U.S. patent number 11,098,955 [Application Number 16/256,417] was granted by the patent office on 2021-08-24 for micro-scale wireless heater and fabrication method and applications thereof.
This patent grant is currently assigned to NATIONAL TSING HUA UNIVERSITY. The grantee listed for this patent is NATIONAL TSING HUA UNIVERSITY. Invention is credited to Yi Hung Chen, Tung Che Lee, Hung-Yin Tsai, Ping Huan Tsai, Shang Ru Wu.
United States Patent |
11,098,955 |
Tsai , et al. |
August 24, 2021 |
Micro-scale wireless heater and fabrication method and applications
thereof
Abstract
A micro-scale wireless heater includes: a support layer having
first and second sides and a cavity formed on the second side; a
first electrode plate and a first conduction line disposed on the
second side; a second electrode plate and a coil both embedded into
a slot on the first side, wherein the support layer is disposed
between the first and second electrode plates forming a capacitor,
the coil forms an inductor, and the slot communicates with the
cavity; and a second conduction line disposed in the cavity. The
first and second electrode plates are electrically connected
together through the first and second conduction lines and the coil
in order. Three exposed surfaces of the second electrode plate, the
coil and the first side are flush with one another. The inductor
and the capacitor convert an electromagnetic wave into heat. A
fabrication method and applications thereof are also provided.
Inventors: |
Tsai; Hung-Yin (Hsinchu,
TW), Lee; Tung Che (New Taipei, TW), Tsai;
Ping Huan (Taoyuan, TW), Wu; Shang Ru (Taichung,
TW), Chen; Yi Hung (Hsinchu, TW) |
Applicant: |
Name |
City |
State |
Country |
Type |
NATIONAL TSING HUA UNIVERSITY |
Hsinchu |
N/A |
TW |
|
|
Assignee: |
NATIONAL TSING HUA UNIVERSITY
(Hsinchu, TW)
|
Family
ID: |
70726271 |
Appl.
No.: |
16/256,417 |
Filed: |
January 24, 2019 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20200158442 A1 |
May 21, 2020 |
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Foreign Application Priority Data
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Nov 21, 2018 [TW] |
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107141407 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01F
17/0006 (20130101); H01F 5/003 (20130101); A61F
7/007 (20130101); H01F 27/28 (20130101); F28F
3/12 (20130101); H02J 50/10 (20160201); A61N
1/403 (20130101); F28D 9/005 (20130101); H01G
4/40 (20130101); H01F 38/14 (20130101); A61F
2007/009 (20130101) |
Current International
Class: |
F28D
9/00 (20060101); F28F 3/12 (20060101); H01F
27/28 (20060101); H02J 50/10 (20160101) |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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103596309 |
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Feb 2014 |
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CN |
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107241821 |
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Oct 2017 |
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CN |
|
Primary Examiner: Fureman; Jared
Assistant Examiner: Warmflash; Michael J
Attorney, Agent or Firm: Muncy, Geissler, Olds and Lowe,
P.C.
Claims
What is claimed is:
1. A micro-scale wireless heater, comprising: a support layer
having a first side, a second side opposite to the first side and a
cavity formed on the second side; a first electrode plate and a
first conduction line disposed on the second side; a second
electrode plate and a coil both embedded into a slot on the first
side, wherein the support layer is disposed between the second
electrode plate and the first electrode plate, which form a
capacitor, the coil forms an inductor, and the slot communicates
with the cavity; and a second conduction line disposed in the
cavity, wherein the first electrode plate is electrically connected
to the second electrode plate through the first conduction line,
the second conduction line and the coil in order, three exposed
surfaces of the second electrode plate, the coil and the first side
of the support layer are flush with one another, and the inductor
and the capacitor converts an electromagnetic wave into heat.
2. The micro-scale wireless heater according to claim 1, wherein
the support layer is made of a microcrystalline diamond material
providing supporting, heat conducting and electrical insulating
functions.
3. The micro-scale wireless heater according to claim 1, wherein
the second electrode plate and the coil are made of titanium.
