U.S. patent number 10,429,414 [Application Number 15/013,106] was granted by the patent office on 2019-10-01 for multiple contact probe head disassembly method and system.
This patent grant is currently assigned to GLOBALFOUNDRIES INC.. The grantee listed for this patent is GLOBALFOUNDRIES INC.. Invention is credited to Stephen P. Ayotte, David L. Gardell, Marvin G. L. Montaque.
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United States Patent |
10,429,414 |
Montaque , et al. |
October 1, 2019 |
Multiple contact probe head disassembly method and system
Abstract
A system and method for disassembling a multiple contact probe
head including a plurality of contact probes positioned by a first
die at a first end of the plurality of probes and a second die at a
second end of the plurality of probes, are provided. The system may
include a manifold configured to sealingly receive an opposing side
of the first die from the second die; and a vacuum source
operatively coupled to the manifold to apply a vacuum to an
interior of the manifold applying a force to the plurality of
contact probes in position in the first die across. Where the
probes include a paramagnetic material, a magnetic source may be
employed to hold the probes during disassembly.
Inventors: |
Montaque; Marvin G. L. (Essex
Junction, VT), Ayotte; Stephen P. (New Haven, VT),
Gardell; David L. (Fairfax, VT) |
Applicant: |
Name |
City |
State |
Country |
Type |
GLOBALFOUNDRIES INC. |
Grand Cayman |
N/A |
KY |
|
|
Assignee: |
GLOBALFOUNDRIES INC. (Grand
Cayman, KY)
|
Family
ID: |
59385504 |
Appl.
No.: |
15/013,106 |
Filed: |
February 2, 2016 |
Prior Publication Data
|
|
|
|
Document
Identifier |
Publication Date |
|
US 20170219631 A1 |
Aug 3, 2017 |
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G01R
1/07357 (20130101); G01R 1/073 (20130101); G01R
3/00 (20130101) |
Current International
Class: |
G01R
1/073 (20060101); G01R 3/00 (20060101) |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Bryant; David P
Assistant Examiner: Holly; Lee A
Attorney, Agent or Firm: LeStrange; Michael Hoffman Warnick
LLC
Claims
What is claimed is:
1. A method for disassembling a multiple contact probe head
including a plurality of contact probes positioned by a first die
at a first end of the plurality of probes and a second die at a
second end of the plurality of probes, the method comprising:
applying a force to the plurality of contact probes in position in
the first die across an opposing side of the first die from the
second die; and removing the second die from the plurality of
contact probes by extracting the plurality of contact probes from
one or more openings in the second die.
2. The method of claim 1, wherein the applying the force includes
applying a vacuum across the opposing side of the first die from
the second die.
3. The method of claim 2, wherein the applying the vacuum includes
sealingly positioning a manifold about the first die, and applying
the vacuum to an interior of the manifold.
4. The method of claim 3, wherein the manifold includes a plurality
of vacuum applying openings.
5. The method of claim 2, wherein the applying the vacuum includes
sealingly positioning a manifold against the first die, and
applying the vacuum to an interior of the manifold.
6. The method of claim 2, further comprising adjusting the applying
the vacuum.
7. The method of claim 1, wherein each of the plurality of contact
probes includes a paramagnetic material, and the applying the force
includes applying an attractive magnetic force to the plurality of
contact probes extending from the opposing side of the first die
from the second die.
8. The method of claim 1, wherein removing the second die includes
extracting the plurality of contact probes from one or more
openings in the second die.
9. A method for disassembling a multiple contact probe head
including a plurality of contact probes positioned by a first die
at a first end of the plurality of probes and a second die at a
second end of the plurality of probes, wherein at least a portion
of the plurality of contact probes extends through one or more
openings in the second die, the method comprising: sealingly
positioning a manifold against the first die; applying a vacuum to
the interior of the manifold, such that a force is applied across
the opposing side of the first die from the second die and to the
plurality of contact probes in position in the first die; and
removing the second die from the plurality of contact probes.
Description
BACKGROUND
Technical Field
The present disclosure relates to multiple contact probe tests, and
more specifically, to a method and system for disassembling a
multiple contact probe head.
Related Art
Multiple contact probe heads are used to test integrated circuit
wafers during fabrication. As shown in FIG. 1, each probe head 10
includes a number of contact probes 12, referred to occasionally as
cobra probes or buckling beam probes, that are positioned in a
predetermined pattern by an upper die 14 and a lower die 16. Each
die includes a number of holes (not referenced) that position a
respective end of the probes. Probes 12 extend from upper die 14 to
a device interface board 18, e.g., a substrate attached to printed
circuit board with a ball grid array, which provides electrical
interconnections to a test controller (not shown) that runs tests
using the probes. Probes 12 also extend from lower die 16 to
contact a wafer 20 for electrical testing performed using the
probes. Probes 12, as shown in FIG. 2, can extend in a
predetermined two-dimensional pattern.
