U.S. patent number 3,577,105 [Application Number 04/828,891] was granted by the patent office on 1971-05-04 for method and apparatus for joining plated dielectric-form waveguide components.
This patent grant is currently assigned to N/A. Invention is credited to Howard S. Jones, Jr..
United States Patent |
3,577,105 |
Jones, Jr. |
May 4, 1971 |
METHOD AND APPARATUS FOR JOINING PLATED DIELECTRIC-FORM WAVEGUIDE
COMPONENTS
Abstract
A plated dielectric waveguide component which includes a
dielectric foam substrate propagating medium and a thin metallic
surface encapsulating the substrate for carrying a conducting
current therealong and a method of interconnecting the same. The
waveguide component has a quarter wavelength step-shaped end which
may be readily butt joined with another plated dielectric waveguide
component having a similar construction and matching end whereby a
lightweight, sturdy and highly efficient connection is
obtained.
Inventors: |
Jones, Jr.; Howard S.
(Washington, DC) |
Assignee: |
N/A (N/A)
|
Family
ID: |
25253016 |
Appl.
No.: |
04/828,891 |
Filed: |
May 29, 1969 |
Current U.S.
Class: |
333/239; 333/35;
403/339; 333/254; 403/364 |
Current CPC
Class: |
H01P
1/042 (20130101); Y10T 403/65 (20150115); Y10T
403/7045 (20150115) |
Current International
Class: |
H01P
1/04 (20060101); H01p 001/04 (); H01p 003/12 ();
F16b 007/00 () |
Field of
Search: |
;333/95,98,35
;29/600,601 ;174/91--92 ;287/64,103 ;156/48--49 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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|
|
|
|
|
|
1,025,473 |
|
Mar 1958 |
|
DT |
|
1,047,895 |
|
Dec 1958 |
|
DT |
|
Other References
Beardow, T., "Waveguide Manf. Techniques," British Communications
& Electronics, 10001958 pp. 776--777.
|
Primary Examiner: Saalbach; Herman Karl
Assistant Examiner: Punter; William H.
Claims
I claim:
1. A plated dielectric waveguide component comprising:
a dielectric substrate as a propagating medium,
a thin metallic surface encapsulating said substrate for carrying a
conducting current therealong, and
wherein said waveguide component formed of said combination
dielectric substrate and thin metallic surface has at least one
step-shaped end for allowing a butt joint interconnection with
another waveguide component having a similarly shaped end.
2. A plated dielectric waveguide component as in claim 1 wherein
said step-shaped end is of a quarter wavelength.
3. A plated dielectric waveguide component as in claim 1 wherein
said butt joint interconnection is made permanent by use of a
conductive sealer.
4. A plated dielectric waveguide component as in claim 2 wherein
said dielectric substrate is a low-loss dielectric foam.
5. A plated dielectric waveguide component as in claim 4 wherein
said thin metallic surface is copper.
6. A plated dielectric waveguide component as in claim 2 wherein
said step-shaped end includes an extending portion having an
aperture therein and a recessed portion having a post attached
thereto whereby said butt joint interconnection with another
waveguide component having a similarly shaped end is facilitated by
allowing the respective posts and apertures to be aligned and
interconnected.
7. A plated dielectric waveguide component as in claim 6 wherein
said aperture and post are formed out of said substrate which is a
dielectric foam.
8. A plated dielectric waveguide component as in claim 6 wherein
said aperture and post are respectively a groove and tongue.
9. A plated dielectric waveguide component as in claim 6 wherein
said aperture and post are of the dowel type.
10. A plated dielectric waveguide component as in claim 6 wherein
said butt joint interconnection is sealed by the use of a
conductive sealer.
Description
BACKGROUND OF THE INVENTION
This invention relates generally to plated dielectric-foam
waveguide components and more particularly to a unique method and
apparatus for the interconnection of plated dielectric-foam
waveguide components.
In the past, the weight and bulk of most waveguide systems stemmed
from their use of metal waveguides and flanges with thick walls.
The standard waveguide components used in such systems were
generally made of brass or copper-alloy tubing having a wall
thickness of 0.125 to 0.025 inches. Some weight reduction was found
possible with the use of aluminum and magnesium guides, but these
were found to be quite expensive. In addition, further weight
reduction could be obtained by properly designing the waveguide
components for minimum volume and by fabricating the same as a
complete system by milling, dip brazing, electroforming or
investment casting.
Understanding that the thick wall of a standard air-filled
waveguide, as discussed above, is essential only for rigidity,
since the current of a propagating wave is concentrated in a very
thin layer (10.sup..sup.-5 to 10.sup..sup.-2 cm.) on the inner wall
surface, there has recently been developed a waveguide component
which uses a low-loss, rigid dielectric substrate as the
propagating medium, rather than air. With such a dielectric
substrate, the need for use of a thick waveguide wall becomes
unnecessary. Instead, a thin metallic surface (approximately 0.005
inches) encapsulating the dielectric substrate is sufficient to
carry the conducting current. Such a plated dielectric waveguide
component has proved to be much lighter than that of the previously
discussed standard metal waveguide and is also cheaper to make.
