U.S. patent application number 17/504763 was filed with the patent office on 2022-09-22 for display panel, method for manufacturing same, and displaying device.
This patent application is currently assigned to BOE Technology Group Co., Ltd.. The applicant listed for this patent is BOE Technology Group Co., Ltd.. Invention is credited to Che An, Wenqi Liu, Jingkai Ni, Zhongyuan Sun, Jinxiang Xue.
Application Number | 20220302413 17/504763 |
Document ID | / |
Family ID | 1000005946402 |
Filed Date | 2022-09-22 |
United States Patent
Application |
20220302413 |
Kind Code |
A1 |
Ni; Jingkai ; et
al. |
September 22, 2022 |
DISPLAY PANEL, METHOD FOR MANUFACTURING SAME, AND DISPLAYING
DEVICE
Abstract
The disclosure provides a display panel, a method for
manufacturing same, and a displaying device. The display panel is
provided with a plurality of display units arranged at intervals
and tensile units connecting every two adjacent display units, and
the display panel further comprises a substrate; light-emitting
elements arranged on one side of the substrate and positioned in
the display units; and package structures at least arranged on the
surfaces, away from the substrate, of the light-emitting elements
and comprising at least one inorganic insulating layer, wherein
orthographic projections of at least part of the tensile units on
the substrate do not overlap with orthographic projections of the
inorganic insulating layers on the substrate.
Inventors: |
Ni; Jingkai; (Beijing,
CN) ; Sun; Zhongyuan; (Beijing, CN) ; Xue;
Jinxiang; (Beijing, CN) ; Liu; Wenqi;
(Beijing, CN) ; An; Che; (Beijing, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
BOE Technology Group Co., Ltd. |
Beijing |
|
CN |
|
|
Assignee: |
BOE Technology Group Co.,
Ltd.
Beijing
CN
|
Family ID: |
1000005946402 |
Appl. No.: |
17/504763 |
Filed: |
October 19, 2021 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 51/5253 20130101;
H01L 51/56 20130101; H01L 51/0005 20130101; H01L 27/3276
20130101 |
International
Class: |
H01L 51/52 20060101
H01L051/52; H01L 27/32 20060101 H01L027/32; H01L 51/56 20060101
H01L051/56; H01L 51/00 20060101 H01L051/00 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 18, 2021 |
CN |
202110292685.1 |
Claims
1. A display panel, wherein, the display panel is provided with a
plurality of display units arranged at intervals and tensile units
connecting every two adjacent display units, and the display panel
further comprises: a substrate; light-emitting elements arranged on
one side of the substrate and positioned in the display units; and
a package structure at least arranged on surfaces of the
light-emitting elements away from the substrate, and comprises at
least one inorganic insulating layer, wherein orthographic
projections of at least part of the tensile units on the substrate
do not overlap with an orthographic projection of the inorganic
insulating layer on the substrate.
2. The display panel according to claim 1, wherein no overlapping
area exists between the orthographic projections of the tensile
units on the substrate and the orthographic projection of the
inorganic insulating layer on the substrate.
3. The display panel according to claim 1, wherein the tensile unit
comprises: an organic film layer arranged on a surface of the
substrate and located on a same side of the substrate as the
light-emitting elements; and a tensile wiring layer arranged on a
surface of the organic film layer away from the substrate, and
electrically connected with the light-emitting elements in the two
corresponding adjacent display units.
4. The display panel according to claim 3, wherein the tensile unit
further comprises: a passivation layer arranged on a surface of the
tensile wiring layer away from the organic film layer.
5. The display panel according to claim 4, wherein the passivation
layer is made from at least one of vinyl triethoxysilane, vinyl
triacetoxysilane and chloromethyl triethoxysilane.
6. The display panel according to claim 1, wherein the display
panel further comprises: a retaining wall arranged around a
peripheral edge of at least one said display unit and in contact
with the package structure, wherein an orthographic projection of
the display unit on the substrate covers an orthographic projection
of the retaining wall on the substrate.
7. The display panel according to claim 1, wherein the package
structure comprises two inorganic insulating layers and an organic
insulating layer positioned between the two inorganic insulating
layers.
8. A method for manufacturing the display panel according to claim
1, wherein the method comprises: forming light-emitting elements on
one side of the substrate; and forming a package structure on
surfaces of the light-emitting elements away from the substrate, to
obtain the display panel.