Periodically the probe head must be disassembled for cleaning or to
replace individual damaged cobra probe wires. Conventional
techniques to disassemble the probe head do not adequately attempt
to maintain the position of the probes, which can lead to the
probes becoming accidentally disengaged, damaged, soiled, etc. For
example, as shown in FIG. 3, current techniques typically apply a
layer of tape 22 across lower ends of probes 12 to hold the probes
in place. This approach typically leads to many probes being
accidentally removed, damaged probes and foreign material (e.g.,
tape residue, dust, etc.) collecting on the probes. Consequently, a
task of replacing a certain number of probes can turn into
replacing a large multiple of the number intended.
SUMMARY
A first aspect of the disclosure is directed to a method for
disassembling a multiple contact probe head including a plurality
of contact probes positioned by a first die at a first end of the
plurality of probes and a second die at a second end of the
plurality of probes, the method including: applying a force to the
plurality of contact probes in position in the first die across an
opposing side of the first die from the second die; and removing
the second die from the plurality of contact probes.
A second aspect of the disclosure includes a system for
disassembling a multiple contact probe head including a plurality
of contact probes positioned by a first die at a first end of the
plurality of probes and a second die at a second end of the
plurality of probes, the system including: a manifold configured to
sealingly receive an opposing side of the first die from the second
die; and a vacuum source operatively coupled to the manifold to
apply a vacuum to an interior of the manifold applying a force to
the plurality of contact probes in position in the first die
across.
A third aspect of the disclosure related to a system for
disassembling a multiple contact probe head including a plurality
of contact probes positioned by a first die at a first end of the
plurality of probes and a second die at a second end of the
plurality of probes, the system including: a magnetic source
configured to be positioned adjacent the first end of the plurality
of probes and magnetically hold the plurality of contact probes
during removal of the second die, wherein each of the plurality of
probes includes a paramagnetic material.
The foregoing and other features of the disclosure will be apparent
from the following more particular description of embodiments of
the disclosure.
BRIEF DESCRIPTION OF THE DRAWINGS
The embodiments of this disclosure will be described in detail,
with reference to the following figures, wherein like designations
denote like elements, and wherein:
FIG. 1 shows a cross-sectional view of a conventional multiple
contact probe head.
FIG. 2 shows a plan view of a conventional multiple contact probe
head.
FIG. 3 shows a perspective view of a conventional multiple contact
probe head in a disassembled state.
FIG. 4 shows a perspective view of a disassembly system for a
multiple contact probe head according to embodiments of the
disclosure.
FIG. 5 shows a plan view of a disassembly system for a multiple
contact probe head according to embodiments of the disclosure.
FIG. 6 shows a cross-sectional view of a disassembly system for a
multiple contact probe head according to embodiments of the
disclosure.
FIG. 7 shows a cross-sectional view of a disassembly system for a
multiple contact probe head according to another embodiment of the
disclosure.
FIG. 8 shows a cross-sectional view of a disassembly system for a
multiple contact probe head according to yet another embodiment of
the disclosure.
DETAILED DESCRIPTION
Referring to FIGS. 4-6, embodiments of a system 100 and method for
disassembling a multiple contact probe head 110 is illustrated.
Probe head 110 may include a plurality of contact probes 112
positioned by a first die 114 at a first end 116 of the plurality
of probes and a second die 120 at a second end 122 of the plurality
of probes. FIGS. 4 and 6 show perspective views of probe head 110
in a disassembled state, and FIG. 5 shows a plan view of system 100
including first die 114 therein. As illustrated, dies 114, 120 may
be substantially circular in plan view; however this may not be
necessary in all instances. As illustrated, first die 114
represents a lower die and second die 120 represents an upper die;
however, this arrangement is not necessary in all instances. In one
example, each die 114, 122 may have a width or diameter of
approximately 76 millimeters (approximately 3 inches). As used
herein, "approximately" indicates +/-20% of the value(s) stated.
Contact probes 112 may include any now known or later developed
probe such as those referred to as cobra probes or buckling beam
probes. As understood, probes 112 are set in openings (not numbered
for clarity) in dies 114, 120 to position the probes for contact
with an integrated circuit wafer. Probes 112 can include any number
of probes, which can range from hundreds to tens of thousands. The
area that probes 112 cover can vary depending on the application,
but may be, for example, approximately 645 square millimeters (1
square inch).
Referring to FIG. 4, probe head 110 may also include a template 170
which may include a layer of, for example, Kapton.RTM. available
from DuPont, Wilmington, Del., with holes for ends of probes 112 to
pass through. Template 170 is used during assembly to align all
probes 112 to holes in second die 120 during assembly.
As shown in FIGS. 4-7, system 100 may include a manifold 130
configured to sealingly receive an opposing side 132 of first die
114 from second die 120. Opposing side 132 of first die 114 faces
away from second die 120 and is the side from which second end 116
of contact probes extend to contact an IC wafer 20 (FIG. 1). Probes
112 may extend from opposing side 132 at a variety of lengths
depending on the application, e.g., less than 1 mm and typically
approximately 0.1 mm to 0.5 mm. Manifold 130 may take a variety of
forms. In one embodiment, shown in FIGS. 4 and 5, manifold 130 may
include a cup-shaped element 134 configured to have an internal
periphery 136 shaped to sealingly receive an outer periphery 138 of
first die 114. That is, as shown best in FIG. 6, manifold 130 has
an end wall 140 and a circular wall 142 extending therefrom that
defines inner periphery 136. Peripheries 136, 138 may be sized so
that the amount of air passing between internal periphery 136 and
outer periphery 138 is small relative to an amount of air supplied
by a vacuum source 160 thus maintaining a desired pressure. In an
alternative embodiment, as shown in FIG. 7, a manifold 230 may
include substantially similar structure to manifold 130 of FIG.
