U.S. patent application number 17/834885 was filed with the patent office on 2022-09-22 for systems and methods for minimizing vibration sensitivity for protected microphones.
The applicant listed for this patent is GoPro, Inc.. Invention is credited to Joyce Gorny, Per Magnus Fredrik Hansson, Mark Hardin, Erich Tisch.
Application Number | 20220303671 17/834885 |
Document ID | / |
Family ID | 1000006388244 |
Filed Date | 2022-09-22 |
United States Patent
Application |
20220303671 |
Kind Code |
A1 |
Gorny; Joyce ; et
al. |
September 22, 2022 |
SYSTEMS AND METHODS FOR MINIMIZING VIBRATION SENSITIVITY FOR
PROTECTED MICROPHONES
Abstract
Protected microphone systems may include a protective layer and
one or more cavities to minimize the vibration sensitivity of a
microphone of the protected microphone systems. The protective
layer may be constructed of a mesh material. The mesh material may
be constructed of a polyester monofilament material.
Inventors: |
Gorny; Joyce; (Mountain
View, CA) ; Tisch; Erich; (San Francisco, CA)
; Hardin; Mark; (Guerneville, CA) ; Hansson; Per
Magnus Fredrik; (Los Altos, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
GoPro, Inc. |
San Mateo |
CA |
US |
|
|
Family ID: |
1000006388244 |
Appl. No.: |
17/834885 |
Filed: |
June 7, 2022 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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17018673 |
Sep 11, 2020 |
11363372 |
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17834885 |
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16441441 |
Jun 14, 2019 |
10785558 |
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17018673 |
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15934399 |
Mar 23, 2018 |
10327063 |
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16441441 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
B06B 1/06 20130101; B06B
3/00 20130101; G02B 27/0006 20130101; G03B 17/56 20130101; G03B
17/08 20130101; G10K 11/002 20130101; H04N 5/2254 20130101; G03B
2217/243 20130101; G03B 2217/246 20130101; G03B 17/24 20130101;
H04N 5/2252 20130101; H04R 1/2876 20130101; H04R 1/08 20130101;
H04N 5/22521 20180801; G03B 2217/244 20130101; G03B 31/06
20130101 |
International
Class: |
H04R 1/28 20060101
H04R001/28; H04R 1/08 20060101 H04R001/08; G03B 31/06 20060101
G03B031/06; H04N 5/225 20060101 H04N005/225; G10K 11/00 20060101
G10K011/00 |
Claims
1. An image capture device comprising: a housing that includes a
port that is fluidly connected to an external environment relative
to the image capture device; an audio capture device configured to
obtain a sound; and a protective layer directly coupled to an
internal portion of the housing adjacent to the port.
2. The image capture device of claim 1, wherein the protective
layer is a membrane.
3. The image capture device of claim 2, wherein the membrane
comprises silicone or polytetrafluoroethylene (PTFE).
4. The image capture device of claim 1, wherein the protective
layer is a mesh.
5. The image capture device of claim 1, wherein the protective
layer is coupled to the internal portion of the housing via a
support structure.
6. The image capture device of claim 5, wherein the support
structure is an adhesive.
7. The image capture device of claim 5, wherein an active area of
the protective layer, a portion of the housing, and a portion of
the support structure form a cavity.
8. An audio capture device comprising: a housing that includes a
first port fluidly connected to an external environment relative to
the image capture device and a second port spaced from and fluidly
connected to the first port; a protective layer disposed between
the first port and the second port, wherein the protective layer is
directly coupled to an internal portion of the housing adjacent to
the first port; a circuit board comprising a microphone configured
to obtain a sound via the second port; a first cavity that extends
between the first port and a first surface of the protective layer;
and a second cavity that extends between a second surface of the
protective layer, the second port, and the microphone.
9. The audio capture device of claim 8, wherein the protective
layer is coupled to the internal portion of the housing via a
support structure.
10. The audio capture device of claim 8, wherein the support
structure is an adhesive.
11. The audio capture device of any one of claim 8, wherein the
protective layer is a mesh.
12. The audio capture device of claim 8, wherein the mesh comprises
a polyester monofilament material.
13. The audio capture device of claim 8, wherein a volume of the
second cavity is larger than a volume of the first cavity.
14. The audio capture device of claim 8, wherein the protective
layer includes an active area and a non-active area.
15. An image capture system comprising: a housing that includes a
port that is fluidly connected to an external environment relative
to the image capture device; a printed circuit board (PCB) disposed
in the housing; an audio capture device coupled to the PCB
configured to obtain a sound; and a protective layer directly
coupled to an internal portion of the housing adjacent to the
port.
16. The image capture system of claim 15, wherein the protective
layer is a mesh.
17. The image capture device of claim 15, wherein the mesh
comprises a polyester monofilament material.
18. The image capture device of claim 15, wherein the protective
layer is a membrane that comprises silicone or
polytetrafluoroethylene (PTFE).
19. The image capture system of claim 15, wherein an adhesive layer
is configured to attach the protective layer to the internal
portion of the housing.
20. The image capture system of claim 15, wherein the protective
layer includes an active area and a non-active area.
Description
CROSS REFERENCE TO RELATED APPLICATION(S)
[0001] This application is a continuation of U.S. patent
application Ser. No. 17/018,673, filed on Sep. 11, 2020, which is a
continuation of U.S. patent application Ser. No. 16/441,441, filed
on Jun. 14, 2019, now U.S. Pat. No. 10,785,558, which is a
continuation of U.S. patent application Ser. No. 15/934,399, filed
on Mar. 23, 2018, now U.S. Pat. No. 10,327,063, the contents of
which are incorporated by reference herein in their entirety.
TECHNICAL FIELD
[0002] This disclosure relates to vibration isolation in
microphones.
BACKGROUND
[0003] Vibration of a device may cause energy to be detected by a
microphone of an image capture device. This vibration may be
detected as noise and cause degradation of the audio experience.
Typical vibration isolation strategies employ dampeners to isolate
microphone components. However, these strategies have been
ineffective in protected microphone implementations.
SUMMARY
[0004] Disclosed herein are implementations of a system and method
for minimizing vibration sensitivity for protected microphones. In
examples where a microphone is protected by a membrane or a mesh,
vibration noise may be dependent on one or more cavities in a
device, in addition to the vibration sensitivity of the microphone
component alone.
[0005] In an aspect, an image capture device may include a housing.
