U.S. patent application number 17/838201 was filed with the patent office on 2022-09-22 for mopping mechanism and cleaning device.
The applicant listed for this patent is Qfeeltech (Beijing) Co., Ltd.. Invention is credited to Zhen CHEN, Xingguo XING, Yiming ZHANG.
Application Number | 20220296068 17/838201 |
Document ID | / |
Family ID | 1000006445554 |
Filed Date | 2022-09-22 |
United States Patent
Application |
20220296068 |
Kind Code |
A1 |
XING; Xingguo ; et
al. |
September 22, 2022 |
MOPPING MECHANISM AND CLEANING DEVICE
Abstract
A mopping mechanism is provided. The mopping mechanism includes
at least one mopping plate movably mountable to a bottom surface of
a cleaning device. The mopping mechanism also includes a magnetic
element assembly including a primary magnetic element and a
secondary magnetic element, and configured to generate a variable
magnetic field to drive the at least one mopping plate to move
reciprocatively relative to the bottom surface.
Inventors: |
XING; Xingguo; (Beijing,
CN) ; ZHANG; Yiming; (Beijing, CN) ; CHEN;
Zhen; (Beijing, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Qfeeltech (Beijing) Co., Ltd. |
Beijing |
|
CN |
|
|
Family ID: |
1000006445554 |
Appl. No.: |
17/838201 |
Filed: |
June 11, 2022 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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PCT/CN2020/138427 |
Dec 22, 2020 |
|
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17838201 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
A47L 2201/04 20130101;
A47L 11/284 20130101; A47L 9/0411 20130101; A47L 11/4036 20130101;
A47L 9/2847 20130101; A47L 2201/06 20130101; A47L 9/0488 20130101;
A47L 9/0483 20130101; A47L 11/4069 20130101; A47L 11/4011
20130101 |
International
Class: |
A47L 11/284 20060101
A47L011/284; A47L 9/04 20060101 A47L009/04; A47L 9/28 20060101
A47L009/28; A47L 11/40 20060101 A47L011/40 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 30, 2019 |
CN |
201911397460.1 |
Claims
1. A mopping mechanism, comprising: at least one mopping plate
movably mountable to a bottom surface of a cleaning device; and a
magnetic element assembly including a primary magnetic element and
a secondary magnetic element, and configured to generate a variable
magnetic field to drive the at least one mopping plate to move
reciprocatively relative to the bottom surface.
2. The mopping mechanism of claim 1, wherein the at least one
mopping plate includes a single mopping plate, one of the primary
magnetic element and the secondary magnetic element is disposed at
the bottom surface within an opening provided in the single mopping
plate, and the other one of the primary magnetic element and the
secondary magnetic element is disposed at the single mopping plate
adjacent the opening.
3. The mopping mechanism of claim 1, wherein the at least one
mopping plate includes a first mopping plate and a second mopping
plate, the primary magnetic element is disposed at the first
mopping plate, and the secondary magnetic element is disposed at
the second mopping plate facing the primary magnetic element.
4. The mopping mechanism of claim 1, wherein the at least one
mopping plate includes a first mopping plate and a second mopping
plate, the primary magnetic element is disposed at the bottom
surface between the first mopping plate and the second mopping
plate, and the secondary magnetic element includes a first
secondary magnetic element disposed at the first mopping plate
facing the primary magnetic element, and a second secondary
magnetic element disposed at the second mopping plate facing the
primary magnetic element.
5. The mopping mechanism of claim 1, wherein at least one of the
primary magnetic element or the secondary magnetic element is an
electromagnetic element or a permanent magnetic element.
6. The mopping mechanism of claim 1, further comprising: a
controller configured to control the magnetic element assembly to
generate the varying magnetic field.
7. The mopping mechanism of claim 6, further comprising: an
electric motor configured to rotate at least one of the primary
magnetic element or the secondary magnetic element, wherein the
controller is configured to control the electric motor to rotate at
least one of the primary magnetic element or the secondary magnetic
element to change the magnetic field.
8. The mopping mechanism of claim 1, wherein the at least one
mopping plate includes a first mopping plate and a second mopping
plate, and the mopping mechanism further includes a restoration
component disposed between the first mopping plate and the second
mopping plate, and configured to provide a restoration force on the
first mopping plate and the second mopping plate.
9. The mopping mechanism of claim 1, wherein the at least one
mopping plate includes a first mopping plate and a second mopping
plate, the primary magnetic element is an electromagnetic element
disposed at the first mopping plate, and the secondary magnetic
element is a linkage-shaped magnetic element including a first end
disposed at the second mopping plate and a second end coupled with
the primary magnetic element.
10. The mopping mechanism of claim 9, further comprising a
restoration component disposed between the first mopping plate and
the second mopping plate, or disposed on the linkage-shaped
magnetic element.
11. The mopping mechanism of claim 1, wherein the primary magnetic
element and the secondary magnetic element are electromagnetic
elements, and the mopping mechanism further includes a restoration
component disposed between the first mopping plate and the second
mopping plate.
12. The mopping mechanism of claim 1, further comprising a position
limiting element coupled with the primary magnetic element and the
secondary magnetic element, and configured to maintain a minimum
distance between the primary magnetic element and the secondary
magnetic element.
13. The mopping mechanism of claim 1, wherein the at least one
mopping plate further includes a first mopping plate and a second
mopping plate, and the mopping mechanism further includes: a
restoration component disposed between the first mopping plate and
the second mopping plate; and a position limiting element coupled
with the primary magnetic element and the secondary magnetic
element and configured to maintain a minimum distance between the
primary magnetic element and the secondary magnetic element.
14. The mopping mechanism of claim 1, wherein the at least one
mopping plate includes a first mopping plate and a second mopping
plate, the secondary magnetic element includes a first secondary
magnetic element disposed at the first mopping plate and a second
secondary magnetic element disposed at the second mopping plate,
and the mopping mechanism further includes a controller configured
to change magnetic poles of the primary magnetic element facing the
first secondary magnetic element and the second secondary magnetic
element to provide the varying magnetic field to drive the first
mopping plate and the second mopping plate to move in an opposite
direction or in a same direction.
15. A mobile device, comprising: at least one driving device
configured to move the mobile device; a bottom surface; and a
mopping mechanism disposed at the bottom surface, the mopping
mechanism including: at least one mopping plate movably mounted to
the bottom surface; and a magnetic element assembly including a
primary magnetic element and a secondary magnetic element, and
configured to generate a variable magnetic field to drive the at
least one mopping plate to move reciprocatively relative to the
bottom surface.
16. The mobile device of claim 15, wherein the at least one mopping
plate includes a single mopping plate, one of the primary magnetic
element and the secondary magnetic element is disposed at the
bottom surface within an opening provided in the single mopping
plate, and the other one of the primary magnetic element and the
secondary magnetic element is disposed at the single mopping plate
adjacent the opening.
17. The mobile device of claim 15, wherein the at least one mopping
plate includes a first mopping plate and a second mopping plate,
the primary magnetic element is disposed at the first mopping
plate, and the secondary magnetic element is disposed at the second
mopping plate facing the primary magnetic element.
18. The mobile device of claim 15, wherein the at least one mopping
plate includes a first mopping plate and a second mopping plate,
and the mopping mechanism further includes a restoration component
disposed between the first mopping plate and the second mopping
plate, and configured to provide a restoration force on the first
mopping plate and the second mopping plate.
19. The mobile device of claim 15, wherein the primary magnetic
element and the secondary magnetic element are electromagnetic
elements, and the mopping mechanism further includes a restoration
component disposed between the first mopping plate and the second
mopping plate.
20. The mobile device of claim 15, further comprising a position
limiting element coupled with the primary magnetic element and the
secondary magnetic element, and configured to maintain a minimum
distance between the primary magnetic element and the secondary
magnetic element.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of International
Application No. PCT/CN2020/138427, filed on Dec. 22, 2020, which
claims priority to Chinese Patent Application No. 201911397460.1,
filed on Dec. 30, 2019. The entire contents of the above-referenced
applications are incorporated herein by reference.
TECHNICAL FIELD
[0002] The present disclosure relates to the technology field of
smart home appliances and, more particularly, to a mopping
mechanism and a cleaning device.
BACKGROUND
[0003] As the advance of technologies and the increase of living
standards, cleaning robots have been widely used in homes due to
functions such as automatic floor sweeping, vacuum cleaning,
etc.
[0004] The most common robots in currently available cleaning
robots are floor-sweeping robots. Floor-sweeping robots can only
perform floor sweeping, but do not have floor-mopping functions. To
accomplish the floor-mopping functions in a cleaning robot,
typically a mop is mounted to a bottom surface of the main body of
the floor-sweeping robot. The mop is static relative to the main
body of the floor-sweeping robot. The mop performs mopping of areas
of the floor it passes by as the cleaning robot moves.
[0005] However, because the mop is static relative to the chassis,
the mop cannot perform reciprocating mopping of the surface to be
cleaned. As a result, the cleaning efficiency is low, and the
cleaning effect is poor.
SUMMARY OF THE DISCLOSURE
[0006] The present disclosure provides a mopping mechanism and a
cleaning device (e.g., a cleaning robot), which can perform
reciprocating mopping of a surface to be cleaned, thereby
increasing the cleaning efficiency and cleaning effect.
[0007] To overcome disadvantages of the conventional technologies,
the present disclosure provides the following technical
solutions:
[0008] In one aspect, the present disclosure provides a mopping
mechanism. The mopping mechanism may be mounted to a bottom surface
of the cleaning device. The mopping mechanism may include at least
one mopping plate movably mountable to the bottom surface, and a
magnetic element assembly configured to provide at least a portion
of a driving force to drive the at least one mopping plate to move
reciprocatively relative to the bottom surface. In some
embodiments, the magnetic element assembly may include a primary
magnetic element and a secondary magnetic element. At least one of
the primary magnetic element or the secondary magnetic element may
be configured to provide a variable magnetic field. At least one of
a magnetic field intensity or a magnetic field direction may be
variable. In some embodiments, the secondary magnetic element may
be disposed at (e.g., fixed to) the at least one mopping plate, and
may move together with the at least one mopping plate. In some
embodiments, the primary magnetic element may be disposed at (e.g.,
fixed to) the at least one mopping plate, and may move together
with the at least one mopping plate. In some embodiments, the at
least one mopping plate may include a first mopping plate and a
second mopping plate. The primary magnetic element may be disposed
at (e.g., mounted on) the first mopping plate and the secondary
magnetic element may be disposed at (e.g., mounted on) the second
mopping plate. The at least one mopping plate may perform a
reciprocating movement relative to the bottom surface at least
partially due to the magnetic force between the primary magnetic
element and the secondary magnetic element.
[0009] In some embodiments, the bottom surface of the cleaning
device may be provided with a first mopping plate and a second
mopping plate disposed side by side. The second mopping plate may
face the first mopping plate. In some embodiments, at least one
(e.g., each) of the first mopping plate and the second mopping
plate may be movably mounted to the bottom surface, and may move,
e.g., at least partially due to the magnetic force, relative to the
bottom surface in a reciprocating manner.
[0010] In some embodiments, at least one primary magnetic element
may be disposed at the bottom surface of the cleaning device. The
at least one primary magnetic element may be located between the
first mopping plate and the second mopping plate. At least one
first secondary magnetic element may be disposed at (e.g., fixed
to) the first mopping plate. At least one second secondary magnetic
element may be disposed at (e.g., fixed to) the second mopping
plate. At least partially due to a magnetic force between the
primary magnetic element and the first secondary magnetic element,
the first mopping plate may perform a reciprocating movement
relative to the bottom surface. At least partially due to a
magnetic force between the primary magnetic element and the second
secondary magnetic element, the second mopping plate may perform a
reciprocating movement relative to the bottom surface. In some
embodiments, while the first mopping plate and the second mopping
plate move relative to the bottom surface of the cleaning device,
the first mopping plate and the second mopping plate may move
relative to one another, or may move in a same direction.
[0011] In some embodiments, the primary magnetic element may be an
electromagnetic element or a permanent magnet (or permanent
magnetic element). In some embodiments, both of the first secondary
magnetic element and the second secondary magnetic element may be
permanent magnets. When the primary magnetic element is an
electromagnetic element, a direction of an electric current
supplied to the primary magnetic element may be changed
periodically to periodically switch the magnetic poles of the
primary magnetic element facing the secondary magnetic elements.
The magnetic force between the primary magnetic element and the
first secondary magnetic element and the magnetic force between the
primary magnetic element and the second secondary magnetic element
may be periodically switched between an attractive magnetic force
and a repulsive magnetic force. As a result, the first mopping
plate and the second mopping plate may be driven by the varying
magnetic forces to perform reciprocating movements relative to the
bottom surface. When the primary magnetic element is a permanent
magnet, the primary magnetic element may be rotated relative to the
bottom surface to periodically change the magnetic poles facing the
first secondary magnetic element and the second secondary magnetic
element, thereby periodically changing the magnetic field direction
(and hence the magnetic forces between the primary magnetic element
and the secondary magnetic elements). The changing magnetic field
direction (and hence the magnetic forces) may drive the first and
second mopping plates to move reciprocatively relative to the
bottom surface.
