U.S. patent number 3,818,386 [Application Number 05/138,356] was granted by the patent office on 1974-06-18 for solid-state modular microwave system.
This patent grant is currently assigned to Texas Instruments Incorporated. Invention is credited to Doyle S. Granberry.
United States Patent |
3,818,386 |
Granberry |
June 18, 1974 |
SOLID-STATE MODULAR MICROWAVE SYSTEM
Abstract
A solid-state, modular microwave transmitter-receiver assembly
made up of a large number of transmit-receive modules each having
an antenna. Each of the modules has functional electronic blocks
mounted on both sides of a center mounting plate contained within a
hermetically sealed package. The module packages generally conform
to the center mounting plate and are elongated, with a greater
width than thickness. The antenna extends from the front end of the
module and connectors extend from the rear end. The connectors are
plugged into a rear support structure and are retained in place by
a series of retaining plates fastened by long screws to the rear
support structure. The retaining plates also form the ground plane
for the antenna array. The antennae are arrayed in horizontal rows
and vertical columns, and the module packages are arranged in rows
extending diagonally of the antenna rows and columns with the edges
of the packages in each row abutting. A cooling fluid duct is
formed between each adjacent pair of module rows by the walls of
the module packages, the retaining plates and the rear support
structure. A manifold and header assembly directs cooling fluid in
opposite directions through alternate cooling fluid ducts. The
antenna assembly of each module provides a hermetically sealed
coupling between the antenna and the interior of the package,
supports the dipole elements, and provides impedance and balun
transforming. The functional electronic blocks are easily secured
on the mounting plate by spot welded brackets and are replaceable.
The hermetically sealed antenna assembly and coaxial input and
output connections are connected to microstrip lines within the
module by spot welded straps of solid ribbon or woven metal wire
fabric, as are adjacent microstrip lines on adjacent abutting
functional electronic blocks. Connections are made between
functional electronic blocks on opposite faces of the mounting
plate by a special coaxial structure extending through the mounting
plate.
Inventors: |
Granberry; Doyle S. (Dallas,
TX) |
Assignee: |
Texas Instruments Incorporated
(Dallas, TX)
|
Family
ID: |
26836129 |
Appl.
No.: |
05/138,356 |
Filed: |
April 28, 1971 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
|
|
889780 |
Dec 15, 1969 |
|
|
|
|
628140 |
Apr 3, 1967 |
3549949 |
|
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Current U.S.
Class: |
333/33; 333/238;
342/371; 343/865; 333/34; 333/243; 343/822 |
Current CPC
Class: |
H01Q
21/062 (20130101); H01Q 21/0025 (20130101); H01Q
9/20 (20130101); H01Q 1/02 (20130101) |
Current International
Class: |
H01Q
1/02 (20060101); H01Q 9/20 (20060101); H01Q
9/04 (20060101); H01Q 21/00 (20060101); H01Q
21/06 (20060101); H03h 007/38 () |
Field of
Search: |
;333/84M,97,34,33
;343/854,821,822,852,865 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Lawrence; James W.
Assistant Examiner: Chatmon, Jr.; Saxfield
Attorney, Agent or Firm: Levine; Harold Comfort; James T.
Dixon; James O.
Parent Case Text
This is a divisional application of application Ser. No. 889,780
filed Dec. 15, 1969 now abandoned, which in turn was a divisional
application of application Ser. No. 628,140 filed Apr. 3, 1967, now
U.S. Pat. No. 3,549,949.
Claims
What is claimed is:
1. In a microwave module, the combination of:
a hermetically sealed package having a mounting plate with a
sidewall disposed generally normal thereto,
a hermetically sealed transmission line extending through the
sidewall having a center conductor terminating within the
package,
a functional circuit block mounted on the mounting plate having a
microstrip transmission line terminating adjacent the end of the
center conductor, and
a metal strap interconnecting the microstrip transmission line and
the center conductor, the metal strap having a width selected to
substantially match the characteristic impedance of the coaxial
transmission line with the characteristic impedance of the
microstrip transmission line.
2. The combination defined in claim 1 wherein the package is
further characterized by:
a second sidewall disposed generally normal to the mounting
plate,
a second hermetically sealed coaxial transmission line extending
through the second side wall having a center conductor
terminating within the package,
a second circuit block mounted on the mounting plate having a
microstrip transmission line extending to a point adjacent the end
of the center conductor of the second coaxial transmission line,
and
a second metal strap interconnecting the end of the center
conductor of the second coaxial transmission line and the end of
the second microstrip transmission line, the width of the metal
strap being selected to substantially match the characteristic
impedance of the second coaxial transmission line to the impedance
of the second microstrip transmission line,
the circuits on the first and second circuit blocks being
interconnected by microstrip transmission lines.
