U.S. patent number 10,705,327 [Application Number 15/860,152] was granted by the patent office on 2020-07-07 for light emitting method and light emitting device.
This patent grant is currently assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE. The grantee listed for this patent is INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE. Invention is credited to Po-Huan Chou, Pin-Hao Hu, Hsuan-Chang Lee, Min-Kai Lee, Shao-Chuan Lu.
United States Patent |
10,705,327 |
Hu , et al. |
July 7, 2020 |
Light emitting method and light emitting device
Abstract
A light emitting method includes passing a laser beam through at
least one offset assembly and a focusing assembly in sequence, and
actuating, by a control-manipulating mechanism, the offset assembly
to cause the laser beam to be offset, so that the laser beam can
quickly produce a controllable opening of any shape in a drilling
process.
Inventors: |
Hu; Pin-Hao (Hsinchu,
TW), Lu; Shao-Chuan (Hsinchu, TW), Lee;
Hsuan-Chang (Hsinchu, TW), Chou; Po-Huan
(Hsinchu, TW), Lee; Min-Kai (Hsinchu, TW) |
Applicant: |
Name |
City |
State |
Country |
Type |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
Hsinchu |
N/A |
TW |
|
|
Assignee: |
INDUSTRIAL TECHNOLOGY RESEARCH
INSTITUTE (Hsinchu, TW)
|
Family
ID: |
67059491 |
Appl.
No.: |
15/860,152 |
Filed: |
January 2, 2018 |
Prior Publication Data
|
|
|
|
Document
Identifier |
Publication Date |
|
US 20190204584 A1 |
Jul 4, 2019 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
B23K
26/082 (20151001); B23K 26/0643 (20130101); B23K
26/40 (20130101); B23K 26/384 (20151001); B23K
26/402 (20130101); G02B 26/0816 (20130101); G02B
27/14 (20130101); G02B 27/286 (20130101); G02B
27/40 (20130101); B23K 26/067 (20130101); B23K
26/0648 (20130101); G02B 27/283 (20130101); G02B
27/0927 (20130101); B23K 26/389 (20151001); B23K
26/035 (20151001); B23K 2103/52 (20180801); B23K
2101/42 (20180801); B23K 2101/001 (20180801); G02B
26/10 (20130101); B23K 2103/00 (20180801); B23K
2103/42 (20180801); B23K 2103/54 (20180801) |
Current International
Class: |
G02B
26/08 (20060101); B23K 26/402 (20140101); G02B
27/28 (20060101); B23K 26/067 (20060101); B23K
26/06 (20140101); B23K 26/035 (20140101); G02B
27/14 (20060101); G02B 27/40 (20060101); B23K
26/384 (20140101); B23K 26/082 (20140101); B23K
26/382 (20140101); B23K 26/40 (20140101); G02B
26/10 (20060101) |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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204308417 |
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May 2015 |
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CN |
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105607248 |
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May 2016 |
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CN |
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105683808 |
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Jun 2016 |
|
CN |
|
102004053298 |
|
Mar 2006 |
|
DE |
|
I459039 |
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Nov 2014 |
|
TW |
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201733730 |
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Oct 2017 |
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TW |
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WO-2016206943 |
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Dec 2016 |
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WO |
|
Other References
Zhu et al., Double-shearing interferometer for accuratetest of
laser wavefront, Proc. of SPIE vol. 5160, Jan. 2, 2004, pp.
390-396. cited by applicant .
Jahns et al., Laser trepanning of stainless steel, Lasers in
Manufacturing Conference 2013, Physics Procedia 41, 2013, pp.
630-635. cited by applicant .
Ashkenasi et al., Advanced laser micro machining using a novel
trepanning system, JLMN--Journal of Laser Micro/Nanoengineering
vol. 6, No. 1 2011, pp. 1-5. cited by applicant .
Ashkenasi et al., Laser Trepanning for Industrial Applications,
Physics Procedia 12, 2011, pp. 323-331. cited by applicant .
Fornaroli et al., Laser-beam helical drilling of high quality micro
holes, Lasers in Manufacturing Conference 2013, Physics Procedia
41, 2013, pp. 661-669. cited by applicant .