4. The micro-scale wireless heater according to claim 1, wherein
the second electrode plate, the coil, the first electrode plate,
the first conduction line and the second conduction line are made
of titanium.
5. The micro-scale wireless heater according to claim 1, wherein
dimensions of the first electrode plate and the second electrode
plate range between 100 microns*300 microns and 1000 microns*500
microns, a line width of the coil ranges between 1 micron and 10
microns, and a pitch of the coil ranges between 10 microns and 50
microns.
6. A biological stimulation system, comprising: multiple
micro-scale wireless heaters each according to claim 1 respectively
disposed on multiple organisms, the micro-scale wireless heaters
having different response frequencies; and an electromagnetic wave
generator generating multiple electromagnetic waves having
frequencies respectively corresponding to the response frequencies
to stimulate the organisms respectively and independently.
7. The biological stimulation system according to claim 6, wherein
each of the organisms is a drosophila.
8. A micro-scale origami system, comprising: a sheet structure
having multiple stimulation blocks; multiple micro-scale wireless
heaters each according to claim 1 respectively disposed on the
stimulation blocks, the micro-scale wireless heaters having
different response frequencies; and an electromagnetic wave
generator generating multiple electromagnetic waves having
frequencies respectively corresponding to the response frequencies
to stimulate the stimulation blocks respectively and independently
so that the sheet structure deforms in a specific direction.
9. A fabrication method of a micro-scale wireless heater,
comprising steps of: forming a second metal layer on a
semiconductor substrate; patterning the second metal layer to form
a second electrode plate and a coil; forming a support layer on and
between the second electrode plate and the coil, so that the second
electrode plate and the coil are embedded into a slot disposed on a
first side of the support layer; forming a cavity on the support
layer to expose a portion of the coil; forming a first metal layer
in the cavity and on the support layer; patterning the first metal
layer to form a first electrode plate and a first conduction line
on a second side of the support layer, and forming a second
conduction line in the cavity; and removing the semiconductor
substrate to form the micro-scale wireless heater.
10. The fabrication method according to claim 9, wherein the first
metal layer in the cavity forms the second conduction line, the
support layer is disposed between the second electrode plate and
the first electrode plate, which form a capacitor, the coil forms
an inductor, the slot communicates with the cavity, the first
electrode plate is electrically connected to the second electrode
plate through the first conduction line, the second conduction line
and the coil in order, three exposed surfaces of the second
electrode plate, the coil and the first side of the support layer
are flush with one another, and the inductor and the capacitor
convert an electromagnetic wave into heat.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
This application claims priority of No. 107141407 filed in Taiwan
R.O.C. on Nov. 21, 2018 under 35 USC 119, the entire content of
which is hereby incorporated by reference.
BACKGROUND OF THE INVENTION
Field of the Invention
The invention relates to a micro-scale wireless heater and a
fabrication method and applications thereof, and more particularly
to a micro-scale wireless heater, a fabrication method thereof, and
a biological stimulation system and a micro-scale origami system
using multiple micro-scale wireless heaters.
Description of the Related Art
With the rapid development of advanced technologies nowadays, the
technologies of semiconductor manufacturing and
micro-electro-mechanical-system (MEMS) processing rapidly break
through. Electronic components are getting smaller and smaller for
the purpose of elevating efficiency and saving cost. Therefore,
there are more and more functional units located in one system.
U.S. Patent Publication No. US2012/0310151A1 disclosed a wireless
microactuator, which can be applied to implantable drug delivery
devices, grippers and injectors, provides wireless power and
control through frequency tuning of an external radio frequency
(RF) magnetic field, and can operate without a battery to provide
an actuating function. However, the dimension of the wireless
microactuator of the '151 patent is large (e.g., a line width of
the coil is about 100 microns, and a gap or pitch is about 150
microns), and the wireless microactuator cannot satisfy the
requirement of the more miniature applications. Therefore, there is
the considerable requirement and development space for the
reduction of wireless microactuator. In addition, the wireless
microactuator of the '151 patent uses the polyimide (PI) as the
support material, and the contact area between the coil and the
support material is small, so that the thermoconductive effect also
needs to be improved.