The housing may include a port that is fluidly connected to an
external environment relative to the image capture device. The
image capture device may include an audio capture device that is
configured to obtain a sound. The image capture device may include
a protective layer that is directly coupled to an internal portion
of the housing adjacent to the port.
[0006] In an aspect, an audio capture device may include a housing.
The housing may include a first port that is fluidly connected to
an external environment relative to the image capture device and a
second port spaced from and fluidly connected to the first port.
The audio capture device may include a protective layer disposed
between the first port and the second port. The protective layer
may be directly coupled to an internal portion of the housing
adjacent to the first port. The audio capture device may include a
circuit board that includes a microphone configured to obtain a
sound via the second port. The audio capture device may include a
first cavity that extends between the first port and a first
surface of the protective layer. The audio capture device may
include a second cavity that extends between a second surface of
the protective layer, the second port, and the microphone.
[0007] In an aspect, an image capture system may include a housing.
The housing may include a port that is fluidly connected to an
external environment relative to the image capture system. The
image capture system may include a printed circuit board (PCB)
disposed in the housing. The image capture system may include an
audio capture device coupled to the PCB. The audio capture device
may be configured to obtain a sound. The image capture system may
include a protective layer directly coupled to an internal portion
of the housing adjacent to the port.
[0008] In an aspect, an image capture device may include a housing.
The housing may include a first port. The image capture device may
include an audio capture device configured to obtain an audible
sound. The image capture device may include a PCB. The PCB may be
coupled to the audio capture device. The image capture device may
include a protective layer. The protective layer may be coupled to
an internal portion of the housing. The image capture device may
include a dampener. The dampener may be configured to absorb
vibration energy. The dampener may include a first surface that is
adhered to the protective layer. The dampener may include a second
surface that is coupled to the PCB.
[0009] In an aspect, an audio capture device may include a housing.
The housing may include a first port that is fluidly connected to
an external environment relative to the audio capture device and a
second port spaced from and fluidly connected to the first port.
The audio capture device may include a protective layer disposed
between the first port and the second port. The audio capture
device may include a PCB that includes a microphone configured to
obtain an audible sound via the second port. The audio capture
device may include a first cavity that extends between the first
port and a first surface of the protective layer. The audio capture
device may include a second cavity that extends between the PCB and
the protective layer. The dampener may include a first surface that
is adhered to the protective layer and a second surface that is
coupled to the PCB.
[0010] In an aspect, an image capture system may include a housing
that includes a first port. The image capture system may include an
audio capture device that is configured to obtain an audible sound.
The image capture system may include a PCB that is coupled to the
audio capture device. The image capture system may include a
protective layer that is coupled to an internal portion of the
housing. The image capture system may include a dampener that is
configured to absorb vibration energy. The dampener may include a
first surface that is coupled to the PCB. The image capture system
may include an adhesive layer that is disposed between the
protective layer and a second surface of the dampener.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The disclosure is best understood from the following
detailed description when read in conjunction with the accompanying
drawings. It is emphasized that, according to common practice, the
various features of the drawings are not to-scale. On the contrary,
the dimensions of the various features are arbitrarily expanded or
reduced for clarity.
[0012] FIG. 1 is a diagram of an example of an image capture
device.
[0013] FIG. 2 is a diagram of an example of a protected microphone
system with a membrane protective layer.
[0014] FIG. 3 is a diagram of another example of a protected
microphone system with a membrane protective layer.
[0015] FIG. 4 is a diagram of an example of a protected microphone
system with a mesh protective layer.
[0016] FIG. 5 is a diagram of another example of a protected
microphone system with a mesh protective layer.
[0017] FIG. 6 is a diagram of another example of a protected
microphone system with a mesh protective layer.
[0018] FIG. 7 is a diagram of another example of a protected
microphone system with a mesh protective layer.
[0019] FIG. 8 is a diagram of another example of a protected
microphone system with a mesh protective layer.
[0020] FIG. 9 is a diagram of another example of a protected
microphone system with a mesh protective layer.
[0021] FIG. 10 is a diagram of another example of a protected
microphone system with a mesh protective layer.
DETAILED DESCRIPTION
[0022] In the embodiments disclosed herein, protected microphone
systems may include dampeners, a protective layer, or a combination
thereof to minimize the vibration sensitivity of a microphone of
the protected microphone systems. The dampeners may be constructed
of a foam material, a thin metal material, or any suitable material
that is pliable and configured to absorb vibration energy. The
protective layer may be a membrane, a mesh, or any suitable
material. The protective layer may be air permeable or non-air
permeable.
[0023] While the disclosure has been described in connection with
certain embodiments, it is to be understood that the disclosure is
not to be limited to the disclosed embodiments but, on the
contrary, is intended to cover various modifications and equivalent
arrangements included within the scope of the appended claims,
which scope is to be accorded the broadest interpretation so as to
encompass all such modifications and equivalent structures as is
permitted under the law.
[0024] FIG. 1 is a diagram of an example of an image capture device
100. In some implementations, an image capture device 100 may be an
action camera that includes an audio component 112, an input/output
(I/O) unit 114, a sensor controller 120, a processor 124, an image
sensor 130, a metadata unit 132, an optics unit 134, a
communication unit 140, a power system 150, or a combination
thereof.
[0025] In some implementations, the audio component 110, which may
include a microphone, may receive, sample, capture, record, or a
combination thereof, audio information, such as sound waves. The
audio information may be associated with, or stored in association
with, image or video content contemporaneously captured by the
image capture device 100. In some implementations, audio
information may be encoded using, for example, Advanced Audio
Coding (AAC), Audio Compression-3 (AC3), Moving Picture Experts
Group Layer-3 Audio (MP3), linear Pulse Code Modulation (PCM),
Motion Picture Experts Group-High efficiency coding and media
delivery in heterogeneous environments (MPEG-H), and/or other audio
coding formats or codecs. In one or more implementations of
spherical video and/or audio, the audio codec may include a
three-dimensional audio codec, such as Ambisonics. For example, an
Ambisonics codec can produce full surround audio including a height
dimension. Using a G-format Ambisonics codec, a special decoder may
be omitted.
[0026] In some implementations, the user interface unit 112 may
include one or more units that may register or receive input from
and/or present outputs to a user, such as a display, a touch
interface, a proximity sensitive interface, a light
receiving/emitting unit, a sound receiving/emitting unit, a
wired/wireless unit, and/or other units. In some implementations,
the user interface unit 112 may include a display, one or more
tactile elements (such as buttons and/or virtual touch screen
buttons), lights (LEDs), speakers, and/or other user interface
elements. The user interface unit 112 may receive user input and/or
provide information to a user related to the operation of the image
capture device 100.