3. The combination defined in claim 2 wherein the microstrip
transmission line interconnecting the circuits on the first and
second circuit blocks includes at least one joint comprising:
a pair of microstrip transmission lines extending to the respective
adjacent edges of a pair of circuit blocks and a metal strap
spanning the gap between the circuit blocks and connected to each
of the microstrip transmission lines, the width of the metal strap
being selected to substantially match the characteristic impedance
of one of the microstrip transmission lines to the characteristic
impedance of the other microstrip transmission line.
4. The combination defined in claim 1 wherein said strap is a solid
metal ribbon having a width substantially greater than its
thickness.
5. The combination defined in claim 1 wherein said strap is woven
wire fabric.
6. In a microwave module, the combination of:
a metal mounting plate,
first and second circuit blocks mounted on the mounting plate in
edge-to-edge relationship,
first and second microstrip transmission lines on the first and
second circuit blocks, respectively, extending to adjacent points
at the edges of the respective circuit blocks, and
a metal strap bridging the gap between the circuit blocks and
extending over the first and second microstrip lines, the metal
strap being welded to each of the underlying microstrip lines, the
width of the metal strap being selected to substantially match the
characteristic impedance of the first microstrip transmission line
and the characteristic impedance of the second microstrip
transmission line.
7. The combination defined in claim 6 wherein:
the metal strap comprises a solid metal ribbon having a width
substantially greater than its thickness.
8. The combination defined in claim 6 wherein:
the metal strap comprises a woven wire fabric.
9. In a microwave module, the combination of:
a mounting plate having opposite mounting surfaces,
a circuit block mounted on each of the opposite mounting
surfaces,
a bore extending through the mounting plate and disposed adjacent
an edge of each of the circuit blocks,
an insulating sleeve disposed in the bore,
a metallic film coating the outer surface of the insulating sleeve,
the metallic film terminating before reaching the top surface of
either circuit block,
a microstrip transmission line formed on the top surface of each of
the circuit blocks and terminating adjacent the bore, and
a conductor extending through the insulating sleeve and over the
ends of the microstrip transmission lines and bonded to each to
interconnect the microstrip transmission lines, the length of the
metallized film on the sleeve, the size of the sleeve, and the size
of the conductor being selected to substantially match the
characteristic impedance of one of the microstrip transmission
lines to the characteristic impedance of the other microstrip
transmission line.
10. The combination defined in claim 9 wherein the sleeve is
tubular and the conductor is cylindrical.
11. The combination defined in claim 9 wherein the edge of one of
the circuit blocks adjacent the bore is formed by a bore through
the circuit block.
Description
This invention relates generally to microwave transmitting and
receiving, and more particularly relates to solid-state microwave
antenna arrays.
While the specific embodiment of the invention described herein is
an airborne terrain-following radar, this invention is equally
applicable to other radar systems, such as those used for ground
mapping, search and detection, fire control, tracking and
navigation, as well as to microwave transmitting and receiving
generally.
Radar systems in general, and airborne radar systems in particular,
have long required considerable servicing and have been somewhat
unreliable because of the many mechanical parts, such as rotary
joints, motors, synchros, gears and other servo components normally
essential to scanning the system, and the magnetrons used for
transmitting, Kylstrons used for transmitting and local oscillator
service, and the high power transmit-receive (TR) protection
devices, for example. It is also difficult to achieve high power at
higher frequencies and the electronic components mentioned tend to
be more unreliable and less practical as the frequency of the
transmitted and received energy increases.
In copending U.S. Pat. application Ser. No. 397,519, entitled
"Modular Integrated Electronics Radar," filed on behalf of Tom M.
Hyltin, Ser. No. 397,472, entitled "Phased Array Radar Antenna Scan
Control," filed on behalf of Leo A. Chamberlin, Jr., and Ser. No.
397,491, entitled "Integrated Circuit Modular Radar Antenna," filed
on behalf of Harry F. Cooke, et al., all of which were filed on
Sept. 18, 1964 and are assigned to the assignee of the present
invention, a radar system is described which utilizes a large array
of solid-state modules. Each module is substantially a complete
microwave transmitter and receiver. Each module includes the
necessary circuitry for amplifying relatively low RF carrier energy
applied simultaneously to all of the modules, and multiplying the
frequency to a higher frequency for transmission from the antenna.
Each module also includes circuitry for processing high frequency
energy received by the antenna to produce a lower frequency IF
signal, which is also preamplified. In addition, each module
includes phase shifting means for both the transmitted and the
received energy so that the beam from the fixed antenna array can
be electronically scanned. Although an X-band module transmitting
at 9 GHz (9 .times. 10.sup.9 cycles per second) typically has a
transmitting power of only about one watt, when a very large number
of the modules transmit simultaneously, the total transmitting
power is essentially the sum of the power of all of the modules.
