U.S. patent number 3,567,903 [Application Number 04/746,055] was granted by the patent office on 1971-03-02 for method of bonding particles into unitary bodies.
This patent grant is currently assigned to Quanta Welding Company. Invention is credited to John C. Parker.
United States Patent |
3,567,903 |
Parker |
March 2, 1971 |
METHOD OF BONDING PARTICLES INTO UNITARY BODIES
Abstract
A method for bonding particles into an integrated mass by
placing the particles, which may be in powder form, in a confining
structure, and applying to the body of powder a controlled pulse,
impulse or burst of electrical or electromagnetic energy, or a
combination thereof, in conjunction with a controlled pressure
pulse.
Inventors: |
Parker; John C. (Bloomfield
Hills, MI) |
Assignee: |
Quanta Welding Company
(Melvindale, MI)
|
Family
ID: |
24999308 |
Appl.
No.: |
04/746,055 |
Filed: |
July 19, 1968 |
Current U.S.
Class: |
219/149;
419/52 |
Current CPC
Class: |
B22F
3/02 (20130101); B23K 11/00 (20130101); B22F
3/14 (20130101) |
Current International
Class: |
B23K
11/00 (20060101); B22F 3/14 (20060101); B22F
3/02 (20060101); B21j 001/06 (); H05b 001/00 () |
Field of
Search: |
;219/149 ;75/226
(Inquired)/ |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Bartis; A.
Assistant Examiner: Rouse; Lawrence A.
Claims
I claim:
1. A method of forming a body of weldable material comprising the
steps of amassing particles of weldable material, imposing a
compressive force over an area of the amassed particles and
applying electrical energy in a single pulse of a current density
of at least a million amperes per square inch for an interval of
the order of a millisecond to said compressed mass of particles to
bond said mass of particles into a unitary body.
2. A method according to claim 1 including the step of confining
said amassed particles to a predetermined form during the
application of compressive force and electrical energy to establish
the shape of said body.
3. A method according to claim 1 including the steps of increasing
the application of compressive force and electrical energy to said
particles with time and wherein said compressive force is peaked in
magnitude within a millisecond of the peaked magnitude of said
pulse form of electrical energy.
4. A method according to claim 1 wherein a common electrode is
employed to apply said compressive force and said electrical energy
to said amassed particles.
5. A method according to claim 1 including the step of mounting a
sheet of weldable material in contact with said amassed particles,
whereby said sheet is bonded to the bonded mass of particles.
6. A method according to claim 1 including the step of mounting a
filament within the body of amassed particles, whereby said
filament is embedded within said bonded mass of particles.
7. A method according to claim 6 wherein said filament is of a
material weldable with said material of said particles whereby said
filament is bonded in a matrix of said bonded particles.
8. A method according to claim 1 including the step of controlling
the current density of said electrical energy distributed across
the surface regions of said amassed particles as a function of the
resistivity of the amassed particles in registry with said surface
regions.
9. A method according to claim 8 wherein said function is an
inverse relationship.
10. A method according to claim 1 including the step of imposing a
greater compressive force on a predetermined surface region of said
amassed particles subjected to compressive force than on other
regions subjected to compressive force whereby the bonded mass in
registry with said predetermined surface region along the axis of
compressive force is of greater density than that bonded mass in
registry with said other regions along the axis of compressive
force.
11. A method according to claim 1 including the step of imposing a
greater current density through a predetermined region of said
amassed particles than through other regions of said amassed
particles whereby the bonded mass in said predetermined region is
of greater density than the bonded mass in said other regions.
12. A method according to claim 1 including the step of applying an
additional pulse of electrical energy of a current density of at
least a million amperes per square inch for an interval of the
order of a millisecond to said amassed particles.
13. A method according to claim 1 including the steps of increasing
the electrical energy and compressive force applied to said amassed
particles with time wherein the compressive force imposed during
the current pulse is sufficient to prevent sparking between
particles in the mass and the peak of electrical energy is time
displaced from the peak of the imposed force.
14. A method according to claim 1 including the step of mounting a
continuous surface of weldable material in contact with said
amassed particles whereby said mass of particles is bonded to the
surface.