1st Office Action of Taiwan Intelligent Patent Office, dated Nov.
19, 2019. cited by applicant.
|
Primary Examiner: Cherry; Euncha P
Attorney, Agent or Firm: Rabin & Berdo, P.C.
Claims
What is claimed is:
1. A light emitting method, comprising: passing a light beam
forming an opening through at least an offset assembly and a
focusing assembly in sequence; and making the light beam generate
an offset by a control-manipulating mechanism to actuate the offset
assembly, wherein the control-manipulating mechanism has a
programmable logic controller planning a displacement path of the
offset assembly, based on a moving distance of the light beam and
an inclination angle of a wall of the opening, to displace the
offset assembly and control an offset path of the light beam.
2. The light emitting method of claim 1, wherein the light beam is
laser.
3. The light emitting method of claim 1, wherein the light beam is
offset in a parallel manner.
4. The light emitting method of claim 1, wherein the displacement
path of the offset assembly includes a moving distance variation or
a rotational angle variation.
5. The light emitting method of claim 1, wherein the offset
assembly includes: a beam splitter; a wave plate provided above the
beam splitter; and a reflecting mirror provided above the wave
plate, wherein the light beam is incident on and reflected by the
beam splitter, passes through the wave plate, is reflected by the
reflecting mirror, passes through the wave plate once again, and is
reflected and outputted by the beam splitter.
6. The light emitting method of claim 1, wherein the
control-manipulating mechanism includes a galvo motor rotating the
offset assembly by an offset angle related to an offset distance of
the light beam.
7. The light emitting method of claim 1, wherein the light beam
passes through two sets of the offset assemblies, one of which is
used for offsetting the light beam in an X-direction, and the other
of which is used for offsetting the light beam in a Y-direction
perpendicular to the X-direction.
8. The light emitting method of claim 1, further comprising
guiding, by a scanning assembly, the light beam from the offset
assembly to the focusing assembly.
9. A light emitting device, comprising: an offset assembly
configured for a light beam to pass therethrough, wherein the light
beam is configured for forming an opening; a focusing assembly
configured for receiving the light beam from the offset assembly;
and a control-manipulating mechanism configured for actuating the
offset assembly to offset the light beam, wherein the
control-manipulating mechanism has a programmable logic controller
planning a displacement path of the offset assembly, based on a
moving distance of the light beam and an inclination angle of a
wall of the opening, to displace the offset assembly and control an
offset path of the light beam.
10. The light emitting device of claim 9, wherein the light beam is
laser, and the light beam is offset in a parallel manner.
11. The light emitting device of claim 9, wherein the offset
assembly includes: a beam splitter; a wave plate provided above the
beam splitter; and a reflecting mirror provided above the wave
plate.
12. The light emitting device of claim 9, wherein the
control-manipulating mechanism includes a galvo motor rotating the
offset assembly by an offset angle related to an offset distance of
the light beam.
13. The light emitting device of claim 9, wherein the light beam
passes through two sets of the offset assemblies, one of which is
used for offsetting the light beam in an X-direction, and the other
of which is used for offsetting the light beam in a Y-direction
perpendicular to the X-direction.
14. The light emitting device of claim 9, further comprising a
scanning assembly provided between the offset assembly and the
focusing assembly and configured for guiding the light beam from
the offset assembly to the focusing assembly.
15. The light emitting device of claim 14, wherein the scanning
assembly is configured for controlling the offset path of the light
beam.
16. The light emitting device of claim 15, wherein the offset path
is a circular, square, triangular, polygonal or curved path to be
used in a laser manufacturing process of complicated parts.
Description
BACKGROUND
1. Technical Field
The present disclosure relates to a light emitting method and a
device thereof, and more particularly, to a method for adjusting
the path of an output light and a device thereof.
