U.S. patent number 10,347,839 [Application Number 15/328,453] was granted by the patent office on 2019-07-09 for manufacturing methods of display panels.
This patent grant is currently assigned to Wuhan China Star Optoelectronics Technology Co., Ltd. The grantee listed for this patent is Wuhan China Star Optoelectronics Technology Co., Ltd.. Invention is credited to Yuejun Tang.
United States Patent |
10,347,839 |
Tang |
July 9, 2019 |
Manufacturing methods of display panels
Abstract
The present disclosure relates to a manufacturing method of
display panels. The method includes providing at least two glass
substrate having a predetermined dimension, configuring the glass
substrate to be spaced apart from a supporting substrate,
configuring a bonding area on the glass substrate, conducting a
cell-formation process or a package process of the display panel,
and stripping the supporting substrate. In this way, the thicker
supporting substrate is configured to support the glass substrate
so as to avoid two ends of the thinner glass substrate from
dropping and curing, which enhances the convenience and the
precision of the manufacturing process of the display panel.
Inventors: |
Tang; Yuejun (Guangdong,
CN) |
Applicant: |
Name |
City |
State |
Country |
Type |
Wuhan China Star Optoelectronics Technology Co., Ltd. |
Wuhan, Hubei |
N/A |
CN |
|
|
Assignee: |
Wuhan China Star Optoelectronics
Technology Co., Ltd (Wuhan, Hubei, CN)
|
Family
ID: |
58215606 |
Appl.
No.: |
15/328,453 |
Filed: |
December 28, 2016 |
PCT
Filed: |
December 28, 2016 |
PCT No.: |
PCT/CN2016/112664 |
371(c)(1),(2),(4) Date: |
January 23, 2017 |
PCT
Pub. No.: |
WO2018/119752 |
PCT
Pub. Date: |
July 05, 2018 |
Prior Publication Data
|
|
|
|
Document
Identifier |
Publication Date |
|
US 20180294411 A1 |
Oct 11, 2018 |
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L
51/5253 (20130101); G02F 1/1333 (20130101); G02F
1/1341 (20130101); H01L 51/56 (20130101); G02F
1/1339 (20130101); H01L 51/003 (20130101); B32B
17/06 (20130101); B32B 43/006 (20130101); G02F
2001/133302 (20130101); B32B 2457/20 (20130101); G02F
2001/133354 (20130101) |
Current International
Class: |
H01L
21/00 (20060101); B32B 17/06 (20060101); G02F
1/1333 (20060101); H01L 51/56 (20060101); B32B
43/00 (20060101); H01L 51/52 (20060101); G02F
1/1339 (20060101); G02F 1/1341 (20060101); H01L
51/00 (20060101) |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
|
|
|
|
|
|
|
203589037 |
|
May 2014 |
|
CN |
|
103995377 |
|
Aug 2014 |
|
CN |
|
104425773 |
|
Mar 2015 |
|
CN |
|
106154609 |
|
Nov 2016 |
|
CN |
|
Other References
International Search Report, Chinese Patent Office, dated Sep. 26,
2017. cited by applicant.
|
Primary Examiner: Booth; Richard A
Attorney, Agent or Firm: Cheng; Andrew C.
Claims
What is claimed is:
1. A manufacturing method of organic light emitting diode (OLED)
display panels, comprising: providing at least two bottom glass
substrates having predetermined dimension; configuring the bottom
glass substrates to be spaced apart from a bottom supporting
substrate, and a thickness of the bottom glass substrate is less
than a thickness of the bottom supporting substrate; configuring an
organic lighting layer and a bonding area on the bottom glass
substrate; forming a package layer on the organic lighting layer;
and stripping the bottom supporting substrate.
2. The manufacturing method as claimed in claim 1, wherein the
bottom supporting substrate is made by glass, and the bottom
supporting substrate has a thickness in a range from 0.5 mm to 1
mm, and the thickness of the bottom glass substrate is in a range
from 0.05 mm to 0.2 mm.
3. The manufacturing method as claimed in claim 1, wherein the step
of configuring the bottom glass substrate on the bottom supporting
substrate further comprises: configuring the bottom supporting
substrate and the bottom glass substrates to contact with each
other so as to bond the bottom supporting substrate with the bottom
glass substrates under vacuum condition, or bonding the bottom
supporting substrate and the bottom glass substrate together via
adhesive.
