stabilizer for integrated circuits, comprising an
insulating base, heater terminals and operating terminals extending
from said insulating base for plugging into a circuit board, an
insulating body connected with said base, said operating terminals
being formed within the body as jacks, a PTC heater element within
the body, said heater element having contacts engaged through
springs with said heater terminals, said body having a window, a
dished and flanged heater plate having at least a part of its
dished portion extending through said window and its flanged
portion engaging the inside margin of the window, said heater
element being nested in said dished portion of the heater plate,
said body having openings aligned with said jacks for the reception
of pins of an integrated circuit and their direction into said
jacks, said heater plate being in close heat-exchange relationship
with the integrated circuit when its pins are applied to the jacks
through said openings.
10. A temperature stabilizer made according to claim 9 wherein the
base, the body and the heater element are separable for replacement
of the heater element.
Description
Integrated circuit performance is prone to be undesirably affected
by ambient temperature variation. It has been the practice
heretofore to build temperature-regulating devices within the
cavities of integrated circuit units. This unduly burdened such
units. Moreover, changes in controlled temperature could not be
accomplished in any simple manner.
By means of the present invention a temperature stabilizer is
provided which is not a permanent part of the integrated circuit
unit which it serves. Repeated connections and disconnections of an
integrated circuit with a circuit board may readily be accomplished
without involving complications in making heater connections.
Changes in heaters may also be easily made.
Referring to the drawings,
FIG. 1 is an exploded view in perspective of parts of the
stabilizer, an integrated circuit unit being shown at the extreme
left;
FIG. 2 is an inside face view of the base plug shown at the extreme
right of FIG. 1;
FIG. 3 is a longitudinal section taken on line 3-3 of FIG. 2;
FIG. 4 is a plan view of the base plug without its electrical
connectors;
FIG. 5 is a front elevation of FIG. 4;
FIG. 6 is a cross section taken on line 6-6 of FIG. 4;
FIG. 7 is a plan view of the outside face of a housing;
FIG. 8 is a cross section taken on line 8-8 of FIG. 7;
FIG. 9 is a front elevation of FIG. 7;
FIG. 10 is a left end view of FIGS. 7 and 9;
FIG. 11 is a longitudinal section taken on line 11-11 of FIG.
7;
FIG. 12 is a plan view of a heating element including its
contacts;
FIG. 13 is a front elevation of FIG. 12;
FIG. 14 is a right end view of FIG. 12;
FIG. 15 is a plan view of the heating element of FIGS. 12--14
nested in a dished heater plate to form a complete heater;
FIG. 16 is a cross section on line 16-16 of FIG. 15, the dished
heater plate being shown in longitudinal section;
FIG. 17 is a face view of an assembly of the housing on the base
and illustrating the exposure of the heater plate;
FIG. 18 is a front elevation of FIG. 17;
FIG. 19 is a cross section (except for heater assembly TR) on line
19-19 of FIG. 17, parts being shown in elevation, and showing in
addition the application of an integrated circuit unit, the
temperature of which is regulated; and
FIG. 20 is an enlarged view of an individual spring terminal and
jack, showing in solid lines the shape in which it is manufactured
and in phantom its sprung shape as assembled with the base.
Corresponding reference characters indicate corresponding parts
throughout the several views of the drawings. The drawings are
considerably enlarged over the sizes of the actually very small
parts.
Referring to FIG. 1, there is shown at the extreme left a
conventional so-called 14-pin dual in-line integrated circuit unit
C. This has opposite lines of terminal pins 1. At the extreme right
of FIG. 1 is shown a base plug P composed of a body 2 of insulating
material from which extend two heater terminals 3 and fourteen
operating terminals 5, further details of which will be described
below. The number of operating terminals is arbitrary.
At H is shown a housing composed of insulating material and formed
for removable force-fit assembly with the body 2 of plug P. Housing
H has an opening or window 7 defined by flanges 43 and flanked by
rows of openings 9 for receiving the pins 1 of the integrated
circuit unit. Within the body 2 is a heater element R composed of a
bar 11 of semiconductive material having the above-mentioned PTC
anomaly. It has terminal contacts 13 soldered thereto. Between the
heater R and the housing H is located a heater plate T having a
dished portion 15 for the reception of the heater. It is flanged as
shown at 17. The dished portion 15 of the heater plate fits into
the window 7 of the housing H. Its flanged portion 17 rests upon
the inside margins of the window 7. Upon assembly under force-fit
of the housing H with body 2 of the plug P, the heater R becomes
nested in the dish 15 of the heater plate T. This nested assembly
becomes a heater unit sandwiched between the housing H and the body
2. The dished portion 15 of the plate T becomes exposed in the
window 7 and the heater R becomes connected with the heater
terminals. The friction provided by the force-fit is sufficient to
prevent separation under action of springs 23 but not enough to
prevent manual separation when desired.
FIGS. 2--6 illustrate details of the plug P. It has a flat wall 19
through which the heater terminals 3 extend, as shown in FIGS. 2
and 3. To insure a secure connection heater terminals 3 may be
staked to body 2. The insides of these terminals are located in a
pocket 21 and on shoulders 22 support light compression springs 23.