[0027] In some implementations, the user interface unit 112 may
include a display unit that presents information related to camera
control or use, such as operation mode information, which may
include image resolution information, frame rate information,
capture mode information, sensor mode information, video mode
information, photo mode information, or a combination thereof;
connection status information, such as connected, wireless, wired,
or a combination thereof; power mode information, such as standby
mode information, sensor mode information, video mode information,
or a combination thereof; information related to other information
sources, such as heart rate information, global positioning system
information, or a combination thereof; and/or other
information.
[0028] In some implementations, the user interface unit 112 may
include a user interface component such as one or more buttons,
which may be operated, such as by a user, to control camera
operations, such as to start, stop, pause, and/or resume sensor
and/or content capture. The camera control associated with
respective user interface operations may be defined. For example,
the camera control associated with respective user interface
operations may be defined based on the duration of a button press,
which may be pulse width modulation, a number of button presses,
which may be pulse code modulation, or a combination thereof. In an
example, a sensor acquisition mode may be initiated in response to
detecting two short button presses. In another example, the
initiation of a video mode and cessation of a photo mode, or the
initiation of a photo mode and cessation of a video mode, may be
triggered or toggled in response to a single short button press. In
another example, video or photo capture for a given time duration
or a number of frames, such as burst capture, may be triggered in
response to a single short button press. Other user command or
communication implementations may also be implemented, such as one
or more short or long button presses.
[0029] In some implementations, the I/O unit 114 may synchronize
the image capture device 100 with other cameras and/or with other
external devices, such as a remote control, a second image capture
device, a smartphone, a user interface device, and/or a video
server. The I/O unit 114 may communicate information between I/O
components. In some implementations, the I/O unit 114 may be
connected to the communication unit 140 to provide a wired and/or
wireless communications interface, such as a Wi-Fi interface, a
Bluetooth interface, a USB interface, an HDMI interface, a Wireless
USB interface, an NFC interface, an Ethernet interface, a radio
frequency transceiver interface, and/or other interfaces, for
communication with one or more external devices, such as a mobile
device, or another metadata source. In some implementations, the
I/O unit 114 may interface with LED lights, a display, a button, a
microphone, speakers, and/or other I/O components. In some
implementations, the I/O unit 114 may interface with an energy
source, such as a battery, and/or a Direct Current (DC) electrical
source.
[0030] In some implementations, the I/O unit 114 of the image
capture device 100 may include one or more connections to external
computerized devices for configuration and/or management of remote
devices, as described herein. The I/O unit 114 may include any of
the wireless or wireline interfaces described herein, and/or may
include customized or proprietary connections for specific
applications.
[0031] In some implementations, the sensor controller 120 may
operate or control the image sensor 130, such as in response to
input, such as user input. In some implementations, the sensor
controller 120 may receive image and/or video input from the image
sensor 130 and may receive audio information from the audio
component 110.
[0032] In some implementations, the processor 122 may include a
system on a chip (SOC), microcontroller, microprocessor, central
processing unit (CPU), digital signal processor (DSP),
application-specific integrated circuit (ASIC), graphics processing
unit (GPU), and/or other processor that may control the operation
and functionality of the image capture device 100. In some
implementations, the processor 122 may interface with the sensor
controller 120 to obtain and process sensory information, such as
for object detection, face tracking, stereo vision, and/or other
image processing.
[0033] In some implementations, the sensor controller 120, the
processor 122, or both may synchronize information received by the
image capture device 100. For example, timing information may be
associated with received sensor data, and metadata information may
be related to content, such as images or videos, captured by the
image sensor 130 based on the timing information. In some
implementations, the metadata capture may be decoupled from
video/image capture. For example, metadata may be stored before,
after, and in-between the capture, processing, or storage of one or
more video clips and/or images.
[0034] In some implementations, the sensor controller 120, the
processor 122, or both may evaluate or process received metadata
and may generate other metadata information. For example, the
sensor controller 120 may integrate the received acceleration
information to determine a velocity profile for the image capture
device 100 concurrently with recording a video. In some
implementations, video information may include multiple frames of
pixels and may be encoded using an encoding method, such as H.264,
H.265, CineForm, and/or other codecs.
[0035] Although not shown separately in FIG. 1, one or more of the
audio component 110, the user interface unit 112, the I/O unit 114,
the sensor controller 120, the processor 122, the electronic
storage unit 124, the image sensor 130, the metadata unit 132, the
optics unit 134, the communication unit 140, or the power systems
150 of the image capture device 100 may communicate information,
power, or both with one or more other units, such as via an
electronic communication pathway, such as a system bus. For
example, the processor 122 may interface with the audio component
110, the user interface unit 112, the I/O unit 114, the sensor
controller 120, the electronic storage unit 124, the image sensor
130, the metadata unit 132, the optics unit 134, the communication
unit 140, or the power systems 150 via one or more driver
interfaces and/or software abstraction layers. In some
implementations, one or more of the units shown in FIG. 1 may
include a dedicated processing unit, memory unit, or both (not
shown). In some implementations, one or more components may be
operable by one or more other control processes. For example, a
global positioning system receiver may include a processing
apparatus that may provide position and/or motion information to
the processor 122 in accordance with a defined schedule, such as
values of latitude, longitude, and elevation at 10 Hz.
[0036] In some implementations, the electronic storage unit 124 may
include a system memory module that may store executable computer
instructions that, when executed by the processor 122, perform
various functionalities including those described herein. For
example, the electronic storage unit 124 may be a non-transitory
computer-readable storage medium, which may include executable
instructions, and a processor, such as the processor 122, may
execute an instruction to perform one or more, or portions of one
or more, of the operations described herein. The electronic storage
unit 124 may include storage memory for storing content, such as
metadata, images, audio, or a combination thereof, captured by the
image capture device 100.
[0037] In some implementations, the electronic storage unit 124 may
include non-transitory memory for storing configuration information
and/or processing code for video information and metadata capture,
and/or to produce a multimedia stream that may include video
information and metadata in accordance with the present disclosure.
