| Patent | Date |
|---|
Contactless readable programmable transponder to monitor chip join
Grant 11,075,619 - Ayotte , et al. July 27, 2 | 2021-07-27 |
Contactless readable programmable transponder to monitor chip join
Grant 10,601,404 - Ayotte , et al. | 2020-03-24 |
Contactless Readable Programmable Transponder To Monitor Chip Join
App 20190386646 - Ayotte; Stephen P. ; et al. | 2019-12-19 |
Multiple contact probe head disassembly method and system
Grant 10,429,414 - Montaque , et al. October 1, 2 | 2019-10-01 |
Predicting semiconductor package warpage
Grant 10,309,884 - Ayotte , et al. | 2019-06-04 |
Separation of integrated circuit structure from adjacent chip
Grant 10,256,204 - Richard , et al. | 2019-04-09 |
Chip joining by induction heating
Grant 10,245,667 - Ayotte , et al. | 2019-04-02 |
Contactless readable programmable transponder to monitor chip join
Grant 10,200,016 - Ayotte , et al. Fe | 2019-02-05 |
Contactless Readable Programmable Transponder To Monitor Chip Join
App 20180358955 - Ayotte; Stephen P. ; et al. | 2018-12-13 |
Method for semiconductor die removal rework
Grant 10,050,012 - Ayotte , et al. August 14, 2 | 2018-08-14 |
Separation Of Integrated Circuit Structure From Adjacent Chip
App 20180130733 - Richard; Glen E. ; et al. | 2018-05-10 |
Contactless readable programmable transponder to monitor chip join
Grant 9,876,487 - Ayotte , et al. January 23, 2 | 2018-01-23 |
Contactless Readable Programmable Transponder To Monitor Chip Join
App 20170366172 - Ayotte; Stephen P. ; et al. | 2017-12-21 |
Chip Joining By Induction Heating
App 20170312841 - Ayotte; Stephen P. ; et al. | 2017-11-02 |
Predicting Semiconductor Package Warpage
App 20170284913 - AYOTTE; STEPHEN P. ; et al. | 2017-10-05 |
Chip joining by induction heating
Grant 9,776,270 - Ayotte , et al. October 3, 2 | 2017-10-03 |
Predicting semiconductor package warpage
Grant 9,772,268 - Ayotte , et al. September 26, 2 | 2017-09-26 |
Multiple Contact Probe Head Disassembly Method And System
App 20170219631 - Montaque; Marvin G. L. ; et al. | 2017-08-03 |
Visually detecting electrostatic discharge events
Grant 9,711,422 - Ayotte , et al. July 18, 2 | 2017-07-18 |
Semiconductor Structure And Method Of Making
App 20170200699 - Ayotte; Stephen P. ; et al. | 2017-07-13 |
Semiconductor structure and method of making
Grant 9,704,830 - Ayotte , et al. July 11, 2 | 2017-07-11 |
Method And Structure For Semiconductor Die Removal Rework
App 20170148762 - Ayotte; Stephen P. ; et al. | 2017-05-25 |
Reliability monitor test strategy definition
Grant 9,645,573 - Ayotte , et al. May 9, 2 | 2017-05-09 |
Detecting sudden changes in acceleration in semiconductor device or semiconductor packaging containing semiconductor device
Grant 9,548,275 - Ayotte , et al. January 17, 2 | 2017-01-17 |
Induction Heating For Underfill Removal And Chip Rework
App 20160372444 - Ayotte; Stephen P. ; et al. | 2016-12-22 |
Induction heating for underfill removal and chip rework
Grant 9,508,680 - Ayotte , et al. November 29, 2 | 2016-11-29 |
IC structure with recessed solder bump area and methods of forming same
Grant 9,472,490 - Sullivan , et al. October 18, 2 | 2016-10-18 |
Predicting Semiconductor Package Warpage
App 20160290905 - Ayotte; Stephen P. ; et al. | 2016-10-06 |
Reliability Monitor Test Strategy Definition
App 20160147220 - Ayotte; Stephen P. ; et al. | 2016-05-26 |
Elliptical Wafer Manufacture
App 20160079059 - Ayotte; Stephen P. ; et al. | 2016-03-17 |
Self-healing crack stop structure
Grant 9,230,921 - Ayotte , et al. January 5, 2 | 2016-01-05 |
Temperature stabilization in semiconductors using the magnetocaloric effect
Grant 9,222,707 - Ayotte , et al. December 29, 2 | 2015-12-29 |
Visually Detecting Electrostatic Discharge Events
App 20150355253 - Ayotte; Stephen P. ; et al. | 2015-12-10 |
Solder bump reflow by induction heating
Grant 9,190,375 - Ayotte , et al. November 17, 2 | 2015-11-17 |
Reducing thermal energy transfer during chip-join processing