[0012] In some embodiments, the primary magnetic element may be an
electromagnetic element. A restoration component may be disposed
between and configured to connect (or couple) the first mopping
plate and the second mopping plate. The restoration component may
be configured to provide a restoration force to the first and
second mopping plates, which may be a pulling force or a pushing
force. When the primary magnetic element is supplied with an
electric current to generate a magnetic field, an attractive or a
repulsive magnetic force may be generated between the primary
magnetic element and the first secondary magnetic element, and
between the primary magnetic element and the second secondary
magnetic element, respectively. The attractive or repulsive
magnetic force may drive the first mopping plate and/or the second
mopping plate to overcome a restoration force provided by the
restoration component to move relative to the bottom surface (and
in some embodiments, relative to one another). When the primary
magnetic element is not supplied with the electric current and does
not generate the magnetic field, the first mopping plate and the
second mopping plate may be driven by the restoration force
provided by the restoration component to move relative to the
bottom surface (and in some embodiments, relative to one another).
In some embodiments, the restoration force provided by the
restoration component may at least partially provide the driving
force to move the mopping plates during a first portion of a
reciprocating movement cycle. In some embodiments, the magnetic
forces may at least partially provide the driving force to move the
mopping plates during a second portion of the reciprocating
movement cycle. In some embodiments, during the first portion of
the reciprocating movement cycle, in which the restoration force
provides the driving force for the movement of the mopping plates,
the magnetic forces may be zero.
[0013] In some embodiments, the bottom surface of the cleaning
device may be provided with a first mopping plate and a second
mopping plate disposed side by side. The second mopping plate may
face the first mopping plate. At least one primary magnetic element
may be mounted on the first mopping plate. At least one secondary
magnetic element may be mounted on the second mopping plate.
[0014] In some embodiments, at least partially due to alternating
attractive magnetic force and repulsive magnetic force between the
primary magnetic element and the secondary magnetic element, the
first mopping plate and the second mopping plate may be driven to
perform a reciprocating movement relative to the bottom surface,
and in some embodiments, relative to one another, such as toward
and away from one another.
[0015] In some embodiments, the primary magnetic element may be an
electromagnetic element. The secondary magnetic element may be an
electromagnetic element in the form of a linkage (hence the
secondary magnetic element may be referred to as a linkage-shaped
secondary magnetic element). The primary magnetic element may be
disposed on the first mopping plate. A first end of the
linkage-shaped secondary magnetic element may be fixedly connected
with the second mopping plate. A second end of the linkage-shaped
secondary magnetic element may abut against the primary magnetic
element, inserted into the body of the primary magnetic element, or
coupled with the primary magnetic element in any other suitable
manner. When an attractive magnetic force is generated between the
primary magnetic element and the linkage-shaped secondary magnetic
element, the first mopping plate and the second mopping plate may
be driven by the attractive magnetic force to move relative to the
bottom surface, and toward one another. When a repulsive magnetic
force is generated between the primary magnetic element and the
linkage-shaped secondary magnetic element, the first mopping plate
and the second mopping plate may be driven to move relative to the
bottom surface, and away from one another.
[0016] In some embodiments, the primary magnetic element may be an
electromagnetic element. A restoration component may be disposed
between the first mopping plate and the second mopping plate, and
may connect or couple the first mopping plate and the second
mopping plate. When the primary magnetic element is supplied with
an electric current to generate a magnetic field, and when an
attractive magnetic force is generated between the primary magnetic
element and the secondary magnetic element, the first mopping plate
and the second mopping plate may be driven by the attractive
magnetic force to move relative to the bottom surface (e.g., toward
one another). While the first mopping plate and the second mopping
plate move toward one another, the restoration component may
provide a pulling force to pull the first mopping plate and the
second mopping plate toward one another, or may provide a pushing
force to push the first mopping plate and the second mopping plate
away from one another. The attractive magnetic force may overcome
the pushing force, such that the mopping plates may be moved toward
one another. When the primary magnetic element is not supplied with
an electric current and does not generate a magnetic field, e.g.,
when an attractive magnetic force is not generated between the
primary magnetic element and the secondary magnetic element, the
first mopping plate and the second mopping plate may be driven by
the pulling restoration force provided by the restoration component
to move relative to the bottom surface and toward one another, or
may be driven by the pushing restoration force provided by the
restoration component to move relative to the bottom surface and
away from one another.
[0017] In some embodiments, the primary magnetic element may be an
electromagnetic element. The secondary magnetic element may be an
electromagnetic element in the form of a linkage (hence the
secondary magnetic element may also be referred to as a
linkage-shaped secondary magnetic element). The primary magnetic
element may be disposed at (e.g., fixed to) the first mopping
plate. A first end of the linkage-shaped secondary magnetic element
may be fixedly connected to the second mopping plate. A second end
of the linkage-shaped secondary magnetic element may abut against
the primary magnetic element, may be inserted into the primary
magnetic element, or may be coupled with the primary magnetic
element in any other suitable manner. When the primary magnetic
element is supplied with an electric current to generate a magnetic
field, an attractive magnetic force may be generated between the
primary magnetic element and the secondary magnetic element. The
attractive magnetic force may drive the first mopping plate and the
second mopping plate to move relative to the bottom surface and
toward one another. During this process, the restoration component
may provide a pushing restoration force against the first mopping
plate and the second mopping plate. The attractive magnetic force
may overcome the pushing restoration force to move the mopping
plates toward one another. When the primary magnetic element is not
supplied with the electric current and does not generate a magnetic
field, the first mopping plate and the second mopping plate may be
driven by a pushing restoration force provided by the restoration
component to move relative to the bottom surface and away from one
another, or by a pulling restoration force to move relative to the
bottom surface and toward one another.
[0018] Another aspect of the present disclosure provides a cleaning
device (e.g., robot) including the disclosed mopping mechanism.
[0019] In conventional technologies, a cleaning device is
configured to clean a floor with a mop. The mop may be fixedly
disposed at a bottom surface of the cleaning device. The mop is
typically static relative to the bottom surface, and mops the floor
as the cleaning device moves. The mop may only mop the floor in a
single direction (i.e., the moving direction of the cleaning
device) within the region traversed by the cleaning device. Such a
cleaning device has a low cleaning efficiency and a poor cleaning
effect.
[0020] Compared with the conventional technologies, the mopping
mechanism and the cleaning device including the mopping mechanism
provided by the present disclosure have the following advantages.
In the mopping mechanism and the cleaning device, the mopping
mechanism may be mounted at the bottom surface of the cleaning
device. The mopping mechanism may include a magnetic element
assembly (which may include at least one primary magnetic element
and at least one secondary magnetic element) configured to at least
partially provide a driving force (e.g., a magnetic force) to drive
at least one mopping plate to move relative to the bottom surface.
At least partially due to the magnetic force between the primary
magnetic element and the secondary magnetic element, the at least
one mopping plate may perform a reciprocating movement relative to
the bottom surface (e.g., in some embodiments, two mopping plates
may move toward or away from one another). The at least one mopping
plate may clean a surface (e.g., a floor surface) in a
reciprocating manner, thereby improving the cleaning efficiency and
cleaning effect.
[0021] According to another aspect of the present disclosure, a
mopping mechanism is provided. The mopping mechanism includes at
least one mopping plate movably mountable to a bottom surface of a
cleaning device. The mopping mechanism also includes a magnetic
element assembly including a primary magnetic element and a
secondary magnetic element, and configured to generate a variable
magnetic field to drive the at least one mopping plate to move
reciprocatively relative to the bottom surface.
[0022] According to another aspect of the present disclosure, a
mobile device is provided. The mobile device includes at least one
driving device configured to move the mobile device. The mobile
device also includes a bottom surface. The mobile device further
includes a mopping mechanism disposed at the bottom surface. The
mopping mechanism includes at least one mopping plate movably
mounted to the bottom surface. The mopping mechanism also includes
a magnetic element assembly including a primary magnetic element
and a secondary magnetic element. The magnetic element assembly is
configured to generate a variable magnetic field to drive the at
least one mopping plate to move reciprocatively relative to the
bottom surface.
BRIEF DESCRIPTION OF THE DRAWINGS
[0023] To explain the technical solutions of the present
disclosure, the drawings that illustrate embodiments of the present
disclosure will be briefly introduced. It is understood that the
drawings described below are only some of the embodiments of the
present disclosure. A person having ordinary skills in the art can
obtain other drawings based on the accompanying drawings without
creative efforts.
[0024] FIG. 1 is a schematic perspective view of a cleaning device,
according to an embodiment of the present disclosure.
[0025] FIG. 2 is a schematic illustration of a bottom configuration
of the cleaning device, according to an embodiment of the present
disclosure.
[0026] FIG. 3 is a schematic illustration of a bottom configuration
of the cleaning device, according to another embodiment of the
present disclosure.
[0027] FIGS. 4A and 4B illustrate a schematic configuration of a
mopping mechanism, according to an embodiment of the present
disclosure.
[0028] FIGS. 4C and 4D illustrate a schematic configuration of a
mopping mechanism, according to an embodiment of the present
disclosure.
[0029] FIG. 5 is a schematic illustration of a bottom configuration
of the cleaning device, according to another embodiment of the
present disclosure.
[0030] FIGS. 6A and 6B illustrate a schematic configuration of a
mopping mechanism and motion states of mopping plates, according to
an embodiment of the present disclosure.
[0031] FIGS. 6C and 6D illustrate a schematic configuration of a
mopping mechanism and motion states of mopping plates, according to
another embodiment of the present disclosure.
[0032] FIGS. 7A and 7B illustrate a schematic configuration of a
mopping mechanism and motion states of mopping plates, according to
another embodiment of the present disclosure.
[0033] FIGS. 8A and 8B illustrate a schematic configuration of a
mopping mechanism and motion states of mopping plates, according to
another embodiment of the present disclosure.
[0034] FIGS. 8C and 8D illustrate a schematic configuration of a
mopping mechanism and motion states of mopping plates, according to
another embodiment of the present disclosure.
[0035] FIGS. 9A and 9B illustrate a schematic configuration of a
mopping mechanism and motion states of mopping plates, according to
another embodiment of the present disclosure.
[0036] FIGS. 9C and 9D illustrate a schematic configuration of a
mopping mechanism and motion states of mopping plates, according to
another embodiment of the present disclosure.
[0037] FIGS. 10A and 10B illustrate a schematic configuration of a
mopping mechanism and motion states of mopping plates, according to
another embodiment of the present disclosure.
[0038] FIGS. 11A-11D illustrate example magnetic field intensity
change over time, according to an embodiment of the present
disclosure.
DETAILED DESCRIPTION
[0039] To render the objectives, features, and advantages of the
present disclosure more obvious and easier to understand, the
technical solutions of the present disclosure will be described in
detail with reference to the accompanying drawings. The embodiments
described herein are only some of the embodiments of the present
disclosure, and are not all of the embodiments of the present
disclosure. Based on the embodiments of the present disclosure, a
person having ordinary skills in the art can obtain other
embodiments without creative efforts, which all fall within the
scope of protection of the present disclosure.
[0040] The singular forms "a," "an," and "the" are intended to
include the plural forms as well, unless the context indicates
otherwise. The terms "comprise," "comprising," "include," and the
like specify the presence of stated features, steps, operations,
elements, and/or components, and do not preclude the presence or
addition of one or more other features, steps, operations,
elements, components, and/or groups. The term "and/or" used herein
includes any suitable combination of one or more related items
listed. For example, "A and/or B" can mean A only, A and B, and B
only. The symbol "/" means "or" between the related items separated
by the symbol. The phrase "at least one of" A, B, or C encompasses
all combinations of A, B, and C, such as A only, B only, C only, A
and B, B and C, A and C, and A, B, and C. In this regard, A and/or
B can mean at least one of A or B.
[0041] Further, when an embodiment illustrated in a drawing shows a
single element, it is understood that the embodiment may include a
plurality of such elements. Likewise, when an embodiment
illustrated in a drawing shows a plurality of such elements, it is
understood that the embodiment may include only one such element.
The number of elements illustrated in the drawing is for
illustration purposes only, and should not be construed as limiting
the scope of the embodiment. Moreover, unless otherwise noted, the
embodiments shown in the drawings are not mutually exclusive, and
they may be combined in any suitable manner. For example, elements
shown in one embodiment but not another embodiment may nevertheless
be included in the other embodiment.
[0042] The present disclosure provides a mopping mechanism and a
mobile device including the mopping mechanism (e.g., a cleaning
device, such as a cleaning robot). The mopping mechanism may be
configured to cause mopping plates included in the mopping
mechanism to move reciprocatively relative to a bottom surface of
the mobile device, and/or to change a mopping speed or a mopping
frequency of the mopping plates. The disclosed mopping mechanism
may drive the mops attached to the mopping plates to perform
reciprocating mopping of the surface to be cleaned, thereby
enhancing the cleaning efficiency and cleaning effect.
[0043] FIG. 1 is a schematic perspective view of a device 100,
according to an embodiment of the present disclosure. The device
100 may also be referred to as a mobile device 100, a cleaning
device 100, a vacuum cleaner 100, a vacuum cleaning robot 100, or a
cleaning robot 100. For discussion purposes, the device 100 is
referred to a cleaning device 100 or a cleaning robot 100. The
cleaning device 100 may include a main body 110. The main body 110
may have any suitable shape, such as a circular shape (as shown in
FIG. 1), a rectangle shape, a square shape, or a combination
thereof. The main body 110 may include a housing 105 for enclosing
and accommodating various elements, parts, or components of the
cleaning device 100. The main body 110 (or the housing 105) may
include a first bumper (or first cover, front bumper) 111 and a
second bumper (or second cover, rear bumper) 112 at a
circumferential side of the main body 110. The first bumper 111 may
be separated from the second bumper by one or more gaps 120. At
least one of the first bumper 111 or the second bumper 112 may be
resiliently coupled with the housing 105 through an elastic member,
such as a spring (not shown). When the cleaning device 100 collides
with an obstacle, such as a wall or furniture, the first bumper 111
or the second bumper 112 may retract when pushed by the obstacle,
thereby providing a buffer or an impact absorption for the cleaning
device 100. One or more collision sensors may be disposed at the
inner side of the first bumper 111 and/or the second bumper 112.