In some implementations, the configuration information may include
capture type, such as video or still image, image resolution, frame
rate, burst setting, white balance, recording configuration, such
as loop mode, audio track configuration, and/or other parameters
that may be associated with audio, video, and/or metadata capture.
In some implementations, the electronic storage unit 124 may
include memory that may be used by other hardware/firmware/software
elements of the image capture device 100.
[0038] In some implementations, the image sensor 130 may include
one or more of a charge-coupled device sensor, an active pixel
sensor, a complementary metal-oxide-semiconductor sensor, an N-type
metal-oxide-semiconductor sensor, and/or another image sensor or
combination of image sensors. In some implementations, the image
sensor 130 may be controlled based on control signals from a sensor
controller 120.
[0039] The image sensor 130 may sense or sample light waves
gathered by the optics unit 134 and may produce image data or
signals. The image sensor 130 may generate an output signal
conveying visual information regarding the objects or other content
corresponding to the light waves received by the optics unit 134.
The visual information may include one or more of an image, a
video, and/or other visual information.
[0040] In some implementations, the image sensor 130 may include a
video sensor, an acoustic sensor, a capacitive sensor, a radio
sensor, a vibrational sensor, an ultrasonic sensor, an infrared
sensor, a radar sensor, a Light Detection and Ranging (LIDAR)
sensor, a sonar sensor, or any other sensory unit or combination of
sensory units capable of detecting or determining information in a
computing environment.
[0041] In some implementations, the metadata unit 132 may include
sensors such as an inertial measurement unit, which may include one
or more accelerometers, one or more gyroscopes, a magnetometer, a
compass, a global positioning system sensor, an altimeter, an
ambient light sensor, a temperature sensor, and/or other sensors or
combinations of sensors. In some implementations, the image capture
device 100 may contain one or more other sources of metadata
information, telemetry, or both, such as image sensor parameters,
battery monitor, storage parameters, and/or other information
related to camera operation and/or capture of content. The metadata
unit 132 may obtain information related to the environment of the
image capture device 100 and aspects in which the content is
captured.
[0042] For example, the metadata unit 132 may include an
accelerometer that may provide device motion information, including
velocity and/or acceleration vectors representative of motion of
the image capture device 100. In another example, the metadata unit
132 may include a gyroscope that may provide orientation
information describing the orientation of the image capture device
100. In another example, the metadata unit 132 may include a global
positioning system sensor that may provide global positioning
system coordinates, time, and information identifying a location of
the image capture device 100. In another example, the metadata unit
132 may include an altimeter that may obtain information indicating
an altitude of the image capture device 100.
[0043] In some implementations, the metadata unit 132, or one or
more portions thereof, may be rigidly coupled to the image capture
device 100, such that motion, changes in orientation, or changes in
the location of the image capture device 100 may be accurately
detected by the metadata unit 132. Although shown as a single unit,
the metadata unit 132, or one or more portions thereof, may be
implemented as multiple distinct units. For example, the metadata
unit 132 may include a temperature sensor as a first physical unit
and a global positioning system unit as a second physical unit. In
some implementations, the metadata unit 132, or one or more
portions thereof, may be included in an image capture device 100 as
shown or may be included in a physically separate unit operatively
coupled to, such as in communication with, the image capture device
100.
[0044] In some implementations, the optics unit 134 may include one
or more of a lens, macro lens, zoom lens, special-purpose lens,
telephoto lens, prime lens, achromatic lens, apochromatic lens,
process lens, wide-angle lens, ultra-wide-angle lens, fisheye lens,
infrared lens, ultraviolet lens, perspective control lens, other
lens, and/or other optics components. In some implementations, the
optics unit 134 may include a focus controller unit that may
control the operation and configuration of the camera lens. The
optics unit 134 may receive light from an object and may focus
received light onto an image sensor 130. Although not shown
separately in FIG. 1, in some implementations, the optics unit 134
and the image sensor 130 may be combined, such as in a combined
physical unit, for example, a housing.
[0045] In some implementations, the communication unit 140 may be
coupled to the I/O unit 114 and may include a component, such as a
dongle, having an infrared sensor, a radio frequency transceiver
and antenna, an ultrasonic transducer, and/or other communications
interfaces used to send and receive wireless communication signals.
In some implementations, the communication unit 240 may include a
local, such as Bluetooth or Wi-Fi, and/or broad range, such as
cellular Long Term Evolution (LTE), communications interface for
communication between the image capture device 100 and a remote
device, such as a mobile device. The communication unit 140 may
communicate using, for example, Ethernet, 802.11, worldwide
interoperability for microwave access (WiMAX), Third Generation
Partnership Project (3GPP), LTE, digital subscriber line (DSL),
asynchronous transfer mode (ATM), InfiniBand, PCI Express Advanced
Switching, and/or other communication technologies. In some
implementations, the communication unit 140 may communicate using
networking protocols, such as multiprotocol label switching (MPLS),
transmission control protocol/Internet protocol (TCP/IP), User
Datagram Protocol (UDP), hypertext transport protocol (HTTP),
simple mail transfer protocol (SMTP), file transfer protocol (FTP),
and/or other networking protocols.
[0046] Information exchanged via the communication unit 140 may be
represented using formats including one or more of hypertext markup
language (HTML), extensible markup language (XML), and/or other
formats. One or more exchanges of information between the image
capture device 100 and remote or external devices may be encrypted
using encryption technologies including one or more of secure
sockets layer (SSL), transport layer security (TLS), virtual
private networks (VPNs), Internet Protocol security (IPsec), and/or
other encryption technologies.
[0047] In some implementations, the one or more power systems 150
supply power to the image capture device 100. For example, for a
small-sized, lower-power action camera, a wireless power solution,
such as battery, solar cell, inductive, such as contactless, power
source, rectification, and/or other power supply, may be used.
[0048] Consistent with the present disclosure, the components of
the image capture device 200 may be remote from one another and/or
aggregated. For example, one or more sensor components may be
distal from the image capture device 100. Multiple mechanical,
sensory, or electrical units may be controlled by a learning
apparatus via network/radio connectivity.
[0049] FIG. 2 is a diagram of an example of a protected microphone
system 200 with a membrane protective layer 210. In this example,
the membrane protective layer 210 may be silicone,
polytetrafluoroethylene (PTFE), or any suitable material, and it
may be air permeable or non-air permeable. The protected microphone
system 200 includes a microphone 220, a printed circuit board (PCB)
230, and a housing 240. The PCB 230 may be flexible or rigid, and
is electrically coupled to the microphone 220. The PCB 230 includes
a port P1 to allow sound to travel to the microphone 220.