BRIEF SUMMARY OF THE INVENTION
It is therefore an objective of the invention to provide a
micro-scale wireless heater and a fabrication method and
applications thereof, wherein the dimension of the micro-scale
wireless heater is significantly reduced, the microcrystalline
diamond layer is used as the support layer, and a planar coil is
embedded into the microcrystalline diamond layer to achieve the
high conductive effect.
To achieve the above-identified object, the invention provides a
micro-scale wireless heater including: a support layer having a
first side, a second side opposite to the first side and a cavity
formed on the second side; a first electrode plate and a first
conduction line disposed on the second side; a second electrode
plate and a coil both embedded into a slot on the first side,
wherein the support layer is disposed between the first and second
electrode plates, which form a capacitor, the coil forms an
inductor, and the slot communicates with the cavity; and a second
conduction line disposed in the cavity, wherein the first electrode
plate is electrically connected to the second electrode plate
through the first conduction line, the second conduction line and
the coil in order, three exposed surfaces of the second electrode
plate, the coil and the first side of the support layer are flush
with one another, and the inductor and the capacitor converts an
electromagnetic wave into heat.
In the micro-scale wireless heater, the support layer may be made
of a microcrystalline diamond material providing supporting, heat
conducting and electrical insulating functions; the second
electrode plate and coil may be made of titanium; the second
electrode plate, the coil, the first electrode plate, the first
conduction line and the second conduction line may be made of
titanium; dimensions of the first electrode plate and the second
electrode plate may range between 100 microns*300 microns and 1000
microns*500 microns, a line width of the coil may range between 1
micron and 10 microns, and a gap or pitch of the coil may range
between 10 microns and 50 microns.
The invention further provides a fabrication method of the
micro-scale wireless heater. The method includes the following
steps: forming a second metal layer on a semiconductor substrate;
patterning the second metal layer to form a second electrode plate
and a coil; forming a support layer on and between the second
electrode plate and the coil, so that the second electrode plate
and the coil are embedded into a slot disposed on a first side of
the support layer; forming a cavity on the support layer to expose
a portion of the coil; forming a first metal layer in the cavity
and on the support layer; patterning the first metal layer to form
a first electrode plate and a first conduction line on a second
side the support layer, and forming a second conduction line in the
cavity; and removing the semiconductor substrate to form the
micro-scale wireless heater.
In the fabrication method, the first metal layer in the cavity may
form the second conduction line, wherein the support layer is
disposed between the first and second electrode plates, which form
a capacitor, the coil forms an inductor, and the slot communicates
with the cavity, wherein the first electrode plate is electrically
connected to the second electrode plate through the first
conduction line, the second conduction line and the coil in order,
three exposed surfaces of the second electrode plate, the coil and
the first side of the support layer are flush with one another, and
the inductor and the capacitor receive an electromagnetic wave to
generate heat.
The invention also provides a biological stimulation system, which
includes: multiple micro-scale wireless heaters respectively
disposed on multiple organisms, the micro-scale wireless heaters
having different response frequencies; and an electromagnetic wave
generator generating multiple electromagnetic waves having
frequencies respectively corresponding to the response frequencies
to stimulate the organisms respectively and independently. Each of
the organisms may be a drosophila.
The invention also provides a micro-scale origami system, which
includes: a sheet structure having multiple stimulation blocks;
multiple micro-scale wireless heaters respectively disposed on the
stimulation blocks, the micro-scale wireless heaters having
different response frequencies; and an electromagnetic wave
generator generating multiple electromagnetic waves having
frequencies respectively corresponding to the response frequencies
to stimulate the stimulation blocks respectively and independently
so that the sheet structure deforms in a specific direction.