Arrays having on the order of thousands of modules are
practical.
In order to operate at high frequencies, the individual antennae of
the array must be spaced about one-half wavelength apart, which for
X-band systems means that the antennae are arrayed in horizontal
rows and vertical columns with about 0.7 inch spacing between the
rows and columns. As a result, the frontal area of each module must
be confined to a square about 0.7 inch on a side. Also, it is
highly desirable to locate the electronic components as close to
the antenna as possible, particularly the circuits operating at the
higher frequencies. Merely obtaining sufficient space within the
module to mount all the functional hybrid or integrated circuits,
even though the circuits are highly microminiaturized, is a serious
problem. Since very large numbers of modules are required, it will
be appreciated that a very large number of relatively high power
devices must be packed into a minimum volume, making it difficult
to provide adequate cooling.
Also, there are very real problems associated with supplying high
frequency signals to th module, transferring the high frequency
signals between the various functional circuits within the module,
transferring high frequency energy between the externally mounted
radiating element and the internal circuitry, and getting the high
frequency signals out of the module while maintaining the module
hermetically sealed. Because of the number of components, it is
also very desirable to be able to replace malfunctioning components
during fabrication, rather than lose the entire module.
This invention is concerned with the structure of the array and
individual modules required in order to achieve high component
density and adequate cooling, economical fabrication costs, low
maintenance requirements, and long service life. This is achieved
by orienting the modules in spaced rows to form cooling fluid ducts
between each two adjacent rows of modules. The rows of modules are
preferably disposed diagonally of the rows and columns of antennae
so that each module can have a maximum width, and thus maximum
circuit mounting area for a given spacing between the antennae. The
mounting area for the circuits is further increased by a package
having a mounting plate extending between midpoints of a peripheral
wall with the solid-state functional electronic components mounted
on both sides of the mounting plate and hermetically sealed by a
pair of lids. Support means for securing the modules in position in
the array also forms the ground plane for the antenna array, and
also two opposite walls of the cooling fluid ducts, and achieves
this without obstructions within the cooling fluid ducts.
The invention is further concerned with an antenna assembly which
mechanically supports a dipole in the proper position, transfers
the RF energy through the wall of the hermetically sealed module
package, and provides the necessary impedance and balun
transformation between the internal transmission line and the
radiating elements.
The invention is also concerned with a means for mounting the
functional electronic blocks on the mounting plate of the module
package, interconnecting functional electronic blocks mounted on
the same side of the mounting plate, interconnecting functional
electronic blocks mounted on opposite sides of the mounting plate,
and interconnecting the blocks and hermetically sealed conductors
extending through the wall of the package.
The novel features believed characteristic of this invention are
set forth in the appended claims. The invention itself, however, as
well as other objects and advantages thereof, may best be
understood by reference to the following detailed description of
illustrative embodiments, when read in conjunction with the
accompanying drawings, wherein:
FIG. 1 is a front perspective view of a microwave antenna array in
accordance with the present invention;
FIG. 2 is an enlarged front view of a portion of the antenna array
of FIG. 1;
FIG. 3 is an exploded perspective view of the parts missing from
the structure illustrated in FIG. 2;
FIG. 4 is a sectional view taken substantially on lines 4--4 of
FIG. 2;
FIG. 5 is a sectional view taken substantially on lines 5--5 of
FIG. 2;
FIG. 6 is an isometric view of an RF module of the array of FIG.
1;
FIG. 7 is a side view of the module of FIG. 6;
FIG. 8 is a sectional view taken substantially on lines 8--8 of
FIG. 7;
FIG. 9 is an edge view of the module of FIG. 6;
FIG. 10 is a front end view of the module of FIG. 6;
FIG. 11 is a rear end view of the module of FIG. 6;
FIG. 12 is a somewhat schematic front view of the antenna array of
FIG. 1 with a portion of the structure removed to better illustrate
certain aspects of the invention;
FIG. 13 is a side view of the structure shown in FIG. 12;
FIG. 14 is a rear view of the structure shown in FIG. 12;
FIG. 15 is a somewhat schematic layout of the functional integrated
and hybrid circuits mounted in one half of the module of FIG.
6;
FIG. 16 is a somewhat schematic layout of the functional integrated
and hybrid circuits mounted in the other half of the module of FIG.