[0050] The housing 240 includes a port P2 to allow sound to travel
into the protected microphone system 200. In this example, the
membrane protective layer 210 is adhered to the housing 240 using
support structures 250. The membrane protective layer 210 includes
an active area 260. The active area 260, along with a portion of
the housing 240 and a portion of the support structures 250 form a
cavity 270 within the protected microphone system 200. In this
example, dampeners 280 are included between the PCB 230 and the
membrane protective layer 210, and the membrane protective layer
210 is adhered to the dampeners 280 using support structures 250.
The dampeners 280 may be a foam, thin metal, or any suitable
material. The active area 260, along with a portion of the
dampeners 280, a portion of the PCB 230, and a portion of the
support structures 250 form a cavity 290 within the protective
microphone system 200. As shown in FIG. 2, the cavity 270 and the
cavity 290 are separated by the active area 260 of the membrane
protective layer 210. In this example, a first velocity (V1)
represents the motion of the housing 240 and support structure 250,
a second velocity (V2) represents the motion of the PCB 230 and the
microphone 220, and a third velocity (V3) represents the motion of
the active area 260. V1 is a forcing velocity on the housing 240.
For example, V1 may be the velocity of handlebars to which the
image capture device is mounted. V1 may not be dependent on the
parameters of the dampeners 280, membrane protective layer 210,
support structures 250, or a combination of any of the above. The
velocity difference between V1 and V2 may be based on the
elasticity of the dampeners 280.
[0051] V2 and V3 may vary based on the stiffness of the dampeners
280, the mass of the microphone 220 and PCB 230 structure, the
stiffness of the membrane protective layer 210, the mass of the
membrane protective layer 210, or a combination of any of the
above. The dampeners 280 may have a stiffness above approximately
1.times.10.sup.6 N/m. In some examples, a stiffness below
1.times.10.sup.6 N/m may result in a significant impact on
microphone performance. The membrane protective layer 210 may have
a stiffness ranging from 10 to 50 N/m. The membrane protective
layer 210 may have a mass that is below approximately
2.times.10.sup.-5 kg. An example where the membrane protective
layer 210 has a mass that is above 2.times.10.sup.-5 kg may result
in poor microphone performance as the resonance moves too far into
the audible frequency range. These parameters, for example dampener
stiffness, microphone and PCB mass, membrane stiffness, and
membrane mass, may each vary with the dimensions of cavity 270,
cavity 290, P1, and P2.
[0052] FIG. 3 is a diagram of another example of a protected
microphone system 300 with a membrane protective layer 310. In this
example, the membrane protective layer 310 may be silicone, PTFE,
or any suitable material, and it may be air permeable or non-air
permeable. The protected microphone system 300 includes a
microphone 320, a PCB 330, and a housing 340. The PCB 330 may be
flexible or rigid, and is electrically coupled to the microphone
320. The PCB 330 includes a port P1 to allow sound to travel to the
microphone 320.
[0053] The housing 340 includes a port P2 to allow sound to travel
into the protected microphone system 300. In this example, the
membrane protective layer 310 is adhered to the PCB 330 using
support structures 350. The membrane protective layer 310 includes
an active area 360. In this example, dampeners 380 are included
between the PCB 330 and the membrane protective layer 310, and the
membrane protective layer 310 is adhered to the dampeners 380 using
support structures 350. The dampeners 380 may be a foam, thin
metal, or any suitable material. The active area 360, along with a
portion of the housing 340, a portion of the support structures
350, and a portion of the dampeners 380 form a cavity 370 within
the protected microphone system 300. The active area 360, along
with a portion of the PCB 230, and a portion of the support
structures 350 form a cavity 390 within the protective microphone
system 300. As shown in FIG. 3, the cavity 370 and the cavity 390
are separated by the active area 360 of the membrane protective
layer 310. In this example, a first velocity (V1) represents the
motion of the housing 340, a second velocity (V2) represents the
motion of the PCB 330 and the membrane support structure 350, and a
third velocity (V3) represents the motion of the active area
360.
[0054] V2 and V3 may vary based on the stiffness of the dampeners
380, the mass of the microphone 220 and PCB 230 structure, the
stiffness of the membrane protective layer 310, the mass of the
membrane protective layer 310, or a combination of any of the
above. In this example, the stiffness of the dampeners 380 may have
a reduced effect on the microphone performance when compared to the
example in FIG. 2. The dampeners 380 may have a stiffness above
approximately 1.times.10.sup.7 N/m. In some examples, a stiffness
below 1.times.10.sup.7 N/m may result in a significant impact on
microphone performance. In this example, changing the stiffness of
the membrane protective layer 310 may not change the relationship
between the acoustic and vibration sensitivities when compared to
the example in FIG. 2. The membrane protective layer 310 may have a
stiffness ranging from 10 to 100 N/m in this example to produce
acceptable acoustic sensitivity. The membrane protective layer 310
may have a mass that is below approximately 2.times.10.sup.-5 kg.
An example where the membrane protective layer 310 has a mass that
is above 2.times.10.sup.-5 kg may result in poor microphone
performance as the resonance moves too far into the audible
frequency range. An example where the membrane protective layer 310
has a mass that is below 2.times.10.sup.-6 kg may result in low
vibration sensitivity on a condition that the dampener 380 meet the
minimum threshold of stiffness of 1.times.10.sup.7 N/m. These
parameters, for example dampener stiffness, microphone and PCB
mass, membrane stiffness, and membrane mass, may each vary with the
dimensions of cavity 370, cavity 390, P1, and P2.
[0055] FIG. 4 is a diagram of an example of a protected microphone
system 400 with a mesh protective layer 410. In this example, the
mesh protective layer 410 may be polyester monofilament or any
suitable material. The protected microphone system 400 includes a
microphone 420, a PCB 430, and a housing 440. The PCB 430 may be
flexible or rigid, and is electrically coupled to the microphone
420. In this example, the PCB 430 is coupled to the housing 440.
The PCB 430 includes a port P1 to allow sound to travel to the
microphone 420.