When the first bumper 111 and/or the second bumper 112 collides
with an object, the one or more collision sensors may detect the
collision and generate a signal indicating the occurrence of the
collision. The cleaning device 100 may also include a camera 125.
The camera 125 may be configured to capture one or more images of
the environment in which the cleaning device 100 operates. For
illustrative purposes, the camera 125 is shown as being mounted at
the front portion (e.g., behind the front bumper 111) of the
cleaning device. It is understood that the camera 125 may be
mounted at any other location of the cleaning device, e.g., a top
portion of the housing. The orientation of the camera 125 may be in
any suitable directions, such as facing front, facing back, facing
sides, facing up (e.g., ceiling of a room), facing a direction
forming an acute angle relative to the moving direction of the
cleaning device, etc. A controller 190 (shown in FIG. 2) included
in the cleaning device 100 may analyze the images to extract
information (e.g., identify objects) for the purpose of
localization and mapping of the cleaning device 100. The cleaning
device 100 may further include one or more sweeping elements or
mechanisms, such as one or more brushes. FIG. 1 shows two side
brushes 130 disposed at two sides of a front portion of the bottom
of the cleaning device 100.
[0044] FIG. 2 is a schematic illustration of a bottom view of the
structural configuration of the cleaning device 100, according to
an embodiment of the present disclosure. The bottom of the main
body 110 of the cleaning device 100 may include a bottom surface or
plate 155. In some embodiments, the bottom surface 155 may be
formed by a plurality of surfaces, although for illustrative
purposes, the bottom surface 155 is shown as a single piece. A
sweeping unit 145 may be mounted to the bottom surface 155 at a
front portion in the moving direction of the cleaning device 100.
The sweeping unit 145 may include the side brushes 130 and a main
brush 150 disposed at a relatively center location of the bottom
surface 155. The side brushes 130 and/or the main brush 150 may be
mounted to the bottom surface 155, or may be mounted to other
components inside the cleaning device 100 and may extend out of the
housing through an opening provided at the bottom surface 155.
Although not shown, in some embodiments, the main brush 150 may be
associated with a vacuum hole configured to vacuum dirt or trash
that have been swept together into a trash storage tank disposed
inside the cleaning device 100, at a top portion, or a side portion
of the cleaning device 100.
[0045] The cleaning device 100 may include a mopping mechanism 160
disposed at a back portion of the bottom surface 2806. During an
operation of the cleaning device 100, the cleaning device 100 may
first sweep a surface to be cleaned using the sweeping unit located
at the front portion in the moving direction, and then mop the
surface to be cleaned using the mopping mechanism 160 located at
the back portion in the moving direction, thereby enhancing the
cleaning efficiency and cleaning effect for the surface to be
cleaned. In other embodiments, the cleaning of the surface to be
cleaned may be performed using only the mopping mechanism 160
disclosed herein, or using other similar or different mopping
mechanisms disclosed herein in other embodiments.
[0046] The cleaning device 100 may include a motion unit configured
to cause the cleaning device 100 to move along a surface to be
cleaned (e.g., a floor). The motion unit may include an
omnidirectional wheel 135 disposed at a front portion of the bottom
surface 155. The omnidirectional wheel 135 may be a non-driving,
passively rotating wheel. The driving unit may also include at
least two driving wheels 140 disposed at two sides of the bottom
surface 155. The positions of the omnidirectional wheel 135 and the
two driving wheels 140 may form a triangle, as shown in FIG. 2, to
provide a stable support to the main body 110 of the cleaning
device 100. In some embodiments, the driving wheels 140 may be
rotatable around a rotation axis passing through a center of
symmetry of the driving wheels 140. In some embodiments, the
driving wheels 140 may not be rotatable around an axis
perpendicular to the bottom surface 155. The omnidirectional wheel
135 may freely rotate around an axis perpendicular to the bottom
surface 155, and around an axis passing through a center of
symmetry of the omnidirectional wheel 135. The omnidirectional
wheel 135 and the driving wheels 140 together move the cleaning
device 100 in any desirable direction. The at least two driving
wheels 140 may be independently driven by one or more electric
motors (not shown in figures) disposed inside the main body 110.
When the two driving wheels 140 are driven at different speeds, the
rotation speed differential of the driving wheels 140 may cause the
cleaning device 100 to turn. In some embodiments, the driving
wheels 140 may be rotatable also around an axis perpendicular to
the bottom surface 155. In some embodiments, the driving unit may
include a track chain (not shown) in place of or in addition to the
driving wheels 140.
[0047] In some embodiments, the controller 190 (shown in FIG. 2)
may include one or more processors configured to control the
movement of the cleaning device, the movement of the mopping
mechanism 160, and/or to process various data (e.g., sensor data)
and signals. In some embodiments, the controller 190 may control
the operations of the environmental sensors and/or the one or more
driving devices. The cleaning device 100 may include one or more
driving devices, such as electric motors, configured to drive the
driving unit, such as the driving wheels 140. The cleaning device
100 may include one or more environmental sensors. The one or more
environmental sensors and the one or more driving devices may be
communicatively connected with the controller 190 through wired or
wireless connections. The controller 190 may also receive data or
signals from the environmental sensors and/or the one or more
driving devices. The one or more environmental sensors may be
configured to obtain information relating to an obstacle in a work
zone of the cleaning device. The environmental sensors may include
at least one of a collision sensor, a proximity sensor (e.g., an
infrared diode), an anti-falling sensor (e.g., a cliff sensor), a
camera (e.g., the camera 125), a light detection and ranging
("Lidar") sensor, etc. The obstacle may be an object that blocks
the passage or movement of the cleaning device in the work zone in
which the cleaning device operates, such as an animal, a human,
and/or a non-living object, such as a wall, a door, a furniture, a
pet, a user, etc. The information relating to the obstacle may
include a location of the obstacle and/or a distance between the
cleaning device and the obstacle. In some embodiments, the
information relating to the obstacle may also include a size,
spatial distribution, a velocity, or a time distribution of the
obstacle. The environmental sensors may transmit the acquired
information relating to the obstacle to the controller 190. The
controller 190 may control a moving path of the cleaning device
based on the information relating to the obstacle. The controller
190 may generate control instructions and transmit the control
instructions to the driving devices to control a motion velocity
and/or direction of the motion devices. In some embodiments, the
controller 190 may also include a non-transitory computer-readable
medium configured to store computer-executable instructions and/or
various data, including sensor data acquired by various sensors,
such as the camera, the collision sensors, the proximity sensors,
the Lidar sensor, etc. The controller 190 may be disposed inside
the body of the cleaning device 100, and is shown as a dashed box
for illustration purposes in FIG. 2. Although the controller 190
may not be shown in other figures, the other embodiments shown in
other figures may also include the controller 190.
[0048] In some embodiments, the driving devices and the controller
190 may be disposed at least partially (e.g., fully) inside a
housing (e.g., housing 105) of the cleaning device. The driving
devices, such as the driving wheels 140 and the omnidirectional
wheel 135, may be disposed at least partially external to the
housing 105 of the cleaning device 100. The housing 105 may include
the bottom surface 155. In some embodiments, the driving wheels 140
and the omnidirectional wheel 135 may be disposed on the bottom
surface 155.
[0049] As shown in FIG. 2, the mopping mechanism 160 of the
cleaning device 100 may be disposed at the bottom surface 155. The
mopping mechanism 160 may include at least one movable mopping
plate 1610 attached with a mop for mopping the surface to be
cleaned (e.g., a floor). The mopping mechanism 160 (including the
mopping plate) may have any suitable shapes, such as a round shape,
a square shape, a triangle shape, or a portion or a combination
thereof. The mopping mechanism 160 disclosed herein is not limited
to be implemented in a cleaning device. The mopping mechanism 160
may be implemented in other cleaning devices, such as a handheld
floor mopping machine, or may be a cleaning assembly included in
other cleaning devices.
[0050] As shown in FIG. 2 and FIG. 3, the mopping mechanism 160 may
include at least one mopping plate movably mounted to the bottom
surface 155. For illustrative purposes, FIG. 2 and FIG. 3 show two
mopping plates, a first mopping plate 1611 and a second mopping
plate 1612. The mopping plates may have any suitable shapes. The
movably mounted mopping plates 1611 and 1612 may slide or rotate
relative to the bottom surface 155. The cleaning device 100 may
include suitable structures to enable the sliding or rotating
movement of the mopping plates 1611 and 1612.
[0051] In the embodiments shown in FIGS. 2-10B, the mopping
mechanism 160 may include a magnetic element assembly including at
least one primary magnetic element and at least one secondary
magnetic element. Each of the primary magnetic element and
secondary magnetic element may be an electromagnetic element or a
permanent magnetic element. A variable magnetic field may be
generated between each pair of a primary magnetic element and a
corresponding secondary magnetic element. A magnetic element
includes two magnetic poles, a first magnetic pole (e.g., a North
pole (or N pole)), and a second magnetic pole (e.g., a South pole
(or S pole)). In some embodiments, the magnetic poles of at least
one of a primary magnetic element or a secondary magnetic element
may be switched (when controlled by the controller 190) between the
S pole and the N pole periodically, thereby periodically changing
the corresponding magnetic field (e.g., magnetic field direction)
existing between a pair of a primary magnetic element and a
secondary magnetic element. For example, the magnetic poles of a
primary magnetic element and a secondary magnetic element that face
one another may be changed between (S, S), (N, N), (S, N), and (N,
S). By changing the magnetic poles periodically, a variable
magnetic field with a variable magnetic field direction may be
generated between the pair of primary magnetic element and
secondary magnetic element. To change the magnetic field direction
and/or intensity, the controller 190 may change a direction of an
electric current supplied to an electromagnetic element (e.g., the
primary magnetic element or the secondary magnetic element or both
may be an electromagnetic element) to change the magnetic poles
facing each other. In some embodiments, to change the magnetic
field direction, the controller 190 may rotate one or both of the
primary magnetic element and the secondary magnetic element in a
pair of magnetic elements, such that magnetic poles of the primary
magnetic element and the secondary magnetic element that face one
another may be changed. While the magnetic field direction is
changed, in some embodiments, the magnetic field intensity may also
be changed, for example, by changing the magnitude of the electric
current supplied to an electromagnetic element. In some
embodiments, one or both of the primary magnetic element and the
secondary magnetic element included in a pair may be permanent
magnetic elements. In some embodiments, the controller 190 may
control an electric motor (an example of the electric motor is
shown in FIG. 6A as a reference numeral 1705) coupled with one or
both of the primary magnetic element and the secondary magnetic
element to rotate one or both of the primary magnetic element and
the secondary magnetic element, thereby changing the magnetic poles
facing each other.
[0052] In the embodiment shown in FIG. 2, the mopping mechanism 160
may include a magnetic element assembly configured to at least
partially provide a driving force for the reciprocating movement of
the mopping plates 1611 and 1612 relative to the bottom surface
155. The magnetic element assembly may include a primary magnetic
element 1620 and a secondary magnetic element 1630. At least one of
the primary magnetic element 1620 or the second magnetic element
1630 may be controlled by the controller 190 to provide a variable
magnetic field having a variable magnetic field intensity and/or a
variable magnetic field direction, such that a variable magnetic
force (e.g., alternating attractive and repulsive magnetic forces)
may be generated between the primary magnetic element 1620 and the
secondary magnetic element 1630. In some embodiments, the secondary
magnetic element 1630 may be disposed at (e.g., fixed to) the first
mopping plate 1611, and may move together with the first mopping
plate 1611. The primary magnetic element 1620 may be disposed
(e.g., fixed to) the second mopping plate 1612, and may move
together with the second mopping plate 1612. At least partially due
to the magnetic force (e.g., alternating attractive and repulsive
magnetic forces) between the primary magnetic element 1620 and the
secondary magnetic element 1630, the mopping plates 1611 and 1612
may be driven by the magnetic force to perform a reciprocating
movement relative to the bottom surface 155 and/or relative to one
another (e.g., toward or away from one another). In some
embodiments, the primary magnetic element 1620 may be disposed at
(e.g., fixed to) the first mopping plate 1611, and the secondary
magnetic element 1630 may be disposed at (e.g., fixed to) the
second mopping plate 1612.
[0053] The arrows 1633 shown in FIG. 2 indicates the directions of
the magnetic force exerted on the primary magnetic element 1620 and
the secondary magnetic element 1630. In the state shown in FIG. 2,
the first mopping plate 1611 and the second mopping plate 1612 may
be at respective first positions, and the magnetic force generated
between the primary magnetic element 1620 and the secondary
magnetic element 1630 may be an attractive force (as indicated by
the arrows 1633). In the embodiments shown in the figures, each
mopping plate may move between a first position and a second
position. The first position and the second position of a mopping
plate are defined with reference to a fixed reference location 1699
on the bottom surface 155. For example, the reference location 1699
may be a line on the bottom surface 155 that lies between the first
mopping plate 1611 and the second mopping plate 1612 when the
mopping plates are closest to one another. The same reference
location 1699 may be used to define the first position and the
second position of the mopping plates in other embodiments shown in
other figures. The first position of a mopping plate is a position
where the mopping plate is closest to the reference location 1699
on the bottom surface 155, and the second position of the mopping
plate is a position where the mopping plate is farthest from the
reference location 1699 on the bottom surface 155.