9. The method according to claim 8, wherein the step of forming the
package structures on surfaces of the light-emitting elements away
from the substrate comprises: forming a prefabricated film layer on
surfaces of the display units and surfaces of the tensile units of
the display panel; and patterning the prefabricated film layer by a
patterning process, to form the inorganic insulating layer.
10. The method according to claim 8, wherein before forming the
package structure on surfaces of the light-emitting elements away
from the substrate, the method further comprises: forming an
organic film layer on a surface of the substrate on a same side as
the light-emitting elements; forming a tensile wiring layer on a
surface of the organic film layer away from the substrate; and
forming a passivation layer on a surface of the tensile wiring
layer away from the organic film layer.
11. The method according to claim 10, wherein a process for forming
the passivation layer comprises at least one of a coating process,
a spraying process or an ink-jet printing process.
12. The method according to claim 8, wherein before forming the
package structure on surfaces of the light-emitting elements away
from the substrate, the method further comprises: forming a
retaining wall around a peripheral edge of at least one of the
display units, wherein the package structure is in contact with the
retaining wall.
13. A displaying device, wherein the displaying device comprises
the display panel according to claim 1.
14. The displaying device according to claim 13, wherein no
overlapping area exists between the orthographic projections of the
tensile units on the substrate and the orthographic projection of
the inorganic insulating layer on the substrate.
15. The displaying device according to claim 13, wherein the
tensile unit comprises: an organic film layer arranged on a surface
of the substrate and located on a same side of the substrate as the
light-emitting elements; and a tensile wiring layer arranged on a
surface of the organic film layer away from the substrate, and
electrically connected with the light-emitting elements in the two
corresponding adjacent display units.
16. The displaying device according to claim 15, wherein the
tensile unit further comprises: a passivation layer arranged on a
surface of the tensile wiring layer away from the organic film
layer.
17. The displaying device according to claim 16, wherein the
passivation layer is made from at least one of vinyl
triethoxysilane, vinyl triacetoxysilane and chloromethyl
triethoxysilane.
18. The displaying device according to claim 13, wherein the
display panel further comprises: a retaining wall arranged around a
peripheral edge of at least one said display unit and in contact
with the package structure, wherein an orthographic projection of
the display unit on the substrate covers an orthographic projection
of the retaining wall on the substrate.
19. The displaying device according to claim 13, wherein the
package structure comprises two inorganic insulating layers and an
organic insulating layer positioned between the two inorganic
insulating layers.
Description
[0001] The application claims priority to Chinese Patent
Application No. 202110292685.1, titled "DISPLAY PANEL, METHOD FOR
MANUFACTURING SAME, AND DISPLAYING DEVICE" and filed to the State
Patent Intellectual Property Office on Mar. 18, 2021, the contents
of which are incorporated herein by reference in its entirety.
TECHNICAL FIELD
[0002] The disclosure relates to the technical field of display, in
particular to a display panel, a method for manufacturing same, and
a displaying device.
BACKGROUND
[0003] Flexible displaying devices have bendable and foldable
forms. With the personalized display requirements such as skin
display, irregular display and arbitrary shape display, a tensile
displaying device is likely to become the mainstream of the next
generation display technology.
SUMMARY
[0004] The disclosure provides a display panel, a method for
manufacturing same, and a displaying device.
[0005] In one aspect of the disclosure, a display panel is
provided. According to an embodiment of the disclosure, the display
panel is provided with a plurality of display units arranged at
intervals and tensile units connecting every two adjacent display
units, and the display panel further comprises a substrate;
light-emitting elements arranged on one side of the substrate and
positioned in the display units; and a package structure at least
arranged on surfaces, away from the substrate, of the
light-emitting elements and comprising at least one inorganic
insulating layer, wherein orthographic projections of at least part
of the tensile units on the substrate do not overlap with an
orthographic projection of the inorganic insulating layers on the
substrate.
[0006] According to an embodiment of the disclosure, no overlapping
area exists between the orthographic projections of the tensile
units on the substrate and the orthographic projection of the
inorganic insulating layer on the substrate.
[0007] According to an embodiment of the disclosure, the tensile
unit comprises: an organic film layer, the organic film layer is
arranged on a surface of the substrate and located on a same side
of the substrate as the light-emitting elements; and a tensile
wiring layer, the tensile wiring layer is arranged on a surface of
the organic film layer away from the substrate, and electrically
connected with the light-emitting elements in the two corresponding
adjacent display units.