[0056] The housing 440 includes a port P2 to allow sound to travel
into the protected microphone system 400. In this example, the mesh
protective layer 410 is adhered to the housing 440 using support
structures 450. The mesh protective layer 410 includes an active
area 460. The active area 460, along with a portion of the housing
440 and a portion of the support structures 450 form a cavity 470
within the protected microphone system 400. In this example,
dampeners 480 are included between the PCB 430 and the mesh
protective layer 410, and the mesh protective layer 410 is adhered
to the dampeners 480 using support structures 450. The dampeners
480 may be a foam, thin metal, or any suitable material. The active
area 460, along with a portion of the dampeners 480, a portion of
the PCB 430, and a portion of the support structures 450 form a
cavity 490 within the protective microphone system 400. As shown in
FIG. 4, the cavity 470 and the cavity 490 are separated by the
active area 460 of the mesh protective layer 410. In this example,
a first velocity (V1) represents the motion of the housing 440 and
PCB 430, a second velocity (V2) represents the motion of the
support structure 450, and a third velocity (V3) represents the
motion of the active area 460.
[0057] V2 and V3 may vary based on the stiffness of the dampeners
480, the mass of the microphone 220 and PCB 230 structure, the
stiffness of the mesh protective layer 410, the mass of the mesh
protective layer 410, the acoustic resistance of the mesh
protective layer 410 or a combination of any of the above. The
dampeners 480 may have a stiffness above approximately
1.times.10.sup.6 N/m. In some examples, a stiffness below
1.times.10.sup.6 N/m may result in a significant impact on
microphone performance. These parameters, for example dampener
stiffness, microphone and PCB mass, mesh stiffness, mesh mass, and
mesh acoustic resistance, may each vary with the dimensions of
cavity 470, cavity 490, P1, and P2.
[0058] FIG. 5 is a diagram of another example of a protected
microphone system 500 with a mesh protective layer 510. In this
example, the mesh protective layer 510 may be polyester
monofilament or any suitable material. The protected microphone
system 500 includes a microphone 520, a PCB 530, and a housing 540.
The PCB 530 may be flexible or rigid, and is electrically coupled
to the microphone 520. In this example, dampeners 580 are coupled
to the PCB 530 the housing 540. The PCB 530 includes a port P1 to
allow sound to travel to the microphone 520.
[0059] The housing 540 includes a port P2 to allow sound to travel
into the protected microphone system 500. In this example, the mesh
protective layer 510 is adhered to the PCB 530 using support
structures 550. The mesh protective layer 510 includes an active
area 560. The active area 560, along with a portion of the housing
540, a portion of the dampeners 580, and a portion of the support
structures 550 form a cavity 570 within the protected microphone
system 500. In this example, the mesh protective layer 510 is
adhered to the PCB 530 using support structures 550. The dampeners
580 may be a foam, thin metal, or any suitable material. The active
area 560, along with a portion of the PCB 530 and a portion of the
support structures 550 form a cavity 590 within the protective
microphone system 500. In this example, the volume of cavity 590 is
kept to a minimum by adhering the mesh protective layer 510
directly to the PCB 530 using support structures 550. As shown in
FIG. 5, the cavity 570 and the cavity 590 are separated by the
active area 560 of the mesh protective layer 510. In this example,
a first velocity (V1) represents the motion of the housing 540, a
second velocity (V2) represents the motion of the PCB 530 and
support structure 550, and a third velocity (V3) represents the
motion of the active area 560.
[0060] V2 and V3 may vary based on the stiffness of the dampeners
580, the mass of the microphone 220 and PCB 230 structure, the
stiffness of the mesh protective layer 510, the mass of the mesh
protective layer 510, the acoustic resistance of the mesh
protective layer 510, or a combination of any of the above. The
dampeners 580 may have a stiffness above approximately
1.times.10.sup.6 N/m. In some examples, a stiffness below
1.times.10.sup.6 N/m may result in a significant impact on
microphone performance. In this example, an acoustic resistance of
the mesh protective layer 510 of below 700 Rayls (kg/sm.sup.2)
produce a minimal impact on the acoustic sensitivity and low
vibration sensitivity. The mesh protective layer 510 may have a
stiffness of over approximately 1.times.10.sup.6 N/m and may have a
low vibration sensitivity. These parameters, for example dampener
stiffness, microphone and PCB mass, mesh stiffness, mesh mass, and
acoustic resistance, may each vary with the dimensions of cavity
570, cavity 590, P1, and P2.
[0061] FIG. 6 is a diagram of another example of a protected
microphone system 600 with a mesh protective layer 610. In this
example, the mesh protective layer 610 may be polyester
monofilament or any suitable material. The protected microphone
system 600 includes a microphone 620, a PCB 630, and a housing 640.
The PCB 630 may be flexible or rigid, and is electrically coupled
to the microphone 620. In this example, the PCB 630 is coupled to
the housing 640. The PCB 630 includes a port P1 to allow sound to
travel to the microphone 620.
[0062] The housing 640 includes a port P2 to allow sound to travel
into the protected microphone system 600. In this example, the mesh
protective layer 610 is adhered to the PCB 630 using support
structures 650. The mesh protective layer 610 includes an active
area 660. The active area 660, along with a portion of the housing
640 and a portion of the support structures 650 form a cavity 670
within the protected microphone system 600. In this example, the
mesh protective layer 610 is adhered to the PCB 630 using support
structures 650. The active area 660, along with a portion of the
PCB 630 and a portion of the support structures 650 form a cavity
690 within the protective microphone system 600. In this example,
the volume of cavity 690 is kept to a minimum by adhering the mesh
protective layer 610 directly to the PCB 630 using support
structures 650. As shown in FIG. 6, the cavity 670 and the cavity
690 are separated by the active area 660 of the mesh protective
layer 610. In this example, a first velocity (V1) represents the
motion of the housing 640, PCB 630, and support structure 650 and a
second velocity (V2) represents the motion of the active area
660.
[0063] V2 may vary based on the stiffness of the mesh protective
layer 610, the mass of the mesh protective layer 610, the acoustic
resistance of the mesh protective layer 610, or a combination of
any of the above. In this example, an acoustic resistance of the
mesh protective layer 610 of below 700 Rayls (kg/sm.sup.2) produced
a minimal impact on the acoustic sensitivity and low vibration
sensitivity. Unexpectedly, the system without dampening material
yields the lowest vibration sensitivity relative to acoustic
sensitivity. The mesh protective layer 610 may have a stiffness of
over approximately 1.times.10.sup.6 N/m and may have a low
vibration sensitivity. These parameters, for example mesh stiffness
and acoustic resistance, may each vary with the dimensions of
cavity 670, cavity 690, P1, and P2.