[0054] At a time instance shown in FIG. 2, the first mopping plate
1611 and the second mopping plate 1612 may be at their respective
first positions. At this time instance, the magnetic force may be
an attractive magnetic force. At a next time instance, the
controller 190 may change the magnetic field between the primary
magnetic element 1620 and the secondary magnetic element 1630, such
that a repulsive magnetic force may exert on the primary magnetic
element 1620 (and hence on the second mopping plate 1612) and on
the secondary magnetic element 1630 (and hence on the first mopping
plate 1611). The first and second mopping plate 1611 and 1612 may
be driven by the repulsive magnetic force to move away from one
another, i.e., from their respective first positions toward their
respective second positions. Although the entire cycle of
reciprocating movement is not shown in FIG. 2, it is understood
that when the first mopping plate 1611 and the second mopping plate
1612 are at respective second positions, the magnetic force
generated by the primary magnetic element 1620 and the secondary
magnetic element 1630 may be changed (e.g., by the controller 190)
from the repulsive magnetic force to an attractive magnetic force
tending to move the first mopping plate 1611 and the second mopping
plate 1612 from their respective second positions toward their
respective first positions, i.e., toward one another. The processes
may be repeated, by alternately changing the directions of the
magnetic force (i.e., between a repulsive magnetic force and an
attractive magnetic force), such that the first mopping plate 1611
and the second mopping plate 1612 may be driven to move away from
one another and toward one another repeatedly, i.e., to move
reciprocatively between their respective first positions and second
positions. Thus, at least partially due to the changing magnetic
force, the first mopping plate 1611 and the second mopping plate
1612 may be driven to move reciprocatively relative to the bottom
surface 155 and/or relative to one another. In some embodiments,
multiple primary magnetic elements may be disposed on one of the
mopping plates, and multiple secondary magnetic elements may be
disposed on the other one of the mopping plates.
[0055] In the embodiment shown in FIG. 2, to change the magnetic
field between the primary magnetic element 1620 and the secondary
magnetic element 1630, the controller 190 may control an electric
current supplied to an electromagnetic element. For example, at
least one of the primary magnetic element 1620 or the secondary
magnetic element 1630 may be an electromagnetic element. Using the
primary magnetic element 1620 being an electromagnetic element as
an example, the direction and/or magnitude of the electric current
supplied to the primary magnetic element 1620 may be periodically
changed by the controller 190, thereby changing the magnetic field
direction and/or magnetic field intensity between the primary
magnetic element 1620 and the secondary magnetic element 1630. The
magnetic force may be varied between an attractive magnetic force
and a repulsive magnetic force. For example, when the mopping
plates 1611 and 1612 are closest to one another (e.g., at their
respective first positions), the magnetic force may be switched
from an attractive magnetic force to a repulsive magnetic force to
push the mopping plates 1611 and 1612 away from one another. When
the mopping plates 1611 and 1612 move to their respective second
positions, the controller 190 may change the magnetic force from a
repulsive magnetic force to an attractive magnetic force. The
mopping plates 1611 and 1612 may then be driven by the attractive
magnetic force to move toward one another. When the mopping plates
1611 and 1612 arrive at their respective first positions at which
they are closest to one another, the controller 190 may again
change the magnetic force from the attractive magnetic force to a
repulsive magnetic force. These processes may be repeated
periodically to drive the mopping plates 1611 and 1612 to perform
reciprocating movements relative to the bottom surface 155 and
relative to one another.
[0056] In the embodiment shown in FIG. 3, the magnetic element
assembly included in the mopping mechanism 160 may include two
secondary magnetic elements, i.e., a first secondary magnetic
element 1631 and a second secondary magnetic element 1632. In some
embodiments, the magnetic element assembly may include two or more
primary magnetic elements 1620, two or more first secondary
magnetic elements 1631, and/or two or more second secondary
magnetic elements 1632. The first secondary magnetic element 1631
may be disposed at (e.g., fixed to) the first mopping plate 1611,
and the second secondary magnetic element 1632 may be disposed at
(e.g., fixed to) the second mopping plate 1612. The primary
magnetic element 1620 may be disposed at (e.g., fixed to) the
bottom plate 155 between the first mopping plate 1611 and the
second mopping plate 1612. The secondary magnetic elements 1631 and
1632 may be disposed at edge locations on the first mopping plate
1611 and the second mopping plate 1612, respectively, adjacent the
primary magnetic element 1620.
[0057] At the state shown in FIG. 3, the first mopping plate 1611
and the second mopping plate 1612 may be at respective first
positions. The arrows 1633 shown in FIG. 3 indicates that the
magnetic force may be an attractive magnetic force. At a next time
instance following the time instance shown in FIG. 3, the magnetic
force may be changed to a repulsive magnetic force to drive the
first mopping plate 1611 and the second mopping plate 1612 away
from one another. The magnetic poles of the primary magnetic
element 1620 or the secondary magnetic elements 1631 and 1632 may
be switched or changed, thereby changing the magnetic fields
between the primary magnetic element 1620 and the secondary
magnetic elements 1631 and 1632. In some embodiments, the
controller 190 (shown in FIG. 2) may independently control the
magnetic field between the primary magnetic element 1620 and the
first secondary magnetic element 1631, and the magnetic field
between the primary magnetic element 1620 and the second secondary
magnetic element 1632. In some embodiments, the controller 190 may
synchronously and/or simultaneously control the magnetic field
between the primary magnetic element 1620 and the first secondary
magnetic element 1631, and the magnetic field between the primary
magnetic element 1620 and the second secondary magnetic element
1632. In some embodiments, the controller 190 may asynchronously
and/or independently control the magnetic field between the primary
magnetic element 1620 and the first secondary magnetic element
1631, and the magnetic field between the primary magnetic element
1620 and the second secondary magnetic element 1632. In some
embodiments, the controller 190 may change the magnetic poles of
the primary magnetic element 1620 between the S pole and the N pole
periodically. In some embodiments, the controller 190 may change
the magnetic poles of a secondary magnetic element (e.g., the
secondary magnetic element 1631 or 1632) between the S pole and the
N pole periodically. Thus, a periodically varying magnetic force
(e.g., varying between an attractive magnetic force and a repulsive
magnetic force) may be generated between the primary magnetic
element 1620 and the secondary magnetic elements 1631 and 1632,
respectively. The periodically varying magnetic force may drive the
first mopping plate 1611 and the second mopping plate 1612, on
which the secondary magnetic elements 1631 and 1632 are mounted, to
move relative to the bottom surface 155, and/or relative to one
another (e.g., toward or away from one another). By repeatedly
changing the magnetic force, the first mopping plate 1611 and the
second mopping plate 1612 may be driven to perform reciprocating
movements relative to the bottom surface 155. The movements of the
first mopping plate 1611 and the second mopping plate 1612 may be
in the same direction or may be in different (e.g., opposite)
directions. The frequency of the reciprocating movement of each of
the first mopping plate 1611 and the second mopping plate 1612 may
be the same or may be different.
[0058] At a time instance following the time instance shown in FIG.
3, the first mopping plate 1611 and the second mopping plate 1612
may be driven by a repulsive magnetic force to move away from one
another. Although the entire cycle of reciprocating movement is not
shown in FIG. 3, the reciprocating movement has been described
above in connection with FIG. 2. By repeatedly changing the
magnetic fields between a pair of a primary magnetic element and a
secondary magnetic element when a mopping plate is at its first
position or second position, the mopping plate may be driven to
perform a reciprocating movement relative to the bottom surface
155. For example, when the first mopping plate 1611 and the second
mopping plate 1612 are at respective first positions, the magnetic
force generated by the primary magnetic element 1620 and the
secondary magnetic element 1630 may be controlled (e.g., by the
controller 190) to be a repulsive force tending to move the first
mopping plate 1611 and the second mopping plate 1612 away from one
another. When the mopping plates 1611 and 1612 move from their
respective first positions to arrive at their respective second
positions, the controller 190 may change the magnetic force between
the primary magnetic element 1620 and the first secondary magnetic
element 1631 from the repulsive magnetic force to an attractive
magnetic force, and change the magnetic force between the primary
magnetic element 1620 and the second secondary magnetic element
1632 from the repulsive magnetic force to an attractive magnetic
force, thereby causing the mopping plates 1611 and 1612 to move
from their respective second positions back to their respective
first positions. The processes may be repeated. The directions
and/or magnitudes of the magnetic forces (i.e., between a repulsive
magnetic force and an attractive magnetic force) between each pair
of primary magnetic element and secondary magnetic element may be
repeatedly and alternatingly changed, such that the first mopping
plate 1611 and the second mopping plate 1612 may be driven to move
away from one another and toward one another repeatedly, i.e., to
move reciprocatively between their respective first positions and
second positions. Thus, at least partially due to the changing
magnetic force, the first mopping plate 1611 and the second mopping
plate 1612 may be driven to move reciprocatively relative to the
bottom surface 155 and/or relative to one another.
[0059] FIGS. 4A-4D illustrate the structures and motion states of
the mopping mechanism 160 of the cleaning device 100 (e.g.,
cleaning robot 100), according to an embodiment of the present
disclosure. FIGS. 4A-4D show that the mopping plates may be
slidable relative to the bottom plate 155. Although slidable motion
is shown as an example relative motion of the mopping plates
relative to the bottom surface 155, the mopping plates may perform
other relative motions, such as rotation relative to the bottom
surface 155. Although the embodiment of the magnetic element
assembly shown in FIG. 3 is adopted in FIGS. 4A-4D to illustrate
the slidable configuration, the slidable configuration shown in
FIGS. 4A-4D can be applicable to the embodiment shown in FIG. 2.
That is, the embodiment shown in FIGS. 4A-4D may be based on the
magnetic element assembly shown in FIG. 2. FIG. 4A shows that the
mopping plates are driven away from one another, and FIG. 4C shows
that the mopping plates are driven toward one another. FIG. 4B
shows a cross-sectional view of the mopping mechanism 160 taken
alone the A-A line shown in FIG. 4A. FIG. 4D shows a
cross-sectional view of the mopping plate 160 taken alone the B-B
line shown in FIG. 4C.
[0060] As shown in FIG. 4A, the mopping plates 1611 and 1612 may be
slidable relative to the bottom surface 155. To enable the mopping
plates 1611 and 1612 to slide relative to the bottom surface 155, a
sliding rail 1655 may be disposed on (e.g., fixed to) the bottom
surface 155, and a sliding groove 1656 matching with the sliding
rail 1655 may be disposed on the mopping plates 1611 and 1612. FIG.
4B illustrates the engagement between the sliding rail 1655
disposed on the bottom surface 155 and the sliding groove 1656
disposed at the mopping plates 1611 and 1612. In some embodiments,
the sliding rail 1655 may be provided on the mopping plates 1611
and 1612, and the sliding groove 1656 may be provided on the bottom
surface 155. The mopping plates 1611 and 1612 may be slidably
mounted onto the bottom surface 155 through the sliding rail 1655
and the sliding groove 1656. When under an external force, such as
the magnetic force, the mopping plates 1611 and 1612 may slide
along the sliding rail 1655.
[0061] In some embodiments, at least one primary magnetic element
1620 may be disposed on the bottom surface 155, and at least one
secondary magnetic element (e.g., 1631 and/or 1632) may be disposed
on each of the mopping plates 1611 and 1612. In the embodiment
shown in FIGS. 4A-4D, the mopping mechanism 160 includes one
primary magnetic element 1620, and each of the mopping plates 1611
and 1612 is provided with one secondary magnetic element 1631 or
1632. The secondary magnetic element 1631 or 1632 may be fixed to
the corresponding mopping plate 1611 or 1612, and may move together
with the mopping plate 1611 or 1612. The secondary magnetic element
1631 or 1632 may be disposed in close proximity to the primary
magnetic element 1620, such that a periodically varying magnetic
force that changes between an attractive magnetic force and a
repulsive magnetic force may be generated between the first
secondary magnetic element 1631 and the primary magnetic element
1620 and between the second secondary magnetic element 1632 and the
primary magnetic element 1620. The mopping plates 1611 and 1612 may
be driven by the changing magnetic forces to perform reciprocating
movements relative to the bottom surface 155, and hence, may mop
the floor surface to be cleaned reciprocatively.
[0062] In some embodiments, as shown in FIG. 5, a single mopping
plate 1610, instead of two separate mopping plates, may be provided
on the bottom surface 155. An opening 1666 may be provided at a
middle portion of the mopping plate 1610. The opening 1666 may be
provided at any suitable location on the mopping plate 1610. One of
the primary magnetic element 1620 and the secondary magnetic
element 1630 may be disposed at the bottom surface 155 within the
opening 1666, the other one of the primary magnetic element 1620
and the secondary magnetic element 1630 may be disposed on the
single mopping plate 1610. For example, in some embodiments, the
primary magnetic element 1620 may be disposed at the bottom surface
155, and may be positioned within the opening 1666 of the mopping
plate 1610. The secondary magnetic element 1630 may be disposed at
an edge of the opening on the mopping plate 1610 opposing or facing
the primary magnetic element 1620. The controller 190 may control
at least one of the primary magnetic element 1620 or the secondary
magnetic element 1630 to provide a variable magnetic field. The
magnetic force generated between the secondary magnetic element
1630 and the primary magnetic element 1620 may be periodically
varied between an attractive magnetic force and a repulsive
magnetic force. The periodically varying magnetic force may drive
the mopping plate 1610 to perform reciprocating movements relative
to the bottom surface 155.