[0008] According to an embodiment of the disclosure, the tensile
unit further comprises: a passivation layer, the passivation layer
is arranged on a surface of the tensile wiring layer away from the
organic film layer.
[0009] According to an embodiment of the disclosure, the
passivation layer is made from at least one of vinyl
triethoxysilane, vinyl triacetoxysilane and chloromethyl
triethoxysilane.
[0010] According to an embodiment of the disclosure, the display
panel further comprises: a retaining wall, the retaining wall is
arranged around a peripheral edge of at least one said display unit
and in contact with the package structure, wherein an orthographic
projection of the display unit on the substrate covers an
orthographic projection of the retaining wall on the substrate.
[0011] According to an embodiment of the disclosure, the package
structure comprises two inorganic insulating layers and an organic
insulating layer positioned between the two inorganic insulating
layers.
[0012] In another aspect of the disclosure, a method for
manufacturing the display panel is provided. According to an
embodiment of the disclosure, the method comprises: forming
light-emitting elements on one side of a substrate; and forming
package structures on surfaces, away from the substrate, of the
light-emitting elements so as to obtain the display panel.
[0013] According to an embodiment of the disclosure, the step of
forming the package structures on surfaces of the light-emitting
elements away from the substrate comprises: forming a prefabricated
film layer on surfaces of the display units and surfaces of the
tensile units of the display panel; and patterning the
prefabricated film layer by a patterning process, to form the
inorganic insulating layer.
[0014] According to an embodiment of the disclosure, before forming
the package structure on surfaces of the light-emitting elements
away from the substrate, the method further comprises: forming an
organic film layer on a surface of the substrate on a same side as
the light-emitting elements; forming a tensile wiring layer on a
surface of the organic film layer away from the substrate; and
forming a passivation layer on a surface of the tensile wiring
layer away from the organic film layer.
[0015] According to an embodiment of the disclosure, a process for
forming the passivation layer comprises at least one of a coating
process, a spraying process or an ink-jet printing process.
[0016] According to an embodiment of the disclosure, wherein before
forming the package structure on surfaces of the light-emitting
elements away from the substrate, the method further comprises:
forming a retaining wall around a peripheral edge of at least one
of the display units, wherein the package structure is in contact
with the retaining wall.
[0017] In yet another aspect of the disclosure, a displaying device
is provided. According to an embodiment of the disclosure, the
displaying device comprises the display panel.
[0018] The above description is merely a summary of the technical
solutions of the present disclosure. In order to more clearly know
the elements of the present disclosure to enable the implementation
according to the contents of the description, and in order to make
the above and other purposes, features and advantages of the
present disclosure more apparent and understandable, the particular
embodiments of the present application are provided below.
BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions
of the embodiments of the present disclosure or the related art,
the figures that are required to describe the embodiments or the
related art will be briefly introduced below. Apparently, the
figures that are described below are merely embodiments of the
present disclosure, and a person skilled in the art can obtain
other figures according to these figures without paying creative
work.
[0020] FIG. 1 shows a plan view of a display panel according to an
embodiment of the disclosure.
[0021] FIG. 2 shows a sectional view of the display panel along
line AA in the embodiment of FIG. 1.
[0022] FIG. 3 shows another sectional view of the display panel
along line AA in the embodiment of FIG. 1.
[0023] FIG. 4 shows another sectional view of the display panel
along line AA in the embodiment of FIG. 1.
[0024] FIG. 5 shows another sectional view of the display panel
along line AA in the embodiment of FIG. 1.
[0025] FIG. 6 shows another sectional view of the display panel
along line AA in the embodiment of FIG. 1.
[0026] FIG. 7 shows another sectional view of the display panel
along line AA in the embodiment of FIG. 1.
[0027] FIG. 8 shows a flowchart of a method for manufacturing a
display panel according to an embodiment of the disclosure.
[0028] FIG. 9a and FIG. 9b show a flowchart of a method for
manufacturing a display panel according to another embodiment of
the disclosure.
[0029] FIG. 10 shows a flowchart of forming a package structure
according to an embodiment of the disclosure.
[0030] FIG. 11 shows a structural diagram of a prefabricated film
layer during the formation of a package structure according to
another embodiment of the disclosure.
[0031] FIG. 12 shows a flowchart of a method for manufacturing a
display panel according to another embodiment of the
disclosure.