With the above-mentioned embodiments, a micro-scale wireless heater
can be implemented. Compared with the prior art, the dimension of
the micro-scale wireless heater of this embodiment is smaller. The
line width of the coil has been reduced to about ( 1/50), the
overall area has also been reduced to about ( 1/10), and the more
miniature dimension is more developmental to the application of
micro-electro-mechanical-system. The microcrystalline diamond is
used as the heat conducting material in this embodiment, the
diamond material has the high thermoconductive property under the
micrometer scale to effectively improve the overall system
efficiency and uniformity. The microcrystalline diamond film formed
by the embodiment is a highly uniform film having the surface
roughness Ra equal to about 17 nm only, is sufficient to function
as a good support material for titanium metal coils, and provides
the uniform thermoconductive effect. Because the dimension is
reduced to the micron level, it can be applied to a micro-scale
biological stimulation system and a micro-scale origami system,
which cannot be achieved by the prior art.
Further scope of the applicability of the invention will become
apparent from the detailed description given hereinafter. However,
it should be understood that the detailed description and specific
examples, while indicating preferred embodiments of the invention,
are given by way of illustration only, since various changes and
modifications within the spirit and scope of the invention will
become apparent to those skilled in the art from this detailed
description.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
FIGS. 1 and 2 are respectively a bottom view and a top view showing
a micro-scale wireless heater according to a preferred embodiment
of the invention.
FIG. 3 is a cross-sectional view taken along a line L-L of FIG.
1.
FIGS. 4A to 4R are schematic structure views showing steps of a
fabrication method of the micro-scale wireless heater according to
the preferred embodiment of the invention.
FIGS. 5A and 5B are two examples showing the application of the
micro-scale wireless heater.
FIG. 6 is a schematic view showing a biological stimulation system
applying multiple micro-scale wireless heaters.
FIG. 7 is a schematic view showing a micro-scale origami system
applying multiple micro-scale wireless heaters.
DETAILED DESCRIPTION OF THE INVENTION
In the embodiment of the invention, the electron beam lithography
(EBL), reactive-ion etching (RIE) and chemical vapor deposition
(CVD) technologies are combined to fabricate the micro-scale
wireless heater, and the embodiment becomes more potential in
applications.
FIGS. 1 and 2 are respectively a bottom view and a top view showing
a micro-scale wireless heater according to a preferred embodiment
of the invention. FIG. 3 is a cross-sectional view taken along a
line L-L of FIG. 1. As shown in FIGS. 1 to 3, a micro-scale
wireless heater 100 of this embodiment includes a support layer 10,
a first electrode plate 20, a first conduction line 30, a second
electrode plate 40, a coil 50 and a second conduction line 60.
The support layer 10 has a first side 11 and a second side 12
opposite to the first side 11 and a cavity 13, and the cavity 13 is
formed on the second side 12. In this embodiment, the support layer
10 is made of a microcrystalline diamond (MCD) providing
supporting, heat conducting and electrical insulating functions.
The microcrystalline diamond has the high-hardness layer and high
thermal conductivity, and is thus quite suitable for the
application of this embodiment. A thickness of the support layer 10
ranges between 0.6 microns and 2.8 microns, and is approximately
equal to 2 microns in an example.
The first electrode plate 20 and the first conduction line 30 are
disposed on the second side 12. For example, the first electrode
plate 20 and the first conduction line 30 are located on a plane
and are integrally formed to have the same thickness.
The second electrode plate 40 and the coil 50 are embedded into a
slot 14 on the first side 11, and the coil 50 is a plane coil. A
line width of the coil 50 ranges between 1 micron and 10 microns,
and a gap or pitch of the coil 50 ranges between 10 microns and 50
microns. In a non-limiting example, the line width of the coil 50
is equal to 2 microns, and the gap of the coil 50 is equal to 10
microns.
The support layer 10 is disposed between the second electrode plate
40 and the first electrode plate 20, which form a capacitor. The
coil 50 forms an inductor, and the slot 14 communicates with the
cavity 13. In this embodiment, the second electrode plate 40 and
the coil 50 are made of titanium, but they may also be made of any
appropriate electroconductive material.