Interconnections between various waveguide components of both the
standard metal type and the recently developed plated dielectric
type have in the past been accomplished by the use of flange
elements at the respective ends of the waveguide components to be
connected. In each instance, a plain flange and a quarter wave
choke flange would be used to provide the necessary connection
between the waveguide components. Ordinarily at the discontinuity
between the two interconnected waveguide components standing waves
and reflections would occur due to a mismatch in the electrical
energy flowing from one waveguide component to the other. The use
of the back-to-back quarter wave choke flange and the plain flange
were found to be somewhat satisfactory in improving the
above-mentioned mismatch by minimizing the reflections and standing
waves set up at the discontinuity and there reduce losses caused by
the same. However, the flange elements having a larger cross
section than that of the waveguide components themselves were
heavy, bulky and expensive and required the use of a quarter wave
matching choke. Moreover, with the plated dielectric-type
waveguide, the plated foam flanges were very delicate and generally
required a metal insert for reinforcement.
SUMMARY OF THE INVENTION
Accordingly, one object of the present invention is the provision
of a new and improved plated dielectric-type waveguide
component.
Another object of this invention is the provision of a new and
improved plate dielectric-type waveguide component which is
lightweight and easy to construct.
A further object of this invention is the provision of a new and
improved plated dielectric-type waveguide component which may be
readily interconnected with other waveguide components.
Still another object of the subject invention is to provide a new
and improved unique plated dielectric-type waveguide component
which is capable of joinder with other waveguide components to
provide a better matched connection than heretofore existed and at
the same time, eliminate the need for flange elements.
Yet another object of the instant invention is the provision of a
new and improved plated dielectric waveguide component which may be
readily interconnected with other waveguide components to give a
connection of the same cross section as that of the waveguide
component itself.
Yet still another object of this invention is the provision of a
new and improved method of interconnecting plated dielectric-type
waveguide components.
One other object of this invention is the provision of a new and
improved method for interconnecting a plated dielectric-type
waveguide component which has a step-shaped end portion which may
be readily aligned with a similar step-shaped end of another
waveguide component to provide a low-loss butt joint
connection.
BRIEF DESCRIPTION OF THE DRAWINGS
A more complete appreciation of the invention will be readily
obtained as the same becomes better understood by reference to the
following detailed description when considered in connection with
the accompanying drawings wherein:
FIG. 1 is a side view of an interconnection between two plated
dielectric waveguide components according to the present
invention;
FIG. 2 is a cross-sectional view taken along the lines 2-2 of one
of the waveguide components of FIG. 1;
FIG. 3 is a perspective view of one embodiment for interconnecting
plated dielectric waveguide components in accordance with the
present invention; and
FIG. 4 is a side view of still another manner for interconnecting
the plated dielectric waveguide components in accordance with the
present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring now to the drawings wherein like reference numerals
designate identical or corresponding parts throughout the several
views, and more particularly to FIG. 1 thereof wherein a waveguide
component in accordance with the present invention is shown as
having a step-shaped end connecting portion 16 which includes an
extending portion 18 and a recessed portion 20. The waveguide
component 10 may be readily joined with another waveguide component
11 which has a similarly shaped end portion which may be butt
joined to the waveguide component 10. The step-shaped portion is
preferably of a quarter wave length and as such will provide a
low-loss connection and thereby allow the energy from one waveguide
component to propagate to the other waveguide component with very
little reflections or standing waves present. If a permanent joint
is desired, the two respective end portions of the waveguide
components 10 and 11 may be sealed by the use of any conventional
conductive adhesive, such for example as the type provided by
Emerson and Cumming or Dupont.
FIG. 2 shows a cross-sectional view taken along the lines 2-2 of
the waveguide component 10 at FIG. 1. The cross-sectional view
shows the waveguide 10 having a dielectric substrate 12 and a thin
metallic outer surface 14 encapsulating the substrate. The
dielectric substrate 12 is used as the waveguide propagating medium
and may be any of several solid or foam dielectrics, such for
example as polystyrene, styrofoam, polyurethene foam or the like.
The thin metallic surface 14 encapsulating the substrate 12 may be
of any conductive material, such for example as copper or silver. A
more detailed description of the dielectric substrates and
encapsulating metallic surfaces, as well as the manner of plating
the same, may be obtained from the article in Microwaves, July,
1965, entitled "Plated-Dielectric Waveguide Components" by Howard
S. Jones and Richard A. Norris.
Referring now to FIG. 3, an alternative embodiment for
interconnecting the waveguide components 10 and 11 according to the
present invention is therein shown. In particular, an aperture such
for example as the aperture 22, in the extending dielectric portion
16 of the waveguide component 10 and a post, such for example as
the post 24, protruding from the recessed dielectric portion 20 of
the same waveguide component 10 is provided for facilitating a butt
joint connection with another waveguide component. For example,
waveguide component 11 is shown as including in a similar fashion
an aperture 26 and a post 28 in such a manner that the two
waveguide components 10 and 11 may be readily aligned and
interconnected. With such a connection the need for a permanent
seal may be eliminated so that the waveguide components may be
readily disconnected for other use. Moreover, it should be
understood that while the apertures and posts have been shown as
being of the dowel type that other connecting elements may be
readily used. For example, the aperture and posts could be of the
tongue and groove type, as illustrated in FIG. 4.
It should now be apparent that the plated dielectric waveguide
component of the herein described invention allows for
interconnection of the same with other similar waveguide components
in a low-loss, lightweight and efficient manner. Moreover, it
should be apparent that with the step-shaped connection according
to the hereinabove described invention, the cross section of the
connection is the same as that of the component itself and thereby
both conserves space and reduces cost.
I wish it to be understood that I do not desire to be limited to
the exact details of construction shown and described, for obvious
modifications will occur to a person skilled in the art.
* * * * *