[0032] FIG. 13 shows a flowchart of a method for manufacturing a
display panel according to another embodiment of the
disclosure.
DETAILED DESCRIPTION
[0033] Embodiments of the disclosure are described in detail below.
The embodiments described below are exemplary ones merely used to
explain the disclosure, and should not be construed as limiting the
disclosure. If specific technologies or conditions are not
indicated in the embodiments, they shall be performed according to
the technologies or conditions described in the literature in this
field or according to the product specifications.
[0034] This disclosure is based on the following findings of the
inventors:
[0035] After in-depth investigation of the structures of displaying
devices in related arts and a large number of experimental
verifications, the inventors found that when the displaying device
is tensile, its packaging effect will deteriorate because the
displaying device has display units and tensile units, and when the
displaying device realizes tensile deformation, the main
deformation area of the whole displaying device is in the tensile
units. However, package structures are generally formed on the
whole displaying device, and inorganic insulation layers in the
package structures are brittle because they are made of inorganic
materials, so the inorganic insulation layers in the package
structures in the tensile units are prone to fracture after tensile
deformation of the displaying device. When the inorganic insulation
layers break, cracks will continue to extend into the display units
along with the stretching of the inorganic insulation layers, and
these cracks will become intrusion channels of water vapor and
oxygen, thus causing black spots and other defects during display,
making the display effect poor.
[0036] On this basis, in one aspect of the disclosure, a display
panel is provided. According to an embodiment of the disclosure,
referring to FIGS. 1 and 2, the display panel has a plurality of
display units 1 arranged at intervals and tensile units 2
connecting every two adjacent display units 1. The display panel
comprises a substrate 100; light-emitting elements 200 disposed on
one side of the substrate 100 and located in the display units 1;
and package structures at least arranged on surfaces, away from the
substrate 100, of the light-emitting elements 200 and comprising at
least one inorganic insulating layer 300, wherein orthographic
projections of at least part of the tensile units 2 on the
substrate 100 do not overlap with orthographic projections of the
inorganic insulating layers 300 on the substrate 100. The display
panel has the tensile units 2 capable of realizing tensile
deformation. In addition, in the display panel, at least part of
the tensile units 2 do not have the inorganic insulating layers 300
in the package structures, so that the package structures rarely
crack during tensile deformation of the display panel, and the
extension of cracks of the inorganic insulating layers 300 towards
the display units 1 caused by the stretching action is avoided,
thus making the package structures have good packaging reliability
and further ensuring the display effect of the display panel after
tensile deformation.
[0037] According to the embodiments of the disclosure, it should be
noted that, with reference to FIG. 1, the numbers of the display
units 1 and the tensile units 2 in the display panel of the
disclosure are not particularly limited, and the figure only shows
the situation that four tensile units 2 are arranged around one
display unit 1. Those skilled in the art can understand that when
the display panel is in other shapes, tensile units of other
numbers may be arranged around one display unit, such as three,
five, etc., which will not be specified here. In addition, in the
display panel of the disclosure, those skilled in the art can
understand that other parts except the display units 1 and the
tensile units 2 may be hollowed out, so as to realize tensile
deformation better.
[0038] According to the embodiments of the disclosure, the material
and thickness of the substrate 100 are not particularly limited,
and may be the material and thickness of substrates in related
arts, which will not be specified here.
[0039] According to the embodiments of the disclosure, in order to
better realize the effect that the package structures rarely crack
during tensile deformation of the display panel, and the extension
of cracks of the inorganic insulating layers 300 towards the
display units 1 caused by the stretching action is avoided, further
referring to FIG. 3, no overlapping area exists between the
orthographic projections of the tensile units 2 on the substrate
100 and the orthographic projections of the inorganic insulating
layers 300 on the substrate 100. In this display panel, no
inorganic insulating layer 300 is disposed in the package structure
in the whole tensile unit 2, so the package structures are less
prone to cracking during tensile deformation, and the cracks of the
inorganic insulating layers 300 caused by the stretching action are
further prevented from extending towards the display units 1, thus
further improving the packaging reliability of the package
structures and further ensuring the display effect of the display
panel after tensile deformation.
[0040] According to the embodiments of the disclosure, further
referring to FIG. 4, the tensile unit 2 may further comprise an
organic film layer 400 disposed on a surface of the substrate 100
and located on the same size of the substrate 100 as the
light-emitting elements 200; and a tensile wiring layer 500
arranged on a surface, away from the substrate 100, of the organic
film layer 400, and electrically connected with the light-emitting
elements in two corresponding adjacent display units (not shown in
the figure, but those skilled in the art can understand that the
tensile wiring layer can be electrically connected with the
light-emitting elements in two corresponding adjacent display units
directly or via a through hole, which will not be specified here).