15. A method according to claim 1 comprising the steps of amassing
additional particles of a weldable material in contact with said
first bonded mass of particles, imposing a compressive force over
an area of said additional particles, and applying electrical
energy in a single pulse of a current density of at least a million
amperes per square inch for an interval of the order of a
millisecond to said additional particles to bond said additional
particles into a unitary mass bonded to said first bonded mass.
Description
SUMMARY OF THE INVENTION
This invention relates to a method for bonding particles into an
integrated mass of controlled form.
Heretofore, it has been known to sinter metal particles of various
compositions, sizes and forms into integrated masses of desired
form by mechanically compacting the particles, with or without
additives such as lubricants to enhance compaction or binders to
retain the compacted form, to a green compact. The green compact is
then heated to temperatures generally within the range of
two-thirds to four-fifths of the absolute temperature melting point
of the metal to bond the particles into an integrated mass.
These sintering processes can be accomplished without a liquid
phase, particularly where all particles are of material having
similar melting temperatures or with a liquid phase present, as
where a material of the particle mix has a low melting temperature
relative to other materials. Various techniques for heating the
green compact have been employed including resistive heating
wherein direct or alternating current is passed through the compact
to raise its temperature to the sintering range.
The present invention involves bonding particles into an integrated
mass by subjecting a body of the particles to a controlled pressure
pulse and applying a controlled pulse of electrical or
electromagnetic energy to the pressed body. Energy pulses of short
duration, either single pulses or a few successive pulses, are
applied only briefly, e.g. a single pulse of 1,000 microsecond
duration, are employed to bond the particles to each other or to
skins, membranes or filaments of weldable material.
An object of the invention is to improve the method of bonding
particles to other bodies and particularly to simplify the
techniques and apparatus required to bond particles which
heretofore have been bonded by complex sintering techniques and
apparatus.
Another object is to improve the quality of the products formed
from bodies of particles bonded together.
A further object is to bond a broad class of materials which are in
finely divided form without subjecting those materials to sintering
temperatures.
DESCRIPTION OF THE DRAWING
FIG. 1 is a flow diagram of the method of this invention;
FIG. 2 is a schematic diagram of one form of apparatus for the
practice of this invention;
FIGS. 3a and 3b are plots of typical single and double pulse
programs including pressure and electrical control and applied
pressure pulses vs. time; and
FIGS. 4--6 are photomicrographs of cross sections of typical
integrated bodies produced according to this invention.
DESCRIPTION OF THE PREFERRED EMBODIMENT
As set forth in FIG. 1, the invention comprises the method of
bonding finely divided particles of weldable material into an
integrated body of a density depending upon the pressures imposed
during bonding. The process involves the simultaneous application
of one or more high power electrical pulses in sychronism with
pressure pulses to a body 11 of finely divided particles confined
between two or more pressure-platens 12 and 13 through which the
pressure and in the example electrical energy is applied.
As a first step, the particles which may be produced by reduction
of oxides, electrolysis, atomization or mechanical comminution may
be of a wide range of sizes of from 0.5 micron diameter and may be
uniformly sized, mixed in size, or stratified as to sizes. The
variations in parameters in part determine the physical properties,
especially density, of the ultimate integrated body. Crystal
particles of angular of flake form can also be bonded together or
mixed and bonded with powder forms of particles. Sheets, bars,
fibers or filaments can also be bonded with the particles in the
powder or crystal form both within the matrix developed from the
particles and as skins on that matrix. The arrangement shown in
FIG. 2 depicts an upper and lower outer skin 14 and 15 applied to
the outer faces of the mass of particles.
As with welding, mixtures of metals can be bonded by this method
and nonmetallic weldable materials can be bonded to each other and
to metals. Where fibers or filaments are embedded in the matrix
they can be prestressed, and can be arrayed to develop optimum
strengths for the ultimate product. A mass of particles may be
piled on a pressure-platen with no external lateral constraint
other than the vector forces within the particle array of material
or developed by the shape of the platen. However, the preferred
technique is to provide lateral constraint of a mold or cell as the
split ring 16 into which at least one electrode-platen closely fits
for relative motion along the compression axis. A guide 17
maintains washer 16 in place and receives platen 13 for
reciprocation.