6;
FIG. 17 is a sectional view taken substantially on lines 17--17 of
FIG. 16;
FIG. 18 is a perspective view of the antenna assembly of the module
of FIG. 6;
FIG. 19 is a sectional view taken substantially on lines 19--19 of
FIG. 18;
FIG. 20 is an enlarged view of a portion of FIG. 19;
FIG. 21 is a sectional view taken substantially on lines 21--21 of
FIG. 20;
FIGS. 22A and 22B are somewhat schematic isometric views
illustrating alternative means for mounting the integrated and
hybrid circuits within the module of FIG. 6;
FIG. 23 is a somewhat schematic isometric view illustrating how the
microwave circuits on adjacent substrates may be interconnected;
and
FIG. 24 is a sectional view illustrating the manner in which the
microwave circuits formed on substrates mounted in the different
compartments of the module of FIG. 6 may be interconnected.
Referring now to the drawings, a microwave antenna array
constructed in accordance with the present invention is indicated
generally by the reference numeral 10. The particular antenna array
10 herein described and illustrated is a solid-state,
electronically scanned airborne radar system of the type described
in the above-referenced U.S. Pat. applications. In such a system, a
very large number of very small modules 12, as shown in FIG. 6, are
assembled in an array with the antennae of the modules disposed in
a common plane. Each of the modules is essentially a separate
microwave transmitter-receiver which includes solid-state circuitry
for amplifying a relatively low frequency RF carrier signal, which
can be more easily handled, then multiplying the frequency of the
RF signal several times before it is radiated from the antenna
during a transmit cycle. During the receive cycle, the high
frequency RF signal is mixed with a local oscillator signal to
produce an IF signal which is amplified before leaving the module.
In addition, each module contains phase shift circuitry for both
the transmit and receive cycles in order to electronically scan the
beam from the fixed antenna array. For other applications, however,
such as microwave relay applications, the modules may only
transmit, or only receive, or may not utilize the phase shift
networks for beam steering. This invention is concerned primarily
with the structure of the modules rather than the electronic
function of the modules.
Each of the modules 12 has a metal package with opposite front and
rear end walls 14 and 16 which define a length, opposite edge walls
18 and 20 which define a width, and opposite sidewalls 22 and 24
which define a thickness. The opposite end walls 14 and 16 and
opposite edge walls 18 and 20 are integrally formed and are of the
same height, the height corresponding essentially to the thickness
of the module package. A center mounting plate 26 extends between
midpoints of the opposite edge walls 18 and 20 and the opposite end
walls 14 and 16 and is preferably integral with the sidewalls to
achieve the best possible heat transfer between the mounting plate
and the walls. Walls 14, 16, 18 and 20 provide a continuous wall
which extends around the periphery of the center mounting plate 26,
is normal to the plate 26 and extends beyond both of the opposite
surfaces of the plate 26, thus forming an integral body having a
pair of oppositely facing, open topped chambers indicated generally
by the reference numerals 28 and 30. The chambers 28 and 30 are
hermetically sealed by lids 32 and 34 which may be stitch welded or
soldered around their entire periphery to the edges of the walls
14, 16, 18 and 20. The two lids 32 and 34 and the four walls 14, 16
18 and 20. The two lids 32 and 34 and the four walls 14, 16, 18 and
20 then form a hermetically sealed package.
An antenna assembly, indicated generally by the reference numeral
40, extends through and projects from the front wall 14 and is
hermetically sealed therewith. A pair of hermetically sealed
coaxial connectors 42 and 44 extend through and project from the
rear end wall 16 to provide high frequency connections to the
circuits located within chambers 28 and 30 and are also
hermetically sealed. The connectors 42 and 44 are the male halves
of a conventional plug-in type connector. Similarly, eight low
frequency or D.C. male connectors 46 extend through a ceramic block
48 and provide D.C. connections to the interior of the module. The
ceramic block 48 is hermetically sealed to the end wall 16 and is
hermetically sealed around each of the connectors 46. It will be
noted that one of the coaxial connectors and four of the D.C.
connectors extend into each of the chambers 28 and 30. An indexing
pin 50 also protrudes from rear end wall 16 to insure that he
otherwise symmetrical package is inserted in the proper manner in
the female receptacle for the connectors 42, 44 and 46. A pair of
essentially semicircular grooves 52 and 54 extend the length of the
edge walls 18 and 20, respectively. A forward facing, recessed
shoulder 56 is formed around the periphery of the front face 14 by
machining for purposes which will hereafter become evident.
Each of the modules 12 is plugged into a femal receptacle carried
by a rear support structure indicated generally by the reference
number 60 in FIGS. 4 and 5. The rear support structure 60 includes
a support plate 62 which is coextensive with the octagonal housing
as illustrated in FIG. 12. At each position where a module 12 is to
be plugged in, the support structure 60 provides a D.C. socket 64
for the eight low frequency connectors 46, a pair of female coaxial
sockets 66 and 68 for the male coaxial connectors 42 and 44, and a
bore 70 for the indexing pin 50. The D.C. sockets 64 are mounted on
a D.C. wiring board 72 and extend through an opening in support
plate 62 to a point essentially flush with the front face of plate
62. The coaxial sockets 66 and 68 are mounted on an RF sub-manifold
74 and extend through the D.C. wiring board 72 and partially
through the support plate 62.