[0063] In some embodiments, the primary magnetic element 1620 and
the secondary magnetic element 1630 may be disposed at other
alternative locations. For example, as shown in FIG. 5, the primary
magnetic element 1620 may be disposed at an edge 1691 location of
the bottom surface 155. The secondary magnetic element 1630 may be
disposed at an end 1692 of the mopping plate 1610 close to the
primary magnetic element 1620. The secondary magnetic element 1630
and the primary magnetic element 1620 may generate a periodically
varying magnetic force to drive the mopping plate 1610 to perform
reciprocating movements relative to the bottom surface 155. In some
embodiments, in addition to the primary magnetic element 1620 and
the secondary magnetic element 1630 disposed at or near the opening
1666, one or more additional pairs of primary magnetic element and
secondary magnetic element may be disposed at one or more pairs of
locations on the mopping plate 1610 and on the bottom surface 155
to provide additional driving forces for the movement of the
mopping plate 1610.
[0064] Referring to FIG. 5, in some embodiments, the primary
magnetic element 1620 and/or the secondary magnetic element 1630
may provide a variable magnetic field with a variable magnetic
field direction and/or magnetic field intensity. For example, the
magnetic field direction may be changed (e.g., by the controller
190) by supplying direct currents of different directions to the
primary magnetic element 1620 (or the secondary magnetic element
1630) at a predetermined frequency. In some embodiments, the
magnetic field direction may be changed by rotating (e.g., by
controlling an electric motor 1705 (shown in FIG. 6A) coupled with
the primary magnetic element 1620 or the secondary magnetic element
1630) the primary magnetic element 1620 or the secondary magnetic
element 1630 around an central axis of the primary magnetic element
or the secondary magnetic element. Accordingly, the magnetic poles
of the primary magnetic element 1620 or the secondary magnetic
element 1630 may be alternately changed between the N pole and the
S pole. A variation in the magnetic field intensity includes a
change in the magnitude of the magnetic force between the primary
magnetic element 1620 and the secondary magnetic element 1630. The
variation in the magnetic field intensity may also include a change
in the magnetic force between a first intensity value (which may be
non-zero or zero) and a second intensity value (which may be zero
or non-zero). In some embodiments, when an electromagnetic element
is used as the primary magnetic element and/or the secondary
magnetic element, the first intensity value and the second
intensity value may correspond to a magnitude of a first electric
current and a magnitude of a second electric current supplied to
the electromagnetic element.
[0065] In some embodiments, the change (or variation) in the
magnetic field direction and the magnetic field intensity may be a
sudden change or a gradual change. FIGS. 11A-11D illustrate example
magnetic field intensity change over time, according to embodiments
of the present disclosure. As shown in FIGS. 11A-11D, the vertical
axis represents the magnetic induction intensity, and the
horizontal axis represents the time. In FIGS. 11A and 11B, B1 and
B2 represent the magnetic induction intensity of a first magnetic
pole and a second magnetic pole relative to the external
environment. B1 and B2 may have opposite directions. In FIGS. 11C
and 11D, B0 represents the magnetic induction intensity between a
primary magnetic element and a secondary magnetic element. The
value "0" on the vertical axis represents that the magnetic
induction intensity between the primary magnetic element and the
secondary magnetic element is 0. That is, no magnetic force exists
between the primary magnetic element and the secondary magnetic
element.
[0066] As shown in FIG. 11A, the magnetic field direction (or
correspondingly, the magnetic pole direction) between the primary
magnetic element and the secondary magnetic element may be
alternately changed between B1 and B2 by alternately supplying
direct currents of different directions to a coil of the primary
magnetic element or the secondary magnetic element at a
predetermined frequency. The instantaneous change in the magnetic
field direction may be regarded as an abrupt change. A self-induced
electromotive force may be generated in the coil, which may hinder
the increase of the magnetic flux, and prolong the time period
related to the change in the magnetic field direction. In practice,
most changes in the magnetic field direction are gradual changes.
The present disclosure does not limit the specific forms of the
changes in the magnetic pole direction or the magnetic field
direction. The descriptions here are only for the purpose of
illustrating examples of an abrupt change in the magnetic field
direction. When the permanent magnetic element (or permanent
magnet) or the electromagnetic element is rotated around a central
axis to change the magnetic field direction on both sides, or when
an alternating current is supplied to a coil in at least one of the
primary magnetic element or the secondary magnetic element in a
pair of magnetic elements facing one another at a predetermined
frequency, as shown in FIG. 11B, the magnetic induction intensity
between the primary magnetic element and the secondary magnetic
element may gradually increase to B1 and then gradually decrease,
and then repeat the similar change in an opposite direction. In the
reverse direction, the magnetic induction intensity may gradually
increase to B2 and then gradually decrease. Such a changing pattern
is periodically cycled, similar to a sine wave pattern. Under such
a situation, the magnetic field direction may be regarded as having
a gradual change.
[0067] As shown in FIG. 11C, direct currents of different
directions may be alternately supplied to a coil of at least one of
the primary magnetic element or the secondary magnetic element,
which may be an electromagnetic element, at a predetermined
frequency. An alternating change between magnetic field generation
and de-magnetization may occur between the primary magnetic element
and the secondary magnetic element, thereby causing an abrupt
change in the magnetic field intensity. Supplying a current to a
coil in at least one of the primary magnetic element or the
secondary magnetic element may gradually generate a magnetic field
between the primary magnetic element and the secondary magnetic
element, and gradually reducing the current may cause the magnetic
field between the primary magnetic element and the secondary
magnetic element to gradually decrease. Correspondingly, the
magnetic field intensity may increase to the maximum value B1 and
gradually decrease to 0, which is repeated periodically, thereby
causing a gradual change in the magnetic field intensity (which may
be represented by the magnetic induction intensity) between the
primary magnetic element and the secondary magnetic element, as
shown in FIG. 11D. Note that the above descriptions relating to the
magnetic field changes, as shown in FIGS. 11A-11D, are applicable
to any of the magnetic element assemblies shown in other figures
when at least one magnetic element is an electromagnetic
element.
[0068] In the mopping mechanism 160 of the present disclosure, at
least partially due to the periodically varying (or changing)
magnetic force between the primary magnetic element and the
secondary magnetic element, the mopping plate (or mopping plates)
may perform a reciprocating movement relative to the bottom surface
155. That is, a driving force that drives the mopping plate or
mopping plates to perform the reciprocating movement relative to
the bottom surface 155 may be at least partially provided by the
periodically varying magnetic force generated between the primary
magnetic element and the secondary magnetic element. Alternatively,
in some embodiments, a portion of the driving force that drives the
mopping plate or mopping plates to perform the reciprocating
movement relative to the bottom surface 155 may be provided by the
periodically varying magnetic force generated between the primary
magnetic element and the secondary magnetic element, and another
portion of the driving force may be provided by a non-magnetic
force exerted on the mopping plate or mopping plates (e.g., a
restoration force provided by a restoration component, such as a
spring, a rubber band, etc., or a supporting force provided by a
cam or a crank that is different from a magnetic force). Under the
combination of the magnetic force and the non-magnetic force, the
mopping plate or mopping plates may be driven to perform the
reciprocating movement relative to the bottom surface 155.
[0069] The varying magnetic force between the primary magnetic
element and the secondary magnetic element may periodically change
between an attractive magnetic force and a repulsive magnetic
force, which may drive the mopping plate(s) to perform the
reciprocating movement relative to the bottom surface 155. The
processes of generating the periodically varying attractive
magnetic force and repulsive magnetic force may be repeated. In
some embodiments, the driving force that drives the mopping
plate(s) to perform the reciprocating movement relative to the
bottom surface 155 may include a magnetic force and a non-magnetic
force, such as a magnetic force and a restoration force provided by
a restoration component, such as an elastic component. The magnetic
force may provide a portion of the entire reciprocating movement
cycle of the mopping plate(s) relative to the bottom surface 155.
For example, the attractive magnetic force may drive a first
portion (or a part of the first portion) of the entire
reciprocating movement cycle in a first direction, and the
repulsive magnetic force may drive a second portion (or a part of
the second portion) of the entire reciprocating movement in a
second direction opposite to the first direction. The restoration
force (e.g., provided by a restoration component, such as a spring,
a rubber band, etc.) may drive the remaining portions of the
reciprocating movement cycle of the mopping plate(s) relative to
the bottom surface 155. The combination of the magnetic force and
the restoration force may drive the mopping plate(s) to perform the
reciprocating movement relative to the bottom surface 155. In some
embodiments, the mopping plate(s) may perform the reciprocating
movement relative to the bottom surface 155 under various
combinations of forces, thereby increasing the cleaning efficiency
of mopping a floor.
[0070] The technical solutions of the present disclosure will be
described in detail in the following embodiments based on the
mounting locations of the primary magnetic element and the
secondary magnetic element and the form of changes of the magnetic
field of the primary magnetic element.
[0071] In some embodiments, as shown in FIGS. 4A and 4B, at least
one primary magnetic element 1620 may be provided at the bottom
surface 155. In addition, the first mopping plate 1611 and the
second mopping plate 1612 may be disposed side by side at the
bottom surface 155 with two edges of the mopping plates facing one
another. At least one first secondary magnetic element 1631 may be
disposed at the first mopping plate 1611. At least one second
secondary magnetic element 1632 may be disposed at the second
mopping plate 1612. The first secondary magnetic element 1631 and
the second secondary magnetic element 1632 may be disposed adjacent
the primary magnetic element 1620, respectively. The primary
magnetic element 1620 may be disposed between the first mopping
plate 1611 and the second mopping plate 1612. The primary magnetic
element 1620 may be controlled to provide a variable magnetic
field. Alternatively, the two secondary magnetic elements, i.e.,
the first secondary magnetic element 1631 and the second secondary
magnetic element 1632, may be controlled provide a variable
magnetic field with respect to the primary magnetic element. As the
variable magnetic field changes periodically between the primary
magnetic element 1620 and the first secondary magnetic element
1631, and between the primary magnetic element 1620 and the second
secondary magnetic element 1632, alternatingly changing repulsive
magnetic force and attractive magnetic force may be generated,
thereby causing the first mopping plate 1611 and the second mopping
plate 1612 to perform the reciprocating movement relative to the
bottom surface 155. In some embodiments, the first secondary
magnetic element 1631 and the second secondary magnetic element
1632 may generate the attractive magnetic force and/or the
repulsive magnetic force with the primary magnetic element 1620 at
the same time (e.g., simultaneously or synchronously). In some
embodiments, the first secondary magnetic element 1631 and the
second secondary magnetic element 1632 may generate the attractive
magnetic force and/or the repulsive magnetic force with the primary
magnetic element 1620 at different times (e.g., asynchronously).
For example, at the same time instance, the magnetic force between
the first secondary magnetic element 1631 and the primary magnetic
element 1620 may be an attractive magnetic force, and the magnetic
force between the second secondary magnetic element 1632 and the
primary magnetic element 1620 may be a repulsive magnetic
force.
[0072] In some embodiments, the primary magnetic element 1620 may
be an electromagnetic element, which may be fixedly mounted to the
bottom surface 155. The primary magnetic element 1620 may be
disposed between the first mopping plate 1611 and the second
mopping plate 1612. The first secondary magnetic element 1631 and
the second secondary magnetic element 1632 may be fixedly mounted
at edge locations on the first mopping plate 1611 and the second
mopping plate 1612, respectively, adjacent the primary magnetic
element 1620. A periodically varying magnetic force may be
generated between the primary magnetic element 1620 and the first
secondary magnetic element 1631, and between the primary magnetic
element 1620 and the second secondary magnetic element 1632. The
magnetic force exerted on the secondary magnetic elements 1631 and
1632 may be sufficiently strong to move the first and second
mopping plates 1611 and 1612 relative to the bottom surface 155. As
shown in FIGS. 4A and 4B, the S pole of the primary magnetic
element 1620 and the S pole of the first secondary magnetic element
1631 may face one another, and the N pole of the primary magnetic
element 1620 and the N pole of the second secondary magnetic
element 1632 may face one another. At this moment, a repulsive
magnetic force, as indicated by the arrows 1633, may exist between
the primary magnetic element 1620 and the first secondary magnetic
element 1631, which may drive the first mopping plate 1611 to move
away from the primary magnetic element 1620 (or away from the
reference location 1699). A repulsive magnetic force may be
generated between the primary magnetic element 1620 and the second
secondary magnetic element 1632, which may drive the second mopping
plate 1612 to move away from the primary magnetic element 1620 (or
away from the reference location 1699). As a result, in some
embodiments, the first mopping plate 1611 and the second mopping
plate 1612 may be driven by the varying magnetic force
reciprocatively between their respective first positions and second
positions relative to the bottom surface 155. In some embodiments,
the first secondary magnetic element 1631 and the second secondary
magnetic element 1632 may be permanent magnets or may be
electromagnetic elements supplied with an electric current having a
constant direction. As such, the magnetic poles of the first
secondary magnetic element 1631 and the second secondary magnetic
element 1632 may remain unchanged during the entire movement cycle
of the mopping plates 1611 and 1612.