2. Description of Related Art
Laser microporous processing technology has been widely used in
many industries, such as in the manufacturing of probe cards used
in semiconductor process testing, transparent hard and brittle
materials, engine injection holes and other processes such as metal
cutting. However, the micropores produced by the existing laser
processing equipment are conical circular holes. Therefore, it is
necessary to incorporate a drilling module with the ability to
control taper angles so as to generate micropores of different
shapes to accommodate different requirements, such as in the areas
of rectangular microporous processing of probe cards and the
processing of straight holes of reinforced glass and tapered holes
in engine nozzles.
However, the laser processing equipment is often limited by the
diffraction characteristics of the laser beam, and the taper angles
of the micropores cannot be adjusted as desired, resulting in the
drilling module not having flexible machining capability for taper
angles. It fails to address the need for manufacturing straight
through holes and tapered holes in a single laser drilling process,
for example, in a situation where the inclination of the edge of a
rectangular hole is different from the inclination at the
corner.
Furthermore, in the prior art, a glass plate or a prism-type
trepanning module is rotated by a hollow motor, but only circular
path offsets can be achieved, and the rotational speed of the
hollow motor is low (less than 4,000 rpm), resulting in low
throughput. This fails to meet the need for high speed in the
manufacturing process of rectangular tapered holes and other
hole-forming processes and the need for a controllable offset path.
It also limits the drilling dimensions, for example, it is not
possible to manufacture holes smaller than 50 microns (.mu.m) in
diameter.
Therefore, there is a need for a solution that addresses the
aforementioned issues in the prior art.
SUMMARY OF THE DISCLOSURE
The present disclosure provides a light emitting method, which may
include: passing a light beam through at least one offset assembly
and a focusing assembly in sequence; and actuating, by a
control-manipulating mechanism, the offset assembly to offset the
light beam, wherein a programmable logic controller (PLC) of the
control-manipulating mechanism plans a displacement path of the
offset assembly to displace the offset assembly and control an
offset path of the light beam.
The present disclosure further provides a light emitting device,
which may include: an offset assembly for a light beam to pass
therethrough; a focusing assembly for receiving the light beam from
the offset assembly; and a control-manipulating mechanism for
actuating the offset assembly to offset the light beam, wherein a
programmable logic controller (PLC) of the control-manipulating
mechanism plans a displacement path of the offset assembly to
displace the offset assembly and control an offset path of the
light beam.
In an embodiment, the displacement path of the offset assembly
includes a moving distance variation or a rotational angle
variation.
In an embodiment, the light emitting device is a laser device, and
the light beam is laser.
In an embodiment, the light beam is offset in a parallel
manner.
In an embodiment, the light beam is used for forming an opening. In
another embodiment, the PLC plans the displacement path of the
offset assembly based on a moving distance of the light beam and an
inclination angle of a wall of the opening.
In an embodiment, the offset assembly may include: a beam splitter;
a wave plate provided above the beam splitter; and a reflecting
mirror provided above the wave plate, wherein the light beam is
incident on and reflected by the beam splitter, passes through the
wave plate, is reflected by the reflecting mirror, passes through
the wave plate once again, and is reflected and outputted by the
beam splitter.
In an embodiment, the control-manipulating mechanism includes a
galvo motor to rotate the offset assembly by an offset angle that
relates to an offset distance of the light beam.
In an embodiment, the light beam passes through two sets of the
offset assemblies, one of which is used for offsetting the light
beam in an X-direction, and the other of which is used for
offsetting the light beam in a Y-direction perpendicular to the
X-direction.
In an embodiment, the light emitting method may further include
guiding, by a scanning assembly, the light beam from the offset
assembly to the focusing assembly. In another embodiment, the
scanning assembly and the PLC are used for controlling the offset
path of the light beam. The offset path may be a circular, square,
triangular, polygonal or curved path to be used in a laser
manufacturing process of complicated parts.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic diagram depicting a light emitting device in
accordance with a first embodiment of the present disclosure;
FIGS. 2A and 2B are schematic diagrams depicting other
implementations of path planning for the light beam in FIG. 1;
FIGS. 2C and 2D are schematic diagrams depicting other
implementations of the shape of the opening in FIG. 1;
FIG. 3A is a schematic diagram depicting a portion of a light
emitting device in accordance with a second embodiment of the
present disclosure;
FIG. 3B is a schematic diagram depicting an offset state of the
light beam of FIG. 3A;
FIG. 3C is a schematic diagram depicting the result of the light
beam of FIG. 3A on a target; and
FIG. 4 is a schematic diagram depicting a light emitting device in
accordance with a third embodiment of the present disclosure.