The second conduction line 60 is disposed in the cavity 13. The
first electrode plate 20 is electrically connected to the second
electrode plate 40 through the first conduction line 30, the second
conduction line 60 and the coil 50 in order. In this embodiment,
the first electrode plate 20, the first conduction line 30 and the
second conduction line 60 are integrally formed. In addition, three
exposed surfaces 45, 55 and 15 of the second electrode plate 40,
the coil 50 and the first side 11 of the support layer 10 are flush
with one another (disposed at the same level or on the same
horizontal plane). Therefore, embedding the second electrode plate
40 and the coil 50 into the support layer 10 may further increase
the structural strength of the micro-scale wireless heater 100. In
addition, because the coil 50 and the second electrode plate 40 are
embedded into the support layer 10, a contact area of the coil 50
and the second electrode plate 40 contacting the support layer 10
becomes larger, and this is advantageous to heat conductivity to
achieve fast response.
In the practical application, the inductor and the capacitor
receive and convert an electromagnetic wave EMW into heat. In a
non-limiting example, the second electrode plate 40, the coil 50,
the first electrode plate 20, the first conduction line 30 and the
second conduction line 60 are made of titanium.
Dimensions of the first electrode plate 20 and the second electrode
plate 40 range between 100 microns*300 microns and 1,000
microns*500 microns. In one example, the dimensions of the first
electrode plate 20 and the second electrode plate 40 equal to 100
microns*300 microns, and the area covered by the second electrode
plate 40 and the coil 50 is equal to 410 microns*300 microns.
FIGS. 4A to 4R are schematic structure views showing steps of a
fabrication method of the micro-scale wireless heater according to
the preferred embodiment of the invention. The numerical values of
the dimensions described below are merely illustrative and the
invention is not limited thereto. In addition, multiple micro-scale
wireless heaters arranged in an array may be made at a time, and
then the independent micro-scale wireless heaters are produced by
way of dicing. For simplicity, the single micro-scale wireless
heater is taken as an example for explanation in the following.
The fabrication method of the micro-scale wireless heater includes
the following steps. As shown in FIGS. 4A to 4C, a second metal
layer 120 is formed on a semiconductor substrate 110. Specifically
speaking, the semiconductor substrate 110, such as a silicon
substrate having a thickness of 300 microns, is provided firstly,
as shown in FIG. 4A. Then, a positioning hole 112 or a positioning
pattern is etched on the semiconductor substrate 110 by way of
photo-lithography, as shown in FIG. 4B. For example, a photoresist
is coated and then patterned, the photo-lithography technology is
performed, and then the photoresist is removed. Next, as shown in
FIG. 4C, the second metal layer 120 is deposited in the positioning
hole 112 and on the semiconductor substrate 110, the material of
the second metal layer 120 is, for example, titanium (may also be
any other suitable metal material), and the thickness of the second
metal layer 120 on the semiconductor substrate 110 is about 300
nanometers (nm).
Then, as shown in FIGS. 4D to 4G, the second metal layer 120 is
patterned to form a second electrode plate 40 and a coil 50.
Specifically speaking, as shown in FIG. 4D, a resist layer 140 is
formed on the second metal layer 120. Next, as shown in FIG. 4E,
the resist layer 140 is patterned according to the positioning hole
112. For example, the electron beam lithography is used to define
the pattern of the resist layer. Then, as shown in FIG. 4F, the
patterned resist layer 140 is taken as a mask to etch the second
metal layer 120 to form the second electrode plate 40 and the coil
50. Next, as shown in FIG. 4G, the resist layer 140 is removed.
Then, as shown in FIG. 4H, a support layer 10 is formed on and
between the second electrode plate 40 and the coil 50, so that the
second electrode plate 40 and the coil 50 are embedded into a slot
14 disposed on a first side 11 of the support layer 10, wherein a
portion corresponding to the positioning hole 112 also forms a
positioning hole 114. The support layer 10 is a uniform micron
crystallization diamond film formed by way of chemical vapor
deposition, for example.
Next, as shown in FIGS. 4I to 4K, a cavity 13 is formed on the
support layer 10, so that a portion of the coil 50 is exposed.