[0073] As shown in FIGS. 4C and 4D, when compared to the states
shown in FIGS. 4A and 4B, by changing the direction of the electric
current supplied to the primary magnetic element 1620, the magnetic
poles of the primary magnetic element 1620 may be changed. That is,
the N pole of the primary magnetic element 1620 may face the S pole
of the first secondary magnetic element 1631, and the S pole of the
primary magnetic element 1620 may face the N pole of the second
secondary magnetic element 1632. As a result, the direction of the
magnetic field between the primary magnetic element and the
secondary magnetic elements may be changed. At this moment, an
attractive magnetic force may be generated between the primary
magnetic element 1620 and the first secondary magnetic element
1631, which may drive the first mopping plate 1611 to move toward
the primary magnetic element 1620 (or toward the reference location
1699). An attractive magnetic force may be generated between the
primary magnetic element 1620 and the second secondary magnetic
element 1632, which may drive the second mopping plate 1632 to move
toward the primary magnetic element 1620 (or the reference location
1699). Accordingly, the first mopping plate 1611 and the second
mopping plate 1612 may be driven to move toward one another. In
some embodiments, the controller 190 included in the cleaning
device 100 may control a power source or a power supplying circuit
that supplies the electric current to the primary magnetic element
1620. The controller 190 may control the power source or the power
supplying circuit to change the direction and/or the magnitude of
the electric current, thereby changing the magnetic field direction
and/or the magnetic field intensity. The controller 190 may also
control the start and termination of the supply of the electric
current, thereby controlling the magnetic field generation and
termination.
[0074] In some embodiments, the primary magnetic element 1620 is an
electromagnetic element. At a first time instance, the N pole of
the primary magnetic element 1620 may face the S pole of the first
secondary magnetic element 1631, and the S pole of the primary
magnetic element 1620 may face the S pole of the second secondary
magnetic element 1632. An attractive magnetic force may be
generated between the primary magnetic element 1620 and the first
secondary magnetic element 1631, such that the first secondary
magnetic element 1631 may drive the first mopping plate 1611 to
move toward the primary magnetic element 1620 (or the reference
location 1699). A repulsive magnetic force may be generated between
the primary magnetic element 1620 and the second secondary magnetic
element 1632, such that the second secondary magnetic element 1632
may drive the second mopping plate 1612 to move away from the
primary magnetic element 1620 (or the reference location 1699). At
a predetermined time instance, the direction of the electric
current supplied to the electromagnetic element (e.g., the primary
magnetic element 1620) may be changed to change the direction of
the magnetic field of the primary magnetic element 1620, such that
the S pole of the primary magnetic element 1620 may face the S pole
of the first secondary magnetic element 1631, and the N pole of the
primary magnetic element 1620 may face the S pole of the second
secondary magnetic element 1632. The repulsive magnetic force
between the primary magnetic element 1620 and the first secondary
magnetic element 1631 may drive the first mopping plate 1611 to
move away from the primary magnetic element 1620 (or the reference
location 1699). The attractive magnetic force between the primary
magnetic element 1620 and the second secondary magnetic element
1632 may drive the second mopping plate 1612 to move toward the
primary magnetic element 1620 (or the reference location 1699).
Such processes may be periodically repeated. Thus, the movements of
the first mopping plate 1611 and the second mopping plate 1612 may
be in the same direction.
[0075] In some embodiments, the primary magnetic element 1620 may
alternately generate an attractive magnetic force and a repulsive
magnetic force with the secondary magnetic elements 1631 and 1632,
such that the first mopping plate 1611 and the second mopping plate
1612 are driven to move in the same direction relative to the
bottom surface 155. This is an example form of reciprocating
movement of the first mopping plate 1611 and the second mopping
plate 1612 relative to the bottom surface 155, although no relative
motion exists between the first mopping plate 1611 and the second
mopping plate 1612. For example, using the configuration shown in
FIG. 4C as an example, at a time instance, the first mopping plate
1611 may be at its second position (e.g., farthest from the primary
magnetic element 1620 or the reference location 1699), and the
second mopping plate 1612 may be at its first position (e.g.,
closest to the primary magnetic element 1620 or the reference
location 1699). At this time instance, the magnetic force between
the first mopping plate 1611 and the primary magnetic element 1620
may be an attractive magnetic force, which may drive the first
mopping plate 1611 to move toward the reference location 1699, and
the magnetic force between the second mopping plate 1612 and the
primary magnetic element 1620 may be a repulsive magnetic force,
which may drive the second mopping plate 1612 to move away from the
reference location 1699. Thus, the first mopping plate 1611 and the
second mopping plate 1612 may move in the same direction. The
processes may be repeated and the first mopping plate 1611 and the
second mopping plate 1612 may be driven to move reciprocatively in
the same direction relative to the bottom surface 155.
[0076] In some embodiments, the primary magnetic element 1620 is an
electromagnetic element. The magnetic poles at both ends of the
primary magnetic element 1620 may be changed by changing the
direction of the electric current supplied to the electromagnetic
element 1620. In some embodiments, the electromagnetic element 1620
may be rotated relative to the bottom surface 155. By rotating the
electromagnetic element 1620, the magnetic poles of the ends of the
primary magnetic element 1620 facing the secondary magnetic
elements 1631 and 1632 may be changed. This change can also
generate a magnetic force that periodically changes between an
attractive magnetic force and a repulsive magnetic force between
the secondary magnetic elements 1631 and 1632 and the primary
magnetic element 1620, thereby driving the first mopping plate 1611
and the second mopping plate 1612 to perform reciprocating
movements relative to the bottom surface 155, respectively.
[0077] In some embodiments, as shown in FIGS. 6A-6D, the primary
magnetic element 1620, the first secondary magnetic element 1631,
and the second secondary magnetic element 1632 may all be permanent
magnets. The primary magnetic element 1620 may be disposed at the
bottom surface 155, and may be rotatable relative to the bottom
surface 155. For example, the primary magnetic element 1620 may be
driven by an electric motor 1705 to rotate. The electric motor 1705
may be controlled by the controller 190. The electric motor 1705
may be disposed at least partially within the housing 105 of the
cleaning device 100. The first secondary magnetic element 1631 may
be disposed at the first mopping plate 1611. The second secondary
magnetic element 1632 may be disposed at the second mopping plate
1612. The first secondary magnetic element 1631 and the second
secondary magnetic element 1632 may be located at two sides of the
primary magnetic element 1620. When the primary magnetic element
1620 rotates around a rotation axis, the magnetic poles of the
primary magnetic element 1620 facing the secondary magnetic
elements 1631 and 1632 may change periodically, thereby generating
a periodically varying magnetic force between the first secondary
magnetic element 1631 and the primary magnetic element 1620, and
between the second secondary magnetic element 1632 and the primary
magnetic element 1620.
[0078] In some embodiments, at a time instance shown in FIG. 6A,
the first secondary magnetic element 1631 may be located at a left
side of the primary magnetic element 1620 (when viewed from the
perspective shown in FIG. 6A). The S pole of the first secondary
magnetic element 1631 may face the N pole of the primary magnetic
element 1620. An attractive magnetic force may be generated between
the first secondary magnetic element 1631 and the primary magnetic
element 1620, which may drive the first mopping plate 1611 to move
to the right (i.e., move toward the primary magnetic element 1620
or toward the reference location 1699). The second secondary
magnetic element 1632 may be located at the right side of the
primary magnetic element 1620. The N pole of the second secondary
magnetic element 1632 may face the S pole of the primary magnetic
element 1620. An attractive magnetic force may be generated between
the second secondary magnetic element 1632 and the primary magnetic
element 1620, which may drive the second mopping plate 1612 to move
to the left (i.e., move toward the primary magnetic element 1620 or
the reference location 1699). As a result, the first mopping plate
1611 and the second mopping plate 1612 may move toward one
another.
[0079] In some embodiments, as shown in FIG. 6B, when the primary
magnetic element 1620 is rotated (e.g., in the clockwise direction
indicated by the arrow around the primary magnetic element 1620 in
FIG. 6B), the primary magnetic element 1620 rotates relative to the
bottom surface 155, thereby changing the magnetic field directions
of the magnetic fields between the primary magnetic element 1620
and the secondary magnetic elements 1631 and 1632. Accordingly, the
motion state of the first mopping plate 1611 and the second mopping
plate 1612 may be changed, such that the first mopping plate 1611
and the second mopping plate 1612 may move away from the reference
location 1699, and away from one another. In some embodiments, a
driving device (e.g., the electric motor 1705 shown in FIG. 6A) may
be disposed inside the housing of the cleaning device 100 to drive
the primary magnetic element 1620 to rotate relative to the bottom
surface 155. At the moment shown in FIG. 6B, the S pole of the
first secondary magnetic element 1631 may face the S pole of the
primary magnetic element 1620. Thus, a repulsive magnetic force may
be generated between the first secondary magnetic element 1631 and
the primary magnetic element 1620, which may drive the first
mopping plate 1611 to move to the left (i.e., move away from the
primary magnetic element 1620 or the reference location 1699). The
N pole of the second secondary magnetic element 1632 may face the N
pole of the primary magnetic element 1620. At this moment, a
repulsive magnetic force may be generated between the second
secondary magnetic element 1632 and the primary magnetic element
1620, which may drive the second mopping plate 1612 to move to the
right (away from the primary magnetic element 1620 or the reference
location 1699). Accordingly, the first mopping plate 1611 and the
second mopping plate 1612 may move away from the reference location
1699, and away from one another. Through the controller 190
controlling the electric motor 1705 to rotate the primary magnetic
element 1620, the first mopping plate 1611 and the second mopping
plate 1612 may be driven to perform a periodic, reciprocating
movement relative to the bottom surface 155 between their
respective first position and second position. Although not shown,
in some embodiments, the primary magnetic element 1620 may be
non-rotatable, and each of the secondary magnetic elements 1631 and
1632 may be rotatable by an electric motor to change their
respective poles facing the primary magnetic element 1620, thereby
switching the magnetic force between the attractive magnetic force
and repulsive magnetic force. In the embodiment shown in FIG. 6A
and FIG. 6B, the mopping plates 1611 and 1612 are driven by an
attractive magnetic force and a repulsive magnetic fore
simultaneously. Thus, the movements of the mopping plates 1611 and
1612 are in opposite directions.
[0080] In some embodiments, as shown in FIG. 6C, the primary
magnetic element 1620 may be disposed between the first secondary
magnetic element 1631 and the second secondary magnetic element
1632. The primary magnetic element 1620 may be disposed at the
bottom surface 155, and may be rotatable relative to the bottom
surface 155. At the time instance shown in FIG. 6C, the N pole of
the primary magnetic element 1620 may face the S pole of the first
magnetic element 1631. At this moment, an attractive magnetic force
may be generated between the primary magnetic element 1620 and the
first secondary magnetic element 1631, which may drive the first
mopping plate 1611 to move to right (toward the primary magnetic
element 1620 or toward the reference location 1699). The S pole of
the primary magnetic element 1620 may face the S pole of the second
secondary magnetic element 1632. A repulsive magnetic force may be
generated between the primary magnetic element 1620 and the second
secondary magnetic element 1632, which may drive the second mopping
plate 1612 to move to the right (away from the primary magnetic
element 1620 or away from the reference location 1699).
Accordingly, the first mopping plate 1611 and the second mopping
plate 1612 may both move to the right, i.e., in the same direction,
as shown in FIG. 6C.
[0081] In some embodiments, when the primary magnetic element 1620
is subsequently rotated around a rotation axis clockwise (as
indicated by the arrow shown around the primary magnetic element
1620 in FIG. 6C) to a time instance shown in FIG. 6D, the S pole of
the primary magnetic element 1620 may face the S pole of the first
secondary magnetic element 1631. At this moment, a repulsive
magnetic force may be generated between the primary magnetic
element 1620 and the first secondary magnetic element 1631, which
may drive the first mopping plate 1611 to move to the left (away
from the primary magnetic element 1620 or away from the reference
location 1699). The N pole of the primary magnetic element 1620 may
face the S pole of the second secondary magnetic element 1632. At
this moment, an attractive magnetic force may be generated between
the primary magnetic element 1620 and the second secondary magnetic
element 1632, which may drive the second mopping plate 1612 to move
to the left (toward the primary magnetic element 1620 or toward the
reference location 1699). Accordingly, the first mopping plate 1611
and the second mopping plate 1612 may both move to the left, i.e.,
in the same direction. The movements shown in FIG. 6C and FIG. 6D
may be repeated to realize reciprocating movements of the first
mopping plate 1611 and the second mopping plate 1612 relative to
the bottom surface 155.
[0082] FIG. 7A illustrate a structural configuration of a mopping
mechanism and motion states of the mopping plates, according to an
embodiment of the present disclosure. As shown in FIG. 7A, at least
one primary magnetic element 1620 may be disposed at the bottom
surface 155. The primary magnetic element 1620 may be an
electromagnetic element. The first secondary magnetic element 1631
may be fixedly disposed at the first mopping plate 1611. The second
secondary magnetic element 1632 may be fixedly disposed at the
second mopping plate 1612. The first secondary magnetic element
1631 and the second secondary magnetic element 1632 may both be
disposed adjacent the primary magnetic element 1620. The primary
magnetic element 1620 may be disposed between the first mopping
plate 1611 and the second mopping plate 1612, and may generate an
attractive magnetic force with the first secondary magnetic element
1631 and the second secondary magnetic element 1632, respectively.
In some embodiments, a restoration component 1640 may be disposed
between the first mopping plate 1611 and the second mopping plate
1612. The restoration component 1640 may be various kinds of
component or assembly configured to provide a restoration force,
such as a spiral spring, an elastic plate, a rubber band, a
magnetic element, etc. Although not shown in the single mopping
plate embodiment shown in FIG. 5, a restoration component similar
to the restoration component 1640 may be disposed at a suitable
location in the mopping mechanism 160 shown in FIG. 5.