DETAILED DESCRIPTION
The present disclosure is described by the following specific
embodiments. Those with ordinary skills in the arts can readily
understand other advantages and functions of the present disclosure
after reading the disclosure of this specification. The present
disclosure may also be practiced or applied with other different
implementations. Based on different contexts and applications, the
various details in this specification can be modified and changed
without departing from the spirit of the present disclosure.
It should be noted that the structures, ratios, sizes shown in the
drawings appended to this specification are to be construed in
conjunction with the disclosure of this specification in order to
facilitate understanding of those skilled in the art. They are not
meant, in any ways, to limit the implementations of the present
disclosure, and therefore have no substantial technical meaning.
Without affecting the effects created and objectives achieved by
the present disclosure, any modifications, changes or adjustments
to the structures, ratio relationships or sizes, are to be
construed as fall within the range covered by the technical
contents disclosed herein. Meanwhile, terms, such as "above",
"below", "first", "second", "one", "a", "an", and the like, are for
illustrative purposes only, and are not meant to limit the range
implementable by the present disclosure. Any changes or adjustments
made to their relative relationships, without modifying the
substantial technical contents, are also to be construed as within
the range implementable by the present disclosure.
Referring to FIG. 1, a schematic diagram depicting a light emitting
device 1 in accordance with a first embodiment of the present
disclosure is shown. The light emitting device 1 is modularized,
including an offset assembly 11, a control-manipulating mechanism
12 and a focusing assembly 13.
The offset assembly 11 includes a spectroscope.
The control-manipulating mechanism 12 is used for actuating the
offset assembly 11, and includes a galvo motor. The
control-manipulating mechanism 12 uses a programmable logic
controller (PLC) to plan a displacement path of the offset assembly
11 (e.g., a rectangular path R1 shown in FIG. 1), and uses the
galvo motor to drive the offset assembly. The PLC makes the plan
based on the moving distance of a light beam (e.g., a long side W
of an opening 90 for guiding a probe on a probe card 9) and the
inclination angle of the wall of the opening (i.e., the inclination
e of a tapered surface of the opening 90). In other words, the
planning of the PLC is an association equation of the moving
distance of the light beam and the inclination angle of the wall of
the opening.
The focusing assembly 13 includes a focusing lens.
During operation, a light source 10 emits a light beam L, such as
laser. The light beam L passes through the offset assembly 11 and
the focusing assembly 13 and is focused on a target (e.g., the
opening 90 of the probe card 9). The offset path (e.g., along the
rectangular path R1 of FIG. 1) of the light beam L is adjusted by
the offset assembly 11, which is driven by the control-manipulating
mechanism 12 (resulting in the light beam L or a light beam L9
based on different offset paths).
Therefore, the light emitting device 1 according to the present
disclosure uses the galvo motor and the PLC of the
control-manipulating mechanism 12 to offset the offset assembly 11,
such that the path of the light beam L can be planned according to
needs (e.g., the rectangular path R1 shown in FIG. 1, or circular
paths R2 shown in FIGS. 2A and 2B). As a result, the light emitting
device 1 is capable of arbitrarily adjusting the taper angles of an
opening (e.g., the inclination e at the long side W and the
inclination e at the corner of the rectangular opening 90 are
different), and thus holes of any shapes can be manufactured. For
example, a circular tapered hole 80 and a circular tapered hole 81
of a target 8 are shown in FIGS. 2A and 2B, a star-shaped opening
82 and a Y-shaped opening 83 of the target 8 are shown in FIG. 2C,
and a rectangular opening 90 with fillets of a probe card 9 is
shown in FIG. 2D. The light emitting device 1 according to the
present disclosure is especially useful for manufacturing holes
with a diameter less than 50 microns (.mu.m) (e.g., the rectangular
opening 90 of the probe card 9).