Specifically speaking, as shown in FIG. 4I, a patterned mask layer
150 is formed on the support layer 10 and in the positioning hole
114. The material of the mask layer 150 is, for example, aluminum,
but any other suitable material may also be used. For example, an
aluminum layer is deposited firstly, the photoresist and
photo-lithography technologies are adopted, and a patterned
aluminum layer (having a through hole 151) is formed based on the
positioning hole 112, so that a portion of the support layer 10 is
exposed. Then, as shown in FIG. 4J, the support layer 10 is etched
(e.g. by way of anisotropic etching of reactive ion etching) by
taking the patterned mask layer 150 as a mask to form the cavity 13
to expose a portion of the coil 50. Next, as shown in FIG. 4K, the
mask layer 150 is removed.
Then, as shown in FIG. 4L, a first metal layer 130 is formed on the
cavity 13 and the support layer 10. The material of the first metal
layer 130 is, for example, titanium (may also be other suitable
metal materials), and the thickness of the first metal layer 130 on
the support layer 10 is equal to 500 nm, for example.
Next, as shown in FIGS. 4M to 4Q, the first metal layer 130 is
patterned to form a first electrode plate 20 and a first conduction
line 30 on a second side 12 of the support layer 10, and to form a
second conduction line 60 in the cavity 13 (the first metal layer
130 in the cavity 13 forms the second conduction line 60).
Specifically speaking, as shown in FIG. 4M, a resist layer 160 is
formed on the first metal layer 130. Then, as shown in FIG. 4N, for
example, the electron beam lithography is used to pattern the
resist layer 160 to expose a portion of the first metal layer 130.
Next, as shown in FIG. 4O, the patterned resist layer 160 is used
as a mask, and the first metal layer 130 is etched based on the
positioning hole 112, and the etch stops on the support layer 10.
Then, as shown in FIG. 4P, the resist layer 160 is removed. The
second conduction line 60 and the first conduction line 30 are
integrally formed with the same material. Next, as shown in FIG.
4Q, cutting is performed along the scribing line DL to form the
structure of FIG. 4R.
Then, as shown in FIGS. 4R and 3, the semiconductor substrate 110
is removed, and the above-mentioned micro-scale wireless heater 100
is formed.
Therefore, the micro-scale wireless heater is designed according to
the MEMS process technology in this embodiment, and the heater is
composed of the inductor and the capacitor. In an example, the
dimension of the titanium metal capacitor is 100*300 microns, the
inductor is composed of the titanium metal coil having the line
width of 2 microns and the pitch of 10 microns, and the
microcrystalline diamond (MCD) layer is taken as a support material
to provide the structural strength and thermal conductivity. The
heater of this design uses the electromagnetic waves as an energy
source to achieve the remote control of the temperature in a
wireless manner, and the required response frequency can be changed
by changing the dimensions of the capacitor and the inductor, so
that the temperatures of individual heaters can be wirelessly
controlled by different electromagnetic wave frequencies.
FIGS. 5A and 5B are two examples showing the application of the
micro-scale wireless heater. Two arms 72 and 74 of the micro-scale
fixture are heated by the micro-scale wireless heater of this
embodiment. The bending directions of the two arms 72 and 74 may be
controlled by the difference in the expansion coefficients of the
composite materials of the arms 72 and 74 so that the opening of
the gripper composed by the arms 72 and 74 can be controlled, and
the wireless micro-scale fixture can be fabricated, as shown in
FIG. 5A. The arms 72 and 74 may be directly connected to the second
electrode plate 40, the support layer 10 or the first electrode
plate. FIG. 5B is a schematic view showing a wireless microfluidic
control system, wherein multiple sets of the combination of the
micro-scale wireless heaters 100 to 102 and cantilever beams 80 to
82 are used, and the degree of warpage of one single or multiple
sets of cantilever beams 80 to 82 may be controlled by one single
or multiple sets of electromagnetic waves of the specific
wavelength to press a fluid reservoir 90 (e.g., in a direction
toward the location under the drawing sheet), thereby controlling
the flow of the entire microfluidic system. For example, pressing
the fluid reservoir 90 by the cantilever beams 80 to 82 in order
allows the fluid to flow in the direction indicated by the arrow,
and controlling different pressing amounts can control the
flow.