[0083] Referring back to FIG. 7A, in some embodiments, the
restoration component 1640 may be configured to provide a pulling
restoration force when the first mopping plate 1611 and the second
mopping plate 1612 move from their respective second positions
(i.e., positions where they are farthest away from the primary
magnetic element or the reference location 1699) toward their
respective first positions (i.e., positions where they are closest
to the primary magnetic element 1620 or the reference location
1699). In such a configuration, the movement process during which
the mopping plates 1611 and 1612 move from their respective second
positions to their respective first positions, the driving force
may be provided by the restoration component 1640. During this
movement process, the magnetic element assembly including the
primary magnetic element 1620 and the secondary magnetic elements
1631 and 1632 may not provide a magnetic force to move the first
mopping plate 1611 and the second mopping plate 1612 toward the
primary magnetic element 1620 or the reference location 1699.
Alternatively, during this movement process, the magnetic element
assembly including the primary magnetic element 1620 and the
secondary magnetic elements 1631 and 1632 may also provide an
attractive magnetic force to move the first mopping plate 1611 and
the second mopping plate 1612 toward the primary magnetic element
1620 or the reference location 1699. Thus, the mopping plates 1611
and 1612 may be driven by both the pulling restoration force and
the attractive magnetic force to move toward the primary magnetic
element 1620 or the reference location 1699. During the movement
process in which the mopping plates 1611 and 1612 move from their
respective first positions toward their respective second
positions, the driving force may be provided by the magnetic
element assembly. For example, the primary magnetic element may be
supplied with an electric current to generate a repulsive magnetic
force between the primary magnetic element 1620 and the first
secondary magnetic element 1631 and between the primary magnetic
element 1620 and the second secondary magnetic element 1632 to
drive the mopping plates 1611 and 1612 to move away from one
another.
[0084] In some embodiments, the restoration component 1640 may be
configured to provide a pushing restoration force when the first
mopping plate 1611 and the second mopping plate 1612 move from
their respective first positions toward their second positions. In
such embodiments, during a movement process in which the first
mopping plate 1611 and the second mopping plate 1612 move from the
first positions toward their second positions, the restoration
component 1640 may provide a pushing restoration force to drive the
movements of the first mopping plate 1611 and the second mopping
plate 1612. The magnetic element assembly including the primary
magnetic element 1620 and the secondary magnetic elements 1631 and
1632 may not provide a driving force. That is, there may be no
magnetic field between the primary magnetic element 1620 and the
secondary magnetic elements 1631 and 1632. For example, when the
restoration component is a spring, the spring may be in a
compressed state (hence may provide a pushing force to the mopping
plates 1611 and 1612) when the first mopping plate 1611 and the
second mopping plate 1612 are at their respective first positions.
The magnetic element assembly may not provide a magnetic force.
Thus, the mopping plates 1611 and 1612 may be pushed away from one
another by the pushing restoration force provided by the compressed
spring. After the first mopping plate 1611 and the second mopping
plate 1612 arrive at their respective second positions, the
restoration component 1640 may reach a neutral state (e.g., a state
in which the restoration component 1640 may no longer provide a
pushing force to the mopping plates 1611 and 1612). At this moment,
the magnetic element assembly may be activated, i.e., a magnetic
field may be generated between the primary magnetic element 1620
and the secondary magnetic elements 1631 and 1632. For example, an
attractive magnetic force may be generated between the primary
magnetic element 1620 and the first secondary magnetic element
1631, and between the primary magnetic element 1620 and the second
secondary magnetic element 1632. The attractive magnetic forces may
pull the mopping plates 1611 and 1612 toward one another, during
which process the restoration component 1640 may be compressed to
provide a pushing restoration force against the mopping plates 1611
and 1612. The attractive magnetic forces may be greater than the
pushing restoration force provided by the restoration component
1640. Thus, the mopping plates 1611 and 1612 may move toward one
another (i.e., toward their respective first positions) until they
arrive at their respective first positions. The processes may be
repeated, such that the mopping plates 1611 and 1612 may perform
reciprocating movements relative to the bottom surface 155.
[0085] During a reciprocating movement cycle of the first mopping
plate 1611 and/or the second mopping plate 1612, in some
embodiments, the restoration force and the magnetic force may
alternately exert on the first mopping plate 1611 and the second
mopping plate 1612, or may exert on the first mopping plate 1611
and the second mopping plate 1612 simultaneously (e.g., during a
same portion of the reciprocating movement cycle). In some
embodiments, during a portion of the reciprocating movement cycle
of the mopping plates 1611 and 1612, while the restoration
component 1640 provides a restoration force to drive the mopping
plates 1611 and 1612, the magnetic element assembly may not provide
a magnetic force. In some embodiments, during a portion of the
reciprocating movement cycle of the mopping plates 1611 and 1612,
while the restoration component 1640 provides a restoration force
to drive the mopping plates 1611 and 1612, the magnetic element
assembly may also provide a magnetic force. Thus, during a portion
of the reciprocating movement cycle of the mopping plates 1611 and
1612, the magnetic fore and the restoration force may coexist or
only one of the magnetic force and the restoration force may exist
at any time instance or time duration.
[0086] In some embodiments, the primary magnetic element 1620 may
be an electromagnetic element. When an electric current is supplied
to the primary magnetic element 1620, a magnetic field may be
generated between the primary magnetic element 1620 and the
secondary magnetic elements 1631 and 1632. The first secondary
magnetic element 1631 and the second secondary magnetic element
1632 may both include a soft magnet material, a permanent magnet,
or an electromagnetic element. When an attractive magnetic force is
generated between the primary magnetic element 1620 and the
secondary magnetic elements 1631 and 1632, the first secondary
magnetic element 1631 and the second secondary magnetic element
1632 may be attracted by the primary magnetic element 1620, i.e.,
be pulled toward the primary magnetic element 1620, thereby causing
the mopping plates 1611 and 1612 to move toward one another (e.g.,
toward their respective first positions).
[0087] At the time instance shown in FIG. 7A, the first mopping
plate 1611 and the second mopping plate 1612 may be at their
respective first positions, i.e., closest to the reference location
1699. The primary magnetic element 1620 may be an electromagnetic
element. The controller 190 may control a power source to supply an
electric current to the primary magnetic element 1620, such that an
attractive magnetic force is generated between the primary magnetic
element 1620 and the first secondary magnetic element 1631, and
between the primary magnetic element 1620 and the second secondary
magnetic element 1632. The mopping plates 1611 and 1612 may be
driven by the attractive magnetic force (which may overcome a
pushing restoration force provided by the restoration component
1640) to move toward the reference location 1699 (i.e., toward the
primary magnetic element 1620, or toward their respective first
positions).
[0088] After the mopping plates 1611 and 1612 arrive at their
respective first positions, the controller 190 may control the
power source to supply an electric current such that a repulsive
magnetic force may be generated between the primary magnetic
element 1620 and the secondary magnetic elements 1631 and 1632. The
mopping plates 1611 and 1612 may be driven by the repulsive
magnetic forces to move away from their respective first positions
toward their respective second positions (also away from one
another). When the mopping plates 1611 and 1612 arrive at their
respective second positions, as shown in FIG. 7B, the controller
190 may control the power source to terminate the electric current
supply to the primary magnetic element 1620, thereby terminating
the magnetic field between the primary magnetic element 1620 and
the secondary magnetic elements 1631 and 1632. When the primary
magnetic element 1620 does not generate the magnetic field, the
attractive magnetic force between the first secondary magnetic
element 1631 and the second secondary magnetic element 1632 and the
primary magnetic element 1620 disappears. At this moment, the
restoration force may be a pulling force. Under the pulling
restoration force of the restoration component 1640, the first
mopping plate 1611 and the second mopping plate 1612 may be pulled
toward one another, i.e., may move toward one another. Through
periodically switching between supply and non-supply of an electric
current to the primary magnetic element 1620, and through the
restoration component 1640, the first mopping plate 1611 and the
second mopping plate 1612 may be driven by the magnetic forces and
the restoration force to perform periodically reciprocating
movements relative to the bottom surface 155.
[0089] In another aspect of the present disclosure, the first
mopping plate 1611 and the second mopping plate 1612 may be
disposed at the bottom surface 155. At least one of the first
mopping plate 1611 or the second mopping plate 1612 may move
relative to the bottom surface 155. At least one secondary magnetic
element 1630 may be fixedly disposed on a mopping plate (e.g., the
first mopping plate 1611 or the second mopping plate 1612) that is
movable relative to the bottom surface 155. At least one primary
magnetic element 1620 may be fixedly disposed on another mopping
plate (e.g., the first mopping plate 1611 or the second mopping
plate 1612). Each primary magnetic element 1620 and each secondary
magnetic element 1630 are disposed adjacent one another to form a
pair. Through changing the magnetic field direction (and in some
embodiments, the magnetic field intensity) generated by the primary
magnetic element 1620, a periodically varying magnetic force may be
generated between the primary magnetic element 1620 and the
secondary magnetic element 1630, which may drive the first mopping
plate 1611 and the second mopping plate 1612 to move relative to
the bottom surface 155, e.g., toward one another or away from one
another. The two mopping plates 1611 and 1612 may periodically
perform reciprocating movements relative to the bottom surface 155.
Accordingly, the mops mounted on the mopping plates 1611 and 1612
may mop the surface to be cleaned repeatedly, thereby enhancing the
cleaning efficiency and cleaning effect.
[0090] In some embodiments, as shown in FIG. 8A and FIG. 8B, the
bottom surface 155 may be provided with the first mopping plate
1611 and the second mopping plate 1612 that are movable relative to
the bottom surface 155. A secondary magnetic element 1630 may be
fixedly disposed at the first mopping plate 1611. A primary
magnetic element 1620 may be fixedly disposed at the second mopping
plate 1612. Through changing the magnetic field direction of the
secondary magnetic element 1630 or the magnetic field direction of
the primary magnetic element 1620, a periodically varying magnetic
force (alternating between an attractive magnetic force and a
repulsive magnetic force) may be generated between the secondary
magnetic element 1630 and the primary magnetic element 1620, which
may drive the first mopping plate 1611 and the second mopping plate
1612 to perform periodically reciprocating movements relative to
the bottom surface 155 (e.g., toward one another and away from one
another). For example, as shown in FIG. 8A, the secondary magnetic
element 1630 may be disposed at the first mopping plate 1611. The
secondary magnetic element 1630 may be permanent magnet. The
primary magnetic element 1620 may be disposed at the second mopping
plate 1612. The primary magnetic element 1620 may be an
electromagnetic element. When the S pole of the secondary magnetic
element 1630 faces the N pole of the primary magnetic element 1620,
as shown in FIG. 8A, the attractive magnetic force between the
secondary magnetic element 1630 and the primary magnetic element
1620 may drive the first mopping plate 1611 and the second mopping
plate 1612 to move toward one another.
[0091] When the direction of the electric current supplied to the
primary magnetic element 1620 is changed, the magnetic field
direction may be changed. Then, the S pole of the secondary
magnetic element 1630 may face the S pole of the primary magnetic
element 1620. As shown in FIG. 8B, a repulsive magnetic force may
be generated between the secondary magnetic element 1630 and the
primary magnetic element 1620, which may drive the first mopping
plate 1611 and the second mopping plate 1612 to move away from one
another. Through controlling the period of the changing electric
current supplied to the primary magnetic element 1620, the magnetic
force between the primary magnetic element 1620 and the secondary
magnetic element 1630 may be periodically changed between an
attractive magnetic force and a repulsive magnetic force, which may
drive the first mopping plate 1611 and the second mopping plate
1612 to move relative to the bottom surface 155, e.g., toward one
another and away from one another. That is, at least one of the
first mopping plate 1611 or the second mopping plate 1612 may
perform periodic, reciprocating movements relative to the bottom
surface 155.
[0092] In some embodiments, the primary magnetic element 1620 and
the secondary magnetic element 1630 may both be permanent magnets.
In some embodiments, the primary magnetic element 1620 or the
secondary magnetic element 1630 may be rotatably disposed at the
mopping plates 1611 and 1612, such that the magnetic field
direction of the magnetic field between the secondary magnetic
element 1630 and the primary magnetic element 1620 may be changed,
and a periodically varying magnetic force that periodically
switches between an attractive magnetic force and a repulsive
magnetic force may be generated between the primary magnetic
element 1620 and the secondary magnetic element 1630. The
periodically varying magnetic force may drive at least one of the
first mopping plate 1611 or the second mopping plate 1612 to
perform periodic, reciprocating movements relative to the bottom
surface 155. In some embodiments, the primary magnetic element 1620
disposed at the first mopping plate 1611 may be an electromagnetic
element, and the secondary magnetic element 1630 disposed at the
second mopping plate 1612 may be an electromagnetic element. The
primary magnetic element 1620 may be disposed adjacent the
secondary magnetic element 1630. An attractive magnetic force or a
repulsive magnetic force may be generated between the primary
magnetic element 1620 and the secondary magnetic element 1630.
[0093] In other embodiments, the bottom surface 155 may be provided
with the first mopping plate 1611 and the second mopping plate
1612. The first mopping plate 1611 and/or the second mopping plate
1612 may be movable relative to the bottom surface 155. At least
one secondary magnetic element 1650 may be fixedly disposed at the
second mopping plate 1612. At least one primary magnetic element
1620 may be fixedly disposed at the first mopping plate 1611. As
shown in FIG. 8C, the secondary magnetic element 1650 may be
configured with a linkage shape. That is, the secondary magnetic
element 1650 may be in a form of a linkage, as shown in FIG. 8C.