4. The manufacturing method as claimed in claim 1, wherein the step
of stripping the bottom supporting substrate further comprises:
conducting a plasma process on the bottom supporting substrate, or
configuring a protrusive pattern on a surface of the bottom
supporting substrate in advance, and injecting air to a gap between
the bottom supporting substrate and the bottom glass substrate via
an air injecting device.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present disclosure relates to display panel manufacturing
technology, and more particularly to a manufacturing method of
display panels, and further particularly to a manufacturing method
of liquid crystal display panel and organic electroluminescent
display panels.
2. Discussion of the Related Art
Display devices are developed with a thin and light trend, in
particularly, users demand thin-type electronic devices have been
increased. Flat display devices, such as liquid crystal devices
(LCDs) or organic light emitting diode (OLED) displays adopted in
portable electronic devices are required to have a thinner
thickness and a lighter weight so as to improve the portability of
the electronic devices. In addition, with respect to the
large-scale electronic products, such as TV, thin and light display
devices may save the space to provide more comfortable user
experience.
With respect to flat display devices, usually, a glass substrate is
adopted to be the carrier of other display components, and the
glass substrate is the one with biggest weight. In order to reduce
the thickness and the weight of the flat display devices, the most
effective way is to reduce the thickness the weight of the glass
substrate. However, thinner glass substrate may be easily bent, and
may have drooping or curving issues during the manufacturing
process. There are two ways to reduce the thickness and the weight
of the glass substrate. First, the glass substrate is etched.
Second, a lighter and thinner glass substrate is adopted. With
respect to the first solution, after the display panel is
assembled, additional etching process is adopted to reduce the
thickness and the weight of the glass substrate. The shortcoming of
this solution is if the etching process fails, the manufacturing
cost is greatly increased. With respect to the second solution, the
thinner glass substrate may be bent, especially for large-scale
glass substrate, and also the drooping and curving issues. In
addition, when the glass substrate is transmitted, even small crash
may cause the glass substrate to be bent when the glass substrate
is loaded or unloaded, which damages the glass substrate.
SUMMARY
In one aspect, a manufacturing method of display panels includes:
providing at least two glass substrate having a predetermined
dimension; configuring the glass substrate to be spaced apart from
a supporting substrate; configuring a bonding area on the glass
substrate; conducting a cell-formation process or a package process
of the display panel; stripping the supporting substrate.
Wherein the supporting substrate is made by glass, and the
supporting substrate has a thickness in a range from 0.5 mm to 1
mm, and the thickness of the glass substrate is in a range from
0.05 mm to 0.2 mm.
Wherein the step of configuring the glass substrate on the
supporting substrate further includes: configuring the supporting
substrate and the glass substrates to contact with each other so as
to bond the supporting substrate with the glass substrates under
vacuum condition, or bonding the supporting substrate and the glass
substrate together via adhesive.
Wherein the method further includes: configuring a supporting ball,
and the supporting ball is configured to maintain a cell gap during
the cell-formation process of the display panel.
Wherein the step of stripping the supporting substrate further
includes: adopting fluorine to conduct a plasma process on the
supporting substrate; or configuring a protrusive pattern on a
surface of the supporting substrate in advance, and injecting air
to a gap between the supporting substrate and the glass substrate
via an air injecting device.
In one aspect, a manufacturing method of display panels includes:
providing at least two top glass substrates and two bottom glass
substrates having predetermined dimension; configuring the bottom
glass substrate to be spaced apart from the bottom supporting
substrate, and configuring the top glass substrate to be spaced
apart from the top supporting substrate, wherein each of the bottom
glass substrates corresponds to one top glass substrate; forming an
array layer, a supporting ball, and a bonding area on the bottom
glass substrate, and forming a photo-resistor layer on the top
glass substrate; aligning the top supporting substrate and the
bottom supporting substrate such that the supporting ball abuts
against the top supporting substrate, and filling a liquid crystal
layer between the photo-resistor layer and the array layer; and
stripping the top supporting substrate and the bottom supporting
substrate, and removing the supporting ball.