In FIG. 2 the pressure-platens 12 and 13 are also the electrodes
for passing the electrical pulses to the particle mass 11. Shunting
of the pulses around the mass 11 is avoided by insulating the ring
16 as by forming it of an insulating material such as teflon.
The constraining mold or cell is advantageously vented to permit
any gas developed in the bonding process to escape. Such gases can
be vented laterally as through the split (not shown) of the ring 16
with little or no flow of the particles into the vent.
The upper pressure platen 12 is stationary in the illustrative
embodiment and the lower pressure platen is moveable along a path
toward the upper platen by a pneumatic piston and cylinder having
locking means to maintain the initially compressed work piece (none
of which is shown). The force mechanism 18 also includes a pressure
transformer acting on the lower platen to be superimposed upon the
initial force. This second applied force can be of a to compact the
body of particles to be bonded prior to the application of pulsed
electromagnetic energy thereto, and can be developed in equipment
of the type depicted in U.S. Pat. No. 3,059,094 of Oct. 16, 1962 to
A. Vang for "Pressure Transformer." When the electrical energy is
pulsed through pressure platens 12 and 13 a pressure pulse is
imposed by the pressure transformer of the force mechanism 18 of
the Vang patent.
In practice, pneumatically developed pressures of the order of 3000
p.s.i. have been employed. These pressure levels are not considered
to be critical and can be varied over a wide range. The pressures
superimposed thereon by the pressure transformer can be of a peak
value of the order of 2000 p.s.i. imposed with a wave form as
illustrated at A in the curves of FIG. 3. However, the compacting
pressure actually imposed upon the sample is presumed to be
considerably less than the sum of these pressures since the pulse
of electrical energy into the electrode-platens 12 and 13 develops
a repulsive force therebetween of undetermined value. The particles
may reorient themselves under the influence of the electric,
magnetic and/or electromagnetic fields through the mass of
particles whereby they interfit more closely and ultimately bond
into the unitary mass, and thermal or chemical changes may occur as
by the breakdown of surface films on the particles, and expulsion
of the products of such breakdown. Thus, it is believed that the
maximum pressure imposed on the particles are substantially less
than the peaks generated by the pressure transformer since a
preponderance of that pressure as developed against a relatively
unyielding measuring device is utilized in the process to overcome
the repulsive force and comply with the shrinkage of the processed
mass.
One electrical control wave form which has been employed is shown
in FIG. 3. It was developed in the secondary 19 of a welding
transformer 21 having a primary 22 connected to a power source 23
through an electronic switch 24 controlled in timed relation to the
pressure from the pressure transformer of the force mechanism 18 by
a process control unit 25. Excellent bonds have been made with
single impulses of 32,600 joules per cubic inch of material to be
bonded applied over an interval of 1000 microseconds.
It will be noted from FIG. 3 that step function input is applied
from the power switch 26 to the pulse transformer of force
mechanism 18 approximately 90.degree. in advance of the bond
impulse applied from electronic switch 24 to the bond transformer
21 and persists for about 120.degree. or about 5.5 milliseconds.
This results in a pressure wave form which peaks about 135.degree.
after the initiation of the pressure signal and the process control
25 times the bond power switch to pass power as a step function
approximately 90.degree. or 4.1 milliseconds after pressure power
is initiated. This power is sustained for about 1000
microseconds.
It is theorized that the mechanism involved in the bonding involves
electrostatic or electromagnetic forces which are imposed across
the particle interfaces in magnitudes sufficient to cause diffusion
of the atoms to establish atomic bonds across the interfaces as a
solid-state bond. That is the energy pulse is of such short
duration that undesirable melting of the composite structure is
avoided and no significant temperature rise in the integrated mass
is observed. Concentration of the applied energy at the particle
surfaces is suggested since the inner structure of the particles is
of low electrical resistance as compared with that across the
interfaces.
As shown in FIG. 3, the energy can be a single pulse or a plurality
of pulses which can be unidirectional or of alternating sign.
Further, if the pressure impulses are so close that the induced
magnetic field does not decay between pulses, a build up of forces
can result when plural pulsing is employed. Thus some time spacing
can be employed between multiple pulses to insure uniform pressure
applications.