[0064] FIG. 7 is a diagram of another example of a protected
microphone system 700 with a mesh protective layer 710. In this
example, the mesh protective layer 710 may be polyester
monofilament or any suitable material. The protected microphone
system 700 includes a microphone 720, a PCB 730, and a housing 740.
The PCB 730 may be flexible or rigid, and is electrically coupled
to the microphone 720. In this example, the PCB 730 is coupled to
the housing 740. The PCB 730 includes a port P1 to allow sound to
travel to the microphone 720.
[0065] The housing 740 includes a port P2 to allow sound to travel
into the protected microphone system 700. In this example, the mesh
protective layer 710 is adhered to the PCB 730 using support
structures 750. The mesh protective layer 710 includes an active
area 760. In this example, since the support structures 750 are
included on a single side of the mesh protective layer 710, the
mesh protective layer 710 along with a portion of the housing 740
form a cavity 770 within the protected microphone system 700. In
this example, the mesh protective layer 710 is adhered to the
housing 740 using support structures 750. The active area 760,
along with a portion of the PCB 730 and a portion of the support
structures 750 form a cavity 790 within the protective microphone
system 700. In this example, the volume of cavity 790 is kept to a
minimum by adhering the mesh protective layer 710 directly to the
PCB 730 using support structures 750. As shown in FIG. 7, the
cavity 770 and the cavity 790 are separated by the active area 760
of the mesh protective layer 710. In this example, a first velocity
(V1) represents the motion of the housing 740, the PCB 730, and the
support structure 750, and a second velocity (V2) represents the
motion of the active area 760.
[0066] V2 may vary based on the stiffness of the mesh protective
layer 710, the mass of the mesh protective layer 710, the acoustic
resistance of the mesh protective layer 710, or a combination of
any of the above. In this example, an acoustic resistance of the
mesh protective layer 710 of below 700 Rayls (kg/sm.sup.2) produced
a minimal impact on the acoustic sensitivity and low vibration
sensitivity. Unexpectedly, the system without dampening material
yields the lowest vibration sensitivity relative to acoustic
sensitivity. The mesh protective layer 710 may have a stiffness of
over approximately 1.times.10.sup.6 N/m and may have a low
vibration sensitivity. These parameters, for example mesh
stiffness, mass, and acoustic resistance, may each vary with the
dimensions of cavity 770, cavity 790, P1, and P2.
[0067] FIG. 8 is a diagram of another example of a protected
microphone system 800 with a mesh protective layer 810. In this
example, the mesh protective layer 810 may be polyester
monofilament or any suitable material. The protected microphone
system 800 includes a microphone 820, a PCB 830, and a housing 840.
The PCB 830 may be flexible or rigid, and is electrically coupled
to the microphone 820. In this example, the PCB 830 is coupled to
the housing 840. The PCB 830 includes a port P1 to allow sound to
travel to the microphone 820.
[0068] The housing 840 includes a port P2 to allow sound to travel
into the protected microphone system 800. In this example, the mesh
protective layer 810 is adhered to the housing 840 using support
structures 850. The mesh protective layer 810 includes an active
area 860. The active area 860, along with a portion of the housing
840 and a portion of the support structures 850 form a cavity 870
within the protected microphone system 800. The active area 860,
along with a portion of the PCB 830 and a portion of the support
structures 850 form a cavity 890 within the protective microphone
system 800. In this example, the volume of cavity 870 and cavity
890 are substantially similar. As shown in FIG. 8, the cavity 870
and the cavity 890 are separated by the active area 860 of the mesh
protective layer 810. In this example, a first velocity (V1)
represents the motion of the housing 840, the PCB 830, and the
support structure 850, and a second velocity (V2) represents the
motion of the active area 860.
[0069] V2 may vary based on the stiffness of the mesh protective
layer 810, the mass of the mesh protective layer 810, the acoustic
resistance of the mesh protective layer 810, or a combination of
any of the above. In this example, an acoustic resistance of the
mesh protective layer 810 of below 700 Rayls (kg/sm.sup.2) produced
a minimal impact on the acoustic sensitivity and low vibration
sensitivity. Unexpectedly, the system without dampening material
yields the lowest vibration sensitivity relative to acoustic
sensitivity. The mesh protective layer 810 may have a stiffness of
over approximately 1.times.10.sup.6 N/m and may have a low
vibration sensitivity. These parameters, for example mesh
stiffness, mass, and acoustic resistance, may each vary with the
dimensions of cavity 870, cavity 890, P1, and P2.
[0070] FIG. 9 is a diagram of another example of a protected
microphone system 900 with a mesh protective layer 910. In this
example, the mesh protective layer 910 may be polyester
monofilament or any suitable material. The protected microphone
system 900 includes a microphone 920, a PCB 930, and a housing 940.
The PCB 930 may be flexible or rigid, and is electrically coupled
to the microphone 920. In this example, the PCB 930 is coupled to
the housing 940. The PCB 930 includes a port P1 to allow sound to
travel to the microphone 920.
[0071] The housing 940 includes a port P2 to allow sound to travel
into the protected microphone system 900. In this example, the mesh
protective layer 910 is adhered to the housing 940 using support
structures 950. The mesh protective layer 910 includes an active
area 960. The active area 960, along with a portion of the housing
940 and a portion of the support structures 950 form a cavity 970
within the protected microphone system 900. The active area 960,
along with a portion of the PCB 930 and a portion of the support
structures 950 form a cavity 990 within the protective microphone
system 900. In this example, the volume of cavity 970 is kept to a
minimum by adhering the mesh protective layer 910 directly to a
portion of the housing 940 closest to port P2 using support
structures 950. As shown in FIG. 9, the cavity 970 and the cavity
990 are separated by the active area 960 of the mesh protective
layer 910. In this example, a first velocity (V1) represents the
motion of the housing 940, the PCB 930, and the support structure
950, and a second velocity (V2) represents the motion of the active
area 960.
[0072] V2 may vary based on the stiffness of the mesh protective
layer 910, the mass of the mesh protective layer 910, the acoustic
resistance of the mesh protective layer 610, or a combination of
any of the above. In this example, an acoustic resistance of the
mesh protective layer 910 of below 700 Rayls (kg/sm.sup.2) produced
a minimal impact on the acoustic sensitivity and low vibration
sensitivity. Unexpectedly, the system without dampening material
yields the lowest vibration sensitivity relative to acoustic
sensitivity. The mesh protective layer 910 may have a stiffness of
over approximately 1.times.10.sup.6 N/m and may have a low
vibration sensitivity. These parameters, for example mesh
stiffness, mass, and acoustic resistance, may each vary with the
dimensions of cavity 970, cavity 990, P1, and P2.