Referring to FIGS. 3A and 3B, schematic diagrams depicting a
portion of a light emitting device in accordance with a second
embodiment of the present disclosure are shown. The difference
between the second embodiment and the first embodiment is in the
components of the offset assembly, and the rest are similar or will
not be repeated.
As shown in FIG. 3A, an offset assembly 21 includes a polarizing
beam splitter (PBS) 20, two 1/4 wave plates 21a and 21b, and two
reflecting mirrors 22a and 22b.
In an embodiment, the PBS 20 has a first surface 20a and a second
surface 20b opposite to the first surface 20a, the two 1/4 wave
plates 21a and 21b are provided at the sides of the first surface
20a and the second surface 20b, respectively, and the two
reflecting mirrors 22a and 22b are provided at the sides of the two
1/4 wave plates 21a and 21b, respectively.
In use, a light beam L1 of a light source 10, which is an
S-polarized light, is incident on and reflected by the first
surface 20a of the PBS 20, and passes through the 1/4 wave plate
21a at the side of the first surface 20a. The light beam L1 is then
incident on and reflected by the reflecting mirror 22a, and passes
through the 1/4 wave plate 21a at the side of the first surface 20a
once again, which is now a P-polarized light (light beam L2). As a
result, the light beam L2 passes through the first surface 20a and
the second surface 20b of the PBS 20. Thereafter, the light beam L2
(P-polarized light) passes through the 1/4 wave plate 21b at the
side of the second surface 20b, is reflected by the reflecting
mirror 22b, and passes through the 1/4 wave plate 21b at the side
of the second surface 20b once again, which now returns to a
S-polarized light (light beam L3). As such, the light beam L3 is
reflected and outputted by the second surface 20b of the PBS
20.
Therefore, using the high reflectivity characteristic of the PBS 20
to S-polarized light and the high transmittance characteristic of
the PBS 20 to P-polarized light, the polarization of the light beam
L1 is adjusted, such that the light beam L3 is reflected and
outputted by the second surface 20b of the PBS 20, thereby
producing controllable and arbitrary offset locations.
Furthermore, as shown in FIG. 3B, the angle of the PBS 20 is
adjusted in a clockwise direction using the galvo motor of the
control-manipulating mechanism 12, so that the light beam L3 is
offset in a parallel manner (e.g., becomes a light beam L4 after
offset). This allows high speed control (for example, the
revolution per minute of the motor is greater than 20,000). More
specifically, the initial location of the PBS 20 is indicated by
dashed lines (or as shown in FIG. 3A), and the PBS 20 is rotated by
an offset angle .+-..theta. by the galvo motor in a clockwise or
anticlockwise direction. Thus, a parallel offset distance D of the
light beam L3 is 2(D1+D2) tan(2.theta.), wherein D1 is the distance
from the reflecting mirror 22a at the side of the first surface 20a
to the PBS 20, and D2 is the distance from the reflecting mirror
22b at the side of the second surface 20b to the PBS 20. In an
embodiment, if the offset angle .theta. of the PBS 20 is one degree
and the length of the offset assembly 21 is 86 mm (i.e., D1 and D2
are 43 mm each), D==2(43+43)tan(21)=6.006 mm, so that the light
beam L3 is offset in a parallel manner by 6.006 mm to become the
lower light beam L4 shown in FIG. 3B. In other words, an initial
point a shown in FIG. 3C (on the opening of the target 8 on which
the light beam L3 focuses) is shifted to an offset point b (on the
opening of the target 8 on which the offset light beam L4 focuses).
It can be appreciated that if the galvo motor rotates the PBS 20 in
an anticlockwise direction, the light beam L3 will be shifted
upwards, becoming another light beam L5, for example.