When the modules 12 are plugged into the sockets carried by support
structure 60, the modules are arrayed as illustrated in FIGS. 2 and
12. It will be noted from FIG. 2 that the antenna assemblies 40 are
arrayed in orthogonally disposed horizontal rows and vertical
columns with the center-to-center spacing approximately one-half
wavelength, which at 9 GHz is approximately 0.7 inch. However, the
modules 12 are arrayed in rows extending diagonally of the rows and
columns of the antenna assemblies 40, and are disposed in
substantially edge abutting relationship as best seen in FIG. 12.
Since the width of each module is substantially greater than the
thickness, the rows of modules 12 are spaced apart and the
sidewalls of the modules in each adjacent pair of rows form the
opposite sidewalls of cooling fluid ducts 80a and 80b. The ducts
80a and 80b are identical but are designated by different reference
characters for purposes which will hereafter become more
evident.
The modules 12 are secured in place in their respective sockets by
means of a plurality of H-shaped clamp plates 82, as best shown in
FIG. 3. Each plate 82 is formed from metal and has an electrically
conductive sealing gasket 84 over its rear face. The total
thickness of each plate 82 is equal to the distance the shoulder 56
is recessed from the front surface of the front end wall 14. Each
plate 82 has a narrow center section 82a which is adapted to fit
over the shoulders 56 at the adjacent ends of two adjacent modules.
A relatively long screw 86 passes through each center section 82a
and extends back through the passageway formed by the adjacent
semicircular grooves 52 and 54 of the two adjacent modules and is
threaded into the support plate 62, as shown in FIGS. 4 and 5. The
ends 82b of the plates 82 extend over the adjacent ducts 80a and
80b and engage the shoulders 56 of the modules in the two adjacent
rows. Thus, a single plate 82 engages and secures four modules in
place, and conversely each module is secured in place by four
plates and four screws. Edges 82c of the plates extend into
engagement with the corresponding edges 82c of the adjacent plates
so that the combination of plates 82 provides a complete front wall
for the cooling fluid ducts. It will be noted that plates 82 and
the support plate 62 form the other two opposite sidewalls of the
cooling fluid ducts 80a and 80b. The gasket material 84 prevents
excessive leakage of the cooling fluid. In addition, the front
surfaces of the plates 82 are coplanar with the front surfaces of
the end walls 14 and the combined surface acts as the ground plane
for the antenna array. The conductive gasket material 84 insures
good electrical contact between the plates and the modules.
Referring once again to FIGS. 12, 13 and 14, a cooling fluid header
88a supplies cooling fluid, typically ambient air, under pressure
to ducts 80a through inlet ports 90a, and exhausts cooling fluid
from ducts 80b through exhaust ports 92a. Similarly, a header 88b
supplies cooling fluid under pressure to ducts 80b through input
ports 90b and exhausts the cooling fluid from ducts 80a through
exhaust ports 92a. The ports 90a and 92a and 90b and 92b are formed
by plates 95a and 95b which extend between the rear support plate
60 and a front plate 94 (see FIG. 13) which is coplanar with the
retainer plates 82 (see FIG. 3) and which therefore provides a
continuation of the ground plane. Mounting holes 93 are provided in
plate 94 to support the device. Plates 97 and 99 may extend around
the remaining peripheries of plates 60 and 94. A pair of manifolds
96a and 96b extend around the rear surface of the rear support
plate 60. Manifold 96a communicates with inlet ports 90a through
openings 98a in plate 60, and manifold 96b communicates with inlet
ports 90b through openings 98b in plate 60.
Thus, it will be noted that cooling fluid passes through manifold
96a, openings 98a, input ports 90a, ducts 80a, and exhausts through
ports 92a, and passes through manifold 96b, openings 98b, input
ports 90b, ducts 80b, and exits through exhaust ports 92b. As a
result, the cooling fluid flows in opposite directions in the ducts
on either side of any one row of modules 12. The modules 12
adjacent the headers 88a and 88b will therefore have relatively
cool fluid flowing by one face and relatively warm fluid flowing by
the other face, while the modules generally centered between the
headers will have cooling fluid at an intermediate temperature
flowing over both faces. As a result, the net cooling effect upon
all modules is substantially the same so that all modules are
maintained at substantially the same temperature.