Thus, the secondary magnetic element 1650 may be referred to as a
linkage-shaped secondary magnetic element 1650. A first end 1651 of
the linkage-shaped secondary magnetic element 1650 may be fixedly
connected with the second mopping plate 1612. A second end 1652 of
the linkage-shaped secondary magnetic element 1650 may abut against
the primary magnetic element 1620 or may extend into a groove or
through hole provided on the primary magnetic element 1620 that
matches with the linkage-shaped secondary magnetic element 1650
when the first mopping plate 1611 and the second mopping plate 1612
are close to one another. In some embodiments, the primary magnetic
element 1620 may be an electromagnetic element provided with a
groove or through hole matching with the second end of the
linkage-shaped secondary magnetic element 1650.
[0094] In the following descriptions, an end of the primary
magnetic element 1620 is described as having a through hole that
matches with the linkage-shaped secondary magnetic element 1650.
This is one example used to explain the operation principle of the
primary magnetic element 1620 and the secondary magnetic element
1650. When the first mopping plate 1611 and the second mopping
plate 1612 are close to one another, the second end 1652 of the
linkage-shaped secondary magnetic element 1650 may insert or extend
into the through hole of the primary magnetic element 1620. The
first end 1651 of the linkage-shaped secondary magnetic element
1650 may face the primary magnetic element 1620. If the magnetic
pole of the first end 1651 of the linkage-shaped secondary magnetic
element 1650 is opposite to the magnetic pole of the primary
magnetic element 1620, then an attractive magnetic force may be
generated between the linkage-shaped secondary magnetic element
1650 and the primary magnetic element 1620. As shown in FIG. 8C, at
this moment, the first mopping plate 1611 and the second mopping
plate 1612 may move toward one another due to the attractive
magnetic force. If the magnetic field direction of the magnetic
field generated between the primary magnetic element 1620 and the
linkage-shaped secondary magnetic element 1650 is changed, such
that a repulsive magnetic force is generated between the primary
magnetic element 1620 and the linkage-shaped secondary magnetic
element 1650, then the first mopping plate 1611 and the second
mopping plate 1612 may be pushed to move away from one another, as
shown in FIG. 8D. Through controlling the periodical change of the
magnetic field direction, the first mopping plate 1611 and the
second mopping plate 1612 may be driven to perform periodic,
reciprocating movements relative to the bottom surface 155.
[0095] In some embodiments, based on the embodiments shown in FIG.
8C and FIG. 8D, a restoration component 1640 may be disposed
between the first mopping plate 1611 and the second mopping plate
1612, as shown in FIG. 9A and FIG. 9B. The restoration component
1640 has been described above. Next, a spiral spring is used as an
example of the restoration component 1640 to explain the function
of the restoration component 1640. In some embodiments, the
restoration component 1640 may be mounted between the first mopping
plate 1611 and the second mopping plate 1612 in a natural state
when the mopping plates 1611 and 1612 are at their respective first
positions. For example, a first end of the restoration component
1640 may abut against the first mopping plate 1611. A second end of
the restoration component 1640 may abut against the second mopping
plate 1612. In some embodiments, the two ends of the restoration
component 1640 may be fixedly mounted to the mopping plates 1611
and 1612. When the mopping plates 1611 and 1612 are at their
respective first positions, the spring may be in a neutral state
providing no restoration force or may be at a state close to the
neutral state providing a minimum restoration force.
[0096] During the reciprocating movement cycle of the mopping
plates 1611 and 1612, the restoration component 1640 may provide a
pushing restoration force or a pulling restoration force. For
example, when the restoration component 1640 is a spring, and when
the mopping plates 1611 and 1612 are at their respective first
positions (e.g., closest to one another), the restoration component
1640 may be in a neutral state providing no restoration force, or
may be in a compressed state providing a pushing force against the
mopping plates 1611 and 1612, or may be in an extended state
providing a pulling force on the mopping plates 1611 and 1612. When
the mopping plates 1611 and 1612 are at their respective second
positions, as shown in FIG. 9B, the restoration component 1640 may
be in an extended state in which the restoration component 1640 may
provide a pulling restoration force tending to pull the mopping
plates 1611 and 1612 toward one another, or may be in a compressed
state in which the restoration component 1640 may provide a pushing
restoration force tending to push the mopping plates 1611 and 1612
away from one another, or may be in a neutral state in which the
restoration component 1640 may provide no restoration force.
[0097] In the following descriptions, for discussion purposes, the
restoration component 1640 is configured to provide a pushing
restoration force (e.g., being in a compressed state) when the
mopping plates 1611 and 1612 move between their respective first
positions and their respective second positions. That is, the
pushing restoration force may drive the mopping plates 1611 and
1612 away from one another from the first positions to the second
positions, and the magnetic force (attractive magnetic force) may
drive the mopping plates 1611 and 1612 toward one another from the
second positions to the first positions. From the first positions
to the second positions, the pushing restoration force may provide
the primary driving force for the movement of the mopping plates
1611 and 1612, and the magnetic element assembly may provide zero
magnetic force. When the mopping plates 1611 and 1612 are at their
respective second positions (e.g., when they are closest to one
another), an electric current may be supplied to the
electromagnetic element that serves as the primary magnetic element
1620 (e.g., the electric current may be supplied to the coil of the
electromagnetic element). The primary magnetic element 1620 may
generate a magnetic field. An attractive magnetic force may be
generated between the primary magnetic element 1620 and the
secondary magnetic element 1650, which may drive the first mopping
plate 1611 and the second mopping plate 1612 to move from their
respective second positions toward their respective first positions
(e.g., to move away from one another). From the second positions to
the first positions, the magnetic element assembly may provide the
primary driving force for the movement of the mopping plates 1611
and 1612, and the restoration component 1640 may exert a pushing
restoration force on the mopping plates 1611 and 1612. The magnetic
forces may be greater than the pushing restoration force.
[0098] FIG. 9A shows that the mopping plates 1611 and 1612 are
moving toward one another under the attractive magnetic force.
During the process the mopping plates 1611 and 1612 move from the
second positions to the first positions, the restoration component
1640 may be compressed and may provide a pushing restoration force
against the mopping plates 1611 and 1612. Because the attractive
magnetic force may be greater than the pushing restoration force,
the mopping plates 1611 and 1612 are driven by the attractive
magnetic force to overcome the pushing restoration force to move
toward the first positions. When the mopping plates 1611 and 1612
arrive at their first positions, the electric current supply to the
electromagnetic element that serves as the primary magnetic element
1620 may be terminated. Thus, no magnetic field may exist between
the primary magnetic element 1620 and the secondary magnetic
element 1630. The pushing restoration force provided by the
restoration component 1640 may drive the mopping plates 1611 and
1612 away from one another, from their first positions toward their
second positions.
[0099] When the mopping plates 1611 and 1612 move to their
respective second positions as shown in FIG. 9B (e.g., when they
are farthest from one another), the electric current supply to the
primary magnetic element 1620 may be restored, such that the
primary magnetic element 1620 may generate a magnetic field to
provide an attractive magnetic force. The first mopping plate 1611
and the second mopping plate 1612 may be driven by the attractive
magnetic force to move toward one another until they arrive their
respective first positions (e.g., until they are closest to one
another). Through controlling the electric current supplied to the
primary magnetic element 1620 to periodically change the magnetic
force, the first mopping plate 1611 and the second mopping plate
1612 may be driven to perform periodic, reciprocating movements
relative to the bottom surface 155.
[0100] As shown in FIG. 9A, when the electric current is supplied
to the electromagnetic element that serves as the primary magnetic
element 1620, the primary magnetic element 1620 may generate a
magnetic field. An attractive magnetic force may be generated
between the primary magnetic element 1620 and the linkage-shaped
secondary magnetic element 1650. The attractive magnetic force may
drive the first mopping plate 1611 and the second mopping plate
1612 toward one another.
[0101] As shown in FIG. 9B, when the electric current supply to the
primary magnetic element 1620 is terminated, the magnetic field of
the primary magnetic element 1620 disappears. The first mopping
plate 1611 and the second mopping plate 1612 may move away from one
another under the pushing restoration force of the restoration
component 1640. Through supplying a periodically changing electric
current to the primary magnetic element 1620 to control the
magnetic field, the first mopping plate 1611 and the second mopping
plate 1612 may be driven to perform periodic, reciprocating
movements relative to the bottom surface 155. In some embodiments,
the restoration component 1640 may be sleeve-fit on the
linkage-shaped secondary magnetic element 1650 and fixedly
connected with the mopping plates 1611 and 1612, as shown in FIG.
9C and FIG. 9D. For example, an end of the restoration component
1640 may abut against an end surface of the primary magnetic
element 1620, and another end of the restoration component 1640 may
abut against a cap end of the linkage-shaped secondary magnetic
element 1650.
[0102] As shown in FIG. 10A and FIG. 10B, the secondary magnetic
element 1630 disposed at the second mopping plate 1612 in an
embodiment of the present disclosure may be an electromagnetic
element. The primary magnetic element 1620 disposed at the first
mopping plate 1611 may also be an electromagnetic element. In some
embodiments, one of the secondary magnetic element 1630 and the
primary magnetic element 1620 may be a permanent magnetic element.
A position limiting element 1660 may be disposed between the
primary magnetic element 1620 and the secondary magnetic element
1630. In some embodiments, the position limiting element 1660 may
be a linkage. For discussion purposes, the position limiting
element 1660 may be referred to as a position limiting linkage
1660. Two ends of the position limiting linkage 1660 may be coupled
with the primary magnetic element 1620 and the secondary magnetic
element 1630, respectively. The position limiting linkage 1660 may
provide a guiding function and a position limiting function to the
movements of the primary magnetic element 1620 and the secondary
magnetic element 1630. For example, the primary magnetic element
1620 and the secondary magnetic element 1630 may sleeve-fit onto
the position limiting linkage 1660. Under the combination of the
magnetic force generated between the primary magnetic element 1620
and the secondary magnetic element 1630, and the restoration force
of the restoration component 1640, the primary magnetic element
1620 and the secondary magnetic element 1630 may slide along the
position limiting linkage 1660 (i.e., to move in the left and right
horizontal direction shown in FIG. 10A and FIG. 10B), and may not
perform cross-position movement (the cross-position movement refers
to a movement having a sub-component in the up-down direction in
FIG. 10A and FIG. 10B). During the process of the primary magnetic
element 1620 and the secondary magnetic element 1630 moving toward
one another, to avoid the secondary magnetic element 1630 and the
primary magnetic element 1620 adhering to one another due to the
attractive magnetic force, the position limiting linkage 1660 may
be provided with a position limiting protrusion or gear (not shown
in figures) configured to limit the minimum distance (e.g., 3-6 cm)
between the secondary magnetic element 1630 and the primary
magnetic element 1620. When the primary magnetic element and the
secondary magnetic element adhere to one another, it may be
difficult to separate them. The position limiting linkage 1660
avoid this issue.
[0103] In some embodiments, at least one of the secondary magnetic
element 1630 or the primary magnetic element 1620 may be disposed
at a location that has a predetermined distance from the opposing
sides of the first mopping plate 1611 and the second mopping plate
1612, such that the secondary magnetic element 1630 and the primary
magnetic element 1620 may not adhere to one another. Thus, the
position limiting linkage 1660 may be omitted, and a minimum
distance between the secondary magnetic element 1630 and the
primary magnetic element 1620 may still be maintained.
[0104] In some embodiments, the cleaning device may be a cleaning
robot, which includes any of the above-described embodiments of the
mopping mechanism.
[0105] In some embodiments, the mopping mechanism 160 may be
mounted to the bottoms surface 155 of the cleaning robot. The
mopping mechanism 160 may include at least one mopping plate
movably mounted to the bottom surface 155 and a magnetic element
assembly. The magnetic element assembly may include at least one
primary magnetic element and at least one secondary magnetic
element. At least one of the primary magnetic element or the
secondary magnetic element may be configured to provide a variable
magnetic field. The magnetic field intensity and/or direction may
be variable. The secondary magnetic element may be disposed at the
mopping plate and may move together with the mopping plate. The
primary magnetic element may be disposed at the bottom surface when
a single mopping plate is included. At least partially due to the
magnetic force between the primary magnetic element and the
secondary magnetic element, the at least one mopping plate may move
relative to the bottom surface 155.
[0106] In some embodiments, the at least one mopping plate may
include a first mopping plate and a second mopping plate disposed
side by side. The primary magnetic element and the secondary
magnetic element may be disposed on the first and second mopping
plates respectively. Under the variable magnetic force, the first
mopping plate and the second mopping plate may move reciprocatively
relative to the bottom surface of the cleaning robot and relative
to one another. Accordingly, the at least one mopping plate may
reciprocatively mop the surface to be cleaned, thereby improving
the cleaning efficiency and cleaning effect for the surface to be
cleaned.
[0107] It should be noted that the mopping mechanism of the present
disclosure is not limited to be used in a cleaning robot, and may
also be used in traditional handheld floor mopping machines. The
mopping mechanism disclosed herein may include any suitable
structure configured to provide, either directly or through other
coupling elements, a periodically changing magnetic force to the
movement of the first mopping plate and/or the second mopping
plate.
[0108] Finally, it should be noted that the above various
embodiments are only used to explain the technical solutions of the
present disclosure, and are not intended to limit the scope of the
present disclosure. Although the present disclosure is explained in
detail with reference to the above various embodiments, a person
having ordinary skills in the art can appreciate: the technical
solutions reflected in the above various embodiments can be
modified, or a portion or all of the technical features can be
equivalently replaced, and various features shown in various
exemplary embodiments in the figures may be combined in any
suitable manner. Such modifications, replacements, combinations, or
variations also fall within the scope of the present
disclosure.
* * * * *