Moreover, from the above equation, it can be seen that the parallel
offset distance D is related to the offset angle .theta. of the PBS
20. Therefore, in actual implementations (e.g., a drilling
process), when the planning method of the PLC of the
control-manipulating mechanism 12 (i.e., the association equation
of the moving distance of the light beam (e.g., the parallel offset
distance D) and the inclination of the wall of the opening (i.e.,
taper angle of the opening)) is used, the distance of the light
beam to be shifted is determined, and a required offset angle
.theta. can be derived by plugging in the value to be shifted (the
parallel offset distance D), which allows the PLC to control the
galvo motor, which in turns rotates the PBS 20 by the desired
angle.
Using the offset assembly 21 in combination with the
control-manipulating mechanism 12, not only the offset of the light
beam L3 can be controlled, but the control speed is high.
Therefore, the light emitting device according to the present
disclosure is capable of arbitrarily adjusting the taper angles of
an opening, allowing it to be used in the manufacturing of holes of
any shapes.
Furthermore, the offset assembly 21 is small in size, therefore
allowing the light emitting device to be minimized.
FIG. 4 is a schematic diagram depicting a light emitting device 3
in accordance with a third embodiment of the present disclosure.
The difference between the third embodiment and the first
embodiment is in the deployment of the offset assembly, the rest
are similar or the same and will not be repeated.
As shown in FIG. 4, the light emitting device 3 includes at least
two sets of offset assemblies 31x and 31y and a scanning assembly
32.
The offset assemblies 31x and 31y may adopt the same structure as
the offset assembly 21 in the second embodiment, and each include a
PBS 310, two 1/4 wave plates 311 and two reflecting mirrors 312 to
adjust the rotational angle of the PBS 310 using the galvo motor of
the control-manipulating mechanism 12, wherein one set of offset
assembly 31y is used for offsetting the light beam in a y-axis
direction, while the other set of offset assembly 31x is used for
offsetting the light beam in an x-axis direction.
In an embodiment, the scanning assembly 32 is a galvanometer-type
scanner, for example, a two dimensional scanner such as a
finite-state machine (FSM) scanner or a XY scanner. The scanning
assembly 32 includes two vertically arranged guide reflecting
mirrors 320. There are numerous types of scanning assembly 32, and
the present disclosure is not limited to the above. For example,
the scanning assembly 32 can be a one dimensional scanner.
In use, a light beam L6 of a light source 10 passes through the two
sets of offset assemblies 31x and 31y, and is guided to the
focusing assembly 13 by the guide reflecting mirrors 320 of the
scanning assembly 32 to be focused on a target. If the present
disclosure is applied in a drilling process, the inclination angle
of a tapered surface of an opening can be adjusted by the two
offset assemblies 31x and 31y (i.e., the taper angle of the
opening, referring to the second embodiment for descriptions, such
as a light beam L7 after adjustment shown as a dashed line in FIG.
4), and with help of the scanning assembly 32 and the PLC, an
offset path R3 of the light beam L6 can be controlled, which is
shown as a circular path in the diagram. However, in other
embodiments, the offset path R3 can be any arbitrary path, e.g.,
with a shape of a square, a triangle or a polygon or curved paths.
The light emitting device 3 according to the present disclosure is
applicable to laser manufacturing process of complicated parts.
The light emitting device according to the present disclosure
adopts two sets of independent offset assemblies 31x and 31y to
offset the light beam L6 in the x and y axes, respectively.
Furthermore, with the addition of the scanning assembly 32,
controllable and arbitrary taper angles can be created on the XY
planes and the focusing optical axis.
In conclusion, the light emitting method and the light emitting
device according to the present disclosure allow the path of the
light beam to be adjusted through the combination of the
control-manipulating mechanism and the offset assembly. Thus, when
applied to the laser drilling process, the present disclosure is
capable of quickly producing controllable tapered holes or straight
holes of any shapes as demanded, and with a size greater than,
equal to or less than 50 microns in diameter.
In addition, the galvo motor of the control-manipulating mechanism
12 can be replaced by other similar motors, such as a voice coil
motor or a torque motor, and the present disclosure is not limited
as such.
The above embodiments are only used to illustrate the principles of
the present disclosure, and should not be construed as to limit the
present disclosure in any way. The above embodiments can be
modified by those with ordinary skill in the art without departing
from the scope of the present disclosure as defined in the
following appended claims.
* * * * *