The antenna assembly 40 is illustrated in detail in FIGS. 18 and
19. The antenna assembly 40 is comprised of a tubular sleeve 150, a
center conductor 152, a ceramic disk 154, and a pair of antenna
elements 156 and 158. The ceramic disk 154 is hermetically sealed
within the end of the tubular sleeve 150 and also around the end of
the center conductor 152 by vacuum-tight hard solder seals. The
diameter of the input portion 152a of the center conductor is
selected relative to the diameter of the adjacent portion of the
tubular sleeve 150 so as to provide a coaxial transmission line
having a 50 ohm characteristic impedance. The center conductor has
portions 152b and 152c of enlarged diameter for transforming the 50
ohm characteristic impedance to the complex impedance required by
the radiating elements 156 and 158 when positioned in the antenna
array. The sleeve 150 is split into halves 150a and 150b to provide
a balun transformation from the unbalanced coaxial transmission
system to the balanced transmission system required to feed energy
to the radiating elements 156 and 158. The slits 160 which separate
the sleeve 150 into halves are approximately one-quarter wavelength
long. Antenna element 156 is secured in one of the sleeve halves
150a by a hard solder connection, and antenna element 158 is simply
a continuation of the center conductor 152, but is also connected
in a slot 162 by a hard solder connection. The antenna elements 156
and 158 are disposed one-quarter wavelength from the ground plane.
Thus, the antenna assembly 40 provides a hermetically sealed
coaxial connection through the wall 14 of the module package,
provides an impedance transformer for matching the standard 50 ohm
characteristic input impedance of the microstrip transmission of
the internal circuit to the complex impedance required for the
antenna, provides a balun transformer to convert from the
unbalanced coaxial input to the balanced dipole antenna, and
mechanically supports the radiating elements 156 and 158
aproximately one-quarter wavelength above the surface of the end
wall 14, which forms a portion of the ground plane for the antenna
array.
The modules 12 may house, for example, the electronic circuitry
described in copending U.S. Pat. application Ser. No. 606,427,
entitled "Transmit-Receive Module for X-Band Phased Arrray Radar
System," filed on behalf of Tom M. Hyltin and assigned to the
assignee of the present invention. All of the functional blocks
within the module are either hybrid circuits, in which case
microstrip transmission lines and discrete semiconductor components
are mounted on a ceramic substrate, or monolithic integrated
circuits, in which case the active components are formed in a
semiconductor substrate which also acts as the dielectric for the
microstrip transmission lines. A typical layout for these circuits
is shown in FIGS. 15-17.
During the transmit cycle at 2.25 GHz carrier signal is applied
through input coaxial connector 44 and is transferred by a strap
109 to a microstrip transmission line (not shown) on interconnector
chip 110 and through interconnection strap 112 to an S-band
preamplifier 113. The output of the preamplifier 113 is coupled by
strap 114 to the input of a duplexer switch 115 which, during the
transmit cycle, directs the signal through strap 116 to a transmit
phase shifter 117. The output of the transmit phase shifter 117 is
connected by strap 118 to a microstrip transmission line 119 on the
receive multiplier 120, which in turn is connected by strap 121 to
microstrip transmission line 122 on an interconnect chip 123. Line
122 is coupled by feed through connector 124 to a microstrip
transmission line 125 on micromodulator 126, and by strap 127 to
the input of a power amplifier 128. The output of power amplifier
128 is connected by strap 129 to a transmit multiplier 130, which
increases the frequency to 9.0 GHz. The RF frequency signal is then
applied by strap 131 to a TR switch 132 which, during the transmit
cycle, directs the energy to the center conductor 152 of the
antenna assembly 40 by way of a strap connector 133.
During the receive cycle, a 2.125 GHz signal is applied to input
coaxial connector 44 and is passed through strap coupling 112 to
the S-band preamplifier, strap coupling 114 to the duplexer, and
strap coupling 134 to a receive phase shifter 135. The output of
the receive phase shifter is applied by strap coupling 136 to the
receive multiplier 120 which increases the frequency to 8.5 GHz.
The output of multiplier 120 is connected by feed through
connection 137 to a mixer 138. Also during the receive cycle, the
TR switch connects the antenna to the mixer 138 where the 9.0 GHz
energy received by the antenna is mixed with the 8.5 GHz local
oscillator signal produced by multiplier 120 to derive a 500 MHz IF
signal. The IF signal is applied by way of strap connector 139 to
IF preamplifier 140. The output of the IF preamplifier is connected
by strap connector 141 to a microstrip transmission line 142 on the
micromodulator 126, which in turn is connected by strap connector
143 to a microstrip transmission line 144 on interconnector chip
145. The microstrip transmission line 144 is then connected to the
output coaxial connector 42 by strap connector 146.