FIG. 6 is a schematic view showing a biological stimulation system
200 applying multiple micro-scale wireless heaters. In model
biological experiments, because the brain structure of a drosophila
is highly similar to that of the mammal, the drosophila is often
used as brain science researches to explore human-related diseases,
neurotransmitter systems, biological evolution and the like. One
single drosophila is very tiny (about 3.5 mm long, 1.5 mm wide and
1.5 mm high) and light (about 0.5 to 1 mg), so it is necessary to
fabricate the advanced MEMS devices for biological experiments. The
dimension of the micro-scale wireless heating coil of this
embodiment is small enough to be placed on a single drosophila,
wherein the externally applied electromagnetic waves are provided
to the heaters, which convert waves into heat. With the designs of
the dimensions of the coils, the drosophilae can be properly
stimulated. Referring to FIG. 6, the biological stimulation system
200 includes: multiple micro-scale wireless heaters 100 to 102
respectively disposed on multiple organisms 210 to 212, wherein the
micro-scale wireless heaters 100 to 102 have different response
frequencies; and an electromagnetic wave generator 220 generating
multiple electromagnetic waves EMW having frequencies respectively
corresponding to the response frequencies to stimulate the
organisms 210 to 212 respectively and independently. Each of the
organisms 210 to 212 may be a drosophila, for example. Multiple
electromagnetic wave generators each generating the electromagnetic
wave having one single frequency may also be synthesized into a
single electromagnetic wave generator that can generate multiple
electromagnetic waves.
FIG. 7 is a schematic view showing a micro-scale origami system 300
applying multiple micro-scale wireless heaters. Using the
micro-scale wireless heater of this embodiment combined with the
origami science process, the shape memory material can be
controlled by electromagnetic waves to control the deformation of
the single or multiple regions of the component. The wireless coils
may be heated through different bands of electromagnetic waves to
control the deformation of a specific area in a specified
direction. This concept can be derived into many fields of
applications, such as the aerospace technology, biomedical
researches, communication applications, energy technology,
electromechanical systems, robotics or the like. Referring to FIG.
7, the micro-scale origami system 300 includes: a sheet structure
310 having multiple stimulation blocks 310 to 315; multiple
micro-scale wireless heaters 100 to 105 respectively disposed on
the stimulation blocks 310 to 315, the micro-scale wireless heaters
100 to 105 having different response frequencies; and an
electromagnetic wave generator 320 generating multiple
electromagnetic waves EMW having frequencies respectively
corresponding to the response frequencies to provide stimulation
(e.g., heating stimulation) to the stimulation blocks 310 to 315
respectively and independently so that the sheet structure 310
deforms in a specific direction. The sheet structure 310 is formed
by shape memory materials, for example.
With the above-mentioned embodiments, a micro-scale wireless heater
can be implemented. Compared with the prior art, the dimension of
the micro-scale wireless heater of this embodiment is smaller. The
line width of the coil has been reduced to about ( 1/50), the
overall area has also been reduced to about ( 1/10), and the more
miniature dimension is more developmental to the application of
micro-electro-mechanical-system. The microcrystalline diamond is
used as the heat conducting material in this embodiment, the
diamond material has the high thermoconductive property under the
micrometer scale to effectively improve the overall system
efficiency and uniformity. The microcrystalline diamond film formed
by the embodiment is a highly uniform film having the surface
roughness Ra equal to about 17 nm only, is sufficient to function
as a good support material for titanium metal coils, and provides
the uniform thermoconductive effect. Because the dimension is
reduced to the micron level, it can be applied to a micro-scale
biological stimulation system and a micro-scale origami system,
which cannot be achieved by the prior art.
While the invention has been described by way of examples and in
terms of preferred embodiments, it is to be understood that the
invention is not limited thereto. To the contrary, it is intended
to cover various modifications. Therefore, the scope of the
appended claims should be accorded the broadest interpretation so
as to encompass all such modifications.
* * * * *