[0073] FIG. 10 is a diagram of another example of a protected
microphone system 1000 with a mesh protective layer 1010. In this
example, the mesh protective layer 1010 may be polyester
monofilament or any suitable material. The protected microphone
system 1000 includes a microphone 1020, a PCB 1030, and a housing
1040. The PCB 1030 may be flexible or rigid, and is electrically
coupled to the microphone 1020. In this example, the PCB 1030 is
coupled to the housing 1040. The PCB 1030 includes a port P1 to
allow sound to travel to the microphone 1020.
[0074] The housing 1040 includes a port P2 to allow sound to travel
into the protected microphone system 1000. In this example, the
mesh protective layer 1010 is adhered to the housing 1040 and the
PCB 1030 using support structures 1050. The mesh protective layer
1010 includes an active area 1060. The active area 1060, along with
a portion of the housing 1040 and a portion of the support
structures 1050 form a cavity 1070 within the protected microphone
system 1000. The active area 1060, along with a portion of the PCB
1030 and a portion of the support structures 1050 form a cavity
1090 within the protective microphone system 1000. As shown in FIG.
10, the cavity 1070 and the cavity 1090 are separated by the active
area 1060 of the mesh protective layer 1010. In this example, a
first velocity (V1) represents the motion of the housing 1040, the
PCB 1030, and the support structure 1050, and a second velocity
(V2) represents the motion of the active area 1060.
[0075] V2 may vary based on the stiffness of the mesh protective
layer 1010, the mass of the mesh protective layer 1010, the
acoustic resistance of the mesh protective layer 1010, or a
combination of any of the above. In this example, an acoustic
resistance of the mesh protective layer 1010 of below 700 Rayls
(kg/sm.sup.2) produced a minimal impact on the acoustic sensitivity
and low vibration sensitivity. Unexpectedly, the system without
dampening material yields the lowest vibration sensitivity relative
to acoustic sensitivity. The mesh protective layer 1010 may have a
stiffness of over approximately 1.times.10.sup.6 N/m and may have a
low vibration sensitivity. These parameters, for example mesh
stiffness, mass, and acoustic resistance, may each vary with the
dimensions of cavity 1070, cavity 1090, P1, and P2.
[0076] In the examples described herein, the microphone may be
stiffly coupled to the membrane support material or the mesh
support material. If a dampener is present, the dampener will
vibrate separately from the other components of the image capture
device, causing pressure fluctuations in a volume directly in front
of the microphone. These pressure fluctuations may be detected by
the microphone as an acoustic signal.
[0077] A volume between the microphone and the membrane material or
the mesh material may be kept to a minimum to promote direct
coupling between the motion of the membrane material or the mesh
material and a membrane of the microphone. If a non-air permeable
membrane is used, the stiffness of the material may be kept as low
as possible. In addition, the mass of the membrane material or the
mesh material may be kept as low as possible. For example, as the
mass of the membrane material or the mesh material decreases, the
relative level of acoustic energy to vibration energy may increase.
In an example where the membrane support material is not rigidly
coupled to the microphone, increasing the membrane material may
cause a drop in acoustic sensitivity. In addition, the motion
between the housing, the membrane material or the mesh material,
and the microphone may decrease as the mass of the membrane
material and the mesh material decreases.
[0078] A port through the image capture device housing to an
external environment may be short in a thickness direction with a
large diameter. In an example where the mounting between the
housing and the mesh material or the membrane material is not
stiff, a port that is short in a thickness direction with a large
diameter may allow pressure fluctuations from any relative motion
between the image capture device housing and the membrane material
or the mesh material to be relieved by the port. In this example,
the vibrations sensitivity at low to mid frequencies may be
reduced.
[0079] If an open, air permeable mesh is present, the acoustic
resistance may be kept as low as possible. For example, as the
acoustic resistance increases, acoustic sensitivity is reduced to
an asymptote defined by where the vibration of the mesh material
becomes dominant over the path through the acoustic resistor. In
addition, as the acoustic resistance increases, vibration
sensitivity is increased to an asymptote defined by where vibration
of the mesh is dominant, for example when it is easier to move the
mesh than interchange air between the image capture device housing
and mesh and the volume between the mesh and the microphone.
[0080] If an open, air permeable mesh is present, increasing the
mesh stiffness may decrease vibration sensitivity. Acoustic
sensitivity may not be affected by varying the mesh or dampener
stiffness.
[0081] Where certain elements of these implementations may be
partially or fully implemented using known components, only those
portions of such known components that are necessary for an
understanding of this disclosure have been described. Detailed
descriptions of other portions of such known components have been
omitted so as not to obscure the disclosure.
[0082] An implementation showing a singular component in this
disclosure should not be considered limiting; rather, this
disclosure is intended to encompass other implementations including
a plurality of the same component, and vice-versa, unless
explicitly stated otherwise herein. Further, this disclosure
encompasses present and future known equivalents to the components
referred to herein by way of illustration.
[0083] As used herein, the terms "image capture device," "imaging
device," and "camera" may be used to refer to any imaging device or
sensor configured to capture, record, and/or convey still and/or
video imagery which may be sensitive to visible parts of the
electromagnetic spectrum, invisible parts of the electromagnetic
spectrum (e.g., infrared, ultraviolet), and/or other energy (e.g.,
pressure waves).
[0084] While certain aspects of the implementations described
herein are in terms of a specific sequence of steps of a method,
these descriptions are only illustrative of the broader methods of
the disclosure and may be modified as required by the particular
applications thereof. Certain steps may be rendered unnecessary or
optional under certain circumstances. Additionally, certain steps
or functionality may be added to the disclosed implementations, or
the order of performance of two or more steps permuted. All such
variations are considered to be encompassed within the
disclosure.
[0085] While the above detailed description has shown, described,
and pointed out novel features of the disclosure as applied to
various implementations, it will be understood that various
omissions, substitutions, and changes in the form and details of
the devices or processes illustrated may be made by those skilled
in the art without departing from the disclosure. The foregoing
description is in no way meant to be limiting, but rather should be
taken as illustrative of the general principles of the
technologies.
* * * * *