The micromodulator 126 produces the high current pulses defining
the transmit cycle which are required to operate power amplifier
128 and switch duplexer 115 and TR switch 132. Choke 147 improves
the operation of mixer 138. A number of D.C. connections are
illustrated on the drawings but will not be discussed in detail
because they do not present an interconnection problem and are not
an advance in the art. In general, the D.C. connections are made to
the D.C. inputs 46 by ball bonded jumper wires, and all connections
between strip conductors on the various substrates can also be made
by ball bonded jumper wires.
Since all circuits are mounted on the body of the package and
interconnected to the antenna assembly of the various connectors
before the lids 32 and 34 are sealed in place, the circuit can
easily be tested after it is assembled. Because of the large number
of functional blocks, it is highly desirable to be able to replace
one or more faulty circuits after the entire module is assembled
and tested, rather than discarding all of the circuits if any one
circuit is bad. By mounting the circuits on the center mounting
plate 26 using the bracket indicated generally by the reference
numeral 170 in FIG. 22A, rather than by the conventional method of
soldering the circuits in place, the faulty modules can be removed
and replaced after the entire module has been tested as a unit.
The bracket 170 is comprised of a thin metal plate 172, 0.001 inch
thick nickel foil, for example, which is substantially coextensive
with the center mounting plate 26. A number of straps 178 are cut
from the foil and bent upwardly as shown in dotted outline at 178a.
The straps 178 are located at points spaced around the peripheries
of the various circuits, represented by circuit 174 in FIG. 22A, to
be mounted by the bracket 170. Where it is desirable to place two
circuits in closely abutting relationship, the straps 178 may be
received in notches cut in the sides of the circuits, or may even
extend through holes cut through the circuits. The straps 178
extend upwardly from the plate 172 a distance substantially greater
than the thickness of the circuits to be mounted. A large number of
tongue-like spring members 175 are also cut from the plate 172 and
bent upwardly at an angle of approximately 45.degree. or slightly
less. The spring members 175 are disposed generally uniformly over
the entire base plate 172. The base plate 172 is resistively spot
welded to the mounting plate 26 at a number of points 176 generally
spaced uniformly over its entire area.
The circuit 174 is placed in its proper position over the base
plate 172 and between the appropriate straps 178, then is forced
downwardly to compress the spring members 175 back into the plane
of the base plate 172. The straps 178 are then bent over metallized
pads 177 on the surface of the circuit. The pads 177 may be very
thin vacuum deposited gold films, for example. The straps 178 are
then welded to the pads 177 using a split tip or gap resistance
welder 179. The resulting weld is adequate to hold the circuit in
place, but can be broken to remove a faulty circuit without
damaging bracket 170. The faulty circuit can then be replaced in
the same manner.
The spring members 175 insure good thermal and electrical contact
between the circuits and the mounting plate 26 because the springs
bias the base plate against the mounting plate 26 and are
themselves biased against the metallized ground plane on the bottom
surface of the circuits.
An alternative method for securing the circuit in position on the
bracket 170 is illustrated in FIG. 22B. Rather than bending the
straps 178 over the edge of the circuit and welding it to the pads
177 as shown in FIG. 22A, a gusset 181 may be welded to each of the
straps. The gussets 181 may be formed from the same sheet material
as the bracket 170. Each gusset has a first flange portion 181a
which engages the top of the circuit and a second flange portion
181b which is disposed at a right angle to the first portion and is
spot welded to the respective strap 178 at a point 182 above the
top of the circuit. The welds 182 can also be broken to remove a
faulty circuit without damaging bracket 170 and the circuit
replaced.
The center conductor 152 of the antenna assembly 40 may be
connected to the output of the TR switch 132 using the structure
illustrated in FIGS. 20 and 21. The center conductor 152 of the
antenna assembly extends beyond the inner edge 14a of the front end
wall 14 and into a slot 190 formed in the center mounting plate 26.
Since the center conductor 152 has a diameter approximately equal
to the thickness of the mounting plate 26, the surface of the
center conductor 152 is essentially coplanar with the surface of
the mounting plate 26. However, the substrate on which the TR
switch 132 is formed is almost as thick as the mounting plate 26
and is resting on the bracket 172. Therefore, the microstrip
transmission line 192, which is the output of the TR switch and
which extends to the edge of the substrate upon which the TR switch
is formed, is not only spaced from the end of the center conductor
152, but is also spaced substantially above the plane of the center
conductor. Thus, any interconnection between the coaxial
transmission line and the microstrip transmission line will tend to
create an impedance discontinuity due to the change from a ceramic
dielectric to air and back to ceramic and due to the change in
planes. Such an impedance discontinuity can reflect an intolerable
amount of energy, particularly at 9 GHz.