The form at the electrode determines the distribution of energy in
the body of particles to be bonded. Thus, where energy is to be
applied to a circular disc having a periphery thicker than its
center, the electrode structure would be more massive in the area
in registry with the periphery and will be thinned in the area of
the center. In such an instance the electrode is concave to conform
to the ultimate shape of the part to be bonded and the thinned
region is backed up with a nonconductive material which provides
the requisite support for the application of compressive forces
while reducing current density in that region. Variations in the
resistivity of the amassed particles, as by variations in the body
form of the particles of a region of the body, can be accommodated
in the bonding by application of current densities at the
electrode-mass interface which are inversely related to the
resistivity of the underlying mass of material. A line of ridges in
a pressure platen can be employed to impose greater compressive
forces in the body of particles registering with the ridges whereby
the region of greatest compression is bonded to the greatest
density while that of less compression tends to offer porous
internal passages or channels.
A bonded body having the characteristics of a thermally sintered
body of pure iron has been produced from pure electrolytic iron
powder. The powder was placed in a split teflon ring 16 and
compressed between parallel planar surfaces of unitary
electrode-platens of electrolytic copper. The pneumatic jack of
force mechanism 18 was actuated to raise the lower electrode-platen
and impose 3000 p.s.i. on the powder body. Bonding was completed to
the form shown in FIG. 4 by the application of 32,600 joules per
cubic inch in a single pulse of 1000 microseconds and the pressure
switch turned on 4.2 milliseconds ahead of the initial application
of electrical energy and turned off about 0.5 milliseconds ahead of
the termination of the application of electrical energy.
The photomicrograph of FIG. 4 is for a polished sample and is at a
magnification of four hundred. It will be noted that bonds are
established uniformly throughout the body while the particles of
powder retain their identity. The samples from which this
photomicrograph was made were pellets one-fourth inch in diameter
and one-sixteenth inch thick.
FIG. 5 is a photomicrograph of a sample of electrolytic iron powder
bonded to a skin 27 of steel foil and shows the bond between the
foil and the integrated mass of bonded powder 28 as an effective
unitary structure. Membranes or skins such as titanium or steel
foil in laminate form or as an exterior skin can be formed in the
bodies produced by this method.
FIG. 6 is a photomicrograph of a sample of electrolytic iron powder
in which glass fibers 29 are embedded. A mechanical lock
established between the matrix 31 of bonded powder and the fibers
enables the fibers to function as reinforcement. Titanium powder
can be bonded in a mass with boron filaments as reenforcement with
the present method and achieve a bond between the matrix and the
filaments.
Other embodiments of the product of this method is a matrix of
bonded weldable particles in which is embedded a mesh or cloth of
wire or glass; or solid structures such as invested rods, handles,
brackets or inserts; or metallized ceramic or oxide particles.
Further, combinations of skins and internal filaments can be made
with the bonded particles of the matrix.
Variants on the method of forming bodies from a mass of particles
utilizing a correlated pressure and electrical impulse of high
energy and short duration include the practice of the method in
special environments as in a vacuum or an inert reducing
carburizing or decarburizing atmosphere. Where extended body forms
are to be produced the process can be practiced on increments of
the material in a continuous operation where bonding is
accomplished to previously bonded body portions while bonding the
particles.
The illustrative examples of the method have not set forth the
variants necessary for irregular shaped products of the method in
any detail. It is to be understood that a multiplicity of
pressure-platens can be employed to vary the compaction applied to
the various portions of the body being bonded and that these
pressures can be directed along axes which are parallel or
angularly related. Further one or more of the pressure-platens can
be isolated from the applied electrical energy or the electrodes
for applying the energy can be separate from all platens so that
the current paths need hot be parallel to the axis along which
pressure is imposed. While a combination of pneumatic pressure
followed by pressure from a pressure transformer has been shown,
other pressure sources can be employed if their pressure pulses can
be synchronized with the electrical pulses during bonding, for
example, hydraulic actuators or detonating devices may be applied
as the force mechanism 18. Accordingly, the above description is to
be read as illustrative of the invention and not in a limiting
sense.
* * * * *