Therefore, through the arrangement of the organic film layers, on
the one hand, a flattening function is realized, so that a forming
plane of the tensile wiring layers and a forming plane of the
display units are as small as possible, thereby reducing the
fracture of the tensile wiring layers caused by excessive
difference of deposition sections; on the other hand, because the
organic film layers are soft, the resistance of the display panel
during stretching may be reduced, so that deformation is easier,
and tensile deformation may be achieved more easily without
cracking.
[0041] According to the embodiments of the disclosure, further, in
order to better realize the effect that the orthographic
projections of at least part of the tensile units 2 on the
substrate 100 do not overlap with the orthographic projections of
the inorganic insulating layers 300 on the substrate 100,
specifically, referring to FIG. 5, a passivation layer 600 may be
further disposed on the tensile unit 2 and is disposed on a
surface, away from the organic film layer 400, of the tensile
wiring layer 500. Therefore, by arranging the passivation layer
600, the surface, away from the organic film layer 400, of the
tensile wiring layer 500 is passivated, and then it may be used as
a mask when the package structure is formed, so that the
orthographic projection of the tensile unit 2 on the substrate 100
does not overlap with the orthographic projection of the inorganic
insulating layer 300 on the substrate 100 directly, and the process
of manufacturing the package structure is simpler and easier to
realize.
[0042] In some more specific embodiments of the disclosure, the
passivation layer 600 may be made from vinyl triethoxysilane, vinyl
triacetoxysilane or chloromethyl triethoxysilane, etc. Therefore,
when the package structure is formed, a surface of the package
structure to be deposited usually has hydroxyl groups, and these
hydroxyl groups may be used as reactive sites for the subsequent
formation of the package structure (such as alumina). After the
passivation layer 600 described above is formed, for example, the
vinyl triethoxysilane, vinyl triacetoxysilane or chloromethyl
triethoxysilane will replace the hydroxyl groups on the surface of
the package structure to be deposited with inert alkyl groups or
silane groups, etc. At this point, when the package structure is
deposited, the package structure may still be formed at a position,
without the passivation layer, on the surface of the package
structure to be deposited, but the package structure may not be
formed at a position with the passivation layer, so that the
orthographic projection of the tensile unit 2 on the substrate 100
does not overlap with the orthographic projection of the inorganic
insulating layer 300 on the substrate 100, and the above materials
are widely available and have low cost.
[0043] In other embodiments of the disclosure, referring to FIG. 6,
the display panel may further comprise a retaining wall 700
arranged around a peripheral edge of at least one display unit 1,
the retaining wall 700 is in contact with the package structures,
and the orthographic projection of the display unit 1 on the
substrate 100 covers an orthographic projection of the retaining
wall 700 on the substrate 100. Therefore, the display panel may
further prevent water and oxygen invasion, and the packaging
reliability is further improved.
[0044] According to the embodiments of the disclosure, in addition,
in the display panel described in the disclosure, those skilled in
the art can understand that other conventional structures or
components in conventional display panels may be included too,
whose structures, materials and functions are the same as those of
the same components in conventional display panels (for example,
the material of the tensile wiring layer may be Ti/Al/Ti, Mo, Al/Nb
and other metals; or it can be a functional conductive material,
such as silver nanowires or conductive rubber, etc.). The specific
structures, materials and functions of the aforementioned
structures and components are also the same as those of the same
components in the display panels of related arts, and thus will not
be described in detail here.
[0045] In a specific embodiment of the disclosure, referring to
FIG. 7, the display panel may also comprise structures of
conventional display panels in related arts, such as a light
shielding layer (not shown in the figure), a thin film transistor
comprising a grid 910, a source 920, a drain 930 and an active
layer 900, a grid insulating layer 800, an interlayer insulating
layer 810, a planarization layer 820, etc. The light-emitting
element may comprise an anode 210, a luminescent layer 220, a
cathode 230, etc. A pixel defining layer (not shown in the figure),
an organic insulating layer 310 and a second inorganic insulating
layer 320 in the package structure, etc. may also be included, and
their specific structures, and the connection modes and functions
of various components may be the same as those in related arts, and
thus not be described in detail here.