Wherein the top supporting substrate and/or the bottom supporting
substrate are made by glass, and a thickness of the bottom
supporting substrate and the top supporting substrate is in a range
from 0.5 mm to 1 mm; and the thickness of the bottom glass
substrate and/or the top glass substrate is in a range from 0.05 mm
to 0.2 mm.
Wherein the step of configuring the bottom glass substrate to be on
the bottom supporting substrate further includes: configuring the
bottom supporting substrate and the bottom glass substrates to
contact with each other so as to bond the bottom supporting
substrate with the bottom glass substrates under vacuum condition,
or bonding the bottom supporting substrate and the bottom glass
substrate together via adhesive; and the step of configuring the
top glass substrate to be on the top supporting substrate further
includes: configuring the top supporting substrate and the top
glass substrates to contact with each other so as to bond the top
supporting substrate with the top glass substrates under vacuum
condition, or bonding the top supporting substrate and the top
glass substrate together via adhesive.
Wherein the step of stripping the bottom supporting substrate
further includes: conducting a plasma process on the bottom
supporting substrate, or configuring a protrusive pattern on a
surface of the bottom supporting substrate in advance, and
injecting air to a gap between the bottom supporting substrate and
the bottom glass substrate via an air injecting device; wherein the
step of stripping the top supporting substrate further includes:
conducting a plasma process on the top supporting substrate, or
configuring a protrusive pattern on a surface of the top supporting
substrate in advance, and injecting air to a gap between the top
supporting substrate and the top glass substrate via an air
injecting device.
In another aspect, a manufacturing method of organic light emitting
diode (OLED) display panels includes: providing at least two bottom
glass substrates having predetermined dimension; configuring the
bottom glass substrate to be spaced apart from a bottom supporting
substrate; configuring an organic lighting layer and a bonding area
on the bottom glass substrate; forming a package layer on the
organic lighting layer; and stripping the bottom supporting
substrate.
Wherein the bottom supporting substrate is made by glass, and the
bottom supporting substrate has a thickness in a range from 0.5 mm
to 1 mm, and the thickness of the bottom glass substrate is in a
range from 0.05 mm to 0.2 mm.
Wherein the step of configuring the bottom glass substrate on the
bottom supporting substrate further includes: configuring the
bottom supporting substrate and the bottom glass substrates to
contact with each other so as to bond the bottom supporting
substrate with the bottom glass substrates under vacuum condition,
or bonding the bottom supporting substrate and the bottom glass
substrate together via adhesive.
Wherein the step of stripping the bottom supporting substrate
further includes: conducting a plasma process on the bottom
supporting substrate, or configuring a protrusive pattern on a
surface of the bottom supporting substrate in advance, and
injecting air to a gap between the bottom supporting substrate and
the bottom glass substrate via an air injecting device.
In view of the above, the thicker supporting substrate is
configured to support the glass substrate so as to avoid two ends
of the thinner glass substrate from dropping and curing, which
enhances the convenience and the precision of the manufacturing
process of the display panel.
BRIEF DESCRIPTION OF THE DRAWINGS
Embodiments of the invention will now be described more fully
hereinafter with reference to the accompanying drawings, in which
embodiments of the invention are shown.
FIGS. 1A-1E are schematic views of the manufacturing method of the
liquid crystal display panel in accordance with a first
embodiment.
FIGS. 2A-2E are schematic views of the manufacturing method of the
liquid crystal display panel in accordance with a second
embodiment.
DETAILED DESCRIPTION OF THE EMBODIMENTS
Various example embodiments will now be described more fully with
reference to the accompanying drawings in which some example
embodiments are shown. In the drawings, the thicknesses of layers
and regions may be exaggerated for clarity. In the following
description, in order to avoid the known structure and/or function
unnecessary detailed description of the concept of the invention
result in confusion, well-known structures may be omitted and/or
functions described in unnecessary detail.
FIGS. 1A-1E are schematic views of the manufacturing method of the
liquid crystal display panel in accordance with a first
embodiment.
The manufacturing method includes the following steps.