The longitudinal sidewalls 25 of the pocket 21 are formed
exteriorly with ribs 26 notched as shown at 27 (FIGS. 4--6). The
walls 25 are formed with flared recesses 29 connected with the
notches 27. The notches as described are for the reception of
spring clips 31, such as illustrated in greatly enlarged form in
FIG. 20. Each springy strip is composed of conductive material such
as copper. Its unsprung V-shape is as indicated in solid lines in
FIG. 20. This V-shape is adapted to have its side portions sprung
together as shown by the phantom lines 33 in FIG. 20. The sides are
formed with loops 30 and flared ends 32. When sprung together each
such operating terminal will then have a neck portion 35 thereof
for springing placement in a notch 27. This holds each terminal
part 5 in place and produces a jack portion 37 in each notch 27 in
addition to forming a terminal 5. In FIGS. 4--6 the body portion 2
of the plug P is shown without any terminal or jack parts in place,
whereas in FIGS. 1--3 the terminals 5 and jacks 37 are shown in
assembled position.
Referring to FIGS. 7--11, details of the housing H are illustrated.
It has sidewalls 36 the insides of which fit flush with the
outsides of the walls 25 and the outside edges of the jacks 37,
thus preventing escape of the spring terminal and jack parts 5 and
37. The housing H also has end walls 39 which frictionally fit into
notches 41 at the ends of body 2. The sidewalls 36 of housing H are
inwardly flanged as shown at 43 to form the window 7. The openings
9 are located in these flanges and are flared on their outsides as
at 44 so as to form entry guides for the rows of pins 1 of the
integrated circuit unit C.
In FIGS. 12--14 are shown details of the heater element R. This
comprises the bar 11 composed of semiconductive material having the
PTC anomaly, such as doped barium titanate (BaTiO.sub.3), barium
strontium titanate (BaSrTiO.sub.3), barium lead titanate
(BaPbTiO.sub.3) or the like. Each material provides a
self-regulated temperature under the constant voltage of the heater
circuit of the circuit board. The barium lead titanate provides the
highest temperature of the three noted. Each contact 13 is formed
with a contact pad 45 on one face and an extending side strip 47.
These are soldered to the bar 11. The contacts 45 are near the ends
of the bar 11 for contact with the conductive springs 23 of the
heater terminals 3. The contacts 45 and side strips 47 supply
voltage across the bar, which due to the PTC anomaly maintains a
substantially constant temperature.
Shown in FIGS. 15 and 16 is the heater plate T composed of black
anodized aluminum which provides it with an insulated surface. The
bar 11 is adhered in the dished part 15 by suitable means such as
epoxy resin. The flanged portions 17 engage the inside margins of
the window as illustrated in FIGS. 17--19. The contact pads 45
engage the springs to maintain this engagement and to deliver
heating voltage and current from the heating circuit in the circuit
board. Thus, the bar 11 will become resistance heated to and
maintain substantially a constant temperature because of its PTC
anomaly.
As shown in FIGS. 17 and 18 when the housing H and the base plug P
are assembled in force-fit frictional engagement, the heater
assembly TR becomes pressed by the springs 23 so that the flat
dished portion 15 of the heater plate is resiliently located and
presented in the window 7. As seen in FIG. 19 housing H, upon
assembly, locks heater assembly TR against base plug P. The
assembly also places the openings 9 for the reception of the
integrated circuit pins 1 over the internal jacks 37 forming parts
of the exterior terminals 5. Then when, as shown in FIG. 19, the
integrated circuit unit C is plugged in, its inner face 49 will
engage the exposed part 15 of heater plate T as the pins 1 engage
the jacks 37. In FIG. 19 is diagrammatically shown the integrated
circuit connections 51 between opposite pins 1. One pin 1 shown in
one jack 37 is illustrated by dotted lines in FIG. 19. Others have
not been illustrated to avoid confusion in the longitudinal
section.
It is to be understood that the assembled device as shown in FIG.
18 may be plugged into and out of an appropriate circuit board. If
desired, the base P when plugged into the board may be permanently
soldered into place. In either case the device may still be
disassembled for substitution of one heater or another having the
desired regulated temperature characteristic. The circuit board may
be either of the operational type or test type. In the former case,
the device prevents temperature variations in the connected
integrated circuitry caused by ambient temperature changes. In the
latter case the device may be used for so-called "burning-in" of
newly manufactured integrated circuits, which means subjecting them
for a period of time to a certain temperature to stabilize them.
The device may also be used as a heat test socket for testing
circuit parameters of various integrated circuits.
It is to be understood that, while the separability of the housing
and plug parts H and P for substitution of heaters is a desirable
feature, if separability is not desired, they may be permanently
joined as with a suitable adhesive, or by integral molding around
the heater assembly.
It may be remarked that the heating element exhibits moderate
conductivity at temperatures below its stabilized temperature. As
the temperature approaches the stabilized temperature, the
conductivity of element 11 decreases rapidly. The application of a
substantially fixed voltage to the heater results in fast warmup
with no temperature override. This is due to the marked
conductivity change in the control temperature. For example, in one
form of the device, warming up from -55.degree. C. ambient, the
device will draw about 6 watts for 30 seconds at 24 volts. It will
stabilize in about 21/2 minutes, reducing its power requirement to
about 11/2 watts steady-state at -55.degree. C. The device adjusts
its steady-state requirement as dissipation conditions change.
Steady-state power, for instance, decreases linearly with
increasing ambient to about 0.3 watts at 60.degree. C. ambient.
In view of the above, it will be seen that the several objects of
the invention are achieved and other advantageous results
attained.
As various changes could be made in the above constructions without
departing from the scope of the invention, it is intended that all
matter contained in the above description or shown in the
accompanying drawings shall be interpreted as illustrative and not
in a limiting sense.
* * * * *