4-6, except manifold 230 sealingly engages a surface of opposing
side 132 of first die 114, i.e., outside of probes 112 but internal
to any mounting hardware such as screws (see FIG. 5) that couple
dies 114, 120 together. In this case, manifold 230 may include an
O-ring 250 about an upper surface thereof, i.e., along an upper
surface of wall 142. In any event, manifold 130, 230 seals against
opposing side 132 of first die 114 where probes 112 extend
therefrom.
System 100 also includes vacuum source 160, 260 operatively coupled
to manifold 130, 230, respectively, to apply a vacuum to an
interior of the manifold applying a force to the plurality of
contact probes 112 in position in first die 114. Vacuum source 160
may include any industrial vacuum system capable of applying to a
negative pressure sufficient to maintain probes 112 in first die
114 when second die 120 is removed from probes 112, as shown in
FIGS. 6 and 7. In one embodiment, vacuum source 160 may apply a
negative pressure of approximately 8,000 Pascal (Pa) to
approximately 80,000 Pa. Vacuum source 160 may also be adjustable
so as to accommodate any possible application expectations, e.g.,
different first die 114 dimensions, different probe 112 sizes,
different numbers of probes 112, etc. In this fashion, vacuum
source 160 may be activated and adjusted to each application.
Vacuum source 160 may be coupled to manifold 130, 230 in any now
known or later developed fashion, e.g., by direct coupling thereto
as shown in FIG. 6 or by one or more conduit(s) 162, 262, as shown
in FIGS. 4 and 7, respectively. As shown in FIGS. 4 and 6, in one
embodiment, manifold 130 may include a single vacuum applying
opening 164 for coupling to vacuum source 160, and in an
alternative embodiment, as shown in FIG. 7, manifold 230 may
include a plurality of vacuum applying openings 264 coupled to
vacuum source 160. In the latter embodiment, a sub-manifold 270 may
be employed to provide negative pressure to openings 264. It is
emphasized that the different features of each embodiment may be
selectively used across the various embodiments, e.g., multiple
openings 264 with direct vacuum source 160 coupling.
Turning to FIG. 8, in an alternative embodiment, a system 300 for
disassembling a multiple contact probe head 110 is illustrated. In
this embodiment, probes 312 are structurally similar to probes 112
(FIGS. 4-7), but include a magnetic or paramagnetic material.
Paramagnetic material may include any material capable of
attraction to a small, positive magnetic field such as but not
limited to magnesium, molybdenum, lithium, and tantalum. In this
case, since probes 312 include a paramagnetic material, they can be
influenced by a magnetic field. A magnetic probe 312 would further
increase the force but may need the additional step of
demagnetizing the probes after re-assembly is complete. Here,
system 300 may include a magnetic source 360 configured to be
positioned adjacent first end 116 of plurality of probes 312.
Magnetic source 360 acts to magnetically hold contact probes 312
during removal of second die 120. Magnetic source 360 can have any
magnetic field force capable of holding probes 312 in position,
which will depend on the size, geometry and material of the probes
and/or the magnetic source. In one example, the amount of necessary
magnetic force could be approximately 0.1 grams per probe to
approximately 20 grams to probe. Magnetic source 360 may be
provided alone or with some mount (in phantom in FIG. 8), similar
to manifold 130. Magnetic source 360 can include any form of
magnetic field generation, e.g., a magnetic material, an adjustable
electromagnet, etc.
In operation, a force may be applied to contact probes 112, 312 in
position in first die 114 across opposing side 132 of first die 114
from second die 120, using system 100 with a force applied by a
vacuum source 160 or using system 300 with a force applied by a
positive magnetic force such as magnetic source 360. Once the force
is applied, as shown in FIGS. 6-8, second die 120 may be removed
from contact probes 112, 312.
Vacuum source 160 or magnetic source 360 will create a stable force
that holds probes 112, 312 so probe head 110 can be disassembled.
Systems 100, 300 using a vacuum or magnetic field for probe head
110 disassembly prevents probe from unplanned disassembly. Systems
100, 300 also leave probes uncontaminated and untouched, and thus
prevents damage to probes 112, 312.
The method as described above is used in the fabrication of
integrated circuit chips.
The descriptions of the various embodiments of the present
disclosure have been presented for purposes of illustration, but
are not intended to be exhaustive or limited to the embodiments
disclosed. Many modifications and variations will be apparent to
those of ordinary skill in the art without departing from the scope
and spirit of the described embodiments. The terminology used
herein was chosen to best explain the principles of the
embodiments, the practical application or technical improvement
over technologies found in the marketplace, or to enable others of
ordinary skill in the art to understand the embodiments disclosed
herein.
* * * * *