In step 1, referring to FIG. 1A, providing a bottom supporting
substrate 11 and a top supporting substrate 12, and providing two
down glass substrates 13 and two top glass substrates 14 having a
predetermined dimension. It is to be noted that the numbers of the
top glass substrates 14 and the down glass substrates 13 may be
configured in accordance with real scenario, that is, the number of
the top glass substrates 14 and the down glass substrates 13 is not
limited to two.
The bottom supporting substrate 11 and the top supporting substrate
12 may be made by glass, ceramics, or metal. A thickness of the
bottom supporting substrate 11 and the top supporting substrate 12
is in a range from 0.5 mm to 1 mm. In the embodiment, the bottom
supporting substrate 11 and the top supporting substrate 12 are
made by glass, and the thickness of the bottom supporting substrate
11 and the top supporting substrate 12 is 0.7 mm.
The step of obtaining the down glass substrates 13 and two top
glass substrates 14 having a predetermined dimension further
includes: cutting a large-scale glass in accordance with a
predetermined dimension to form the down glass substrates 13 and
the top glass substrates 14.
In step 2, referring to FIG. 1B, configuring the down glass
substrates 13 to be spaced apart from the bottom supporting
substrate 11, and configuring the top glass substrates 14 to be
spaced apart from the top supporting substrate 12.
The down glass substrates 13 and the top glass substrates 14 are
thinner, and the down glass substrates 13 and the top glass
substrates 14 have the thickness ranging from 0.05 mm to 0.4 mm,
preferably, in a range from 0.1 mm to 0.15 mm. The thinner glass
substrate, such as the down glass substrates 13 and the top glass
substrates 14, are configured to be above the thicker supporting
substrate, such as the bottom supporting substrate 11 and the 12
and the 12. That is, the thicker supporting substrate is configured
to support the glass substrate so as to avoid two ends of the
thinner glass substrate from dropping and curing, which enhances
the convenience and the precision of the manufacturing process of
the display panel.
The step of configuring the down glass substrates 13 and top glass
substrates 14 respectively on the bottom supporting substrate 11
and the top supporting substrate 12 further includes: 1) bonding
the supporting substrate and the glass substrate via adhesive
forces, such as static electricity, vacuum forces, or surface
tension forces, under a vacuum condition; 2) the supporting
substrate and the glass substrate are bonded together via
adhesive.
In step 3, referring to FIG. 1C, configuring a supporting ball 15,
an array layer 17, and a bonding area 19. Correspondingly, a
photo-resistor layer 16 is configured on the top glass substrates
14. It is to be noted that other display components may be
configured on the down glass substrates 13 and the top glass
substrates 14. In addition, though the bonding area 19 and the
supporting ball 15 are conventionally configured in a non-display
area of the liquid crystal panel, the bonding area 19 may also not
equivalent to the non-display area of the liquid crystal panel.
In the embodiment, the supporting ball 15 may be, but not limited
to, a Si ball.
In step 4, referring to FIG. 1D, aligning the top supporting
substrate 12 and the 11 and the 11 such that the supporting ball 15
abuts against the top supporting substrate 12, and filling a liquid
crystal layer (LC) between the photo-resistor layer 16 and the
array layer 17 to finish a cell-formation process of the liquid
crystal panel.
The top supporting substrate 12 and the bottom supporting substrate
11 not only can protect the down glass substrates 13 and the top
glass substrates 14, but also the display components between the
top glass substrates 14 and the down glass substrates 13. In
addition, the top supporting substrate 12 and the bottom supporting
substrate 11 also enhances the operational convenience and
alignment precision.
In addition, the supporting ball 15 is configured to maintain a
distance between the top glass substrates 14 and the down glass
substrates 13 and the distance between the top supporting substrate
12 and the bottom supporting substrate 11. Before being cured, the
supporting ball 15 maintains the distances between two sides of the
seal of the top glass substrates 14 and the down glass substrates
13 to be the same or to be very close to one another. After being
cured, the thicknesses of the internal and the external edges may
be the same or may be close to one another, which reduces the color
differences occurring in the edge portion.
In step 5, referring to FIG. 1E, stripping the top supporting
substrate 12 and the bottom supporting substrate 11 and removing
the supporting ball 15.