[0046] Specifically, when the package structure described above has
two inorganic insulating layers 300 and 320 and an organic
insulating layer 310 between the two inorganic insulating layers
300 and 320, the packaging effect is further improved, and the
packaging reliability may be more effectively ensured. More
specifically, the inorganic insulating layers 300 and 320 may be
made from SiNx, SiON, SiCN, SiOx, A.sub.l2O.sub.3, MgO, ZnO, etc.
Of course, it can be understood that the package structure may only
comprise the two inorganic insulating layers 300 and 320 described
above, and not comprise the organic insulating layer, and the
materials of the inorganic insulating layers 300 and 320 may be the
same as those described above, which may shorten the manufacturing
cycle and facilitate industrial production; meanwhile, the problem
that accurate control of a coverage area is hard to achieve due to
the preparation of the organic insulating layer can be avoided.
[0047] In another aspect of the disclosure, a method for
manufacturing the display panel is provided. According to the
embodiments of the disclosure, referring to FIGS. 8, 9a and 9b, the
method may specifically comprise the following steps:
[0048] S100, forming light-emitting elements 200 on one side of a
substrate 100 (see FIG. 9a for structural diagram).
[0049] According to the embodiments of the disclosure, the process
of forming the light-emitting elements 200 on one side of the
substrate 100 may include vacuum evaporation, chemical vapor
deposition, spin coating, ink-jet printing, and the like. The
process parameters of vacuum evaporation, chemical vapor
deposition, spin coating, and ink-jet printing are those of
conventional vacuum evaporation, chemical vapor deposition, spin
coating, and ink-jet printing, which will not be specified here.
The manufacturing process is simple, convenient, easy to realize
and capable of facilitating industrial production.
[0050] S200, forming package structures 300 on surfaces, away from
the substrate 100, of the light-emitting elements 200 so as to
obtain the display panel (see FIG. 9b for structural diagram).
[0051] According to the embodiments of the disclosure, the process
of forming the package structures 300 on the surfaces, away from
the substrate 100, of the light-emitting elements 200 may include
vacuum evaporation, chemical vapor deposition, spin coating,
ink-jet printing, and the like. The process parameters of vacuum
evaporation, chemical vapor deposition, spin coating, and ink-jet
printing are those of conventional vacuum evaporation, chemical
vapor deposition, spin coating, and ink-jet printing, which will
not be specified here. The manufacturing process is simple,
convenient, easy to realize and capable of facilitating industrial
production.
[0052] Specifically, in some embodiments of the disclosure,
referring to FIGS. 10 and 11, forming the package structures on
surfaces, away from the substrate, of the light-emitting elements
may further comprise:
[0053] S210, forming prefabricated film layers 299 on surfaces of
the display units and surfaces of the tensile units of the display
panel (see FIG. 11 for structural diagram).
[0054] According to the embodiments of the disclosure, the process
of forming the prefabricated film layers 299 on the surfaces of the
display units and the surfaces of the tensile units of the display
panel may include vacuum evaporation, chemical vapor deposition,
spin coating, ink-jet printing, and the like. The process
parameters of vacuum evaporation, chemical vapor deposition, spin
coating, and ink-jet printing are those of conventional vacuum
evaporation, chemical vapor deposition, spin coating, and ink-jet
printing, which will not be specified here. The manufacturing
process is simple, convenient, easy to realize and capable of
facilitating industrial production.
[0055] S220, patterning the prefabricated film layers by a
patterning process to form inorganic insulating layers 300 (see
FIG. 9b for structural diagram).
[0056] According to the embodiments of the disclosure, the
patterning process may include: coating a surface of the
prefabricated film layer with a photoresist, exposing, developing,
etching, stripping the photoresist, etc., so as to form the
inorganic insulating layer 300. The specific process parameters of
each step in the patterning process are the process parameters of a
conventional patterning process, which will not be specified here.
The manufacturing process is simple, convenient, easy to realize
and capable of facilitating industrial production.
[0057] Specifically, in other embodiments of the disclosure,
referring to FIG. 12, before forming the package structures on the
surfaces, away from the substrate, of the light-emitting elements,
the method may further comprise:
[0058] S300, forming an organic film layer on a surface of the
substrate on the same side as the light-emitting elements.