Grant 9,177,931 - Ayotte , et al. November 3, 2 | 2015-11-03 |
Solder Bump Reflow By Induction Heating
App 20150294948 - Ayotte; Stephen P. ; et al. | 2015-10-15 |
Reducing Thermal Energy Transfer During Chip-join Processing
App 20150243618 - Ayotte; Stephen P. ; et al. | 2015-08-27 |
Visually detecting electrostatic discharge events
Grant 9,105,573 - Ayotte , et al. August 11, 2 | 2015-08-11 |
Inhibiting propagation of imperfections in semiconductor devices
Grant 9,059,097 - Ayotte , et al. June 16, 2 | 2015-06-16 |
Self-healing Crack Stop Structure
App 20150097271 - Ayotte; Stephen P. ; et al. | 2015-04-09 |
Chip Joining By Induction Heating
App 20150089805 - Ayotte; Stephen P. ; et al. | 2015-04-02 |
Contactless Readable Programmable Transponder To Monitor Chip Join
App 20150091584 - Ayotte; Stephen P. ; et al. | 2015-04-02 |
Microprocessor image correction and method for the detection of potential defects
Grant 8,987,010 - Ayotte , et al. March 24, 2 | 2015-03-24 |
Microprocessor Image Correction And Method For The Detection Of Potential Defects
App 20150064813 - AYOTTE; Stephen P. ; et al. | 2015-03-05 |
Detecting Sudden Changes In Acceleration In Semiconductor Device Or Semiconductor Packaging Containing Semiconductor Device
App 20140346619 - Ayotte; Stephen P. ; et al. | 2014-11-27 |
Stacked multi-chip package and method of making same
Grant 8,829,674 - Ayotte , et al. September 9, 2 | 2014-09-09 |
Temperature Stabilization In Semiconductors Using The Magnetocaloric Effect
App 20140223922 - Ayotte; Stephen P. ; et al. | 2014-08-14 |
Stacked Multi-chip Package And Method Of Making Same
App 20140183723 - Ayotte; Stephen P. ; et al. | 2014-07-03 |
Controlled collapse chip connection (C4) structure and methods of forming
Grant 8,765,593 - Ayotte , et al. July 1, 2 | 2014-07-01 |
Inhibiting Propagation Of Imperfections In Semiconductor Devices
App 20140042594 - Ayotte; Stephen P. ; et al. | 2014-02-13 |
Controlled Collapse Chip Connection (c4) Structure And Methods Of Forming
App 20140042630 - Ayotte; Stephen P. ; et al. | 2014-02-13 |
Visually Detecting Electrostatic Discharge Events
App 20130257624 - AYOTTE; Stephen P. ; et al. | 2013-10-03 |
Thermally sensitive material embedded in the substrate
Grant 8,426,856 - Ayotte , et al. April 23, 2 | 2013-04-23 |
Low profile heat sink for semiconductor devices
Grant 8,230,903 - Ayotte , et al. July 31, 2 | 2012-07-31 |
Thermally Sensitive Material Embedded In The Substrate
App 20120007074 - Ayotte; Stephen P. ; et al. | 2012-01-12 |
Gap capacitors for monitoring stress in solder balls in flip chip technology
Grant 7,939,390 - Ayotte , et al. May 10, 2 | 2011-05-10 |
Production of integrated circuit chip packages prohibiting formation of micro solder balls
Grant 7,915,732 - Ayotte , et al. March 29, 2 | 2011-03-29 |
Gap Capacitors For Monitoring Stress In Solder Balls In Flip Chip Technology
App 20100203655 - Ayotte; Stephen P. ; et al. | 2010-08-12 |
Rectangular-shaped controlled collapse chip connection
Grant 7,745,256 - Ayotte , et al. June 29, 2 | 2010-06-29 |
Gap capacitors for monitoring stress in solder balls in flip chip technology
Grant 7,709,876 - Ayotte , et al. May 4, 2 | 2010-05-04 |
Production Of Integrated Circuit Chip Packages Prohibiting Formation Of Micro Solder Balls
App 20090321914 - Ayotte; Stephen P. ; et al. | 2009-12-31 |
Rectangular-Shaped Controlled Collapse Chip Connection
App 20090273095 - Ayotte; Stephen P. ; et al. | 2009-11-05 |
Low Profile Heat Sink For Semiconductor Devices
App 20090260778 - Ayotte; Stephen P. ; et al. | 2009-10-22 |
Optimized Passivation Slope For Solder Connections
App 20090218688 - Ayotte; Stephen P. ; et al. | 2009-09-03 |
Gap Capacitors For Monitoring Stress In Solder Balls In Flip Chip Technology
App 20090201626 - Ayotte; Stephen P. ; et al. | 2009-08-13 |
Method And Apparatus For Singulating Integrated Circuit Chips
App 20090155981 - Ayotte; Stephen P. ; et al. | 2009-06-18 |
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