The step of stripping the top supporting substrate 12 and the
bottom supporting substrate 11 includes: 1) adopting fluorine to
conduct a plasma process on the supporting substrate; 2)
configuring a protrusive pattern on a surface of the supporting
substrate in advance to decrease the adhesive force between the
glass substrate and the supporting substrate. Also, an air
injecting device (not shown) is adopted to inject the air to the
gap between the supporting substrate and the glass substrate so as
to strip the supporting substrate.
In view of the above, the thinner top supporting substrate 12 and
the down glass substrates 13 are configured to provide an uniform
thickness of the liquid crystal panel. Also, the surface of the
cell is flat and smooth.
FIGS. 2A-2E are schematic views of the manufacturing method of the
liquid crystal display panel in accordance with a second
embodiment.
The method includes the following steps.
In step 1, referring to FIG. 2A, providing a top glass substrate 21
and two down glass substrates 23. It is to be noted that the
numbers of the down glass substrates 23 may be configured in
accordance with real scenario, that is, the number of the down
glass substrates 23 is not limited to two.
The bottom supporting substrate 21 and the top supporting substrate
22 may be made by glass, ceramics, or metal. A thickness of the
bottom supporting substrate 21 and the top supporting substrate 22
is in a range from 0.5 mm to 1 mm. In the embodiment, the bottom
supporting substrate 21 and the top supporting substrate 22 are
made by glass, and the thickness of the bottom supporting substrate
21 and the top supporting substrate 22 is 0.7 mm.
The step of obtaining the two down glass substrates 23 having a
predetermined dimension further includes: cutting a large-scale
glass in accordance with a predetermined dimension to form the two
down glass substrates 23.
In step 2, referring to FIG. 2B, configuring the down glass
substrates 23 to be spaced apart from the bottom supporting
substrate 21.
The down glass substrates 23 is thinner, and has a thickness
ranging from 0.1 mm to 0.25 mm. The thinner down glass substrates
23 is configure above the bottom supporting substrate 21 such that
the thicker bottom supporting substrate 21 may support the down
glass substrates 23. In addition, two ends of the thinner down
glass substrates 23 are prevented from dropping and curving, which
enhances the convenience and the precision of the manufacturing
process of the display panel.
The step of configuring the down glass substrates 23 on the bottom
supporting substrate 21 further includes: 1) configuring the bottom
supporting substrate 21 and the down glass substrates 23 to contact
with each other so as to bond the bottom supporting substrate 21
with the down glass substrates 23 under vacuum condition. The
bottom supporting substrate 21 and the down glass substrates 23 are
bonded via adhesive forces, such as static electricity, vacuum
forces, or surface tension forces; 2) the bottom supporting
substrate 21 and the down glass substrates 23 are bonded together
via adhesive.
In step 3, referring to FIG. 2C, configuring an organic lighting
layer 27 and a bonding area 29. It is to be noted that other
display components may be configured on the down glass substrates
23. In addition, though the bonding area 29 generally equivalent to
a non-display area of the liquid crystal panel, the bonding area 29
may also not equivalent to the non-display area of the liquid
crystal panel.
In step 4, referring to FIG. 1D, configuring a package layer 28
above the organic lighting layer 27 to isolate water and oxygen.
The package layer 28 may be a glass cover or a thin-film package
layer.
In step 5, referring to FIG. 2E, stripping the bottom supporting
substrate 21.
The step of stripping the bottom supporting substrate 11 includes:
1) adopting fluorine to conduct a plasma process on the bottom
supporting substrate 21; 2) configuring a protrusive pattern on a
surface of the bottom supporting substrate 21 in advance to
decrease the adhesive force between the down glass substrates 23
and the bottom supporting substrate 21. Also, an air injecting
device (not shown) is adopted to inject the air to the gap between
the down glass substrates 23 and bottom supporting substrate 21 so
as to strip the supporting substrate.
In view of the above, the thinner down glass substrates 23 is
configured to provide an uniform thickness of the liquid crystal
panel. Also, the surface of the cell is flat and smooth.
It is believed that the present embodiments and their advantages
will be understood from the foregoing description, and it will be
apparent that various changes may be made thereto without departing
from the spirit and scope of the invention or sacrificing all of
its material advantages, the examples hereinbefore described merely
being preferred or exemplary embodiments of the invention.
* * * * *