[0059] According to the embodiments of the disclosure, the process
of forming the organic film layer on the surface of the substrate
on the same side as the light-emitting elements may include vacuum
evaporation, chemical vapor deposition, spin coating, ink-jet
printing, and the like. The process parameters of vacuum
evaporation, chemical vapor deposition, spin coating, and ink-jet
printing are those of conventional vacuum evaporation, chemical
vapor deposition, spin coating, and ink-jet printing, which will
not be specified here. The manufacturing process is simple,
convenient, easy to realize and capable of facilitating industrial
production.
[0060] S400, forming a tensile wiring layer on a surface, away from
the substrate, of the organic film layer.
[0061] According to the embodiments of the disclosure, the process
of forming the tensile wiring layer on the surface, away from the
substrate, of the organic film layer may include vacuum sputtering
deposition, screen printing, chemical vapor deposition, ink-jet
printing, and the like. The process parameters of vacuum sputtering
deposition, screen printing, chemical vapor deposition, and ink-jet
printing are those of conventional vacuum sputtering deposition,
screen printing, chemical vapor deposition, and ink-jet printing.
The manufacturing process is simple, convenient, easy to realize
and capable of facilitating industrial production.
[0062] S500, forming a passivation layer on a surface, away from
the organic film layer, of the tensile wiring layer.
[0063] According to the embodiments of the disclosure, the process
of forming the passivation layer on the surface, away from the
organic film layer, of the tensile wiring layer may include
coating, spraying, ink-jet printing, and the like. The process
parameters of coating, spraying, and ink-jet printing are those of
conventional coating, spraying, and ink-jet printing, wherein
spraying or ink-jet printing may be performed through
fixed-printing head printing, high-precision printing and other
methods, which will not be specified here. The manufacturing
process is simple, convenient, easy to realize and capable of
facilitating industrial production, and the passivation layer may
be better formed.
[0064] In some other embodiments of the disclosure, referring to
FIG. 13, before forming the package structures on the surfaces,
away from the substrate, of the light-emitting elements, the method
may further comprise:
[0065] S600, forming a retaining wall around a peripheral edge of
at least one of the display units, wherein the package structures
are in contact with the retaining wall.
[0066] According to embodiments of the disclosure, the process of
forming the retaining wall around the peripheral edge of at least
one of the display units may include spin coating, slit coating,
ink-jet printing, screen printing, chemical vapor deposition,
exposure etching, and the like. The process parameters of spin
coating, slit coating, ink-jet printing, screen printing, chemical
vapor deposition, and exposure etching are those of conventional
spin coating, slit coating, ink-jet printing, screen printing,
chemical vapor deposition, and exposure etching, which will not be
specified here. The manufacturing process is simple, convenient,
easy to realize and capable of facilitating industrial
production.
[0067] In yet another aspect of the disclosure, a displaying device
is provided. According to the embodiments of the disclosure, the
displaying device comprises the display panel. The displaying
device can realize tensile deformation, and in the process of
tensile deformation, the package structures rarely crack, so the
packaging reliability is good. Meanwhile, the displaying device has
all the features and advantages of the display panel, which will
not be repeated here.
[0068] According to the embodiments of the disclosure, the
displaying device comprises other necessary structures and
components in addition to the aforementioned display panel, which
can be supplemented and designed by those skilled in the art
according to the specific types of the displaying device and use
requirements, and will not be described in detail here.
[0069] According to the embodiments of the disclosure, the specific
types of the displaying device are not particularly limited, for
example, including but not limited to mobile phones, tablet
personal computers, wearable devices, game machines, televisions,
and vehicle-mounted displays.
[0070] In this specification, descriptions referring to the terms
"one embodiment", "some embodiments", "example", "specific
example", or "some examples" mean that specific features,
structures, materials or characteristics described in connection
with this embodiment or example are included in at least one
embodiment or example of this disclosure. In this specification,
the schematic expressions of these terms do not necessarily refer
to the same embodiments or examples. Furthermore, the specific
features, structures, materials or characteristics described may be
combined in any one or more embodiments or examples in a suitable
manner. In addition, those skilled in the art may combine different
embodiments or examples and features of different embodiments or
examples described in this specification without contradicting each
other.
[0071] Although the embodiments of the disclosure have been shown
and described above, it can be understood that the above-mentioned
embodiments are exemplary and cannot be understood as limiting the
disclosure, and those of ordinary skill in the art can make
changes, modifications, substitutions and variations to the
above-mentioned embodiments within the scope of the disclosure.
* * * * *