In accordance with this invention, however, the center conductor
152 can be connected to the microstrip transmission line 192 by a
metal strap 133. The metal strap is preferably solid metal ribbon,
but can also be woven wire mesh. The solid metal ribbon can be
resistively welded to the coaxial center conductor 152 and to the
microstrip line 192. In order to compensate for the dielectric and
geometric discontinuities of the interconnection, the width of the
strap 133 is increased to provide substantially the same
characteristic impedance. For example, when connecting the coaxial
transmission line from the antenna assembly 40, which has a 50 ohm
characteristic impedance, to a microstrip transmission line, also
having a 50 ohm characteristic impedance, the strap 133 should be
about 0.045 inch wide. This compares with a width of 0.020 inch
required for the microstrip transmission line to provide a 50 ohm
characteristic impedance when using a ceramic substrate 0.020 inch
thick.
The woven wire fabric is not as mechanically stable as the solid
metal ribbon, but has the advantage of being easily welded to the
center conductor and to the strip transmission line using a heated
tool having a very small tip to press the wire fabric against the
center conductor and microstrip line.
It will be noted from FIGS. 15 and 16 that the entire surfaces of
the mounting plate 26 are substantially covered by functional
circuit blocks and interconnector chips, the interconnector chips
merely providing the microstrip transmission lines necessary to
interconnect the circuits and the coaxial connectors extending
through the end wall. The circuit blocks and interconnector chips
all have the same thickness and a metallized ground plane on the
bottom face. Microstrip transmission lines are formed by strip
conductors on the top surface of the substrate and the ground
plane. The characteristic impedance of the microstrip transmission
lines is determined by the thickness and dielectric properties of
the substrate material and the width of the strip conductors, and
these variables are customarily selected to produce a transmission
line having a 50 ohm characteristic impedance. Since all of the
substrates have substantially the same thickness, the microstrip
transmission lines carrying the high frequency signals can be
interconnected by connector straps as described in connection with
FIGS. 15 and 16. For example, connector strap 131 which connects
the output of the transmit mutiplier 130 to the TR switch 132 may
be formed as shown in FIG. 23. The microstrip transmission line 202
on the duplexer switch 132 extends to the edge of the circuit
block. A microstrip transmission line 208 extends to the edge of
the multiplier circuit block 130 and is aligned with the microstrip
transmission line 202 on the TR switch. A strap of gold wire mesh
131 bridges the gap between the adjacent circuit blocks and extends
over the adjacent ends of the microstrip transmission lines 202 and
208. The strap is welded to the transmission lines by using the tip
of a heated tool to press the wire mesh against the respective
microstrip transmission lines to form localized welds 209.
Alternatively, a solid metal ribbon may be substituted for the wire
mesh strap and welded using the split tip resistive welder
illustrated in FIG. 22A.
The dielectric discontinuity resulting from the change from ceramic
to air at the gap which must necessarily exist between the adjacent
substrates may be compensated by increasing the width of the strap
131 in order to maintain the same characteristic impedance and thus
eliminate impedance discontinuities which would reflect an
intolerable amount of high frequency energy. However, for very
close spacing between the circuit blocks, the strap may be the same
width as the microstrip transmission lines.
In accordance with another aspect of this invention, the feed
through connectors 124 and 137 (see FIGS. 15 and 16), for example,
may be constructed as shown in detailed sectional view of FIG. 24.
A hole 220 is bored through the central mounting plate 26. The bore
220 may be located immediately adjacent the edge of the two
substrates to be connected, as illustrated by the relationship of
the bore to substrate 222, or may pass through both substrates, as
illustrated by the relationship of the bore to substrate 224, or
may be a combination of the relationships as actually illustrated
in FIG. 24. The substrates 222 and 224 may be mounted on the
mounting plate 26 using the brackets 170 as illustrated. The
microstrip transmission lines to be interconnected, for example,
strip line 226 on substrate 222 and strip line 228 on substrate
224, extend to points immediately adjacent the bore 220.
An insulating sleeve 230, preferably made of quartz, is coated with
a metallized film 231 around its midportion, but is not coated
adjacent the ends. The sleeve is then inserted in the bore 220. A
wire conductor 232 passes through the insulating sleeve 230 and the
opposite ends are flattened at 232a and 232b until they are
approximately the same width as the strip lines 226 and 228. The
flat portions of the conductor 232 are bent over the strip lines
and spot welded using an electrip gap welder as previously
described.
Using a trial and error procedure, the characteristic impedance of
the feed through connector can be adjusted by varying the length of
the metallized film 231 on the insulating sleeve 230, or the
diameter of wire 232 adjusted, until any impedance discontinuity is
reduced to an acceptable level for a given installation.
Although preferred embodiments of the invention have been described
in detail, it is to be understood that various changes,
substitutions and alterations can be made therein without departing
from the spirit and scope of the invention as defined by the
appended claims.
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